Protection device and laser head

Abstract

The invention provides a protection device and a laser head. The protection device comprises a cavity, a nozzle and a movement direction changing element. One end of the cavity is connected with the nozzle, and the other end of the cavity is provided with other parts of the laser head; the movement direction changing element is located between the nozzle and other parts of the laser head, and the movement direction changing element is arranged on the cavity; the movement direction changing element is configured to change a movement direction of the impurity. According to the laser head, the movement direction changing element is arranged on the cavity between the nozzle and other parts of the laser head and can be used for changing the movement direction of the impurities, so that the impurities moving towards the other parts of the laser head are reduced, the protection effect on the other parts of the laser head can be improved, and the service life of the laser head is prolonged. The service life of the laser head is prolonged.

Description

Technical Field

[0001] The present application relates to the field of laser processing, and in particular, to a protective device and a laser head. Background Art

[0002] During laser processing, various impurities such as dust, particles, and slag are usually generated. These impurities may not only affect the working effect of the components in the laser head, but also damage the components in the laser head. Currently, the main way to protect the components in the laser head is to purge the impurities with protective gas to reduce the impact of impurities on the components.

[0003] However, the splashing slag usually has a high temperature and kinetic energy, which can penetrate or destroy the traditional protective layer, causing damage to the surface of the equipment or functional failure. For example, during welding, cutting or metal processing, high-temperature operations will produce splashing slag, which may cause serious damage if it comes into contact with sensitive electronic components or precision mechanical parts. The current protection methods are very limited in the face of the high-temperature slag splashing force. Summary of the invention

[0004] In view of this, an object of the embodiments of the present application is to provide a protective device and a laser head, which can improve the protection of other components of the laser head and extend the service life of the laser head.

[0005] In a first aspect, an embodiment of the present application provides a protective device, comprising: a cavity, a nozzle, and a motion direction changing element; one end of the cavity is connected to the nozzle, and the other end of the cavity is provided with other components of the laser head; the motion direction changing element is located between the nozzle and other components of the laser head, and the motion direction changing element is arranged on the cavity; wherein the motion direction changing element is configured to change the movement direction of impurities.

[0006] In the above implementation process, by setting a motion direction changing element on the cavity between the nozzle and other components of the laser head, the motion direction changing element can be used to change the movement direction of impurities, thereby reducing the impurities moving toward other components of the laser head, thereby improving the protection of other components of the laser head and extending the service life of the laser head.

[0007] In one embodiment, the movement direction changing element is a magnet; the magnet is arranged outside the cavity, and the magnetic field direction of the magnet is perpendicular to the axial direction of the cavity.

[0008] In the above implementation process, by setting the movement direction changing element to a magnet, and the magnetic field direction of the magnet is perpendicular to the axial direction of the cavity, the corresponding magnetic force and Lorentz force can be generated based on the magnet, and then the movement direction of impurities such as slag and plasma in the cavity can be changed by the magnetic force and Lorentz force, thereby improving the protection of other components of the laser head and extending the service life of the laser head.

[0009] In one embodiment, the impurities are slag; the magnet is configured to attract the slag to generate a magnetic force, and the magnetic force is configured to change the movement direction of the slag.

[0010] In the above implementation process, by setting the movement direction changing element to a magnet, the magnet can generate magnets with the slag, thereby changing the movement direction of the slag, which can reduce the slag moving toward other parts of the laser head, improve the protection of other parts of the laser head, and extend the service life of the laser head.

[0011] In one embodiment, the impurity is plasma; the magnet is configured to generate a Lorentz force through a magnetic field, and the Lorentz force is configured to change the movement direction of the plasma.

[0012] In the above implementation process, by setting the moving direction changing element as a magnet, the magnet can generate a magnetic field, and the movement of plasma in the magnetic field will generate Lorentz force, which can change the moving direction of plasma, thereby reducing the plasma moving toward other parts of the laser head, improving the protection of other parts of the laser head, and extending the service life of the laser head. In addition, the ion obstacles in the laser beam transmission process can be removed to avoid affecting the processing effect due to insufficient laser energy, thereby improving the processing effect of the laser head.

[0013] In one embodiment, the magnet is an electromagnet.

[0014] In the above implementation process, by setting the magnet as an electromagnet, the magnetism and magnetic field of the electromagnet can be controlled by turning the power on and off, making it easier to blow away the impurities and dust on the laser processing head when maintaining the laser head, thereby avoiding impurities adsorbed around the magnet that are difficult to clean and reducing the difficulty of cleaning the laser head.

[0015] In one embodiment, the movement direction changing element is an external electric field unit; the external electric field unit is arranged outside the cavity; wherein the external electric field unit is configured to generate an external electric field, and the external electric field is configured to change the movement direction of the impurities.

[0016] In the above implementation process, by setting the movement direction changing element as an external electric field unit, and the external electric field unit can generate a corresponding external electric field, the free electrons inside the slag and / or plasma will move under the action of the electric field force, thereby changing the movement direction of impurities such as slag and plasma in the cavity, thereby improving the protection of other components of the laser head and extending the service life of the laser head.

[0017] In one embodiment, a pouring spout is provided inside the cavity; wherein a diameter of a side of the pouring spout close to other components of the laser head is larger than a diameter of a side of the pouring spout close to the nozzle.

[0018] In the above implementation process, by setting a pouring mouth inside the cavity, the pouring mouth can block a part of impurities moving toward other parts of the laser head, thereby reducing the impurities moving toward other parts of the laser head, improving the protection of other parts of the laser head, and extending the service life of the laser head.

[0019] In one embodiment, it also includes: an air inlet; the air inlet is arranged on a side of the cavity close to other components of the laser head; one end of the air inlet is connected to the inner side of the cavity, and the other end of the air inlet is connected to an external air source; wherein the air inlet is configured to transmit the external air source to the cavity, and the external air source is configured to purge the impurities toward the nozzle.

[0020] In the above implementation process, by setting an air inlet and connecting the air inlet to the inner side of the cavity, external gas can be blown from one side of other components of the laser head toward the nozzle, thereby driving impurities such as ash layers that cannot change the direction of movement through the movement direction changing element to be ejected toward the nozzle, thereby reducing impurities moving toward other components of the laser head, improving the protection of other components of the laser head, and extending the service life of the laser head.

[0021] In the second aspect, an embodiment of the present application also provides a laser head, comprising: a blocking member and the first aspect, or the protective device of any one of the first aspect; the blocking member is arranged at an end away from the nozzle in the protective device; wherein the blocking member is configured to protect the optical path and components inside the laser head from being contaminated by impurities; and the protective device is configured to change the movement direction of impurities.

[0022] In the above implementation process, by setting a protective device between the blocking member and the nozzle, the protective device can be used to change the movement direction of impurities, thereby reducing the impurities moving toward the blocking member, avoiding the impact of impurities on the blocking member, extending the service life of the blocking member, and reducing the use cost of the blocking member.

[0023] In one embodiment, it further includes: a laser generator and a laser transmitter; the laser generator and the laser transmitter are both arranged on a side of the blocking member away from the nozzle; wherein the laser transmitter is configured to transmit the laser generated by the laser generator to the blocking member, and transmit it to the nozzle through the blocking member and the cavity; the nozzle is configured to emit the laser to the outside of the laser head.

[0024] In the above implementation process, by arranging the laser transmitter and the laser generator on the side of the blocking member away from the nozzle, the blocking member can prevent impurities from moving toward the internal components of the laser head such as the laser generator and the laser transmitter, thereby protecting the internal components of the laser head, improving the protection of other components of the laser head, and extending the service life of the laser head.

[0025] In order to make the above-mentioned objects, features and advantages of the present application more obvious and understandable, embodiments are given below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of a protection device provided in an embodiment of the present application;

[0028] Figure 2 A schematic diagram of a magnetic field generated by a motion direction changing element provided in an embodiment of the present application;

[0029] Figure 3 A schematic diagram of a laser head provided in an embodiment of the present application.

[0030] Description of the drawings: 110 - cavity, 120 - nozzle, 130 - motion direction changing element, 140 - pouring mouth, 150 - air inlet, 20 - impurity, 210 - plasma, 30 - metal, 40 - barrier, F - Lorentz force, S - original motion trajectory of the impurity. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0032] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0033] Laser processing heads such as laser cutting heads and laser welding heads are equipped with protective lenses. The main function of the protective lenses is to protect the optical path and core components inside the laser processing head from being contaminated by external dust, splashing slag, etc. The traditional method of protecting the protective lenses is to blow the protective lenses with protective gas.

[0034] However, the inventors of the present application have discovered through long-term research that the above-mentioned protection method is effective against general dust, but has very limited protection against pollution caused by splashing slag, especially plasma.

[0035] In view of this, the present application proposes a protective device, which arranges a motion direction changing element on the cavity between the nozzle and other components of the laser head. The motion direction changing element can be used to change the movement direction of impurities, thereby reducing the impurities moving toward other components of the laser head, thereby improving the protection of other components of the laser head and extending the service life of the laser head.

[0036] like Figure 1 , is a schematic diagram of a protection device provided in an embodiment of the present application, comprising: a cavity 110 , a nozzle 120 and a motion direction changing element 130 .

[0037] One end of the cavity 110 is connected to the nozzle 120 , and the other end of the cavity 110 is provided with other components of the laser head; the motion direction changing element 130 is located between the nozzle 120 and other components of the laser head, and the motion direction changing element 130 is provided on the cavity 110 .

[0038] It can be understood that when the laser head is working, the laser generated by the laser head is emitted to the outside of the laser head through the nozzle 120 .

[0039] The other components of the laser head here refer to the components of the laser head except the nozzle 120, for example, a focusing mirror, a reflecting mirror, a connecting piece, a collimating piece, a protective mirror, etc.

[0040] The above-mentioned motion direction changing element 130 is configured to change the motion direction of the impurity 20. For example, the impurity 20 moves from the nozzle 120 to other parts of the laser head, and the motion direction changing element can make the impurity 20 move from other parts of the laser head to the nozzle 120. For another example, the impurity 20 moves from the nozzle 120 to other parts of the laser head, and the motion direction changing element can make the impurity 20 move from other parts of the laser head to the cavity 110, etc.

[0041] The moving direction changing element 130 can generate a certain force, and the force can be used to change the moving direction of the impurities 20. For example, the moving direction changing element 130 is a magnet, and the magnet can generate a corresponding magnetic force, thereby changing the moving direction of the metal slag through the magnetic force. The magnet can also form a magnetic field, and the movement of the plasma 210 in the magnetic field may generate a Lorentz force F, and the moving direction of the plasma 210 is changed by the Lorentz force F.

[0042] Of course, in some cases, the motion direction changing element 130 may also be some power element, which can be used to generate power, and the power generated by the motion element can be used to control the impurities 20 to move along the target direction, etc. The motion direction changing element 130 can be selected according to actual conditions.

[0043] It should be understood that during the process of laser head processing metal 30, slag and plasma 210 may be generated. Some of these splashing slag and plasma clouds may enter the cavity 110 from the nozzle 120, and the slag contacts other parts of the laser head, which may cause burns to the parts contacting the slag due to absorbing huge laser heat. In addition, the plasma 210 contacts other parts of the laser head, which may also damage the parts contacting the plasma 210.

[0044] By setting a motion direction changing element 130 on the cavity 110, the motion direction changing element 130 can be used to change the motion direction of the impurity 20, thereby causing the impurity 20 to move in a direction away from other components of the laser head, thereby preventing the impurity 20 from contacting other components of the laser head and improving the protection of other components of the laser head.

[0045] For example, if the moving direction changing element 130 is a magnet, the magnetically conductive slag entering from the nozzle 120 will be attracted by the magnet and move close to the inner wall of the cavity 110, thereby reducing the slag moving toward other parts of the laser head. At the same time, the magnet can form a corresponding magnetic field, and the charged plasma 210 will be deflected in the moving direction under the action of the Lorentz force F generated by the magnetic field, thereby reducing the plasma 210 moving toward other parts of the laser head.

[0046] If the movement direction changing element 130 is an external electric field unit, the external electric field unit will generate an external electric field, and an electric field force can be generated through the external electric field. Under the action of the electric field force, the movement direction of the slag and plasma 210 is deflected, thereby reducing the plasma 210 and slag moving toward other parts of the laser head.

[0047] The above-mentioned interaction relationship between the motion direction changing element 130 and the impurity 20 is only exemplary, and the interaction relationship between the motion direction changing element 130 and the impurity 20 can be adjusted according to actual conditions.

[0048] Optionally, the impurity 20 may be slag, plasma 210, dust, etc. The impurity 20 may be selected according to actual conditions.

[0049] In the above implementation process, by setting a movement direction changing element 130 on the cavity 110 between the nozzle 120 and other components of the laser head, the movement direction changing element 130 can be used to change the movement direction of the impurities 20, thereby reducing the impurities 20 moving toward other components of the laser head, thereby improving the protection of other components of the laser head and extending the service life of the laser head.

[0050] In a possible implementation, the motion direction changing element 130 is a magnet; the magnet is disposed outside the cavity 110 , and the magnetic field direction of the magnet is perpendicular to the axial direction of the cavity 110 .

[0051] The magnet may be a strong magnet, and the magnet is configured to change the movement direction of the impurities 20 .

[0052] Optionally, the magnet can be arranged around the cavity 110, or on one side of the cavity 110, or on two opposite sides of the cavity 110. The arrangement and quantity of the magnet can be adjusted according to actual conditions.

[0053] The magnet here can be a permanent magnet or an electromagnet, and the magnet type can be selected according to actual conditions.

[0054] It is understandable that when the laser head processes the metal 30, some metal slag and plasma 210 may be generated, and these slag and plasma 210 may contact other parts of the laser head and damage these parts. In particular, the lens plays a very important role in the laser head, but the contact of slag with the lens may burn the lens, and the contact of plasma 210 with the lens may damage the lens, thereby affecting the use of the laser head.

[0055] By setting a magnet, the magnet may generate a corresponding magnetic field. When the slag and plasma 210 move in the cavity 110, the direction of movement can be changed under the action of the magnetic force generated by the magnet and the Lorentz force F, so that the slag and plasma 210 move in a direction close to the nozzle 120, and impurities 20 such as the slag and plasma 210 can be discharged from the laser head through the nozzle 120.

[0056] In the above implementation process, by setting the movement direction changing element 130 to be a magnet, and the magnetic field direction of the magnet is perpendicular to the axial direction of the cavity 110, the corresponding magnetic force and Lorentz force F can be generated based on the magnet, and then the movement direction of impurities 20 such as slag and plasma 210 in the cavity 110 can be changed by the magnetic force and the Lorentz force F, thereby improving the protection of other components of the laser head and extending the service life of the laser head.

[0057] In a possible implementation, the magnet is configured to attract the slag to generate a magnetic force, and the magnetic force is configured to change the movement direction of the slag.

[0058] The slag here refers to the metal slag generated when the laser head is processing the metal 30 .

[0059] It can be understood that when the slag approaches the magnet during its movement, the magnetic field of the magnet will cause the rearrangement of the magnetic moments inside the slag, so that the slag will produce magnetism that attracts the magnet. The essence of this attraction is the magnetic force generated between the magnetic field of the magnet and the magnetic moments inside the slag. Specifically, the magnetic field of the magnet will change the motion state of the electrons inside the slag, so that the magnetic moments inside the slag tend to be consistent with the direction of the magnetic field of the magnet, thereby generating attraction.

[0060] Since the magnet is disposed outside the cavity 110 , the slag moves toward the inner wall of the cavity 110 under the attraction of the magnet, thereby reducing the slag moving toward other components of the laser head.

[0061] In the above implementation process, by setting the movement direction changing element 130 as a magnet, the magnet can generate magnets with the slag, thereby changing the movement direction of the slag, which can reduce the slag moving toward other parts of the laser head, improve the protection of other parts of the laser head, and extend the service life of the laser head.

[0062] In one possible implementation, Figure 2 As shown, the magnet is configured to generate a Lorentz force F through a magnetic field, and the Lorentz force F is configured to change the direction of movement of the plasma 210.

[0063] The plasma 210 here is composed of ionized metal vapor and ionized cutting auxiliary gas. A part of the plasma 210 may also enter the cavity 110 through the nozzle 120.

[0064] It can be understood that a corresponding magnetic field is generated around the magnet, and when the charged particles in the plasma 210 move in the magnetic field, the charged particles inside it (such as electrons and ions) will be affected by the Lorentz force F. The direction of this force is perpendicular to the direction of the magnetic field and the direction of particle movement, causing the original movement trajectory S of the particles to be deflected, thereby reducing the plasma 210 moving toward other parts of the laser head and improving the protection of other parts of the laser head.

[0065] In addition, the plasma 210 will hinder the passage of the laser beam and reduce the laser energy transmitted to the processing material. The magnetic field can change the movement direction of the plasma 210, remove ion obstacles during the transmission of the laser beam, and avoid incomplete cutting due to insufficient laser energy.

[0066] In the above implementation process, by setting the movement direction changing element 130 as a magnet, the magnet can generate a magnetic field, and the plasma 210 moves in the magnetic field to generate a Lorentz force F, and the movement direction of the plasma 210 can be changed by the Lorentz force F, thereby reducing the plasma 210 moving toward other parts of the laser head, improving the protection of other parts of the laser head, and extending the service life of the laser head. In addition, the ion obstacles in the laser beam transmission process can be removed to avoid affecting the processing effect due to insufficient laser energy, thereby improving the processing effect of the laser head.

[0067] In a possible implementation, the magnet is an electromagnet.

[0068] Among them, an electromagnet refers to a device composed of a magnetic core and a coil, which can generate a magnetic field when current flows through the coil.

[0069] The magnetism of the electromagnet here can be controlled by turning the power on and off, and the magnetism of the electromagnet can be achieved by adjusting the magnitude of the current.

[0070] It can be understood that since the electromagnet can control the presence or absence of a magnetic field through electric current, when cleaning the laser head, the current of the electromagnet can be disconnected to reduce the magnetic force and / or Lorentz force F between the impurities 20 and the electromagnet, thereby avoiding the impurities 20 adsorbed around the magnet from being difficult to clean, thereby reducing the difficulty of cleaning the laser head.

[0071] In the above implementation process, by setting the magnet as an electromagnet, the magnetism and magnetic field of the electromagnet can be controlled by turning the power on and off, making it easier to blow and clean the impurities 20 on the laser processing head when maintaining the laser head, thereby avoiding the difficulty of cleaning the impurities 20 adsorbed around the magnet and reducing the difficulty of cleaning the laser head.

[0072] In a possible implementation, the motion direction changing element 130 is an external electric field unit; the external electric field unit is disposed outside the cavity 110 .

[0073] The external electric field unit is configured to generate an external electric field, and the external electric field is configured to change the movement direction of the impurity 20 .

[0074] The external electric field unit here can be a unit composed of capacitor elements, or a unit composed of metal sheets, power supplies and other elements. The external electric field unit can be set according to actual conditions.

[0075] In one embodiment, capacitors may be disposed in parallel on two opposite sides of the cavity 110 , and the capacitors may be connected to a power source, thereby generating an external electric field around the cavity 110 .

[0076] In another embodiment, metal sheets may be arranged in one or more directions outside the cavity 110 , and each metal sheet may be connected to a power source, thereby generating an external electric field around the cavity 110 .

[0077] The above-mentioned configuration of the external electric field unit is only exemplary, and the configuration of the external electric field unit can be adjusted according to actual conditions.

[0078] It is understandable that when an external electric field acts on the slag and / or plasma 210, the free electrons inside the slag and / or plasma 210 are affected by the electric field force and move. This movement changes the charge distribution on the surface of the slag and / or plasma 210, thereby changing the movement direction of the slag and / or plasma 210.

[0079] In the above implementation process, by setting the movement direction changing element 130 as an external electric field unit, and the external electric field unit can generate a corresponding external electric field, the free electrons inside the slag and / or plasma 210 will move due to the electric field force, thereby changing the movement direction of impurities 20 such as the slag and plasma 210 in the cavity 110, thereby improving the protection of other components of the laser head and extending the service life of the laser head.

[0080] In a possible implementation, a pouring spout 140 is disposed inside the cavity 110 .

[0081] The diameter of the side of the pouring mouth 140 close to other components of the laser head is larger than the diameter of the side of the pouring mouth 140 close to the nozzle 120 .

[0082] Optionally, the pouring mouth 140 may be in a truncated cone, a prism, or the like shape, and the specific shape of the pouring mouth 140 may be selected according to actual conditions.

[0083] It can be understood that since the diameter of the side of the pour mouth 140 close to other parts of the laser head is larger than the diameter of the side of the pour mouth 140 close to the nozzle 120, the contact area between the impurities 20 and the inside of the cavity 110 can be increased, and a part of the impurities 20 moving toward other parts of the laser head can be blocked, thereby reducing the impurities 20 moving toward other parts of the laser head.

[0084] In the above implementation process, by setting a pouring mouth 140 inside the cavity 110, the pouring mouth 140 can block a part of the impurities 20 moving toward other parts of the laser head, thereby reducing the impurities 20 moving toward other parts of the laser head, improving the protection of other parts of the laser head, and extending the service life of the laser head.

[0085] In a possible implementation, the protection device further includes: an air inlet 150 .

[0086] The air inlet 150 is disposed on a side of the cavity 110 close to other components of the laser head; one end of the air inlet 150 is connected to the inner side of the cavity 110 , and the other end of the air inlet 150 is connected to an external air source.

[0087] The air inlet 150 is configured to transmit an external air source to the cavity 110 , and the external air source is configured to purge impurities 20 toward the nozzle 120 .

[0088] It is understandable that, in the process of operation of the laser head, in addition to impurities 20 such as slag and plasma 210, impurities 20 such as dust may also be generated, and it is difficult for these impurities 20 to change their movement direction through the movement direction changing element 130. For such impurities 20, external gas can be connected, and the external gas can be blown from one side of other components of the laser head toward the nozzle 120, thereby driving the impurities 20 such as dust layers that cannot change their movement direction through the movement direction changing element 130 to be ejected toward the nozzle 120.

[0089] In the above implementation process, by setting the air inlet 150, and the air inlet 150 is connected to the inner side of the cavity 110, the external gas can be blown from the side of the other components of the laser head toward the nozzle 120, thereby driving the impurities 20 such as the ash layer that cannot change the movement direction by the movement direction changing element 130 to be ejected toward the nozzle 120, thereby reducing the impurities 20 moving toward other components of the laser head, improving the protection of other components of the laser head, and extending the service life of the laser head.

[0090] like Figure 3 , which is a schematic diagram of a laser head provided in an embodiment of the present application, including: a blocking member 40 and the protective device in the above embodiment.

[0091] The blocking member 40 is disposed at an end away from the nozzle 120 in the protection device.

[0092] The blocking member 40 here is used to isolate other components of the laser head from the nozzle 120 , and the blocking member 40 is configured to protect the optical path and components inside the laser head from being contaminated by impurities 20 .

[0093] Optionally, the blocking member 40 may be a protective lens, a plastic sheet with through holes, a metal sheet with through holes, etc. The blocking member 40 may be selected according to actual conditions.

[0094] It is understandable that during the laser head processing, impurities 20 such as slag and plasma 210 may be generated. These impurities 20 may damage the blocking member 40 when in contact with the blocking member 40, thereby affecting the working effect of the laser head and even affecting the service life of the laser head. For example, the blocking member 40 is a protective lens. When the slag contacts the protective lens, the protective lens may be burned. When the plasma 210 contacts the protective lens, the protective lens may be damaged.

[0095] The above-mentioned protection device configuration changes the movement direction of the impurities 20 . The protection device can reduce the impurities 20 moving toward the blocking member 40 , thereby avoiding the influence of the impurities 20 on the blocking member 40 and extending the service life of the blocking member 40 .

[0096] In the above implementation process, a protective device is arranged between the blocking member 40 and the nozzle 120. The protective device can be used to change the movement direction of the impurities 20, thereby reducing the impurities 20 moving toward the blocking member 40, avoiding the influence of the impurities 20 on the blocking member 40, extending the service life of the blocking member 40, and reducing the use cost of the blocking member 40.

[0097] In a possible implementation, the laser head further includes: a laser generator and a laser transmitter.

[0098] The laser transmitter is arranged between the laser generator and the blocking member 40 .

[0099] The laser generator here is used to generate laser, and the laser transmitter is configured to transmit the laser generated by the laser generator to the blocking member 40, and transmit it to the nozzle 120 through the blocking member 40 and the cavity 110; the nozzle 120 is configured to emit laser to the outside of the laser head.

[0100] The above-mentioned laser generator and laser transmitter are both arranged on the side of the blocking member 40 away from the nozzle 120. The blocking member 40 is used to prevent impurities 20 from moving toward the internal components of the laser head such as the laser generator and laser transmitter, thereby protecting the internal components of the laser head.

[0101] In the above implementation process, by arranging the laser transmitter and the laser generator on the side of the blocking member 40 away from the nozzle 120, the blocking member 40 can prevent impurities 20 from moving toward the internal components of the laser head such as the laser generator and the laser transmitter, thereby protecting the internal components of the laser head, improving the protection of other components of the laser head, and extending the service life of the laser head.

[0102] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0103] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A protection device, characterized in that: include: Chamber, nozzle and motion direction changing element; One end of the cavity is connected to the nozzle, and the other end of the cavity is provided with other components of the laser head; The motion direction changing element is located between the nozzle and other components of the laser head, and the motion direction changing element is arranged on the cavity; Wherein, the movement direction changing element is configured to change the movement direction of the impurities.

2. The protection device according to claim 1, characterized in that: The motion direction changing element is a magnet; The magnet is arranged outside the cavity, and the magnetic field direction of the magnet is perpendicular to the axial direction of the cavity.

3. The protection device according to claim 2, characterized in that: The impurities are slag; The magnet is configured to attract the slag to generate a magnetic force, and the magnetic force is configured to change the moving direction of the slag.

4. The protection device according to claim 2, characterized in that: The impurity is plasma; The magnet is configured to generate a Lorentz force through a magnetic field, and the Lorentz force is configured to change the direction of movement of the plasma.

5. The protection device according to any one of claims 2 to 4, characterized in that: The magnet is an electromagnet.

6. The protection device according to claim 1, characterized in that: The motion direction changing element is an external electric field unit; The external electric field unit is arranged outside the cavity; Wherein, the external electric field unit is configured to generate an external electric field, and the external electric field is configured to change the movement direction of the impurities.

7. The protection device according to claim 1, characterized in that: The cavity is provided with a pouring spout; Wherein, the diameter of the pouring mouth on the side close to other components of the laser head is larger than the diameter of the pouring mouth on the side close to the nozzle.

8. The protection device according to claim 1, characterized in that: Also includes: Air intake; The air inlet is arranged on a side of the cavity close to other components of the laser head; One end of the air inlet is connected to the inner side of the cavity, and the other end of the air inlet is connected to an external air source; Wherein, the air inlet is configured to transmit the external air source to the cavity, and the external air source is configured to purge the impurities toward the nozzle.

9. A laser head, characterized in that: include: A blocking member and a protective device as claimed in any one of claims 1 to 8; The blocking member is arranged at an end away from the nozzle in the protection device; Wherein, the blocking member is configured to protect the optical path and components inside the laser head from being contaminated by impurities; and the protection device is configured to change the movement direction of the impurities.

10. The laser head according to claim 9, characterized in that: Also includes: a laser generator and a laser transmitter; The laser generator and the laser transmitter are both arranged on a side of the blocking member away from the nozzle; Wherein, the laser transmitter is configured to transmit the laser generated by the laser generator to the blocking member, and transmit it to the nozzle through the blocking member and the cavity; and the nozzle is configured to emit the laser to the outside of the laser head.

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