Drying device

By designing a drying device including a circulating drying flow path and a multi-vent hole lower cover plate, the problems of long and uneven drying time of the existing silicon wafer drying device are solved, and efficient and uniform silicon wafer drying is achieved. Dry effect.

CN119412894AInactive Publication Date: 2025-02-11TZTEK TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202411382449.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2025-02-11
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing silicon wafer drying devices have problems of long drying time and uneven drying time, which affects the production line efficiency.

Method used

Design a drying device including an outer box, an inner groove body, a basket bracket assembly, a sliding cover assembly, a heating assembly and a circulating fan assembly. Through the design of the spacer chamber and the top cover chamber, a circulating drying flow is formed. The lower cover plate of multiple ventilation holes is used to evenly apply hot air flow.

Benefits of technology

It improves the drying efficiency of silicon wafers, ensures drying quality, and has good temperature control effect. It is suitable for silicon wafer cleaning and drying fields.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a drying device, and belongs to the field of silicon wafer production or drying, and the drying device comprises an outer box body, an inner groove body, a material basket bracket assembly, a sliding cover plate assembly, a heating assembly and a circulating fan assembly. The inner groove body and the outer box body on the periphery are arranged at intervals to form an interval cavity, the sliding cover plate assembly provided with a top cover cavity is transversely arranged at the top of the outer box body in a sliding control mode, a side edge air outlet of the top cover cavity is correspondingly communicated with an air outlet in the top of the interval cavity, and a circulating drying flow path is formed by the circulating fan assembly, the interval cavity, the top cover cavity and the inner groove containing cavity. After hot air enters the top cover cavity from the interval cavity, hot air flow is uniformly beaten through the ventilation holes of the lower cover plate and is vertically and downwards output, the silicon wafer drying effect is improved, the temperature control effect of the device is good, the drying quality is guaranteed, and application and popularization in the fields of drying or silicon wafer cleaning and the like are facilitated.
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Description

Technical Field

[0001] The invention belongs to the field of silicon wafer production or drying, and in particular relates to a drying device. Background Art

[0002] During the silicon wafer preparation process, impurities such as silicon mud and silicon powder will remain on the outer surface of the cut and separated silicon wafers, which need to be cleaned. Conventionally, a wafer basket is used to fix the silicon wafers together for cleaning. After cleaning, a large amount of water stains will adhere to the surface of the silicon wafers and the wafer basket. At this time, the water stains on the surface need to be treated.

[0003] The conventional method for removing water stains is to let the insert flower basket and silicon wafers stand and drain together, such as standing and draining in an independent drying workshop, or drying only by heat radiation from electric heating tubes. This method is time-consuming and not conducive to efficient production of the production line. Therefore, it is necessary to design a drying tank structure to solve the above problems.

[0004] In addition, existing drying boxes often use hinged or sliding rail plug-in top covers. The hot air below is folded from the side and directly hits the lower surface of the top cover, while the conventional lower surface is a plate surface, that is, a flat surface, causing the hot air flow to hit the lower surface of the top cover in a single direction and return in a single direction to flow obliquely downward, which results in uneven drying of the silicon wafer surface. Summary of the invention

[0005] In order to overcome the deficiencies of the prior art, an object of the present invention is to provide a drying device which can solve the above-mentioned problems.

[0006] A drying device comprises an outer box body, an inner tank body, a material basket bracket assembly, a sliding cover assembly, a heating assembly and a circulating fan assembly; the inner tank body and the outer box body are spaced apart to form a partition cavity, the material basket bracket assembly is arranged on the inner tank body, the sliding cover assembly provided with a top cover cavity is arranged on the top of the outer box body for horizontal sliding control, the heating assembly is arranged in the partition cavity, the circulating fan assembly is installed on the outer box body, and a circulating drying flow path is formed by the circulating fan assembly, the partition cavity, the top cover cavity and the inner tank accommodating cavity.

[0007] Optionally, the drying device also includes a filter assembly, which includes a debris filter, a trough bottom air outlet filter and a trough top air outlet filter, wherein the debris filter and the trough bottom air outlet filter are arranged on the bottom wall of the inner trough body at intervals in sequence, and the trough top air outlet filter is arranged between the inner trough body and the top edge of the outer box body.

[0008] Optionally, the drying device further comprises a plurality of temperature sensors, and probes of the temperature sensors are inserted into the compartment cavity inside the outer box body.

[0009] Optionally, the drying device also includes a cold air temperature control component, which includes an air cooling pipe group and a cold air fan, the air inlet of the cold air fan is connected to the air inlet of the air cooling pipe group, and the air outlet of the cold air fan is connected to the partition cavity, the top cover cavity or the inner groove accommodating cavity.

[0010] Optionally, a plurality of air holes are provided in the upper middle portion of the side plate of the inner tank body, and the air holes are connected to the partition cavity and the inner tank accommodating cavity.

[0011] Optionally, the sliding cover plate assembly includes a cover plate moving frame, an upper cover plate, a lower cover plate and a cover plate driving assembly, the cover plate moving frame is composed of a plurality of groove rails with inner guide grooves, the lower cover plate is arranged under the upper cover plate which is in an inverted "concave" shape as a whole, the lower cover plate adopts a mesh plate with a plurality of ventilation holes evenly opened, and a top cover cavity is formed between the upper cover plate and the lower cover plate; the upper cover plate and the lower cover plate are driven by the cover plate driving assembly as a whole to move horizontally and laterally in the groove rails of the cover plate moving frame.

[0012] Optionally, a gap is provided between the side of the lower cover plate and the lower end of the side folding plate of the upper cover plate, thereby forming a side air outlet of the top cover cavity; when the top of the outer box body of the drying device is covered by the sliding cover assembly, the side air outlet of the top cover cavity is correspondingly connected to the top air outlet of the gap cavity.

[0013] Compared with the prior art, the beneficial effect of the present invention is that after the hot air of the drying device of the present application enters the top cover cavity from the partition cavity, the hot air flow is evenly distributed and output vertically downward through the multiple ventilation holes of the lower cover plate, thereby improving the drying effect of the silicon wafer. The device has good temperature control effect, ensures the drying quality, and is easy to promote and apply in the fields of drying or silicon wafer cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the drying device of the present invention;

[0015] Figure 2 It is a schematic diagram of the drying device tank body opening to the tank body closing;

[0016] Figure 3 It is a partial structural schematic diagram of the sliding cover assembly;

[0017] Figure 4 It is a schematic diagram of the circulation drying flow path;

[0018] Figure 5 This is a practical schematic diagram of three sets of drying devices connected in series.

[0019] In the figure,

[0020] 100. Outer box;

[0021] 200, inner tank; 210, air vent;

[0022] 300, basket bracket assembly;

[0023] 400, sliding cover plate assembly; 410, cover plate moving frame; 420, upper cover plate; 430, lower cover plate; 440, cover plate driving assembly;

[0024] 500, heating component;

[0025] 600, circulation fan assembly;

[0026] 700, filter assembly; 710, crushing filter screen; 720, trough bottom tuyere filter screen; 730, trough top tuyere filter screen;

[0027] 800. Temperature sensor. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] A drying device, see Figure 1-Figure 4 , including an outer box body 100, an inner tank body 200, a basket bracket assembly 300, a sliding cover assembly 400, a heating assembly 500 and a circulating fan assembly 600.

[0030] Drying flow path: the inner tank body 200 and the outer box body 100 are spaced apart to form a partition cavity, the basket bracket assembly 300 is arranged on the inner tank body 200, the sliding cover plate assembly 400 with a top cover cavity is arranged on the top of the outer box body 100 for horizontal sliding control, the heating assembly 500 is arranged in the partition cavity, and the circulating fan assembly 600 is installed on the outer box body 100. A circulating drying flow path is formed by the circulating fan assembly 600, the partition cavity, the top cover cavity, and the inner tank accommodating cavity.

[0031] Specifically: the inner tank body 200 is arranged in the outer box body 100, and the inner tank body 200 and the outer box body 100 are spaced apart to form a spacer cavity for the circulation of hot air; the concave accommodating portion of the inner tank body 200 is the inner tank accommodating cavity, which is the placement space and main drying area for silicon wafers; the material basket bracket assembly 300 is arranged on the inner tank body 200, and is used to support the silicon wafer material basket; the sliding cover plate assembly 400 is arranged on the top of the outer box body 100 and the inner tank body 200 for horizontal sliding control, and the lower surface of the sliding cover plate assembly 400 is provided with vents corresponding to the air outlet at the top of the spacer cavity and the inner tank accommodating cavity; the heating assembly 500 is arranged in the spacer cavity between the outer box body 100 and the inner tank body 200, and is used to heat the circulating air; the circulating fan assembly 600 is arranged on the outer box body 100, and draws air from the spacer cavity.

[0032] The outer surface of the outer box body 100 may be provided with a heat insulating layer, including outer box side panels, outer box end panels and outer box bottom panels, which together form an open trough body.

[0033] The inner tank body 200 includes inner tank side plates and an inner tank bottom plate, but no end plates and top plates (of course, inner tank end plates may also be provided), forming a concave structure. The inner tank body 200 and the outer box end plates of the outer box body 100 form an inner tank accommodating cavity. Furthermore, a plurality of air holes 210 are provided in the middle and upper part of the side plates (i.e., inner tank side plates) of the inner tank body 200, and the air holes 210 communicate with the partition cavity and the inner tank accommodating cavity.

[0034] Among them, see Figure 2 and Figure 3 The sliding cover assembly 400 includes a cover moving frame 410, an upper cover 420, a lower cover 430 and a cover driving assembly 440. The cover moving frame 410 is composed of a plurality of groove rails with inner guide grooves. The lower cover 430 is arranged below the upper cover 420 which is in an inverted "concave" shape as a whole. The lower cover 430 adopts a mesh plate with a plurality of ventilation holes evenly provided thereon, and a top cover cavity is formed between the upper cover 420 and the lower cover 430. The upper cover 420 and the lower cover 430 are driven by the cover driving assembly 440 as a whole to move horizontally in the groove rails of the cover moving frame 410.

[0035] Among them, a guide rail is arranged in the cover plate moving frame 410, and the cover plate driving assembly 440 is driven by a cylinder, a hydraulic cylinder, a linear motor, etc., and preferably driven by a cylinder.

[0036] A gap is provided between the side of the lower cover plate 430 and the lower end of the side folded plate of the upper cover plate 420, thereby forming a side air outlet of the top cover cavity. When the top of the outer box body 100 of the drying device is sealed by the sliding cover assembly 400, the side air outlet of the top cover cavity is connected to the top air outlet of the partition cavity accordingly.

[0037] Furthermore, the drying device also includes a filter assembly 700, which includes a debris filter 710, a trough bottom air outlet filter 720 and a trough top air outlet filter 730, wherein the debris filter 710 and the trough bottom air outlet filter 720 are arranged on the bottom wall of the inner trough body 200 at intervals in sequence, and the trough top air outlet filter 730 is arranged between the inner trough body 200 and the top edge of the outer box body 100.

[0038] The filter assembly 700 is preferably a stainless steel wire mesh or mesh that is resistant to high temperature and corrosion. The debris filter 710 is arranged above the bottom tuyere filter 720, and the mesh diameter of the debris filter 710 is larger than the mesh diameter of the bottom tuyere filter 720.

[0039] Furthermore, the drying device also includes a plurality of temperature sensors 800 , and the probes of the temperature sensors 800 are inserted into the compartment cavity inside the outer box body 100 .

[0040] Temperature control principle of the drying device: if the temperature detected by the temperature sensor 800 exceeds the drying temperature threshold, the heating power of the heating component 500 is reduced, and vice versa. Specifically: 1. reduce the heating power; 2. if the temperature exceeds the threshold value, stop heating.

[0041] Furthermore (not shown), as an option, the drying device also includes a cold air temperature control component, which includes an air cooling pipe group and a cold air fan, the air inlet of the cold air fan is connected to the air inlet of the air cooling pipe group, and the air outlet of the cold air fan is connected to the partition cavity, the top cover cavity or the inner groove accommodating cavity.

[0042] The cooling fan can be installed on the bottom plate, side plate or end plate of the outer box 100. Of course, it can also be installed on the sliding cover plate assembly 400, but it needs to move with the cover plate, which is not preferred. The cooling air can be directly passed to the partition cavity, which cools down evenly; it can also be directly passed to the inner tank accommodating cavity of the inner tank body 200, and the temperature at the silicon wafer drying location cools down faster.

[0043] Cooling principle of cold air access: In the aforementioned high temperature resistance principle, the response rate is slow when cooling. Therefore, when a sudden high temperature occurs and rapid cooling is required, a cooling measure of cold air access is designed.

[0044] Not shown in the figure, the cold air blower quickly passes external cold air into the drying device, which can quickly cool down, has a fast response speed, and has a better temperature control effect.

[0045] Application: This drying device can be used in the cleaning machine in the production of silicon wafers. After the silicon wafers are cleaned, they enter the drying station, where the aforementioned drying device efficiently dries the silicon wafers in batches to remove water stains on the surface of the silicon wafers. In specific applications, multiple groups of the aforementioned drying devices are connected in series (see Figure 5 , three groups are connected in series) or in parallel to increase the drying capacity.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A drying device, comprising an outer box (100), an inner tank (200), a basket bracket assembly (300), a sliding cover assembly (400), a heating assembly (500) and a circulating fan assembly (600); characterized in that: The inner tank body (200) and the outer box body (100) are spaced apart to form a spacer cavity, the basket bracket assembly (300) is arranged on the inner tank body (200), the sliding cover assembly (400) provided with a top cover cavity is arranged on the top of the outer box body (100) in a lateral sliding controlled manner, the heating assembly (500) is arranged in the spacer cavity, and the circulation fan assembly (600) is installed on the outer box body (100), and a circulation drying flow path is formed by the circulation fan assembly (600), the spacer cavity, the top cover cavity, and the inner tank accommodating cavity.

2. The drying device according to claim 1, characterized in that: The drying device further comprises a filter assembly (700), wherein the filter assembly comprises a debris receiving filter (710), a trough bottom air outlet filter (720) and a trough top air outlet filter (730), wherein the debris receiving filter (710) and the trough bottom air outlet filter (720) are sequentially arranged at intervals on the bottom wall of the inner trough body (200), and the trough top air outlet filter (730) is arranged between the inner trough body (200) and the top edge of the outer box body (100).

3. The drying device according to claim 1, characterized in that: The drying device further comprises a plurality of temperature sensors (800), wherein the probes of the temperature sensors (800) are inserted into the compartment cavity inside the outer box body (100).

4. The drying device according to claim 3, characterized in that: The drying device also includes a cold air temperature control component, which includes an air cooling pipe group and a cold air fan. The air inlet of the cold air fan is connected to the air inlet of the air cooling pipe group, and the air outlet of the cold air fan is connected to the partition cavity, the top cover cavity or the inner groove accommodating cavity.

5. The drying device according to claim 1, characterized in that: A plurality of air holes (210) are provided in the upper middle portion of the side plate of the inner tank body (200), and the air holes (210) are connected to the partition cavity and the inner tank accommodating cavity.

6. The drying device according to claim 1, characterized in that: The sliding cover plate assembly (400) comprises a cover plate moving frame (410), an upper cover plate (420), a lower cover plate (430) and a cover plate driving assembly (440); the cover plate moving frame (410) is composed of a plurality of groove rails with inner guide grooves; the lower cover plate (430) is arranged below the upper cover plate (420) which is in an inverted "concave" shape as a whole; the lower cover plate (430) adopts a mesh plate with a plurality of ventilation holes evenly provided thereon; a top cover cavity is formed between the upper cover plate (420) and the lower cover plate (430); the upper cover plate (420) and the lower cover plate (430) are driven by the cover plate driving assembly (440) as a whole to move horizontally in the groove rails of the cover plate moving frame (410).

7. The drying device according to claim 6, characterized in that: A gap is provided between the side of the lower cover plate (430) and the lower end of the side folded plate of the upper cover plate (420), thereby forming a side air outlet of the top cover cavity; when the top of the outer box body (100) of the drying device is sealed by the sliding cover plate assembly (400), the side air outlet of the top cover cavity is connected to the top air outlet of the gap cavity.

Citation Information

Patent Citations

  • Hot air circulation oven with tank cover

    CN111306902A

  • Novel silicon wafer cleaning machine drying structure

    CN208349787U

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    CN209588548U

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