Detection method and system for rapidly determining temperature stabilization time

Abstract

The invention discloses a detection method and system for rapidly determining temperature stabilization time, and relates to the technical field of data processing. The method comprises the following steps: acquiring material parameters and structure parameters of a plurality of components in a to-be-detected product, and calculating temperature lag time of each component based on material information and structure information of each component; screening out a plurality of parts of which the temperature lag time is greater than or equal to a time threshold value as target parts; receiving temperature data of the mounting positions corresponding to the target parts, and generating temperature curves corresponding to the target parts based on the temperature data and a preset sampling period; and determining the temperature stabilization time of the to-be-detected product in combination with the temperature curves. By implementing the technical scheme provided by the invention, the effect of improving the detection accuracy of the temperature stabilization time is achieved.

Description

Technical Field

[0001] The present application relates to the field of data processing technology, and in particular to a detection method, system, electronic device and storage medium for quickly determining temperature stabilization time. Background Art

[0002] With the acceleration of global industrialization, the reliability and performance stability of industrial products have become the focus of increasing attention of manufacturers and consumers. Especially in high-end manufacturing industries such as electronics, automobiles and aircraft manufacturing, the temperature stability of products under various environmental conditions directly affects their safety and functional realization.

[0003] At present, the existing detection methods for determining the temperature stabilization time mainly rely on detecting the components at fixed positions in the product to determine the temperature stabilization time of the product. However, in actual applications, since there are multiple components inside the product and the material properties of different components are different, only by detecting the components at fixed positions, the thermal response differences of other components in the product are often ignored, resulting in misjudgment of the overall temperature stability of the product, resulting in low accuracy in the detection of the temperature stabilization time. Summary of the invention

[0004] The present application provides a detection method and system for quickly determining temperature stabilization time, which has the effect of improving the detection accuracy of temperature stabilization time.

[0005] In a first aspect, the present application provides a detection method for quickly determining temperature stabilization time, comprising: Obtaining material parameters and structural parameters of multiple components in the product to be tested, and calculating the temperature hysteresis time of each component based on the material information and structural information of each component; Screening out a plurality of components whose temperature hysteresis time is greater than or equal to a time threshold as target components; Receiving temperature data of the installation position corresponding to each of the target components, and generating a temperature curve corresponding to each of the target components based on each of the temperature data and a preset sampling period; In combination with each of the temperature curves, the temperature stabilization time of the product to be tested is determined.

[0006] In a second aspect of the present application, a detection system for quickly determining temperature stabilization time is provided, the system comprising: a parameter acquisition module, for acquiring material parameters and structural parameters of multiple components in a product to be detected, and calculating the temperature lag time of each component based on the material information and structural information of each component; A component screening module, used to screen out a plurality of components whose temperature hysteresis time is greater than or equal to the time threshold as target components; a curve generating module, used to receive the temperature data of the installation position corresponding to each target component, and generate a temperature curve corresponding to each target component based on each temperature data and a preset sampling period; The time detection module is used to determine the temperature stabilization time of the product to be detected in combination with each of the temperature curves.

[0007] In a third aspect of the present application, an electronic device is provided, comprising a memory, a processor, and a program stored in the memory and executable on the processor, wherein the program can implement a detection method for quickly determining temperature stabilization time when loaded and executed by the processor.

[0008] In a fourth aspect of the present application, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor implements a detection method for quickly determining a temperature stabilization time.

[0009] In summary, one or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: By adopting the above technical solution, the temperature lag time of each component is calculated by combining the material parameters and structural parameters of the components corresponding to multiple installation positions, which can effectively distinguish the target components that have a greater impact on the temperature stability of the product, thereby narrowing the scope of key components of concern, making the detection more centralized and targeted, and improving the accuracy and efficiency of the detection. The temperature curve of each target component is generated, and the positional relationship between the components is considered, and temperature compensation and correction are performed, which can more accurately reflect the temperature change of each component and the heat conduction effect inside the product, so that the corrected target temperature curve can be obtained, making the judgment basis of the temperature stabilization time more accurate and reliable. By judging whether the temperature difference and curve slope of the target temperature curve are stable, the thermal response of multiple target components is considered, and whether the temperature of the product is stable can be accurately determined, avoiding misjudgment based on the temperature of a single component, and improving the detection accuracy of the temperature stabilization time. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a flow chart of a detection method for quickly determining temperature stabilization time provided in an embodiment of the present application; Figure 2 It is a structural schematic diagram of a detection system for quickly determining temperature stabilization time provided in an embodiment of the present application; Figure 3 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application.

[0011] Description of reference numerals: 300, electronic device; 301, processor; 302, communication bus; 303, user interface; 304, network interface; 305, memory. DETAILED DESCRIPTION

[0012] In order to enable technicians in this field to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0013] In the description of the embodiments of the present application, words such as "for example" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "for example" or "for example" is intended to present related concepts in a specific way.

[0014] In the description of the embodiments of the present application, the meaning of the term "multiple" refers to two or more. For example, multiple systems refer to two or more systems, and multiple screen terminals refer to two or more screen terminals. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0015] The present application embodiment provides a method for quickly determining the temperature stabilization time. In one embodiment, please refer to Figure 1 , Figure 1 This is a flow chart of a method for quickly determining the temperature stabilization time provided by an embodiment of the present application. The method can be implemented by a computer program, which can be integrated into an application or run as an independent tool application. The method can also be implemented by a single-chip microcomputer or run in a detection system for quickly determining the temperature stabilization time based on a von Neumann system. Specifically, the method can include the following steps: Step 101: Obtain material parameters and structural parameters of multiple components in the product to be tested, and calculate the temperature hysteresis time of each component based on the material information and structural information of each component.

[0016] The products to be tested can be industrial products that need to be tested for temperature stability, especially those precision equipment or systems that have high requirements for temperature stability. Specifically, the products to be tested can be understood as complex systems with multiple components made of different materials and heat transfer relationships between the components, such as avionics equipment, automotive power systems, industrial control equipment, medical diagnostic instruments, precision processing equipment, etc.

[0017] Material parameters refer to the key parameters used to characterize the thermophysical properties of the materials of each component in the product to be tested, mainly including specific heat capacity and heat dissipation coefficient. Among them, specific heat capacity reflects the ability of the material to store heat, that is, the amount of heat required to increase the unit temperature of a unit mass of the material; the heat dissipation coefficient characterizes the ability of the material to transfer heat to the surrounding environment, that is, the heat dissipation rate of the material under unit area and unit temperature difference conditions.

[0018] Structural parameters refer to the basic parameters used to describe the geometric characteristics and physical properties of each component in the product to be tested, mainly including mass and surface area. Among them, mass reflects the heat capacity of the component and directly affects the speed of its temperature change; surface area determines the contact area of ​​the component for heat exchange with the external environment, affecting the efficiency of heat transfer.

[0019] Temperature hysteresis time refers to the time delay required for each component in the product to be tested to reach the target temperature from the initial temperature when the external ambient temperature changes. This time reflects the response speed and thermal inertia characteristics of the components to temperature changes.

[0020] Specifically, in order to accurately evaluate the response characteristics of each component in the product to be tested to temperature changes, it is first necessary to obtain the material parameters and structural parameters of multiple components in the product. Among them, the material parameters include specific heat capacity and heat dissipation coefficient, which reflect the ability of the material to store and transfer heat; the structural parameters include mass and surface area, which determine the thermal inertia characteristics of the component during temperature changes. For example, for an electronic device, the above parameters of key components such as the processor, radiator, and PCB board can be obtained. After obtaining the parameters, the temperature lag time of each component is comprehensively calculated by combining the material parameters and structural parameters through a formula. This calculation method comprehensively considers the influence of the physical properties and geometric characteristics of the component on its temperature response. For example, components with larger mass or higher specific heat capacity often have greater thermal inertia and take longer to reach temperature stability; while components with larger surface area or higher heat dissipation coefficient are conducive to rapid heat transfer and may have shorter temperature lag time. By calculating the temperature lag time, the time required for each component to reach a temperature stable state can be quantitatively evaluated, which provides a data basis for the subsequent screening of key detection components.

[0021] Based on the above embodiment, as an optional embodiment, in step 101: calculating the temperature hysteresis time of each component based on the material information and structure information of each component, this step may also include the following steps: Step 201: Substitute the specific heat capacity, heat dissipation coefficient, mass and surface area of ​​each component into a preset formula to obtain the temperature hysteresis time of each component; wherein the preset formula is: Where, T i represents the temperature hysteresis time of the i-th component, G i represents the mass of the i-th component, C i represents the specific heat capacity of the ith component, S i represents the surface area of ​​the ith component, λ i represents the heat dissipation coefficient of the ith component.

[0022] The preset formula refers to a mathematical formula for calculating the temperature hysteresis time of each component in the product to be tested. In the embodiment of the present application, the preset formula can be understood as a multivariate analysis formula including the mass, specific heat capacity, heat dissipation coefficient and surface area of ​​the component, and the preset formula is used to quantitatively calculate and evaluate the temperature hysteresis time of each component.

[0023] Specifically, in order to accurately calculate the temperature hysteresis time of each component of the product to be tested, it is necessary to substitute the obtained material parameters and structural parameters into the preset formula for calculation. This formula is based on the basic principles of thermodynamics and comprehensively considers the key factors that affect the temperature response characteristics of the components, among which T i reflects the characteristic time required for the i-th component to reach temperature stability. In the implementation process, the mass G of the i-th component is first i Specific heat capacity C i , surface area S i and heat dissipation coefficient λ i Substitute them into the preset formula. For example, for an aluminum radiator, its mass is 0.2 kg, its specific heat capacity is 900 joules per kilogram per degree Celsius, its surface area is 0.05 square meters, and its heat dissipation coefficient is 15 watts per square meter per degree Celsius. Substituting them into the formula, we can get its temperature lag time T i =(0.2×900) / (0.05×15)=240 seconds. In this way, the temperature hysteresis time of all components in the product to be tested can be calculated in sequence.

[0024] By combining the physical and geometric characteristics of the components through a preset formula, the obtained temperature hysteresis time can objectively reflect the thermal response characteristics of the components. i ×C i Indicates the total heat capacity of the component, reflecting its ability to store heat; the denominator Si ×λ i It indicates the total heat dissipation capacity of the component and reflects the efficiency of heat transfer. The ratio of these two factors accurately describes the dynamic response characteristics of the component during temperature changes. Through this quantitative calculation, reliable data support is provided for the subsequent screening of key detection components, thereby improving the accuracy of temperature stabilization time detection.

[0025] Step 102: Filter out a plurality of components whose temperature hysteresis time is greater than or equal to a time threshold as target components.

[0026] Specifically, in order to accurately identify the key components that have a decisive influence on the temperature stability of the product, it is necessary to screen based on the calculated temperature lag time. The screening process uses the time threshold as the judgment standard, and the components with a temperature lag time greater than or equal to the threshold are determined as target components. The setting of the time threshold is usually based on product performance requirements and engineering practice experience. For example, the time threshold can be set to 180 seconds, which means that components with a temperature lag time of more than 3 minutes will be identified as target components. First, the temperature lag time of each component is compared with the preset time threshold. For example, when the product to be tested contains components such as a heat sink with a temperature lag time of 240s, a processor with a temperature lag time of 120s, a power module with a temperature lag time of 200s, and a PCB board with a temperature lag time of 150s, if the time threshold is set to 180 seconds, the heat sink and the power module will be screened as target components. Since these target components have a long temperature lag time, their temperature response characteristics will significantly affect the overall temperature stability of the product. This time threshold-based screening method can effectively reduce the complexity of detection and improve detection efficiency by focusing on components with longer temperature lag times. The screened target components can truly reflect the temperature stability characteristics of the product and provide a data basis for the subsequent precise detection of temperature stabilization time.

[0027] Step 103: receiving temperature data of the installation position corresponding to each target component, and generating a temperature curve corresponding to each target component based on each temperature data and a preset sampling period.

[0028] The temperature data refers to the real-time temperature measurement value collected by the temperature sensor at the installation location of the target component, including the temperature value and the corresponding timestamp information. These data reflect the actual temperature response characteristics of the target component during the change of ambient temperature.

[0029] The temperature curve refers to a continuous function curve formed by interpolating the temperature data of the target component with time as the horizontal axis and temperature as the vertical axis. This curve intuitively describes the temperature change of the target component over time during the test process and reflects the dynamic temperature response characteristics of the component.

[0030] Specifically, in order to dynamically monitor the temperature change process of the target component, it is necessary to arrange temperature sensors at the installation position of each target component to collect real-time temperature data. These temperature sensors can be thermocouples, thermistors or infrared sensors, etc. The specific selection depends on the product characteristics and measurement requirements. The setting of the sampling period needs to take into account the fast and slow characteristics of temperature change. It can usually be set to 1 second to 10 seconds. A shorter sampling period is conducive to capturing rapid temperature changes, while a longer sampling period is suitable for slow temperature changes. In the specific implementation process, the temperature sensor continuously collects temperature data at the installation position of the target component according to the preset sampling period. For example, for the two selected target components, the heat sink and the power module, temperature sensors can be placed at their installation positions respectively, and a sampling period of 5 seconds is used for data collection. The collected temperature data includes timestamps and corresponding temperature values. These discrete temperature data points are converted into continuous temperature curves through the data processing system. The horizontal axis of the temperature curve represents time, and the vertical axis represents temperature value, which intuitively shows the temperature change trend of the target component during the entire test process. This temperature curve generation method based on continuous sampling has significant advantages: first, through high-frequency data acquisition, the temperature change process of the target component can be fully recorded without missing key temperature fluctuation information; the visual expression of the temperature curve makes it easier for analysts to judge the temperature change characteristics and identify the temperature stabilization point; the use of a unified sampling period ensures the comparability of temperature data of different target components, providing a standardized data basis for the subsequent determination of the temperature stabilization time.

[0031] Based on the above embodiment, as an optional embodiment, in step 103: based on each temperature data and a preset sampling period, a temperature curve corresponding to each target component is generated. This step may also include the following steps: Step 301: Align the time stamps of each temperature data to obtain data samples corresponding to each target component.

[0032] The timestamp refers to the precise collection time corresponding to each temperature data point, which is recorded according to the preset sampling period with the test start time as the reference point. These timestamps accurately record the collection timing of the temperature data and are key information to ensure data time synchronization.

[0033] A data sample is a data set that contains a standardized time series and its corresponding temperature value after timestamp alignment. Each data sample consists of a unified time stamp and the actual temperature measurement value of each target component at that moment, forming a structured time-temperature correspondence dataset.

[0034] Specifically, in order to ensure that the temperature data of different target components are comparable and synchronous, it is necessary to perform timestamp alignment on the temperature data collected by each temperature sensor. Since there may be slight time differences in the data collection of different sensors in the actual measurement process, this difference will affect the accuracy of the subsequent judgment of temperature stability, so timestamp alignment is a key step in generating standardized data samples. In the specific implementation process, a reference time point is first selected as the starting point of data alignment, and the test start time can usually be selected as the time zero point. Then, according to the preset sampling period (for example, 5 seconds), the temperature data of all target components are reorganized onto a unified time axis. For example, for the two target components of the radiator and the power module, the timestamps of the original data may be {0.1s, 5.2s, 10.1s...} and {0.2s, 5.1s, 10.2s...}, respectively. After alignment, they are unified into a standard time series of {0s, 5s, 10s...}. For temperature values ​​that do not completely correspond to the timestamps, they can be corrected by methods such as linear interpolation to ensure that there are corresponding temperature data at each standard time point. This timestamp alignment processing method has significant advantages: First, by establishing a unified time reference system, the synchronization of temperature data of different target components is ensured, making the comparative analysis of temperature changes more accurate.

[0035] Step 302: For each target component, a temperature curve of the target component within a preset sampling period is generated with multiple temperature values ​​in the data sample as the vertical axis and the sampling time of each temperature value as the horizontal axis.

[0036] Specifically, in order to show the temperature change trend of the target component, the standardized data samples need to be converted into a visual temperature curve. This conversion can not only help analysts quickly identify the temperature change characteristics, but also provide a graphical analysis basis for subsequent temperature stability judgment. By establishing a unified coordinate system, with time as the horizontal axis and temperature as the vertical axis, the temperature response characteristics of the target component during the entire test process can be clearly depicted. In the specific implementation process, a two-dimensional coordinate system is first established based on the aligned data samples, with the horizontal axis representing time and the vertical axis representing temperature. Then, the temperature data points of each target component are plotted in the coordinate system according to the sampling time. For example, for the target component of the radiator, the temperature may be 25.3 degrees Celsius at 0 seconds, 26.1 degrees Celsius at 5 seconds, and 27.0 degrees Celsius at 10 seconds. These discrete data points will be marked in the coordinate system in chronological order. In order to obtain a continuous temperature curve, these discrete data points need to be interpolated. Commonly used interpolation methods include linear interpolation, spline interpolation, etc. Selecting a suitable interpolation method can ensure that the generated temperature curve can accurately reflect the temperature change trend and have sufficient smoothness. This method of generating temperature curves is expressed through a unified coordinate system, so that the temperature change process of different target components can be directly compared and analyzed; the continuous temperature curve can fully reflect the dynamic characteristics of temperature changes, including key information such as heating rate, fluctuation amplitude and stability trend; thirdly, the visual expression method makes it easy for engineers to quickly judge abnormal temperature changes and stable states.

[0037] Step 104: Determine the temperature stabilization time of the product to be tested in combination with each temperature curve.

[0038] The temperature stabilization time refers to the time interval from the start of the test to the time when the product to be tested reaches a temperature stable state. This time point corresponds to the moment when the target component in the product to be tested reaches a temperature stable state, and is used to evaluate the overall temperature stability of the product.

[0039] Specifically, in order to accurately evaluate the temperature stability performance of the product to be tested, it is necessary to comprehensively judge the temperature stabilization time of the product based on the temperature curve of each target component. This judgment not only takes into account the temperature stability state of a single target component, but also requires a comprehensive analysis of the temperature change characteristics of all target components to determine the time required for the entire product to reach temperature stability. In the specific implementation process, the change characteristics of each temperature curve are first analyzed, focusing on the temperature change rate and fluctuation amplitude. By calculating the temperature change between adjacent sampling points, the temperature change rate curve can be obtained. When the temperature change rate of a target component is continuously lower than the preset threshold and the temperature fluctuation amplitude is within the allowable range, it can be considered that the target component has reached a temperature stable state. For multiple target components such as radiators and power modules, the moments when they reach a temperature stable state are recorded separately. Finally, the longest temperature stabilization time among all target components is taken as the temperature stabilization time of the entire product to be tested, which can ensure that all key components of the product have reached a stable state. This method for determining the temperature stabilization time avoids the one-sidedness that may be caused by the stabilization time judgment of a single component by comprehensively considering the temperature change characteristics of multiple target components; based on the dual criteria of temperature change rate and fluctuation amplitude, the accuracy of temperature stability state judgment is improved.

[0040] Based on the above embodiment, as an optional embodiment, in step 104: combining each temperature curve to determine the temperature stabilization time of the product to be tested, this step may also include the following steps: Step 401: Determine the temperature compensation coefficient corresponding to each target component based on the installation position corresponding to each target component.

[0041] The temperature compensation coefficient is a calibration factor used to correct the temperature measurement value of the target component, which reflects the degree of influence of the installation position characteristics of the target component on the temperature measurement. This coefficient is determined based on the ratio between the actual temperature of the target component and the measured value of the temperature sensor, and is used to convert the measured temperature into a correction value closer to the actual temperature.

[0042] Specifically, due to the heat transfer and mutual influence between the target components, it is necessary to determine the temperature compensation coefficient based on the relative installation position of the target components to accurately reflect the thermal coupling effect between the components. For example, when the two target components are installed at a close distance, the heat transfer between them is more significant, which may cause deviations in the temperature measurement value, so it is necessary to correct this mutual influence through the temperature compensation coefficient. In the specific implementation process, it is first necessary to obtain the installation coordinate information of each target component and calculate the relative distance between them. For example, the distance between the radiator and the power module is 5cm, and the distance between the power module and the main control board is 3cm. Based on these distance data, a thermal influence relationship model between the target components can be established. When the distance between the two components is less than a preset threshold (such as 10cm), the thermal coupling effect between them needs to be considered. The method for determining the temperature compensation coefficient is as follows: First, establish a corresponding relationship between the distance and the degree of thermal influence. The closer the distance, the greater the thermal influence, and the corresponding compensation coefficient is also greater. For example, when the distance between two components is less than 5cm, the component on the heat source side may require a compensation coefficient of 1.2; when the distance is between 5-10cm, the compensation coefficient may drop to 1.1; when the distance exceeds 10cm, it can be considered that the thermal impact is small and the compensation coefficient is close to 1.0. At the same time, the superposition effect of multiple components needs to be considered. If a target component is affected by multiple heat sources at the same time, its compensation coefficient needs to comprehensively consider the contribution of each heat source. This method of determining the temperature compensation coefficient based on the relative installation position can more accurately reflect the impact of thermal coupling effects on temperature measurement by considering the distance relationship between components; the hierarchical compensation mechanism based on the distance threshold makes the temperature correction more targeted and reasonable; considering the superposition effect of multiple heat sources makes the temperature compensation closer to the actual situation.

[0043] Based on the above embodiment, as an optional embodiment, in step 401: based on the installation position corresponding to each target component, determine the temperature compensation coefficient corresponding to each target component. This step may also include the following steps: Step 411: based on each installation position, determine the relative distance between any two adjacent target components.

[0044] Specifically, since the intensity of the thermal coupling effect between the target components is directly related to their spatial position relationship, it is necessary to determine the relative distance between them based on the installation position information of each target component. As a basic parameter for evaluating the thermal coupling effect, the accuracy of the relative distance directly affects the accuracy of the subsequent temperature compensation. In the specific implementation process, it is first necessary to obtain the spatial installation coordinates of each target component in the product. These coordinates can be obtained through the three-dimensional design drawings of the product or actual measurements, and are represented by a standard three-dimensional rectangular coordinate system. For example, in the product to be tested, the center point coordinates of the radiator are (10, 20, 0), and the center point coordinates of the power module adjacent to it are (15, 20, 0). Then, the straight-line distance between the center points of any two adjacent target components is calculated using the distance formula between two points in three-dimensional space. For the above-mentioned radiator and power module, the relative distance between them is calculated to be 5 cm. This calculation needs to be performed on all adjacent target component combinations in the product, and finally a complete relative distance data set is formed for subsequent temperature compensation coefficient determination.

[0045] Step 421: Screen out two adjacent target components with the largest relative distance, and determine the temperature transfer path of the two adjacent target components with the largest relative distance in the product to be inspected.

[0046] The temperature transfer path refers to the spatial route through which heat is transferred from one target component to another target component inside the product to be tested. This transfer path includes various heat transfer methods, such as heat conduction, heat convection and heat radiation, as well as the combination of these transfer methods in different media and structures. The temperature transfer path can be understood as the specific channel through which heat flows inside the product. For example, the temperature transfer path from the radiator to the main control board may include: the radiator conducts heat to the PCB board through a metal bracket, and then conducts heat to the main control board through the copper layer of the PCB board; or the radiator transfers heat to the main control board through the convection of the surrounding air, etc.

[0047] Specifically, since the heat transfer between the two adjacent target components with the largest relative distance is the most complex, and its temperature transfer path has a significant impact on the temperature characteristics of the entire product, it is necessary to focus on analyzing the temperature transfer characteristics between this pair of target components. This analysis can help understand the most unfavorable heat transfer situation in the product and provide an important reference for evaluating the overall temperature characteristics. In the specific implementation process, it is first necessary to compare the relative distances between all adjacent target component pairs to find the pair with the largest distance. For example, in the product to be tested, it is found through comparison that the relative distance between the radiator and the main control board is 8cm, which is greater than the distance between other adjacent component pairs. After determining this pair of target components, it is necessary to analyze the possible temperature transfer paths between them. The determination of the temperature transfer path needs to consider the physical structure and material properties inside the product, including direct heat transfer paths and indirect heat transfer paths. For example, the temperature transfer between the radiator and the main control board may be carried out through multiple paths: one is heat conduction through the connecting bracket; the second is heat transfer through air convection; the third is the heat transfer link formed by other intermediate components, such as the radiator to the power module to the PCB board to the main control board. By analyzing these transfer paths, the propagation characteristics of heat inside the product can be better understood.

[0048] Step 431: Determine the path starting point on the temperature transfer path, and calculate the distance between each target component on the temperature transfer path and the path starting point.

[0049] The path starting point refers to the location of the target component that is the source of heat transfer on the temperature transfer path. This location usually corresponds to the target component with the highest temperature or the most heat generated, and is the starting point for heat transfer and diffusion inside the product.

[0050] Specifically, since the transfer of heat on the temperature transfer path is directional and cumulative, it is necessary to determine the starting point of the path and calculate the distance between each target component on the path and the starting point, which is of great significance for accurately evaluating the heat transfer process and determining the temperature compensation coefficient. The starting point of the path is usually the main source of heat or the target component with the highest temperature. Its determination directly affects the accuracy of the subsequent temperature transfer analysis. In the specific implementation process, it is first necessary to analyze the temperature characteristics and heat generation of each target component on the temperature transfer path. For example, in the temperature transfer path from the radiator to the main control board, if the temperature of the radiator is the highest and it is the main heat source, the radiator is determined as the starting point of the path. After determining the starting point of the path, it is necessary to calculate the cumulative distance between each target component on the path and the starting point in sequence along the temperature transfer path. This calculation needs to consider the actual transfer path characteristics, rather than a simple straight-line distance. For example, if heat is transferred from the radiator (starting point) to the main control board through the power module, then the distance between the power module and the starting point is 5cm (the actual transfer distance from the radiator to the power module), and the distance between the main control board and the starting point is 12cm (including 5cm from the radiator to the power module plus 7cm from the power module to the main control board). This method of calculating the cumulative spacing based on the path starting point can more accurately describe the heat propagation process inside the product by clarifying the starting position of heat transfer; the calculation of the cumulative spacing reflects the actual path length of heat transfer, providing a more accurate distance reference for evaluating thermal coupling effects.

[0051] Based on the above embodiment, as an optional embodiment, in step 431: determining the path starting point on the temperature transfer path, this step may also include the following steps: Step 4311: Obtain the average temperature value of each target component on the temperature transfer path; determine the target component with the highest average temperature value as the path starting point on the temperature transfer path.

[0052] Specifically, since the directionality of heat transfer is usually from a high temperature area to a low temperature area, it is necessary to determine the source of heat transfer, that is, the starting point of the path, by analyzing the average temperature value of each target component on the temperature transfer path. This method of determining the starting point based on temperature characteristics can more accurately reflect the actual heat transfer law inside the product. In the specific implementation process, it is first necessary to calculate the average temperature value of each target component on the temperature transfer path during the entire test cycle. For example, for a temperature transfer path including a radiator, a power module, and a main control board, assuming that the temperature curve of the radiator contains 100 sampling points, its temperature value is distributed between 55 degrees Celsius and 65 degrees Celsius, and the average temperature value is calculated to be 60 degrees Celsius; the temperature value of the power module is distributed between 45 degrees Celsius and 55 degrees Celsius, and the average temperature value is 50 degrees Celsius; the temperature value of the main control board is distributed between 35 degrees Celsius and 45 degrees Celsius, and the average temperature value is 40 degrees Celsius. By comparing these average temperature values, it is found that the average temperature value of the radiator is the highest, so the radiator is determined as the starting point of the path of the temperature transfer path. This method of determining the starting point of the path based on the average temperature value has significant advantages: first, by calculating the average temperature value, the influence of instantaneous temperature fluctuations is eliminated, making the starting point determination more stable; second, using the target component with the highest temperature as the starting point of the path is in line with the physical laws of heat transfer, making the subsequent temperature compensation analysis more reasonable.

[0053] Step 441: The ratio of each spacing to the total length of the temperature transfer path is used as the temperature compensation coefficient corresponding to each target component.

[0054] Specifically, since heat decays as the distance increases during the transfer process, the distance between the target component and the starting point of the path has an important influence on the degree of thermal influence on it. Therefore, it is necessary to quantify this distance relationship as a temperature compensation coefficient to accurately reflect the thermal coupling influence on each target component. This compensation method based on relative distance can effectively balance the attenuation effect in the heat transfer process. In the specific implementation process, it is first necessary to determine the total length of the temperature transfer path, that is, the cumulative distance from the starting point of the path to the end of the path. For example, in the temperature transfer path from the radiator (starting point of the path) to the main control board (end of the path), if it passes through the power module, its total length is 12cm (5cm from the radiator to the power module plus 7cm from the power module to the main control board). Then, calculate the ratio of the distance between each target component on the path and the starting point of the path to the total length. Taking this transfer path as an example, the spacing ratio of the power module is 5 / 12 (about 0.42), and the spacing ratio of the main control board is 12 / 12 (1.0). These ratios are used as temperature compensation coefficients for the corresponding target components, reflecting the relative degree of their influence by thermal coupling. By establishing a standardized compensation coefficient calculation process, not only the accuracy of temperature characteristic evaluation is improved, but also a more precise reference basis is provided for product quality control.

[0055] Step 402: Correct the temperature curve of each target component according to each temperature compensation coefficient to obtain a target temperature curve of each target component.

[0056] The target temperature curve refers to a time series data curve that more accurately reflects the actual temperature change of the target component after being corrected by the temperature compensation coefficient. This curve is a correction result obtained through compensation calculation based on the original temperature measurement value, taking into account the influence of the thermal coupling effect between the target components.

[0057] Specifically, in order to obtain more accurate temperature change characteristics of the target component, the original temperature curve needs to be corrected using the temperature compensation coefficient. Since the relative installation positions between the target components will cause thermal coupling effects, the measured values ​​of the temperature sensor may be biased, so it is necessary to obtain a target temperature curve that is closer to the actual situation through correction processing. In the specific implementation process, for the temperature curve of each target component, the temperature value at each sampling moment is multiplied by the corresponding temperature compensation coefficient to obtain the corrected target temperature curve. For example, for the power module, if its temperature compensation coefficient is 1.2, the measured value of the original temperature curve at a certain moment is 40 degrees Celsius, and the corrected temperature value is 48 degrees Celsius. This correction process requires processing all sampling points of the temperature curve in sequence. The dynamic changes of the thermal coupling effect also need to be considered during the correction, that is, the temperature compensation coefficient may change under different working conditions. For example, when the temperature of a target component rises rapidly, its thermal impact on the surrounding components will be enhanced, and at this time, it may be necessary to dynamically adjust the temperature compensation coefficient of the relevant components. Through this correction process, a target temperature curve that more accurately reflects the actual temperature changes of each target component can be obtained.

[0058] Based on the above embodiment, as an optional embodiment, in step 402: according to each temperature compensation coefficient, the temperature curve of each target component is corrected to obtain the target temperature curve of each target component. This step may also include the following steps: Step 412: For each target component, based on the temperature compensation coefficient corresponding to the target component, calculate the temperature correction amount of multiple temperature values ​​in the temperature curve.

[0059] The temperature correction refers to the adjustment value that needs to be made to the measured temperature value of the target component when considering the influence of thermal coupling effect. This value reflects the correction size that needs to be made to the original temperature measurement value due to the thermal coupling effect of the surrounding components.

[0060] Specifically, since the actual temperature of the target component will be affected by the thermal coupling effect of the surrounding components, it is necessary to calculate the temperature correction amount based on the temperature compensation coefficient to eliminate the interference of the thermal coupling effect on the temperature measurement. This correction can help obtain temperature data that is closer to the actual working state of the target component and improve the accuracy of the temperature characteristic evaluation. In the specific implementation process, it is first necessary to obtain the temperature value and the corresponding temperature compensation coefficient in the temperature curve. For example, for the power module, its temperature compensation coefficient is 0.42, and the temperature value at a certain moment in the temperature curve is 45 degrees Celsius. Then, the correction amount of the temperature value is calculated based on the temperature compensation coefficient. The calculation of the temperature correction amount needs to consider the degree of influence of the thermal coupling effect, which can be obtained by multiplying the temperature value by the temperature compensation coefficient. For the example of the power module above, its temperature correction amount is 45 degrees Celsius × 0.42 = 18.9 degrees Celsius. This calculation requires processing each temperature value in the temperature curve to form a complete sequence of temperature correction amounts. For example, if the temperature curve contains 100 sampling points, 100 corresponding temperature correction amounts need to be calculated. This method of calculating the correction amount based on the temperature compensation coefficient can quantitatively reflect the influence of the thermal coupling effect on the temperature measurement by introducing the compensation coefficient, so that the correction result is more in line with the actual situation.

[0061] Step 422: performing cumulative calculation on each temperature value and the corresponding temperature correction amount to obtain the target temperature value of the target component at multiple sampling moments; and generating a target temperature curve of the target component based on each target temperature value.

[0062] Specifically, it is necessary to first perform a correction calculation on the temperature value at each sampling moment in the temperature curve. For example, for the power module, the temperature measurement value at a certain sampling moment is 45 degrees Celsius, and the corresponding temperature correction amount is 18.9 degrees Celsius. The target temperature value at that moment is 63.9 degrees Celsius obtained by cumulative operation. This calculation requires processing all sampling points in the temperature curve in sequence. If the temperature curve contains 100 sampling points, 100 cumulative operations are required to obtain a series of target temperature values ​​that reflect the actual temperature state of the target component. Then, based on these target temperature values, the data points are connected in chronological order to form a target temperature curve. For example, the target temperature values ​​of the power module at different moments are plotted into a curve chart, which can intuitively show the trend of its temperature change over time. This method of generating a target temperature curve based on cumulative operation can effectively compensate for the temperature measurement deviation caused by the thermal coupling effect by accumulating temperature values ​​and correction amounts; correction and calculation are performed at each sampling moment to ensure the time continuity of temperature characteristic evaluation; the generated target temperature curve more accurately reflects the actual operating temperature change law of the target component.

[0063] Step 403: In each target temperature curve, determine the temperature difference between any two adjacent target components; when the temperature difference between any two adjacent target components is less than the temperature difference threshold, and the curve slopes corresponding to each temperature curve are less than the slope threshold, the current time is used as the temperature stabilization time of the product to be tested.

[0064] Specifically, in order to accurately determine whether the temperature state of the product to be tested has reached stability, it is necessary to consider the temperature balance between adjacent target components and the temperature change trend of each component at the same time. This judgment method is based on two key indicators: the temperature difference between adjacent target components and the rate of change of the temperature curve, so as to ensure that the product to be tested reaches a thermal equilibrium state as a whole. In the specific implementation process, it is first necessary to analyze the data of each target temperature curve at each moment. For any two adjacent target components, such as a heat sink and a power module, calculate their temperature difference at the current moment. For example, when the temperature of the heat sink is 45 degrees Celsius and the temperature of the adjacent power module is 48 degrees Celsius, the temperature difference between them is 3 degrees Celsius. If the preset temperature difference threshold is 5 degrees Celsius, this pair of adjacent components meets the temperature balance requirement. At the same time, it is necessary to calculate the slope of each target temperature curve at the current moment, that is, the temperature change rate. The slope of the curve can be obtained by calculating the temperature change between two adjacent sampling points and dividing it by the time interval. For example, if the temperature change of a target component does not exceed 1 degree Celsius within 1 minute, the slope of its temperature curve is 1. When the preset slope threshold is 2, the component meets the temperature stability requirement. Only when the temperature difference of all adjacent target components is less than the temperature difference threshold (such as 5 degrees Celsius) and the slope of all target temperature curves is less than the slope threshold (such as 2), can the current moment be determined as the temperature stabilization time of the product to be tested. This method of determining the temperature stabilization time can more comprehensively evaluate the temperature stability of the product by simultaneously examining the two dimensions of temperature difference and change trend; based on the judgment of the temperature difference of adjacent components, it ensures the balance of the temperature distribution inside the product; through the limitation of the slope threshold, it avoids the situation where the temperature is still slowly changing and is misjudged as a stable state. Compared with the traditional method that only considers a single temperature indicator, this dual judgment mechanism significantly improves the accuracy and reliability of the temperature stabilization time judgment.

[0065] Reference Figure 2 , is a detection system for quickly determining the temperature stabilization time provided by an embodiment of the present application, the system comprising: a parameter acquisition module, a component screening module, a curve generation module, and a time detection module, wherein: A parameter acquisition module is used to obtain material parameters and structural parameters of multiple components in the product to be tested, and calculate the temperature hysteresis time of each component based on the material information and structural information of each component; A component screening module is used to screen out multiple components whose temperature hysteresis time is greater than or equal to the time threshold as target components; a curve generating module is used to receive the temperature data of the installation position corresponding to each target component, and generate a temperature curve corresponding to each target component based on each temperature data and a preset sampling period; The time detection module is used to determine the temperature stabilization time of the product to be detected by combining various temperature curves.

[0066] On the basis of the above embodiment, the parameter acquisition module is further used to substitute the specific heat capacity, heat dissipation coefficient, mass and surface area of ​​each component into a preset formula to obtain the temperature hysteresis time of each component; wherein the preset formula is: Where, T i represents the temperature hysteresis time of the ith component, G i represents the mass of the i-th component, C i represents the specific heat capacity of the ith component, S i represents the surface area of ​​the ith component, λ i represents the heat dissipation coefficient of the ith component.

[0067] Based on the above embodiment, the curve generation module is also used to align the timestamps of each temperature data to obtain data samples corresponding to each target component; for each target component, multiple temperature values ​​in the data sample are used as the vertical axis, and the sampling time of each temperature value is used as the horizontal axis to generate a temperature curve of the target component within a preset sampling period.

[0068] On the basis of the above embodiment, the time detection module is also used to determine the temperature compensation coefficient corresponding to each target component based on the installation position corresponding to each target component; according to each temperature compensation coefficient, the temperature curve of each target component is corrected to obtain the target temperature curve of each target component; in each target temperature curve, the temperature difference between any two adjacent target components is determined; when the temperature difference between any two adjacent target components is less than the temperature difference threshold, and the curve slopes corresponding to each temperature curve are less than the slope threshold, the current moment is used as the temperature stabilization time of the product to be detected.

[0069] On the basis of the above-mentioned embodiment, the time detection module is also used to determine the relative distance between any two adjacent target components based on each installation position; screen out the two adjacent target components with the largest relative distance, and determine the temperature transfer path of the two adjacent target components with the largest relative distance in the product to be detected; determine the starting point of the temperature transfer path, and calculate the distance between each target component and the starting point of the path on the temperature transfer path; and use the ratio of each distance to the total length of the temperature transfer path as the temperature compensation coefficient corresponding to each target component.

[0070] On the basis of the above embodiment, the time detection module is also used to calculate the temperature correction amount of multiple temperature values ​​in the temperature curve for each target component based on the temperature compensation coefficient corresponding to the target component; add each temperature value and the corresponding temperature correction amount to obtain the target temperature value of the target component at multiple sampling times; and generate the target temperature curve of the target component based on each target temperature value.

[0071] Based on the above embodiment, the time detection module is further used to obtain the average temperature value of each target component on the temperature transfer path; and determine the target component with the highest average temperature value as the path starting point on the temperature transfer path.

[0072] It should be noted that: when the device provided in the above embodiment realizes its function, only the division of the above functional modules is used as an example. In actual application, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the device and method embodiments provided in the above embodiment belong to the same concept, and the specific implementation process is detailed in the method embodiment, which will not be repeated here.

[0073] The present application also discloses an electronic device. Figure 3 , Figure 3 The electronic device 300 may include: at least one processor 301 , at least one network interface 304 , a user interface 303 , a memory 305 , and at least one communication bus 302 .

[0074] The communication bus 302 is used to realize the connection and communication between these components.

[0075] The user interface 303 may include a display interface and a camera interface. The optional user interface 303 may also include a standard wired interface and a wireless interface.

[0076] The network interface 304 may optionally include a standard wired interface or a wireless interface (such as a WI-FI interface).

[0077] Among them, the processor 301 may include one or more processing cores. The processor 301 uses various interfaces and lines to connect various parts in the entire server, and executes various functions of the server and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory 305, and calling data stored in the memory 305. Optionally, the processor 301 can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor 301 can integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU) and a modem. Among them, the CPU mainly processes the operating system, user interface diagrams and applications, etc.; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 301, and it can be implemented separately through a chip.

[0078] Among them, the memory 305 may include a random access memory (Random Access Memory, RAM) and may also include a read-only memory (Read-Only Memory). Optionally, the memory 305 includes a non-transitory computer-readable storage medium. The memory 305 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 305 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 305 may optionally also be at least one storage device located away from the aforementioned processor 301. Refer to Figure 3 The memory 305 as a computer storage medium may include an operating system, a network communication module, a user interface module, and an application program for a method for quickly determining a temperature stabilization time.

[0079] exist Figure 3In the electronic device 300 shown, the user interface 303 is mainly used to provide an input interface for the user and obtain the data input by the user; and the processor 301 can be used to call the application program stored in the memory 305 for a detection method for quickly determining the temperature stabilization time. When executed by one or more processors 301, the electronic device 300 executes one or more methods in the above-mentioned embodiments. It should be noted that for the aforementioned method embodiments, for the sake of simple description, they are all expressed as a series of action combinations, but those skilled in the art should know that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required for the present application.

[0080] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0081] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0082] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0083] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0084] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a memory and includes several instructions for a computer device (which can be a personal computer, server or network device, etc.) to perform all or part of the steps of the various embodiments of the present application. The aforementioned memory includes: various media that can store program codes, such as USB flash drives, mobile hard drives, magnetic disks or optical disks.

[0085] The above are only exemplary embodiments of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification and practice, those skilled in the art will easily think of other embodiments of the present disclosure.

[0086] This application is intended to cover any variation, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the art not recorded in the present disclosure. The description and examples are to be regarded as exemplary only.

Claims

1. A method for quickly determining temperature stabilization time, characterized in that: include: Obtaining material parameters and structural parameters of multiple components in the product to be tested, and calculating the temperature hysteresis time of each component based on the material information and structural information of each component; Screening out a plurality of components whose temperature hysteresis time is greater than or equal to a time threshold as target components; Receiving temperature data of the installation position corresponding to each of the target components, and generating a temperature curve corresponding to each of the target components based on each of the temperature data and a preset sampling period; In combination with each of the temperature curves, the temperature stabilization time of the product to be tested is determined.

2. The method for quickly determining the temperature stabilization time according to claim 1, characterized in that: The material parameters include specific heat capacity and heat dissipation coefficient, the structural parameters include mass and surface area, and the temperature hysteresis time of each component is calculated based on the material information and structural information of each component, including: Substituting the specific heat capacity, heat dissipation coefficient, mass and surface area of ​​each component into a preset formula to obtain the temperature hysteresis time of each component; Wherein, the preset formula is: Where, T i represents the temperature hysteresis time of the ith component, G i represents the mass of the i-th component, C i represents the specific heat capacity of the ith component, S i represents the surface area of ​​the ith component, λ i represents the heat dissipation coefficient of the ith component.

3. The method for quickly determining the temperature stabilization time according to claim 1, characterized in that: The step of generating a temperature curve corresponding to each target component based on each temperature data and a preset sampling period includes: Aligning the timestamps of the temperature data to obtain data samples corresponding to the target components; For each of the target components, a temperature curve of the target component within the preset sampling period is generated with multiple temperature values ​​in the data sample as the vertical axis and the sampling time of each temperature value as the horizontal axis.

4. The method for quickly determining the temperature stabilization time according to claim 1, characterized in that: The step of determining the temperature stabilization time of the product to be tested by combining the temperature curves comprises: Determining a temperature compensation coefficient corresponding to each target component based on an installation position corresponding to each target component; Correcting the temperature curve of each target component according to each temperature compensation coefficient to obtain a target temperature curve of each target component; In each of the target temperature curves, determining a temperature difference between any two adjacent target components; When the temperature difference between any two adjacent target components is less than the temperature difference threshold, and the curve slopes corresponding to the temperature curves are all less than the slope threshold, the current moment is taken as the temperature stabilization time of the product to be detected.

5. The method for quickly determining the temperature stabilization time according to claim 4, characterized in that: The step of determining the temperature compensation coefficient corresponding to each target component based on the installation position corresponding to each target component comprises: Based on each of the installation positions, determining a relative distance between any two adjacent target components; Screening out the two adjacent target components with the largest relative distance, and determining the temperature transfer paths of the two adjacent target components with the largest relative distance in the product to be inspected; Determine a path starting point on the temperature transfer path, and calculate a distance between each target component on the temperature transfer path and the path starting point; The ratio of each of the spacings to the total length of the temperature transfer path is used as a temperature compensation coefficient corresponding to each of the target components.

6. The method for quickly determining the temperature stabilization time according to claim 4, characterized in that: The step of correcting the temperature curve of each target component according to each temperature compensation coefficient to obtain a target temperature curve of each target component includes: For each of the target components, calculating a temperature correction amount for a plurality of temperature values ​​in the temperature curve based on a temperature compensation coefficient corresponding to the target component; Accumulating each of the temperature values ​​and the corresponding temperature correction amount to obtain the target temperature value of the target component at multiple sampling moments; Based on each of the target temperature values, a target temperature curve of the target component is generated.

7. The method for quickly determining the temperature stabilization time according to claim 5, characterized in that: The determining of a path starting point on the temperature transfer path comprises: Obtaining an average temperature value of each target component on the temperature transfer path; The target component with the highest average temperature value is determined as the path starting point on the temperature transfer path.

8. A detection system for quickly determining temperature stabilization time, characterized in that: The system comprises: A parameter acquisition module, used to acquire material parameters and structural parameters of multiple components in the product to be tested, and calculate the temperature hysteresis time of each component based on the material information and structural information of each component; A component screening module, used to screen out multiple components whose temperature hysteresis time is greater than or equal to the time threshold as target components; a curve generating module, used to receive temperature data of the installation position corresponding to each target component, and generate a temperature curve corresponding to each target component based on each temperature data and a preset sampling period; The time detection module is used to determine the temperature stabilization time of the product to be detected in combination with each of the temperature curves.

9. An electronic device, characterized in that: It includes a processor, a memory, a user interface and a network interface, the memory is used to store instructions, the user interface and the network interface are used to communicate with other devices, and the processor is used to execute the instructions stored in the memory so that the electronic device executes the detection method for quickly determining the temperature stabilization time as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores instructions, and when the instructions are executed, the detection method for quickly determining the temperature stabilization time according to any one of claims 1 to 7 is executed.

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