Test arm for dynamic and static test of IGBT (Insulated Gate Bipolar Translator)

Abstract

The invention provides a test arm for IGBT dynamic and static tests, which comprises a test arm, the test arm is used for being matched with a feeding trolley and a test machine for use, and two 180-degree rotating shaft assemblies, two test pressure providing assemblies and two chip grabbing pressure providing assemblies are respectively arranged in front of and behind the test arm. The 180-degree rotating shaft assembly, the test pressure providing assembly and the chip grabbing pressure providing assembly are all installed on the test arm base assembly. The beneficial effects of the invention are as follows: settable accurate test pressure is provided, the UPH of equipment is improved, the layout of the equipment is simplified, and the space is saved; in addition, the test arm structure has an accurate temperature control function, and different temperatures can be set according to different products during IGBT test; and the chip information can be recorded before each test of the chip. The device can adapt to different types of IGBTs, the device structure is simplified, and different IGBT products can be tested by replacing some parts of the test head base assembly and the IGBT suction assembly.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor testing, and in particular relates to a test arm for dynamic and static testing of IGBT. Background Art

[0002] During dynamic and static testing of IGBT (insulated gate bipolar transistor, a type of power semiconductor device), the test arm is generally required to pick up the IGBT chip from the feeding mechanism, and then place it on the specific socekt of the test machine, and then the test arm provides pressure. The existing equipment has the following problems: Problem 1, it cannot provide accurate pressure of different settable values, while this invention can provide accurate test pressure; Problem 2: During testing, the existing equipment generally performs vertical downward pressure testing or a few vertical upward pressure testing. However, the general test machine is relatively large in size, which means that the test machine can only be placed parallel to the upper or lower part of the test arm, which results in the test equipment occupying a huge space or the layout of the test machine is difficult; Problem 3, the existing pressure test arm has a low UPH. In IGBT testing, dynamic and static testing is a relatively time-consuming and important item. Static and dynamic testing correspond to single test arm and single head respectively, which is inefficient and does not have an ideal UPH. Summary of the invention

[0003] In view of this, the present invention aims to provide a test arm for dynamic and static testing of IGBT to solve at least one problem existing in the prior art.

[0004] To achieve the above object, the technical solution of the present invention is achieved as follows:

[0005] A test arm for IGBT dynamic and static testing comprises a test arm, which is used in conjunction with a feeding trolley and a testing machine. Two sets of 180-degree rotating shaft assemblies, two sets of test pressure providing assemblies and two sets of chip grabbing pressure providing assemblies are respectively installed at the front and rear of the test arm. The 180-degree rotating shaft assemblies, the test pressure providing assemblies and the chip grabbing pressure providing assemblies are all installed on the test arm base assembly. Pressure cylinders are respectively installed at the front of the test pressure providing assemblies and the chip grabbing pressure providing assemblies. Two sets of test head base assemblies are installed on one set of the 180-degree rotating shaft assemblies, and each set of the test head base assemblies is installed with a set of IGBT suction assemblies.

[0006] Furthermore, the 180-degree rotating shaft assembly includes a motor body, a reducer body, a reducer mounting base, a pillar, a rotating shaft base, an air joint 1, an air joint 2, a wiring terminal 1, a terminal mounting plate, a bushing, a test head base mounting base, a tension spring fixing bolt, a wiring terminal 2, a rotating shaft support seat, a zeroing detection plate, a sensor body, a sensor mounting plate, a rotating shaft limit column, a rotating shaft limit block, a rotating shaft body and a coupling. The bottom of the motor body is mounted to the reducer body, and the output shaft at the bottom of the reducer body passes through the reducer mounting base and is mounted to the rotating shaft body through the coupling. The reducer mounting The base plate and the rotating shaft base plate are connected by a number of pillars. A zero detection plate, a sensor mounting plate, a rotating shaft limit column and a rotating shaft limit block are respectively installed above the rotating shaft base plate. The sensor body is mounted on the sensor mounting plate. Air joint 1 and air joint 2 are respectively installed below the rotating shaft base plate. The bottom of the rotating shaft body passes through the rotating shaft base plate and is installed on the rotating shaft support seat. The bottom of the rotating shaft support seat is installed on the terminal mounting plate. Terminal 1 and terminal 2 are respectively installed on the terminal mounting plate. A test head base mounting base plate is installed below the terminal mounting plate. A shaft liner and a tension spring fixing bolt are installed on the surface of the test head base mounting base plate.

[0007] Furthermore, the test pressure providing assembly includes a screw support, a screw nut mounting plate, a buffer limit column, a cylinder mounting base plate, a pressure transmission column, a guide shaft fixing seat, a guide shaft, a linear bearing, a zero detection sheet, a screw body, a motor mounting base, a sensor body 1, a sensor body 2, a belt tensioning plate, a pulley 1, a protective cover, a pulley 2, and a belt body. The bottom of the pressure transmission column is installed to the cylinder mounting base plate, and the middle part of the pressure transmission column is sequentially sleeved with the guide shaft fixing seat and the screw nut mounting plate from bottom to top, and the guide shaft fixing seat and The screw nut mounting plates are connected by a guide shaft, and a buffer limit column is also installed on the guide shaft fixing seat. A zero detection plate is also installed on one side above the screw nut mounting plate. The top of the pressure transmission column passes through the screw nut mounting plate and is installed to the screw body. The top of the screw body passes through the motor mounting base and the screw support in turn and is installed to the pulley two. The pulley two and the pulley one are connected through the belt body transmission. A protective cover is provided above the pulley one, and the belt tensioning plate is installed below the pulley one. The sensor body one and the sensor body two are installed at the bottom of the belt tensioning plate.

[0008] Furthermore, the test arm base assembly includes a bracket, a cooling fan, a motor enable button, a test pressure providing assembly mounting substrate, an oblique brace, a degree drive shaft mounting substrate, a chip grasping pressure providing mounting substrate, an IO board assembly, a control valve assembly, a vacuum providing assembly, a control board, a proportional valve assembly, and a code reader. The cooling fan, the code reader, the control board and another cooling fan are installed in the middle of the bracket from left to right, and the proportional valve assembly is installed below the control board. The upper sides of the bracket are respectively mounted to the chip grasping pressure providing mounting substrate through an oblique brace. The test pressure providing assembly mounting substrate, the IO board assembly and another test pressure providing assembly mounting substrate are installed in the middle of the upper part of the bracket from left to right, and the control valve assembly is installed on the front side of the IO board assembly.

[0009] Furthermore, the pressure cylinder includes a cylinder rod, a guide ring, a cylinder barrel, a C-shaped sealing ring, a sealing ring, a gas joint, a cylinder seat, and a cylinder head. One side of the cylinder seat is connected to the gas joint, one end of the cylinder seat is installed to the cylinder barrel through a sealing ring, the cylinder rod is installed in the cylinder barrel, the cylinder head is installed on the top of the cylinder barrel, and the guide ring and the C-shaped sealing ring are sequentially sleeved on the outside of the cylinder rod.

[0010] Furthermore, the test head base assembly includes a pressure transmission column, a guide plate mounting plate, a guide column, a guide seat, a heat insulation plate 1, a clamp body, a test head base adjustment substrate, a heat insulation plate 2, a temperature switch, a temperature switch fixing bolt, a temperature sensor 1, a heating rod, a heat conduction plate, a clamp adapter plate 1, a clamp adapter plate 2, a clamp cylinder heat insulation cover, a clamp cylinder, a support for a tension spring, a clamp cylinder sensor, and a tension spring body. A temperature sensor 1 and a heating rod are respectively installed on one side of the heat conduction plate. A temperature switch is also installed on the surface of the heat conduction plate through a temperature switch fixing bolt. A heat insulation plate 2 is installed above the heat conduction plate. Two clamping jaw adapter plates 1 are installed above the hot plate 2, and the two clamping jaw adapter plates 1 are connected through the clamping jaw adapter plate 2, the clamping jaw body is installed on the inner side of the clamping jaw adapter plate 1, and the test head base adjustment substrate is installed inside the clamping jaw adapter plate 1, and the heat insulation plate 1 is installed above the test head base adjustment substrate, and the guide column is installed above the heat insulation plate 1, and the guide seat is installed to the clamping jaw adapter plate 2 through the guide plate mounting plate. The tension spring body is also installed on one side of the guide plate mounting plate through a tension spring with a support, and the clamping jaw cylinder heat insulation cover is installed on the outer side of the clamping jaw adapter plate 2, and the clamping jaw cylinder sensor is installed above the clamping jaw cylinder heat insulation cover.

[0011] Furthermore, the IGBT suction assembly includes a suction head substrate, a sealing ring, a temperature sensor fixing bolt, a second temperature sensor, a sealing ring, a suction head mounting seat, a suction head body and an IGBT body. The lower part of the IGBT body is sequentially installed to the suction head substrate through the suction head body, the suction head mounting seat and the sealing ring. The temperature sensor second is installed at the bottom of the suction head substrate through the temperature sensor fixing bolt and the sealing ring.

[0012] Furthermore, the test pressure providing component and the chip grabbing pressure providing component have the same structure, but have different lead screws for providing different downward forces.

[0013] Compared with the prior art, the test arm for dynamic and static testing of IGBT described in the present invention has the following advantages:

[0014] The test arm for dynamic and static testing of IGBT described in the present invention provides an adjustable accurate test pressure, improves the UPH of the equipment, simplifies the equipment layout, and saves space. In addition, the test arm structure of the present application has an accurate temperature control function, and different temperatures can be set according to different products during IGBT testing; chip information can also be recorded before each chip test. It can adapt to different types of IGBTs, simplify the equipment structure, and test different IGBT products by replacing some parts of the test head base assembly and the IGBT suction assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 This is a schematic diagram of the use of the test arm, feeding mechanism and testing machine according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic isometric diagram of a test arm structure according to an embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the structure of a 180-degree rotating shaft assembly according to an embodiment of the present invention;

[0019] Figure 4 A schematic diagram of the structure of the test pressure providing component and the chip grabbing pressure providing component according to an embodiment of the present invention;

[0020] Figure 5 A schematic diagram of a test arm base according to an embodiment of the present invention;

[0021] Figure 6 It is an exploded schematic diagram of the test head base structure according to an embodiment of the present invention;

[0022] Figure 7 This is a schematic diagram of the structure of a pressure cylinder according to an embodiment of the present invention;

[0023] Figure 8 It is a schematic diagram of an explosion of the IGBT absorption mechanism according to an embodiment of the present invention.

[0024] Description of reference numerals:

[0025] 1. Test arm; 2. Feeding trolley; 3. Test machine;

[0026] 100. One hundred and eighty degree rotating shaft assembly; 110. Test pressure providing assembly; 120. Chip grabbing pressure providing assembly; 130. Test arm base assembly; 140. Pressure cylinder; 150. Test head base assembly; 160. IGBT suction assembly;

[0027] 1001, motor body; 1002, reducer body; 1003, reducer mounting base plate; 1004, pillar; 1005, rotating shaft base plate; 1006, gas joint 1; 1007, gas joint 2; 1008, terminal 1; 1009, terminal mounting plate; 1010, bushing; 1011, test head base mounting base plate; 1012, tension spring fixing bolt; 1013, terminal 2; 1014, shaft support seat; 1015, zeroing detection plate; 1016, sensor body; 1017, sensor mounting plate; 1018, shaft limiting column; 1019, shaft limiting block; 1020, shaft body; 1021, coupling;

[0028] 1101, screw support; 1103, screw nut mounting plate; 1104, buffer limit column; 1105, cylinder mounting base plate; 1106, pressure transmission column; 1107, guide shaft fixing seat; 1108, guide shaft; 1109, linear bearing; 1110, zeroing detection sheet; 1111, screw body; 1112 motor mounting base; 1113 sensor body 1; 1114, sensor body 2; 1115, belt tensioning plate; 1116, pulley 1; 1117, protective cover; 1118, pulley 2; 1119, belt body;

[0029] 1301, bracket; 1302, cooling fan; 1303, motor enable button; 1304, test pressure providing assembly mounting substrate; 1305, diagonal support; 1306, 180 degree drive shaft mounting substrate; 1307, chip grabbing pressure providing mounting substrate; 1308, IO board assembly; 1309, control valve assembly; 1310, vacuum providing assembly; 1311, control board; 1312, proportional valve assembly; 1313, code reader;

[0030] 1401, cylinder rod; 1402, guide ring; 1403, cylinder barrel; 1404, C-shaped sealing ring; 1405, sealing ring; 1406, gas joint; 1407, cylinder seat; 1408, cylinder head;

[0031] 1501, pressure transmission column; 1502, guide plate mounting plate; 1503, guide column; 1504, guide seat; 1505, heat insulation board 1; 1506, clamp body; 1507, test head base adjustment substrate; 1508, heat insulation board 2; 1509, temperature switch; 1510, temperature switch fixing bolt; 1511, temperature sensor 1; 1512, heating rod; 1513, heat conduction plate; 1514, clamp adapter board 1; 1515, clamp adapter board 2; 1516, clamp cylinder heat insulation cover; 1517, clamp cylinder; 1518, support for tension spring; 1519, clamp cylinder sensor; 1520, tension spring body;

[0032] 1601, suction head substrate; 1602, sealing ring; 1603, temperature sensor fixing bolt; 1604, temperature sensor 2; 1605, sealing ring; 1606, suction head mounting seat; 1607, suction head body; 1608, IGBT body. DETAILED DESCRIPTION

[0033] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0036] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0037] like Figures 1 to 8 As shown, a test arm for IGBT dynamic and static testing includes a test arm 1, which is used to cooperate with a feeding trolley 2 and a testing machine 3. Other mechanisms transport materials to the feeding trolley 2, and then the test arm 1 takes materials from the feeding trolley 2, puts them on the testing machine 3 for testing, and then puts them on the feeding trolley 2 after the test. First, this test arm 1 takes and puts materials vertically, and the side pressure test solves the problem of inconvenient layout of the testing machine 3; the test arm 1 is respectively equipped with two sets of 180-degree rotating shaft assemblies 100, two sets of test pressure providing assemblies 110, and two sets of chip grabbing pressure providing assemblies 120 at the front and back, wherein the test pressure providing assemblies 110 and the chip grabbing pressure providing assemblies 120 have the same structure, except that the lead size of the screw body 1111 is different, the lead is different, the force provided is different, and the others are the same. There is also a set of test arm base assemblies 130, four sets of pressure cylinders 140, four sets of test head base assemblies 150, and four sets of IGBT suction assemblies 160; one set of 180-degree rotating shaft assemblies 100 is installed on the front and back Two sets of test head base assemblies 150 are installed (arranged at an angle of 180 degrees), and each set of test head base assemblies 150 is equipped with a set of IGBT suction assembly 160. The front parts of the test pressure providing assembly 110 and the chip grabbing pressure providing assembly 120 are respectively equipped with pressure cylinders 140. The pressure cylinder 140 and the proportional valve assembly 1312 are connected to the test pressure providing assembly 110 and the chip grabbing pressure providing assembly 120 to provide precise pressure. When the screw rod moves and drives the pressure cylinder 140 to squeeze the pressure transmission column 1501 downward, the test head base assembly 150 and the IGBT suction assembly 160 can move downward and sideways. When the test pressure providing assembly 110 and the chip grabbing pressure providing assembly 120 are returned to zero, the test head base assembly 150 and the IGBT suction assembly 160 will be reset under the action of the tension spring 1520. The above set of action devices corresponds to the IGBT static DC test, and the other set of 180-degree rotating shaft assembly 100 and related components correspond to the IGBT dynamic AC test.

[0038] The present invention provides an adjustable accurate test pressure, improves the UPH of the equipment, simplifies the equipment layout, and saves space. In addition, the test arm structure of the present application has an accurate temperature control function, and different temperatures can be set according to different products during IGBT testing; chip information can also be recorded before each chip test. It can adapt to different types of IGBTs, simplify the equipment structure, and test different IGBT products by replacing some parts of the test head base assembly and the IGBT suction assembly.

[0039] Furthermore, the 180-degree shaft assembly 100 includes a motor body 1001, a reducer body 1002, a reducer mounting base plate 1003, a support 1004, a rotating shaft base plate 1005, an air joint 1 1006, an air joint 2 1007, a wiring terminal 1 1008, a terminal mounting plate 1009, a bushing 1010, a test head base mounting base plate 1011, a tension spring fixing bolt 1012, a wiring terminal 2 1013, a shaft support seat 1014, a zeroing detection plate 1015, a sensor body 1016, a sensor mounting plate 1017, a shaft limiting column 1018, a shaft limiting block 1019, a shaft body 1020 and a coupling 1021. The bottom of the motor body 1001 is mounted to the reducer body 1002, and the output shaft at the bottom of the reducer body 1002 passes through the reducer mounting base plate 1003 and is mounted to the shaft body 1020 through the coupling 1021. The machine mounting substrate 1003 and the rotating shaft substrate 1005 are connected by a number of pillars 1004. A zeroing detection plate 1015, a sensor mounting plate 1017, a rotating shaft limiting column 1018, and a rotating shaft limiting block 1019 are respectively installed above the rotating shaft substrate 1005. The sensor body 1016 is installed on the sensor mounting plate 1017. An air joint 1006 and an air joint 2 1007 are respectively installed below the rotating shaft substrate 1005. The bottom of the rotating shaft body 1020 passes through the rotating shaft substrate 1005 and is installed on the rotating shaft support seat 1014. The bottom of the rotating shaft support seat 1014 is installed on the terminal mounting plate 1009. The terminal mounting plate 1009 is respectively installed with a wiring terminal 1008 and a wiring terminal 2 1013. A test head base mounting substrate 1011 is installed below the terminal mounting plate 1009. A shaft liner 1010 and a tension spring fixing bolt 1012 are installed on the surface of the test head base mounting substrate 1011.

[0040] In a preferred embodiment of the present invention, the test pressure providing component 110 includes a screw support 1101, a screw nut mounting plate 1103, a buffer limit column 1104, a cylinder mounting base plate 1105, a pressure transmission column 1106, a guide shaft fixing seat 1107, a guide shaft 1108, a linear bearing 1109, a zeroing detection piece 1110, a screw body 1111, a motor mounting base 1112, a sensor body 1113, a sensor body 2 1114, a belt tensioning plate 1115, a pulley 1116, a protective cover 1117, a pulley 2 1118, and a belt body 1119. The bottom of the pressure transmission column 1106 is installed to the cylinder mounting base plate 1105, and the middle part of the pressure transmission column 1106 is sequentially sleeved with the guide shaft fixing seat 1107 and the screw nut mounting plate 1103 from bottom to top, and the guide shaft The fixing seat 1107 and the screw nut mounting plate 1103 are connected by a guide shaft 1108. A buffer limit column 1104 is also installed on the guide shaft fixing seat 1107. A zero detection plate 1110 is also installed on one side above the screw nut mounting plate 1103. The top of the pressure transmission column 1106 passes through the screw nut mounting plate 1103 and is installed to the screw body 1111. The top of the screw body 1111 passes through the motor mounting base 1112 and the screw support 1101 in sequence and is installed to the pulley 2 1118. The pulley 2 1118 and the pulley 1 1116 are connected through the belt body 1119. A protective cover 1117 is provided above the pulley 1116. The belt tensioning plate 1115 is installed below the pulley 1116. The sensor body 1113 and the sensor body 2 1114 are installed at the bottom of the belt tensioning plate 1115.

[0041] In a preferred embodiment of the present invention, the test arm base assembly 130 includes a bracket 1301, a cooling fan 1302, a motor enable button 1303, a test pressure providing assembly mounting substrate 1304, a diagonal support 1305, a 180-degree drive shaft mounting substrate 1306, a chip grabbing pressure providing mounting substrate 1307, an IO board assembly 1308, a control valve assembly 1309, a vacuum providing assembly 1310, a control board 1311, a proportional valve assembly 1312, and a code reader 1313. The middle of the bracket 1301 is equipped with a cooling fan 1302, a motor enable button 1303, a test pressure providing assembly mounting substrate 1304, a diagonal support 1305, a 180-degree drive shaft mounting substrate 1306, a chip grabbing pressure providing mounting substrate 1307, an IO board assembly 1308, a control valve assembly 1309, a vacuum providing assembly 1310, a control board 1311, a proportional valve assembly 1312, and a code reader 1313. A heat fan 1302, a barcode reader 1313, a control board 1311 and another heat dissipation fan 1302, a proportional valve assembly 1312 is installed below the control board 1311, both sides above the bracket 1301 are respectively installed to the chip grasping pressure providing mounting substrate 1307 through a diagonal support 1305, a test pressure providing assembly mounting substrate 1304, an IO board assembly 1308 and another test pressure providing assembly mounting substrate 1304 are installed in the middle above the bracket 1301 from left to right, and a control valve assembly 1309 is installed on the front side of the IO board assembly 1308.

[0042] In a preferred embodiment of the present invention, the pressure cylinder 140 includes a cylinder rod 1401, a guide ring 1402, a cylinder barrel 1403, a C-shaped sealing ring 1404, a sealing ring 1405, a gas joint 1406, a cylinder seat 1407, and a cylinder head 1408. One side of the cylinder seat 1407 is connected to the gas joint 1406, and one end of the cylinder seat 1407 is installed to the cylinder barrel 1403 through the sealing ring 1405. The cylinder rod 1401 is installed in the cylinder barrel 1403, and the cylinder head 1408 is installed on the top of the cylinder barrel 1403. The guide ring 1402 and the C-shaped sealing ring 1404 are sequentially sleeved on the outside of the cylinder rod 1401.

[0043] In a preferred embodiment of the present invention, the test head base assembly 150 includes a pressure transmission column 1501, a guide plate mounting plate 1502, a guide column 1503, a guide seat 1504, a heat insulation plate 1505, a clamp body 1506, a test head base adjustment substrate 1507, a heat insulation plate 2 1508, a temperature switch 1509, a temperature switch fixing bolt 1510, a temperature sensor 1511, a heating rod 1512, and a heat conduction plate 1513. , a clamp adapter plate 1514, a clamp adapter plate 2 1515, a clamp cylinder heat shield 1516, a clamp cylinder 1517, a tension spring support 1518, a clamp cylinder sensor 1519, and a tension spring body 1520. A temperature sensor 1511 and a heating rod 1512 are respectively installed on one side of the heat conducting plate 1513. A temperature switch 1509 is also installed on the surface of the heat conducting plate 1513 through a temperature switch fixing bolt 1510. The heat conducting plate 151 3 is installed above the heat insulation plate 2 1508, two clamping jaw adapter plates 1 1514 are installed above the heat insulation plate 2 1508, the two clamping jaw adapter plates 1 1514 are connected by the clamping jaw adapter plate 2 1515, the clamping jaw body 1506 is installed inside the clamping jaw adapter plate 1514, the test head base adjustment substrate 1507 is installed inside the clamping jaw adapter plate 1514, the heat insulation plate 1505 is installed above the test head base adjustment substrate 1507, the heat insulation plate 1505 A guide column 1503 is installed on the top, and one side of the guide column 1503 is connected to a guide seat 1504. The guide seat 1504 is installed to the second clamp adapter plate 1515 through the guide plate mounting plate 1502. One side of the guide plate mounting plate 1502 also installs a tension spring body 1520 through a tension spring support 1518. A clamp cylinder heat insulation cover 1516 is installed on the outer side of the clamp adapter plate 1515, and a clamp cylinder sensor 1519 is installed above the clamp cylinder heat insulation cover 1516.

[0044] In a preferred embodiment of the present invention, the IGBT suction assembly 160 includes a suction head substrate 1601, a sealing ring 1602, a temperature sensor fixing bolt 1603, a temperature sensor 1604, a sealing ring 1605, a suction head mounting seat 1606, a suction head body 1607 and an IGBT body 1608. The lower part of the IGBT body 1608 is installed to the suction head substrate 1601 through the suction head body 1607, the suction head mounting seat 1606 and the sealing ring 1605 in sequence. The temperature sensor 1604 is installed at the bottom of the suction head substrate 1601 through the temperature sensor fixing bolt 1603 and the sealing ring 1602.

[0045] Working principle of a test arm for IGBT dynamic and static testing:

[0046] During the test, when the trolley first transports the material to the first position, the first set of chip grabbing pressure providing assembly 120 leadscrew rotates to make the pressure cylinder 140 move downward to squeeze the pressure transmission column 1501 so that the test head base assembly 150, the IGBT suction assembly 160 can move downward, the IGBT suction assembly 160 is connected to the vacuum providing assembly 1310, when the 1601 suction head substrate contacts the IGBT body 1608, the vacuum providing assembly 1310 works to absorb the IGBT chip, after the chip is absorbed, the clamp on the test head base starts to work and holds the chip, then the chip grabbing pressure providing assembly 120 is reset to zero, the test head base assembly 150 and the IGBT suction assembly 160 are also reset under the action of the tension spring, and the 180-degree rotating shaft assembly 100 rotates to turn the sucked IGBT to a position parallel to the side of the test machine At this time, the screw rod of the test pressure providing component 110 starts to rotate to make the pressure cylinder 140 squeeze the pressure transmission column 1501, and then the IGBT on the test head base component 150 and the IGBT suction component 160 is pressed onto the test machine 3, and then the test machine 3 starts to test the IGBT according to the relevant test. After the test is completed, the chip suction vacuum starts to work, and the clamp holds the chip, and then the chip grabbing pressure providing component 120 is reset to zero, and the 180-degree rotating shaft component 100 rotates to put the tested IGBT back to the feeding trolley 2, and the feeding trolley 2 moves forward another position, and the rear set of 180-degree rotating shaft components 100 and related components correspond to the IGBT dynamic AC test, and the above actions are repeated; after the IGBT dynamic test is completed, the IGBT is put back into the feeding trolley 2, and other mechanisms take away the material on the feeding trolley 2.

[0047] Among them, the pressure transmission column 1501 passes through the shaft bushing 1010, and the test head base assembly 150 has a precise temperature control function. Different temperatures can be set according to different products during IGBT testing; a barcode reader 1313 will record chip information before each chip test. The control valve assembly 1309 is used to control the clamping cylinder 1517; the cooling fan 1302 is used to actively cool down each time the product is switched. The temperature switch 1509 prevents overall temperature abnormalities. Different IGBT products can be tested by replacing some parts of the test head base assembly 150 and the IGBT suction assembly 160.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A test arm for IGBT dynamic and static testing, characterized in that: The invention comprises a test arm, which is used in conjunction with a feeding trolley and a testing machine. Two sets of 180-degree rotating shaft assemblies, two sets of test pressure providing assemblies and two sets of chip grabbing pressure providing assemblies are respectively installed at the front and rear of the test arm. The 180-degree rotating shaft assemblies, the test pressure providing assemblies and the chip grabbing pressure providing assemblies are all installed on the test arm base assembly. Pressure cylinders are respectively installed at the front of the test pressure providing assemblies and the chip grabbing pressure providing assemblies. Two sets of test head base assemblies are installed on one set of the 180-degree rotating shaft assemblies, and each set of the test head base assemblies is installed with a set of IGBT absorption assemblies.

2. The test arm for dynamic and static testing of IGBT according to claim 1, characterized in that: The 180-degree rotating shaft assembly includes a motor body, a reducer body, a reducer mounting base, a pillar, a rotating shaft base, a gas joint 1, a gas joint 2, a wiring terminal 1, a terminal mounting plate, a bushing, a test head base mounting base, a tension spring fixing bolt, a wiring terminal 2, a rotating shaft support seat, a zeroing detection plate, a sensor body, a sensor mounting plate, a rotating shaft limiting column, a rotating shaft limiting block, a rotating shaft body and a coupling. The bottom of the motor body is mounted to the reducer body, and the output shaft at the bottom of the reducer body passes through the reducer mounting base and is mounted to the rotating shaft body through the coupling. The reducer mounting base, The rotating shaft substrates are connected by a number of pillars. A zero detection plate, a sensor mounting plate, a shaft limit column and a shaft limit block are respectively installed above the rotating shaft substrate. The sensor body is mounted on the sensor mounting plate. Air joint 1 and air joint 2 are respectively installed below the rotating shaft substrate. The bottom of the shaft body passes through the rotating shaft substrate and is installed on the shaft support seat. The bottom of the shaft support seat is installed on the terminal mounting plate. Terminal 1 and terminal 2 are respectively installed on the terminal mounting plate. A test head base mounting substrate is installed below the terminal mounting plate. A bushing and a tension spring fixing bolt are installed on the surface of the test head base mounting substrate.

3. The test arm for dynamic and static testing of IGBT according to claim 1, characterized in that: The test pressure providing component includes a screw support, a screw nut mounting plate, a buffer limit column, a cylinder mounting base plate, a pressure transmission column, a guide shaft fixing seat, a guide shaft, a linear bearing, a zeroing detection sheet, a screw body, a motor mounting base, a sensor body one, a sensor body two, a belt tensioning plate, a pulley one, a protective cover, a pulley two, and a belt body. The bottom of the pressure transmission column is installed on the cylinder mounting base plate, and the middle part of the pressure transmission column is sequentially sleeved on the guide shaft fixing seat and the screw nut mounting plate from bottom to top. The guide shaft fixing seat and the screw nut mounting plate are connected through a guide shaft. A buffer limit column is also installed on the guide shaft fixing seat, and a zeroing detection sheet is also installed on one side above the screw nut mounting plate. The top of the pressure transmission column passes through the screw nut mounting plate and is installed on the screw body. The top of the screw body passes through the motor mounting base and the screw support in turn and is installed on the pulley two. The pulley two and the pulley one are connected through the belt body transmission. A protective cover is provided above the pulley one, and the belt tensioning plate is installed below the pulley one. The sensor body one and the sensor body two are installed at the bottom of the belt tensioning plate.

4. The test arm for dynamic and static testing of IGBT according to claim 1, characterized in that: The test arm base assembly includes a bracket, a cooling fan, a motor enable button, a test pressure providing assembly mounting substrate, an oblique brace, a degree drive shaft mounting substrate, a chip grabbing pressure providing mounting substrate, an IO board assembly, a control valve assembly, a vacuum providing assembly, a control board, a proportional valve assembly, and a code reader. The cooling fan, the code reader, the control board and another cooling fan are installed in the middle of the bracket from left to right, and the proportional valve assembly is installed below the control board. The two sides above the bracket are respectively mounted to the chip grabbing pressure providing mounting substrate through an oblique brace. The test pressure providing assembly mounting substrate, the IO board assembly and another test pressure providing assembly mounting substrate are installed in the middle of the upper part of the bracket from left to right, and the control valve assembly is installed on the front side of the IO board assembly.

5. The test arm for dynamic and static testing of IGBT according to claim 1, characterized in that: The pressure cylinder includes a cylinder rod, a guide ring, a cylinder barrel, a C-shaped sealing ring, a sealing ring, a gas joint, a cylinder seat, and a cylinder head. One side of the cylinder seat is connected to the gas joint, and one end of the cylinder seat is installed to the cylinder barrel through a sealing ring. The cylinder rod is installed in the cylinder barrel, and the cylinder head is installed on the top of the cylinder barrel. The guide ring and the C-shaped sealing ring are sequentially sleeved on the outside of the cylinder rod.

6. The test arm for dynamic and static testing of IGBT according to claim 1, characterized in that: The test head base assembly includes a pressure transmission column, a guide plate mounting plate, a guide column, a guide seat, a heat insulation plate 1, a clamp body, a test head base adjustment substrate, a heat insulation plate 2, a temperature switch, a temperature switch fixing bolt, a temperature sensor 1, a heating rod, a heat conduction plate, a clamp adapter plate 1, a clamp adapter plate 2, a clamp cylinder heat insulation cover, a clamp cylinder, a support for a tension spring, a clamp cylinder sensor, and a tension spring body. A temperature sensor 1 and a heating rod are respectively installed on one side of the heat conduction plate. A temperature switch is also installed on the surface of the heat conduction plate through the temperature switch fixing bolt. A heat insulation plate 2 is installed above the heat conduction plate. The heat insulation plate Two clamping jaw adapter plates 1 are installed above the second clamping jaw adapter plate, the two clamping jaw adapter plates 1 are connected through the clamping jaw adapter plate 2, the clamping jaw body is installed on the inner side of the clamping jaw adapter plate 1, the test head base adjustment substrate is installed inside the clamping jaw adapter plate 1, the heat insulation plate 1 is installed above the test head base adjustment substrate, the guide column is installed above the heat insulation plate 1, one side of the guide column is connected with the guide seat, the guide seat is installed to the clamping jaw adapter plate 2 through the guide plate mounting plate, one side of the guide plate mounting plate is also used to install the tension spring body through a tension spring with a support, the clamping jaw cylinder heat insulation cover is installed on the outer side of the clamping jaw adapter plate 2, and the clamping jaw cylinder sensor is installed above the clamping jaw cylinder heat insulation cover.

7. The test arm for dynamic and static testing of IGBT according to claim 1, characterized in that: The IGBT suction assembly includes a suction head substrate, a sealing ring, a temperature sensor fixing bolt, a second temperature sensor, a sealing ring, a suction head mounting seat, a suction head body and an IGBT body. The lower part of the IGBT body is sequentially installed to the suction head substrate through the suction head body, the suction head mounting seat and the sealing ring. The second temperature sensor is installed at the bottom of the suction head substrate through the temperature sensor fixing bolt and the sealing ring.

8. The test arm for dynamic and static testing of IGBT according to claim 1, characterized in that: The test pressure providing assembly and the chip grabbing pressure providing assembly have the same structure, but have different lead screws for providing different downward pressures.

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