Component current test method and device, electronic equipment and storage medium

Abstract

The invention relates to the technical field of servers, in particular to a component current test method and device, electronic equipment and a storage medium, and is used for improving the current test accuracy of components on a server mainboard. The method comprises the following steps: for a to-be-tested server mainboard, when a non-welded component is tested, obtaining a corresponding relation between mainboard resistance and temperature of the server mainboard according to a first temperature and a first voltage drop corresponding to the server mainboard under different preset currents; testing a second temperature of the server mainboard under the target current and a second voltage drop corresponding to the component when the welding component is tested; wherein the server mainboard and the component are connected in parallel; according to the corresponding relation, the mainboard resistance of the server mainboard at the second temperature is determined, and the target current and the second voltage drop are combined to determine the current passing through the component.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a component current testing method, device, electronic device and storage medium. Background Art

[0002] Some components on the server motherboard, such as the power busbar, are key components for connecting and distributing power, directly affecting the power efficiency and stability of the server system. With the advancement of technology, the power busbar technology on the server motherboard has undergone significant development and improvement. In modern servers, the power output end and the load end on the motherboard are usually connected by copper plating, and the busbar is generally arranged in the circuit as a supplementary current path.

[0003] In the related art, the method for testing the current passing through the busbar is generally to remove the busbar from the mainboard, reconnect the busbar to the mainboard using a load line, and then measure the current value in the path using a clamp ammeter.

[0004] However, this operation will change the original current path and the impedance value in the circuit. Since the impedance of the busbar is very low, the process of disassembling and reconnecting may significantly increase the overall impedance, destroying the original current distribution, resulting in the current value obtained from the test being inconsistent with the current actually carried by the busbar in the original circuit. The measurement result deviates from the actual situation and cannot reflect the real current flow.

[0005] In summary, how to improve the accuracy of current testing of components on server motherboards is an urgent problem to be solved. Summary of the invention

[0006] The embodiments of the present application provide a component current testing method, device, electronic device and storage medium, which are used to improve the current testing accuracy of components on a server mainboard.

[0007] An embodiment of the present application provides a component current testing method, comprising:

[0008] For a server mainboard to be tested, when testing unsoldered target components, the first temperature and first voltage drop corresponding to the server mainboard under different preset currents; and, according to each preset current and each measured first temperature and first voltage drop, obtaining a corresponding relationship between the mainboard resistance and the temperature of the server mainboard; the first voltage drop represents the difference in voltage between the two ends of the server mainboard;

[0009] When testing the welding target component, the second temperature of the server mainboard under the target current, and the second voltage drop corresponding to the target component; wherein the server mainboard and the target component are connected in parallel; the second voltage drop represents the difference in voltage between the two ends of the target component;

[0010] According to the corresponding relationship, the mainboard resistance of the server mainboard at the second temperature is determined, and the current passing through the target component is determined in combination with the target current and the second voltage drop.

[0011] Through the component current testing method of the present application, only the target component needs to be considered whether it is welded, and the original current path is not changed. It is tested without destroying the layout, and the test process only measures basic parameters such as temperature and voltage. No additional hardware is required, and no additional hardware equipment needs to be customized. No additional development costs will be incurred. Only general instruments can be used for measurement, which improves the convenience and accuracy of the test. In addition, the component current testing method of the present application uses the basic Ohm's law and the resistor parallel calculation formula to simply and reliably calculate the current size of the target component, thereby improving the current test accuracy of the target component on the server motherboard.

[0012] Optionally, when the target components are not welded to the server mainboard, the input end of the server mainboard is connected to a DC power supply, and the output end of the server mainboard is connected to an electronic load;

[0013] The first temperature and the first voltage drop of the server mainboard under different preset currents are tested by adjusting the loading state of the electronic load; wherein the different preset currents are the loading current values ​​displayed by the electronic load under different loading states, and the first temperature is measured after the temperature rise is stabilized.

[0014] Through the above process, since the resistance of the server motherboard changes with temperature, in order to accurately evaluate the electrical performance of the motherboard, especially the performance at different operating temperatures, it is necessary to know the resistance of the motherboard under various temperature conditions. Therefore, by measuring the temperature change of the motherboard under different preset currents, the resistance value of the motherboard at different temperatures can be understood, which can help predict the thermal characteristics of the motherboard in actual work and provide a basis for calculating the resistance of the target components.

[0015] Optionally, obtaining a mainboard resistance of the server mainboard at a corresponding first temperature according to each of the preset currents and the first voltage drop measured under the preset current;

[0016] A fitting curve of the variation of the mainboard resistance with temperature is obtained according to the first temperatures and the mainboard resistances; wherein the fitting curve is used to describe the corresponding relationship between the mainboard resistance and the temperature of the server mainboard.

[0017] Through the above process, by measuring the temperature and voltage drop changes of the server mainboard under different preset currents when the target components are not welded, the mainboard resistance of the server mainboard can be calculated. On this basis, it can provide a basis for the subsequent calculation of the resistance of the target components when welding the target components.

[0018] Optionally, the server mainboard and the target component are connected in parallel; wherein the input end of the server mainboard is connected to a DC power supply, and the output end of the server mainboard is connected to an electronic load;

[0019] By adjusting the loading state of the electronic load, the second temperature of the server mainboard under the target current and the second voltage drop corresponding to the target component are tested; wherein the target current is the loading current value displayed by the electronic load under the target loading state, and the second temperature is measured after the temperature rise is stabilized.

[0020] In the above process, by connecting the server mainboard and the target components in parallel and adjusting the load state of the electronic load, the second temperature of the server mainboard under the target current and the second voltage drop corresponding to the target components can be measured, thereby realizing an effective test of the circuit performance when welding the target components. On the basis of the copper connection between the power output end and the load end of the server mainboard, the target components are arranged as a supplementary current path, and the test can be performed without destroying the original layout, ensuring the accuracy of the test and the simplicity of operation.

[0021] Optionally, according to the corresponding relationship, determining a mainboard resistance of the server mainboard at the second temperature;

[0022] Determining a parallel resistance between the server mainboard and the target component according to the target current and the second voltage drop;

[0023] Determining the target component resistance corresponding to the target component according to the mainboard resistance and the parallel resistance;

[0024] A current passing through the target component is determined according to the second voltage drop and the resistance of the target component.

[0025] Through the above process, firstly, the calculation process is simple. By using the basic Ohm's law and the resistor parallel calculation formula, the current flow of the target component can be simply and reliably calculated. Secondly, no additional hardware is required. This method does not require the customization of additional hardware equipment, so no additional development costs will be incurred. Only general instruments can be used for measurement, which greatly improves the convenience of testing. Finally, it is highly usable and versatile. This method avoids the need for customized equipment and is suitable for a variety of test environments and conditions, thereby ensuring wide applicability and effectiveness.

[0026] Optionally, the target component is a Busbar.

[0027] By using the busbar as the target component for the test current, the current passing through the busbar on the server motherboard can be measured.

[0028] An embodiment of the present application provides a component current testing device, comprising:

[0029] A first measuring unit is used for testing, for a server mainboard to be tested, a first temperature and a first voltage drop corresponding to the server mainboard under different preset currents when target components are not welded; and obtaining a corresponding relationship between the mainboard resistance and the temperature of the server mainboard according to each preset current and each measured first temperature and first voltage drop; the first voltage drop represents a voltage difference between two ends of the server mainboard;

[0030] a second measuring unit, for testing a second temperature of the server mainboard under a target current and a second voltage drop corresponding to the target component when welding the target component; wherein the server mainboard and the target component are connected in parallel; the second voltage drop represents a voltage difference between two ends of the target component; and the first temperature and the second temperature are measured under the same environmental conditions;

[0031] The processing unit is used to determine the mainboard resistance of the server mainboard at the second temperature according to the corresponding relationship, and determine the current passing through the target component in combination with the target current and the second voltage drop.

[0032] Optionally, the first measuring unit is specifically used for:

[0033] When the target components are not welded to the server mainboard, connecting the input end of the server mainboard to a DC power supply, and connecting the output end of the server mainboard to an electronic load;

[0034] The first temperature and the first voltage drop of the server mainboard under different preset currents are tested by adjusting the loading state of the electronic load; wherein the different preset currents are the loading current values ​​displayed by the electronic load under different loading states, and the first temperature is measured after the temperature rise is stabilized.

[0035] Optionally, the first measuring unit is specifically used for:

[0036] Obtaining a mainboard resistance of the server mainboard at a corresponding first temperature according to each of the preset currents and the first voltage drop measured under the preset current;

[0037] A fitting curve of the variation of the mainboard resistance with temperature is obtained according to the first temperatures and the mainboard resistances; wherein the fitting curve is used to describe the corresponding relationship between the mainboard resistance and the temperature of the server mainboard.

[0038] Optionally, the second measuring unit is specifically used for:

[0039] Connecting the server mainboard and the target components in parallel; wherein the input end of the server mainboard is connected to a DC power supply, and the output end of the server mainboard is connected to an electronic load;

[0040] By adjusting the loading state of the electronic load, the second temperature of the server mainboard under the target current and the second voltage drop corresponding to the target component are tested; wherein the target current is the loading current value displayed by the electronic load under the target loading state, and the second temperature is measured after the temperature rise is stabilized.

[0041] Optionally, the processing unit is specifically used for:

[0042] Determining the mainboard resistance of the server mainboard at the second temperature according to the corresponding relationship;

[0043] Determining a parallel resistance between the server mainboard and the target component according to the target current and the second voltage drop;

[0044] Determining the target component resistance corresponding to the target component according to the mainboard resistance and the parallel resistance;

[0045] A current passing through the target component is determined according to the second voltage drop and the resistance of the target component.

[0046] Optionally, the target component is a Busbar.

[0047] The beneficial effects of this application are as follows:

[0048] The embodiment of the present application provides a component current testing method, device, electronic device and storage medium. First, the power output terminal and the load terminal on the server mainboard have been connected by copper plating. The present application takes into account the influence of temperature change on the resistance of the copper conductor and directly measures the temperature and voltage drop of the server mainboard when the target component is not welded. Since the resistance of copper increases with the increase of temperature, this phenomenon will affect the resistance of the server mainboard. By testing the temperature and voltage drop of the server mainboard under different temperature conditions, the temperature and resistance relationship of the server mainboard can be accurately obtained, thereby providing a basis for further resistance and current measurement when welding the target component.

[0049] On this basis, the target components are arranged as a supplementary current path, and the temperature and voltage drop when welding the target components are measured again. Combined with the temperature and resistance relationship of the server motherboard measured in the above process, the current size of the target components can be simply and reliably calculated using basic Ohm's law and the resistor parallel calculation formula.

[0050] In addition, it should be emphasized that in this application, only whether to weld the target components needs to be considered. The method of removing the target components, connecting the target components to the mainboard with load lines, and then testing the current value with a clamp ammeter is not used. This application is tested without destroying the layout, and the test process only measures basic parameters such as temperature and voltage. No additional hardware is required, and no additional hardware equipment needs to be customized. No additional development costs will be incurred. Only general instruments need to be used for measurement, which improves the convenience and accuracy of the test.

[0051] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the written description, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0053] Figure 1 This is a flowchart of an implementation method of a component current test method in an embodiment of the present application;

[0054] Figure 2 A circuit diagram of testing a server motherboard when a busbar is not welded provided in an embodiment of the present application;

[0055] Figure 3 A simplified circuit diagram for testing the resistance of a mainboard provided in an embodiment of the present application;

[0056] Figure 4 A schematic diagram of a fitting curve of a mainboard resistance varying with temperature provided in an embodiment of the present application;

[0057] Figure 5 A circuit diagram of testing a server motherboard when welding a busbar provided in an embodiment of the present application;

[0058] Figure 6 A simplified circuit diagram for testing the current passing through a Busbar provided in an embodiment of the present application;

[0059] Figure 7 A schematic diagram of an implementation of calculating the current passing through a Busbar provided in an embodiment of the present application;

[0060] Figure 8 A schematic diagram of the structure of a component current testing device in an embodiment of the present application;

[0061] Fig. 9 The present invention is a schematic diagram of the hardware structure of an electronic device to which an embodiment of the present application is applied. DETAILED DESCRIPTION

[0062] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the technical solution of the present application, rather than all of the embodiments. Based on the embodiments recorded in the application documents, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the technical solution of the present application.

[0063] The preferred embodiments of the present application are described below in conjunction with the drawings in the specification. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In addition, the embodiments and features in the embodiments of the present application may be combined with each other if there is no conflict.

[0064] See also Figure 1 As shown, it is an implementation flow chart of a component current testing method provided in an embodiment of the present application, comprising the following steps:

[0065] S11: For the server mainboard to be tested, when testing the unsoldered target components, the first temperature and the first voltage drop corresponding to the server mainboard under different preset currents; and, according to each preset current and each measured first temperature and first voltage drop, the corresponding relationship between the mainboard resistance and the temperature of the server mainboard is obtained; the first voltage drop represents the difference in voltage between the two ends of the server mainboard.

[0066] The server motherboard to be tested refers to the core circuit board actually used in the server system. It carries the processor, memory, storage and other key components. It is a motherboard responsible for managing and distributing power, signal transmission and various data processing tasks in the system. The target components refer to the key components that are connected in parallel with the server motherboard and affect the current distribution. They are used to adjust or enhance the performance of a specific current path.

[0067] In the embodiment of the present application, the target component may be a busbar, a current shunt, or a power element with resistance characteristics. The present application does not specifically limit the type and specific form of the target component. The following description will be made by taking the busbar as an example.

[0068] Among them, Busbar is a conductive element used for power transmission and distribution, usually in the form of strips or sheets, and is often used in high current conduction paths. Used in servers, data centers, industrial electrical equipment and other fields, Busbar is one of the key components for achieving efficient current distribution. Its design can carry large currents and maintain low impedance between multiple power connection points, helping to optimize current distribution and reduce power loss.

[0069] In the embodiment of the present application, the first temperature and the second temperature are measured under the same environmental conditions. It should be noted that the so-called "same environmental conditions" may have a certain error, that is, although the two measurements are carried out under the same environmental conditions as much as possible, the actual environmental factors are not necessarily completely consistent. Therefore, "same environmental conditions" refers to measuring under conditions where parameters such as temperature, humidity, and airflow are as similar as possible, allowing fluctuations within a certain range, and does not require that the environmental conditions are exactly the same.

[0070] For example, in the test environment, the temperature may fluctuate by 0.5°C from the set value of 25°C, the humidity may fluctuate within ±5% of the set value, and the airflow speed is maintained at a near-stationary state, but may be slightly disturbed by the tiny airflow in the laboratory. These small changes are usually within a reasonable error range and will not have a significant impact on the test results.

[0071] In addition, when setting environmental conditions, the environment should be arranged in a standard test environment with an ideal ambient temperature and no wind, eliminating the influence of ambient temperature changes and airflow, and ensuring the stability and accuracy of the data. In an optional embodiment, the ambient temperature can be set to 25°C and the humidity can be set to 50%, while ensuring no wind conditions to eliminate the influence of ambient temperature changes and airflow, thereby ensuring the stability and accuracy of the test data, and eliminating the influence of ambient temperature fluctuations and airflow on the measurement results as much as possible, thereby improving the reliability and consistency of the test data. The above environmental conditions are only simple examples. According to specific test requirements and environments, parameters such as ambient temperature, ambient humidity, wind speed, etc. can be adjusted accordingly. This application does not make specific limitations on this, and only needs to meet the requirements of test stability and accuracy.

[0072] The preset current refers to the current passing through the server motherboard, and different current values ​​can be set according to the working requirements of the server motherboard. In an optional implementation, the preset current may be set to 5A, 10A, 15A, 20A, 25A, ..., 100A to simulate the working state of the motherboard under different load conditions and evaluate its performance. The specific preset current is not specifically limited in this application.

[0073] The first temperature refers to the temperature of the server mainboard under a preset current. Since the temperature of the server mainboard will gradually increase with the continuous action of the current load after being powered on for a period of time, it is necessary to wait for the temperature to reach a stable state when measuring. In an optional implementation, the first temperature can represent the stable temperature rise temperature reached after ten minutes, which is used to reflect the temperature change of the mainboard under continuous current load conditions, ensuring that data is collected under temperature stability conditions.

[0074] The first voltage drop refers to the voltage difference between the two ends of the server mainboard, which represents the voltage drop on the server mainboard under a preset current and is used to calculate the resistance characteristics of the mainboard.

[0075] The corresponding relationship between the motherboard resistance and temperature of the server motherboard refers to the change in the resistance value of the server motherboard under different temperature conditions calculated based on the measured first temperature and first voltage drop under different preset currents. Through this relationship, the change of the motherboard resistance with temperature can be understood, and then used to predict the performance of the motherboard under different operating conditions.

[0076] Optionally, the target ambient temperature may be 25°C without wind. The specific ambient temperature may be set according to actual test requirements or temperature control requirements of the server working environment. This is just a simple example. Other temperatures may be used in actual applications, such as 26°C without wind. This document does not make specific limitations on this.

[0077] In the embodiment of the present application, in order to test the change of the resistance of the server motherboard with temperature when the target components are not soldered, the Figure 2 The circuit shown is used to test the resistance of a server motherboard.

[0078] See also Figure 2 As shown, it is a circuit diagram of testing a server motherboard when the busbar is not welded, provided by an embodiment of the present application. Figure 2As shown in the figure, when the busbar is not welded to the server motherboard, the server motherboard can be regarded as a variable resistor. Affected by temperature and current changes, its resistance value will increase with the increase of temperature. This is because the resistance of the copper conductor increases with the increase of temperature, resulting in heat accumulation in the circuit under high current conditions, thus affecting the resistance value. Therefore, the input end of the server motherboard can be connected to a DC power supply, and the output end of the server motherboard can be connected to an electronic load to test its voltage drop and temperature change under different currents.

[0079] like Figure 2 After the circuit is connected in the manner shown, the first temperature and the first voltage drop of the server mainboard under different preset currents can be tested by adjusting the load state of the electronic load.

[0080] The different preset currents are the load current values ​​displayed by the electronic load under different load conditions. The first temperature is measured after the temperature rise is stabilized. The first voltage drop is Figure 2 The difference between the voltage test point V2 and the voltage test point V1.

[0081] In the embodiment of the present application, the load refers to the load current applied to the server motherboard by the electronic load to simulate the current load of the motherboard in the actual working state. Adjusting the load state of the electronic load means changing the current value of the load so that it runs under different preset currents, thereby testing the first temperature change and the first voltage drop of the server motherboard under these different current conditions.

[0082] In an optional implementation of the present application, the voltage can be measured by an eight-and-a-half-digit high-precision digital voltmeter, and the temperature can be measured by a temperature gun. The tools for measuring voltage and temperature are just simple examples here, and other tools can also be used in actual applications. This document does not make specific limitations on this.

[0083] Through the above process, the temperature change of the motherboard can be measured under different preset currents, so as to understand the resistance of the motherboard at different temperatures.

[0084] By pulling the electronic load, obtaining different preset currents, and measuring the corresponding first temperature and first voltage drop, the resistance of the server motherboard at different temperatures can be calculated. The calculation of the motherboard resistance will be specifically introduced below.

[0085] When the busbar is not welded to the server mainboard, an optional implementation method for obtaining the resistance of the server mainboard at different temperatures is as follows:

[0086] The mainboard resistance of the server mainboard at the corresponding first temperature is obtained according to each preset current and the first voltage drop measured under the preset current.

[0087] See also Figure 3FIG. 1 is a simplified circuit diagram of a motherboard resistance test provided by an embodiment of the present application. Figure 3 The simplified circuit shown includes a DC power supply, an electronic load, and a resistor R obtained by simplifying the server motherboard. B , which is the motherboard resistor in this article.

[0088] Then, the voltage across the server motherboard is measured in the above manner to obtain the voltage difference across the server motherboard (i.e., the first voltage drop), and the motherboard resistance of the server motherboard is calculated according to Ohm's law formula in combination with the preset current value obtained by the electronic load. The specific calculation formula is as follows:

[0089]

[0090] Among them, R B Indicates the motherboard resistance of the server motherboard, V 2 Indicates the voltage at the power supply output, V 1 Indicates the load terminal voltage, V B =V 2 -V 1 It indicates that the voltage difference (ie, the first voltage drop) across the server mainboard is obtained, and I indicates a preset current value pulled by the electronic load.

[0091] In formula 1, the motherboard resistance R of the server motherboard B Equal to the first voltage drop V B (That is, the power output voltage V 2 Subtract the load voltage V 1 ) and the preset current value I.

[0092] By using the above formula 1, the resistance value of the server motherboard at different temperatures can be calculated.

[0093] In an optional embodiment, assuming that the target ambient temperature is 25° C., the preset current of the electronic load is set to multiple values ​​I 1 =5A, I 2 =10A, I 2 =15A, I 4 =20A;

[0094] Each time the electronic load is adjusted to a certain load state, the first temperatures of the server motherboard measured after the temperature rise is stabilized are: T 1＝ 35℃、T 2＝ 40℃、T 3＝ 45℃、T 4＝ 50℃;

[0095] Under the above-mentioned preset currents, the first voltage drops measured are V B1 =V21 -V 11 =12V-11.8V, V B2 =V 22 -V 12 =12V-11.5V, V B3 =V 23 -V 13 =12V-11.2V, V B4 =V 24 -V 14 =12V-10.5V, calculated: V B1 =0.2V, V B2 =0.5V, V B3 =0.8V, V B4 =1.5V.

[0096] Then, according to formula 1, the motherboard resistance R of the server motherboard under different preset current conditions can be calculated. B They are:

[0097]

[0098] According to each first temperature and each mainboard resistance, fitting can be performed by least square method or the like to obtain a fitting curve of mainboard resistance varying with temperature; wherein the fitting curve is used to describe the corresponding relationship between the mainboard resistance and temperature of the server mainboard.

[0099] In an optional embodiment, still taking the above example as an example, in different I 1 =5A, I 2 =10A, I 2 =15A, I 4 =20A preset current, the first temperatures measured are T 1 =35℃、T 2 =40℃、T 3 =45℃、T 4 =50℃; the calculated mainboard resistances are R B1 =0.04Ω, R B2 =0.05Ω, R B3 ≈0.0533Ω, R B4 =0.075Ω, the corresponding relationship between the first temperature and each mainboard resistance can be obtained, as shown in Table 1:

[0100] Table 1 Correspondence between the first temperature and each mainboard resistance

[0101]

[0102]

[0103] It should be noted that the above is just a simple example. In actual applications, these parameters under more preset currents can be measured, and then a fitting curve can be drawn through the above corresponding relationship.

[0104] See also Figure 4 As shown, it is a schematic diagram of a fitting curve of the change of the mainboard resistance with temperature provided by an embodiment of the present application. In this curve, the resistance value of the mainboard gradually increases with the increase of temperature, showing a positive correlation trend. This shows that when the temperature rises, the resistance of the mainboard will also increase. By measuring the temperature and resistance data of the server mainboard under different preset currents, the resistance value corresponding to each temperature point can be obtained, and then a fitting curve of the change of the mainboard resistance with temperature can be drawn through these data points. This fitting curve can not only intuitively reflect the relationship between temperature and resistance, but also can obtain the equation of the fitting curve through mathematical methods, which is convenient for further calculation and analysis.

[0105] The above fitting curve can be obtained to further analyze the change of the server motherboard resistance with temperature in the actual working environment. This method can effectively evaluate the performance of the server motherboard under different temperatures and current loads without soldering the target components, thereby ensuring its reliability and stability in actual applications. This process is simple, feasible and does not require additional hardware support, which helps to reduce testing costs and improve the operability of the design.

[0106] In the above process, the resistance of the server motherboard is tested when the target components are not welded. On this basis, the temperature and voltage drop when the target components are welded can be further tested to obtain the resistance and current of the target components. The specific process of welding the target components will be described in detail below.

[0107] S12: When testing the welding target components, the second temperature of the server mainboard under the target current and the second voltage drop corresponding to the target components.

[0108] The server mainboard and the target component are connected in parallel; the second voltage drop represents the voltage difference between the two ends of the target component; and the first temperature and the second temperature are measured under the same environmental conditions.

[0109] The following still takes Busbar as the target component as an example:

[0110] In the embodiment of the present application, in order to test the second temperature of the server mainboard under the target current when welding the Busbar, and the second voltage drop corresponding to the Busbar, the following circuit can be used for the Busbar.

[0111] See also Figure 5 As shown, it is a circuit diagram of testing a server mainboard when welding a busbar provided by an embodiment of the present application.

[0112] Connect the server motherboard and the Busbar in parallel; wherein the input end of the server motherboard is connected to a DC power supply, and the output end of the server motherboard is connected to an electronic load;

[0113] By adjusting the load state of the electronic load, the second temperature of the server mainboard under the target current and the second voltage drop corresponding to the busbar are tested;

[0114] The target current is the load current value displayed by the electronic load under the target load state, the second temperature is measured after the temperature rise is stabilized, and the second voltage drop refers to the voltage difference between the two ends of the Busbar when the server motherboard and the Busbar are connected in parallel.

[0115] In the embodiment of the present application, the target current is obtained by loading the electronic load, and the corresponding second temperature and second voltage drop are measured. In an optional embodiment, the target current can be set according to the actual situation, for example, it can be a reference value of a derating parameter, where the derating parameter is the rated current reduced to avoid overloading the busbar); in another optional embodiment, the target current can also reflect the typical operating current during actual operation according to the actual situation.

[0116] The target current is precisely controlled by pulling an electronic load so that the temperature and voltage drop of the server motherboard can be measured at this current. The target current can be set according to the derating parameters to ensure that the Busbar is not overloaded, and the typical operating current can be selected according to the actual operating conditions. This method can simulate the current conditions in the real working environment, thereby providing reliable data support for design and optimization, and ensuring the stability and reliability of the system.

[0117] In an optional implementation of the present application, the voltage can be measured by an eight-and-a-half-digit high-precision digital voltmeter, and the temperature can be measured by a temperature gun. This document does not specifically limit the tools for measuring voltage and temperature.

[0118] In the above process, by connecting the server motherboard and the Busbar in parallel and adjusting the load state of the electronic load, the second temperature of the server motherboard under the target current and the second voltage drop corresponding to the Busbar can be measured, thereby realizing an effective test of the circuit performance when welding the Busbar. Based on the copper connection between the power output end and the load end of the server motherboard, the Busbar is arranged as a supplementary current path, which can be tested without destroying the original layout, ensuring the accuracy of the test and the simplicity of operation.

[0119] The above introduces the circuit configuration of connecting the server motherboard and the busbar in parallel when welding the busbar. The following will introduce the calculation process when welding the busbar.

[0120] S13: Determine the mainboard resistance of the server mainboard at the second temperature according to the corresponding relationship, and determine the current passing through the target component in combination with the target current and the second voltage drop.

[0121] The corresponding relationship refers to the corresponding relationship between the mainboard resistance and temperature of the server mainboard introduced above in this application.

[0122] In an optional embodiment, it may be a fitting curve of the mainboard resistance and temperature. When the temperature is a second temperature under the target current, the mainboard resistance of the server mainboard at the second temperature may be obtained according to the fitting curve.

[0123] For example, still taking Table 1 listed above as an example, the first temperatures of the mainboard are T1=35°C, T2=40°C, T3=45°C, T4=50°C, and the corresponding mainboard resistances are RB1=0.04Ω, RB2=0.05Ω, RB3, RB4=0.075Ω. In an optional implementation, if the measured second temperature is 42°C, then according to the fitting curve, the mainboard resistance of the server mainboard at this temperature can be obtained to be approximately R B =0.055Ω; In another optional implementation, if the measured second temperature is 48°C, then according to the fitting curve, the mainboard resistance of the server mainboard at this temperature can be obtained to be approximately R B =0.070Ω.

[0124] Through the above process, the motherboard resistance of the server motherboard at the second temperature is obtained through the fitting curve of the motherboard resistance and temperature. The following will analyze the detailed process of determining the current passing through the Busbar by combining the motherboard resistance with the target current and the second voltage drop.

[0125] Still taking Busbar as the target component as an example, see Figure 6 As shown, it is a simplified circuit diagram of a test busbar current provided by an embodiment of the present application. Figure 6 The simplified circuit includes a DC power supply, an electronic load, and a server motherboard and a busbar connected in parallel. The server motherboard is simplified to a resistor R B , Busbar is simplified to a resistor R Busbar , these two resistors are connected in parallel.

[0126] Next, the current flow of the Busbar is analyzed by calculation when the DC power supply, electronic load, and server motherboard and Busbar are connected in parallel.

[0127] See also Figure 7 As shown, it is a schematic diagram of an implementation of calculating the current passing through the Busbar provided by an embodiment of the present application, and the steps are as follows S71-S74:

[0128] S71: determining the mainboard resistance of the server mainboard at the second temperature according to the corresponding relationship;

[0129] The corresponding relationship is the corresponding relationship between the first temperature and each mainboard resistance described above in this application.

[0130] In an optional embodiment, the corresponding relationship may be a fitting curve, and the mainboard resistance of the server mainboard at the second temperature may be obtained through the corresponding relationship, which may be recorded as R B '.

[0131] In an optional embodiment, for example, still taking the above-listed Table 1 as an example, the first temperatures of the mainboard are T1=35°C, T2=40°C, T3=45°C, T4=50°C, and the corresponding mainboard resistances are RB1=0.04Ω, RB2=0.05Ω, RB3, RB4=0.075Ω, respectively. Taking the obtained fitting curve as an example, if the target current is 20A and the measured second temperature is 50°C, then through the above fitting curve, it can be concluded that the mainboard resistance of the server mainboard at the second temperature is R B '=0.075Ω.

[0132] S72: Determine a parallel resistance between the server mainboard and the busbar according to the target current and the second voltage drop;

[0133] In an optional embodiment, still taking the above as an example, the target current is I A =20A, assuming that the voltage at the Busbar power input terminal is V 2 '=12V, the voltage at the output of the electronic load is V 1 '=8V, then the second voltage drop is V A =V 2 '-V 1 '=12V-11V=1V, according to Ohm's law, the parallel resistance between the server motherboard and the busbar is calculated by the following formula:

[0134]

[0135] Wherein, R is the parallel resistance between the server motherboard and the Busbar. According to Formula 2, when the target current is 20A and the second voltage drop is 1V, the calculated parallel resistance between the server motherboard and the Busbar is 0.05Ω.

[0136] In formula 2, the parallel resistance R between the server motherboard and the busbar is equal to the second voltage drop V A (That is, the voltage at the Busbar power input terminal is V 2 'Subtract the voltage at the output of the Busbar electronic load to get V1 ') and target current I A ratio.

[0137] S73: Determine the busbar resistance corresponding to the busbar according to the mainboard resistance and the parallel resistance.

[0138] In an optional embodiment, still taking the above as an example, the motherboard resistor R B '=0.075Ω, parallel resistance R=0.05Ω, then the Busbar resistance corresponding to the Busbar can be calculated according to the parallel resistance calculation formula:

[0139]

[0140] Among them, R Busbar is the Busbar resistance corresponding to the Busbar. Taking the above as an example, the R Busbar About 0.15Ω.

[0141] In formula 3, the parallel resistance R is equal to the motherboard resistance R B ' and Busbar resistor R Busbar The product of the mainboard resistance R B ' and Busbar resistor R Busbar The sum of the parallel resistance R and the mainboard resistance R is substituted into Formula 3. B 'The Busbar resistance R can be obtained Busbar The numerical value of .

[0142] S74: Determine the current passing through the busbar according to the second voltage drop and the busbar resistance.

[0143] In an optional embodiment, still taking the above as an example, the second voltage drop is V A =V 2 '-V 1 '=12V-11V=1V,R Busbar It is about 0.15Ω. According to Ohm's law, the current I passing through the Busbar can be calculated by the following formula: Busbar :

[0144]

[0145] Among them, R Busbar is the current passing through the Busbar. Still taking the above as an example, it is calculated by Formula 4 that in the above embodiment, the current passing through the Busbar is approximately 6.67A.

[0146] In formula 4, the current I passing through the busbar is BusbarEqual to the second voltage drop V corresponding to Busbar A Busbar resistor R Busbar ratio.

[0147] Through the above process, firstly, the calculation process is simple, and the current through the Busbar can be simply and reliably calculated by using the basic Ohm's law and the resistor parallel calculation formula; secondly, no additional hardware is required, and this method does not require the customization of additional hardware equipment, so no additional development costs will be incurred, and only general instruments (such as digital voltmeters, temperature measuring instruments, etc.) can be used for measurement, which greatly improves the convenience of testing; finally, it is highly usable and universal, and this method avoids the need for customized equipment (such as non-contact current guns, etc.), and is suitable for a variety of test environments and conditions, thereby ensuring wide applicability and effectiveness.

[0148] Based on the same inventive concept, the present application also provides a component current testing device. Figure 8 As shown, it is a schematic diagram of the composition structure of the component current testing device 800, which may include:

[0149] The first measuring unit 801 is used to test the first temperature and the first voltage drop corresponding to the server mainboard under different preset currents when the target components are not welded on the server mainboard to be tested; and obtain the corresponding relationship between the mainboard resistance and the temperature of the server mainboard according to each preset current and each measured first temperature and first voltage drop; the first voltage drop represents the difference between the voltages at both ends of the server mainboard;

[0150] The second measuring unit 802 is used to test the second temperature of the server mainboard under the target current and the second voltage drop corresponding to the target component when the target component is welded; wherein the server mainboard and the target component are connected in parallel; the second voltage drop represents the difference in voltage between the two ends of the target component; the first temperature and the second temperature are measured under the same environmental conditions;

[0151] The processing unit 803 is used to determine the mainboard resistance of the server mainboard at the second temperature according to the corresponding relationship, and determine the current passing through the target component in combination with the target current and the second voltage drop.

[0152] Optionally, the first measuring unit 801 is specifically configured to:

[0153] When the target components are not soldered to the server mainboard, the input end of the server mainboard is connected to a DC power supply, and the output end of the server mainboard is connected to an electronic load;

[0154] By adjusting the loading state of the electronic load, the first temperature and the first voltage drop of the server mainboard under different preset currents are tested; wherein the different preset currents are the loading current values ​​displayed by the electronic load under different loading states, and the first temperature is measured after the temperature rise is stabilized.

[0155] Optionally, the first measuring unit 801 is specifically configured to:

[0156] Obtaining a mainboard resistance of the server mainboard at a corresponding first temperature according to each preset current and a first voltage drop measured under the preset current;

[0157] According to each first temperature and each mainboard resistance, a fitting curve of mainboard resistance changing with temperature is obtained; wherein the fitting curve is used to describe the corresponding relationship between the mainboard resistance and temperature of the server mainboard.

[0158] Optionally, the second measuring unit 802 is specifically configured to:

[0159] Connect the server mainboard and the target components in parallel; wherein the input end of the server mainboard is connected to a DC power supply, and the output end of the server mainboard is connected to an electronic load;

[0160] By adjusting the loading state of the electronic load, the second temperature of the server mainboard under the target current and the second voltage drop corresponding to the target components are tested; wherein the target current is the loading current value displayed by the electronic load under the target loading state, and the second temperature is measured after the temperature rise is stabilized.

[0161] Optionally, the processing unit 803 is specifically configured to:

[0162] According to the corresponding relationship, determining the mainboard resistance of the server mainboard at the second temperature;

[0163] Determine the parallel resistance between the server mainboard and the target component according to the target current and the second voltage drop;

[0164] Determine the target component resistance corresponding to the target component according to the mainboard resistance and the parallel resistance;

[0165] The current passing through the target component is determined according to the second voltage drop and the resistance of the target component.

[0166] Optionally, the target component is a Busbar.

[0167] For the convenience of description, the above parts are divided into modules (or units) according to their functions and described separately. Of course, when implementing this application, the functions of each module (or unit) can be implemented in the same or multiple software or hardware.

[0168] In the embodiments of the present application, the term "module" or "unit" refers to a computer program or a part of a computer program with a predetermined function, and works together with other related parts to achieve a predetermined goal, and can be implemented in whole or in part by using software, hardware (such as processing circuits or memories) or a combination thereof. Similarly, a processor (or multiple processors or memories) can be used to implement one or more modules or units. In addition, each module or unit can be part of an overall module or unit that includes the function of the module or unit.

[0169] It should be noted that, although several units or subunits of the device are mentioned in the above detailed description, this division is merely exemplary and not mandatory. In fact, according to the embodiments of the present application, the features and functions of two or more units described above can be embodied in one unit. Conversely, the features and functions of one unit described above can be further divided into multiple units to be embodied.

[0170] Based on the same inventive concept as the above method embodiment, an electronic device is also provided in the embodiment of the present application. In one embodiment, the electronic device can be a server, or a terminal device such as a mobile phone, a laptop, a tablet computer, a desktop computer, etc., to perform the above component current testing method.

[0171] like Fig. 9 As shown, it is a schematic diagram of an electronic device provided in some embodiments of the present application, including a memory 901, a communication module 903 and one or more processors 902.

[0172] The memory 901 is used to store computer programs executed by the processor 902. The memory 901 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system and programs required for running the instant messaging function, etc.; the data storage area may store various instant messaging information and operation instruction sets, etc.

[0173] The memory 901 may be a volatile memory, such as a random-access memory (RAM); the memory 901 may also be a non-volatile memory, such as a read-only memory, a flash memory, a hard disk drive (HDD) or a solid-state drive (SSD); or the memory 901 may be any other medium that can be used to carry or store a desired computer program in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto. The memory 901 may be a combination of the above memories.

[0174] The processor 902 may include one or more central processing units (CPU) or a digital processing unit, etc. The processor 902 is used to implement the above-mentioned component current testing method when calling the computer program stored in the memory 901 .

[0175] The communication module 903 is used to communicate with terminal devices and other servers.

[0176] The specific connection medium between the memory 901, the communication module 903 and the processor 902 is not limited in the embodiment of the present application. Fig. 9 In the embodiment, the memory 901 and the processor 902 are connected via a bus 904. The bus 904 is connected to the processor 902 via a bus 904. Fig. 9 The connections between the other components are only for illustration and are not intended to be limiting. The bus 904 can be divided into an address bus, a data bus, a control bus, etc. For ease of description, Fig. 9 The diagram shows that only one thick line is used, but this does not mean that there is only one bus or only one type of bus.

[0177] The memory 901 stores a computer storage medium, and the computer storage medium stores computer executable instructions, and the computer executable instructions are used to implement the component current testing method of the embodiment of the present application. The processor 902 is used to execute the above-mentioned component current testing method, such as Figure 1 shown.

[0178] In addition, although the operations of the method of the present application are described in a specific order in the drawings, this does not require or imply that the operations must be performed in this specific order, or that all the operations shown must be performed to achieve the desired results. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step, and / or one step may be decomposed into multiple steps.

[0179] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain a computer-usable computer program.

[0180] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program commands. These computer program commands can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the commands executed by the processor of the computer or other programmable data processing device generate commands for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0181] These computer program commands may also be stored in a computer readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the commands stored in the computer readable memory produce an article of manufacture comprising a command device, the command device implementing the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0182] These computer program commands can also be loaded onto a computer or other programmable data processing device so that a series of operation steps are executed on the computer or other programmable device to produce a computer-implemented process, so that the commands executed on the computer or other programmable device provide the instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0183] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0184] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A component current testing method, characterized in that: The method comprises: For a server mainboard to be tested, when testing unsoldered target components, the first temperature and first voltage drop corresponding to the server mainboard under different preset currents; and, according to each preset current and each measured first temperature and first voltage drop, obtaining a corresponding relationship between the mainboard resistance and the temperature of the server mainboard; the first voltage drop represents the difference in voltage between the two ends of the server mainboard; When testing the welding target component, the second temperature of the server mainboard under the target current, and the second voltage drop corresponding to the target component; wherein the server mainboard and the target component are connected in parallel; the second voltage drop represents the difference in voltage between the two ends of the target component; the first temperature and the second temperature are measured under the same environmental conditions; According to the corresponding relationship, the mainboard resistance of the server mainboard at the second temperature is determined, and the current passing through the target component is determined in combination with the target current and the second voltage drop.

2. The method according to claim 1, characterized in that For the server mainboard to be tested, when testing the unsoldered target components, the first temperature and the first voltage drop corresponding to the server mainboard under different preset currents include: When the target components are not welded to the server mainboard, connecting the input end of the server mainboard to a DC power supply, and connecting the output end of the server mainboard to an electronic load; The first temperature and the first voltage drop of the server mainboard under different preset currents are tested by adjusting the loading state of the electronic load; wherein the different preset currents are the loading current values ​​displayed by the electronic load under different loading states, and the first temperature is measured after the temperature rise is stabilized.

3. The method according to claim 1, characterized in that The obtaining, according to each preset current and each measured first temperature and first voltage drop, a corresponding relationship between the mainboard resistance and the temperature of the mainboard of the server comprises: Obtaining the mainboard resistance of the server mainboard at the corresponding first temperature according to each of the preset currents and the first voltage drop measured under the preset current; A fitting curve of the variation of the mainboard resistance with temperature is obtained according to the first temperatures and the mainboard resistances; wherein the fitting curve is used to describe the corresponding relationship between the mainboard resistance and the temperature of the server mainboard.

4. The method according to any one of claims 1 to 3, characterized in that: When the test welding target components, the second temperature of the server mainboard under the target current, and the second voltage drop corresponding to the target components, include: Connecting the server mainboard and the target components in parallel; wherein the input end of the server mainboard is connected to a DC power supply, and the output end of the server mainboard is connected to an electronic load; By adjusting the loading state of the electronic load, the second temperature of the server mainboard under the target current and the second voltage drop corresponding to the target component are tested; wherein the target current is the loading current value displayed by the electronic load under the target loading state, and the second temperature is measured after the temperature rise is stabilized.

5. The method according to any one of claims 1 to 3, characterized in that: The determining, according to the corresponding relationship, the mainboard resistance of the server mainboard at the second temperature, and determining the current passing through the target component in combination with the target current and the second voltage drop, includes: Determining the mainboard resistance of the server mainboard at the second temperature according to the corresponding relationship; Determining a parallel resistance between the server mainboard and the target component according to the target current and the second voltage drop; Determining the target component resistance corresponding to the target component according to the mainboard resistance and the parallel resistance; A current passing through the target component is determined according to the second voltage drop and the resistance of the target component.

6. The method according to any one of claims 1 to 3, characterized in that: The target component is a Busbar.

7. A component current testing device, characterized in that: include: A first measuring unit is used for testing, for a server mainboard to be tested, a first temperature and a first voltage drop corresponding to the server mainboard under different preset currents when a target component is not soldered; And, obtaining a corresponding relationship between the mainboard resistance and the temperature of the mainboard of the server according to each preset current and each measured first temperature and first voltage drop; The first voltage drop represents the voltage difference between two ends of the server mainboard; a second measuring unit, for testing a second temperature of the server mainboard under a target current and a second voltage drop corresponding to the target component when welding the target component; wherein the server mainboard and the target component are connected in parallel; the second voltage drop represents a voltage difference between two ends of the target component; and the first temperature and the second temperature are measured under the same environmental conditions; The processing unit is used to determine the mainboard resistance of the server mainboard at the second temperature according to the corresponding relationship, and determine the current passing through the target component in combination with the target current and the second voltage drop.

8. The device according to claim 7, characterized in that The first measuring unit is used for: When the target components are not welded to the server mainboard, connecting the input end of the server mainboard to a DC power supply, and connecting the output end of the server mainboard to an electronic load; The first temperature and the first voltage drop of the server mainboard under different preset currents are tested by adjusting the loading state of the electronic load; wherein the different preset currents are the loading current values ​​displayed by the electronic load under different loading states, and the first temperature is measured after the temperature rise is stabilized.

9. An electronic device, characterized in that: It comprises a processor and a memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of any one of the methods of claims 1 to 6.

10. A computer-readable storage medium, characterized in that: It includes a computer program. When the computer program is run on an electronic device, the computer program is used to enable the electronic device to execute the steps of any method described in claims 1 to 6.

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