Photoresist coating detection device for wafer production

Abstract

The invention provides a photoresist coating detection device for wafer production, and relates to the technical field of coating detection, the photoresist coating detection device comprises suckers mounted on a plurality of follow-up pipes, an embedded groove is formed in a lifting disc, sealing blocks are coaxially and slidably mounted in the follow-up pipes, a plurality of telescopic holes are formed in the upper ends of the sealing blocks at equal intervals, and the telescopic holes are communicated with the embedded groove. A plurality of telescopic holes are formed in the sealing block, a control rod is connected in each telescopic hole in a sliding mode, top holes with the same number as the telescopic holes are formed in the upper end face of the sealing block, the top holes are communicated with the interiors of the telescopic holes, a control groove is formed in each control rod, and a parallel plate is installed on the extending part of each control rod. The multi-point adsorption type fixing structure is adopted, the wafer is stably fixed in all directions through cooperative work of the lifting disc and the follow-up pipes, the wafer fixing stability is improved through the design, and whether fixing is in place or not can be judged through negative pressure detection, so that the detection precision is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of coating detection, and more specifically, to a photoresist coating detection device for wafer production. Background Art

[0002] In the contemporary semiconductor manufacturing field, photoresist coating detection in the wafer production process is an extremely critical process link. Although the existing detection device is equipped with multiple suction cups for wafer fixation, this design should be able to provide all-round stable support. However, in actual operation, the equipment often starts detection when only one suction cup has completed fixation, and does not fully utilize the advantages of multi-point fixation. This operation method seriously violates the original design intention of the equipment and makes it impossible to give full play to the functional advantages of the multi-suction cup fixing system.

[0003] This improper operation method leads to a series of technical problems. When the wafer is fixed by only a single suction cup, the other unactivated suction cups cannot provide the necessary support force, which makes the wafer prone to uneven stress distribution and slight deformation during the inspection process. These problems directly affect the inspection accuracy of the photoresist coating. Especially when performing high-precision inspections, any slight deformation of the wafer surface may cause deviations in the inspection data, ultimately affecting product quality and production efficiency. This situation not only reduces the reliability of the inspection, but may also cause a decline in the quality control level of the entire production line. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the problems existing in the prior art, the present invention provides a photoresist coating detection device for wafer production to solve the technical problems mentioned in the background technology.

[0006] (II) Technical solution

[0007] To achieve the above object, the present invention provides the following technical solution: a photoresist coating detection device for wafer production, comprising a lifting plate and a plurality of follower tubes arranged along the axis of the lifting plate,

[0008] The adsorption mechanism comprises a suction cup installed on the plurality of follower tubes, an embedded groove is provided on the lifting plate, a sealing block is coaxially slidably installed in the follower tube, a plurality of telescopic holes are equidistantly provided on the upper end of the sealing block, a control rod is slidably connected in each of the telescopic holes, the upper end surface of the sealing block is provided with top holes having the same number as the telescopic holes, the top holes are connected in the telescopic holes, a control groove is provided on each of the control rods, a parallel plate is installed on the protruding part of each of the control rods, the parallel plates are attached to the sealing block, a round head is installed on the control rod, a limited edge is installed on the upper end surface of the sealing block, and the plurality of parallel plates can only slide within the limited edge; and

[0009] The negative pressure mechanism comprises an external pipe connected to the plurality of follower pipes, and the plurality of external pipes are respectively connected to external negative pressure equipment.

[0010] Preferably, a workbench is installed at the lower end of the lifting plate, a moving frame is installed on the workbench, a detector is installed on the protruding end of the moving frame, a cylinder is installed on the workbench, and the protruding end of the cylinder is connected to the lifting plate.

[0011] Preferably, springs are respectively installed on the plurality of parallel plates, the springs are slidably connected to the control rod, and the springs are in contact with the side walls of the sealing block. This design provides a stable elastic force for the parallel plates through the elastic action of the springs, while ensuring the flexible movement of the control rod, thereby improving the reliability and response speed of the sealing system.

[0012] Preferably, the adsorption mechanism also includes a plurality of fixed rods installed along the axis on the workbench, ventilation pipes are installed on the plurality of fixed rods, a bottom hole is opened on the lower end surface of the follower tube, the ventilation pipe is slidably connected in the bottom hole, and the ventilation pipe passes through the bottom hole and is connected to the sealing block. This design establishes a stable air path system through the cooperation of the fixed rods and the ventilation pipes, thereby ensuring the reliability and sealing of the negative pressure transmission.

[0013] Preferably, the sealing block is provided with right-angle grooves along the axis with the same number as the telescopic holes, and a central groove is provided at the center of the sealing block, one end of the central groove is connected to the plurality of telescopic holes, and the other end of the central groove is connected to the ventilation pipe. This design forms a complete air path network through the arrangement of the right-angle grooves and the central groove, thereby achieving uniform distribution and effective transmission of negative pressure.

[0014] Preferably, a plurality of connecting grooves are equidistantly provided on the side wall of the ventilation pipe, a top plate and a bottom plate are respectively installed at the upper and lower ends of the ventilation pipe, the bottom plate is connected to a plurality of the fixing rods, and when the top plate abuts against the follower pipe, the plurality of connecting grooves are respectively connected to the inner and outer sides of the follower pipe. This design realizes automatic switching and sealing of the air path through the cooperation of the connecting grooves and the top and bottom plates, thereby ensuring the reliable operation of the negative pressure system.

[0015] Preferably, an annular tube is installed between the multiple follower tubes, and the multiple follower tubes are respectively connected in the annular tube. This design connects the multiple follower tubes through the annular tube, achieves balanced distribution of negative pressure, and improves the stability and reliability of the entire system.

[0016] Preferably, the negative pressure mechanism also includes two one-way disks symmetrically installed on the inner wall of the external tube, and two one-way plates symmetrically installed are coaxially arranged inside the external tube, and two two-way rods are installed between the two one-way plates. This design achieves one-way control of the negative pressure through the cooperation of the one-way disk and the one-way plate, thereby improving the stability of the system.

[0017] Preferably, an intermediate plate is installed on the inner wall of the external pipe, two slide grooves are provided in the intermediate plate, the two-way rod is slidably connected in the two slide grooves, and a plurality of micro-flow holes are provided on the inner walls of the two slide grooves.

[0018] Preferably, the two one-way plates are respectively installed with return springs, and the two return springs are respectively connected to the two sides of the middle plate. This design ensures the automatic resetting function of the one-way plate through the elastic action of the return springs, thereby improving the reliability of the system.

[0019] (III) Beneficial effects

[0020] Compared with the prior art, the present invention provides a photoresist coating detection device for wafer production, which has the following beneficial effects:

[0021] First of all, in terms of the wafer fixing system, a multi-point adsorption fixing structure is adopted. Through the coordinated work of the lifting plate and multiple follow-up tubes, the wafer is fixed in all directions and stably. This design not only improves the stability of wafer fixation, but also can judge whether the fixation is in place through negative pressure detection, effectively avoiding the displacement and deformation of the wafer during the detection process, and ensuring the detection accuracy.

[0022] Secondly, in terms of the negative pressure control system, an innovative two-way pressure balancing mechanism is designed. Through the ingenious coordination of the external tube, one-way disc and one-way plate, precise control and automatic adjustment of negative pressure are achieved. When a slight air leak occurs in the system, the external negative pressure equipment can be replenished in time to maintain a stable negative pressure environment; and when the pressure changes drastically, the system can automatically isolate the external negative pressure source to prevent pressure fluctuations from affecting the detection effect.

[0023] Finally, in terms of safety protection, a complete safety protection mechanism is built through the coordinated work of components such as sealing blocks, control rods and springs. When the wafer is placed improperly, the system can automatically release the adsorption to avoid damage to the wafer. At the same time, the startup and release processes of the entire system are automatically controlled, greatly improving the safety and convenience of operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of a photoresist coating detection device for wafer production in the present invention;

[0025] Figure 2 It is a schematic diagram of the structure of the lifting plate and the cylinder in the present invention;

[0026] Figure 3 It is a schematic diagram of the structure of the follower tube, the suction cup and the external tube in the present invention;

[0027] Figure 4 It is a schematic cross-sectional structure diagram of the follower tube and the sealing block in the present invention;

[0028] Figure 5 It is a schematic cross-sectional structure diagram of the sealing block in the present invention;

[0029] Figure 6 is a schematic cross-sectional structural diagram of a control rod in the present invention;

[0030] Figure 7 It is a schematic cross-sectional structure diagram of the ventilation pipe in the present invention;

[0031] Figure 8 It is a schematic cross-sectional structural diagram of the external pipe in the present invention;

[0032] Fig. 9 It is a schematic diagram of the structure of the middle plate in the present invention.

[0033] In the figure: 11, lifting plate; 12, follower tube; 13, workbench; 14, mobile frame; 15, detector; 21, suction cup; 22, embedded groove; 23, sealing block; 24, telescopic hole; 25, control rod; 26, top hole; 27, control groove; 28, parallel plate; 29, round head; 31, external tube; 32, one-way plate; 33, one-way plate; 34, two-way rod; 35, middle plate; 36, slide groove; 37, micro-flow hole; 38, return spring; 210, limit edge; 211, spring; 212, fixed rod; 213, ventilation pipe; 214, bottom hole; 215, right-angle groove; 216, center groove; 217, connecting groove; 218, top plate; 219, bottom plate; 220, annular tube; 16, cylinder. DETAILED DESCRIPTION

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0036] In the present invention, unless otherwise specified, the directions used, such as "up" and "down", usually refer to the directions shown in the drawings, or to the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the drawings; "inside" and "outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directions are not used to limit the present invention.

[0037] See also Figures 1 to 9A photoresist coating detection device for wafer production includes a lifting plate 11 and a plurality of follower tubes 12 arranged along the axis of the lifting plate 11, a workbench 13 is installed at the lower end of the lifting plate 11, a moving frame 14 is installed on the workbench 13, a detector 15 is installed on the extended end of the moving frame 14, a cylinder 16 is installed on the workbench 13, and the extended end of the cylinder 16 is connected to the lifting plate 11, and the adsorption mechanism includes a suction cup 21 installed on the plurality of follower tubes 12, an embedded groove 22 is opened on the lifting plate 11, a sealing block 23 is coaxially slidably installed in the follower tube 12, and the upper end of the sealing block 23 is equidistantly opened. A plurality of telescopic holes 24 are provided, each of which is slidably connected with a control rod 25. The upper end surface of the sealing block 23 is provided with top holes 26 of the same number as the telescopic holes 24, and the top holes 26 are connected to the telescopic holes 24. A control groove 27 is provided on each control rod 25. A parallel plate 28 is installed on the extended portion of each control rod 25. The parallel plate 28 is attached to the sealing block 23. A round head 29 is installed on the control rod 25. A limited edge 210 is installed on the upper end surface of the sealing block 23. The plurality of parallel plates 28 can only slide in the limited edge 210. The plurality of parallel plates 28 are respectively provided with springs 2 11, the spring 211 is sleeved and slidably connected to the control rod 25, and the spring 211 abuts against the side wall of the sealing block 23, the adsorption mechanism also includes a plurality of fixed rods 212 installed on the workbench 13 and arranged along the axis, and a vent pipe 213 is installed on the plurality of fixed rods 212, a bottom hole 214 is opened on the lower end surface of the follower tube 12, the vent pipe 213 is slidably connected in the bottom hole 214, and the vent pipe 213 passes through the bottom hole 214 and is connected to the sealing block 23, and a right-angle groove 215 with the same number as the telescopic hole 24 is opened in the sealing block 23 along the axis, and a central position of the sealing block 23 is opened There is a central groove 216, one end of the central groove 216 is connected to multiple telescopic holes 24, and the other end of the central groove 216 is connected to the ventilation pipe 213. Multiple connecting grooves 217 are equidistantly provided on the side wall of the ventilation pipe 213. The ventilation pipe 213 is respectively provided with a top plate 218 and a bottom plate 219 at the upper and lower ends. The bottom plate 219 is connected to multiple fixing rods 212. When the top plate 218 abuts against the follower pipe 12, the multiple connecting grooves 217 are respectively connected to the inner and outer sides of the follower pipe 12. An annular pipe 220 is installed between the multiple follower pipes 12, and the multiple follower pipes 12 are respectively connected to the annular pipe 220.

[0038] When the wafer is coated and tested, the cylinder 16 is extended to the highest position, thereby driving the lifting plate 11 and the multiple follower tubes 12 to rise to the highest position synchronously. At this time, the top plate 218 is on the lower end surface of the follower tube 12, and then the corresponding wafer is placed in the embedded groove 22, and the wafer is attached to the multiple suction cups 21, and then the cylinder 16 is started to pull downward. Since the fixing rod 212 is installed on the workbench 13, the ventilation pipe 213 and the sealing block 23 are stationary, and the multiple follower tubes 12 and the lifting plate 11 move downward, and the right-angle groove 215 is attached to the side wall of the follower tube 12, so the right-angle groove 215 is in a sealed state, and the multiple round heads 29 are respectively against the workbench 13. The control groove 27 on the control rod 25 connects the top hole 26 with the telescopic hole 24, so that the space between the sealing block 23 and the suction cup 21 is connected to the outside world. As the bottom hole 214 covers the multiple connecting grooves 217, the space between the follower tube 12 and the sealing block 23 is in a sealed state. As the cylinder 16 continues to act, the follower tube 12 will continue to slide downward. At this time, since the diameter of the vent pipe 213 is much smaller than the diameter of the sealing block 23, the volume of the sealed space between the sealing block 23 and the vent pipe 213 increases, so it will be in a negative pressure state. Since the suction cup 21 is connected to the outside world through the vent pipe 213, as the sealing The space at the upper end of the sealing block 23 is reduced and the air inside will be discharged. At this time, it is in a state of normal atmospheric pressure. When the round head 29 leaves the side wall of the follower tube 12, the control rod 25 is driven to expand outward under the action of the spring 211, and then the parallel plate 28 is pressed against the limit edge 210, and the control rod 25 closes the top hole 26 and the telescopic hole 24. Therefore, the suction cup 21 is in a closed state at this time, and the space at the lower end of the sealing block 23 is in a state of maximum negative pressure. When the follower tube 12 moves downward again, the right-angle groove 215 will release the seal between the follower tube 12, and then the negative pressure will be transmitted between the suction cup 21 and the lower end surface of the wafer. At this time, if any one of the suction cups 21 and the wafer If the circle is not in a closed state, the negative pressure in the corresponding follower tube 12 will be connected to the atmospheric pressure to reach the state of atmospheric pressure, and multiple follower tubes 12 are connected to each other through the annular tube 220, and the spaces at the upper and lower ends of the follower tube 12 are connected through the right-angle groove 215. Therefore, as long as there is an unclosed suction cup 21, the suction force of the negative pressure will be lost. Only when the wafer is placed in parallel without the embedded groove 22 will the suction cup 21 and the wafer be not sealed. Therefore, the adsorption will be released at this time to avoid damage to the wafer, and then it will be reinstalled for adsorption and fixation, and then detected by the detector 15. Only then can the safe and effective detection of the wafer be guaranteed.

[0039] When the inspection is completed, the follower tube 12 is pushed upward by the cylinder 16, and then the round head 29 contacts the side wall of the follower tube 12 to release the seal. At this time, the suction cup 21 and the sealing block 23 are connected to the atmosphere again, so the wafer after the inspection can be taken out and the next inspection process can be carried out.

[0040] See also Figures 7 to 9 The negative pressure mechanism includes an external tube 31 connected to multiple follower tubes 12, and the multiple external tubes 31 are respectively connected to external negative pressure equipment. The negative pressure mechanism also includes two one-way disks 32 symmetrically installed on the inner wall of the external tube 31, and two one-way plates 33 are coaxially arranged in the external tube 31, and two two-way rods 34 are installed between the two one-way plates 33. An intermediate plate 35 is installed on the inner wall of the external tube 31, and two slide grooves 36 are provided in the intermediate plate 35. The two-way rod 34 is slidably connected in the two slide grooves 36. A plurality of micro-flow holes 37 are provided on the inner walls of the two slide grooves 36. Return springs 38 are respectively installed on the two one-way plates 33, and the two return springs 38 are respectively connected to both sides of the intermediate plate 35.

[0041] Since one end of the multiple external tubes 31 is connected to the external negative pressure mechanism, and the other end of the external tube 31 is connected to the follower tube 12, the negative pressure value provided by the external device is the same as the negative pressure value generated after the sealing block 23 connects the follower tube 12 up and down. Since the negative pressure values ​​on both sides are the same, the one-way plates 33 on both sides will be returned to the positive position under the action of the return spring 38, so that the one-way plates 33 on both sides and the one-way disk 32 are connected. At this time, even if there is a leak between the suction cup 21 and the wafer, the negative pressure value can continue to be provided according to the external negative pressure device, thereby ensuring the stability of use. When the cylinder 16 moves up and down, the speed is very fast, so the pressure changes The pressure of the follower tube 12 will also be very fast. At this time, the multiple micro-flow holes 37 cannot flow a lot of gas in a short time. Therefore, the pressure change will be promptly reflected on the one-way plates 33 on both sides. When the pressure of the follower tube 12 is high, the one-way plate 33 and the one-way disk 32 on one side of the follower tube 12 are in a sealed state. When the pressure of the follower tube 12 is low, the one-way plate 33 and the one-way disk 32 on the other side are in a sealed state. Therefore, when the pressure of the follower tube 12 changes drastically, the external negative pressure equipment will be closed in time and will not have any impact. Only when the wafer and the suction cup 21 have a slight leakage, the external negative pressure equipment will take effect, thereby ensuring the detection effect.

[0042] In all the schemes mentioned above, the connection between two parts can be selected according to actual conditions by welding, bolt and nut matching connection, bolt or screw connection or other well-known connection methods, which will not be described one by one here. In the above, all fixed connections are preferably welded. Although the embodiments of the present invention have been shown and described, it can be understood by ordinary technicians in this field that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the attached claims and their equivalents.

Claims

1. A photoresist coating detection device for wafer production, comprising a lifting plate (11) and a plurality of follower tubes (12) arranged along the axis of the lifting plate (11), The adsorption mechanism is characterized by: The invention comprises a suction cup (21) mounted on a plurality of the following tubes (12); an inner groove (22) is provided on the lifting plate (11); a sealing block (23) is coaxially slidably installed in the following tube (12); a plurality of telescopic holes (24) are equidistantly provided on the upper end of the sealing block (23); a control rod (25) is slidably connected in each of the telescopic holes (24); a top hole (26) is provided on the upper end surface of the sealing block (23) and the same number of the telescopic holes (24); (26) is connected to the telescopic hole (24), each of the control rods (25) is provided with a control groove (27), the extended portion of each of the control rods (25) is provided with a parallel plate (28), the parallel plate (28) is fitted on the sealing block (23), a round head (29) is provided on the control rod (25), a limiting edge (210) is provided on the upper end surface of the sealing block (23), and the plurality of parallel plates (28) can only slide within the limiting edge (210); and The negative pressure mechanism comprises an external pipe (31) connected to the plurality of follower pipes (12); the plurality of external pipes (31) are respectively connected to external negative pressure equipment.

2. The photoresist coating detection device for wafer production according to claim 1, characterized in that: A workbench (13) is installed at the lower end of the lifting plate (11), a moving frame (14) is installed on the workbench (13), a detector (15) is installed on the protruding end of the moving frame (14), a cylinder (16) is installed on the workbench (13), and the protruding end of the cylinder (16) is connected to the lifting plate (11).

3. The photoresist coating detection device for wafer production according to claim 1, characterized in that: A spring (211) is respectively installed on the plurality of parallel plates (28), the spring (211) is sleeved and slidably connected to the control rod (25), and the spring (211) abuts against the side wall of the sealing block (23).

4. The photoresist coating detection device for wafer production according to claim 1, characterized in that: The adsorption mechanism also includes a plurality of fixed rods (212) installed on the workbench (13) and arranged along the axis, and a ventilation pipe (213) is installed on the plurality of fixed rods (212). A bottom hole (214) is opened on the lower end surface of the follower tube (12), and the ventilation pipe (213) is slidably connected in the bottom hole (214). The ventilation pipe (213) passes through the bottom hole (214) and is connected to the sealing block (23).

5. The photoresist coating detection device for wafer production according to claim 4, characterized in that: The sealing block (23) is provided with right-angle grooves (215) along the axis, the same number as the telescopic holes (24), and a central groove (216) is provided at the center of the sealing block (23), one end of the central groove (216) is connected to the plurality of telescopic holes (24), and the other end of the central groove (216) is connected to the ventilation pipe (213).

6. The photoresist coating detection device for wafer production according to claim 5, characterized in that: A plurality of connecting grooves (217) are equidistantly provided on the side wall of the ventilation pipe (213); a top plate (218) and a bottom plate (219) are respectively installed at the upper and lower ends of the ventilation pipe (213); the bottom plate (219) is connected to a plurality of the fixing rods (212); when the top plate (218) contacts the inside of the follower pipe (12), the plurality of connecting grooves (217) are respectively connected to the inside and outside of the follower pipe (12).

7. The photoresist coating detection device for wafer production according to claim 6, characterized in that: An annular tube (220) is installed between the plurality of follower tubes (12), and the plurality of follower tubes (12) are respectively connected to the annular tube (220).

8. The photoresist coating detection device for wafer production according to claim 1, characterized in that: The negative pressure mechanism also includes two one-way discs (32) symmetrically mounted on the inner wall of the external pipe (31), and two one-way plates (33) symmetrically mounted coaxially are arranged inside the external pipe (31), and two two-way rods (34) are mounted between the two one-way plates (33).

9. The photoresist coating detection device for wafer production according to claim 8, characterized in that: An intermediate plate (35) is installed on the inner wall of the external pipe (31), two slide grooves (36) are provided in the intermediate plate (35), a bidirectional rod (34) is slidably connected in the two slide grooves (36), and a plurality of micro-flow holes (37) are provided on the inner walls of the two slide grooves (36).

10. The photoresist coating detection device for wafer production according to claim 9, characterized in that: The two one-way plates (33) are respectively provided with return springs (38), and the two return springs (38) are respectively connected to the two sides of the middle plate (35).

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