Plasma secondary batch groove machining special machine control method and system

Abstract

The invention relates to a plasma secondary batch groove machining special machine control method which comprises the steps that a pneumatic baffle is aligned with the end face of a cut plate, and the pneumatic baffle is pushed to the cutting starting position; the groove cutting angle is adjusted according to an angle ruler of the cutting gun, and the cutting height and the cutting groove root are adjusted based on the plasma cutting parameter table; adjusting the position and the angle of the cutting gun through a laser ray based on the cutting groove root leaving; automatically calling the cutting speed according to the type and the thickness of the cut plate; and in the cutting process, the equipment state of the plasma secondary batch groove machining special machine is monitored in real time, and the cutting speed, the groove cutting angle and the cutting height are adjusted in real time. According to the technical scheme, the cutting precision and efficiency are improved, automatic monitoring and adjustment are achieved, the cutting quality is ensured, the operation risk is reduced, and the overall performance and production efficiency of the plasma secondary batch groove machining special machine are improved.

Description

Technical Field

[0001] The present application relates to the field of industrial plasma cutting technology, and in particular to a control method and system for a plasma secondary batch groove processing machine. Background Art

[0002] In the existing plasma cutting technology, it is difficult to balance cutting accuracy and processing efficiency when performing beveling of steel plates in batches. In traditional methods, parameters such as cutting height, bevel angle and cutting speed are often set manually. However, in actual operation, due to the different types and thicknesses of plates, problems such as uneven cutting speed, bevel angle deviation and improper control of cutting seam root retention are prone to occur during the cutting process, resulting in low processing accuracy. In addition, the existing technology usually lacks real-time monitoring and adjustment mechanisms. If the equipment status changes or the quality of the plate fluctuates during the cutting process, it is impossible to effectively feedback and adaptively adjust the cutting parameters, resulting in an uneven cutting section and even affecting the consistency and quality of the bevel. These shortcomings not only reduce the processing accuracy, but also affect the production efficiency and the service life of the equipment. Summary of the invention

[0003] The purpose of this application is to provide a control method and system for a plasma secondary batch beveling processing machine, which automatically controls the cutting process of the plasma secondary batch beveling processing machine, optimizes cutting parameters, improves cutting accuracy and efficiency, thereby reducing manual intervention and ensuring cutting quality and equipment safety.

[0004] In a first aspect, the present application provides a plasma secondary batch groove processing machine control method, the method comprising:

[0005] Aligning the end face of the cut plate with the pneumatic baffle and pushing the pneumatic baffle to the cutting start position;

[0006] Adjust the bevel cutting angle according to the angle scale of the cutting gun, and adjust the cutting height and cutting bevel root according to the plasma cutting parameter table;

[0007] Based on the cutting groove root retention, the position and angle of the cutting gun are adjusted by a laser line;

[0008] Automatically call the cutting speed according to the type and thickness of the cutting plate;

[0009] During the cutting process, the equipment status of the plasma secondary batch groove processing machine is monitored in real time, and the cutting speed, the groove cutting angle and the cutting height are adjusted in real time.

[0010] Optionally, adjusting the position and angle of the cutting gun by laser line based on the cutting groove root retention specifically includes:

[0011] Based on the cutting groove root, projecting the laser line onto the surface of the cutting material and aligning it with the target cutting groove;

[0012] Observing the position of the laser line on the cutting plate to determine the deviation between the cutting groove of the cutting gun and the target cutting groove;

[0013] The lateral position, longitudinal height and cutting angle of the cutting gun are adjusted according to the deviation so that the cutting point is consistent with the position of the laser line.

[0014] Optionally, the method further comprises pre-setting an optimal cutting speed value according to the material and thickness of different cutting plates.

[0015] Optionally, during the cutting process, real-time monitoring of the equipment status of the plasma secondary batch groove processing machine and real-time adjustment of the cutting speed, the groove cutting angle and the cutting height specifically include:

[0016] Collect various working data in real time through the internal sensors of the equipment, and feed back the various working data to the equipment status display interface;

[0017] According to the cutting bevel angle, the type and thickness of the cutting plate, the optimal cutting speed is calculated according to the preset values ​​in the plasma cutting parameter table, and automatically adjusted to the appropriate speed range;

[0018] The angle sensor detects the current angle of the cutting gun and automatically controls the angle according to the preset angle value;

[0019] The height sensor measures the distance between the cutting gun and the cutting plate in real time and automatically maintains the optimal cutting height.

[0020] Optionally, the method further comprises:

[0021] Record the state, speed, angle and height adjustment during the cutting process;

[0022] After cutting is completed, the device automatically resets and performs self-test.

[0023] Optionally, the method further comprises performing basic settings on system parameters when the equipment is installed and debugged for the first time.

[0024] Optionally, the system parameters include offset distance, arc feedback time, speed ratio, pulse accuracy, offset speed, device status, acceleration rate, deceleration rate and arc starting delay.

[0025] Optionally, the method further comprises resetting the offset distance when the laser spot is replaced.

[0026] Optionally, when the arc feedback is set to 0, the device automatically runs after the arc starting delay time expires until a stop command is received;

[0027] When the arc feedback is set to non-zero and the device detects arc current feedback after the arc starting delay time is reached, the device automatically starts cutting;

[0028] When the arc feedback is set to non-zero and no feedback signal is received within the set arc starting delay, the device will stop automatically.

[0029] In a second aspect, the present application provides a control system using the plasma secondary batch groove processing machine control method as described above, characterized in that the system comprises:

[0030] Pneumatic stopper module, used to align the cut sheet to the cutting start position;

[0031] An angle adjustment module, including an angle ruler of the cutting gun, for automatically adjusting the angle of the cutting gun according to the set bevel cutting angle;

[0032] Parameter control module, including plasma cutting parameter table, used to automatically call cutting speed, cutting height and groove root retention based on the type and thickness of the cutting plate;

[0033] Real-time monitoring module, including multiple sensors, used to collect equipment status data during the cutting process and monitor parameters such as cutting speed, groove angle and cutting height in real time;

[0034] An automatic adjustment module is connected to the real-time monitoring module, and adjusts the cutting speed, groove angle and cutting height in real time according to the feedback information of the equipment status data;

[0035] Laser positioning module, used to quickly align the cutting groove root based on the laser line and adjust the position and angle of the cutting gun;

[0036] The control center module is connected with the pneumatic baffle module, the angle adjustment module, the parameter control module, the real-time monitoring module, the automatic adjustment module and the laser positioning module, and is used to coordinate the operation of each module to ensure cutting accuracy and processing stability.

[0037] Compared with the prior art, this application has the following beneficial effects:

[0038] According to the technical solution of the present application, the end face of the cutting plate is precisely positioned by the pneumatic baffle, and the position and angle of the cutting gun are adjusted in combination with the laser line, thereby realizing precise control of the cutting angle, speed and height. This method uses laser assistance and automatic call of cutting parameters to make the cutting process intelligent, which not only improves the processing accuracy and efficiency, but also significantly reduces human operation errors, and realizes the consistency and stability of batch groove processing.

[0039] Furthermore, in this application, the laser line assists the precise adjustment of the cutting gun position, preset optimal speed, intelligent control based on real-time sensors, and equipment status recording and self-checking functions to ensure the consistency and safety of processing and improve the cutting quality of different materials and thicknesses. In addition, through the optimization configuration of system parameters such as offset distance and arc feedback, especially the automatic correction when changing the laser point or in different plate environments, the reliability and controllability of the entire cutting process are guaranteed, adapting to the needs of various cutting processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A schematic flow chart of a plasma secondary batch groove processing machine control method according to an embodiment of the present application is shown;

[0041] Figure 2 Shows Figure 1 A schematic flow chart of a method for adjusting the position and angle of a cutting gun by a laser line based on cutting a groove and leaving a root in step S300;

[0042] Figure 3 A structural block diagram of a control system based on a plasma secondary batch groove processing machine control method according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0043] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0044] The terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0045] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0046] Figure 1 FIG. 1 is a schematic flow chart of a plasma secondary batch groove processing machine control method according to an embodiment of the present application. Figure 1 As shown, the steps of the plasma secondary batch groove processing special machine control method include:

[0047] Step S100, aligning the end surface of the cut plate with the pneumatic baffle and pushing the pneumatic baffle to the cutting start position.

[0048] First, the cutting plate is precisely positioned by the pneumatic baffle to ensure that the plate is in the specified position and the end faces are aligned before cutting. The cutting baffle will be pushed to the starting point of the cutting to ensure that the cutting starts at the predetermined position to prevent deviation. Positioning the end face of the plate by the pneumatic baffle can reduce human error and ensure that the starting point of the cutting is accurate. The positioning accuracy of this link improves the control of the material during the entire cutting process, thereby ensuring the accuracy of the cutting path and avoiding time waste due to offset cutting or repeated alignment.

[0049] Step S200, adjusting the bevel cutting angle according to the angle ruler of the cutting gun, and adjusting the cutting height and the bevel cutting root based on the plasma cutting parameter table.

[0050] First, adjust the angle of the cutting gun according to the angle ruler to meet the specific angle requirements of bevel cutting. Then, make detailed settings according to the plasma cutting parameter table, including the adjustment of the cutting gun height and the bevel root, so that the cutting accuracy and bevel quality meet the process requirements. Through precise adjustment based on the parameter table, the cutting angle and height can directly match different workpiece specifications and bevel requirements, reducing the trial and error process and improving the cutting quality and consistency. At the same time, setting the bevel root helps to enhance the stability of the workpiece, especially in the case of welding requirements, providing better conditions for subsequent processes.

[0051] Step S300, based on cutting the groove and leaving the root, adjust the position and angle of the cutting gun through the laser line.

[0052] The laser system first projects a laser line onto the surface of the cutting material, aligning it with the target cutting groove. The operator can determine the deviation between the actual cutting groove of the cutting gun and the target by observing the position of the laser line. Subsequently, the system automatically or manually adjusts the lateral position, longitudinal height and cutting angle of the cutting gun according to the detected deviation, so that the cutting point is consistent with the laser line, thereby achieving precise cutting. This step S300 significantly improves the cutting accuracy through laser-assisted positioning, reduces material waste and subsequent processing requirements. At the same time, the visualization of the laser line enables the operator to make intuitive adjustments, reduce the risk of human error and improve work efficiency. In addition, this method has good adaptability and is suitable for cutting needs of different materials and thicknesses, ensuring cutting consistency and shortening equipment commissioning time, thereby improving overall production efficiency.

[0053] Step S400, automatically calling the cutting speed according to the type and thickness of the cutting plate.

[0054] The system reads the material and thickness information of the plate, and calls the optimal cutting speed from the preset parameter database. The cutting speed is set according to the material characteristics and thickness, which can ensure the stability and efficiency of the cutting process. Automatically matching the cutting speed according to the characteristics of the plate can avoid cutting defects caused by too slow or too fast. Automatic speed call reduces the error of manual judgment and realizes the optimal cutting parameters for different materials, thereby improving the cutting speed while ensuring the smoothness and accuracy of the cutting surface.

[0055] Step S500, during the cutting process, real-time monitoring of the equipment status of the plasma secondary batch groove processing machine, and real-time adjustment of the cutting speed, groove cutting angle and cutting height.

[0056] The device's built-in sensors collect device operation data in real time. In some embodiments, the device operation data includes cutting speed, bevel cutting angle, height, device temperature, arc feedback, etc. The system makes appropriate fine adjustments based on data changes to ensure the continuity and consistency of cutting. At the same time, if an abnormality or deviation is detected, the system can make adjustments or alarms in a timely manner.

[0057] The real-time monitoring and adjustment function significantly improves the accuracy of the cutting process. Dynamic adjustment of cutting speed, angle and height can adapt to slight changes in the material and maintain cutting stability, thereby reducing the error rate and preventing cutting deviations caused by fluctuations in equipment status, effectively extending the service life of the equipment and improving processing accuracy.

[0058] According to the embodiment of the present application, the pneumatic baffle is used to accurately position the end face of the cutting plate, and the position and angle of the cutting gun are adjusted in combination with the laser line, thereby realizing precise control of the cutting angle, speed and height. This method uses laser assistance and automatic call of cutting parameters to make the cutting process intelligent, which not only improves the processing accuracy and efficiency, but also significantly reduces human operation errors, and realizes the consistency and stability of batch groove processing.

[0059] Figure 2 Shows Figure 1 A schematic flow chart of a method for adjusting the position and angle of a cutting gun by a laser line based on cutting a groove and leaving a root in step S300. Figure 2 As shown, step S300 specifically includes the following steps:

[0060] Step S310, based on the cutting groove root, project the laser line onto the surface of the cutting material and align it with the target cutting groove.

[0061] The laser system accurately projects the laser line onto the surface of the cutting material according to the preset cutting groove root. The laser line is designed to align with the target cutting groove, which is usually achieved by adjusting the angle and position of the laser projection. This process requires real-time monitoring of the laser equipment to ensure the precise positioning of the laser line in the cutting area. This step S310 can provide a visual reference before cutting through laser alignment to ensure the alignment accuracy of the cutting gun and the target cutting groove. This method not only reduces material waste due to cutting errors, but also provides a reliable foundation for the subsequent cutting process, improving the overall cutting efficiency and cutting quality.

[0062] Step S320, observing the position of the laser line on the cut plate to determine the deviation between the cutting groove of the cutting gun and the target cutting groove.

[0063] The operator or an automated system observes the position of the laser line projected onto the cut sheet and compares it to the target cut groove. Visually or with a sensor, the system measures the actual deviation between the laser line and the target cut groove. This process requires full use of the clarity and contrast of the laser line to accurately determine the size and direction of the deviation. By determining the deviation between the cutting gun and the target cut groove, the operator can quickly identify possible problems in the cutting process. Accurate measurement and feedback at this stage can significantly improve cutting accuracy, avoid errors in subsequent processes, reduce material costs and production time, and improve product consistency and repeatability.

[0064] Step S330, adjusting the lateral position, longitudinal height and cutting angle of the cutting gun according to the deviation so that the cutting point is consistent with the position of the laser line.

[0065] According to the deviation measured in step S320, the system or operator will adjust the lateral position, longitudinal height and cutting angle of the cutting gun. The adjustment can be done manually or automatically through the control system to ensure that the position and angle of the cutting gun are consistent with the position of the laser line and the cutting point is accurate. The effective adjustment of step S330 enables the cutting gun to be accurately positioned at the optimal cutting position, thereby ensuring the efficiency and accuracy of the cutting process. By eliminating deviations, the cutting gun can achieve consistent cutting quality during the cutting process, reducing the need for subsequent processing, while optimizing the production process, improving production efficiency and the quality of the final product.

[0066] In some embodiments, the plasma secondary batch groove processing machine control method also includes pre-setting the optimal cutting speed value according to the material and thickness of different cutting plates.

[0067] In this step, the control system will query the pre-set cutting parameter database according to the material type and thickness of the different cutting plates. The database contains the characteristics and optimal cutting speed values ​​of various materials (such as steel, aluminum, copper, etc.). The system will analyze the input cutting plate information and automatically call the corresponding optimal cutting speed. Before the equipment is started, the system will perform a self-check to ensure that the parameter settings are correct and store the cutting speed value for subsequent cutting.

[0068] Presetting the optimal cutting speed value can significantly improve cutting efficiency and cutting quality. The appropriate cutting speed can reduce the heat generated during the cutting process, reduce the risk of material deformation and burning, and thus improve the smoothness and neatness of the cut edge. In addition, the appropriate cutting speed can also help extend the service life of the cutting equipment, reduce maintenance costs, and improve overall production efficiency. This measure not only improves the stability and consistency of production, but also helps to meet the cutting requirements of different materials and thicknesses, providing customers with higher quality products.

[0069] In some embodiments, the method of real-time monitoring the equipment status of the plasma secondary batch groove processing machine during the cutting process in step S500 and adjusting the cutting speed, groove cutting angle and cutting height in real time includes the following specific steps:

[0070] Step S510, various working data are collected in real time through the internal sensors of the device, and the various working data are fed back to the device status display interface.

[0071] Sensors inside the equipment continuously monitor various operating parameters, such as current, voltage, temperature, cutting speed, cutting height, and cutting gun angle. The collected operating data is transmitted to the equipment status display interface through the internal communication system for the operator to view in real time. Through real-time operating data feedback, the operator can promptly understand the operating status of the equipment, quickly identify potential problems and take necessary measures to reduce the risk of failure and ensure the stability and safety of the cutting process.

[0072] Step S520, according to the cutting groove angle, the type and thickness of the cutting plate, the optimal cutting speed is calculated according to the preset values ​​of the plasma cutting parameter table, and automatically adjusted to an appropriate speed range.

[0073] The control system consults the optimal cutting speed preset in the plasma cutting parameter table according to the cutting groove angle, the material type and thickness of the cutting plate. The system will calculate the optimal cutting speed under the current conditions in real time and automatically adjust it to the appropriate speed range. This step S520 ensures the rationality of the speed during the cutting process, improves the cutting efficiency and cutting quality, and adopts a suitable cutting speed to reduce the heat generated during the cutting process, reduce the deformation and burning risks of the material, thereby improving the cutting effect and the quality of the final product.

[0074] Step S530, detecting the current angle of the cutting gun through an angle sensor, and automatically controlling the angle according to a preset angle value.

[0075] The system detects the actual angle of the cutting gun in real time through the angle sensor and compares it with the preset angle value. If a deviation is found, the control system will automatically adjust the angle of the cutting gun to ensure that the cutting gun always maintains the optimal cutting angle. This step S530 can improve the cutting accuracy and reduce the errors generated during the cutting process by keeping the cutting gun at the optimal angle, thereby improving the neatness and smoothness of the groove. This precise control also helps to ensure the consistency of cutting quality and meet different cutting requirements.

[0076] Step S540, using a height sensor to measure the distance between the cutting gun and the cutting plate in real time, and automatically maintaining the optimal cutting height.

[0077] Through the height sensor, the system measures the distance between the cutting gun and the cutting plate in real time and adjusts it according to the preset optimal cutting height. If the height deviation exceeds the set range, the system automatically adjusts the position of the cutting gun. Maintaining the optimal cutting height can ensure the cutting quality and avoid problems such as uneven cutting or overheating caused by improper height. In addition, automatic adjustment of the cutting height reduces the burden on the operator and improves the stability and safety of the cutting process.

[0078] In some embodiments, the plasma secondary batch groove processing machine control method further includes the following steps:

[0079] Step S600, recording the adjustment of the state, speed, angle and height during the cutting process.

[0080] During the cutting process, the system monitors and records various key parameters in real time, including cutting status, cutting speed, cutting gun angle and cutting height. These data will be stored in the equipment's control system for subsequent analysis and reference. Recording key parameters in the cutting process can provide an important basis for subsequent quality control and process improvement. Operators can identify potential problems by analyzing these data, such as fluctuations in cutting quality and degradation of equipment performance, and take measures to optimize them. In addition, these records also help achieve traceability of the production process and improve the scientific nature of equipment maintenance.

[0081] Step S700: After the cutting is completed, the device automatically resets and performs self-check.

[0082] After the cut is completed, the equipment automatically performs a reset procedure to restore the cutting gun and related components to their initial state. After this process, the system performs a self-check to check whether the various functions of the equipment are normal, including whether the electrical system, mechanical components, sensors, etc. are functioning properly. The automatic reset function can reduce operator intervention and improve work efficiency and safety. In addition, the self-check process ensures that the equipment is in good working condition after each cut, reducing the risk of failure and downtime. Through regular self-checking, the reliability and stability of the equipment can be improved, thereby ensuring production efficiency and product quality.

[0083] In some embodiments, the plasma secondary batch groove processing machine control method also includes basic settings of system parameters during the initial installation and commissioning of the equipment.

[0084] During the initial installation of the equipment, ensure that all mechanical parts, sensors and electrical systems are connected according to specifications, and check the installation position and function of each component. Through the equipment control interface, the operator enters or adjusts the relevant system parameters according to the equipment's technical manual and cutting process requirements.

[0085] In some embodiments, the system parameters include offset distance, arc feedback time, speed ratio, pulse accuracy, offset speed, device status, acceleration rate, deceleration rate and arc start delay.

[0086] The offset distance is used to set the distance from the laser point to the center point of the plasma cutting gun nozzle to ensure the accurate positioning of the cutting gun during the processing. The arc feedback is used to judge the arc feedback function during the cutting process and control the time for the plasma arc to start and stabilize. The speed ratio is used to fine-tune the speed during the cutting operation, affecting the ratio setting of the cutting speed and quality. The pulse accuracy is used to adjust the accuracy of the running speed to ensure the current stability during the plasma cutting process. The offset speed is used to match the offset distance. When the laser is offset, it will move at this speed. The speed is usually set at 500mm / min-1000mm / min. The device status displays the status of the device, including alarm information such as communication abnormality, running, standby, and arc waiting timeout. The acceleration is mainly used for the acceleration speed during the start of the operation. The deceleration is mainly used for the deceleration speed during the stop of the operation. The above-mentioned offset speed, acceleration and deceleration acceleration: ensure the smoothness of the movement during the cutting process. The arc delay is used for the perforation delay after the plasma starts the generator. After the arc delay time is reached, the cutting starts to adjust the time of arc ignition before cutting to ensure the accuracy and stability of the cutting.

[0087] Basic settings can optimize the operation of the equipment according to different materials, thicknesses and cutting requirements, ensuring that each cut meets the expected quality standards. By accurately setting system parameters, the equipment can better cope with various working conditions during operation, reduce the occurrence of failures, and improve the stability of operation. Reasonable system parameters can reduce the risks in equipment operation, reduce accidents during cutting, and ensure the safety of operators. At the same time, through the initial basic settings, the debugging time of the equipment can be effectively shortened, the waste of resources during trial cutting can be reduced, and the operating costs of the enterprise can be reduced.

[0088] In some embodiments, the above speed ratio is used to increase or decrease the speed by the cutting speed reduction and cutting speed increase on the device. Each time the operator presses the cutting speed reduction or cutting speed increase button, the speed is adjusted once according to the above ratio, and continuous adjustment is made if the button is pressed continuously. For example, when the speed ratio is set to 10%, if the original cutting speed is 1000mm / min, the speed becomes 1000-1000*10%=900mm / min by pressing the cutting speed reduction button once, that is, the device will start running at 900mm / min. It should be emphasized that the adjusted speed will overwrite the original speed. The next time the same plate and the same thickness are called again, cutting will start at the adjusted speed.

[0089] In some embodiments, the offset distance is reset when the laser spot is changed.

[0090] During the cutting process, the system detects that the laser point needs to be replaced, which may be due to changes in the shape of the workpiece, material, or cutting requirements. The operator or the automated system will recalculate the offset distance based on the position of the new laser point. The offset distance refers to the relative distance between the laser point and the cutting position of the cutting gun to ensure accurate cutting. The recalculated offset distance is entered into the device control system, which can be done manually or automatically through the graphical interface. The system automatically calibrates the position of the cutting gun based on the new offset distance to ensure that the working point of the cutting gun is aligned with the laser point. After completing the offset setting, perform a small-scale test cut to verify the effectiveness of the new laser point and offset distance settings to ensure that the cutting quality meets the requirements.

[0091] Resetting the offset distance ensures accurate alignment of the laser point with the cutting gun, thereby improving the accuracy and quality of the cutting and avoiding poor cutting due to deviation. When processing workpieces of different materials or shapes, flexible adjustment of the offset distance enables the equipment to adapt to a variety of processing needs and improve production flexibility and efficiency. By timely adjusting the offset distance, the possibility of scrap and rework caused by improper cutting is reduced, thereby saving material costs and time. In addition, when the system can automatically identify laser point changes and prompt to reset the offset distance, it can reduce the operator's manual intervention and improve the convenience and comfort of operation. In large-scale production, quickly adapting to laser point changes and adjusting the offset distance can speed up the overall production rhythm, improve equipment utilization, and ensure on-time delivery of products.

[0092] In some embodiments, when the arc feedback is set to 0, the device automatically runs after the arc starting delay time expires until a stop command is received; when the arc feedback is set to non-0 and the device detects arc current feedback after the arc starting delay time expires, the device automatically starts cutting; when the arc feedback is set to non-0 and no feedback signal is received within the set arc starting delay, the device will automatically stop.

[0093] When the arc feedback parameter set by the system is 0, the device will automatically start running after the arc delay ends and continue cutting until a stop command is received. This is mainly used for cutting grid plates, or cutting plates with gaps between plates. The stop button must be pressed manually after the cutting is completed. When the arc feedback parameter is set to a non-zero value, the device will wait for arc current feedback to be detected after the arc delay ends, and automatically start cutting after confirming the cutting preparation state. If arc current feedback is not detected within the set arc delay, the device will automatically stop to prevent abnormalities or failures during the cutting process. This is mainly used for cutting continuous plates, and the arc will automatically stop after the cutting is completed.

[0094] The automatic stop function can effectively prevent the equipment from operating without a cutting arc when no arc current feedback is received, reducing potential safety hazards. When the arc feedback is set to non-0, by waiting for valid arc current feedback, it can ensure that the cutting equipment operates under optimal conditions, thereby improving cutting quality and consistency. The design of automatic cutting when the arc feedback is 0 can achieve fast startup, reduce manual intervention, improve overall production efficiency, and meet the needs of high-frequency production. The automated control system enables the operator to focus more on monitoring the cutting process without having to frequently check the equipment status, improving the convenience of operation. By timely detecting and responding to the arc current status, equipment loss caused by poor cutting conditions can be avoided, thereby extending the service life of the equipment and reducing maintenance costs.

[0095] According to the above embodiments, the present application ensures the consistency and safety of processing and improves the cutting quality of different materials and thicknesses through precise adjustment of the laser line-assisted cutting gun position, preset optimal speed, intelligent control based on real-time sensors, and equipment status recording and self-checking functions. In addition, through the optimization configuration of system parameters such as offset distance and arc feedback, especially automatic correction when changing laser points or in different plate environments, the reliability and controllability of the entire cutting process are guaranteed, and the needs of various cutting processes are met.

[0096] The present application also provides a control system based on a plasma secondary batch groove processing machine control method. Figure 3 As shown, the control system based on the plasma secondary batch groove processing machine control method includes a pneumatic baffle module 101, an angle adjustment module 102, a parameter control module 103, a real-time monitoring module 104, an automatic adjustment module 105, a laser positioning module 106 and a control center module 107.

[0097] A pneumatic baffle module 101 is used to align the cut plate to the cutting start position;

[0098] An angle adjustment module 102, including an angle ruler of the cutting gun, for automatically adjusting the angle of the cutting gun according to the set bevel cutting angle;

[0099] The parameter control module 103 includes a plasma cutting parameter table for automatically calling the cutting speed, cutting height and groove root retention based on the type and thickness of the cutting plate;

[0100] A real-time monitoring module 104, including a plurality of sensors, is used to collect equipment status data during the cutting process and monitor parameters such as cutting speed, groove angle and cutting height in real time;

[0101] The automatic adjustment module 105 is connected to the real-time monitoring module 104 and adjusts the cutting speed, groove angle and cutting height in real time according to the feedback information of the equipment status data;

[0102] Laser positioning module 106, used to quickly align the cutting groove root based on the laser line and adjust the position and angle of the cutting gun;

[0103] The control center module 107 is connected to the pneumatic baffle module 101, the angle adjustment module 102, the parameter control module 103, the real-time monitoring module 104, the automatic adjustment module 105 and the laser positioning module 106, and is used to coordinate the operation of each module to ensure cutting accuracy and processing stability.

[0104] In the control system of the plasma secondary batch groove processing machine control method, the specific implementation method of adjusting parameters such as cutting speed, groove angle and cutting height refers to the relevant content of the embodiment of the above method, which will not be repeated here.

[0105] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0106] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A plasma secondary batch groove processing machine control method, characterized in that: The method comprises: Aligning the end face of the cut plate with the pneumatic baffle and pushing the pneumatic baffle to the cutting start position; Adjust the bevel cutting angle according to the angle scale of the cutting gun, and adjust the cutting height and cutting bevel root according to the plasma cutting parameter table; Based on the cutting groove root retention, the position and angle of the cutting gun are adjusted by a laser line; Automatically call the cutting speed according to the type and thickness of the cutting plate; During the cutting process, the equipment status of the plasma secondary batch groove processing machine is monitored in real time, and the cutting speed, the groove cutting angle and the cutting height are adjusted in real time.

2. The plasma secondary batch groove processing machine control method according to claim 1 is characterized in that: The adjusting the position and angle of the cutting gun by laser line based on the cutting groove root retention specifically includes: Based on the cutting groove root, projecting the laser line onto the surface of the cutting material and aligning it with the target cutting groove; Observing the position of the laser line on the cutting plate to determine the deviation between the cutting groove of the cutting gun and the target cutting groove; The lateral position, longitudinal height and cutting angle of the cutting gun are adjusted according to the deviation so that the cutting point is consistent with the position of the laser line.

3. The plasma secondary batch groove processing machine control method according to claim 1 is characterized in that: The method further comprises presetting an optimal cutting speed value according to the material and thickness of different cutting plates.

4. The plasma secondary batch groove processing machine control method according to claim 1 is characterized in that: During the cutting process, real-time monitoring of the equipment status of the plasma secondary batch groove processing machine and real-time adjustment of the cutting speed, the groove cutting angle and the cutting height specifically include: Collect various working data in real time through the internal sensors of the equipment, and feed back the various working data to the equipment status display interface; According to the cutting bevel angle, the type and thickness of the cutting plate, the optimal cutting speed is calculated according to the preset values ​​in the plasma cutting parameter table, and automatically adjusted to the appropriate speed range; The angle sensor detects the current angle of the cutting gun and automatically controls the angle according to the preset angle value; The height sensor measures the distance between the cutting gun and the cutting plate in real time and automatically maintains the optimal cutting height.

5. The plasma secondary batch groove processing machine control method according to claim 4 is characterized in that: The method further comprises: Record the state, speed, angle and height adjustment during the cutting process; After cutting is completed, the device automatically resets and performs self-test.

6. The plasma secondary batch groove processing machine control method according to claim 1, characterized in that: The method also includes performing basic settings on system parameters when the equipment is first installed and debugged.

7. The plasma secondary batch groove processing machine control method according to claim 6 is characterized in that: The system parameters include offset distance, arc feedback time, speed ratio, pulse accuracy, offset speed, device status, acceleration rate, deceleration rate and arc starting delay.

8. The plasma secondary batch groove processing machine control method according to claim 7 is characterized in that: The method further includes resetting the offset distance when the laser spot is replaced.

9. The plasma secondary batch groove processing machine control method according to claim 7, characterized in that: When the arc feedback is set to 0, the device automatically runs after the arc starting delay time expires until a stop command is received; When the arc feedback is set to non-zero and the device detects arc current feedback after the arc starting delay time is reached, the device automatically starts cutting; When the arc feedback is set to non-zero and no feedback signal is received within the set arc starting delay, the device will stop automatically.

10. A control system using the plasma secondary batch groove processing machine control method as described in claims 1-9, characterized in that: The system comprises: Pneumatic stopper module, used to align the cut sheet to the cutting start position; An angle adjustment module, including an angle ruler of the cutting gun, for automatically adjusting the angle of the cutting gun according to the set bevel cutting angle; Parameter control module, including plasma cutting parameter table, used to automatically call cutting speed, cutting height and groove root retention based on the type and thickness of the cutting plate; Real-time monitoring module, including multiple sensors, used to collect equipment status data during the cutting process and monitor parameters such as cutting speed, groove angle and cutting height in real time; An automatic adjustment module is connected to the real-time monitoring module, and adjusts the cutting speed, groove angle and cutting height in real time according to the feedback information of the equipment status data; Laser positioning module, used to quickly align the cutting groove root based on the laser line and adjust the position and angle of the cutting gun; The control center module is connected with the pneumatic baffle module, the angle adjustment module, the parameter control module, the real-time monitoring module, the automatic adjustment module and the laser positioning module, and is used to coordinate the operation of each module to ensure cutting accuracy and processing stability.

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