Laminated display method and device for measurement data, medium and product

Abstract

The invention discloses a lamination display method and equipment for measurement data, a medium and a product, and relates to the technical field of semiconductor integrated circuits. The laminated display method of the measurement data comprises the following steps: acquiring various measurement data of a wafer; constructing a reference coordinate system of the wafer; converting each measurement data into a reference coordinate system to obtain a plurality of reference measurement data; drawing a data layer corresponding to each kind of reference measurement data in the reference coordinate system; and superposing the data layers to obtain a measurement lamination image corresponding to the wafer. According to the lamination display method of the measurement data, the operation steps of analysis and attribution of the yield loss can be simplified, automatic and comprehensive analysis of the yield loss reason of the wafer according to the lamination image is facilitated, and thus the accuracy of yield loss analysis can be improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor integrated circuit technology, and in particular relates to a stacked display method, device, medium and product for measurement data. Background Art

[0002] In integrated circuit manufacturing, wafers must be scanned multiple times to generate a large amount of measurement data. By analyzing this measurement data, timely judgment, evaluation, and optimization of each manufacturing process can be made, which can help continuously improve the yield rate of integrated circuit production.

[0003] In existing methods, specific measurement tools are used to visualize various specific types of measurement data.

[0004] However, existing technologies for analyzing, attributing, and tracing yield loss are fragmented and cumbersome, and cannot perform automatic and comprehensive analysis, and accuracy is difficult to guarantee. Summary of the Invention

[0005] An object of the embodiments of the present application is to provide a method, device, medium, and product for stacked display of measurement data, so as to realize stacked display of multiple measurement data.

[0006] A further purpose of the embodiments of the present application is to improve the accuracy of yield loss analysis.

[0007] In one aspect of an embodiment of the present application, a method for displaying stacked measurement data is provided, comprising:

[0008] Obtain various measurement data of wafers;

[0009] Constructing a reference coordinate system for the wafer;

[0010] Convert each measurement data into a reference coordinate system to obtain a variety of reference measurement data;

[0011] Draw the data layer corresponding to each benchmark measurement data in the benchmark coordinate system;

[0012] The data layers are superimposed to obtain the measurement stack image corresponding to the wafer.

[0013] In one aspect of an embodiment of the present application, a stacked display device for measurement data is provided, comprising:

[0014] Data acquisition module, used to obtain various measurement data of wafers;

[0015] Constructing the wafer's reference coordinate system;

[0016] A data conversion module is used to convert each measurement data into a reference coordinate system to obtain a variety of reference measurement data;

[0017] A layer drawing module is used to draw the data layer corresponding to each reference measurement data in the reference coordinate system;

[0018] The layer overlay module is used to overlay each data layer to obtain the measurement stacked image corresponding to the wafer.

[0019] In one aspect of an embodiment of the present application, an electronic device is provided, which includes: a memory and a program or instruction stored in the memory and executable on a processor, wherein when the program or instruction is executed by the processor, a method for stacked display of measurement data as provided in any one aspect of the above-mentioned embodiment of the present application is implemented.

[0020] In one aspect of an embodiment of the present application, a readable storage medium is provided, on which a program or instruction is stored. When the program or instruction is executed by a processor, a method for stacking display of measurement data as provided in any aspect of the above-mentioned embodiment of the present application is implemented.

[0021] In one aspect of an embodiment of the present application, a computer program product is provided. When instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes the method for stacking display of measurement data provided by any aspect of the above-mentioned embodiment of the present application.

[0022] In the stacked display method of measurement data provided in the embodiment of the present application, a reference coordinate system is first constructed. Then, each measurement data is converted into the reference coordinate system respectively to obtain the reference measurement data corresponding to various performance tests. And the data layers corresponding to each reference measurement data are superimposed to obtain the measurement stacked image corresponding to the wafer. In this way, the embodiment of the present application pre-sets a reference coordinate system and uniformly converts the various measurement data of the wafer into the reference measurement data in the reference coordinate system, so as to construct the corresponding stacked image. Through the stacked image, multiple types of measurement data can be directly superimposed and visually displayed, thereby simplifying the analysis and attribution steps of yield loss, and facilitating the automatic and comprehensive analysis of the reasons for the yield loss of the wafer based on the stacked image, thereby improving the accuracy of the yield loss analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 1 is a flow chart of a method for displaying stacked layers of measurement data provided by one embodiment of the present application;

[0025] Figure 2 is a schematic diagram of measuring a stacked image provided by one embodiment of the present application;

[0026] Figure 3 is a schematic diagram of a reference coordinate system provided by an embodiment of the present application;

[0027] Figure 4 is a schematic diagram of a deviation angle provided by an embodiment of the present application;

[0028] Figure 5 This is a schematic structural diagram of a stacked display device for measurement data provided by one embodiment of the present application;

[0029] Figure 6 It is a structural diagram of a stacked display device for measuring data provided by one embodiment of the present application. DETAILED DESCRIPTION

[0030] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0031] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0032] It should be noted that the acquisition, storage, use, and processing of data in the technical solution of this application comply with the relevant provisions of national laws and regulations.

[0033] It should be noted that in the embodiments of the present application, certain software, components, models and other existing solutions in the industry may be mentioned. They should be regarded as exemplary. Their purpose is only to illustrate the feasibility of implementing the technical solution of the present application, but it does not mean that the applicant has or will necessarily use the solution.

[0034] Existing methods use specific measurement tools to visualize various types of measurement data. However, the analysis, attribution, and traceability of yield loss using existing technologies are fragmented and cumbersome, and automated and comprehensive analysis is impossible, with limited accuracy.

[0035] The purpose of the present application is to provide a method, device, medium and product for the stacked display of measurement data. In the stacked display method of measurement data provided in the embodiment of the present application, a reference coordinate system is first constructed. Then, each measurement data is converted into the reference coordinate system respectively to obtain the reference measurement data corresponding to various performance tests. And the data layers corresponding to each reference measurement data are superimposed to obtain the measurement stacked image corresponding to the wafer. In this way, the embodiment of the present application pre-sets a reference coordinate system and uniformly converts the various measurement data of the wafer into the reference measurement data in the reference coordinate system, so as to construct the corresponding stacked image. Through the stacked image, multiple types of measurement data can be directly superimposed and visually displayed, thereby simplifying the analysis and attribution steps of yield loss, and facilitating the automatic and comprehensive analysis of the reasons for the yield loss of the wafer based on the stacked image, thereby improving the accuracy of the yield loss analysis.

[0036] The following describes specific embodiments of the stacked display method, device, medium, and product for measuring data provided by the embodiments of the present application.

[0037] Figure 1 A flowchart of a method for displaying stacked measurement data is provided. The method for displaying stacked measurement data can be applied to a server. The method for displaying stacked measurement data can include the following steps S101 to S105.

[0038] S101, obtaining various measurement data of the wafer.

[0039] In this embodiment, each type of measurement data corresponds to a performance test. The performance test is used to detect the performance parameters of each chip unit in the production process corresponding to the wafer, and the measurement data is used to represent the results of the performance test.

[0040] The wafer production process includes multiple production links, and performance testing is carried out in each production link to obtain corresponding measurement data.

[0041] As an example, the server performs performance testing through the measurement and detection tools corresponding to each production link of the wafer, thereby obtaining the measurement data corresponding to each production link.

[0042] S102, constructing a reference coordinate system for the wafer.

[0043] In this embodiment, each measurement data will carry corresponding first layout information, which includes key parameters such as wafer size, feature point position, adjacent chip unit spacing, chip unit origin position and wafer center position. The first layout information can be obtained through the corresponding measurement and detection tools in the production link.

[0044] As an example, after obtaining each measurement data, the server randomly selects one piece of first layout information from the first layout information corresponding to each measurement data as the second layout information.

[0045] Then, a plane rectangular coordinate system is constructed with the second layout information as a reference, the wafer center position in the second layout information as the origin, and the feature point position in the second layout information as the negative direction of the vertical axis to obtain a reference coordinate system of the wafer.

[0046] The characteristic point position is used to characterize the position of a point with a significant feature on the wafer. For example, the characteristic point position may be a notch position of the wafer.

[0047] S103, converting each measurement data into a reference coordinate system to obtain a plurality of reference measurement data.

[0048] In this embodiment, the reference measurement data is used to represent the corresponding data after the measurement data is converted into the reference coordinate system.

[0049] As an example, the server converts the measurement data from various performance tests obtained into a constructed reference coordinate system based on their corresponding positions on the wafer. This allows all measurement data to be represented using a unified reference, facilitating subsequent analysis and comparison.

[0050] S104: Draw a data layer corresponding to each type of reference measurement data in the reference coordinate system.

[0051] In this embodiment, the server draws corresponding data layers in the reference coordinate system according to the converted reference measurement data. Each data layer represents different reference measurement data with a different color or pattern.

[0052] S105 , overlaying the data layers to obtain a measurement stacked image corresponding to the wafer.

[0053] In this embodiment, the server overlays the mapped data layers to form a measurement stack image containing all the measurement data from the performance tests. This image can intuitively display the performance distribution of each chip unit on the wafer, as well as the correlation and differences between different measurement data.

[0054] For example, the upper data layer in a measurement stacked image may obscure the lower data layers. To achieve the best display effect, you can adjust the upper and lower layer relationships, colors, and transparency of each data layer as needed.

[0055] As another example, the measurement data includes defect (Defect) data, process control point (CP) data, ink (Ink) data, dimensional measurement (Met) data, evaluation parameter (WAT) data and zone (Zone) data. In the corresponding measurement stack image, the Defect data can be displayed as a square dot matrix, and the display of pictures corresponding to the Defect data can be supported to more intuitively understand the defect situation. The CP data is displayed as a color block of the chip unit, where the color, brightness or pattern of the color block can change according to the specific value of the CP data. The Ink data is displayed as a black block to indicate the coverage of the ink. The Met data is displayed as a circular dot matrix, and the specific dimensional measurement value is marked next to the circular dot matrix so that the user can accurately understand the dimensional measurement results. The WAT data is displayed as a semi-transparent box diagram, and the Zone data is displayed as a boundary line.

[0056] like Figure 2 , a schematic diagram of a measurement stack image is provided. Reference numeral 201 shows the display result of Met data in the measurement stack image. Reference numeral 202 shows the display result of Defect data in the measurement stack image, and reference numeral 204 shows the image corresponding to the Defect data. Reference numeral 203 shows the display result of Zone data in the measurement stack image, reference numeral 205 shows the display result of Ink data in the measurement stack image, reference numeral 206 shows the display result of WAT data in the measurement stack image, and reference numeral 207 shows the display result of CP data in the measurement stack image.

[0057] In the stacked display method of measurement data provided by this embodiment, a reference coordinate system is first constructed. Then, each measurement data is converted into the reference coordinate system respectively to obtain the reference measurement data corresponding to various performance tests. And the data layers corresponding to each reference measurement data are superimposed to obtain the measurement stacked image corresponding to the wafer. In this way, the embodiment of the present application pre-sets a reference coordinate system and uniformly converts various measurement data of the wafer into reference measurement data in the reference coordinate system, so as to construct the corresponding stacked image. Through the stacked image, multiple types of measurement data can be directly superimposed and visually displayed, thereby simplifying the analysis and attribution steps of yield loss, and facilitating automatic and comprehensive analysis of the reasons for the yield loss of the wafer based on the stacked image, thereby improving the accuracy of the yield loss analysis.

[0058] As an optional embodiment, S102 may specifically include:

[0059] Determining whether the first layout information corresponding to each measurement data is complete, and obtaining at least one candidate measurement data carrying the complete first layout information;

[0060] Selecting second layout information from the first layout information corresponding to each candidate measurement data;

[0061] A plane rectangular coordinate system is constructed with the wafer center position in the second layout information as the origin and the feature point position in the second layout information as the negative direction of the vertical axis to obtain a reference coordinate system of the wafer.

[0062] In this embodiment, the candidate measurement data is used to represent measurement data with complete first layout information. For example, measurement data with complete key parameters such as wafer size, feature point locations, adjacent chip unit spacing, chip unit origin location, and wafer center location is the candidate measurement data.

[0063] As an example, after obtaining each measurement data, the server checks whether each measurement data carries complete first layout information. If certain measurement data is missing some key information, it is considered incomplete data and excluded from subsequent processing.

[0064] Then, the best candidate measurement data is screened out from the remaining candidate measurement data according to a preset selection criterion (such as measurement accuracy or data integrity), and the first layout information corresponding to the best candidate measurement data is determined as the second layout information.

[0065] Then, the center of the coordinate system is determined using the wafer center position from the selected second layout information as the origin. The vertical axis of the coordinate system is determined using the groove position from the second layout information as the negative direction of the vertical axis. Ultimately, a plane rectangular coordinate system is constructed with the wafer center as the origin and the feature point position as the negative direction of the vertical axis, which is the wafer's reference coordinate system.

[0066] like Figure 3 , a schematic diagram of a reference coordinate system is provided, wherein the origin position is the wafer center position 301 in the second layout information, and the negative direction of the vertical axis is the groove position 302 in the second layout information.

[0067] This embodiment selects second layout information from the first layout information corresponding to each candidate measurement data, and then constructs a reference coordinate system based on the second layout information. This provides a reference coordinate system that facilitates the subsequent overlay of data layers corresponding to each measurement data to construct a corresponding stacked image, thereby improving the accuracy of yield loss analysis.

[0068] As an optional embodiment, S103 may specifically include:

[0069] Determine whether the first layout information corresponding to the measurement data is consistent with the second layout information corresponding to the reference coordinate system, and obtain a layout comparison result;

[0070] If the layout comparison result indicates that the first layout information and the second layout information are inconsistent, determining difference information between the first layout information and the second layout information, the difference information including a difference type and a difference size;

[0071] According to the difference information, the measurement data is converted into a reference coordinate system to obtain reference measurement data corresponding to the measurement data.

[0072] In this embodiment, the server compares the first layout information of the measurement data with the second layout information of the reference coordinate system one by one, and determines whether the two are consistent based on the comparison results. If the first layout information and the second layout information are consistent, it means that the coordinate system constructed based on the first layout information of the measurement data and the reference coordinate system are compatible, and no data conversion is required. If the first layout information and the second layout information are inconsistent, it means that the coordinate system constructed based on the first layout information of the measurement data and the reference coordinate system are not compatible, and data conversion is required.

[0073] Then, if the layout comparison result indicates inconsistency, the algorithm is used to identify the difference information between the first layout information and the second layout information, and the difference information is recorded in detail, including the difference type and difference size.

[0074] Then, based on the difference type and size, set the parameters of the conversion algorithm, such as the rotation angle, translation distance, and scaling ratio. Based on the conversion algorithm parameters, select an appropriate conversion algorithm or tool to convert the measurement data from the original coordinate system of the first layout information to the reference coordinate system, obtaining the corresponding values ​​of the measurement data in the reference coordinate system, i.e., the reference measurement data.

[0075] This embodiment enables accurate and consistent conversion of measurement data in different coordinate systems. By converting each measurement data into reference measurement data in a reference coordinate system, it facilitates the subsequent overlay of the data layers corresponding to each measurement data to construct a corresponding stacked image, thereby improving the accuracy of yield loss analysis.

[0076] As an optional embodiment, the difference information includes at least one of a feature point position and a chip unit origin position, and the measurement data includes a measurement position and a corresponding measurement parameter;

[0077] According to the difference information, the measurement data is converted into a reference coordinate system to obtain the reference measurement data corresponding to the measurement data, which may specifically include:

[0078] In the case where the difference type is a feature point position difference, the measurement position in the measurement data is rotated according to the deviation angle between the first layout information and the second layout information to obtain reference measurement data corresponding to the measurement data, where the deviation angle is the angle formed by a line connecting the feature point position of the first layout information and the wafer center position and a line connecting the feature point position of the second layout information and the wafer center position;

[0079] When the difference type is the difference in the chip unit origin position, the measurement position in the measurement data is shifted according to the deviation distance between the first layout information and the second layout information to obtain the reference measurement data corresponding to the measurement data. The deviation distance is the length of the line segment formed by connecting the chip unit origin position of the first layout information and the chip unit origin position of the second layout information.

[0080] In this embodiment, when the difference type is a difference in feature point position, the server first determines the line connecting the feature point position in the first and second layout information with the wafer center position. It then calculates the angle between these two lines, i.e., the deviation angle. Finally, the measured position in the measurement data is rotated based on the deviation angle to obtain updated baseline measurement data.

[0081] As an example, Figure 4, a schematic diagram of a deviation angle is provided. Here, the angle formed by the line connecting the first special diagnostic point position A in the first layout information and the wafer center position O, and the line connecting the second special diagnostic point position B in the second layout information and the wafer center position O, is m degrees, that is, the deviation angle is m degrees.

[0082] If the discrepancy is a difference in the chip unit origin position, the server first determines the line length between the chip unit origin positions in the first and second layout information, i.e., the deviation distance. The server then shifts the measurement position in the measurement data based on the deviation distance to obtain the baseline measurement data.

[0083] This embodiment uses translation or rotation, depending on the type of difference between the first and second layout information, to convert the position information in the actual measurement data into a reference coordinate system. This facilitates the subsequent overlay of the data layers corresponding to the various measurement data to construct a corresponding stacked image, thereby improving the accuracy of yield loss analysis.

[0084] As an optional embodiment, before S104, the method for displaying the stacked measurement data may further include:

[0085] Determine whether each reference measurement data carries complete unit measurement data, and obtain a data judgment result, where the unit measurement data is the measurement data of the chip unit on the wafer;

[0086] In the case where the reference measurement data does not carry complete unit measurement data, data expansion is performed on the reference measurement data to obtain expanded measurement data. The data expansion is used to represent the measurement data of the unknown position inferred based on the measurement data of the known position;

[0087] Dividing the extended measurement data into multiple measurement data groups according to the distribution of chip units of the wafer, wherein the measurement data group includes multiple extended measurement data located within the same chip unit range;

[0088] Calculate the mean of each measurement data group to obtain a measurement mean sequence, which includes the mean of the expanded measurement data corresponding to each chip unit in the wafer;

[0089] S104 may specifically include:

[0090] According to each measurement mean sequence, the corresponding data layers are drawn in the reference coordinate system.

[0091] In this embodiment, the unit measurement data is used to represent the measurement data of the chip units on the wafer. Data expansion is used to represent the inference of measurement data of unknown locations based on measurement data of known locations. For example, interpolation and extrapolation methods can be used for data expansion.

[0092] As an example, the server first compares the baseline measurement data with the location information of all chip units on the wafer. If the baseline measurement data covers the measurement data of all chip units on the wafer, it is judged to be complete; if not, it is judged to be incomplete.

[0093] When baseline measurement data is incomplete, data expansion is required to obtain expanded measurement data. The purpose of data expansion is to infer measurement data at unknown locations based on measurement data at known locations. This can be achieved by using interpolation algorithms (such as linear interpolation and quadratic interpolation) based on measurement data at known locations to infer measurement data at unknown locations, thereby obtaining expanded measurement data.

[0094] After obtaining the expanded measurement data, it needs to be divided into multiple measurement data groups based on the distribution of chip units on the wafer. This can be achieved by first determining the range of each chip unit based on the location information of the chip units on the wafer. Then, each data point in the expanded measurement data is matched with its corresponding chip unit, and multiple expanded measurement data within the same chip unit range are divided into a single measurement data group.

[0095] Finally, the mean is calculated for each measurement data group to obtain a measurement mean sequence. This can be achieved by calculating the mean of all member data in each measurement data group and using this as the mean of the expanded measurement data corresponding to that chip unit. Arranging the means corresponding to all chip units in a certain order creates a measurement mean sequence. This measurement mean sequence reflects the measurement data of each chip unit on the wafer and provides a foundation for subsequent data layer drawing.

[0096] This embodiment ensures that measurement data corresponding to each chip unit on the wafer is obtained by performing integrity assessment, data expansion, data group division, and mean calculation on the measurement data of the chip units on the wafer. This improves the accuracy of the data layers subsequently drawn based on the measurement data, and further improves the accuracy of yield loss analysis.

[0097] As an optional embodiment, after S105, the method for displaying the stacked measurement data may further include:

[0098] In response to a marking operation on a first yield area and a second yield area in the measurement stack image, a yield marking result is obtained, wherein the yield of the chip units in the first yield area is greater than the yield of the chip units in the second yield area;

[0099] The measurement stack image is updated according to the yield marking result to obtain a marked measurement stack image.

[0100] In this embodiment, the first yield region is used to represent a high yield region, and the second yield region is used to represent a low yield region. The yield of the chip units in the first yield region is significantly greater than the yield of the chip units in the second yield region.

[0101] The yield marking result is used to represent marking information of the first yield area and the second yield area. For example, the yield marking result may include a yield level, a shape of the yield area, and a size of the yield area.

[0102] As an example, the server automatically generates a yield marking result in response to a user's marking operation on a first yield area and a second yield area in a measurement stack image.

[0103] Then, the server adds the information in the yield marking result (such as the border, color, text description, etc. of the marked area) to the original measurement stack image, saves the measurement stack image with the added marking information as a marked measurement stack image, and displays it.

[0104] Through this embodiment, the yield area in the measurement stack image is accurately marked and updated, thereby obtaining a marked measurement stack image, which helps users intuitively analyze the reasons for wafer yield loss in the measurement stack image.

[0105] As an optional embodiment, in response to the marking operation on the first yield area and the second yield area in the measurement stack image, after obtaining the yield marking result, the stack display method of the measurement data may further include:

[0106] Acquire a first yield data set of a first yield region and a second yield data set of a second yield region, wherein the first yield data set includes various baseline measurement data located in the first yield region, and the second yield data set includes various baseline measurement data located in the second yield region;

[0107] Performing statistical processing on each benchmark measurement data in the first yield data group and the second yield data group to obtain statistical processing results of each benchmark measurement data;

[0108] Calculate the difference between each statistical processing result of the first yield data group and the corresponding statistical processing result of the second yield data group to obtain the statistical processing difference between the first yield data group and the second yield data group;

[0109] The production link corresponding to each benchmark measurement data having a statistically processed difference greater than a preset difference threshold is determined to be the cause of the wafer yield loss.

[0110] In this embodiment, the preset difference threshold is used to identify which baseline measurement data has significant differences, thereby obtaining the cause of yield loss.

[0111] As an example, the server first obtains the corresponding baseline measurement data for each chip unit in the first yield area and the second yield area. All baseline measurement data in the first yield area are combined into a first yield data group, and all baseline measurement data in the second yield area are combined into a second yield data group.

[0112] Then, one or more statistical methods are selected from the group consisting of average value calculation, variance calculation, and standard deviation calculation. The selected statistical processing is performed on each type of benchmark measurement data in the first yield data group and the second yield data group, thereby obtaining a statistical processing result for each benchmark measurement data after statistical processing, namely, an average value, variance, or standard deviation.

[0113] Then, for each benchmark measurement data set, the statistically processed result in the first yield data set is subtracted from the corresponding statistically processed result in the second yield data set to obtain a statistically processed difference. Benchmark measurement data sets with statistically processed differences greater than a preset difference threshold are screened out. Based on these screened benchmark measurement data, the corresponding production process is traced back to identify the cause of wafer yield loss. These production processes may include wafer processing, photolithography, etching, and ion implantation.

[0114] By comparing the baseline measurement data in the first yield region and the second yield region in this embodiment, the cause of wafer yield loss can be accurately identified, thereby facilitating the formulation of corresponding improvement measures to improve wafer yield and product quality.

[0115] A stacked display method based on measurement data. Accordingly, the present application also provides a specific embodiment of a stacked display device for measurement data.

[0116] like Figure 5 As shown, the stacked display device 500 for measurement data provided by the embodiment of the present application includes a data acquisition module 510 , a coordinate system construction module 520 , a data conversion module 530 , a layer drawing module 540 and a layer overlay module 550 .

[0117] The data acquisition module 510 is used to acquire various measurement data of the wafer;

[0118] A coordinate system construction module 520 is used to construct a reference coordinate system of the wafer;

[0119] The data conversion module 530 is used to convert each measurement data into a reference coordinate system to obtain a variety of reference measurement data;

[0120] The layer drawing module 540 is used to draw the data layer corresponding to each reference measurement data in the reference coordinate system;

[0121] The layer overlay module 550 is used to overlay the data layers to obtain a measurement stack image corresponding to the wafer.

[0122] As an optional embodiment, the coordinate system construction module 520 specifically includes the following units:

[0123] a first determining unit, configured to determine whether the first layout information corresponding to each measurement data is complete, and obtain at least one candidate measurement data carrying the complete first layout information;

[0124] an information selection unit, configured to select second layout information from the first layout information corresponding to each candidate measurement data;

[0125] The coordinate system construction unit is used to construct a plane rectangular coordinate system with the wafer center position in the second layout information as the origin and the feature point position in the second layout information as the negative direction of the vertical axis to obtain a reference coordinate system of the wafer.

[0126] As an optional embodiment, the data conversion module 530 specifically includes the following units:

[0127] a second judgment unit, configured to judge whether the first layout information corresponding to the measurement data is consistent with the second layout information corresponding to the reference coordinate system, and obtain a layout comparison result;

[0128] a difference determining unit, configured to determine difference information between the first layout information and the second layout information when the layout comparison result indicates that the first layout information and the second layout information are inconsistent, the difference information including a difference type and a difference size;

[0129] The data conversion unit is used to convert the measurement data into a reference coordinate system according to the difference information to obtain reference measurement data corresponding to the measurement data.

[0130] As an optional embodiment, the difference type includes at least one of a feature point position difference and a chip unit origin position difference, and the measurement data includes a measurement position and a corresponding measurement parameter;

[0131] The data conversion unit is specifically used for:

[0132] In the case where the difference type is a feature point position difference, the measurement position in the measurement data is rotated according to the deviation angle between the first layout information and the second layout information to obtain reference measurement data corresponding to the measurement data, where the deviation angle is the angle formed by a line connecting the feature point position of the first layout information and the wafer center position and a line connecting the feature point position of the second layout information and the wafer center position;

[0133] When the difference type is the difference in the chip unit origin position, the measurement position in the measurement data is shifted according to the deviation distance between the first layout information and the second layout information to obtain the reference measurement data corresponding to the measurement data. The deviation distance is the length of the line segment formed by connecting the chip unit origin position of the first layout information and the chip unit origin position of the second layout information.

[0134] As an optional embodiment, before drawing corresponding data layers in the reference coordinate system according to each reference measurement data, the measurement data stacking display device 500 may further include:

[0135] The data judgment module is used to judge whether each reference measurement data carries complete unit measurement data and obtain a data judgment result. The unit measurement data is the measurement data of the chip unit on the wafer;

[0136] A data expansion module is used to expand the reference measurement data to obtain expanded measurement data when the reference measurement data does not carry complete unit measurement data. The data expansion is used to represent the measurement data of unknown locations inferred based on the measurement data of known locations.

[0137] A data partitioning module is used to divide the extended measurement data into multiple measurement data groups according to the distribution of chip units of the wafer, and the measurement data group includes multiple extended measurement data located in the same chip unit range;

[0138] A data calculation module is used to perform mean calculation on each measurement data group to obtain a measurement mean sequence, wherein the measurement mean sequence includes the mean of the expanded measurement data corresponding to each chip unit in the wafer;

[0139] The layer drawing module 540 is specifically used to:

[0140] According to each measurement mean sequence, the corresponding data layers are drawn in the reference coordinate system.

[0141] As an optional embodiment, after the data layers are superimposed to obtain a measurement stack image corresponding to the wafer, the measurement data stack display device 500 may further include:

[0142] a yield marking module configured to obtain a yield marking result in response to a marking operation on a first yield area and a second yield area in the measurement stack image, wherein the yield of the chip unit in the first yield area is greater than the yield of the chip unit in the second yield area;

[0143] The image updating module is used to update the measurement stack image according to the yield marking result to obtain the marked measurement stack image.

[0144] As an optional embodiment, in response to the marking operation on the first yield area and the second yield area in the measurement stack image, after obtaining the yield marking result, the stack display device 500 for the measurement data may further include:

[0145] The data acquisition module 510 is further configured to acquire a first yield data set for a first yield region and a second yield data set for a second yield region, wherein the first yield data set includes various baseline measurement data located in the first yield region, and the second yield data set includes various baseline measurement data located in the second yield region;

[0146] a data statistics module, configured to perform statistical processing on each benchmark measurement data in the first yield data group and the second yield data group, respectively, to obtain statistical processing results of each benchmark measurement data after statistical processing;

[0147] a difference calculation module, configured to calculate a difference between each statistical processing result of the first yield data group and a corresponding statistical processing result of the second yield data group, to obtain a statistical processing difference between the first yield data group and the second yield data group;

[0148] The cause determination module is used to determine the production link corresponding to each benchmark measurement data whose statistical processing difference is greater than a preset difference threshold as the cause of the wafer yield loss.

[0149] A stacked display method based on measurement data. Accordingly, the present application also provides a specific embodiment of a stacked display device based on measurement data.

[0150] Figure 6 A schematic diagram of the hardware structure of a stacked display device for measuring data provided in an embodiment of the present application is shown.

[0151] The stacked display device for measurement data may include a processor 601 and a memory 602 storing computer program instructions.

[0152] Specifically, the processor 601 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0153] The memory 602 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 602 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 602 may include removable or non-removable (or fixed) media. Where appropriate, the memory 602 may be inside or outside the integrated gateway disaster recovery device. In a specific embodiment, the memory 602 is a non-volatile solid-state memory.

[0154] The processor 601 reads and executes computer program instructions stored in the memory 602 to implement any one of the stacked display methods for measurement data in the above embodiments.

[0155] In one example, the stacked display device for measurement data may further include a communication interface 603 and a bus 610. Figure 6 As shown, the processor 601, the memory 602, and the communication interface 603 are connected via a bus 610 and communicate with each other.

[0156] The communication interface 603 is mainly used to implement communication between various modules, devices, layout units and / or equipment in the embodiments of the present application.

[0157] Bus 610 includes hardware, software or both, and couples the components of the laminated display device of measurement data to each other.For example, and not limitation, bus may include accelerated graphics port (AGP) or other graphics bus, enhanced industry standard architecture (EISA) bus, front side bus (FSB), hypertransport (HT) interconnection, industry standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnect (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations. Where appropriate, bus 610 may include one or more buses. Although the present application embodiment describes and shows a specific bus, the application considers any suitable bus or interconnection.

[0158] In addition, in conjunction with the stacked display method for measurement data in the above-mentioned embodiments, embodiments of the present application may provide a computer storage medium for implementation. The computer storage medium stores computer program instructions; when the computer program instructions are executed by a processor, any of the stacked display methods for measurement data in the above-mentioned embodiments is implemented.

[0159] In addition, in combination with the stacked display method of measurement data in the above-mentioned embodiments, the embodiments of the present application may provide a computer program product for implementation. When the instructions in the computer program product are executed by the processor of an electronic device, the electronic device executes the stacked display method of measurement data provided in any aspect of the above-mentioned embodiments of the present application.

[0160] It should be understood that the present application is not limited to the specific configurations and processes described above and illustrated in the figures. For the sake of brevity, a detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and illustrated as examples. However, the method process of the present application is not limited to the specific steps described and illustrated. Those skilled in the art can make various changes, modifications, and additions, or change the order of the steps after understanding the spirit of the present application.

[0161] The functional blocks shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable medium" can include any medium that can store or transmit information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0162] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps. In other words, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0163] Aspects of the present disclosure have been described above with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the function / action specified in one or more boxes of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor or a field programmable logic circuit. It is also understood that each box in the block diagram and / or flowchart and the combination of the boxes in the block diagram and / or flowchart can also be implemented by dedicated hardware that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions.

[0164] The above description is only a specific embodiment of the present application. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and layout units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited to this. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the scope of protection of the present application.

Claims

1. A method for displaying measured data in layers, characterized in that: include: Obtain various measurement data of wafers; Constructing a reference coordinate system of the wafer; Convert each of the measurement data into the reference coordinate system to obtain a plurality of reference measurement data; Draw a data layer corresponding to each type of the reference measurement data in the reference coordinate system; The data layers are superimposed to obtain a measurement stacked image corresponding to the wafer.

2. The method according to claim 1, characterized in that: The construction of the reference coordinate system of the wafer includes: Determine whether the first layout information corresponding to each of the measurement data is complete, and obtain at least one candidate measurement data carrying the complete first layout information; Selecting second layout information from the first layout information corresponding to each of the candidate measurement data; A plane rectangular coordinate system is constructed with the wafer center position in the second layout information as the origin and the feature point position in the second layout information as the negative direction of the vertical axis to obtain the reference coordinate system of the wafer.

3. The method according to claim 2, characterized in that The measurement data are converted into the reference coordinate system to obtain a variety of reference measurement data, including: determining whether the first layout information corresponding to the measurement data is consistent with the second layout information corresponding to the reference coordinate system, and obtaining a layout comparison result; If the layout comparison result indicates that the first layout information is inconsistent with the second layout information, determining difference information between the first layout information and the second layout information, the difference information including a difference type and a difference size; The measurement data is converted into the reference coordinate system according to the difference information to obtain the reference measurement data corresponding to the measurement data.

4. The method according to claim 3, characterized in that The difference type includes at least one of a feature point position difference and a chip unit origin position difference, and the measurement data includes a measurement position and a corresponding measurement parameter; The step of converting the measurement data into the reference coordinate system according to the difference information to obtain the reference measurement data corresponding to the measurement data includes: In the case where the difference type is the feature point position difference, the measurement position in the measurement data is rotated according to the deviation angle between the first layout information and the second layout information to obtain the reference measurement data corresponding to the measurement data, wherein the deviation angle is an angle formed by a line connecting the feature point position of the first layout information and the center position of the wafer and a line connecting the feature point position of the second layout information and the center position of the wafer; In the case where the difference type is the difference in the chip unit origin position, the measurement position in the measurement data is translated according to the deviation distance between the first layout information and the second layout information to obtain the reference measurement data corresponding to the measurement data, and the deviation distance is the length of a line segment formed by connecting the chip unit origin position of the first layout information and the chip unit origin position of the second layout information.

5. The method according to claim 1, characterized in that Before drawing the data layer corresponding to each type of the reference measurement data in the reference coordinate system, the method further includes: Determine whether each of the reference measurement data carries complete unit measurement data, and obtain a data determination result, wherein the unit measurement data is measurement data of a chip unit on the wafer; In the case where the reference measurement data does not carry complete unit measurement data, data expansion is performed on the reference measurement data to obtain expanded measurement data, wherein the data expansion is used to characterize the measurement data of the unknown position inferred from the measurement data of the known position; Dividing the extended measurement data into a plurality of measurement data groups according to the distribution of the chip units of the wafer, wherein the measurement data group includes a plurality of the extended measurement data located within the same chip unit range; Performing mean calculation on each of the measurement data groups to obtain a measurement mean sequence, wherein the measurement mean sequence includes the mean of the extended measurement data corresponding to each chip unit in the wafer; The step of drawing corresponding data layers in the reference coordinate system according to each of the reference measurement data includes: According to each of the measurement mean value sequences, corresponding data layers are drawn in the reference coordinate system.

6. The method according to any one of claims 1 to 5, characterized in that: After the data layers are superimposed to obtain a measured stacked image corresponding to the wafer, the method further includes: In response to the marking operation on the first yield area and the second yield area in the measured stack image, a yield marking result is obtained, wherein the yield of the chip unit in the first yield area is greater than the yield of the chip unit in the second yield area; The measured stack image is updated according to the yield marking result to obtain the marked measured stack image.

7. The method according to claim 6, characterized in that After obtaining the yield marking result in response to the marking operation on the first yield area and the second yield area in the measured stack image, the method further includes: Acquire a first yield data group of the first yield area and a second yield data group of the second yield area, wherein the first yield data group includes each of the reference measurement data located in the first yield area, and the second yield data group includes each of the reference measurement data located in the second yield area; Performing statistical processing on each of the benchmark measurement data in the first yield data group and the second yield data group respectively to obtain statistical processing results of each of the benchmark measurement data after statistical processing; Calculate the difference between each of the statistical processing results of the first yield data group and the corresponding statistical processing results in the second yield data group to obtain a statistical processing difference between the first yield data group and the second yield data group; The production link corresponding to each of the benchmark measurement data whose statistical processing difference is greater than a preset difference threshold is determined as the cause of the yield loss of the wafer.

8. An electronic device, characterized in that: The device comprises: a processor and a memory storing computer program instructions; When the processor executes the computer program instructions, the method for stacking and displaying the measurement data according to any one of claims 1 to 7 is implemented.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer program instructions, and when the computer program instructions are executed by a processor, the method for stacking and displaying measurement data according to any one of claims 1 to 7 is implemented.

10. A computer program product, characterized in that When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes the method for stacking and displaying measurement data as described in any one of claims 1 to 7.

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