Z-axis motion platform and use method

Abstract

The invention discloses a Z-axis motion platform and a use method. Wherein the Z-axis motion platform comprises a bottom plate, an adsorption mechanism, a jacking mechanism, a guide mechanism and a driving mechanism; the adsorption mechanism comprises an electrostatic chuck, the jacking mechanism can move in the Z-axis direction and is used for jacking off a wafer on the electrostatic chuck, the driving mechanism is used for providing moving driving force for the jacking mechanism, and the guiding mechanism is arranged between the jacking mechanism and the bottom plate and is used for guiding when the jacking mechanism moves in the Z-axis direction; the guide mechanism comprises a fixed support, a sliding block, a sliding rail, an elastic piece and a movable support. The fixed support is connected with the bottom plate, the sliding block or the sliding rail is fixed to the fixed support, the movable support is connected with the jacking mechanism, the sliding rail or the sliding block is fixed to the movable support, and the elastic piece is used for providing reset force for the movable support to move to the low position. The Z-axis motion platform has the advantages of being high in motion precision, good in stability, low in installation and adjustment difficulty, small in mass and the like, and the problems of motion clamping stagnation, low return speed and the like can be prevented.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor testing equipment, and in particular relates to a Z-axis motion platform and a use method thereof. Background Art

[0002] During the defect detection process of the wafer, the detected wafer needs to be removed from the electrostatic chuck. At this time, the wafer on the electrostatic chuck needs to be lifted up by a lifting mechanism. The existing lifting mechanism is guided by a linear bearing and a guide pin. Due to the radial clearance of the linear bearing, the movement accuracy and stability of the lifting mechanism are poor. In addition, three linear bearings and three guide pins are usually required between the lifting mechanism and the base plate for guiding to ensure stable guidance. However, this will make the overall structure complex and the mass increased, and will also increase the difficulty of assembly and debugging of the guide structure, which may cause problems such as movement jamming and slow return speed. Summary of the invention

[0003] In view of the above problems, the present invention discloses a Z-axis motion platform and a use method to overcome the above problems or at least partially solve the above problems.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] On one hand, the present invention discloses a Z-axis motion platform, comprising a base plate, and an adsorption mechanism, a lifting mechanism, a guide mechanism and a driving mechanism arranged on the base plate;

[0006] The adsorption mechanism includes an electrostatic suction cup for adsorbing and fixing the wafer, the lifting mechanism can move along the Z-axis direction, and is used to lift the wafer off the electrostatic suction cup, the driving mechanism is used to provide a driving force for the lifting mechanism to move along the Z-axis direction, and the guiding mechanism is arranged between the lifting mechanism and the bottom plate, and is used to guide the lifting mechanism when it moves along the Z-axis direction;

[0007] The guiding mechanism includes a fixed bracket, a slider, a slide rail, an elastic member and a movable bracket; the fixed bracket is fixedly connected to the base plate, the slider or the slide rail is fixed to the fixed bracket, the movable bracket is fixedly connected to the lifting mechanism, the slide rail or the slider is fixed to the movable bracket, the slider and the slide rail are slidably matched, and the elastic member is used to provide a reset force for the movable bracket to move to a low position.

[0008] Furthermore, the guide mechanism further includes a spring seat;

[0009] Fixed arms are respectively extended on both sides of the movable bracket, and each of the fixed arms is provided with a through hole and an annular groove, the annular groove is located on the upper end surface of the fixed arm and is sleeved on the outer side of the through hole, the elastic member is a compression spring, and the elastic member is sleeved on the spring seat, the upper end of the spring seat abuts against the upper end of the elastic member, the lower end of the spring seat passes through the through hole and is fixedly connected to the bottom plate, and the lower end of the elastic member is located in the annular groove.

[0010] Further, the jacking mechanism includes a jack support and a plurality of jacks;

[0011] A plurality of the push rods are evenly arranged on the push rod bracket, the lower end of each push rod is connected to the push rod bracket, the upper end of each push rod is provided with a flexible member, and the push rod bracket is fixedly connected to the movable bracket.

[0012] Furthermore, the adsorption mechanism also includes a suction cup support frame;

[0013] The electrostatic suction cup is arranged on the suction cup support frame, and an avoidance hole is opened on the electrostatic suction cup for the upper end of the ejector rod to pass through.

[0014] Further, three fine-tuning mechanisms are included;

[0015] The three fine-adjustment mechanisms are arranged in an equilateral triangle between the suction cup support frame and the base plate, and are used to fine-adjust the height of the suction cup support frame on the base plate along the Z-axis direction.

[0016] Furthermore, each of the fine-tuning mechanisms comprises a fine-tuning seat, a piezoelectric ceramic, a tension spring, a first fixing plate, a second fixing plate and a connecting plate;

[0017] The fine-tuning seat is fixed to the base plate, and the two ends of the connecting plate are respectively connected to the first fixing plate and the second fixing plate through flexible hinges, the first fixing plate is fixed to the fine-tuning seat, and the second fixing plate is fixedly connected to the suction cup support frame, the lower end of the tension spring and the lower end of the piezoelectric ceramic are both connected to the fine-tuning seat, the upper end of the tension spring is connected to the second fixing plate, and the upper end of the piezoelectric ceramic abuts against the side of the connecting plate close to the first fixing plate.

[0018] Furthermore, a bolt hole is opened on the connecting plate, a fine-tuning bolt is arranged in the screw hole, and the lower end of the fine-tuning bolt abuts against the upper end of the piezoelectric ceramic.

[0019] Furthermore, shock absorbing arms are respectively extended from both sides of the fine-tuning seat, and a shock absorbing member is provided on the inner side of each of the shock absorbing arms, and the shock absorbing member abuts against the side edge of the second fixing plate.

[0020] Furthermore, a first plane mirror arranged along the X-axis direction and a second plane mirror arranged along the Y-axis direction are provided on the bottom plate, the first plane mirror and the bottom plate are connected via a first mirror bracket, and the second plane mirror and the bottom plate are connected via a second mirror bracket.

[0021] Another aspect of the present invention discloses a method for using the above-mentioned Z-axis motion platform, which specifically comprises the following steps:

[0022] Step 01, the driving mechanism overcomes the restoring force of the elastic member, drives the lifting mechanism to move to a high position along the Z-axis direction, so that the lifting mechanism lifts the detected wafer off the electrostatic chuck;

[0023] Step 02, after the wafers that have been inspected on the lifting mechanism are taken away by the wafer conveying mechanism, the lifting mechanism receives the wafers that have not been inspected;

[0024] Step 03, the driving mechanism stops providing driving force to the lifting mechanism, and the lifting mechanism is moved to a low position along the Z-axis direction by the restoring force of the elastic member, so that the uninspected wafer falls on the electrostatic chuck;

[0025] Step 04, the electrostatic chuck absorbs and fixes the uninspected wafer.

[0026] The advantages and beneficial effects of the present invention are:

[0027] In the Z-axis motion platform of the present invention, a slider and a slide rail are arranged between the jacking mechanism and the base plate, so that the jacking mechanism is guided by the slide rail, thereby improving the motion accuracy and stability of the jacking mechanism, reducing the difficulty and quality of the assembly and adjustment of the overall structure, and effectively preventing the occurrence of problems such as motion jamming and slow return speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0029] Figure 1 A three-dimensional structural diagram of a Z-axis motion platform in one embodiment of the present invention;

[0030] Figure 2 An exploded structural diagram of a Z-axis motion platform in one embodiment of the present invention;

[0031] Figure 3 It is a position structure diagram of a lifting mechanism and a guide mechanism in one embodiment of the present invention;

[0032] Figure 4 An exploded structural diagram of a guide mechanism in one embodiment of the present invention;

[0033] Figure 5 is a three-dimensional structural diagram of an unassembled fine-tuning mechanism in one embodiment of the present invention;

[0034] Figure 6 is a cross-sectional view of an assembled fine adjustment mechanism in one embodiment of the present invention;

[0035] Figure 7 A three-dimensional structural diagram of a driving mechanism in one embodiment of the present invention;

[0036] Figure 8 A diagram showing the positional relationship between a driving mechanism and a lever bracket in one embodiment of the present invention;

[0037] Fig. 9 It is a three-dimensional cross-sectional view of the connection between the lever and the lever seat in one embodiment of the present invention;

[0038] Fig.10 This is a diagram of the implementation steps of a method for using a Z-axis motion platform in another embodiment of the present invention.

[0039] In the figure: 1, bottom plate; 2, electrostatic suction cup; 3, fixed bracket; 4, slider; 5, slide rail; 6, elastic member; 7, movable bracket; 8, spring seat; 9, fixed arm; 10, through hole; 11, annular groove; 12, push rod bracket; 13, push rod; 14, suction cup support frame; 15, avoidance hole; 16, fine-tuning mechanism; 17, fine-tuning seat; 18, piezoelectric ceramics; 19, tension spring; 20, first fixed plate; 21, second fixed plate; 22, connecting plate; 23, flexible hinge; 24, fine-tuning bolt; 25, shock absorption Support arm; 26, shock absorbing member; 27, rubber sleeve; 28, first plane mirror; 29, second plane mirror; 30, first mirror bracket; 31, second mirror bracket; 32, flexible member; 33, lever; 34, lever seat; 35, driving source; 36, screw; 37, nut; 38, bearing; 39, pressing ring; 40, opening; 41, top screw; 42, reset member; 43, buffer member; 44, boss; 45, pressure rod; 46, L-shaped connecting rod; 47, pressure groove; 48, first contact member; 49, second contact member. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] The technical solutions provided by various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0042] In one embodiment of the present invention, a Z-axis motion platform is provided. Figures 1 to 4 As shown, the Z-axis motion platform includes a base plate 1, and an adsorption mechanism, a lifting mechanism, a guide mechanism and a driving mechanism arranged on the base plate 1. The Z-axis motion platform can be arranged on a semiconductor defect detection device.

[0043] Specifically, the adsorption mechanism includes an electrostatic suction cup 2, which is used to adsorb and fix the wafer. The lifting mechanism can move along the Z-axis direction, and is used to lift the wafer off the electrostatic suction cup 2. The driving mechanism is used to provide the lifting mechanism with a driving force for moving along the Z-axis direction. The guide mechanism is arranged between the lifting mechanism and the base plate 1, and is used to guide the lifting mechanism when it moves along the Z-axis direction, thereby ensuring that the lifting mechanism only moves in the Z-axis direction.

[0044] Furthermore, if Figure 4 As shown, the guiding mechanism includes a fixed bracket 3, a slider 4, a slide rail 5, an elastic member 6 and a movable bracket 7; the fixed bracket 3 is fixedly connected to the base plate 1, specifically, it can be fixed by screws or bolts, the slider 4 is fixed on the fixed bracket 3, the movable bracket 7 is fixedly connected to the lifting mechanism, specifically, it can be fixed by screws or bolts, the slide rail 5 is fixed on the movable bracket 7, the slider 4 and the slide rail 5 can be slidably matched to realize the movement and guiding of the lifting mechanism in the Z-axis direction, and the elastic member 6 is used to provide a reset force (elastic force) for the movable bracket 7 to move to a low position; when the driving mechanism stops providing driving force for the lifting mechanism, the reset force (elastic force) of the elastic member 6 causes the movable bracket 7 to drive the lifting mechanism to move to a low position, which can effectively prevent movement jamming and slow return speed.

[0045] In this way, due to the structural characteristics of the slide rail 5 and the slider 4, not only the guiding stability of the lifting mechanism is better and the motion accuracy is higher, but also the lifting mechanism and the bottom plate 1 can be stably guided by only one slide rail 5, which effectively reduces the difficulty of the overall structure and the overall quality of the guide mechanism. Of course, in other embodiments, the positions of the slide rail and the slider can be swapped, which is also within the scope of protection of the present invention.

[0046] In summary, in the Z-axis motion platform of this embodiment, a slider and a slide rail are arranged between the jacking mechanism and the base plate, so that the jacking mechanism is guided by the slide rail, thereby improving the movement accuracy and stability of the jacking mechanism, reducing the difficulty and quality of the installation and adjustment of the overall structure, and effectively preventing the occurrence of problems such as movement jamming and slow return speed.

[0047] In this embodiment, if Figure 3 and Figure 4 As shown, the guide mechanism further includes a spring seat 8 .

[0048] Fixed arms 9 are extended from both sides of the movable bracket 7. Each fixed arm 9 is provided with a through hole 10 and an annular groove 11. The annular groove 11 is located on the upper end surface of the fixed arm 9 and is sleeved on the outer side of the through hole 10, that is, the annular groove 11 and the through hole 10 are coaxially arranged. The elastic member 6 is a compression spring. The elastic member 6 is sleeved on the spring seat 8. The upper end of the spring seat 8 abuts against the upper end of the elastic member 6. The lower end of the spring seat 8 passes through the through hole 10 and is fixedly connected to the bottom plate 1. The lower end of the elastic member 6 is located in the annular groove 11. In this way, when the lifting mechanism moves to a high position along the Z-axis direction, the elastic member 6 is compressed, forming a downward elastic force on the lifting mechanism. When the driving mechanism stops providing driving force for the lifting mechanism, the elastic force of the elastic member 6 and the gravity of the lifting mechanism work together to reset the lifting mechanism to a low position. In other embodiments, the elastic member can also be a tension spring, and the structure of the movable bracket needs to be adjusted accordingly.

[0049] In addition, if Figure 2 and Figure 3 As shown, the lifting mechanism includes a push rod support 12 and a plurality of push rods 13. The number of the push rods is preferably three, and the push rod support is in a Y-shaped shape.

[0050] Specifically, multiple push rods 13 are evenly arranged on the push rod bracket 12. The upper end of the push rod 13 can pass through the adsorption mechanism to lift the wafer on the electrostatic suction cup 2. The lower end of each push rod 13 is connected to the push rod bracket 12. The lower end of the push rod 13 can be fixedly connected or rotatably connected to the push rod bracket 12. The upper end of each push rod 13 is provided with a flexible part 32 to prevent the push rod 13 from damaging the wafer. The flexible part 32 can be an O-ring made of rubber material. The push rod bracket 12 is fixedly connected to the movable bracket 7 by screws or bolts.

[0051] In addition, if Figure 1 and Figure 2 As shown, the adsorption mechanism also includes a suction cup support frame 14.

[0052] The electrostatic suction cup 2 is arranged on the suction cup support frame 14 to realize stable support for the electrostatic suction cup 2. The electrostatic suction cup 2 is provided with an avoidance hole 15 for the upper end of the ejector rod 13 to pass through. In this way, when the lifting mechanism is in a low position, the upper end of the ejector rod 13 is located below the electrostatic suction cup 2 and does not pass through the avoidance hole 15; when the lifting mechanism is in a high position, the upper end of the ejector rod 13 passes through the avoidance hole 15. Of course, an avoidance structure corresponding to the position of the avoidance hole can also be provided on the suction cup support frame for the upper end of the ejector rod to pass through.

[0053] In this embodiment, if Figure 1 and Figure 2 As shown, the Z-axis motion platform further includes three fine-tuning mechanisms 16; of course, the number of fine-tuning mechanisms may be other.

[0054] Specifically, three fine-tuning mechanisms 16 are arranged in an equilateral triangle between the suction cup support frame 14 and the base plate 1 for fine-tuning the height of the suction cup support frame 14 on the base plate 1 along the Z-axis direction so that the electrostatic suction cup 2 on the suction cup support frame 14 maintains a horizontal position.

[0055] Furthermore, if Figure 5 and Figure 6 As shown, each fine-tuning mechanism includes a fine-tuning seat 17, a piezoelectric ceramic 18, a tension spring 19, a first fixing plate 20, a second fixing plate 21 and a connecting plate 22. The piezoelectric ceramic can be a cylinder, which can extend axially when powered, and the extension distance is positively correlated with the applied voltage.

[0056] The fine-tuning seat 17 is fixed on the base plate 1, and can be fixed on the base plate 1 by screws or bolts. The two ends of the connecting plate 22 are connected to the first fixing plate 20 and the second fixing plate 21 by flexible hinges 23, so that the connecting plate 22 can rotate relative to the first fixing plate 20, and the second fixing plate 21 can rotate relative to the connecting plate 22. The first fixing plate 20 can be fixed on the fine-tuning seat 17 by bolts, and the second fixing plate 21 can be fixedly connected to the suction cup support frame 14 by bolts. The lower end of the tension spring 19 and the lower end of the piezoelectric ceramic 18 are both connected to the fine-tuning seat 17, and the lower end of the piezoelectric ceramic 18 and the fine-tuning seat 17 can be connected by screws or bolts. The bolt is fixed, the upper end of the tension spring 19 is connected to the second fixed plate 21, and the upper end of the piezoelectric ceramic 18 abuts against the side of the connecting plate 22 close to the first fixed plate 20, so that the hinge between the connecting plate 22 and the first fixed plate 20, the abutment between the upper end of the piezoelectric ceramic 18 and the connecting plate 22, and the hinge between the connecting plate 22 and the second fixed plate 21 form a distance-saving lever structure, thereby amplifying the stroke of the piezoelectric ceramic 18, that is, the piezoelectric ceramic 18 extends axially for a smaller distance. Through the above-mentioned distance-saving lever structure, the second fixed plate 21 can be moved a larger distance, thereby realizing the adjustment of the height of the suction cup support frame 14, and the adjustment method is simpler.

[0057] And, if Figure 5 and Figure 6 As shown, a bolt hole is opened on the connecting plate 22, and a fine-tuning bolt 24 is arranged in the screw hole. The lower end of the fine-tuning bolt 24 abuts against the upper end of the piezoelectric ceramic 18. The height of the connecting plate 22 relative to the piezoelectric ceramic 18 can be adjusted by the depth of the fine-tuning bolt 24 screwed into the screw hole, thereby ensuring that the height of the second fixed plate 21 in each fine-tuning mechanism is consistent when the piezoelectric ceramic 18 is not powered on.

[0058] In addition, if Figure 5As shown, shock-absorbing arms 25 are respectively extended from both sides of the fine-tuning seat 17, and shock-absorbing members 26 are provided on the inner side of each shock-absorbing arm 25. The shock-absorbing members 26 abut against the side of the second fixing plate 21. The shock-absorbing members 26 can be rubber sheets or rubber blocks. By providing the shock-absorbing arms 25 and the shock-absorbing members 26, the vibration generated by the second fixing plate 21 during movement can be effectively reduced, thereby ensuring the stability of the suction cup support frame 14 during movement. Among them, the inner side of the shock-absorbing arm is the opposite side of the two shock-absorbing arms.

[0059] In addition, if Figure 6 As shown, a rubber sleeve 27 is sleeved on the outer side of the piezoelectric ceramic 18 to absorb the vibration generated when the piezoelectric ceramic 18 is energized and extended, so as to ensure the stability of the fine-tuning mechanism.

[0060] In this embodiment, if Figure 1 and Figure 2 As shown, the bottom plate 1 is provided with a first plane mirror 28 arranged along the X-axis direction and a second plane mirror 29 arranged along the Y-axis direction. The first plane mirror 28 can reflect laser light and is used to measure the distance that the Z-axis motion platform moves along the X-axis direction. The second plane mirror 29 can reflect laser light and is used to measure the distance that the Z-axis motion platform moves along the Y-axis direction. The first plane mirror 28 and the bottom plate 1 are connected via a first mirror bracket 30, and the second plane mirror 29 and the bottom plate 1 are connected via a second mirror bracket 31. By arranging the first plane mirror 28 and the second plane mirror 29 on the bottom plate 1, the size and weight of the suction cup support frame 14 can be reduced, and the mass distribution of the suction cup support frame 14 can be made more balanced, thereby increasing the response speed of the motion platform and improving the motion accuracy of the motion platform.

[0061] In one embodiment of the present invention, Figure 2 , Figures 7 to 9 As shown, the driving mechanism includes a lever 33, a lever seat 34, a driving source 35, a screw 36, a nut 37 and two bearings 38. The driving source is a device capable of driving linear motion, such as an electric drive cylinder, a pneumatic drive cylinder or a linear motor.

[0062] Specifically, the front end of the lever 33 abuts against the lower end surface of the push rod bracket 12. When the front end of the lever 33 is in a high position, the front end of the lever 33 can lift the push rod bracket 12. When the front end of the lever 33 is in a low position, the push rod bracket 12 falls back as the front end of the lever 33 descends. A support hole (not shown in the figure) is opened in the middle of the lever 33. The support hole is arranged along a direction perpendicular to the length of the lever 33. The lever 33 can rotate around the support hole. Two bearings 38 are respectively arranged at both ends of the support hole. The screw 36 The screw 36 and the nut 37 are connected through two bearings 38 and support holes, and can be tightened so that the screw 36 and the nut 37 axially squeeze the inner rings of the two bearings 38 from the outside of the two bearings 38 respectively, so that the outer rings of the two bearings 38 clamp and fix the lever 33, thereby eliminating the gap between the inner and outer rings of the bearings 38 and achieving effective pre-tightening in the bearings 38; wherein, the outer side of the bearing 38 is the side of the bearing 38 away from the lever 33, and the inner side of the bearing 38 is the side of the bearing 38 close to the lever 33.

[0063] Furthermore, the screw rod 36 and the nut 37 are fixed on the lever seat 34, and the lever seat 34 is fixed on the bottom plate 1. The two can be fixedly connected by screws or bolts, and the driving source 35 is used to provide a driving force for the front end of the lever 33 to move to a high position. It should be noted that when the two bearings 38 are arranged at both ends of the support hole, only the outer ring of the bearing 38 abuts against the lever 33, and only the inner ring of the bearing 38 abuts against the screw rod 36 or the nut 37.

[0064] In this way, by respectively arranging bearings 38 at both ends of the support hole on the lever 33, and axially squeezing the inner rings of the two bearings 38 through the screw 36 and the nut 37, the outer rings of the two bearings 38 are clamped to fix the lever 33, thereby eliminating the gap between the inner and outer rings of the bearings 38, achieving effective pre-tightening in the bearings 38, greatly reducing the shaking of the lever 33, and enabling the lever 33 to move more smoothly and reliably, thereby improving the mechanical service life of the drive mechanism.

[0065] In this embodiment, bearing grooves (not shown in the figure) are formed at both ends of the support hole, and two bearings 38 are respectively arranged in the two bearing grooves. In this way, the bearings 38 are accommodated by the bearing grooves to prevent dust particles from entering the bearings 38 and affecting the normal operation of the bearings 38. The bearing grooves are used to position the bearings 38 to prevent the bearings 38 from moving relative to the lever 33 during long-term use of the drive mechanism, thereby ensuring the accuracy of the movement of the drive mechanism.

[0066] In addition, if Fig. 9 As shown, the drive mechanism further includes a pressure ring 39 .

[0067] The pressure ring 39 is sleeved on the screw 36 and is located between the two bearings 38. The pressure ring 39 is used to squeeze and fix the inner rings of the two bearings 38, that is, when the screw 36 and the nut 37 squeeze the outer sides of the inner rings of the two bearings 38, the pressure ring 39 squeezes the inner sides of the inner rings of the two bearings 38 to fix the inner rings of the bearings 38. The setting of the pressure ring 39 can effectively prevent the screw 36 and the nut 37 from excessively squeezing the inner rings of the bearings 38.

[0068] In addition, a mounting groove is provided on the lever seat 34, and the mounting groove penetrates the lever seat 34 along a direction perpendicular to the length of the lever 33. Fig. 9 As shown, an opening 40 is provided in the middle of the lever seat 34 for accommodating the lever 33 , and the screw rod 36 and the nut 37 are respectively fixed in the mounting grooves on both sides of the opening 40 , so that the assembly and disassembly of the lever 33 and the lever seat 34 are more convenient.

[0069] Furthermore, if Fig. 9 As shown, the lever seat 34 is provided with a plurality of top screw holes connected to the mounting groove, each of which is provided with a top screw 41, and the top screw 41 is used to tighten and fix the screw rod 36 and the nut 37. Specifically, the lever seat 34 is provided with eight top screw holes, which are respectively arranged on both sides of the mounting groove, four top screws 41 are used to fix the screw rod 36, and four top screws 41 are used to fix the nut 37, so that the screw rod 36 and the nut 37 are fixed more firmly.

[0070] Of course, in other embodiments, a pressure cover may also be provided on the mounting groove to compress and fix the screw rod and the nut. Specifically, the pressure cover may be fixed on the lever seat by screws or bolts.

[0071] In this embodiment, if Figure 8 As shown, the driving mechanism further includes a reset member 42; wherein the reset member can be a coil spring.

[0072] One end of the reset member 42 is connected to the lever 33, and the other end of the reset member 42 is connected to the lever seat 34. The reset member 42 is used to provide a reset force for the front end of the lever 33 to return to the low position. By adding the reset member 42, the lever 33 can be quickly returned to the low position, the response speed is increased, and the lever 33 is prevented from being stuck. In other embodiments, the other end of the reset member can also be connected to the bottom plate.

[0073] In addition, if Figure 7 and Figure 8 As shown, a buffer 43 is provided on the lever 33 between the front end of the lever 33 and the lever seat 34, and a boss 44 corresponding to the position of the buffer 43 is provided on the bottom plate 1 to avoid collision between the front end of the lever 33 and the bottom plate 1, avoid vibration, and also extend the service life of the driving mechanism. The buffer can be made of rubber material, and the boss can be made of metal material.

[0074] In addition, the boss and the bottom plate are connected via threads; thus, the height of the boss can be adjusted so that when the front end of the lever is in a low position, the buffer member can just contact the boss.

[0075] In this embodiment, if Figure 7 and Figure 8 As shown, the driving mechanism further includes a pressure rod 45 and an L-shaped connecting rod 46.

[0076] Specifically, the long side end of the L-shaped connecting rod 46 is fixedly connected to the rear end of the lever 33, the driving source 35 is arranged below the rear end of the lever 33, the pressing rod 45 is fixedly connected to the push rod shaft of the driving source 35, the side of the pressing rod 45 is provided with a pressing groove 47, and the short side end of the L-shaped connecting rod 46 abuts against the upper groove wall of the pressing groove 47. In this way, when the push rod shaft of the driving source 35 moves downward, the rear end of the lever 33 is pressed downward, so that the front end of the lever 33 moves to a high position. Through the above-mentioned structural arrangement, the layout of the driving mechanism is more compact and occupies less space.

[0077] Furthermore, if Figure 7 and Figure 8 As shown, the front end of the lever 33 is provided with a first contact member 48, and the first contact member 48 is in point contact or line contact with the lower end surface of the push rod bracket 12, and the short side end of the L-shaped connecting rod 46 is provided with a second contact member 49, and the second contact member 49 is in point contact or line contact with the upper groove wall of the pressing groove 47. Among them, the first contact member and the second contact member can be a sphere or a cylinder, and the first contact member can be fixed to the front end of the lever by bolts, or the first contact member and the lever adopt an integral structure, and the second contact member can be fixed to the L-shaped connecting rod by bolts, or the second contact member and the L-shaped connecting rod adopt an integral structure. By providing the first contact member 48 and the second contact member 49, the lateral force of the driving source 35 on the lever 33 and the lateral force of the lever 33 on the push rod bracket 12 can be effectively reduced, thereby ensuring the stable and reliable operation of the motion platform.

[0078] In another embodiment of the present invention, a method for using the Z-axis motion platform in the above embodiment is provided. Fig.10 As shown, the method of use specifically includes the following steps:

[0079] Step 01, the driving mechanism overcomes the restoring force of the elastic member, drives the lifting mechanism to move to a high position along the Z-axis direction, and enables the lifting mechanism to lift the detected wafer off the electrostatic chuck.

[0080] Step 02: After the wafers that have been inspected on the lifting mechanism are taken away by the wafer conveying mechanism, the lifting mechanism receives the wafers that have not been inspected. The wafer conveying mechanism may be a structure on the inspection equipment.

[0081] Step 03, the driving mechanism stops providing driving force to the lifting mechanism, and the lifting mechanism is moved to a low position along the Z-axis direction by the reset force of the elastic member, so that the uninspected wafer falls on the electrostatic chuck.

[0082] Step 04, the electrostatic chuck absorbs and fixes the untested wafer. After the electrostatic chuck absorbs and fixes the wafer, the wafer can be tested, and step 1 is repeated after the test is completed.

[0083] The above is only a specific embodiment of the present invention. Under the above teachings of the present invention, those skilled in the art can make other improvements or modifications on the basis of the above embodiments. Those skilled in the art should understand that the above specific description is only to better explain the purpose of the present invention, and the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A Z-axis motion platform, characterized in that: It includes a bottom plate, and an adsorption mechanism, a lifting mechanism, a guide mechanism and a driving mechanism arranged on the bottom plate; The adsorption mechanism includes an electrostatic suction cup for adsorbing and fixing the wafer, the lifting mechanism can move along the Z-axis direction, and is used to lift the wafer off the electrostatic suction cup, the driving mechanism is used to provide a driving force for the lifting mechanism to move along the Z-axis direction, and the guiding mechanism is arranged between the lifting mechanism and the bottom plate, and is used to guide the lifting mechanism when it moves along the Z-axis direction; The guiding mechanism includes a fixed bracket, a slider, a slide rail, an elastic member and a movable bracket; the fixed bracket is fixedly connected to the base plate, the slider or the slide rail is fixed to the fixed bracket, the movable bracket is fixedly connected to the lifting mechanism, the slide rail or the slider is fixed to the movable bracket, the slider and the slide rail are slidably matched, and the elastic member is used to provide a reset force for the movable bracket to move to a low position.

2. The Z-axis motion platform according to claim 1, characterized in that: The guide mechanism also includes a spring seat; Fixed arms are respectively extended on both sides of the movable bracket, and each of the fixed arms is provided with a through hole and an annular groove, the annular groove is located on the upper end surface of the fixed arm and is sleeved on the outer side of the through hole, the elastic member is a compression spring, and the elastic member is sleeved on the spring seat, the upper end of the spring seat abuts against the upper end of the elastic member, the lower end of the spring seat passes through the through hole and is fixedly connected to the bottom plate, and the lower end of the elastic member is located in the annular groove.

3. The Z-axis motion platform according to claim 1, characterized in that: The jacking mechanism includes a jack support and a plurality of jacks; A plurality of the push rods are evenly arranged on the push rod bracket, the lower end of each push rod is connected to the push rod bracket, the upper end of each push rod is provided with a flexible member, and the push rod bracket is fixedly connected to the movable bracket.

4. The Z-axis motion platform according to claim 3, characterized in that: The adsorption mechanism also includes a suction cup support frame; The electrostatic suction cup is arranged on the suction cup support frame, and an avoidance hole is opened on the electrostatic suction cup for the upper end of the ejector rod to pass through.

5. The Z-axis motion platform according to claim 4, characterized in that: Also included are three fine-tuning mechanisms; The three fine-adjustment mechanisms are arranged in an equilateral triangle between the suction cup support frame and the base plate, and are used to fine-adjust the height of the suction cup support frame on the base plate along the Z-axis direction.

6. The Z-axis motion platform according to claim 5, characterized in that: Each of the fine-tuning mechanisms comprises a fine-tuning seat, piezoelectric ceramics, a tension spring, a first fixing plate, a second fixing plate and a connecting plate; The fine-tuning seat is fixed to the base plate, and the two ends of the connecting plate are respectively connected to the first fixing plate and the second fixing plate through flexible hinges, the first fixing plate is fixed to the fine-tuning seat, and the second fixing plate is fixedly connected to the suction cup support frame, the lower end of the tension spring and the lower end of the piezoelectric ceramic are both connected to the fine-tuning seat, the upper end of the tension spring is connected to the second fixing plate, and the upper end of the piezoelectric ceramic abuts against the side of the connecting plate close to the first fixing plate.

7. The Z-axis motion platform according to claim 6, characterized in that: The connecting plate is provided with a bolt hole, in which a fine-tuning bolt is arranged, and the lower end of the fine-tuning bolt abuts against the upper end of the piezoelectric ceramic.

8. The Z-axis motion platform according to claim 6, characterized in that: Shock-absorbing arms are respectively extended from both sides of the fine-tuning seat, and a shock-absorbing member is arranged on the inner side of each of the shock-absorbing arms, and the shock-absorbing member abuts against the side edge of the second fixing plate.

9. The Z-axis motion platform according to any one of claims 1 to 8, characterized in that: The bottom plate is provided with a first plane mirror arranged along the X-axis direction and a second plane mirror arranged along the Y-axis direction. The first plane mirror and the bottom plate are connected via a first mirror bracket, and the second plane mirror and the bottom plate are connected via a second mirror bracket.

10. A method for using the Z-axis motion platform according to claim 1, characterized in that: The specific steps include: Step 01, the driving mechanism overcomes the restoring force of the elastic member, drives the lifting mechanism to move to a high position along the Z-axis direction, so that the lifting mechanism lifts the detected wafer off the electrostatic chuck; Step 02, after the wafers that have been inspected on the lifting mechanism are taken away by the wafer conveying mechanism, the lifting mechanism receives the wafers that have not been inspected; Step 03, the driving mechanism stops providing driving force to the lifting mechanism, and the lifting mechanism is moved to a low position along the Z-axis direction by the restoring force of the elastic member, so that the uninspected wafer falls on the electrostatic chuck; Step 04, the electrostatic chuck absorbs and fixes the uninspected wafer.

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