Wafer carrying device and wafer processing equipment

Abstract

The present application discloses a wafer bearing device and wafer processing equipment, wherein the bearing device comprises: a translation mechanism, a lifting mechanism, a rotating mechanism and a bearing platform, wherein the bearing platform is connected to the rotating mechanism, wherein the rotating mechanism is connected to the lifting mechanism, wherein a translation space is formed in the translation mechanism, wherein the lifting mechanism is arranged in the translation space; wherein the rotating mechanism comprises a first shell, a first driving assembly and a rotating shaft, wherein the bearing platform is installed at one end of the rotating shaft; wherein the lifting mechanism comprises a second shell and a second driving assembly, wherein the second shell is connected to the translation mechanism, wherein the second driving assembly is connected to the first shell, wherein a lifting cavity is formed in the second shell, wherein a throttling assembly is arranged on the inner wall surface of the lifting cavity, and wherein the first shell can be lifted and lowered without contact in the lifting cavity. The present device realizes that the three mechanisms are nearly coplanar, thereby reducing the system's working center of gravity, reducing the system's vertical dimension, reducing the mass of moving parts, and improving the operating accuracy and positioning accuracy of the entire system.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductors, and in particular to a wafer carrier and wafer processing equipment. Background Art

[0002] Optical detection of wafer defects has always been an engineering problem that has long accompanied the development of IC (chip) manufacturing. Wafer defect detection must accurately identify wafer defects and obtain specific information about the defects, including the location of the defects, area size, etc.; meet the speed and capacity requirements of large-scale industrial production and achieve rapid detection.

[0003] The motion platform that carries the wafer is a key device in the system. In the current chip production process, the measurement speed of the wafer defect detection equipment is usually required to reach more than 100 wafers / hour. Conventional XY linear motion platforms are difficult to meet this speed requirement. The speed of a high-speed air-floating turntable can usually reach more than 1,000 revolutions. In this case, it is a very suitable solution to use a horizontal linear axis driven by a high-precision linear motor and an air-floating turntable driven by a linear motor to allow the wafer to be inspected while rotating at high speed. At this time, the wafer motion trajectory is a spiral line; at the same time, due to the unevenness of the wafer and the depth of field limitation of the detection camera, it is often necessary to design a lifting axis to cooperate with the rotating axis for high-frequency tracking focus. Conventional rotary axis mechanical guides are currently difficult to meet the accuracy requirements in the field of high-precision detection, and the existing structural forms mostly adopt a three-axis combination stacking form. The system structure is relatively large in size and heavy in weight. After stacking, it is difficult to meet the comprehensive motion accuracy and efficiency requirements. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a wafer carrying device and a wafer processing equipment. By arranging the rotating mechanism inside the lifting mechanism and the lifting mechanism inside the translation mechanism, the three mechanisms are nearly coplanar, thereby lowering the system's working center of gravity, reducing the system's vertical dimensions, reducing the mass of moving parts, and improving the operating accuracy and positioning accuracy of the entire system. In addition, the full air-floating guide rail design is adopted to improve the cleanliness of the motion system.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] On the one hand, a wafer carrying device is provided, comprising: a translation mechanism, a lifting mechanism, a rotation mechanism and a carrying platform, wherein the carrying platform is used to mount a wafer to be inspected, the carrying platform is connected to the rotating end of the rotation mechanism, the rotation mechanism is connected to the lifting end of the lifting mechanism, a translation space is formed in the translation mechanism, the lifting mechanism is arranged in the translation space, and is connected to the power end of the translation mechanism;

[0007] The rotating mechanism includes a first shell, a first driving component installed in the first shell, and a rotating shaft connected to the first driving component, and the carrying platform is installed at one end of the rotating shaft; the lifting mechanism includes a second shell, and a second driving component installed in the second shell, the second shell is connected to the power end of the translation mechanism, the second driving component is connected to the first shell, a lifting cavity matching the first shell is formed in the second shell, the lifting cavity opens upward, and a throttling component is provided on the inner wall surface of the lifting cavity so that the inner wall surface of the lifting cavity forms an air floating surface, and the first shell can be lifted up and down without contact in the lifting cavity under the drive of the second driving component.

[0008] Furthermore, the rotating mechanism includes a first bearing and a second bearing, the first bearing is arranged at the upper part of the first housing, the second bearing is arranged at the lower part of the first housing, the rotating shaft is arranged inside the first bearing and the second bearing, and a first throttling member is arranged inside the first bearing and the second bearing so that an air film is formed on the contact surface between the first bearing and the rotating shaft, and an air film is formed on the contact surface between the second bearing and the rotating shaft.

[0009] Furthermore, the lower end of the first bearing extends toward the direction of the rotating shaft to form a limiting portion, and the first throttling member is arranged in the limiting portion so that an air film is formed between the contact surface of the limiting portion and the rotating shaft.

[0010] Furthermore, a third bearing is arranged at the upper end of the first bearing, the rotating shaft passes through the interior of the third bearing, a first air supply channel is arranged in the third bearing, the first air supply channel can supply air to the first throttling member in the first bearing, the first throttling member is arranged in the first air supply channel, so that an air film is formed on the bottom surface of the third bearing, and then cooperates with the limiting portion to limit the axial displacement of the rotating shaft.

[0011] Furthermore, a sealing plate is provided at the upper end of the third bearing to seal the first air supply channel.

[0012] Furthermore, the outer peripheral wall of the rotating shaft is sleeved with a first grating, and the sealing plate is provided with a first counter for counting in cooperation with the first grating.

[0013] Furthermore, the interior of the rotating shaft is hollow to form a cavity, the lower end of the cavity is isolated by an air separator, and a first air supply component is provided on the air separator. The air inlet end of the first air supply component is arranged below the air separator, and the air outlet end is arranged inside the rotating shaft to form a first air source air supply.

[0014] Furthermore, a conducting groove is provided in the second bearing, a through hole connected to the conducting groove is provided on the rotating shaft, a second air supply component is provided on the second bearing, an air inlet end of the second air supply component is arranged below the second bearing, and an air outlet end is connected to the conducting groove, and then air is supplied into the cavity through the through hole to form a second air source supply.

[0015] Furthermore, the second shell includes a base, a first side plate, a second side plate, a third side plate and a fourth side plate, and the first side plate, the second side plate, the third side plate and the fourth side plate are all arranged on the base, and are sequentially connected around and connected with the base to form the rectangular lifting cavity.

[0016] Furthermore, the second driving assembly includes two driving motors, which are symmetrically arranged on the base and respectively pass through the second side plate and the fourth side plate to be connected to the first shell.

[0017] Furthermore, a piston hole is provided on the base, the piston hole is located in the lifting cavity, and a piston is provided at the bottom of the first shell and is loosely connected to the piston hole.

[0018] Furthermore, the piston hole passes through the base, and an air sealing plate is provided at the bottom of the piston hole.

[0019] Furthermore, a first vacuum cavity is provided in the first side plate, and a second throttling member staggered from the first vacuum cavity is provided on an outer wall of the first side plate, so that an air-floating surface is formed on the outer wall of the first side plate.

[0020] Furthermore, an air flotation cavity is provided on the third side plate, an air flotation cushion is movably installed in the air flotation cavity, and a third throttling member is provided on the side of the air flotation cushion away from the third side plate, so that the side of the air flotation cushion forms an air flotation surface.

[0021] Furthermore, a sealing ring is provided between the air flotation cushion and the air flotation cavity, and the air flotation cushion can swing relative to the third side plate through deformation of the sealing ring.

[0022] Furthermore, the translation mechanism includes a base plate, a first guide rail assembly and a second guide rail assembly, the first guide rail assembly and the second guide rail assembly are both arranged on the base plate, the base is arranged on the base plate, the first guide rail assembly is arranged opposite to the air flotation surface on the first side plate, and the second guide rail assembly is arranged opposite to the air flotation surface on the air flotation pad.

[0023] Furthermore, the base is mounted on the bottom plate and is provided with a second vacuum chamber inside. The bottom surface of the base is provided with a fourth throttling member staggered from the second vacuum chamber so that the bottom surface of the base forms an air floating surface.

[0024] Furthermore, the translation mechanism also includes a third driving assembly and a fourth driving assembly, the driving end of the third driving assembly is connected to the first side plate, and the driving end of the fourth driving assembly is connected to the third side plate.

[0025] Further, the first guide rail assembly is provided with a second grating, and the first side plate is provided with a second counter for counting in coordination with the second grating; and / or the second guide rail assembly is provided with a third grating, and the third side plate is provided with a third counter for counting in coordination with the third grating.

[0026] Furthermore, a fourth grating is arranged on the first housing, and a fourth counter for counting in cooperation with the fourth grating is arranged on the second housing.

[0027] On the other hand, a wafer processing device is also provided, comprising the wafer carrying device as described above.

[0028] The beneficial effects of the present application are as follows: the device integrates a translation mechanism, a lifting mechanism and a rotation mechanism, and the three are cleverly combined in a nearly coplanar manner, which not only greatly reduces the overall center of gravity of the system, but also effectively reduces the vertical size and mass of the moving parts.

[0029] The translation mechanism constitutes the basic framework of the device. The translation space formed inside it drives the lifting mechanism through the power end to achieve precise displacement of the wafer in the horizontal plane. The lifting mechanism is nested in the translation space and driven by the second drive component, which is responsible for the contactless lifting and lowering of the wafer in the vertical direction. In this process, the lifting cavity inside the lifting mechanism uses the throttling component to accurately control the gas flow to form an air floating surface, so that the first shell of the rotating mechanism and the wafer it carries can achieve smooth and frictionless lifting and lowering movement in the lifting cavity, greatly improving the accuracy and stability of the movement. The rotating mechanism is installed at the lifting end of the lifting mechanism. The first drive component drives the rotating shaft and the carrying platform to rotate. The carrying platform is used to fix the wafer to be inspected. This design allows the wafer to receive all-round scanning from the inspection camera while rotating at high speed, so as to accurately identify the specific information of the defect, including location, area size, etc.

[0030] What is particularly critical is that since the rotating mechanism is embedded in the lifting cavity, the top of the rotating mechanism is almost flush with the top of the lifting mechanism, which greatly reduces the vertical size of the entire device. In addition, an air-floating guide rail is used between the lifting cavity and the first shell to achieve contactless movement, ensuring high-speed and high-frequency precise movement.

[0031] In addition, this device fully adopts air-floating guide rail technology, which not only further improves the system's motion accuracy and positioning accuracy, but also effectively avoids dust and debris pollution that may be generated by traditional mechanical guide rails, ensuring the cleanliness of the wafer inspection environment, which is crucial for the semiconductor manufacturing industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The present application is further described in detail below based on the drawings and embodiments.

[0033] Figure 1 A top view of the wafer carrying device according to an embodiment of the present application;

[0034] Figure 2 A three-dimensional diagram of a wafer carrying device according to an embodiment of the present application;

[0035] Figure 3 A three-dimensional diagram of the rotating mechanism described in the embodiment of the present application;

[0036] Figure 4 A cross-sectional view of the rotating mechanism described in the embodiment of the present application;

[0037] Figure 5 It is a front view of the lifting mechanism described in the embodiment of the present application;

[0038] Figure 6 The three-dimensional structure of the lifting mechanism described in the embodiment of the present application Figure 1 ;

[0039] Figure 7 The third embodiment of the present application is the third embodiment of the second shell Figure 1 ;

[0040] Figure 8 It is an assembly diagram of the translation mechanism and the lifting mechanism described in the embodiment of the present application;

[0041] Fig. 9 It is an assembly cross-sectional view of the translation mechanism and the lifting mechanism described in the embodiment of the present application;

[0042] Fig.10 The three-dimensional structure of the lifting mechanism described in the embodiment of the present application Figure 2 ;

[0043] Fig.11 The third embodiment of the present application is the third embodiment of the second shell Figure 2 .

[0044] In the figure: 1, translation mechanism; 101, bottom plate; 102, first guide rail assembly; 103, second guide rail assembly; 104, third drive assembly; 105, fourth drive assembly; 106, second grating; 107, second counter; 108, third grating; 109, third counter; 110, drive stator; 111, drive mover; 2, lifting mechanism; 201, second housing; 202, second drive assembly; 203, movable Plug hole; 204, air sealing plate; 205, air flotation pad; 206, sealing ring; 207, fourth grating; 208, fourth counter; 209, throttling assembly; 2011, base; 2012, first side plate; 2013, second side plate; 2014, third side plate; 2015, fourth side plate; 2016, first vacuum chamber; 2017, second throttling element; 2018, second vacuum chamber; 2019, fourth throttling element; 20 21. driving motor; 2022. mounting seat; 2023. connecting plate; 2024. second motor stator; 2025. second motor mover; 2051. third throttle; 3. rotating mechanism; 301. first housing; 302. first driving assembly; 303. rotating shaft; 304. first bearing; 305. second bearing; 306. first throttle; 307. third bearing; 308. sealing plate; 309. first grating ; 310, first counter; 311, gas distributor; 312, first gas supply assembly; 313, second gas supply assembly; 314, piston; 3021, first motor stator; 3022, first electronic mover; 3031, through hole; 3041, limiting part; 3051, conducting groove; 3121, rotating joint; 3122, first fixed joint; 3131, gas supply joint; 3132, second fixed joint; 4, carrying platform. DETAILED DESCRIPTION

[0045] In order to make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0046] In the description of this application, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0047] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0048] like Figure 1-Figure 11 As shown, this embodiment provides a wafer carrying device, which includes: a translation mechanism 1, a lifting mechanism 2, a rotation mechanism 3 and a carrying platform 4, the carrying platform 4 is used to install the wafer to be tested, the carrying platform 4 is connected to the rotating end of the rotation mechanism 3, the rotation mechanism 3 is connected to the lifting end of the lifting mechanism 2, a translation space is formed in the translation mechanism 1, the lifting mechanism 2 is arranged in the translation space, and is connected to the power end of the translation mechanism 1;

[0049] The rotating mechanism 3 includes a first shell 301, a first driving component 302 installed in the first shell 301, and a rotating shaft 303 connected to the first driving component 302, and the carrying platform 4 is installed at one end of the rotating shaft 303; the lifting mechanism 2 includes a second shell 201, and a second driving component 202 installed in the second shell 201, the second shell 201 is connected to the power end of the translation mechanism 1, the second driving component 202 is connected to the first shell 301, a lifting cavity matching the first shell 301 is formed in the second shell 201, the lifting cavity is open upward, and a throttling component 209 is provided on the inner wall surface of the lifting cavity so that the inner wall surface of the lifting cavity forms an air floating surface, and the first shell 301 can be lifted up and down without contact in the lifting cavity under the drive of the second driving component 202.

[0050] In the device, the translation mechanism 1 is the basis of the entire wafer carrying device. It provides a translation space that allows the wafer to move in the horizontal plane. This translation space drives the lifting mechanism 2 through the power end of the translation mechanism 1, thereby realizing the position adjustment of the wafer in the X or Y axis direction. The lifting mechanism 2 is arranged in the translation space and connected to the power end of the translation mechanism 1. It includes a second shell 201, in which a second drive component 202 is installed. The second drive component 202 drives the first shell 301 to move up and down in the lifting cavity. The inner wall surface of the lifting cavity is designed with a throttling component 209. These throttling components 209 can achieve contactless air floating lifting in the lifting cavity by precisely controlling the flow of gas. This design not only improves the accuracy and stability of lifting, but also reduces friction and wear, and improves the service life of the system. The rotating mechanism 3 is installed at the lifting end of the lifting mechanism 2, which is responsible for the rotation of the wafer. It includes a first shell 301, in which a first drive component 302 and a rotating shaft 303 are installed. The carrying platform 4 is used to mount the wafer to be inspected and is connected to one end of the rotating shaft 303. When the first driving assembly 302 is started, it drives the rotating shaft 303 and the carrying platform 4 to rotate, thereby realizing the rotation inspection of the wafer.

[0051] Based on the above scheme, by setting the rotating mechanism 3 inside the lifting mechanism 2, and the lifting mechanism 2 inside the translation mechanism 1, a design of three mechanisms close to coplanar is realized. This design reduces the working center of gravity of the system, reduces the size of the system in the vertical direction, and makes the entire wafer carrier more compact and lightweight. Due to the full air-floating guide rail design, the lifting mechanism 2 and the rotating mechanism 3 can achieve contactless movement during the movement process, reducing friction and wear, thereby improving the operation accuracy and positioning accuracy of the entire system, which is crucial for wafer defect detection, because even a small error may lead to deviations in the detection results. The full air-floating guide rail design also brings another benefit, which is to improve the cleanliness of the motion system. Since there is no physical contact between the moving parts, no pollutants such as dust or debris will be generated, which is very important for industries such as semiconductor manufacturing that have extremely high requirements for cleanliness. In addition, by optimizing the structural design and improving the motion accuracy, the wafer carrier can support faster detection speeds and meet the speed and capacity requirements of large-scale industrial production. At the same time, since the system structure is compact and lightweight, it is also convenient for rapid deployment and adjustment in the production line.

[0052] Furthermore, the rotating mechanism 3 includes a first bearing 304 and a second bearing 305, wherein the first bearing 304 is arranged at the upper part of the first housing 301, the second bearing 305 is arranged at the lower part of the first housing 301, the rotating shaft 303 is arranged inside the first bearing 304 and the second bearing 305, and the first throttle 306 is arranged inside the first bearing 304 and the second bearing 305, so that an air film is formed between the contact surface of the first bearing 304 and the rotating shaft 303, and an air film is formed between the contact surface of the second bearing 305 and the rotating shaft 303. In this solution, the rotating mechanism 3 adopts an innovative upper and lower double radial bearing configuration, that is, the first bearing 304 and the second bearing 305 are arranged at the upper part and the lower part of the first housing 301 respectively, and the rotating shaft 303 is precisely installed inside the two bearings. This design not only enhances the stability of the rotating shaft 303, but also significantly improves the overturning stiffness of the rotating shaft 303 system, so that the wafer can maintain extremely high stability and precision during high-speed rotation.

[0053] What is particularly critical is that the first throttle members 306 are carefully configured inside the first bearing 304 and the second bearing 305. These first throttle members 306 can form a stable air film on the contact surface between the first bearing 304 and the rotating shaft 303 and the contact surface between the second bearing 305 and the rotating shaft 303 by precisely regulating the flow of gas. The existence of the air film greatly reduces the direct contact between the rotating shaft 303 and the bearing, thereby significantly reducing friction and wear and extending the service life of the equipment. At the same time, the air film also provides an additional damping effect, further enhancing the stability of the rotating shaft 303.

[0054] The design of the upper and lower double radial bearings not only improves the overturning stiffness of the rotating shaft 303 system, but also enables the rotating mechanism 3 to quickly restore the equilibrium state when subjected to external loads or disturbances, ensuring the high precision and stability of the wafer during the inspection process. This is crucial to improving the accuracy and reliability of wafer defect detection, because even a small deviation may have a significant impact on the inspection results.

[0055] Furthermore, the lower end of the first bearing 304 extends toward the direction of the rotating shaft 303 to form a limiting portion 3041, and the first throttling member 306 is arranged in the limiting portion 3041, so that an air film is formed between the contact surface of the limiting portion 3041 and the rotating shaft 303; at the same time, a third bearing 307 is arranged at the upper end of the first bearing 304, and the rotating shaft 303 passes through the interior of the third bearing 307, and the third bearing 307 is provided with a first air supply channel, and the first air supply channel can supply air to the first throttling member 306 in the first bearing 304, and the first throttling member 306 is arranged in the first air supply channel, so that an air film is formed on the bottom surface of the third bearing 307, and then cooperates with the limiting portion 3041 to limit the axial displacement of the rotating shaft 303. A limiting portion 3041 extends from the lower end of the first bearing 304 toward the rotating shaft 303. The limiting portion 3041 can abut against a partial structure of the rotating shaft 303 for limiting position, and a first throttling member 306 is arranged inside. When the rotating shaft 303 rotates in the bearing, a stable air film can be formed between the contact surface of the limiting portion 3041 and the rotating shaft 303. This air film not only reduces the direct contact between the rotating shaft 303 and the bearing, reduces friction and wear, but also provides an additional damping effect, thereby enhancing the stability of the rotating shaft 303.

[0056] At the same time, a third bearing 307 is also arranged at the upper end of the first bearing 304, and the rotating shaft 303 passes through the interior of the third bearing 307, and a first air supply channel is designed inside the third bearing 307. A first throttling member 306 is also arranged in the first air supply channel, so that a layer of air film is formed on the bottom surface of the third bearing 307 (i.e., the contact surface with the rotating shaft 303), and this layer of air film cooperates with the air film formed by the limiting portion 3041 to jointly limit the axial displacement of the rotating shaft 303, thereby further improving the stability of the rotating shaft 303 system; in addition, the first air supply channel can also stably supply air to the first throttling member 306 in the first bearing 304, so that an air film is formed on the contact surface between the first bearing 304 and the rotating shaft 303. It can be understood that the gas output through the first air supply channel can be supplied to the first bearing 304 and the third bearing 307, so that the contact surfaces of these two bearings with the rotating shaft 303 can form an air film, thereby achieving contact-free operation.

[0057] It is worth mentioning that the first bearing 304 also adopts a design of increasing the shaft diameter (i.e., the limit portion 3041 formed by extension), and its radial dimension is appropriately elongated. Such a design not only improves the radial stiffness and overturning stiffness of the shaft system, but also enables the rotating mechanism 3 to exhibit higher stability and anti-overturning ability when subjected to external loads or disturbances. Moreover, the first bearing 304 also adopts an inner-enclosed structure, which effectively reduces the radial dimension of the overall rotating mechanism 3, not only improving the compactness and integration of the equipment, but also providing a more accurate and stable rotating platform for wafer inspection.

[0058] At the same time, a sealing plate 308 is provided at the upper end of the third bearing 307 to seal the first air supply channel. The design details of the sealing plate 308 are crucial because it ensures that the gas in the first air supply channel can stably and continuously flow to the first throttle 306 in the first air supply channel and the first throttle 306 in the first bearing 304, thereby forming a stable air film between the contact surfaces of the rotating shaft 303 and the two bearings. If the first air supply channel is not effectively sealed, the gas may leak, resulting in unstable formation of the air film, thereby affecting the stability and accuracy of the rotating shaft 303. The design of the sealing plate 308 not only ensures the sealing of the first air supply channel, but also improves the overall structural strength of the rotating mechanism 3. It fits tightly on the upper end of the third bearing 307, effectively preventing gas leakage and intrusion of external impurities, and providing a cleaner and more stable working environment for the rotating mechanism 3.

[0059] Generally speaking, the outer peripheral wall of the rotating shaft 303 is sleeved with a first grating 309, and the sealing plate 308 is provided with a first counter 310 for counting in cooperation with the first grating 309. The first grating 309 is specifically a circular grating, which is sleeved on the outer peripheral wall of the rotating shaft 303 and can rotate synchronously with the rotating shaft 303. The circular grating is a high-precision optical measuring element, which is tightly sleeved on the outer peripheral wall of the rotating shaft 303 and can rotate synchronously with the rotation of the rotating shaft 303. This design ensures that the first grating 309 can reflect the real rotation of the rotating shaft 303 in real time. Among them, it is important that the first grating 309 is arranged at a position close to the table (i.e., the position where the wafer is placed). Such a design helps to reduce the Abbe error, that is, the measurement error caused by the relative position change between the measuring element and the object being measured. In wafer defect detection, the reduction of the Abbe error is crucial to improving the accuracy and reliability of detection, because it can ensure that the rotation value of the rotating shaft 303 is accurately and truly fed back. The first counter 310 cooperating with the first grating 309 is installed on the sealing plate 308. It is responsible for receiving the optical signal from the first grating 309 and converting it into an electrical signal for counting and processing. The first counter 310 can accurately calculate the key parameters such as the rotation angle and rotation speed of the rotating shaft 303, providing reliable data support for wafer defect detection.

[0060] In order to achieve weight reduction while ensuring structural strength and precision, and to improve the output efficiency of the motor, this solution cleverly adopts a hollow rotating shaft 303 structure. Specifically, the interior of the rotating shaft 303 is designed to be hollow, forming a cavity. This design not only significantly reduces the weight of the rotating shaft 303 and reduces the inertial force during rotation, but also helps to optimize the output of the first drive assembly 302. Due to the reduction in the mass of the rotating shaft 303, the energy required by the first drive assembly 302 to drive the rotating shaft 303 is also reduced accordingly, thereby improving the energy efficiency ratio of the first drive assembly 302. At the same time, the design of the hollow rotating shaft 303 does not sacrifice structural strength and precision. By using high-strength materials and precise manufacturing processes, it is ensured that the rotating shaft 303 can still maintain sufficient rigidity and stability when subjected to external loads and disturbances.

[0061] Furthermore, the lower end of the cavity is isolated with a gas separator 311, and a first gas supply component 312 is provided on the gas separator 311, and the air inlet end of the first gas supply component 312 is arranged below the gas separator 311, and the air outlet end is arranged inside the rotating shaft 303 to form a first gas source supply. The lower end of the cavity is isolated with a gas separator 311, and the gas separator 311 plays a key role in gas path distribution. On the gas separator 311, a first gas supply component 312 is provided, and its air inlet end is located below the gas separator 311, and the air outlet end extends to the inside of the rotating shaft 303, so that the first gas supply component 312 can realize precise regulation of the gas path inside the rotating shaft 303 by controlling the inlet and outlet of the gas. When it is necessary to generate a vacuum adsorption force to adsorb the wafer, the first gas supply component 312 can extract air into the cavity inside the rotating shaft 303 through its air outlet end. Since the carrying platform 4 is arranged at the upper end of the rotating shaft 303, when the gas in the cavity is exhausted, a local vacuum area will be formed, and this vacuum area will generate a strong adsorption force on the wafer on the carrying platform 4, thereby ensuring that the wafer can remain stable and motionless during the rotation process. In addition, air can also be transported into the cavity to break the vacuum so that the wafer can be removed.

[0062] Furthermore, a conducting groove 3051 is provided in the second bearing 305, a through hole 3031 connected to the conducting groove 3051 is provided on the rotating shaft 303, and a second air supply component 313 is provided on the second bearing 305, and the air inlet end of the second air supply component 313 is arranged below the second bearing 305, and the air outlet end is connected to the conducting groove 3051, and then air is supplied into the cavity through the through hole 3031 to form a second air source supply. The present invention not only utilizes the cavity inside the rotating shaft 303 and the first air supply component 312 to achieve vacuum adsorption, but also cleverly introduces the second air supply component 313 and the conducting groove 3051 in the second bearing 305 to form a second air source supply system. Specifically, the second bearing 305 is designed with conducting grooves 3051, and these conducting grooves 3051 are connected to the through holes 3031 on the rotating shaft 303. In this way, when the second air supply component 313 is working, its air inlet end sucks gas from the bottom of the second bearing 305, and then sends the gas into the conducting groove 3051 through the air outlet end. Since the conducting groove 3051 is connected to the through hole 3031 on the rotating shaft 303, the gas can smoothly enter the cavity inside the rotating shaft 303. This design allows us to control the air pressure of the cavity inside the rotating shaft 303 through the second air supply component 313. When the wafer needs to be released, the second air supply component 313 can transport air into the cavity, thereby destroying the vacuum area formed before, so that the wafer can be easily removed. This design not only improves the flexibility of the wafer carrier, but also makes the operation of the wafer during rotation and detection more convenient.

[0063] At the same time, since the second air supply component 313 and the guide groove 3051 in the second bearing 305 are independent of the first air supply component 312 and the air distributor 311, they can be controlled separately without interfering with each other. This independent air path control system provides more accurate and reliable air pressure control for the wafer carrier, further improving the accuracy and stability of wafer detection.

[0064] It is worth noting that since the gap between the rotating shaft 303 and the second bearing 305 is very small and the compressed air is discharged from the first throttle member 306 in the second bearing 305, the conducting groove 3051 opened on the second bearing 305 and the through hole 3031 of the rotating shaft 303 can be regarded as a closed space and no air leakage will occur.

[0065] In addition, the first air supply component 312 includes a rotating joint 3121 and a first fixed joint 3122. A slewing bearing is arranged inside the rotating joint 3121 to realize air supply when the air pipe does not rotate with the rotating shaft 303. The first fixed joint 3122 is connected to the air distributor 311 and arranged in the cavity. The second air supply component 313 includes an air supply joint 3131 and a second fixed joint 3132. The air supply joint 3131 is connected to the second bearing 305 and communicates with the conducting groove 3051. The second fixed joint 3132 is connected to the air distributor 311 and arranged in the cavity. The first driving component 302 includes a first motor stator 3021 and a first motor mover. The first motor stator 3021 is fixed to the first housing 301, and the first motor mover is fixed to the rotating shaft 303 to form a complete and accurate driving system.

[0066] In some embodiments, the second shell 201 includes a base 2011, a first side plate 2012, a second side plate 2013, a third side plate 2014 and a fourth side plate 2015. The first side plate 2012, the second side plate 2013, the third side plate 2014 and the fourth side plate 2015 are all arranged on the base 2011, and are sequentially connected around and form a rectangular lifting cavity with the base 2011. The second shell 201 is the main component of the lifting mechanism 2, and its structure includes a base 2011, a first side plate 2012, a second side plate 2013, a third side plate 2014 and a fourth side plate 2015. These side plates are all arranged on the base 2011, and are sequentially connected around and form a rectangular lifting cavity with the base 2011. This design not only makes the structure of the lifting mechanism 2 more stable, but also provides enough space for the embedded rotating mechanism 3. The rotating mechanism 3 is completely embedded in the lifting cavity of the lifting mechanism 2. This design effectively lowers the working center of gravity of the rotating mechanism 3. Since the rotating mechanism 3 is the core component for wafer bearing and rotation, the lowering of its working center of gravity helps to improve the stability and anti-overturning ability of the entire device. At the same time, this design also compresses the overall height of the rotating mechanism 3 and the lifting mechanism 2, making the entire device more compact and lightweight, and easy to install and move on the production line.

[0067] In addition, the inner wall surface of the lifting cavity is provided with a throttling assembly 209, so that the inner wall surface of the lifting cavity forms an air flotation surface. The air flotation surface is a technology that uses gas pressure to support and suspend objects. It can effectively reduce the friction and wear between mechanical parts and improve the operating efficiency and life of the equipment. In this design, the air flotation surface of the lifting mechanism 2 adopts a rectangular full-enclosed structure design. This design not only increases the size of the air flotation surface, improves the stability and carrying capacity of the equipment, but also makes the layout more compact and reasonable.

[0068] It should be noted that the inner wall surface of the lifting cavity includes the inner wall surfaces of the four side plates and the top surface of the base 2011 located in the lifting cavity, that is, all surfaces constituting the lifting cavity are provided with throttling components 209 to form an air flotation surface.

[0069] Specifically, the second driving assembly 202 includes two driving motors 2021, which are symmetrically arranged on the base 2011 and respectively connected to the first housing 301 through the second side plate 2013 and the fourth side plate 2015. The two driving motors 2021 are symmetrically arranged on the base 2011. This symmetrical layout design not only makes the entire lifting mechanism 2 more balanced in force, reduces vibration and noise caused by unbalanced load, but also improves the stability and service life of the device.

[0070] More importantly, the two drive motors 2021 are connected to the first housing 301 through the second side plate 2013 and the fourth side plate 2015 respectively. Such a connection mode enables the output force of the drive motor 2021 to act directly on the first housing 301 of the rotating mechanism 3, thereby achieving effective driving of the rotating mechanism 3. Since the two drive motors 2021 are driven in parallel, they can jointly provide a larger driving force for the rotating mechanism 3, making the entire device more stable and efficient during the lifting and rotation process. In addition, this design of the dual drive motor 2021 driving in parallel also enables the output force to pass through the center of the rotating shaft 303. This means that during the lifting process, the output force of the drive motor 2021 can act more directly on the rotating shaft 303, reducing the torque loss and energy consumption caused by the excessively long lever arm. Therefore, this design not only improves the driving force of the lifting mechanism 2, but also makes the entire device more efficient in energy utilization.

[0071] More specifically, the second driving assembly 202 further includes a mounting seat 2022 and a connecting plate 2023. The mounting seat 2022 is disposed on the base 2011. The driving motor 2021 is mounted on the mounting seat 2022. One end of the connecting plate 2023 is connected to the driving end of the driving motor 2021, and the other end is connected to the first housing 301, that is, the connecting plate 2023 passes through the second side plate 2013 or the fourth side plate 2015 and is connected to the first housing 301. The driving motor 2021 is specifically a voice coil motor, including a second motor stator 2024 and a second motor mover 2025. The second motor stator 2024 is mounted on the mounting seat 2022. The second motor mover 2025 connects the second motor stator 2024 and the connecting plate 2023.

[0072] Furthermore, a piston hole 203 is provided on the base 2011, and the piston hole 203 passes through the base 2011 and is located in the lifting cavity. A piston 314 is provided at the bottom of the first shell 301, and the piston 314 is connected with the piston hole 203 with a clearance fit, and a gas sealing plate 204 is provided at the bottom of the piston hole 203. The piston hole 203 on the base 2011 is a carefully designed structure, which passes through the base 2011 and is located in the lifting cavity, providing a channel for the up and down movement of the piston 314. The piston 314 is provided at the bottom of the first shell 301 and is connected with the piston hole 203 with a clearance fit. This clearance fit design ensures that the piston 314 can move smoothly and stably in the piston hole 203, while reducing friction and wear, and extending the service life of the equipment. When positive pressure is introduced into the bottom of the piston 314, the piston 314 will be subjected to an upward thrust, which can effectively balance the gravity of the first housing 301 and its moving parts. This design enables the lifting mechanism 2 to maintain dynamic balance in the vertical direction, thereby reducing the vibration and offset caused by gravity, and improving the stability and precision of the equipment. The bottom of the piston hole 203 is provided with a sealing plate 204, which is closely connected with the base 2011 to form a structure of the cylinder sealing the piston hole 203. This design ensures that the gas inside the piston hole 203 will not leak into the external environment, and also ensures that the pressure inside the cylinder is stable when the piston 314 moves up and down. The existence of the sealing plate 204 plays a vital role in achieving dynamic balance and precise control in the vertical direction.

[0073] In addition, the voice coil motor is symmetrically arranged and combined with the connection and cooperation between the piston 314 and the piston hole 203 to achieve high-frequency follow-up movement in the vertical direction. The voice coil motor is a linear motor based on the principle of electromagnetic induction, which has the advantages of fast response speed and high movement accuracy. When positive pressure is introduced into the bottom of the piston 314 to balance gravity, the voice coil motor can accurately control the up and down movement speed and position of the piston 314, thereby achieving high-frequency follow-up movement in the vertical direction. This design not only improves the movement accuracy and response speed of the equipment, but also makes the entire device more flexible and efficient in the production and testing process of wafers.

[0074] In particular, a first vacuum chamber 2016 is provided in the first side plate 2012, and a second throttling member 2017 staggered from the first vacuum chamber 2016 is provided on the outer wall of the first side plate 2012, so that the outer wall of the first side plate 2012 forms an air flotation surface; an air flotation cavity is provided on the third side plate 2014, and an air flotation cushion 205 is movably installed in the air flotation cavity, and a third throttling member 2051 is provided on the side of the air flotation cushion 205 away from the third side plate 2014, so that The side of the air-floating cushion 205 forms an air-floating surface; the translation mechanism 1 includes a base plate 101, a first guide rail assembly 102 and a second guide rail assembly 103, the first guide rail assembly 102 and the second guide rail assembly 103 are both arranged on the base plate 101, the base 2011 is arranged on the base plate 101, the first guide rail assembly 102 is arranged opposite to the air-floating surface on the first side plate 2012, and the second guide rail assembly 103 is arranged opposite to the air-floating surface on the air-floating cushion 205.

[0075] In the above scheme, the first side plate 2012 is provided with a first vacuum chamber 2016, and the outer wall surface of the first side plate 2012 is provided with a second throttling member 2017 staggered from the first vacuum chamber 2016, so that the outer wall surface of the first side plate 2012 forms an air-floating surface, and the outer wall surface of the first side plate 2012 is arranged opposite to the side surface of the first guide rail assembly 102, so as to form an air-floating main guide rail. The first vacuum chamber 2016 of the first side plate 2012 generates suction force on the side surface of the first guide rail assembly 102 through negative pressure, and at the same time, the second throttling member 2017 of the first side plate 2012 and the formed air-floating surface jointly generate bearing capacity. This design of simultaneous action of vacuum and positive pressure not only improves the bearing capacity and stability of the air-floating main guide rail, but also makes the entire lifting mechanism 2 move more smoothly and accurately in the horizontal direction. The third side plate 2014 is provided with an air-floating cavity, in which an air-floating cushion 205 is movably installed. A third throttle 2051 is provided on the side of the air-floating cushion 205 away from the third side plate 2014, so that an air-floating surface is formed on the side of the air-floating cushion 205. The air-floating surface is arranged opposite to the side of the second guide rail assembly 103 to form an air-floating guide rail. The flexibility of the air-floating cushion 205 and the precise control of the third throttle 2051 enable the air-floating guide rail to provide additional stability and precision in the horizontal direction.

[0076] In general, by introducing air flotation technology, the friction between the moving parts and the guide rails is reduced by utilizing the gas film effect, achieving smooth and nearly frictionless motion. At the same time, combined with the vacuum preload design, it not only provides a stable bearing capacity for the system, but also effectively eliminates the slight deformation caused by gravity, thereby further improving the operating accuracy of the system, making the wafer carrier more precise and stable in both horizontal and vertical directions. The design of air flotation and vacuum preload allows the use of smaller gaps to achieve stable bearing and motion, which greatly saves space. At the same time, due to the reduction in the need for traditional mechanical support structures, the structural space layout of the entire device is more compact, which is conducive to more complex motion control in a limited space. The key is that a dual-guide master-slave design is adopted, in which the main guide adopts an air flotation + vacuum preload design as the guide surface for operating accuracy, which not only improves the guiding accuracy of the system, but also enhances the bearing capacity of the main guide through vacuum preload, so that it can maintain higher stability in the face of external disturbances. The auxiliary guide rail adopts the piston 314 preload form, and the piston 314 air floating pad 205 provides additional preload force for the main guide rail, thereby further increasing the running stiffness of the main guide rail and ensuring stability and reliability under high-speed and high-precision movement.

[0077] In addition, a sealing ring 206 is provided between the air-floating cushion 205 and the air-floating cavity, and the air-floating cushion 205 can swing relative to the third side plate 2014 through the deformation of the sealing ring 206. The sealing ring 206 can not only prevent gas leakage and ensure the stable operation of the air-floating cushion 205, but more importantly, it allows the air-floating cushion 205 to swing relative to the third side plate 2014 within a small angle range, and this swinging ability is crucial to improving the adaptability and motion accuracy of the system.

[0078] In practical applications, due to various factors in the manufacturing and assembly process, it is inevitable that there is a certain parallelism error between the main rail and the guide rail. Traditional rigid connection structures are often difficult to fully adapt to this error, resulting in instability and reduced precision during movement. However, the small-angle deflection function of the air-floating cushion 205 realized by the sealing ring 206 can make the air-floating surface of the air-floating cushion 205 always keep following the movement of the guide rail surface. This followability can not only effectively absorb the assembly parallelism error between the main rail and the guide rail, but also compensate for the slight deformation caused by factors such as temperature changes and vibrations to a certain extent, thereby ensuring the continuous operation of the system under high precision and high stability.

[0079] In particular, the auxiliary rail adopts a combination of piston 314 preload and sealing ring 206 deformation and swing, which not only improves the adaptability and movement accuracy of the system, but also brings additional beneficial effects, especially in improving the air-floating rigidity of the main rail side and solving the problem of asynchronous operation of dual drives.

[0080] First, the guide rail provides a stable preload force for the main rail through the piston 314 preload design. This preload force not only enhances the load-bearing capacity of the main rail, but also improves its air bearing rigidity. In high-speed, high-precision motion, air bearing rigidity is one of the key factors to ensure system stability and accuracy. Through the piston 314 preload design, the guide rail can effectively provide the necessary support and rigidity for the main rail, enabling it to maintain higher stability and accuracy when facing external disturbances.

[0081] Secondly, the deformation and swinging function of the sealing ring 206 plays an important role in solving the problem of asynchronous operation of the dual drive. In the wafer carrier, the synchronous operation of the dual drive is the basis for ensuring the high-precision and high-stability movement of the system. However, due to various factors in the manufacturing and assembly process, it is inevitable that there is a certain degree of asynchrony between the dual drives. This asynchrony will not only reduce the movement accuracy of the system, but may also cause problems such as vibration and noise. The small-angle deflection function of the air floating pad 205 realized by the sealing ring 206 can compensate for the slight deviation caused by the asynchronous operation of the dual drive to a certain extent, thereby ensuring the continuous operation of the system with high precision and high stability.

[0082] Finally, this design also helps to improve the control servo bandwidth. Servo bandwidth is one of the important indicators to measure the response speed and stability of the control system. In the wafer carrier, improving the servo bandwidth means that the system can respond to external commands and disturbances faster, thereby achieving higher motion accuracy and stability. Through the preload design of the piston 314 of the guide rail and the deformation and swing design of the sealing ring 206, the system can better adapt to the external environment and internal changes, thereby improving the servo bandwidth and the overall performance of the control system.

[0083] Optionally, the base 2011 is mounted on the bottom plate 101, and a second vacuum chamber 2018 is provided inside. The bottom surface of the base 2011 is provided with a fourth throttling member 2019 staggered from the second vacuum chamber 2018, so that the bottom surface of the base 2011 forms an air flotation surface. The base 2011 is firmly mounted on the bottom plate 101, serving as the basic support of the entire lifting mechanism 2. Inside the base 2011, a second vacuum chamber 2018 is carefully designed. This design element echoes the first vacuum chamber 2016 described previously, and together they provide a stable bearing capacity and air flotation effect for the system. The bottom surface of the base 2011 can form an air flotation surface, and a tiny gas film is generated between the air flotation surface and the bottom plate 101, thereby greatly reducing friction and wear. In order to further optimize the air flotation effect, the bottom surface of the base 2011 is provided with a fourth throttle 2019 staggered from the second vacuum chamber 2018. The fourth throttle 2019 is used to adjust the gas flow rate, thereby controlling the thickness and rigidity of the gas film between the base 2011 and the bottom plate 101. By accurately adjusting the size and position of the throttle, it can be ensured that the base 2011 has sufficient flexibility and adaptability while maintaining stability to cope with various complex motion scenes. This design not only improves the bearing capacity of the base 2011, but also makes the movement of the entire lifting mechanism 2 in the vertical direction more stable and accurate. Due to the existence of the air flotation surface, the friction between the base 2011 and the bottom plate 101 is greatly reduced, which helps to reduce energy consumption, vibration and noise, and improve the response speed and accuracy of the system. Moreover, the air flotation surface formed on the bottom surface of the base 2011 can also compensate for the slight deformation caused by manufacturing and assembly errors to a certain extent, thereby improving the stability and reliability of the entire system, so that the wafer bearing device can better adapt to various working environments and conditions, and provide a more reliable and efficient solution for the production and detection of wafers.

[0084] In some embodiments, the translation mechanism 1 further includes a third drive assembly 104 and a fourth drive assembly 105, wherein the drive end of the third drive assembly 104 is connected to the first side plate 2012, and the drive end of the fourth drive assembly 105 is connected to the third side plate 2014. Through the coordinated work of the third drive assembly 104 and the fourth drive assembly 105, the wafer carrier can achieve more precise translational movement in the horizontal direction, so that the wafer carrier can better adapt to various production processes and detection requirements, thereby improving the versatility and flexibility of the equipment. Moreover, the introduction of the third drive assembly 104 and the fourth drive assembly 105 also facilitates fault diagnosis and maintenance of the system. By monitoring the working status and output parameters of the two drive assemblies, potential fault points can be discovered and located in a timely manner, so that corresponding maintenance measures can be taken to ensure the continuous and stable operation of the equipment.

[0085] The third driving assembly 104 and the fourth driving assembly 105 both include a driving stator 110 and a driving mover 111 . The driving stator 110 is connected to the first guide rail assembly 102 , and the driving mover 111 is connected to the first side plate 2012 or the third side plate 2014 .

[0086] Furthermore, the first guide rail assembly 102 is provided with a second grating 106, and the first side plate 2012 is provided with a second counter 107 for counting in cooperation with the second grating 106; and / or the second guide rail assembly 103 is provided with a third grating 108, and the third side plate 2014 is provided with a third counter 109 for counting in cooperation with the third grating 108.

[0087] Based on the above scheme, the second grating 106 disposed on the first rail assembly 102 and the second counter 107 on the second side plate 2013 constitute a first feedback system. When the first side plate 2012 moves along the first rail assembly 102, the second grating 106 will emit precise light signals, and the second counter 107 is responsible for receiving and counting these signals, thereby monitoring and recording the displacement of the first side plate 2012 in real time. This design ensures precise control of the horizontal linear axis movement and improves the positioning accuracy and repeatability of the system.

[0088] Similarly, the third grating 108 on the second rail assembly 103 and the third counter 109 on the third side plate 2014 constitute a second feedback system. Their working principle is similar to that of the first feedback system, but they focus on the displacement of the third side plate 2014. Through the coordinated work of the two feedback systems, the system can more comprehensively grasp the motion state of the wafer carrying platform 4 and achieve more accurate and stable motion control.

[0089] In addition, the design also adopts the design idea of ​​close installation of drive feedback, that is, the drive component and feedback component are installed as close as possible. This design helps to reduce the motion Abbe error, that is, the measurement error caused by the distance between the measurement point and the drive point. By reducing this distance, the system can more accurately reflect the actual motion situation and improve the accuracy and stability of motion control.

[0090] In addition, the design that the driving point of the dual-drive assembly passes through the center of gravity of the translation mechanism 1 is also a highlight of the solution. By setting the driving point of the dual-drive assembly near the center of gravity of the translation mechanism 1, the system can avoid the generation of eccentric loads, thereby ensuring the stability of speed and the linearity of movement. This design not only improves the dynamic performance of the system, but also provides a more reliable and efficient solution for wafer production and testing.

[0091] Furthermore, the first housing 301 is provided with a fourth grating 207, and the second housing 201 is provided with a fourth counter 208 for counting in cooperation with the fourth grating 207. The fourth grating 207 provided on the first housing 301 and the fourth counter 208 provided on the second housing 201 together constitute a feedback system of the rotating mechanism 3. When the rotating mechanism 3 moves up and down, the fourth grating 207 will emit precise light signals, and the fourth counter 208 is responsible for receiving and counting these signals, thereby monitoring and recording the displacement of the rotating mechanism 3 in real time. This single feedback arrangement not only simplifies the structure of the system, but also improves the accuracy and reliability of the feedback signal.

[0092] Crucially, the design sets the layout position of the feedback system at the center of the two symmetrically arranged voice coil motors and close to the stage working position. This layout helps to reduce system errors and improve the accuracy and stability of motion control. Since the feedback system directly reflects the motion state of the rotating mechanism 3, setting it at the drive symmetrical center position can ensure the accuracy and symmetry of the feedback signal, thereby avoiding errors caused by position deviation. At the same time, placing the layout position close to the stage working position also helps to reduce the error accumulation caused by the excessively long transmission chain, further improving the overall performance of the system.

[0093] In addition, this single feedback arrangement has certain flexibility and scalability. As production processes and testing requirements continue to change, the system may need to be adjusted and optimized accordingly. The single feedback arrangement facilitates such adjustments and optimizations, because only local adjustments to the feedback system are needed to achieve overall performance improvements.

[0094] On the other hand, a wafer processing device is also provided, which can be specifically applied to a wafer defect detection process, and includes the wafer carrying device as described above.

[0095] In the description of this article, it should be understood that the terms "upper", "lower", "left", "right", etc., and other directions or positional relationships are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of this application. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0096] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0097] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0098] The technical principles of the present application are described above in conjunction with specific embodiments. These descriptions are only for explaining the principles of the present application and cannot be interpreted as limiting the scope of protection of the present application in any way. Based on the explanations herein, those skilled in the art can think of other specific implementation methods of the present application without creative work, and these methods will fall within the scope of protection of the present application.

Claims

1. A wafer carrying device, characterized in that: include: A translation mechanism (1), a lifting mechanism (2), a rotation mechanism (3) and a carrying platform (4), wherein the carrying platform (4) is used to mount a wafer to be inspected, the carrying platform (4) is connected to the rotating end of the rotation mechanism (3), the rotation mechanism (3) is connected to the lifting end of the lifting mechanism (2), a translation space is formed in the translation mechanism (1), the lifting mechanism (2) is arranged in the translation space and is connected to the power end of the translation mechanism (1); The rotating mechanism (3) comprises a first shell (301), a first driving component (302) installed in the first shell (301), and a rotating shaft (303) connected to the first driving component (302), and the carrying platform (4) is installed at one end of the rotating shaft (303); the lifting mechanism (2) comprises a second shell (201) and a second driving component (202) installed in the second shell (201), the second shell (201) is connected to the power end of the translation mechanism (1), the second driving component (202) is connected to the first shell (301), a lifting cavity matching the first shell (301) is formed in the second shell (201), the lifting cavity is open upward, and a throttling component (209) is provided on the inner wall surface of the lifting cavity so that the inner wall surface of the lifting cavity forms an air floating surface, and the first shell (301) can be lifted up and down in the lifting cavity without contact under the drive of the second driving component (202); The rotating mechanism (3) further comprises a first bearing (304) and a second bearing (305), wherein the first bearing (304) is arranged at the upper part of the first housing (301), and the second bearing (305) is arranged at the lower part of the first housing (301), and the rotating shaft (303) is arranged inside the first bearing (304) and the second bearing (305), and a first throttling member (306) is arranged inside the first bearing (304) and the second bearing (305), so that an air film is formed on the contact surface between the first bearing (304) and the rotating shaft (303), and an air film is formed on the contact surface between the second bearing (305) and the rotating shaft (303); The second shell (201) comprises a base (2011), a first side plate (2012), a second side plate (2013), a third side plate (2014) and a fourth side plate (2015); the first side plate (2012), the second side plate (2013), the third side plate (2014) and the fourth side plate (2015) are all arranged on the base (2011), and are sequentially connected around and connected to the base (2011) to form the rectangular lifting cavity; A first vacuum chamber (2016) is provided in the first side plate (2012), and a second throttling member (2017) staggered from the first vacuum chamber (2016) is provided on the outer wall surface of the first side plate (2012), so that the outer wall surface of the first side plate (2012) forms an air flotation surface; an air flotation cavity is provided on the third side plate (2014), and an air flotation pad (205) is movably installed in the air flotation cavity, and a third throttling member (2051) is provided on the side of the air flotation pad (205) facing away from the third side plate (2014), so that the side surface of the air flotation pad (205) forms an air flotation surface.

2. The wafer carrier device according to claim 1, characterized in that: The lower end of the first bearing (304) extends toward the direction of the rotating shaft (303) to form a limiting portion (3041), and the first throttling member (306) is arranged in the limiting portion (3041) so that an air film is formed on the contact surface between the limiting portion (3041) and the rotating shaft (303); a third bearing (307) is also arranged at the upper end of the first bearing (304), and the rotating shaft (303) passes through the interior of the third bearing (307), and a first air supply channel is arranged in the third bearing (307), and the first throttling member (306) is arranged in the first air supply channel, and the first air supply channel can supply air to the first throttling member (306) in the first bearing (304), so that an air film is formed on the bottom surface of the third bearing (307), and then cooperates with the limiting portion (3041) to limit the axial displacement of the rotating shaft (303).

3. The wafer carrier device according to claim 1, characterized in that: The rotating shaft (303) is hollow inside to form a cavity, and the lower end of the cavity is isolated by an air separator (311). The air separator (311) is provided with a first air supply component (312), and the air inlet end of the first air supply component (312) is arranged below the air separator (311), and the air outlet end is arranged inside the rotating shaft (303) to form a first air source supply; the second bearing (305) is provided with a conducting groove (3051), and the rotating shaft (303) is provided with a through hole (3031) connected to the conducting groove (3051); the second bearing (305) is provided with a second air supply component (313), and the air inlet end of the second air supply component (313) is arranged below the second bearing (305), and the air outlet end is connected to the conducting groove (3051), and then air is supplied to the cavity through the through hole (3031) to form a second air source supply.

4. The wafer carrier device according to any one of claims 1 to 3, characterized in that: The second driving assembly (202) comprises two driving motors (2021), and the two driving motors (2021) are symmetrically arranged on the base (2011), and are respectively connected to the first shell (301) by passing through the second side plate (2013) and the fourth side plate (2015).

5. The wafer carrier device according to claim 4, characterized in that: The base (2011) is provided with a piston hole (203) penetrating the bottom surface; the piston hole (203) is located in the lifting chamber; the bottom of the first shell (301) is provided with a piston (314) which is loosely connected to the piston hole (203); the bottom of the piston hole (203) is also provided with an air sealing plate (204).

6. The wafer carrier device according to claim 4, characterized in that: A sealing ring (206) is provided between the air flotation cushion (205) and the air flotation cavity, and the air flotation cushion (205) can swing relative to the third side plate (2014) through the deformation of the sealing ring (206).

7. The wafer carrying device according to claim 6, characterized in that: The translation mechanism (1) comprises a base plate (101), a first guide rail assembly (102) and a second guide rail assembly (103); the first guide rail assembly (102) and the second guide rail assembly (103) are both arranged on the base plate (101); the base (2011) is arranged on the base plate (101); the first guide rail assembly (102) is arranged opposite to the air-floating surface on the first side plate (2012); and the second guide rail assembly (103) is arranged opposite to the air-floating surface on the air-floating pad (205).

8. The wafer carrier device according to claim 4, characterized in that: The translation mechanism (1) further comprises a third driving assembly (104) and a fourth driving assembly (105), wherein the driving end of the third driving assembly (104) is connected to the first side plate (2012), and the driving end of the fourth driving assembly (105) is connected to the third side plate (2014).

9. A wafer processing equipment, characterized in that: It comprises a wafer carrying device as described in any one of claims 1-8.

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