High-density metal packaging radio frequency assembly and assembling method thereof

Abstract

The invention provides a high-density metal packaging radio frequency assembly and an assembly method thereof, and the assembly method is characterized in that the upper surface of a metal tube shell is provided with an installation region which is through up and down; a PCB (Printed Circuit Board) mounting step is arranged in the mounting area and is used for mounting a PCB; cover plate mounting sinking platforms are respectively arranged on the upper and lower surfaces of the metal tube shell along the edge of the mounting area and are used for mounting the metal cover plate; a radio frequency connector mounting through hole is formed in the side surface of the metal tube shell, and a solder ring mounting hole is formed in the edge of the axial end part of the radio frequency connector mounting through hole; the radio frequency connector is fixedly mounted in the radio frequency connector mounting through hole; chamfers are arranged at the positions, adjacent to the corresponding metal cover plates, of the upper face and the lower face of the metal tube shell. The edge of the metal cover plate is provided with a chamfer; the chamfers on the upper surface and the lower surface of the metal tube shell are respectively assembled with the chamfers on the edges of the corresponding metal cover plates to form a V-shaped sinking groove structure; according to the invention, a reflow soldering mode is adopted for installation and connection, the packaging structure has air tightness, and the reliability of the radio frequency assembly can be significantly improved.

Description

Technical Field

[0001] The invention belongs to the field of radio frequency filtering components, and in particular relates to a high-density metal packaged radio frequency component and an assembly method thereof. Background Art

[0002] RF components refer to miniaturized microwave circuit products that are composed of RF components and other parts, connected to external circuits in the form of coaxial, waveguide or other transmission lines, and can independently perform specific functions in the system. With the development of communication technology, the requirements for miniaturization and integration of products are getting higher and higher. The production and manufacturing process of RF components often involves many processes such as component mounting, circuit board fixing, RF connector installation and cover packaging. In some special application scenarios, RF components are also required to have good sealing properties, which increases the difficulty of product packaging structure and assembly process design.

[0003] Conventional printed circuit boards are mostly installed in metal or ceramic housings after single-sided mounting by screw fastening or conductive adhesive bonding; double-sided mounting welding can effectively increase the board installation density of components, but there are process difficulties in adopting multi-temperature gradient welding. The reflow temperature of the first side often exceeds the temperature resistance limit of the components, which has an adverse effect on the reliability of the product. It is not widely used in actual production.

[0004] The RF connectors used in RF components are mostly assembled by silver paste bonding. Silver paste bonding requires manual coating of silver paste on the RF connector shell, which is then inserted into the shell mounting hole and cured by high-temperature baking. The coating process can easily cause the tube shell to become contaminated, and the bonding strength of the silver paste is not high. During use, the silver paste may become brittle, causing the RF connector to fall off, causing many inconveniences in production and use.

[0005] After the RF component printed circuit board is mounted in the housing, it is usually packaged with a cover plate in the form of screws. This requires that the housing is provided with screw mounting holes and the cover plate has a certain thickness. The packaged product is not airtight. Although the parallel sealing process can achieve product sealing, it has strict restrictions on the size of the product housing and cannot be used for packaging of slightly larger products, so its actual application is relatively limited.

[0006] For the above reasons, single-sided mounting technology is mostly used in the production process of conventional RF components, which has problems such as low component installation density, lack of airtightness, complicated production process and low actual yield rate, which restricts the promotion and application of the product. Summary of the invention

[0007] In order to solve the problems existing in the background technology, the present invention provides a high-density metal-packaged radio frequency component and an assembly method thereof. The installation of a double-sided printed circuit board and a radio frequency connector and the airtight packaging of a metal cover are realized through a frame-type metal shell design. The double-sided mounting of the circuit board is realized by using the same solder (process optimization), and the installation of the circuit board, the radio frequency connector and the tube shell and the airtight packaging of the cover are realized by reflow soldering with low-temperature solder. The production process is simple and the product yield is high. A miniaturized, airtightly packaged and highly reliable radio frequency component is produced, which is suitable for mass production.

[0008] In order to achieve the above technical objectives, one aspect of the present invention provides a high-density metal packaged radio frequency component, comprising: a metal tube shell, a PCB board and a radio frequency connector, the PCB board is mounted on both sides of the components, and a mounting area penetrating from top to bottom is arranged on the top of the metal tube shell; a PCB mounting step and a radio frequency signal shielding rib beam are arranged in the mounting area, and the PCB board is placed on the PCB mounting step; the upper and lower surfaces of the metal tube shell are respectively provided with cover plate mounting sinks along the edges of the mounting area, and a metal cover plate is placed on the cover plate mounting sinks; a radio frequency connector mounting through hole is arranged on the side of the metal tube shell, and a solder ring mounting groove is arranged at the edge of the axial end of the radio frequency connector mounting through hole; the radio frequency connector is fixedly installed in the radio frequency connector mounting through hole; the upper and lower surfaces of the metal tube shell are respectively provided with 45° chamfers adjacent to the corresponding metal cover plates; the edge of the metal cover plate is provided with a 45° chamfer; the chamfers on the upper and lower surfaces of the metal tube shell are respectively assembled with the chamfers at the edges of the corresponding metal cover plates to form a V-shaped sink structure.

[0009] Another aspect of the present invention provides an assembly method of a high-density metal packaged radio frequency component, the assembly method being applied to the high-density metal packaged radio frequency component, comprising:

[0010] S1: PCB board mounting, select the board surface with light weight or small number of components as the first side, and reflow solder the components on the first side of the PCB board with 63Sn37Pb solder; then reflow solder the components on the second side of the PCB board with the same 63Sn37Pb solder;

[0011] S2: Apply low melting point solder paste on the PCB mounting step of the metal tube shell and the solder paste receiving groove of the RF signal shielding rib beam; and use tweezers to install the PCB board into the metal tube shell, and gently press it to make it fully fit with the PCB mounting step;

[0012] S3: inserting the RF connector into the RF connector mounting through hole, installing the solder ring in the solder ring placement hole, and applying adhesive covering the solder ring, the RF connector and the metal tube shell;

[0013] S4: Install the metal cover plate on the cover plate installation sinks on the upper and lower surfaces of the metal tube shell, and place the solder ring in the V-shaped sink structure formed after assembly, and fix it with a clamp after placement;

[0014] S5: Put the product assembled in step S4 into a reflow oven for reflow soldering. After soldering is completed, remove the fixture to obtain an assembled RF component.

[0015] The present invention has at least the following beneficial effects

[0016] The invention reduces the weight of the radio frequency component through the design of a frame-type metal shell; the arrangement of the internal PCB installation step and the radio frequency signal shielding rib beam ensures the installation of the double-sided mounted PCB board; the radio frequency connector is installed on the side wall of the metal shell, and the inner lead thereof is overlapped on the pads on the upper and lower surfaces of the printed circuit board, thereby ensuring the lead-out of the radio frequency signal; the cover plate is sealed by reflow soldering, thereby realizing the production of miniaturized, high-density and high-reliability radio frequency components.

[0017] During assembly and manufacturing, the present invention realizes double-sided mounting of a PCB board using the same solder of 63Sn37Pb by means of an adhesive process, thereby avoiding the risk of component damage caused by excessively high reflow temperature of heterogeneous solders.

[0018] By spot-coating low-melting-point solder on the shell step and using adhesives and reflow tooling, the assembly and packaging of the PCB board, RF connector and double-sided cover are achieved, which greatly simplifies the component production and manufacturing process, has a high yield rate, and meets mass production needs. At the same time, by placing a solder ring in the V-shaped sink groove structure formed after assembly, the metal cover plate and the metal shell are welded by the solder ring in the V-shaped sink groove structure, and the RF connector and the metal shell are welded by the solder ring in the solder ring placement hole, so as to ensure the airtight packaging of the RF component.

[0019] In summary, through the formulation of the above scheme, the production process of the present invention is simple, the product yield is high, and a miniaturized, airtightly packaged, high-reliability RF component is produced, which is suitable for mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the assembly structure of the present invention;

[0021] Figure 2 It is a structural schematic diagram of the metal tube shell of the present invention;

[0022] Figure 3 It is a schematic diagram of the assembly structure of the radio frequency connector of the present invention. DETAILED DESCRIPTION

[0023] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the following embodiments only illustrate the basic concept of the present invention in a schematic manner, and the following embodiments and features in the embodiments can be combined with each other without conflict.

[0024] Among them, the drawings are only used for illustrative explanations, and they only represent schematic diagrams rather than actual pictures, and should not be understood as limitations on the present invention. In order to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of actual products. For those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0025] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "front", "rear", etc. indicate the orientation or position relationship, they are based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting the present invention. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0026] See also Figure 1 to Figure 3 According to one aspect of the present invention, a high-density metal packaged radio frequency component is provided, comprising: a metal tube shell, a PCB board and a radio frequency connector, wherein the PCB board is double-sidedly mounted with components, and an installation area penetrating from top to bottom is provided on the top of the metal tube shell; a PCB installation step and a radio frequency signal shielding rib beam are provided in the installation area, and the PCB board is placed on the PCB installation step; a cover plate installation sink is provided along the edge of the installation area on the upper and lower surfaces of the metal tube shell, and a metal cover plate is placed on the cover plate installation sink; a radio frequency connector installation through hole is provided on the side of the metal tube shell, and a solder ring installation groove is provided at the edge of the axial end of the radio frequency connector installation through hole; the radio frequency connector is fixedly installed in the radio frequency connector installation through hole; a 45° chamfer is provided at the upper and lower surfaces of the metal tube shell adjacent to the corresponding metal cover plate; a 45° chamfer is provided at the edge of the metal cover plate; the chamfers on the upper and lower surfaces of the metal tube shell are respectively assembled with the chamfers at the edge of the corresponding metal cover plate to form a V-shaped sink structure.

[0027] Preferably, a positioning plug is provided at the axial bottom of the RF connector mounting hole to prevent the RF connector from being inserted too deeply; when installing the RF connector, the positioning plug provided at the axial bottom of the mounting hole and the external end are used to achieve positioning during the installation process by using a spot-coated adhesive.

[0028] Preferably, a solder paste receiving groove is provided on the RF signal shielding rib beam and the PCB installation step, and the components, PCB board, metal tube shell, cover plate, and RF connector are all installed and connected by reflow soldering to achieve the airtightness of the packaging structure.

[0029] In this embodiment, the frame-type metal tube shell is provided with a PCB board installation step on it; the side of the metal tube shell is provided with an RF connector installation through hole; the upper and lower surfaces of the metal tube shell are respectively provided with a cover plate installation sink along the edge of the installation area for the installation of the cover plate. There are chamfered sink grooves at the edge of the shell and the cover plate, which form a V-shaped sink groove structure after assembly to accommodate the solder paste applied by the cover plate package. The recommended V-shaped sink groove structure width is 2 to 4 mm, and the depth is equal to the thickness of the cover plate; the metal tube shell is made of Kovar, stainless steel, aluminum and other materials, with nickel or gold plating on the surface, and good solderability should be maintained. It is provided with a PCB board installation step and an RF connector installation through hole, and the PCB board installation step is 1 to 3 mm wide, which is used to apply solder paste and install the PCB board. Among them, a solder accommodating shallow groove should be opened on the PCB board installation step, the groove width is 1 / 2 the width of the PCB board installation step, and the depth is 0.5 to 1 mm to accommodate the applied solder paste.

[0030] The depth of the RF connector installation through hole is the same as the length of the RF connector shell, and the aperture is generally 0.05 to 0.15 mm larger than the RF connector shell. The RF connector installation through hole has the same appearance as the RF connector and should maintain a good fit. A positioning plug is provided at the bottom of the axial end to prevent the RF connector from being inserted too deeply, and a solder ring installation groove is provided at the end.

[0031] The solder ring of the RF connector end has a width of 0.3 to 0.5 mm and a thickness of 0.2 to 0.3 mm, and the surface is pre-prepared with flux. The size of the solder ring placement hole is the same as that of the corresponding solder ring, and has a positive tolerance.

[0032] Ground pads are provided around the contact mounting surface between the PCB and the metal shell for reflow soldering with the PCB mounting step. The width of the ground pad should be 1mm greater than the width of the PCB mounting step to accommodate the overflow solder after the solder melts, forming a weld with the side wall of the metal shell, improving the mounting strength of the PCB, and avoiding the generation of tin slag and tin beads.

[0033] An extended RF signal shielding rib beam structure is arranged inside the metal tube shell, and a grounding pad is arranged on the corresponding PCB board. When the PCB board is installed, solder paste is applied and reflow soldering is performed simultaneously to improve the grounding and signal shielding functions of the RF component, and also enhance the structural strength of the RF component.

[0034] The metal cover installation fixture is a spring clamping structure, such as a long tail clip. It is easy to use and has strong applicability to products of different sizes. It can apply pressure to the four corners of the upper and lower covers respectively, ensuring the flatness of the upper and lower covers and the shell installation, and improving the qualified rate of the packaging airtightness.

[0035] Another aspect of the present invention provides an assembly method of a high-density metal packaged radio frequency component, the assembly method being applied to the high-density metal packaged radio frequency component, comprising:

[0036] S1: PCB board mounting, select the board surface with light weight or small number of components as the first side, and reflow solder the components on the first side of the PCB board with 63Sn37Pb solder; then reflow solder the components on the second side of the PCB board with the same 63Sn37Pb solder;

[0037] Preferably, before reflow soldering of the components on the second side of the PCB board, the junction between the overweight component body with a mass greater than 2g on the first side of the PCB board and the printed circuit board is reinforced by patch red glue or spot epoxy glue.

[0038] Preferably, the peak temperature of the reflow curve during PCB mounting is 40-60°C higher than the melting point of the solder paste and is maintained for 40-70s; the heating rate does not exceed 4°C / s at any time, and the cooling rate does not exceed 5°C / s during the cooling stage.

[0039] In this embodiment, 63Sn37Pb solder is used on both sides of the PCB board for reflow soldering. Before the second side is reflowed, conventional components can be kept in the mounted state by the solder adhesion. The overweight components (>2g) on ​​the first side should be reinforced with patch red glue or spot epoxy glue to avoid component falling off during reflow. The red glue does not need to be baked and cured in advance. It can be cured automatically during the reflow process of the reflow curve described in this article.

[0040] The peak temperature of the reflow curve is 40 to 60°C higher than the melting point of the solder paste and is maintained for 40 to 70 seconds. The heating rate does not exceed 4°C / s at any time, and the cooling rate does not exceed 5°C / s during the cooling stage.

[0041] It is recommended to use an eight-temperature zone hot air reflow oven for reflow. Reflow temperature zone parameter settings: 150℃, 120℃, 155℃, 160℃, 170℃, 180℃, 206℃, 235℃; transmission rate: 62cm / min.

[0042] S2: Apply low melting point solder paste on the PCB mounting step of the metal tube shell and the solder paste receiving groove of the RF signal shielding rib beam; and use tweezers to install the PCB board into the metal tube shell, and gently press it to make it fully fit with the PCB mounting step;

[0043] Preferably, the low melting point solder paste includes: SnAg, InSn or SnBi.

[0044] S3: insert the RF connector into the RF connector mounting through hole, install the solder ring (SnAg, InSn, SnBi, etc.) in the solder ring placement hole, and apply adhesive covering the solder ring, the RF connector and the metal shell;

[0045] Preferably, after step S2 is completed, the connection points of the RF connector and the PCB pad are soldered with SAC305 solder, and the soldering iron temperature is 350° C. The adhesive such as patch red glue is applied to cover the solder ring, the RF connector and the metal shell to prevent the RF connector and the solder ring from shifting or falling off during the reflow process.

[0046] In this embodiment, the RF connector adopts the pre-set solder ring method due to its small size, and the PCB board and the cover board are reflow soldered by applying solder paste in the solder tank. After the PCB board is placed, SAC305 solder should be used to solder the connection points between the PCB board and the lead pins in the RF connector to avoid displacement of the RF lead pins and the printed circuit board during the reflow process.

[0047] S4: Install the metal cover plate on the cover plate installation sinks on the upper and lower surfaces of the metal tube shell, and place the solder ring in the V-shaped sink structure formed after assembly, and fix it with a clamp after placement;

[0048] S5: Put the product assembled in step S4 into a reflow oven for reflow soldering. After soldering is completed, remove the fixture to obtain an assembled RF component.

[0049] Preferably, the peak temperature in the reflow soldering in step S5 does not exceed 185° C., and the reflow chain speed is lower than the reflow chain speed during PCB board mounting.

[0050] Preferably, when the adhesive in step S3 is red glue, after the reflow soldering in step S5 is completed, the RF component is placed on a 120° C. heating table to fully preheat the metal shell, and then the softened red glue in step S3 is scraped off with a blade.

[0051] In this embodiment, the design of the fixture is adopted to realize the installation of the RF connector and the airtight packaging of the double-sided cover plate by one-time reflow soldering. The RF connector is fixed by red glue, that is, the adhesive covering the solder ring, the RF connector and the metal shell is spot-coated to avoid the displacement of the lead pin or the solder sheet during the reflow soldering process.

[0052] In this embodiment, the reflow curve setting of step S5 should ensure that the low melting point solder is fully melted while avoiding the remelting of the solder joints of the double-sided mounted components of the PCB board. In addition, due to the large heat capacity of the PCB board and the metal tube shell, the peak temperature during the reflow soldering process is kept at no more than 185°C, and the reflow chain speed is appropriately reduced to ensure that the solder can be melted well. It is recommended to use an eight-temperature zone hot air reflow furnace for reflow. Reflow temperature zone parameter settings: 95°C, 115°C, 130°C, 145°C, 155°C, 175°C, 180°C, 185°C; transmission rate: 45cm / min.

[0053] This embodiment also includes: performing weld appearance inspection and air tightness inspection on the manufactured RF components. The solder should be well melted, bright and wet; the welds at the junction of the RF connector, cover plate and metal shell should be continuous and free of defects; and the packaged products are placed in fluorine oil for leak detection, marking the leaking points of poor packaging.

[0054] Use an electric soldering iron or hot air blower to heat and melt the solder wire to repair the poor packaging leakage points marked on the packaging structure, and inspect them again after the repair is completed.

[0055] After assembly is completed, the weld appearance inspection and component air tightness inspection processes are set up to repair the packaging leakage points to ensure the air tightness of the product.

[0056] In summary, the present invention reduces the weight of the RF component through the design of a frame-type metal shell; the setting of the internal PCB installation step ensures the installation of the double-sided PCB board; the RF connector is installed on the side wall of the metal shell, and its internal leads are overlapped on the pads on the upper and lower surfaces of the printed circuit board to ensure the lead-out of the RF signal; the cover plate is sealed by reflow soldering, thereby realizing the production of miniaturized, high-density, and high-reliability RF components.

[0057] During assembly and manufacturing, the present invention realizes double-sided mounting of a PCB board using the same solder of 63Sn37Pb by means of an adhesive process, thereby avoiding the risk of component damage caused by excessively high reflow temperature of heterogeneous solders.

[0058] By spot-coating low-melting-point solder on the shell step and using adhesives and reflow tooling, the assembly and packaging of the PCB board, RF connector and double-sided cover are achieved, which greatly simplifies the component production and manufacturing process, has a high yield rate, and meets mass production needs. At the same time, by placing a solder ring in the V-shaped sink groove structure formed after assembly, the metal cover plate and the metal shell are welded by the solder ring in the V-shaped sink groove structure, and the RF connector and the metal shell are welded by the solder ring in the solder ring placement hole, so as to ensure the airtight packaging of the RF component.

[0059] In summary, through the formulation of the above scheme, the production process of the present invention is simple, the product yield is high, and a miniaturized, airtightly packaged, high-reliability RF component is produced, which is suitable for mass production.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution, which should be included in the scope of the claims of the present invention.

Claims

1. A high-density metal packaged radio frequency component, characterized in that: include: A metal tube shell, a PCB board and a radio frequency connector, wherein components are mounted on both sides of the PCB board, and an installation area penetrating from top to bottom is arranged on the top of the metal tube shell; a PCB installation step and a radio frequency signal shielding rib beam are arranged in the installation area, and the PCB board is placed on the PCB installation step; cover plate installation sinks are arranged along the edges of the installation area on the upper and lower surfaces of the metal tube shell, and a metal cover plate is placed on the cover plate installation sink; a radio frequency connector installation through hole is arranged on the side of the metal tube shell, and a solder ring installation groove is arranged at the edge of the axial end of the radio frequency connector installation through hole; the radio frequency connector is fixedly installed in the radio frequency connector installation through hole; 45° chamfers are arranged on the upper and lower surfaces of the metal tube shell at positions adjacent to the corresponding metal cover plates; a 45° chamfer is arranged at the edge of the metal cover plate; the chamfers on the upper and lower surfaces of the metal tube shell are assembled with the chamfers on the edges of the corresponding metal cover plates to form a V-shaped sink structure.

2. A high-density metal packaged radio frequency component according to claim 1, characterized in that: A positioning plug is provided at the axial bottom of the RF connector mounting through hole; during installation, the RF connector is positioned during installation by using the positioning plug provided at the axial bottom of the mounting through hole and the external end with a dotted adhesive.

3. The high-density metal packaged radio frequency component according to claim 1, characterized in that: A solder paste receiving groove is provided on the radio frequency signal shielding rib beam and the PCB installation step, and the components, PCB board, metal tube shell, cover plate, and radio frequency connector are all installed and connected by reflow soldering to achieve the air tightness of the packaging structure.

4. A method for assembling a high-density metal packaged radio frequency component, the method being applied to a high-density metal packaged radio frequency component as claimed in any one of claims 1 to 3, characterized in that: include: S1: PCB board mounting, select the board surface with light weight or small number of components as the first side, and reflow solder the components on the first side of the PCB board with 63Sn37Pb solder; then reflow solder the components on the second side of the PCB board with the same 63Sn37Pb solder; S2: Apply low melting point solder paste on the PCB mounting step of the metal tube shell and the solder paste receiving groove of the RF signal shielding rib beam; and use tweezers to install the PCB board into the metal tube shell, and gently press it to make it fully fit with the PCB mounting step; S3: inserting the RF connector into the RF connector mounting through hole, installing the solder ring in the solder ring placement hole, and applying adhesive covering the solder ring, the RF connector and the metal tube shell; S4: Install the metal cover plate on the cover plate installation sinks on the upper and lower surfaces of the metal tube shell, and place the solder ring in the V-shaped sink structure formed after assembly, and fix it with a clamp after placement; S5: Put the product assembled in step S4 into a reflow oven for reflow soldering. After soldering is completed, remove the fixture to obtain an assembled RF component.

5. The method for assembling a high-density metal packaged radio frequency component according to claim 4, characterized in that: Before reflow soldering the components on the second side of the PCB, the heavy components with a mass greater than 2g on the first side of the PCB and the junction of the printed circuit board are reinforced with patch red glue or spot epoxy glue.

6. The method for assembling a high-density metal packaged radio frequency component according to claim 4, characterized in that: When the PCB board is mounted, the peak temperature of the reflow curve is 40 to 60° C. higher than the melting point of the solder paste and maintained for 40 to 70 seconds; the heating rate does not exceed 4° C. / s at any time, and the cooling rate does not exceed 5° C. / s in the cooling stage.

7. The method for assembling a high-density metal packaged radio frequency component according to claim 4, characterized in that: The low melting point solder paste includes: SnAg, InSn or SnBi.

8. The method for assembling a high-density metal packaged radio frequency component according to claim 4, characterized in that: After step S2 is completed, the connection points between the RF connector and the PCB pad are soldered using SAC305 solder.

9. The method for assembling a high-density metal packaged radio frequency component according to claim 4, characterized in that: In the reflow soldering of step S5, the peak temperature does not exceed 185° C., and the reflow chain speed is lower than the reflow chain speed during PCB board mounting.

10. The method for assembling a high-density metal packaged radio frequency component according to claim 4, characterized in that: When the adhesive in step S3 is red glue, after the reflow soldering in step S5 is completed, the RF component is placed on a 120° C. heating table to fully preheat the metal shell, and then the softened red glue in step S3 is scraped off with a blade.

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