Heat dissipation device

Abstract

The invention discloses a heat dissipation device which comprises a shell, and an inner cavity of the shell comprises a heat absorption cavity wall and a cooling cavity wall which are opposite in the first direction and arranged in a spaced mode. The number of the supporting plates is multiple, the two ends, in the first direction, of each supporting plate are connected with the heat absorption cavity wall and the cooling cavity wall correspondingly, and the supporting plates divide an inner cavity of the shell into at least one migration cavity; and the capillary structure layer covers the heat absorption cavity wall, the cooling cavity wall and the surface of the supporting plate, and cooling liquid is stored in the capillary structure layer on the heat absorption cavity wall. According to the heat dissipation device, a plurality of supporting columns in the prior art are replaced with the supporting plates, on the premise that the supporting strength of the supporting plates to the shell is guaranteed, the contact area between the supporting plates and the wall of the heat absorption cavity is small, the contact area between cooling liquid and the wall of the heat absorption cavity is increased, and the heat dissipation efficiency of the heat dissipation device is improved.

Description

Technical Field

[0001] The invention relates to the field of thermal management equipment, and in particular to a heat dissipation device. Background Art

[0002] Vapor Chamber is a highly efficient heat dissipation device, widely used in electronic equipment, computer processors, LED lighting, communication equipment and other fields that require efficient heat dissipation. The vapor chamber transfers heat through the internal working fluid during evaporation and condensation to achieve efficient heat diffusion and uniform temperature distribution. The basic structure of the vapor chamber includes a sealed cavity with capillary structures and cooling fluid distributed inside the cavity. When the heat source heats one side of the vapor chamber, the cooling fluid evaporates on that side and condenses in the cooling area to release heat, thereby achieving rapid heat transfer and uniform distribution.

[0003] In order to ensure that the temperature equalizing plate has sufficient structural strength and to avoid squeezing the equipment that needs heat dissipation due to deformation of the temperature equalizing plate, the temperature equalizing plate in the prior art is provided with a plurality of support columns in the cavity, thereby improving the structural strength of the temperature equalizing plate. However, the support columns occupy a large area of ​​the inner wall of the cavity close to the heat source, which reduces the contact area between the cooling fluid and the corresponding area of ​​the heat source, thereby reducing the heat dissipation efficiency. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a heat dissipation device, which replaces a plurality of support columns in the prior art with support plates, and on the premise of ensuring the support strength of the support plate to the shell, reduces the contact area between the support plate and the wall of the heat absorption cavity, increases the contact area between the coolant and the wall of the heat absorption cavity, and improves the heat dissipation efficiency of the heat dissipation device.

[0005] An embodiment of the present invention provides a heat dissipation device, comprising: a shell, the inner cavity of the shell comprising a heat absorption cavity wall and a cooling cavity wall that are opposite to and spaced apart along a first direction; a support plate, the support plates being multiple, each of the support plates being connected to the heat absorption cavity wall and the cooling cavity wall at two ends along the first direction, respectively, and the support plates dividing the inner cavity of the shell into at least one migration cavity; a capillary structure layer covering the heat absorption cavity wall, the cooling cavity wall and the surface of the support plate, wherein the capillary structure layer on the heat absorption cavity wall stores cooling liquid.

[0006] In the heat dissipation device of the present invention, the outer wall of one side of the shell with the heat absorption cavity wall is in contact with the heat source, the heat emitted by the heat source is conducted to the heat absorption cavity wall, the cooling liquid on the heat absorption cavity wall evaporates and absorbs heat under the action of the heat on the heat absorption cavity wall, and is converted into steam, the steam migrates in the migration cavity, moves to the cooling cavity wall, condenses and dissipates heat. By replacing the multiple support columns of the prior art with support plates, under the premise of ensuring the support strength of the support plate to the shell, the contact area between the support plate and the heat absorption cavity wall is small, and the contact area between the cooling liquid and the heat absorption cavity wall is increased, so that the heat dissipation efficiency is improved.

[0007] In some embodiments, the heat absorption cavity wall has a heat conduction area, and the plurality of support plates are disposed in the heat conduction area.

[0008] According to some embodiments of the present invention, the plurality of support plates include a first support group, the first support group includes a plurality of first support plates disposed in the center of the heat transfer area, and the plurality of first support plates are staggered.

[0009] According to some embodiments of the present invention, the plurality of support plates further include a second support group, and the second support group includes a plurality of second support plates distributed around the first support group.

[0010] According to some embodiments of the present invention, the heat transfer area includes a plurality of corners, each of the corners is provided with at least two second support plates, and at least two of the second support plates are parallel or intersecting.

[0011] According to some embodiments of the present invention, the second support plate is spaced apart from the first support plate, or the second support plate intersects with the first support plate.

[0012] According to some embodiments of the present invention, a third support plate is further included, wherein the third support plate is disposed between the first support plate and the second support plate, and the third support plate is parallel to the second support plate.

[0013] According to some embodiments of the present invention, the capillary structure layer is at least one of a copper powder sintering structure, a groove structure and a wire mesh woven structure.

[0014] According to some embodiments of the present invention, the capillary structure layer of the heat absorption cavity wall is provided with a thinning area, and at least a part of the structure of the thinning area overlaps with the heat conduction area.

[0015] According to some embodiments of the present invention, at least a portion of the structure of the heat absorption cavity wall is recessed away from the cooling cavity wall along the first direction to form a groove, and a portion of the bottom wall of the groove constitutes a heat conduction area of ​​the heat absorption cavity wall, and the capillary structure layer includes the thinning area and the thickening area arranged in the groove, and the thickening area surrounds the circumference of the thinning area.

[0016] According to some embodiments of the present invention, the capillary structure layer on the cooling cavity wall includes a first sub-region and a second sub-region surrounding the first sub-region, the first sub-region is opposite to the heat conduction region along the first direction, and the thickness of the first sub-region is greater than the thickness of the second sub-region.

[0017] According to some embodiments of the present invention, a guide groove is provided on the wall of the heat absorption cavity, and the guide groove passes through the heat conduction area.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is a schematic diagram of the internal structure of a heat dissipation device according to an embodiment of the present invention;

[0021] Figure 2 is one of the schematic diagrams of the arrangement of the support plate according to the embodiment of the present invention;

[0022] Figure 3 is a second schematic diagram of the arrangement of the support plate according to an embodiment of the present invention;

[0023] Figure 4 Schematic diagram 3 of the arrangement of the support plate according to the embodiment of the present invention;

[0024] Figure 5 is a fourth schematic diagram of the arrangement of the support plate according to an embodiment of the present invention;

[0025] Figure 6 It is a schematic diagram of the internal structure of a heat dissipation device according to another embodiment of the present invention.

[0026] Reference numerals:

[0027] 100- heat dissipation device;

[0028] 110-shell; 111-heat absorption cavity wall; 111a-heat conduction area; 112-cooling cavity wall; 113-migration cavity; 114-groove; 115-guiding groove;

[0029] 120-support plate; 121-first support group; 121a-first support plate; 122-second support group; 122a-second support plate; 123a-third support plate;

[0030] 130 - capillary structure layer; 131 - thinning area; 132 - thickening area; 133 - first sub-area; 134 - second sub-area. DETAILED DESCRIPTION

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] In order to ensure that the temperature equalizing plate has sufficient structural strength and to avoid squeezing the equipment that needs heat dissipation due to deformation of the temperature equalizing plate, the temperature equalizing plate in the prior art is provided with a plurality of support columns in the cavity, thereby improving the structural strength of the temperature equalizing plate. However, the support columns occupy a large area of ​​the inner wall of the cavity close to the heat source, which reduces the contact area between the cooling fluid and the corresponding area of ​​the heat source, thereby reducing the heat dissipation efficiency of the heat dissipation device.

[0033] In view of this, the present invention provides a heat dissipation device, which replaces multiple support columns in the prior art with support plates. On the premise of ensuring the supporting strength of the support plate to the shell, the contact area between the support plate and the wall of the heat absorption chamber is small, and the contact area between the coolant and the wall of the heat absorption chamber is increased, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0034] Reference below Figures 1 to 6 , describing a heat dissipation device 100 according to an embodiment of the present invention, the heat dissipation device 100 can be used to cool electronic devices, computer processors, LED lighting, communication equipment and the like.

[0035] refer to Figure 1 and Figure 6 The heat dissipation device 100 may include a housing 110 , a support plate 120 and a capillary structure layer 130 .

[0036] The housing 110 defines an inner cavity, which is used to accommodate the support plate 120 and the capillary structure layer 130 of the heat dissipation device 100. The inner cavity may include a first direction (eg Figure 1 The heat absorbing cavity wall 111 and the cooling cavity wall 112 are opposite to each other in the X direction (as shown in the figure), and the heat absorbing cavity wall 111 and the cooling cavity wall 112 are arranged at intervals.

[0037] There may be multiple support plates 120, and the two ends of each support plate 120 along the first direction are respectively connected to the heat absorption cavity wall 111 and the cooling cavity wall 112. The support plate 120 divides the inner cavity of the shell 110 into at least one migration cavity 113. For example, the support plate 120 and the inner cavity may not intersect in the direction perpendicular to the first direction, and the entire inner cavity forms a migration cavity 113. Alternatively, multiple support plates 120 may be connected end to end to form a support plate group, and the support plates 120 located at the head and tail ends of the support plate group in the direction perpendicular to the first direction are respectively connected to the shell 110, dividing the inner cavity into two migration cavities 113; of course, there may be multiple support plate groups formed, and the support plates 120 located at the head and tail ends of the multiple support plate groups in the direction perpendicular to the first direction are respectively connected to the shell 110, so that the inner cavity is divided into multiple migration cavities 113. Among them, the specific number of migration cavities 113 can be selected by designers according to needs, and the present invention does not limit this.

[0038] The capillary structure layer 130 can cover the heat absorption cavity wall 111, the cooling cavity wall 112 and the surface of the support plate 120, and the capillary structure layer 130 on the heat absorption cavity wall 111 stores cooling liquid. The cooling liquid is heated and evaporated on the surface of the heat absorption cavity wall 111 to form steam. Under the action of transpiration, the steam flows through the migration cavity 113 and flows through the cooling cavity wall 112, and condenses and converts into liquid on the cooling cavity wall 112. The capillary structure layer 130 is a material layer with tiny pores or channels, which can absorb and transmit liquid through capillary action. Under the capillary action of the capillary structure layer 130, the liquid cooling liquid flows back to the heat absorption cavity wall 111, and the evaporation-condensation process is circulated, so that the heat dissipation device 100 plays a heat dissipation role.

[0039] In the heat dissipation device 100 of the present invention, the outer wall of one side of the housing 110 with the heat absorption cavity wall 111 is in contact with the heat source, and the heat emitted by the heat source is conducted to the heat absorption cavity wall 111. The cooling liquid on the heat absorption cavity wall 111 absorbs heat and evaporates under the action of the heat on the heat absorption cavity wall 111, and is converted into steam. The steam migrates in the migration cavity 113 and moves to the cooling cavity wall 112, condensing and dissipating heat. By replacing the multiple support columns of the prior art with the support plate 120, under the premise of ensuring the support strength of the support plate 120 on the housing 110, the contact area between the support plate 120 and the heat absorption cavity wall 111 is small, and the contact area between the cooling liquid and the heat absorption cavity wall 111 is increased, thereby improving the heat dissipation efficiency.

[0040] refer to Figure 1 and Figure 6 In some embodiments, the heat absorption cavity wall 111 has a heat conduction area 111 a , and the plurality of support plates 120 are all disposed in the heat conduction area 111 a .

[0041] When the heat sink 100 is in use, the heat conduction area 111a is in contact with the heat source, which may be a high-precision component (such as a chip). The support plate 120 is disposed in the heat conduction area 111a, which can ensure that the heat conduction area 111a of the heat sink 100 has sufficient structural strength to prevent the heat sink 100 from being deformed by heat and thus being squeezed and damaged by the heat source. At the same time, since the capillary structure layer 130 is disposed on the support plate 120, and the support plate 120 is disposed in the heat conduction area 111a, the coolant flows back to the heat conduction area 111a through the capillary structure layer 130 on the support plate 120, thereby improving the heat dissipation efficiency of the heat sink 100. In addition, the heat of the heat source can be conducted to the support plate 120 through the heat conduction area 111a, and the side wall area of ​​the support plate 120 is large, which increases the heat dissipation area and further improves the heat dissipation efficiency of the heat sink 100.

[0042] refer to Figures 2 to 6 According to some embodiments of the present invention, the plurality of support plates 120 may include a first support group 121, the first support group 121 may include a plurality of first support plates 121a, and the plurality of first support plates 121a are arranged in the center of the heat transfer area 111a. The arrangement of the plurality of first support plates 121a may be a staggered arrangement of the plurality of first support plates 121a, so that the efficiency of heat conduction from the heat transfer area 111a to the support plate 120 is high, and the staggered arrangement of the first support plates 121a may also provide more heat conduction paths, so that heat is quickly transferred from the heat source to the inside of the heat dissipation device 100, thereby improving the overall thermal conductivity of the heat dissipation device 100. Of course, the plurality of first support plates 121a may also be arranged around the central axis of the heat transfer area 111a along the first direction, so as to enhance the structural strength of the heat dissipation device 100.

[0043] Continue to refer Figures 2 to 6 According to some embodiments of the present invention, the plurality of support plates 120 further include a second support group 122, and the second support group 122 includes a plurality of second support plates 122a distributed around the first support group 121. The second support plates 122a may be arranged at the corners of the heat transfer zone 111a to enhance the structural strength of the heat dissipation device 100 at the corners of the heat transfer zone 111a. Alternatively, the second support plates 122a may also be arranged along the periphery of the heat transfer zone 111a to enhance the structural strength of the heat dissipation device at the periphery of the heat transfer zone 111a. Of course, the second support plates 122a may be arranged at both the corners of the heat transfer zone 111a and the periphery of the heat transfer zone 111a, thereby improving the overall structural strength of the heat dissipation device 100.

[0044] On the one hand, the second support plate 122a is arranged around the first support group 121 to enhance the structural stability of the heat dissipation device 100. On the other hand, the second support group 122 can also optimize the heat transfer path. The heat on the heat source is transferred to the heat transfer area 111a, and then transferred to the second support plate 122a, so as to avoid heat accumulation in the central area of ​​the heat transfer area 111a and prevent local overheating. In this way, the heat can be diffused more evenly outside the heat dissipation device 100, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0045] Continue to refer Figures 2 to 6 According to some embodiments of the present invention, the heat transfer area 111a may be rectangular, matching the shape of the heat source, and the heat transfer area 111a includes multiple corners, each corner is provided with at least two second support plates 122a, for example, the second support plates 122a provided at the corners may be on both sides, intersecting at 90°, or, the second support plates 122a provided at the corners may also be three or more. It should be noted that the more the number of second support plates 122a is provided, the larger the area of ​​the heat transfer area 111a occupied, and the number of second support plates 122a is sufficient to ensure the structural strength of the heat dissipation device 100.

[0046] At least two second support plates 122a may be parallel to each other (refer to Figure 4 ), or at least two second support plates 122a may also intersect (refer to Figure 2 , Figure 3 and Figure 5 ). By arranging the second support plates 122a at the corners, the force on the heat transfer area 111a is more uniform, thereby improving the mechanical strength and structural stability of the heat transfer area 111a, and improving the structural reliability of the heat dissipation device 100. In the process of heat transfer, the corners are usually weak areas for heat transfer. By arranging at least two second support plates 122a at each corner, the thermal conductivity of the corners of the heat transfer area 111a can also be significantly enhanced. In this way, the layout of the parallel or intersecting second support plates 122a provides more heat conduction paths, making the heat distribution more uniform, thereby improving the thermal conductivity efficiency of the heat dissipation device 100.

[0047] Furthermore, the second support plate 122a is spaced apart from the first support plate 121a (refer to Figure 2 , Figure 4 and Figure 5 ), so that the heat conducted to the support plate 120 through the heat conduction area 111a can have multiple heat conduction paths, so that the heat distribution is more uniform. Alternatively, the second support plate 122a can also intersect with the first support plate 121a (refer to Figure 3), thus, a plurality of cross heat conduction paths are formed, and heat can be conducted to the second support plate 122a through the first support plate 121a, or heat can be conducted to the first support plate 121a through the second support plate 122a, thereby improving the heat transfer efficiency and allowing the heat to diffuse quickly inside the heat dissipation device 100, thereby avoiding local overheating.

[0048] Optionally, when at least two second support plates 122a at the corner positions are parallel and the second support plates 122a are spaced apart from the first support plates 121a, a second support plate 122a is also provided between the two second support plates 122a at the corner positions on the same side of the heat transfer area 111a (see Figure 4 ), to enhance the supporting effect on the heat dissipation device 100.

[0049] refer to Figure 5 According to some embodiments of the present invention, the support plate 120 may further include a third support plate 123a, which is disposed between the first support plate 121a and the second support plate 122a, and the third support plate 123a is parallel to the second support plate 122a.

[0050] The addition of the third support plate 123a enables the multiple support plates 120 to form a multi-layer support structure, further enhancing the mechanical strength and structural stability of the heat sink 100, preventing the heat sink 100 from deforming under high temperature conditions, and enhancing the adaptability of the heat sink 100 to the working environment. The third support plate 123a also provides more heat conduction paths, allowing heat to be more evenly transferred to the entire temperature plate, and the third support plate 123a is arranged in parallel with the second support plate 122a to form a multi-layer heat conduction network, further improving the heat conduction efficiency, and can more evenly distribute heat to avoid heat concentration in the center or edge area of ​​the heat conduction area 111a, thereby improving the heat dissipation performance of the heat sink 100.

[0051] According to some embodiments of the present invention, the capillary structure layer 130 is at least one of a copper powder sintering structure, a groove structure, or a wire mesh woven structure. For example, the capillary structure layer 130 may be a copper powder sintering structure, or the capillary structure layer 130 may also be a groove structure, or the capillary structure layer 130 may also be a wire mesh woven structure. Alternatively, the capillary structure layer 130 may include two structures of the copper powder sintering structure, the groove structure, or the wire mesh woven structure. Of course, the capillary structure layer 130 may also include the copper powder sintering structure, the groove structure, and the wire mesh woven structure at the same time.

[0052] The copper powder sintering structure forms a porous material by sintering copper powder, which has high capillary force and good thermal conductivity. The copper powder sintering structure can provide a large number of tiny pores to promote the evaporation and condensation process of the coolant, thereby improving the heat conduction efficiency of the heat sink 100. The groove structure forms a capillary action channel by etching tiny grooves in the inner cavity of the heat sink 100 and the surface of the support plate 120.

[0053] The groove structure can provide a clear fluid flow path, reduce flow resistance, and promote the circulation of the coolant, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0054] The wire mesh structure is a porous material formed by weaving metal mesh, which has good capillary force and mechanical strength. The wire mesh structure can provide uniform capillary action, promote the evaporation and condensation process of the working fluid, and improve the overall heat dissipation performance of the vapor chamber.

[0055] The capillary structure layers 130 with different structures can provide a variety of heat conduction paths, so that the heat is evenly distributed in the heat sink 100, ensuring efficient heat transfer inside the heat sink 100, and avoiding local overheating, thereby improving the heat dissipation efficiency of the heat sink 100. In addition, the copper powder sintering structure and the wire mesh woven structure have high mechanical strength, and can also enhance the structural stability of the heat sink 100 and prevent the heat sink 100 from deformation and damage.

[0056] Optionally, when the capillary structure layer on the support plate 120 is a groove structure, the groove structure extends along the first direction to facilitate the cooling liquid to flow back along the support plate 120, so that the heat dissipation device 100 can operate efficiently.

[0057] refer to Figure 1 According to some embodiments of the present invention, the capillary structure layer 130 of the heat absorption cavity wall 111 is provided with a thinning area 131, and at least a part of the structure of the thinning area 131 overlaps with the heat conduction area 111a. The area of ​​the thinning area 131 may just overlap with the heat conduction area 111a, or the area of ​​the thinning area 131 may exceed the heat conduction area 111a, and the heat conduction area 111a is located in the thinning area 131. At this time, a part of the structure of the thinning area 131 overlaps with the heat conduction area 111a.

[0058] The thickness of the capillary structure at the thinned area 131 is reduced, and the coolant flowing back to the heat absorption cavity wall 111 can quickly flow from the periphery of the heat transfer area 111a to the heat transfer area 111a, optimizing the flow path of the coolant inside the heat sink 100, reducing the flow resistance, accelerating the circulation speed of the coolant, and improving the response speed of the heat sink 100. The thickness of the capillary structure at the thinned area 131 is reduced, so that the thermal resistance of the thinned area 131 is reduced, and the heat can be quickly transferred to the coolant, promoting its evaporation and condensation process, thereby improving the heat exchange efficiency of the heat sink 100, and also playing a role in optimizing the heat transfer path, so that the heat is more evenly diffused throughout the heat sink 100, avoiding the heat concentration in a certain area.

[0059] refer to Figure 5 According to some embodiments of the present invention, at least part of the structure of the heat absorption cavity wall 111 is recessed away from the cooling cavity wall 112 along the first direction to form a groove 114, and part of the bottom wall of the groove 114 constitutes a heat transfer area 111a. The groove 114 improves the collection effect of the coolant, and the heat transfer area 111a is located in the groove 114 to ensure that the heat transfer area 111a is in contact with the heat source, so that the heat can be quickly transferred to the inside of the heat dissipation device 100. The capillary structure layer 130 may include a thinning area 131 and a thickening area 132 arranged in the groove 114, and the thickening area 132 surrounds the circumference of the thinning area 131. The heat can be quickly diffused circumferentially from the heat transfer area 111a through the thinning area 131, so that the heat can be evenly dispersed in the heat dissipation device 100, thereby avoiding the phenomenon of local overheating. Although the material thickness of the thinning area 131 is reduced, the existence of the thickening area 132 can provide additional mechanical support to ensure the overall structural stability of the heat dissipation device 100. In this way, stress can be effectively dispersed to prevent the heat dissipation device 100 from being deformed under high temperature or high pressure conditions.

[0060] refer to Figure 1 According to some embodiments of the present invention, the capillary structure layer 130 of the cooling cavity wall 112 includes a first sub-region 133 and a second sub-region 134 surrounding the first sub-region 133 , the first sub-region 133 is opposite to the heat conduction region 111a along a first direction, and the thickness of the first sub-region 133 is greater than the thickness of the second sub-region 134 .

[0061] On the one hand, the greater thickness of the first sub-region 133 provides a stronger capillary effect, ensuring that the coolant can quickly flow back to the heat transfer area 111a to maintain the efficient operation of the heat dissipation device 100. On the other hand, the greater thickness of the first sub-region 133 provides a stronger heat conduction capacity. Since the first sub-region 133 and the heat transfer area 111a are opposite to each other along the first direction, heat can be more efficiently transferred from the heat transfer area 111a to the cooling cavity wall 112, thereby improving the heat conduction efficiency of the heat dissipation device 100.

[0062] The larger thickness of the first sub-region 133 provides a larger surface area, which helps to improve the cooling efficiency. The heat is quickly transferred to the cooling cavity wall 112 through the first sub-region 133, and is quickly dissipated through the cooling medium (such as air) on the side of the shell 110 away from the heat source, thereby improving the heat dissipation effect of the heat sink 100. The second sub-region 134 is thinner and surrounds the first sub-region 133, which can effectively guide the heat to diffuse outward from the first sub-region 133, ensuring that the heat is evenly distributed inside the heat sink 100, and avoiding local overheating in the heat sink 100. The combined design of the first sub-region 133 and the second sub-region 134 can also optimize the flow path of the coolant inside the heat sink 100, reduce the flow resistance, and promote the circulation of the coolant, thereby improving the heat dissipation efficiency of the heat sink 100. In this way, the efficient evaporation and condensation process can be ensured, and the heat conduction efficiency of the heat sink 100 can be improved.

[0063] refer to Figure 1 and Figure 5 According to some embodiments of the present invention, a guide groove 115 is provided on the heat absorption cavity wall 111, and the guide groove 115 passes through the heat transfer area 111a. The guide groove 115 can guide the coolant to quickly return to the heat transfer area 111a, optimize the flow path of the coolant in the heat sink 100, so that the evaporation and condensation process of the coolant is carried out efficiently, and the thermal management efficiency of the heat sink 100 is improved. The guide groove 115 can also guide the heat to be transferred along a specific path, so that the heat is more efficiently transferred from the heat source to the inside of the heat sink 100, which plays the effect of optimizing the heat transfer path, thereby improving the thermal conductivity of the heat sink 100. In addition, the guide groove 115 can also reduce the thermal resistance in the heat transfer process, ensure that the heat is quickly transferred to the coolant, and improve the thermal conductivity performance of the heat sink 100.

[0064] Optionally, the arrangement of the guide grooves 115 can also be: multiple guide grooves 115 are arranged radially along the circumference of the heat transfer area 111a, so as to improve the centralized guide effect of the coolant, facilitate the coolant to flow back to the heat transfer area 111a, and also improve the heat dissipation effect along the circumference of the heat transfer area 111a.

[0065] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0066] In the description of the present invention, "first feature" or "second feature" may include one or more of the features.

[0067] In the description of the present invention, "plurality" means two or more.

[0068] In the description of the present invention, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0069] In the description of the present invention, “on”, “over” and “above” a first feature from a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0071] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A heat dissipation device (100), characterized in that: include: A shell (110), wherein an inner cavity of the shell (110) comprises a heat absorbing cavity wall (111) and a cooling cavity wall (112) which are arranged opposite to each other and spaced apart in a first direction; a support plate (120), wherein the support plates (120) are multiple, and the two ends of each support plate (120) along the first direction are respectively connected to the heat absorption cavity wall (111) and the cooling cavity wall (112), and the support plate (120) divides the inner cavity of the shell (110) into at least one migration cavity (113); The capillary structure layer (130) covers the heat absorption cavity wall (111), the cooling cavity wall (112) and the surface of the support plate (120), wherein the capillary structure layer (130) on the heat absorption cavity wall (111) stores cooling liquid.

2. The heat dissipation device (100) according to claim 1, characterized in that: The heat absorption cavity wall (111) has a heat conduction area (111a), and the plurality of support plates (120) are all arranged in the heat conduction area (111a).

3. The heat dissipation device (100) according to claim 2, characterized in that: The plurality of support plates (120) include a first support group (121), the first support group (121) includes a plurality of first support plates (121a) arranged in the center of the heat conduction area (111a), and the plurality of first support plates (121a) are arranged in a staggered manner.

4. The heat dissipation device (100) according to claim 3, characterized in that: The plurality of support plates (120) further include a second support group (122), wherein the second support group (122) includes a plurality of second support plates (122a) distributed around the first support group (121).

5. The heat dissipation device (100) according to claim 4, characterized in that: The heat conduction area (111a) comprises a plurality of corners, each of which is provided with at least two second support plates (122a), and at least two second support plates (122a) are parallel or intersecting.

6. The heat dissipation device (100) according to claim 4, characterized in that: The second support plate (122a) is spaced apart from the first support plate (121a), or the second support plate (122a) intersects with the first support plate (121a).

7. The heat dissipation device (100) according to claim 4, characterized in that: The invention also comprises a third support plate (123a), wherein the third support plate (123a) is arranged between the first support plate (121a) and the second support plate (122a), and the third support plate (123a) is parallel to the second support plate (122a).

8. The heat dissipation device (100) according to any one of claims 1 to 7, characterized in that: The capillary structure layer (130) is at least one of a copper powder sintering structure, a groove structure and a wire mesh woven structure.

9. The heat dissipation device (100) according to any one of claims 1 to 7, characterized in that: The capillary structure layer (130) of the heat absorption cavity wall (111) is provided with a thinning area (131), and at least a part of the structure of the thinning area (131) overlaps with the heat conduction area (111a).

10. The heat dissipation device (100) according to claim 9, characterized in that: At least part of the structure of the heat absorption cavity wall (111) is recessed away from the cooling cavity wall (112) along the first direction to form a groove (114), and part of the bottom wall of the groove (114) constitutes a heat conduction area (111a) of the heat absorption cavity wall (111), The capillary structure layer (130) comprises the thinned area (131) and the thickened area (132) arranged in the groove (114), and the thickened area (132) surrounds the circumference of the thinned area (131).

11. The heat dissipation device (100) according to any one of claims 1 to 7, characterized in that: The capillary structure layer (130) on the cooling cavity wall (112) comprises a first sub-region (133) and a second sub-region (134) surrounding the first sub-region (133), the first sub-region (133) being opposite to the heat conduction region (111a) along the first direction, and the thickness of the first sub-region (133) being greater than the thickness of the second sub-region (134).

12. The heat dissipation device (100) according to any one of claims 1 to 7, characterized in that: A guide groove (115) is provided on the heat absorption cavity wall (111), and the guide groove (115) passes through the heat conduction area (111a).

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