Cooling system for x-ray apparatus

Abstract

The invention provides a cooling system for an X-ray apparatus, the cooling system comprising: a top cooling unit (TCU) comprising a heat exchanger plate with an integrated cooling fluid circuit, and a support arm, in particular a C-arc, configured for mounting the TCU and for mounting a monolithic module of an X-ray source of the X-ray apparatus, wherein the fluid circuit is arranged above the main surface of the heat exchanger plate to capture heat via the main surface.

Description

Technical Field

[0001] The invention provides a cooling system for an X-ray device and an X-ray device. Background Art

[0002] X-ray devices currently in use, especially mobile X-ray systems, generally include an X-ray source, which includes an X-ray box (also referred to as a monoblock), which includes an X-ray tube and may also include a high-voltage generator integrated into one physical component. The monoblock includes a box with a cooling fluid, which is pumped into the interior of the monoblock so that the cooling fluid circulates inside, thereby dispersing the heat inside the monoblock. In other words, at least a portion of the cooling system is integrated with the X-ray source (specifically the monoblock).

[0003] Current systems face several challenges, including difficulty in assembling and repairing the system or replacing the X-ray source, and difficulty maintaining the performance of the cooling loop over extended periods of time.

[0004] It is an object of the present invention to provide a cooling system for an X-ray device and an X-ray device that alleviates at least some of the above challenges. Summary of the invention

[0005] The invention achieves this object. The invention provides a cooling system and an X-ray device according to the independent claims. Embodiments are given in the dependent claims.

[0006] The present invention provides a cooling system for an X-ray device, the cooling system comprising: a top cooling unit, TCU, which comprises a heat exchanger plate with an integrated cooling fluid circuit; and a support arm, in particular a C-shaped arc, which is configured as a single module for mounting the TCU and for mounting an X-ray source of the X-ray device, wherein the fluid circuit is arranged on a main surface of the heat exchanger plate so as to obtain heat via the main surface.

[0007] Optionally, the C-shaped arc is configured for removably mounting a TCU and / or for removably mounting a cell module.

[0008] Thus, a cooling system can be provided that allows heat to be reliably withdrawn from a single module mounted on a support arm (e.g., from the top surface of the single module). At the same time, since the cooling system is not incorporated into the single module, the single module / X-ray source can be replaced without disconnecting the cooling circuit, thereby keeping the performance of the cooling circuit in good condition. When the cooling circuit is interrupted (i.e., it cannot remain intact or connected), this may lead to a decrease in the performance and reliability of the cooling circuit.

[0009] The cooling system allows easy initial assembly of the components and easy mounting and dismounting independent of each other. Thus, improved maintenance can also be achieved by the configuration of the cooling system. The cooling system allows modular construction and use as an additional cooling system for existing X-ray devices.

[0010] The cooling system also allows to increase the maximum operating time / exposure time / process time of the X-ray equipment as it provides very effective cooling, i.e. removing heat from the individual modules, thus preventing overheating for extended periods of time.

[0011] The cooling system is particularly advantageous for use in mobile X-ray devices and / or X-ray devices having many back-to-back procedures.

[0012] In the present disclosure, unless otherwise specified, the relative arrangements of all components refer to the assembled state of the cooling system and / or X-ray device for the intended use.

[0013] According to the present disclosure, a board may have two oppositely arranged surfaces, such as a top surface and a bottom surface, connected by one or more side surfaces. Specifically, the height of the board may be less than the length and width of the top surface and the bottom surface and / or less than the radius of the top surface and the bottom surface. Specifically, each side surface may be smaller than the top surface and the bottom surface.

[0014] The main surface of the heat exchanger plate of the present disclosure may be one of the larger surfaces, especially the surface facing the cell module in the assembled state. In the assembled state, the main surface may be in contact with the surface of the cell module.

[0015] The fluid circuit being arranged above the main surface may result in the fluid circuit being arranged in a plane parallel to the plane of the main surface, in particular in a plane at least close to the main surface as it is a surface opposite to the main surface.

[0016] Exemplary configurations of heat exchanger plates are given in detail below, in which the fluid circuit is arranged above the main surface of the heat exchanger plate so as to obtain heat via the main surface. It should be understood that these are merely examples of possible configurations. As an example, the feature "so as to obtain heat via the main surface" may refer to being configured to obtain heat via the main surface when the cooling system is used for its intended purpose (i.e., the cooling fluid is inside the fluid circuit, especially circulated through the fluid circuit), for example, heat is obtained from an object (such as a single module) arranged adjacent to the main surface. Therefore, those skilled in the art will appreciate that various arrangements and shapes of the fluid circuit will allow heat to be obtained via the main surface.

[0017] In operation, the cooling fluid circulating through the heat exchanger plates can thus extract heat from the cell modules.

[0018] The cooling fluid circuit integrated in the heat exchanger plate may result in the cooling fluid channels of the cooling fluid circuit being formed inside the heat exchanger plate, in particular integrally with the heat exchanger plate.

[0019] The heat exchanger plate may be made from one component or may be assembled from a plurality of components, in particular a plurality of components permanently connected together. If the heat exchanger plate is made from a plurality of components, the cooling fluid circuit may be formed by or in one or more of the plurality of components.

[0020] The cooling fluid may be water, oil and / or glycol.

[0021] The support arm may be considered to have a box support portion including a mounting mechanism for the TCU and a mounting mechanism for the cell module. The support arm may also have a portion configured for mounting an X-ray detector of the X-ray device at the end opposite to the end where the TCU is mounted.

[0022] The support arm, in particular the C-shaped arc, can be made as an extruded profile, in particular an extruded profile which is initially in a straight shape and which can then be rolled up in order to obtain a curved shape.

[0023] The cooling system can be configured such that, in operation, a cooling fluid can flow through the TCU to transfer heat away from the X-ray source, for example, to a free environment via a heat exchanger (e.g., an external heat exchanger fluidly connected to the TCU and / or an additional heat exchanger, such as a water or air heat exchanger).

[0024] The support arm may be configured such that it can fully support the TCU, or in other words, such that the TCU may be held in a suspended position solely by the support arm.

[0025] According to the present disclosure, the integrated cooling fluid circuit may include at least one (especially two or more) integrated cooling fluid channel. Each cooling fluid channel may have two ports, especially an inlet port and an outlet port. These ports are also referred to as ports of the TCU or ports of the heat exchanger plate in this article.

[0026] Each cooling fluid channel may extend in a plane perpendicular to the main surface of the heat exchanger plate. In particular, all cooling fluid channels may extend in the same plane.

[0027] Alternatively or additionally, each cooling fluid channel may be loop-shaped, the loop starting at one port and ending at another port. If there are two or more cooling fluid channels, at least two cooling fluid channels may be loop-shaped, and one of the loops may be arranged completely inside the other loops.

[0028] Each port may be formed integrally with or attached to a heat exchanger plate.

[0029] Both ports of the cooling fluid channels, in particular all ports of all cooling fluid channels, may be arranged on the same side of the heat exchanger plate, in particular extend from the same side surface of the heat exchanger plate.

[0030] Alternatively or additionally, two ports of a cooling fluid channel, in particular all ports of all cooling fluid channels, may be arranged parallel to each other. Arranged parallel to each other may particularly refer to a main flow direction of the fluid within the port.

[0031] The configuration of the fluid channels as described herein allows for a higher heat exchange efficiency and a smaller size of the heat exchanger plate. Furthermore, it may allow for an easy connection and disconnection of the heat exchanger plate (in particular the cooling fluid circuit) with an external fluid circuit (e.g., an external heat exchanger circuit). As an example, a parallel arrangement and / or an arrangement on the same side and / or an arrangement in the same plane may allow for an easy installation (e.g., by plug connection).

[0032] According to the present disclosure, the TCU may include an interface portion configured to engage with an interface portion of a support arm. Specifically, the interface portion of the TCU and the interface portion of the support arm may be configured to provide an assembly mechanism configured so that the TCU is detachably fixed to the support arm in an assembled state.

[0033] The interface portion of the TCU may include one or more ports for integrated cooling fluid channels. For example, each port may be used as one of a pair of connection elements of a plug-type connection.

[0034] Alternatively or additionally, the interface portion of the TCU may include one or more other elements that function as one of a pair of connection elements of a plug-type connection. The respective other of a pair of connection elements of a plug-type connection may be included in the interface portion of the support arm. Thus, the assembly mechanism may include a plug connection.

[0035] Alternatively or in addition, the interface portion of the TCU may include one or more holes and / or grooves (each hole and / or groove is configured to receive a pin of the interface portion of the support arm) and / or may include one or more pins (which are configured to be received in the holes and / or grooves of the interface portion of the support arm). Assembly can be achieved by engaging each pin with its corresponding hole or groove. This allows the TCU to be aligned and / or the relative position of the TCU and the support arm to be fixed and / or the TCU to be supported. Therefore, the assembly mechanism may include a position fixing mechanism.

[0036] Alternatively or in addition, the assembly mechanism may include a sliding mechanism, and the interface portion of the TCU may include one of a pair of elements constituting the sliding mechanism, for example, a slot or groove configured to guide a matching portion of the interface portion of the support arm, or a portion of a slot or groove configured to be a matching portion of the interface portion of the support arm.

[0037] Thus, the assembly mechanism may be provided by the interface portion of the TCU and the interface portion of the support arm.

[0038] It should be noted that the groove of the interface portion of the TCU can be used as part of the fixing mechanism as well as part of the sliding mechanism of the assembly mechanism.

[0039] The above-mentioned assembly mechanism can also provide support for the TCU on the support arm, that is, it includes a support mechanism, which can include, for example, at least a subset of elements of a position fixing mechanism and / or a sliding mechanism.

[0040] According to the present disclosure, the support arm may include a mounting mechanism for detachably mounting the cell module to the support arm, particularly in a manner that installation and removal of the cell module does not require removal of the TCU from the support arm.

[0041] This is particularly advantageous for easily replacing individual modules during the service life of the X-ray device without damaging the cooling circuit.

[0042] The mounting means of the support arm and the assembly means, in particular the interface portion of the support arm, may be configured such that in the assembled state the main surfaces of the heat exchanger plates are arranged above and in contact with the top surface of the cell module.

[0043] A mounting mechanism for detachably mounting the cell module to the support arm may optionally be included in the interface portion of the support arm. This may allow a compact configuration of the cooling system and / or the X-ray device to be achieved.

[0044] The mounting mechanism of the support arm may include a screwing mechanism and / or a click-mechanism and / or a clamping mechanism.

[0045] As an example, the mounting mechanism of the support arm may be configured so that the support arm can be attached to the monomer module when the TCU and the support arm are in an assembled state. For example, the mounting mechanism may be such that the TCU and the support arm can be placed on top of the monomer module in the assembled state, and then the monomer module can be fixed to the support arm, for example, by screws or a snap mechanism or a clamping mechanism. As an example, a plurality of holes for receiving screws may extend from the top to the bottom of the interface portion of the support arm, so that the monomer module can be fixed to the support arm by placing the support arm on top of the monomer module, inserting a screw into each of the plurality of holes from the top, and tightening the monomer module to the support arm.

[0046] The mounting mechanism of the support arm may be configured such that the weight of the cell module may be fully held or supported by the support arm.

[0047] According to the present disclosure, a cooling system, in particular a TCU, may include a mounting mechanism for detachably attaching the TCU to a cell module mounted on a support arm (in particular, to a top surface of the cell module).

[0048] This is particularly advantageous for easily replacing individual modules during the service life of the X-ray device without damaging the cooling circuit.

[0049] The mounting mechanism for detachably attaching the TCU to the cell module may in particular be configured such that the main surfaces of the heat exchanger plates are held in contact with the top surface of the cell module in the assembled state.

[0050] The mounting mechanism for detachably attaching the TCU to the cell module may optionally be arranged at least partially outside the interface portion of the TCU. Specifically, it may be arranged closer to the second end of the heat exchanger plate than the first end of the interface portion where the TCU is arranged, the first end and the second end being opposite ends of the heat exchanger plate.

[0051] For example, in the area of ​​the interface portion of the TCU, the relative position of the TCU and the cell module will be mainly determined by the mounting mechanism and assembly mechanism of the support arm. Therefore, it is particularly advantageous to ensure that the main surface contacts the cell module in the area away from the interface portion of the TCU.

[0052] The mounting mechanism for detachably attaching the TCU to the cell module may include a tightening mechanism and / or a snap mechanism and / or a clamping mechanism.

[0053] As an example, a mounting mechanism for removably attaching the TCU to the cell module may be configured so that the TCU can be attached to the cell module when the TCU and the support arm are in an assembled state and optionally when the cell module is mounted on the support arm. For example, the mounting mechanism may be configured so that the TCU placed on top of the cell module (e.g., after assembling the TCU and the support arm and after mounting the cell module to the support arm) can be attached to the cell module, for example, by screws or a snap mechanism or a clamping mechanism. As an example, a plurality of holes for receiving screws may extend from the top to the bottom of the TCU (specifically the heat exchanger plate), so that the TCU can be attached to the cell module by placing the TCU on top of the cell module, inserting screws into each of the plurality of holes from the top and tightening the TCU to the support arm.

[0054] According to the present disclosure, the TCU may include a mounting mechanism for mounting a collimator of an X-ray device. Specifically, the heat exchanger plate may have an opening in its main surface for accommodating at least a portion of the collimator, and may optionally include a positioning element, such as a groove and / or a hole and / or a pin, for positioning the collimator on top of the heat exchanger plate. Specifically, the opening may extend from the main surface of the heat exchanger plate to the opposite surface of the heat exchanger plate, that is, it is a through hole extending through the heat exchanger plate. The mounting mechanism may also be used to align the collimator relative to the single module.

[0055] The opening may be configured, and the collimator in a mounted state may be arranged and configured so that X-rays emitted from the X-ray source can travel through the opening and into the collimator. Specifically, the opening may be configured so that a portion of the collimator is arranged in the opening, while another portion of the collimator is supported by a portion of a surface opposite to the main surface of the heat exchanger plate.

[0056] The positioning element may be configured to engage with a corresponding positioning element (e.g., a groove and / or a hole and / or a pin) of the collimator. Specifically, the TCU may include two or more pins extending orthogonally from a surface opposite to the main surface of the heat exchanger plate. The collimator may have corresponding holes into which the pins may be inserted in order to position / align the collimator (e.g., by sliding it onto the TCU).

[0057] The mounting mechanism for mounting the collimator may optionally include a depression and / or recess in the top surface (i.e., the surface opposite to the main surface or the surface facing away from the cell module in the assembled state) of the TCU (specifically the heat exchanger plate). The depression and / or recess may be configured to allow the collimator to be accommodated, in particular so as to limit lateral movement of the collimator relative to the top surface of the TCU while supporting the collimator from the bottom. This may be used to provide additional stability.

[0058] Optionally, the mounting mechanism for mounting the collimator may further include an attachment mechanism for fixing the collimator to the TCU, such as a tightening mechanism and / or a clamping mechanism.

[0059] The mounting mechanism for mounting a collimator according to the present disclosure allows for easy assembly and disassembly and may also allow for a compact configuration of an X-ray device.

[0060] A collimator may be provided to avoid beam leakage and to perform beam shaping.

[0061] According to the present disclosure, the support arm, in particular the C-shaped arc, may include one or more cooling channels, each cooling channel having two ports, which, in the assembled state, are connected to two ports of a cooling fluid channel of the cooling fluid circuit, so that in the assembled state, one or more closed cooling circuits are formed, each closed cooling circuit being formed by at least one of the cooling channels of the support arm and at least one of the cooling fluid channels of the heat exchanger plate.

[0062] The support arm, and in particular the cooling channels of the support arm, may be configured to allow heat exchange between a fluid circulating through the cooling channels and the surroundings of the support arm. The support arm provides sufficient space for the cooling fluid to travel a long distance, thereby allowing efficient heat exchange.

[0063] Thus, the support arm may be configured to radiate heat. The support arm may be used as a heat exchanger that is external and connected to the TCU. It should be noted that, alternatively, the TCU may also be connected to a heat exchanger that is separate from the support arm. The separate heat exchanger may optionally be supported by the support arm.

[0064] In particular, the support arm (e.g. C-shaped arc) may comprise a first cooling channel extending along the first support arm / C-shaped arc side and arranged to have two open ends in order to be connected to two ports of the heat exchanger plate, e.g. two of the ports of the cooling fluid channel. Furthermore, the support arm (e.g. C-shaped arc) may comprise a second cooling channel extending along the second support arm / C-shaped arc side (preferably, which is opposite to the first support arm / C-shaped arc side) and arranged to have two open ends in order to be connected to two other ports of the heat exchanger plate, e.g. two of the ports of the cooling fluid channel. The open end of the first cooling channel and / or the open end of the second cooling channel may be used as ports of the cooling channel.

[0065] The TCU may be mounted on a support arm, and the support arm may be coupled to the TCU in such a way that the coupling allows cooling fluid from the TCU to circulate through the cooling channels of the support arm, in particular so as to allow a closed loop circulation through the support arm and the TCU. In other words, the cooling channels of the support arm and the cooling fluid channels of the TCU may form one or more cooling circuits. Thus, the cooling channels in the support arm may be part of a complete cooling system together with the TCU.

[0066] In addition, the cooling system may also include an air ventilator located in the support arm, for example, for additional cooling. For example, the support arm may include an air duct through which cooling air may pass to cool the support arm. This may provide additional cooling enhancement.

[0067] According to the present disclosure, the heat exchanger plate and the support arm, in particular their respective interface portions, may be configured such that ports of the support arm and ports of one or more cooling fluid channels are configured to form a plug connection with each other.

[0068] For example, a plug connection may allow connecting the support arm and the TCU, in particular for attaching the TCU and / or for establishing one or more closed cooling circuits, by sliding the TCU towards the support arm so as to engage ports of the heat exchanger plate and corresponding ports of the support arm.

[0069] This allows for easy and reliable assembly.

[0070] According to the present disclosure, the cooling system may include an assembly mechanism configured to allow the TCU to be removably fixed to the support arm, and the assembly mechanism may include a plug connection and a fixing element (e.g., a pin) configured to lock the relative position of the TCU and the support arm when the plug connection is in a connected state.

[0071] As an example, the above-mentioned assembly mechanism can be included in the cooling system. The plug connection can in particular be a plug connection formed by a port of the heat exchanger plate and a port of the support arm, for example as described above. By such an assembly mechanism, an easy and reliable assembly can be ensured.

[0072] According to the present disclosure, the cooling system may further comprise one or more pumps for circulating the cooling fluid through the cooling fluid circuit of the TCU, in particular through a closed cooling circuit formed by the cooling channels of the support arm and the cooling fluid channels of the heat exchanger plates.

[0073] The one or more pumps may comprise any suitable pump known in the art. The one or more pumps may, for example, be arranged at the end of the support arm opposite to the end with the interface portion (e.g., the end to which the X-ray detector is attached). This is advantageous in terms of the overall distribution of the constituent elements of the cooling system or X-ray device.

[0074] In accordance with the present disclosure, one or more integrated cooling fluid channels may be arranged to optimize heat distribution throughout the heat exchanger plate.

[0075] As an example, one or more integrated cooling fluid channels may be loop-shaped, as described above. As an example, a first loop-shaped cooling fluid channel may extend along an outer sidewall of a heat exchanger plate. As another example, a second loop-shaped cooling fluid channel may extend around an inner sidewall of a heat exchanger plate, for example, along an edge of any opening in the heat exchanger plate, such as an opening for accommodating a portion of a collimator. Thus, efficient heat exchange may be achieved.

[0076] In an optional embodiment, the TCU is arranged to mount a collimator of an X-ray device so that the heat exchanger plate is located between the monoblock and the collimator. The integrated cooling fluid circuit of the heat exchanger plate includes a portion of a channel extending below the mounted collimator and above the monoblock (or in other words, between the collimator and the monoblock). In a specific embodiment, the heat exchanger plate has an opening in its main surface for accommodating at least a portion of the collimator, and the shape of the portion of the channel closely follows the outer shape of the opening (for example, along the edge of the opening or any opening in the heat exchanger plate) - this can be a second loop-shaped cooling fluid channel extending around the inner side wall of the heat exchanger plate.

[0077] Likewise, efficient heat exchange can be achieved.

[0078] According to the present disclosure, the cooling channels of the support arm may extend along the entire length of the support arm. For example, in the case of a C-shaped arc, they may extend along the entire arc.

[0079] Specifically, two ports of each cooling channel, ie, an input port and an output port, may be arranged at the same end of the support arm, and each cooling channel may extend from the end of the support arm to the other end of the support arm and back.

[0080] The above may improve the utilization of available space (eg in a support arm) for heat exchange.

[0081] The invention also provides an X-ray device comprising a cooling system according to the present disclosure, for example as described in the claims or as described above, and an X-ray source comprising, in particular, a monolithic module, wherein, in the assembled state, the main surfaces of the heat exchanger plates are in contact with the top surface of the monolithic module.

[0082] According to the present disclosure, the X-ray device may further include an X-ray detector, for example, which is arranged at an end of the support arm opposite to the end of the support arm on which the cell module and the TCU are mounted. The pump mentioned above may be arranged at the end of the support arm that is the same as the X-ray detector.

[0083] Another embodiment of the present invention includes a cooling system for an X-ray device, the cooling system comprising:

[0084] a top cooling unit TCU comprising a heat exchanger plate with an integrated cooling fluid circuit; and

[0085] The support arm, in particular a C-shaped arc, is configured as a single module for mounting the TCU and for mounting an X-ray source of the X-ray device.

[0086] The fluid circuit is arranged above the main surface of the heat exchanger plate so as to obtain heat via the main surface. The TCU is also arranged to mount a collimator of the X-ray device so that the heat exchanger plate is located between the monoblock module and the collimator. The integrated cooling fluid circuit of the heat exchanger plate includes a portion of a channel extending below the collimator and above the monoblock module (or in other words, between the collimator and the monoblock module) after installation. In a specific embodiment, the heat exchanger plate has an opening in its main surface for accommodating at least a portion of the collimator, and the shape of the portion of the channel closely follows or extends along the outer shape of the opening (for example, along the edge of the opening or any opening in the heat exchanger plate) - this can be a loop-shaped cooling fluid channel extending around the inner side wall of the heat exchanger plate.

[0087] A more efficient heat exchange can be achieved.

[0088] As another embodiment, the invention comprises a top cooling unit, TCU, comprising a heat exchanger plate with an integrated cooling fluid circuit, the heat exchanger plate being arranged for mounting with a support arm, in particular a C-shaped arc, which is mounted with a monolithic module of an X-ray source of an X-ray device. The fluid circuit is arranged on a main surface of the heat exchanger plate in order to extract heat via the main surface. Optionally, the TCU is in particular arranged for being detachably mounted to the support arm. As another alternative or combined option, the TCU is also arranged to mount a collimator for an X-ray device such that the heat exchanger plate is located between the monoblock and the collimator, wherein the integrated cooling fluid circuit of the heat exchanger plate includes a portion of a channel extending below the mounted collimator and above the monoblock (or in other words, between the collimator and the monoblock), wherein in a specific embodiment, the heat exchanger plate has an opening in its main surface for accommodating at least a portion of the collimator, and the shape of the portion of the channel closely follows or extends along the outer shape of the opening (e.g., along the edge of the opening or any opening in the heat exchanger plate) - this can be a loop-shaped cooling fluid channel extending around the inner side wall of the heat exchanger plate. The features and advantages outlined above in the context of the cooling system are equally applicable to the X-ray device described herein.

[0089] Further features, examples and advantages will become apparent from the detailed description taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0090] Figure 1a and Figure 1b Schematically illustrates a TCU of a cooling system according to the present disclosure;

[0091] Figure 2a and Figure 2b schematically illustrates an assembly mechanism for detachably fixing a TCU according to the present disclosure;

[0092] Figure 3 Schematically shows a TCU and a portion of a support arm and a collimator of a cooling system according to the present disclosure;

[0093] Figure 4 Schematically shows a TCU and a portion of a support arm and a single module of a cooling system according to the present disclosure;

[0094] Figure 5 An exemplary support arm according to the present disclosure is shown; and

[0095] Figures 6a to 6c An X-ray device according to the present disclosure is shown. DETAILED DESCRIPTION

[0096] Figure 1a and Figure 1b The TCU 2 of the cooling system 1 according to the present disclosure is schematically shown in an oblique view from the top and in a cross-sectional view.

[0097] The TCU comprises a heat exchanger plate 3 with an integrated cooling fluid circuit 4 comprising two cooling fluid channels 4a, 4b, which can be loop-shaped as shown. Alternative shapes are conceivable. There can also be a different number of cooling fluid channels.

[0098] The TCU also includes four ports at the first end 3e of the heat exchanger plate, namely the inlet port 5a and the outlet port 6a of the cooling fluid channel 4a and the inlet port 5b and the outlet port 6b of the cooling fluid channel 4b. These ports can be formed integrally with the heat exchanger plate and therefore also integrally with the cooling fluid channel, or they can be attached to the heat exchanger plate. In any case, for simplicity, they are referred to as ports of the cooling fluid channel. These ports can be used to connect the TCU fluid to an external heat exchanger. The second end 3f of the heat exchanger plate is arranged opposite to the first end.

[0099] The heat exchanger plate has a main surface 3a (at Figure 1a , but indicated by arrows), which in operation serves to capture heat emitted by the X-ray source and which may also be referred to as the bottom surface. In contrast to the main surface, the heat exchanger plate has a surface 3b, which may also be referred to as the top surface of the heat exchanger plate. Furthermore, the heat exchanger plate has an outer sidewall (collectively labeled 3c) and an inner sidewall (collectively labeled 3d). The inner sidewall is a sidewall that defines one or more holes 7a, 7b in the heat exchanger plate. As an example, the hole 7a may be configured to accommodate a collimator 14, as described in more detail below, for example, with reference to Figure 3 .

[0100] The heat exchanger plate of this example also includes grooves 8a and holes 8b, which can be used to assemble the cooling system, for example, by engaging with corresponding pins of the support arm, which will be described in detail below. However, these holes and grooves are optional and additional, and different elements for assembly can be provided according to the assembly mechanism that allows the TCU to be detachably attached to the support arm.

[0101] The part 9 including the elements for assembly is called the interface part of the TCU. It forms an interface with the support arm.

[0102] As in Figure 1a As can be seen in , the top surface of the heat exchanger plate comprises optional holes 10. These are elements that can be used to attach the heat exchanger plate to a single module of an X-ray source, as will be described in detail below.

[0103] As in Figure 1a As can be seen in FIG. 1 , the top surface of the heat exchanger plate includes an optional recess 11, and the TCU includes an optional pin 12 that extends upward from the top surface of the heat exchanger plate and can be attached to or formed integrally with the heat exchanger plate. These are elements that can be used to position the collimator on top of the TCU, which will be described in detail below.

[0104] Figure 2a and Figure 2b The oblique view and the top view from the top show the method for converting a TCU (especially as shown in FIG. Figure 1a and Figure 1b The TCU shown is detachably fixed to the assembly mechanism of the support arm 13 of the cooling system 1 according to the present disclosure. Figure 2a and Figure 2b A first end 13a of the support arm is shown. Not shown is an opposite end 13b of the support arm. Figure 6a and Figure 6b The first end 13a includes an interface portion 13a-1 of the support arm.

[0105] The interface portion 9 of the TCU and the interface portion of the support arm are configured to engage with each other so as to removably fix the TCU to the support arm. In this example, a first pair of pins 15a and a second pair of pins 15b are provided so as to engage with the grooves 8a and holes 8b of the heat exchanger plate, respectively. In this example, the first pair of pins 15a are fixed, i.e., they cannot move independently. The second pair of pins are (independently) movable.

[0106] As an example, for assembly, the TCU may be displaced in the direction indicated by the arrow toward the interface portion of the support arm so that the pin 15a slides into the groove 8a, thereby limiting the movement of the TCU relative to the support arm.

[0107] Subsequently, the pin 15b may be inserted into the hole 8b, thereby fixing the position of the TCU relative to the support arm.

[0108] To remove the TCU from the support arm, the pin 15b may be retracted from the hole 8b and the TCU may be slid in a direction opposite to that indicated by the arrow to disengage the groove 8a from the pin 15a.

[0109] Therefore, the interface portion of the TCU and the interface portion of the support arm are configured to provide an assembly mechanism configured such that the TCU is detachably fixed to the support arm in an assembled state.

[0110] However, it is contemplated that additional and / or different elements may be provided for the detachable assembly mechanism.

[0111] Figure 3FIG. 2 shows a portion of a TCU 2 and a support arm 13 of a cooling system according to the present disclosure in an assembled state. Figure 1a , Figure 1b , Figure 2a and Figure 2b The TCU and support arm are shown in FIG. , but other configurations are also contemplated.

[0112] also, Figure 3 The collimator 14 is shown mounted above the TCU. It can be seen that the pins 12 of the TCU extend through the holes 14a of the collimator 14, thereby positioning the collimator. A portion of the collimator is received in the holes 7a ( Figure 3 ), and if the TCU has a recess 11, the collimator can be arranged in the recess.

[0113] Thus, a mounting mechanism for the collimator may be provided, which may include the hole 7a, the recess 11 and the pin 12.

[0114] Figure 4 The TCU and a portion of the support arm of the cooling system according to the present disclosure are schematically shown (particularly as shown in FIG. Figure 1a , Figure 1b , Figure 2a , Figure 2b and Figure 3 ) and a single module 16 of an X-ray source 17, which is mounted on a support arm.

[0115] Specifically, Figure 4 The through hole 8c in the interface portion of the support arm and the screw 18 inserted into the through hole and used to mount the cell module on the support arm are shown. Figure 4 As can be seen in FIG, in the assembled state, the main surfaces of the heat exchanger plates are in contact with the top surface 16a of the cell modules. In operation, the cooling fluid circulating through the heat exchanger plates can thus extract heat from the cell modules.

[0116] In this example, optional screws 19 extend through optional holes 10 of the heat exchanger plate in order to attach the heat exchanger plate to the cell module of the X-ray source. Thus, the contact between the heat exchanger plate and the cell module can be enhanced.

[0117] Figure 5A cross section of an exemplary support arm 13 of the present disclosure is shown, specifically, a cross section within an area located outside the interface portion and not forming one of the ends of the support arm is shown. In this example, the support arm is also an external heat exchanger to which the TCU can be connected. Specifically, in this example, the support arm includes cooling channels 20a and 20b, each cooling channel having two ports (not shown) at the interface portion of the support arm, specifically an inlet port and an outlet port. In the assembled state, the outlet port of the support arm is connected to the inlet ports 5a and 5b of the TCU, and the inlet port of the support arm is connected to the outlet ports 6a and 6b of the TCU. For example, the ports of the support arm and the ports of the TCU can be configured and arranged so that they establish a plug connection between the TCU and the support arm.

[0118] Figures 6a to 6c A fully assembled X-ray device 22 according to the present disclosure is shown, which includes a TCU according to the present disclosure (e.g., as shown in the previous figures) and a support arm according to the present disclosure (e.g., as shown in the previous figures (especially Figure 5 )). Figures 6a to 6c The X-ray device in the embodiment further comprises a single module of an X-ray source, an X-ray detector 23 arranged at the second end 13b of the support arm (which is opposite to the first end 13a of the support arm), and a pump 24, which in this example is arranged at the second end 13b of the support arm, but can also be arranged at a different position. The pump is configured to circulate a cooling fluid through the support arm and the TCU.

[0119] In this example, the support arm is shown as a C-shaped arc, but the support arm can also have a different shape. Figure 6c As shown by line 21 in FIG. 1 , which shows an example of a possible shape of the cooling channel, the cooling channel of the support arm may extend along the entire length of the support arm.

[0120] Arrows 25 roughly indicate the flow of fluid through the support arm.

[0121] Optionally, a removable cover 26 may be provided to cover the TCU and a portion of the collimator.

[0122] It should be understood that the present disclosure is not limited to Figure 5 , Figure 6a , Figure 6b and Figure 6c The support arm 13 shown in FIG. 1 is used as an external heat exchanger connected to the TCU. That is, alternatively, the port of the TCU may be connected to a different external heat exchanger.

[0123] Although the present invention has been shown and described in detail in the drawings and the foregoing description, such showing and description should be regarded as exemplary rather than restrictive. The present invention is not limited to the disclosed embodiments. In view of the above description and the drawings, it will be understood by those skilled in the art that various modifications may be made within the scope of the invention defined by the claims.

[0124] List of reference numerals:

[0125] Cooling system 1

[0126] TCU 2

[0127] Heat exchanger plate 3

[0128] Main surface 3a

[0129] Top surface 3b

[0130] Outer wall 3c

[0131] Inner wall 3d

[0132] First End 3e

[0133] Second end 3f

[0134] Cooling fluid circuit 4

[0135] Cooling fluid channels 4a, 4b, Inlet ports 5a, 5b

[0136] Outlet ports 6a, 6b

[0137] Holes 7a, 7b

[0138] Groove 8a

[0139] Hole 8b

[0140] Interface section 9

[0141] Hole 10

[0142] Recess 11

[0143] Pin 12

[0144] Support arm 13

[0145] First end 13a

[0146] The second end 13b Interface section 13a-1 Collimator 14 Hole 14a Pins 15a, 15b Single module 16 X-ray source 17 Screws 18, 19 Cooling channels 20a, 20b Line 21 X-ray equipment 22 X-ray detector 23 Pump 24 Arrow 25 Removable cover 26

Claims

1. A cooling system (1) for an X-ray device (22), the cooling system (1) comprising: A top cooling unit TCU (2) comprising a heat exchanger plate (3) with an integrated cooling fluid circuit (4); and a support arm (13), in particular a C-shaped arc, configured as a single module (16) for mounting the TCU (2) and for mounting an X-ray source (17) of the X-ray device, wherein the fluid circuit (4) is arranged above the main surface (3a) of the heat exchanger plate (3) in order to extract heat via the main surface (3a); The integrated cooling fluid circuit (4) comprises at least one integrated cooling fluid channel (4a, 4b), in particular two or more integrated cooling fluid channels (4a, 4b), and wherein each of the cooling fluid channels (4a, 4b) has two ports (5a, 5b, 6a, 6b), in particular an inlet port (5a, 5b) and an outlet port (6a, 6b); wherein the support arm (13), in particular the C-shaped arc, comprises one or more cooling channels (20a, 20b), each cooling channel having two ports (5a, 5b, 6a, 6b) connected to the cooling fluid channels (4a, 4b) of the cooling fluid circuit (4) or to one of the cooling fluid channels (4a, 4b), so that in the assembled state, one or more closed cooling circuits are formed, each closed cooling circuit being formed by at least one of the cooling channels (20a, 20b) of the support arm (13) and at least one of the cooling fluid channels (4a, 4b) of the heat exchanger plate (3).

2. The cooling system (1) according to claim 1, wherein: The TCU (2) comprises an interface portion (9), wherein the interface portion (9) is configured to engage with, in particular, an interface portion (13a-1) of the support arm (13), wherein the interface portion (9) of the TCU (2) and the interface portion (13a-1) of the support arm (13) are configured to provide an assembly mechanism, wherein the assembly mechanism is configured such that the TCU (2) is detachably fixed to the support arm (13) in an assembled state.

3. The cooling system (1) according to any one of the preceding claims, wherein: The support arm (13) comprises a mounting mechanism, which is used to detachably mount the single module (16) to the support arm (13), in particular to mount the single module (16) in a manner such that the installation and removal of the single module (16) does not require the TCU (2) to be removed from the support arm (13).

4. The cooling system (1) according to any one of the preceding claims, wherein: The cooling system (1), in particular the TCU (2), comprises a mounting mechanism for detachably attaching the TCU (2) to the cell module (16) mounted on the support arm (13), in particular to the top surface of the cell module.

5. The cooling system (1) according to any one of the preceding claims, wherein: The TCU (2) comprises a mounting mechanism for mounting a collimator (14), in particular of the X-ray device (22), wherein the heat exchanger plate (3) has an opening in its main surface (3a) for accommodating at least a part of the collimator (14), and optionally comprises positioning elements, such as pins, for positioning the collimator on top of the heat exchanger plate.

6. The cooling system (1) according to any one of the preceding claims, wherein: The heat exchanger plate (3) and the support arm (13), in particular their respective interface portions, are configured such that ports of the support arm (13) and ports (5a, 5b, 6a, 6b) of the one or more cooling fluid channels (4a, 4b) are configured to form a plug connection with each other.

7. The cooling system (1) according to claim 6, wherein: The cooling system (1) comprises an assembly mechanism, which is configured so that the TCU (2) is detachably fixed to the support arm (13), wherein the assembly mechanism comprises the plug connection and a fixing element, such as a pin, which is configured to lock the relative position of the TCU (2) and the support arm (13) when the plug connection is in a connected state.

8. The cooling system (1) according to any one of the preceding claims, wherein: The cooling system (1) further comprises one or more pumps (24) for circulating a cooling fluid through the cooling fluid circuit (4) of the TCU (2), in particular through the closed cooling circuit formed by the cooling channels (20a, 20b) of the support arm and the cooling fluid channels (4a, 4b) of the heat exchanger plate (3).

9. The cooling system (1) according to any one of the preceding claims, wherein: The one or more integrated cooling fluid channels (4a, 4b) are arranged to optimize heat distribution throughout the heat exchanger plate (3).

10. A cooling system according to any one of the preceding claims, wherein: The TCU (2) is arranged for mounting a collimator (14) of the X-ray device (22) such that the heat exchanger plate (3) is located between the cell module (16) and the collimator (14), and the integrated cooling fluid circuit (4) of the heat exchanger plate (3) comprises a portion of the channel (4b) extending below the mounted collimator (14) and above the cell module (16).

11. A cooling system according to any one of the preceding claims, wherein: The heat exchanger plate (3) has an opening in its main surface (3a) for accommodating at least a portion of the collimator (14), and optionally the shape of the portion of the channel (4b) closely follows the outer shape of the opening.

12. A cooling system according to any one of the preceding claims, wherein: The cooling channels (20a, 20b) of the support arm (13) extend along the entire length of the support arm (13).

13. An X-ray device (22) comprising a cooling system (1) according to any one of the preceding claims and an X-ray source (17) comprising a single module (16), wherein: In the assembled state, the main surface (3a) of the heat exchanger plate (3) is in contact with the top surface of the cell module (16).

14. The X-ray device (22) according to claim 13, wherein: The X-ray device (22) further comprises an X-ray detector (23), which is located at an end of the support arm (13) opposite to the end of the support arm on which the cell module (16) and the TCU (2) are mounted.

15. A cooling unit (2) for being assembled to a cooling system (1) for an X-ray device (22), the cooling system (1) further comprising a support arm (13), in particular a C-shaped arc, configured as a single module (16) for mounting an X-ray source (17) of the X-ray device, in, The cooling unit (2) is configured to be mounted to a support arm (13), and comprises a heat exchanger plate (3) with an integrated cooling fluid circuit (4); wherein the fluid circuit (4) is arranged above the main surface (3a) of the heat exchanger plate (3) in order to extract heat via the main surface (3a); The integrated cooling fluid circuit (4) comprises at least one integrated cooling fluid channel (4a, 4b), in particular two or more integrated cooling fluid channels (4a, 4b), and Wherein, each of the cooling fluid channels (4a, 4b) has two ports (5a, 5b, 6a, 6b), in particular, an inlet port (5a, 5b) and an outlet port (6a, 6b) on one side of the heat exchanger plate, so that they can be fluidically connected to the cooling channels (20a, 20b) of the support arm, and each cooling channel has two ports connected in the assembled state, so that in the assembled state, one or more closed cooling circuits are formed, each closed cooling circuit is formed by at least one of the cooling channels (20a, 20b) of the support arm (13) and at least one of the cooling fluid channels (4a, 4b) of the heat exchanger plate (3).

Images