Electronic element grinding tool
By designing an electronic component grinding processing tool for including a positioning disk and a grinding mechanism, the equipment replacement problem caused by different sizes during the silicon wafer grinding process is solved, and convenient grinding and operational convenience for silicon wafers of different sizes is achieved.
Patent Information
- Application Number
- CN202411850991.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-02-14
AI Technical Summary
In the prior art, due to the different sizes of circular silicon wafers during the silicon wafer grinding process, different grinding equipment need to be replaced, which is troublesome to operate and increases the cost of equipment purchase.
An electronic component grinding processing tool is designed, including a horizontally arranged workbench, positioning disc and grinding mechanism. By providing adsorption positioning holes and annular positioning bosses on the positioning disk, the silicon wafer is positioned by vacuum adsorption and cylinder support, and grinding is performed by a movable lift plate and a grinding wheel driven by a reducer motor. The tooling can replace the positioning disk according to the silicon wafer of different sizes, achieving universality and easy operation.
It realizes convenient grinding of silicon wafers of different sizes, reduces the cost of equipment replacement and purchase, and improves the convenience of operation and the versatility of tooling.
Smart Images
Figure CN119427200A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the field of electronic component processing, and in particular relates to an electronic component grinding processing tool. Background Art
[0002] Silicon wafers are an indispensable and important material in semiconductor processing. They can not only manufacture electronic components, but also are mainly used to manufacture semiconductor components such as diodes, transistors, field effect transistors, etc. These devices are one of the most important components in electronic devices and can be used in electronic products, computers, communication equipment and other fields; they can also manufacture integrated circuits. Silicon wafers are the basic materials for transistors and other electronic components and can be used to manufacture integrated circuits (ICs).
[0003] In the process of manufacturing electronic components, silicon wafers often need to be ground to the thickness required for processing. When grinding, the silicon wafers need to be positioned through positioning grooves. The silicon wafers are placed in the positioning grooves and then ground by grinding wheels. However, due to the different sizes of circular silicon wafers, different grinding equipment needs to be replaced for silicon wafers of different sizes, which makes the operation more troublesome, increases the cost of purchasing equipment, and increases the burden on enterprises. Summary of the invention
[0004] The purpose of the present invention is to provide an electronic component grinding tool, which can conveniently grind silicon wafers and can replace positioning plates according to silicon wafers of different sizes, has good versatility and is relatively easy to operate.
[0005] The objective of the present invention is achieved in this way: an electronic component grinding processing tool comprises a horizontally arranged workbench, a top plate is arranged above the workbench, a plurality of support columns are vertically arranged between the top plate and the workbench, a plurality of support legs are arranged on the lower side of the workbench, a positioning plate is arranged on the workbench, a plurality of adsorption positioning holes are opened on the positioning plate, a supporting mechanism is arranged corresponding to the positioning plate, and a grinding mechanism is arranged correspondingly above the positioning plate.
[0006] When the present invention is working, the circular silicon wafer is placed in the positioning plate, the positioning boss is positioned around the outer circumference of the silicon wafer, the silicon wafer is vacuum adsorbed by the adsorption positioning hole, the positioning boss protrudes from the upper surface of the silicon wafer, and the piston rod of the cylinder supports the edge of the lower surface of the positioning plate. Then the lifting plate of the grinding mechanism moves up and down, and the grinding wheel is driven to rotate by the reduction motor to grind and thin the silicon wafer to a corresponding thickness. If it is necessary to grind silicon wafers of different sizes, the positioning plates of different sizes are replaced, the positioning plates are loosened by the threads, and then replaced with new positioning plates. Compared with the prior art, the beneficial effects of the present invention are: the silicon wafer can be easily ground, and the positioning plates can be replaced according to silicon wafers of different sizes, the versatility is good, and the operation is relatively convenient.
[0007] As a further improvement of the present invention, the workbench and the top plate are both rectangular, and are arranged correspondingly up and down. A vertical support column is arranged at the four corners of the workbench and the top plate. There are four support legs, which are distributed at the four corners of the lower side of the workbench, and a support plate is horizontally arranged between each support leg.
[0008] As a further improvement of the present invention, the positioning disk is circular, and an annular positioning boss is provided on the outer edge of the upper surface of the positioning disk. A circular connecting groove is coaxially provided inside the positioning disk, and each adsorption positioning hole is provided above the circular connecting groove. An entry groove is provided on the positioning disk below the circular connecting groove. A mounting joint is coaxially provided at the center of the lower side of the positioning disk, and the mounting joint is provided corresponding to the entry groove. An internal thread is provided on the inner wall of the mounting joint. An upper joint is vertically provided on the upper side of the workbench, and an external thread is provided on the outer periphery of the upper joint. The mounting joint is threadedly connected to the upper joint. The threaded connection between the mounting joint of the positioning disk and the upper joint of the workbench is loosened, and different positioning disks can be replaced. The openings of different positioning disks correspond to the outer diameters of the silicon wafers, and the new silicon wafers are positioned.
[0009] As a further improvement of the present invention, a lower joint is provided at the lower side of the workbench, an outer thread is provided at the outer periphery of the lower joint, a connecting hole connecting the upper joint and the lower joint is vertically opened on the workbench, and the lower joint is connected to the vacuum generating device through a pipeline. The vacuum generating device provides vacuum to the connecting groove of the positioning plate through the lower joint and the connecting hole, and the silicon wafer is sucked by each adsorption positioning hole for positioning.
[0010] As a further improvement of the present invention, at least four supporting holes surrounding the outer periphery of the connecting hole are vertically opened on the workbench, and each supporting hole is evenly distributed along the circumferential direction. The supporting mechanism includes at least four cylinders evenly distributed along the circumferential direction, each cylinder is located on the support plate and is arranged corresponding to each supporting hole, the piston rod of the cylinder is upward and passes through the corresponding supporting hole, and a pad is arranged at the end of the piston rod of the cylinder, and a rubber shock-absorbing pad is arranged on the surface of the pad, and the shock-absorbing pad contacts the bottom of the positioning plate. After the piston rod of the cylinder moves upward, it supports the edge of the lower surface of the positioning plate. When the grinding wheel grinds the silicon wafer, it provides an upward supporting force to the positioning plate carrying the silicon wafer, and the grinding is more stable.
[0011] As a further improvement of the present invention, the grinding mechanism includes a lifting plate that can move up and down, the lifting plate is transmission-connected to the lifting drive assembly, a mounting bracket is provided on the lower side of the lifting plate, a reduction motor is installed on the mounting bracket, the output end of the reduction motor is downward and a grinding wheel is installed, and the grinding wheel is arranged corresponding to the positioning plate. The reduction motor drives the grinding wheel to rotate to grind the silicon wafer.
[0012] As a further improvement of the present invention, the lifting drive assembly is symmetrically arranged in two groups, and the two groups of lifting drive assemblies are distributed on both sides of the lifting plate. The lifting drive assembly includes a screw rod rotatably arranged between the top plate and the workbench, and a screw rod nut is sleeved on the screw rod. The two screw rod nuts are respectively connected to the left and right sides of the lifting plate in a transmission manner. Two drive motors are installed on the top plate, and the upper end of the screw rod passes through the top plate. The output shaft of the drive motor is connected to the corresponding extended end of the screw rod in a transmission manner. The two screw rods rotate, and the lifting plate is driven to move up and down through the screw rod nut, and the grinding wheel is driven to rise and fall to grind the silicon wafer.
[0013] As a further improvement of the present invention, the mounting bracket is rectangular, and the mounting bracket includes two flat plates spaced apart from each other, two left-right symmetrical side plates are arranged between the two flat plates, and the reduction motor is mounted on the lower flat plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a structural schematic diagram of the present invention.
[0015] Figure 2 for Figure 1 A partial enlarged view of .
[0016] Figure 3 It is a schematic diagram of the structure of each support column on the lower side of the top plate.
[0017] Figure 4 It is a top view of each adsorption positioning hole on the positioning plate.
[0018] Figure 5 A top view of each cylinder.
[0019] Among them, 1 workbench, 2 top plate, 3 support column, 4 support leg, 5 positioning plate, 5a positioning boss, 6 adsorption positioning hole, 7 support plate, 8 connecting groove, 9 entry groove, 10 installation joint, 11 upper joint, 12 lower joint, 13 connecting hole, 14 support hole, 15 cylinder, 16 pad, 17 shock-absorbing pad, 18 lifting plate, 19 mounting bracket, 19a flat plate, 19b side plate, 20 reduction motor, 21 grinding wheel, 22 screw, 22a screw nut, 23 drive motor. DETAILED DESCRIPTION
[0020] like Figure 1-5As shown, it is a kind of electronic component grinding processing tool, including a horizontally arranged workbench 1, a top plate 2 is arranged above the workbench 1, a plurality of support columns 3 are vertically arranged between the top plate 2 and the workbench 1, a plurality of support legs 4 are arranged on the lower side of the workbench 1, a positioning plate 5 is arranged on the workbench 1, a plurality of adsorption positioning holes 6 are opened on the positioning plate 5, a support mechanism is arranged corresponding to the positioning plate 5, and a grinding mechanism is arranged correspondingly above the positioning plate 5. The workbench 1 and the top plate 2 are both rectangular, the workbench 1 and the top plate 2 are arranged correspondingly up and down, a vertical support column 3 is arranged at the four corners of the workbench 1 and the top plate 2, four support legs 4 are arranged, and the four support legs 4 are distributed at the four corners of the lower side of the workbench 1, and a support plate 7 is horizontally arranged between each support leg 4.
[0021] The positioning disk 5 is circular, and an annular positioning boss 5a is provided on the outer edge of the upper surface of the positioning disk 5. A circular connecting groove 8 is coaxially provided inside the positioning disk 5, and each adsorption positioning hole 6 is provided above the circular connecting groove 8. An entry groove 9 is provided below the circular connecting groove 8 on the positioning disk 5. A mounting joint 10 is coaxially provided at the center of the lower side of the positioning disk 5. The mounting joint 10 is provided corresponding to the entry groove 9. The inner wall of the mounting joint 10 is provided with an internal thread. An upper joint 11 is vertically provided on the upper side of the workbench 1. The outer periphery of the upper joint 11 is provided with an external thread, and the mounting joint 10 is threadedly connected with the upper joint 11. The threaded connection between the mounting joint 10 of the positioning disk 5 and the upper joint 11 of the workbench 1 is loosened, and different positioning disks 5 can be replaced. The openings of different positioning disks 5 correspond to the outer diameters of the silicon wafers, and the new silicon wafers are positioned. A lower joint 12 is provided at the lower side of the workbench 1, and an external thread is provided on the outer periphery of the lower joint 12. A connecting hole 13 connecting the upper joint 11 and the lower joint 12 is vertically opened on the workbench 1, and the lower joint 12 is connected to the vacuum generating device through a pipeline. The vacuum generating device provides vacuum to the connecting groove 8 of the positioning plate 5 through the lower joint 12 and the connecting hole 13, and the silicon wafer is sucked by each adsorption positioning hole 6 for positioning.
[0022] At least four support holes 14 surrounding the connecting hole 13 are vertically opened on the workbench 1. Each support hole 14 is evenly distributed along the circumferential direction. The support mechanism includes at least four cylinders 15 evenly distributed along the circumferential direction. Each cylinder 15 is located on the support plate 7 and is arranged corresponding to each support hole 14. The piston rod of the cylinder 15 is upward and passes through the corresponding support hole 14. A pad 16 is arranged at the end of the piston rod of the cylinder 15. A rubber shock-absorbing pad 17 is arranged on the surface of the pad 16. The shock-absorbing pad 17 contacts the bottom of the positioning plate 5. After the piston rod of the cylinder 15 moves upward, it supports the edge of the lower surface of the positioning plate 5. When the grinding wheel 21 grinds the silicon wafer, it provides an upward support force to the positioning plate 5 carrying the silicon wafer, and the grinding is more stable.
[0023] The grinding mechanism includes a lifting plate 18 that can move up and down, and the lifting plate 18 is connected to the lifting drive assembly in a transmission manner. A mounting bracket 19 is provided on the lower side of the lifting plate 18, and a reduction motor 20 is installed on the mounting bracket 19. The output end of the reduction motor 20 is downward and a grinding wheel 21 is installed. The grinding wheel 21 is arranged corresponding to the positioning plate 5. The reduction motor 20 drives the grinding wheel 21 to rotate to grind the silicon wafer. The lifting drive assembly is symmetrically arranged in two groups, and the two groups of lifting drive assemblies are distributed on both sides of the lifting plate 18. The lifting drive assembly includes a screw rod rotatably arranged between the top plate 2 and the workbench 1, and a screw rod nut 22a is sleeved on the screw rod. The two screw rod nuts 22a are respectively connected to the left and right sides of the lifting plate 18 in a transmission manner. Two drive motors 23 are installed on the top plate 2, and the upper end of the screw rod passes through the top plate 2. The output shaft of the drive motor 23 is connected to the corresponding extended end of the screw rod in a transmission manner. The mounting bracket 19 is rectangular and includes two upper and lower spaced flat plates 19a. Two left-right symmetrical side plates 19b are disposed between the two flat plates 19a. The reduction motor 20 is mounted on the lower flat plate 19a.
[0024] When the present invention is working, the circular silicon wafer is placed in the positioning plate 5, and the positioning boss 5a is positioned around the periphery of the silicon wafer. The silicon wafer is vacuum-adsorbed by the adsorption positioning hole 6, and the positioning boss 5a protrudes from the upper surface of the silicon wafer. The piston rod of the cylinder 15 supports the edge of the lower surface of the positioning plate 5. Then the lifting plate 18 of the grinding mechanism moves up and down, and the two screws rotate. The lifting plate 18 is driven up and down by the screw nut 22a, and the grinding wheel 21 is driven to rise and fall. The grinding wheel 21 is driven to rotate by the reduction motor 20 to grind and thin the silicon wafer to a corresponding thickness. If it is necessary to grind silicon wafers of different sizes, replace the positioning plates 5 of different sizes, loosen the positioning plate 5 through the thread, and then replace the new positioning plate 5; loosen the threaded connection between the mounting joint 10 of the positioning plate 5 and the upper joint 11 of the workbench 1, and then replace different positioning plates 5. The openings of different positioning plates 5 correspond to the outer diameter of the silicon wafer, and the new silicon wafer is positioned. The advantages of the present invention are that the silicon wafer can be ground conveniently, the positioning plate 5 can be replaced according to the silicon wafers of different sizes, the present invention has good versatility and is relatively convenient to operate.
[0025] The present invention is not limited to the above-mentioned embodiments. On the basis of the technical solution disclosed in the present invention, technicians in this field can make some substitutions and deformations to some technical features therein according to the disclosed technical content without creative labor, and these substitutions and deformations are all within the protection scope of the present invention.
Claims
1. An electronic component grinding tool, characterized in that: It includes a horizontally arranged workbench, a top plate is arranged above the workbench, a plurality of support columns are vertically arranged between the top plate and the workbench, a plurality of support legs are arranged at the lower side of the workbench, a positioning plate is arranged on the workbench, a plurality of adsorption positioning holes are opened on the positioning plate, a supporting mechanism is arranged corresponding to the positioning plate, and a grinding mechanism is arranged correspondingly above the positioning plate.
2. The electronic component grinding tool according to claim 1, characterized in that: The workbench and the top plate are both rectangular, and are arranged correspondingly up and down. A vertical support column is arranged at the four corners of the workbench and the top plate. There are four support legs, which are distributed at the four corners of the lower side of the workbench, and a support plate is arranged horizontally between each support leg.
3. The electronic component grinding tool according to claim 2, characterized in that: The positioning plate is circular, and an annular positioning boss is provided on the outer edge of the upper surface of the positioning plate. A circular connecting groove is coaxially opened inside the positioning plate, and each adsorption positioning hole is opened above the circular connecting groove. An entry groove is opened on the positioning plate below the circular connecting groove. A mounting joint is coaxially provided at the center of the lower side of the positioning plate, and the mounting joint is arranged corresponding to the entry groove. An internal thread is arranged on the inner wall of the mounting joint. An upper joint is vertically arranged on the upper side of the workbench, and an external thread is arranged on the outer periphery of the upper joint. The mounting joint is threadedly connected to the upper joint.
4. The electronic component grinding tool according to claim 3, characterized in that: A lower joint is arranged at the lower side of the workbench, an outer circumference of the lower joint is arranged with an external thread, a connecting hole connecting the upper joint and the lower joint is vertically opened on the workbench, and the lower joint is connected to the vacuum generating device through a pipeline.
5. The electronic component grinding tool according to claim 4, characterized in that: At least four supporting holes surrounding the connecting hole are vertically opened on the workbench, and the supporting holes are evenly distributed along the circumferential direction. The supporting mechanism includes at least four cylinders evenly distributed along the circumferential direction, and each cylinder is located on the support plate and is arranged corresponding to each supporting hole. The piston rod of the cylinder is upward and passes through the corresponding supporting hole. A pad is arranged at the end of the piston rod of the cylinder, and a rubber shock-absorbing pad is arranged on the surface of the pad, and the shock-absorbing pad is in contact with the bottom of the positioning plate.
6. An electronic component grinding tool according to any one of claims 1 to 5, characterized in that: The grinding mechanism includes a lifting plate that can move up and down, the lifting plate is transmission-connected to the lifting drive assembly, a mounting bracket is provided on the lower side of the lifting plate, a reduction motor is installed on the mounting bracket, the output end of the reduction motor is downward and a grinding wheel is installed, and the grinding wheel is arranged corresponding to the positioning plate.
7. The electronic component grinding tool according to claim 6, characterized in that: The lifting drive assembly is symmetrically arranged in two groups, and the two groups of lifting drive assemblies are distributed on both sides of the lifting plate. The lifting drive assembly includes a screw rod rotatably arranged between the top plate and the workbench, and a screw rod nut is sleeved on the screw rod. The two screw rod nuts are respectively connected to the left and right sides of the lifting plate in a transmission manner. Two driving motors are installed on the top plate. The upper end of the screw rod passes through the top plate, and the output shaft of the driving motor is connected to the corresponding protruding end of the screw rod in a transmission manner.
8. The electronic component grinding tool according to claim 6, characterized in that: The mounting bracket is rectangular and comprises two upper and lower spaced flat plates, two left-right symmetrical side plates are arranged between the two flat plates, and the reduction motor is mounted on the lower flat plate.