Sample material box cooling oscillation device

Abstract

The invention relates to the technical field of biochemical experiment automation equipment, and discloses a sample material box cooling oscillation device which comprises a supporting frame, a rotating shaft is arranged on the supporting frame, an oscillation base is installed on the rotating shaft on the inner side of the supporting frame, the rotating shaft on the outer side of the supporting frame is connected to a driving device, and a cooling unit is installed on the oscillation base. A refrigeration surface is arranged above the cooling unit, a heat conduction frame is fixedly arranged above the refrigeration surface, the lower surface of the heat conduction frame is attached to the refrigeration surface, an adaptive cavity hole is formed in the heat conduction frame, a sample material box is fixedly arranged in the adaptive cavity hole, and a material box fixing frame is arranged on the supporting frame; and the material box fixing frame is used for pressing and loosening the sample material box on the heat conduction frame. According to the invention, the refrigeration module and the sample material box are bound together for oscillation, so that the unification of refrigeration and automatic operation is realized.

Description

Technical Field

[0001] The invention relates to the technical field of biochemical experiment automation equipment, and in particular to a sample box cooling and oscillating device. Background Art

[0002] During the nucleic acid extraction experiment of biological samples, it should be carried out at a lower temperature as much as possible, and oscillate to make it uniform to ensure the efficiency and quality of nucleic acid extraction. Extract nucleic acids under low temperature conditions to maintain the stability of nucleic acids: Low temperature environment can reduce the risk of nucleic acid degradation and maintain its integrity and purity.

[0003] Existing oscillating devices do not have a cooling function. When in use, the oscillating device needs to be placed in a refrigerated device to ensure the stability of the refrigerated temperature while ensuring the normal movement of the device. However, this method cannot integrate the oscillating device into the biological laboratory automation system.

[0004] In the automation system of biological laboratories, the placement and removal of samples during the oscillation process are all completed through robotic automation, and it is impossible to place the equipment in a cold room for automated operations.

[0005] The Chinese patent "Low-temperature oscillator based on microplate" (publication number: CN206002376U) discloses a low-temperature oscillator that cools the microplate below by placing an ice layer in the oscillation box, thereby reducing the temperature on the surface of the microplate. This physical cooling method cannot accurately control the temperature of the microplate, and the liquid after the ice layer melts directly affects the vibration frequency. The box is placed above the microplate, making it impossible for automated equipment to operate the microplate. Summary of the invention

[0006] The purpose of the present invention is to solve the above-mentioned problem and to provide a sample box cooling and oscillating device, which binds a refrigeration module and a sample box together for oscillation, thereby realizing the unification of refrigeration and automated operation.

[0007] The technical solution adopted by the present invention is: A sample box cooling and oscillation device, characterized in that it includes a support frame, a rotating shaft is arranged on the support frame, an oscillation seat is installed on the rotating shaft inside the support frame, the rotating shaft outside the support frame is connected to a driving device, a cooling unit is installed on the oscillation seat, the top of the cooling unit is a refrigeration surface, a heat conductive frame is fixedly arranged above the refrigeration surface, the lower surface of the heat conductive frame is in contact with the refrigeration surface, an adapting cavity is arranged on the heat conductive frame, a sample box is fixedly arranged in the adapting cavity, a box fixing frame is arranged on the support frame, and the box fixing frame realizes pressing and releasing operations on the sample box on the heat conductive frame.

[0008] Furthermore, the material box fixing frame includes a push rod motor arranged on the support frame, a rotating shaft is arranged on the heat-conducting frame, the rotating shaft is perpendicular to the push rod of the push rod motor, a pressure rod is arranged on the rotating shaft, the lower end of the pressure rod is rotatably connected to the rocker arm, a linkage head is arranged on the rocker arm, and a tension spring is used to generate a pulling force between the end of the pressure rod away from the rotating shaft and the heat-conducting frame, and the pulling force causes the pressure rod to generate a pressing force on the material box on the heat-conducting frame, and when the push rod motor pushes the linkage head of the rocker arm to move the rocker arm forward, the pressure rod rotates with the rotating shaft to overcome the pulling force of the tension spring and open from the material box.

[0009] Furthermore, the adapter holes on the heat-conducting frame are divided into several rows, each row of adapter holes is used to set a sample box, and is equipped with a box fixing rack, multiple box fixing racks share a rocker rod, and the rocker rod simultaneously drives multiple box fixing racks to open and close multiple sample boxes.

[0010] Furthermore, the rotating shaft is divided into two parts, which are respectively arranged in the shaft holes on both sides of the heat-conducting frame, and the two parts of the rotating shaft are coaxially connected to the two end parts of the pressure rod.

[0011] Furthermore, a cushion block is arranged on one side of the heat-conducting frame close to the push rod motor, the axial hole on this side is arranged on the cushion block, another axial hole is arranged on the other side of the heat-conducting frame, and the tension spring is arranged between the cushion block and the pressure rod.

[0012] Furthermore, the cooling unit is a semiconductor refrigeration component, including a semiconductor refrigeration sheet and a heat dissipation frame. The semiconductor refrigeration sheet is arranged on the heat dissipation frame, the cooling surface of the semiconductor refrigeration sheet is in contact with the bottom surface of the heat-conducting frame, and the heating surface of the semiconductor refrigeration sheet is in contact with the heat dissipation frame.

[0013] Furthermore, a heat-insulating fence is arranged between the heat-dissipating frame and the heat-conducting frame, and positioning angle pieces are arranged on the heat-insulating fence at four corner positions of the heat-dissipating frame, and the heat-dissipating frame is fixed on the positioning angle pieces.

[0014] Furthermore, a guide groove is provided on the thermal insulation fence, and a water outlet of the guide groove is located on one side of the thermal insulation fence.

[0015] Furthermore, heat dissipation holes are arranged on the left and right sides of the heat dissipation frame, a fan and an air duct are arranged inside the heat dissipation frame, and the air duct is matched with the heat dissipation holes.

[0016] Furthermore, the driving device is a reduction motor arranged on the outside of the support frame, and the reduction motor drives the oscillation seat to swing, and the swing angle is -90° to +90°.

[0017] The beneficial effects of the present invention are: (1) The semiconductor refrigeration module is small in size and can be organically combined with the sample box, making it easy to integrate into the automation system; (2) The sample box is easy and quick to install, suitable for automatic loading and unloading; (3) Precise temperature control, suitable for long-term unattended workstations. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Attached Figure 1 It is a three-dimensional structural schematic diagram of the present invention; Attached Figure 2 is a schematic diagram of the three-dimensional structure of the oscillation drive unit of the present invention; Attached Figure 3 It is a schematic diagram of the three-dimensional structure of the cooling unit of the present invention; Attached Figure 4 Yes Figure 3 Schematic diagram of the internal structure without some panels; Attached Figure 5 It is a schematic diagram of the structure of the heat conducting frame; Attached Figure 6 It is a schematic diagram of the structure of the sample box; Attached Figure 7 This is a partial enlarged view of the position of the material box fixing frame.

[0019] The reference numerals in the accompanying drawings are: 1. Heat transfer unit of material box; 2. Cooling unit; 3. Oscillation drive unit; 4. Support frame; 5. Oscillation seat; 6. Gear motor; 7. Heat conduction rack; 8. Sample box; 9. Semiconductor cooling chip; 10. Heat dissipation frame; 11. Heat transfer plate; 12. Heat insulation fence; 13. Positioning angle piece; 14. Heat dissipation hole; 15. Fan; 16. Air duct; 17. Adaptation cavity hole; 18. Material box fixing frame; 19. Swing rod; 20. Push rod motor; 21. Push rod; 22. Press rod; 23. Linkage head; 24. Tension spring; 25. Shaft hole; 26. Spacer; 27. Positioning piece; 28. Position sensor. DETAILED DESCRIPTION

[0020] The specific implementation of the sample box cooling and oscillating device of the present invention will be described in detail below with reference to the accompanying drawings.

[0021] See attached Figure 1 The sample box cooling and oscillating device is mainly composed of a box heat transfer unit 1, a cooling unit 2 and an oscillation driving unit 3.

[0022] See attached Figure 2 The support frame 4 of the oscillation drive unit 3 is provided with a rotating shaft, an oscillation seat 5 is installed on the rotating shaft inside the support frame 4, and the rotating shaft outside the support frame 4 is connected to a driving device, which is a reduction motor 6. The reduction motor 6 drives the oscillation seat 5 to swing, and the swing angle is -90° to +90°. According to the type of sample, the system can adjust the frequency and angle of the swing.

[0023] A cooling unit 2 is mounted on the oscillating seat 5, and a cooling surface is disposed above the cooling unit 2. A material box heat transfer unit 1 is fixedly disposed above the cooling surface. The material box heat transfer unit 1 includes a heat conducting frame 7, and the lower surface of the heat conducting frame 7 is in contact with the cooling surface. The heat conducting frame 7 is used to place a sample material box 8 to store the sample material box 8 at low temperature.

[0024] See attached Figure 3 , 4 The cooling unit 2 is a semiconductor refrigeration component, including a semiconductor refrigeration sheet 9 and a heat dissipation frame 10. The semiconductor refrigeration sheet 9 is arranged on the heat dissipation frame 10. The cooling surface of the semiconductor refrigeration sheet 9 is attached to the bottom surface of the heat conduction frame 7 through the heat transfer plate 11, and the heating surface of the semiconductor refrigeration sheet 9 is attached to the heat dissipation frame 10. A heat insulation fence 12 is arranged between the heat dissipation frame 10 and the heat conduction frame 7. Positioning angle pieces 13 are arranged on the heat insulation fence 12 at the four corners of the heat dissipation frame 10, and the heat conduction frame 7 is fixed on the positioning angle pieces 13.

[0025] The heat insulation fence 12 ensures heat transfer between the heat dissipation frame 10 and the heat conducting frame 7. A guide groove (not shown in the figure) is provided on the heat insulation fence 12, and the water outlet of the guide groove is located on one side of the heat insulation fence 12. Since the temperature of the heat conducting frame 7 is relatively low, condensed water will form on its surface, and the guide groove can be used to lead out the condensed water.

[0026] Heat dissipation holes 14 are arranged on the left and right sides of the heat dissipation frame 10 . A fan 15 and an air duct 16 are arranged inside the heat dissipation frame 10 . The air duct 16 is matched with the heat dissipation holes 14 .

[0027] See attached Figure 5 , 6 7 , an adapting cavity hole 17 is set on the heat-conducting frame 7 , a sample material box 8 is fixedly set in the adapting cavity hole 17 , a material box fixing frame 18 is set on the supporting frame 4 , and the material box fixing frame 18 realizes pressing and releasing operations on the sample material box 8 on the heat-conducting frame 7 .

[0028] The adapting cavity holes 17 on the heat-conducting frame 7 are divided into several rows, each row of adapting cavity holes 17 is used to set a sample material box 8, and is equipped with a material box fixing frame 18. Multiple material box fixing frames 18 share a rocker rod 19, and the rocker rod 19 simultaneously drives multiple material box fixing frames 18 to open and close multiple sample material boxes 8.

[0029] The material box fixing frame 18 includes a push rod motor 20 arranged on the support frame 4, a rotating shaft is arranged on the heat-conducting frame 7, the rotating shaft is perpendicular to the push rod 21 of the push rod motor 20, a pressure rod 22 is arranged on the rotating shaft, the lower end of the pressure rod 22 is rotatably connected to the swing rod 19, and a linkage head 23 is arranged on the swing rod 19. A tension is generated between the end of the pressure rod 22 away from the rotating shaft and the heat-conducting frame 7 through a tension spring 24, and the tension causes the pressure rod 22 to generate a pressing force on the sample material box 8 on the heat-conducting frame 7. When the push rod motor 20 pushes the linkage head 23 of the swing rod 19 to move the swing rod 19 forward, the pressure rod 22 rotates with the rotating shaft to overcome the tension of the tension spring 24 and open from the sample material box 8. The linkage head 23 of the swing rod 19 is set in a screw shape to facilitate line contact with the push rod 21.

[0030] A positioning piece 27 is provided on the push rod 21 of the push rod motor 20 , and a position sensor 28 is provided on the support frame 4 , and the two cooperate to determine the position where the push rod motor 20 pushes the pressing rod 22 , so as to determine whether the pressing rod 22 closes the sample box 8 or not.

[0031] The rotating shaft is divided into two parts, which are respectively arranged in the shaft holes 25 on both sides of the heat-conducting frame 7, and the two parts of the rotating shaft are coaxially connected to the two end parts of the pressing rod 22. A cushion block 26 is arranged on the side of the heat-conducting frame 7 close to the push rod motor 20, and the shaft hole 25 on this side is arranged on the cushion block 26. Another shaft hole 25 is arranged on the other side of the heat-conducting frame 7, and the tension spring 24 is arranged between the cushion block and the pressing rod 22.

[0032] The working process of this patent is that after starting the equipment, the cooling unit 2 is first operated to reduce the temperature to a predetermined temperature, and the push rod motor 20 pushes the swing rod 19 forward. At this time, the pressure rod 22 is opened, and the centrifuge tube and the sample box 8 with the sample configured are placed in the heat-conducting frame 7. After the arrangement is completed, the push rod motor 20 retracts the push rod 21, and the tension spring 24 resets the swing rod 19. At the same time, the pressure rod 22 is pressed tightly against the sample box 8. The loading of the sample box 8 is completed. Then the reduction motor 6 is started to drive the vibration seat to swing and oscillate. The function of oscillating the sample in a low temperature environment is realized.

[0033] The entire device can be integrated into an automated system for nucleic acid detection, with the sample box 8 operated by a robot, the operation of the push rod motor 20 and the reduction motor 6 controlled by the system, and the refrigeration parameters of the cooling unit 2 controlled.

[0034] The above are only preferred embodiments of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A sample box cooling and oscillating device, characterized in that: The invention comprises a support frame, a rotating shaft is arranged on the support frame, an oscillation seat is installed on the rotating shaft inside the support frame, the rotating shaft outside the support frame is connected to a driving device, a cooling unit is installed on the oscillation seat, a refrigeration surface is arranged above the cooling unit, a heat-conducting frame is fixedly arranged above the refrigeration surface, the lower surface of the heat-conducting frame is in contact with the refrigeration surface, an adapting cavity hole is arranged on the heat-conducting frame, a sample box is fixedly arranged in the adapting cavity hole, a box fixing frame is arranged on the support frame, and the box fixing frame realizes pressing and releasing operations on the sample box on the heat-conducting frame.

2. The sample box cooling and oscillating device according to claim 1, characterized in that: The material box fixing frame includes a push rod motor arranged on the supporting frame, a rotating shaft is arranged on the heat-conducting frame, the rotating shaft is perpendicular to the push rod of the push rod motor, a pressure rod is arranged on the rotating shaft, the lower end of the pressure rod is rotatably connected to the rocking rod, a linkage head is arranged on the rocking rod, a tension spring is used to generate tension between the end of the pressure rod away from the rotating shaft and the heat-conducting frame, the tension causes the pressure rod to generate a pressing force on the material box on the heat-conducting frame, and when the push rod motor pushes the linkage head of the rocking rod to move the rocking rod forward, the pressure rod rotates with the rotating shaft to overcome the tension of the tension spring and open from the material box.

3. The sample box cooling and oscillating device according to claim 2, characterized in that: The adapting holes on the heat-conducting frame are divided into several rows, each row of adapting holes is used to set a sample box, and is equipped with a box fixing frame, multiple box fixing frames share a swing rod, and the swing rod simultaneously drives multiple box fixing frames to open and close multiple sample boxes.

4. The sample box cooling and oscillating device according to claim 3, characterized in that: The rotating shaft is divided into two parts, which are respectively arranged in the shaft holes on both sides of the heat-conducting frame, and the two parts of the rotating shaft are coaxially connected with the two end parts of the pressure rod.

5. The sample box cooling and oscillating device according to claim 4, characterized in that: A cushion block is arranged on one side of the heat-conducting frame close to the push rod motor, and the axial hole on this side is arranged on the cushion block. Another axial hole is arranged on the other side of the heat-conducting frame, and the tension spring is arranged between the cushion block and the pressure rod.

6. The sample box cooling and oscillating device according to any one of claims 1 to 5, characterized in that: The cooling unit is a semiconductor refrigeration component, including a semiconductor refrigeration sheet and a heat dissipation frame. The semiconductor refrigeration sheet is arranged on the heat dissipation frame. The cooling surface of the semiconductor refrigeration sheet is in contact with the bottom surface of the heat conduction frame, and the heating surface of the semiconductor refrigeration sheet is in contact with the heat dissipation frame.

7. The sample box cooling and oscillating device according to claim 6, characterized in that: A heat-insulating fence is arranged between the heat-dissipating frame and the heat-conducting frame, and positioning angle pieces are arranged on the heat-insulating fence at four corner positions of the heat-dissipating frame, and the heat-conducting frame is fixed on the positioning angle pieces.

8. The sample box cooling and oscillating device according to claim 7, characterized in that: A guide groove is arranged on the heat-insulating fence, and a water outlet of the guide groove is located on one side of the heat-insulating fence.

9. The sample box cooling and oscillating device according to claim 6, characterized in that: The left and right sides of the heat dissipation frame are provided with heat dissipation holes, a fan and an air duct are provided inside the heat dissipation frame, and the air duct is matched with the heat dissipation holes.

10. The sample box cooling and oscillating device according to any one of claims 1 to 5, characterized in that: The driving device is a reduction motor arranged on the outside of the support frame, and the reduction motor drives the oscillation seat to swing, and the swing angle is -90° to +90°.

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