Electroplating device for semiconductor processing

Abstract

The invention discloses a semiconductor processing electroplating device which comprises a machine frame, a conveying assembly, a plurality of electroplating tanks, a sliding block and a plurality of clamping assemblies, and the machine frame comprises a first frame body and a second frame body; the conveying assembly comprises a first rail and a second rail, the second rail is two sub-rails, and the first rail is arranged between the two sub-rails; the plurality of electroplating baths are longitudinally and sequentially arranged below the first track; the sliding block is arranged on the conveying assembly in a sliding mode, and a driving component is arranged on the first rail. The multiple clamping assemblies are detachably arranged on the sliding block. Each clamping assembly comprises a back plate, an upper clamp and two side clamps, wherein the upper clamp and the two side clamps are arranged on the back plate. Therefore, through the arrangement of the driving component, the semiconductor can be electroplated in the continuous processing process, the overall production efficiency is remarkably improved, through the arrangement of the clamping assembly, the semiconductor can be rapidly and stably fixed, and the problem of uneven electroplating caused by material deformation in the electroplating process can be effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor electroplating, and in particular to a semiconductor processing electroplating device. Background Art

[0002] As an efficient, environmentally friendly and adaptable electroplating process, semiconductor VCP electroplating technology plays an important role in the manufacturing process of semiconductor devices.

[0003] In the process of electroplating semiconductors, existing semiconductor processing electroplating equipment needs to transfer the semiconductors to the electroplating area separately for continuous vertical electroplating processing operations, and then transfer the semiconductors to the next processing step after electroplating. This link interrupts the continuous operation process of the production line and limits the improvement of overall production efficiency.

[0004] In addition, current electroplating equipment generally adopts a top clamping mechanism. For some thin plates or soft plates, during the continuous vertical movement, especially in the VCP (vertical continuous plating) system, when the plating liquid is sprayed forcefully from both sides, this clamping method may affect the stability of the conductor, causing the semiconductor thin plate to deform during electroplating, which inevitably affects the uniformity and quality of the electroplating and reduces the final performance of the product. Summary of the invention

[0005] The present application aims to solve one of the technical problems in the related art at least to some extent.

[0006] To this end, one purpose of the present application is to propose a semiconductor processing electroplating device. Through the set driving components, the semiconductor can be electroplated during continuous processing, which significantly improves the overall production efficiency. Through the set clamping components, the semiconductor can be fixed quickly and stably, which can effectively reduce the problem of uneven electroplating caused by material deformation during the electroplating process.

[0007] To achieve the above-mentioned purpose, the first embodiment of the present application proposes a semiconductor processing electroplating device, including a frame, a conveying component, a plurality of electroplating tanks, a slider and a plurality of clamping components, wherein the frame includes a first frame and a second frame, wherein the first frame is arranged on the second frame; the conveying component includes a first track and a second track, wherein the second track is two-section sub-tracks, the first track is arranged between the two sub-tracks, the first track is arranged on the first frame through a lifting component, and the second track is arranged on the second frame; the plurality of electroplating tanks are longitudinally arranged in sequence below the first track; the slider is slidably arranged on the conveying component, and a driving component is arranged on the first track; the plurality of The clamping assembly is detachable and arranged on the slider, and the clamping assembly includes a back plate and an upper clamp and two side clamps arranged on the back plate, wherein the back plate includes a top plate and two side plates, wherein the top plate is vertically arranged at the bottom of the slider, and the two side plates are respectively arranged on both sides of the longitudinal direction of the top plate; the upper clamp is arranged on the top plate through a rotating component; the two side clamps are respectively arranged on the two side plates, and the side clamps include a control rope and a plurality of roller shafts, wherein the control rope is connected to the rotating component, a mounting block is movably provided on one side of the roller shaft, the mounting block is slidably connected to the side plate, the control rope is vertically movably arranged through the plurality of mounting blocks in sequence, and the roller shaft is arranged in sliding contact with the corresponding side plate.

[0008] In addition, the semiconductor processing electroplating device proposed in the present application may also have the following additional technical features:

[0009] In one embodiment of the present application, the upper clamp includes a rotating shaft and a plurality of clamping plates, wherein the rotating shaft is movably arranged on the top plate, a connecting plate is extended from the rotating shaft, and the connecting plate is connected to the rotating component through a connecting rope; the plurality of clamping plates are longitudinally arranged in sequence on the rotating shaft.

[0010] In one embodiment of the present application, the rotating component includes a winding shaft, which is arranged in a accommodating cavity inside the top plate, and a first motor is provided at the end of the winding shaft. The connecting rope passes through the accommodating cavity and is connected to the small diameter portion in the middle of the winding shaft, and the two control ropes respectively pass through the accommodating cavity and are connected to the large diameter portions on both sides of the winding shaft.

[0011] In one embodiment of the present application, the diameters of the multiple rollers on the side plate decrease sequentially from top to bottom, and a plurality of baffles for limiting the rollers are vertically arranged on the side plate in sequence, and the distances between the multiple baffles and the side plate decrease sequentially from top to bottom.

[0012] In one embodiment of the present application, the driving component includes a second motor, a meshing rack and a gear, wherein the second motor is arranged on a mounting seat on the outer side of the first track, and a moving block is provided at the output end of the second motor through a movable shaft, the moving block passes through the first track and has a groove at one end, a moving plate is provided in the groove through a spring, and the moving plate is abutted against one longitudinal side of the slider; the gear sleeve is arranged on the outer side of the movable shaft, and the rack is arranged on the first track.

[0013] In one embodiment of the present application, one longitudinal side of the sliding block is arranged in an arc shape.

[0014] Compared with the prior art, the beneficial effects of this application are:

[0015] 1. The set driving components can ensure the continuity of the slider's transmission between the first track and the two sub-tracks, so that the semiconductor can be electroplated during the continuous processing process, which significantly improves the overall production efficiency, not only reduces the labor cost, but also shortens the production cycle.

[0016] 2. The clamping assembly can quickly and stably fix the upper side and both longitudinal sides of the semiconductor, which can effectively reduce the problem of uneven electroplating caused by material deformation during the electroplating process.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 It is a structural schematic diagram of a semiconductor processing electroplating device according to an embodiment of the present application;

[0020] Figure 2 This is a schematic diagram of the structure of a clamping assembly of a semiconductor processing electroplating device according to an embodiment of the present application;

[0021] Figure 3 It is a schematic cross-sectional structure diagram of the connection between the driving component and the top plate of the semiconductor processing electroplating device according to one embodiment of the present application;

[0022] Figure 4 It is a schematic diagram of a front cross-sectional structure of a clamping assembly of a semiconductor processing electroplating device according to one embodiment of the present application;

[0023] Figure 5 It is a schematic structural diagram of a semiconductor processing electroplating device according to another embodiment of the present application.

[0024] As shown in the figure: 10, frame; 11, first frame; 12, second frame; 13, lifting component; 20, transmission component; 21, first track; 211, mounting seat; 22, second track; 221, sub-track; 23, slider; 30, electroplating tank; 40, semiconductor; 60, clamping component; 61, back plate; 611, top plate; 6111, accommodating cavity; 612, side plate; 6121, baffle; 62, upper fixture ; 621, rotating shaft; 6211, connecting plate; 622, clamping plate; 63, side clamp; 631, control rope; 632, roller; 6321 mounting block; 70, connecting rope; 80, winding shaft; 81, first motor; 90, driving component; 91, second motor; 911, movable shaft; 912, moving block; 9121, groove; 9122, spring; 9123, moving plate; 92, rack; 93, gear. DETAILED DESCRIPTION

[0025] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limitations on the present application. On the contrary, the embodiments of the present application include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.

[0026] The semiconductor processing electroplating device according to an embodiment of the present application is described below with reference to the accompanying drawings.

[0027] like Figure 1-Figure 5 As shown, the semiconductor processing electroplating device according to the embodiment of the present application may include a frame 10, a conveying assembly 20, a plurality of electroplating tanks 30, a slider 23 and a plurality of clamping assemblies 60.

[0028] The frame 10 may include a first frame body 11 and a second frame body 12 , wherein the first frame body 11 is disposed on the second frame body 12 .

[0029] The conveying assembly 20 may include a first track 21 and a second track 22, wherein the second track 22 is composed of two sub-tracks 221, the first track 21 is disposed between the two sub-tracks 221, the first track 21 is disposed on the first frame 11 through the lifting component 13, and the second track 22 is disposed on the second frame 12. A plurality of electroplating tanks 30 are longitudinally disposed sequentially below the first track 21. The slider 23 is slidably disposed on the conveying assembly 20, and a driving component 90 is disposed on the first track 21.

[0030] It should be noted that the lifting component 13 described in this embodiment can control the vertical movement of the first rail 21. After the first rail 21 moves, it can drive the slider 23 and multiple clamping components 60 thereon to move vertically together, so that the semiconductor 40 on the clamping component 60 enters the corresponding electroplating tank 30, and the electroplating tank 30 performs electroplating on the semiconductor 40.

[0031] It should be noted that the driving component 90 described in this embodiment is capable of controlling the sliding movement of the slider 23 in the first track 21, and this control capability remains unaffected when the slider 23 seamlessly switches between the first track 21 and the second track 22, thereby ensuring the continuity and stability of the operation.

[0032] It can be understood that in the process of the slider 23 entering another sub-track 221 from one sub-track 221, the slider 23 first enters the first track 21, and then moves in the first track 21 under the action of the driving component 90. During the process, the device can electroplate the semiconductor 40, so that the semiconductor 40 can be electroplated during continuous processing, which significantly improves the overall production efficiency, not only reduces labor costs, but also shortens the production cycle.

[0033] A plurality of clamping assemblies 60 are detachable and arranged on the slider 23. The clamping assemblies 60 may include a back plate 61, an upper clamp 62 and two side clamps 63 arranged on the back plate 61. The back plate 61 may include a top plate 611 and two side plates 612. The top plate 611 is vertically arranged at the bottom of the slider 23, and the two side plates 612 are respectively arranged on both sides of the longitudinal direction of the top plate 611. The upper clamp 62 is arranged on the top plate 611 through a rotating component. The two side clamps 63 are respectively arranged on the two side plates 612. The side clamps 63 may include a control rope 631 and a plurality of rollers 632. The control rope 631 is connected to the rotating component, and a mounting block 6321 is movably arranged on one side of the roller 632. The mounting block 6321 is slidably connected to the side plate 612. The control rope 631 is vertically and sequentially arranged to penetrate through the plurality of mounting blocks 6321. The roller 632 is arranged to slide against the corresponding side plate 612.

[0034] It can be understood that the upper clamp 62 and the two side clamps 63 can clamp and fix the upper side and the two longitudinal sides of the semiconductor 40 respectively.

[0035] It should be noted that the rotating component described in this embodiment can drive the upper clamp 62 to rotate, and at the same time can drive the two control ropes 631 to reel in, so that the control rope 631 drives the roller 632 connected thereto to move and achieve clamping of one longitudinal side of the semiconductor 40. The two side clamps 63 can be used in combination to achieve clamping of both longitudinal sides of the semiconductor 40.

[0036] It should be noted that the control rope 631 described in this embodiment can drive the mounting block 6321 connected thereto to move vertically after movement, and the mounting block 6321 drives the roller 632 connected thereto to move vertically, and the roller 632 can rotate during the vertical movement, thereby effectively avoiding potential damage (such as scratches, wear, etc.) to the semiconductor 40 during the movement of the roller 632, and enhancing the ability of the roller 632 to firmly clamp and fix the semiconductor 40.

[0037] Specifically, when electroplating operation is required on the semiconductor 40, the relevant personnel first control the slider 23 to move intermittently on the first track 21 through the driving component 90. When the slider 23 moves intermittently and stops, the first track 21 is controlled to move vertically through the lifting component 13. After the first track 21 moves, it can drive the slider 23 and multiple clamping assemblies 60 thereon to move vertically together, so that the semiconductor 40 on the clamping assembly 60 enters the corresponding electroplating tank 30, and the electroplating tank 30 performs electroplating operation on the semiconductor 40.

[0038] After the semiconductor 40 passes through multiple electroplating tanks 30 for continuous electroplating, the relevant personnel control the first track 21 to reset through the lifting component 13, so that the two ends of the first track 21 are reconnected with the two sub-tracks 221. At this time, the driving component 90 can control the slider 23 to move from the first track 21 to the corresponding sub-track 221, thereby achieving the continuity of the processing of the semiconductor 40. In addition, the next slider 23 can be controlled to enter the first track 21, and the above steps can be repeated to achieve continuous electroplating processing of the semiconductor 40.

[0039] In one embodiment of the present application, Figure 2 As shown, the upper clamp 62 may include a rotating shaft 621 and a plurality of clamping plates 622, wherein the rotating shaft 621 is movably arranged on the top plate 611, a connecting plate 6211 is extended from the rotating shaft 621, the connecting plate 6211 is connected to the rotating component through a connecting rope 70, and a plurality of clamping plates 622 are longitudinally arranged on the rotating shaft 621 in sequence.

[0040] Specifically, the rotating component can control the connection plate 6211 and the rotation axis 621 to rotate relative to the top plate 611 through the connection rope 70, thereby achieving the function of controlling the rotation of multiple clamping plates 622 and realizing the clamping function of multiple clamping plates 622 and the top plate 611 on the upper side of the semiconductor 40.

[0041] Furthermore, if Figure 3 and Figure 4As shown, the rotating component may include a winding shaft 80, which is arranged in a accommodating cavity 6111 inside the top plate 611, and a first motor 81 is provided at the end of the winding shaft 80. The connecting rope 70 passes through the accommodating cavity 6111 and is connected to the small diameter portion in the middle of the winding shaft 80, and the two control ropes 631 respectively pass through the accommodating cavity 6111 and are connected to the large diameter portions on both sides of the winding shaft 80.

[0042] It should be noted that the winding shaft 80 described in this embodiment has large diameter parts on both sides and a small diameter part in the middle, so that the winding movement distances of the connecting rope 70 and the control rope 631 on the winding shaft 80 are different, so that the side clamp 63 can adapt to the clamping of semiconductors 40 of different lengths.

[0043] Specifically, when it is necessary to control the clamping assembly 60 to clamp the semiconductor 40, the first motor 81 is started first. The first motor 81 drives the winding shaft 80 to rotate, so that the connecting rope 70 and the two control ropes 631 can be wound on the winding shaft 80, so that the connecting rope 70 drives the rotating shaft 621 to rotate, and the control rope 631 drives the multiple mounting blocks 6321 connected thereto to move vertically, thereby realizing the function of clamping and fixing the upper side and both longitudinal sides of the semiconductor 40.

[0044] Furthermore, if Figure 2 , Figure 3 and Figure 4 As shown, the diameters of the multiple rollers 632 on the side plate 612 decrease from top to bottom, and multiple baffles 6121 for limiting the rollers 632 are vertically arranged on the side plate 612, and the distances between the multiple baffles 6121 and the side plate 612 decrease from top to bottom.

[0045] It is understandable that the multiple baffles 6121 are capable of limiting the corresponding rollers 632 respectively, so that the multiple rollers 632 are located at the corresponding baffles 6121 when moving vertically, which helps to stably clamp the semiconductor 40.

[0046] In one embodiment of the present application, Figure 3 As shown, the driving component 90 may include a second motor 91, a meshing rack 92 and a gear 93, wherein the second motor 91 is arranged on a mounting seat 211 outside the first track 21, and a moving block 912 is arranged at the output end of the second motor 91 through a movable shaft 911, the moving block 912 passes through the first track 21 and has a groove 9121 at one end, a moving plate 9123 is arranged in the groove 9121 through a spring 9122, and the moving plate 9123 is arranged against one longitudinal side of the slider 23. The gear 93 is sleeved on the outer side of the movable shaft 911, and the rack 92 is arranged on the first track 21. One longitudinal side of the slider 23 is arranged in an arc shape.

[0047] It should be noted that when the slider 23 described in this embodiment enters the first track 21, the curved side of the slider 23 first contacts the movable plate 9123, and in the process of the slider 23 entering the first track 21, the movable plate 9123 can first move in the direction of the groove 9121 and compress the spring 9122. When the slider 23 moves and separates from the movable plate 9123, the movable plate 9123 moves and resets under the action of the spring 9122. At this time, the movable plate 9123 can push the slider 23 to move in the first track 21 under the control of the driving component 90.

[0048] Specifically, when the relevant personnel controls the slider 23 to move on the first track 21 through the driving component 90, the second motor 91 is started first, and the second motor 91 drives the movable shaft 911 to rotate. The rotation of the movable shaft 911 can drive the gear 93 to rotate. Under the action of the rack 92, the mounting seat 211, the second motor 91, the movable shaft 911, the gear 93, the moving block 912 and the moving plate 9123 will move longitudinally linearly together. During the process, the moving plate 9123 can push the slider 23 to move in the first track 21.

[0049] In summary, the semiconductor processing electroplating device in the embodiment of the present application, through the provided driving components, can enable the semiconductor to be electroplated during continuous processing, thereby significantly improving the overall production efficiency. Through the provided clamping components, the semiconductor can be fixed quickly and stably, which can effectively reduce the problem of uneven electroplating caused by material deformation during the electroplating process.

[0050] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0052] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and deform the above embodiments within the scope of the present application.

Claims

1. A semiconductor processing electroplating device, characterized in that: The invention comprises a frame (10), a transmission component (20), a plurality of electroplating tanks (30), a slide block (23) and a plurality of clamping components (60), wherein: The frame (10) comprises a first frame body (11) and a second frame body (12), wherein the first frame body (11) is arranged on the second frame body (12); The conveying assembly (20) comprises a first track (21) and a second track (22), wherein the second track (22) is composed of two sub-tracks (221), the first track (21) is arranged between the two sub-tracks (221), the first track (21) is arranged on the first frame (11) through a lifting component (13), and the second track (22) is arranged on the second frame (12); The plurality of electroplating tanks (30) are longitudinally arranged in sequence below the first track (21); The slider (23) is slidably arranged on the conveying assembly (20), and a driving component (90) is arranged on the first track (21); The plurality of clamping assemblies (60) are detachable and arranged on the slider (23), wherein the clamping assemblies (60) include a back plate (61), an upper clamp (62) and two side clamps (63) arranged on the back plate (61), wherein: The back plate (61) comprises a top plate (611) and two side plates (612), wherein the top plate (611) is vertically arranged at the bottom of the slider (23), and the two side plates (612) are respectively arranged on both sides of the top plate (611) in the longitudinal direction; The upper clamp (62) is arranged on the top plate (611) via a rotating component; The two side clamps (63) are respectively arranged on the two side plates (612), and the side clamps (63) include a control rope (631) and a plurality of rollers (632), wherein the control rope (631) is connected to the rotating component, and a mounting block (6321) is movably provided on one side of the roller (632), and the mounting block (6321) is slidably connected to the side plate (612), and the control rope (631) is vertically and sequentially movably passed through the plurality of mounting blocks (6321), and the roller (632) is slidably contacted with the corresponding side plate (612).

2. The semiconductor processing electroplating device according to claim 1, characterized in that: The upper clamp (62) comprises a rotating shaft (621) and a plurality of clamping plates (622), wherein: The rotating shaft (621) is movably arranged on the top plate (611), a connecting plate (6211) is extended from the rotating shaft (621), and the connecting plate (6211) is connected to the rotating component via a connecting rope (70); The plurality of clamping plates (622) are longitudinally arranged in sequence on the rotating shaft (621).

3. The semiconductor processing electroplating device according to claim 2, characterized in that: The rotating component includes a winding shaft (80), and the winding shaft (80) is arranged in a receiving chamber (6111) inside the top plate (611). A first motor (81) is provided at the end of the winding shaft (80). The connecting rope (70) passes through the receiving chamber (6111) and is connected to the small diameter portion in the middle of the winding shaft (80). The two control ropes (631) respectively pass through the receiving chamber (6111) and are connected to the large diameter portions on both sides of the winding shaft (80).

4. The semiconductor processing electroplating device according to claim 3, characterized in that: The diameters of the multiple roller shafts (632) on the side plate (612) decrease sequentially from top to bottom, and multiple baffles (6121) for limiting the position of the roller shafts (632) are vertically and sequentially arranged on the side plate (612), and the distances between the multiple baffles (6121) and the side plate (612) decrease sequentially from top to bottom.

5. The semiconductor processing electroplating device according to claim 1, characterized in that: The driving component (90) comprises a second motor (91), a meshing rack (92) and a gear (93), wherein: The second motor (91) is arranged on a mounting seat (211) outside the first track (21); a moving block (912) is arranged at the output end of the second motor (91) via a movable shaft (911); the moving block (912) passes through the first track (21) and has a groove (9121) at one end thereof; a moving plate (9123) is arranged in the groove (9121) via a spring (9122); and the moving plate (9123) is arranged against one longitudinal side of the slider (23); The gear (93) is sleeved on the outside of the movable shaft (911), and the rack (92) is arranged on the first track (21).

6. The semiconductor processing electroplating device according to claim 5, characterized in that: One longitudinal side of the sliding block (23) is arranged in an arc shape.

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