Binding method of heterogeneous metals

Abstract

A dissimilar metal bonding method comprises the steps that (a) a first metal piece is arranged on a lower die and provided with a bottom located in a die cavity and a vertical part extending upwards from the bottom to define a concave area, the first metal piece is further provided with an extending part extending from the vertical part to the top face of the lower die, and the upper surface of the extending part is higher than the top face of the lower die; (b) arranging a first upper mold on the upper surface of the extension part; (c) providing bonding glue at the bottom, wherein the viscosity of the bonding glue is enough to enable the top to be higher than the top surface of the lower mold; and (d) the lower surface of a second metal piece with the upper surface provided with a second upper mold faces downwards to pressurize the bonding glue, the bottom of the second metal piece is partially exposed, a gap is formed between the second metal piece and the vertical part, and the lower surface of the second upper mold shields the gap so that the bonding glue can be flattened in the concave area in the pressurizing process, and when the lower surface of the second upper mold is in contact with the vertical part, the gap is filled with the bonding glue upwards so as to be in contact with the lower surface of the second upper mold, the bonding glue can be transversely flattened in the sunken area and then moves towards the gap so as to fill the space of the gap in the step (d), and the manufacturing process is simplified.

Description

Technical Field

[0001] The invention relates to a bonding method, in particular to a bonding method of heterogeneous metals. Background Art

[0002] With the advancement of the technology industry, the demand for 3C products such as computers and computer peripherals, communications and consumer electronics is increasing day by day. As consumers' requirements for the appearance of 3C products are gradually increasing, the appearance design of 3C products has also been increasingly valued by the industry. Therefore, in the relevant technical industries of 3C products, such as mobile phones, laptops and tablet computers, the beauty of the casing / shell of 3C products is particularly valued. Among the existing types of 3C product casings, the most common ones are casings that combine plastic and metal, and casings that combine heterogeneous metals. Based on the property of metal that can reflect light sources, it can bring consumers a dazzling visual experience in the presentation of appearance, and is highly valued. However, the problem that the industry is troubled by the casing composed of heterogeneous metals is the lack of integration at the junction of different metals.

[0003] For example, see Figure 1 and Figure 2 The invention patent case with Chinese application publication number CN106544674A (hereinafter referred to as case 1) discloses a surface treatment process for combining a magnesium die-casting workpiece and an aluminum part, which includes a step S1, a step S2, a step S3, a step S4, a step S5, and a step S6.

[0004] The step S1 is to grind and sandblast a bonding surface 111 of a magnesium die casting 11 and a bonding surface 121 of an aluminum frame 12 to provide a good bonding surface for subsequent connection and thermal spraying. The step S2 is to apply a glue 13 on the bonding surface 111 of the magnesium die casting 11 after grinding and sandblasting. The step S3 is to connect the bonding surface 121 of the aluminum frame 12 after grinding and sandblasting to the glue 13 to form a workpiece assembly with the magnesium die casting 11. The step S4 is to thermally spray a nickel-aluminum material 14 at a gap after connecting the magnesium die casting 11 and the aluminum frame 12. The step S5 is to partially grind the nickel-aluminum material 14 to make it integrated with the workpiece assembly as a whole and more natural. The step S6 is to spray paint the surface appearance of the workpiece assembly after grinding.

[0005] Although the previous case 1 can solve the problem of insufficient integrity of the heterogeneous metal joint, the previous case 1 cannot completely combine the magnesium die casting 11 and the aluminum frame 12 in a single step (i.e., step S3) during the process of combining the magnesium die casting 11 and the aluminum frame 12. The previous case 1 still needs to perform the thermal spraying of step S4 to form the nickel-aluminum material 14 in the gap between the magnesium die casting 11 and the aluminum frame 12 in order to completely combine the magnesium die casting 11 and the aluminum frame 12. Therefore, the previous case 1 is relatively complicated in the means of combining the magnesium die casting 11 and the aluminum frame 12.

[0006] It can be seen from the above description that improving the method of combining heterogeneous metals to simplify the manufacturing process is a problem to be solved by relevant practitioners in the technical field. Summary of the invention

[0007] The object of the present invention is to provide a method for combining heterogeneous metals which can simplify the manufacturing process.

[0008] The method for combining heterogeneous metals of the present invention comprises the following steps: step (a), step (b), step (c), and step (d).

[0009] The step (a) is to arrange a first metal piece in the mold cavity of the lower mold. The first metal piece has a bottom located in the mold cavity and a vertical portion extending upward from one end of the bottom to define a recessed area together with the bottom. The first metal piece also has an extension portion extending laterally from the top end of the vertical portion to the top surface of the lower mold, and the height of the upper surface of the extension portion of the first metal piece is higher than the height of the top surface of the lower mold.

[0010] The step (b) is to set a first upper mold on the upper surface of the extension portion of the first metal component, and expose the bottom and the vertical portion of the first metal component outside the first upper mold.

[0011] The step (c) is to provide a bonding adhesive on the bottom of the first metal member before or after the step (a). The bonding adhesive has a viscosity sufficient to make the top of the bonding adhesive higher than the top surface of the lower mold.

[0012] The step (d) is to pressurize the bonding adhesive with the lower surface of a second metal member whose material is different from that of the first metal member facing downward after implementing the steps (a), (b) and (c); wherein the second metal member partially exposes the bottom of the first metal member and forms a gap with the vertical portion, and a second upper mold is arranged on the upper surface of the second metal member opposite to its lower surface, and the lower surface of the second upper mold covers the gap, so that the bonding adhesive is gradually flattened laterally in the recessed area of ​​the first metal member during the pressurization process, and fills the gap upward to contact the lower surface of the second upper mold when the lower surface of the second upper mold contacts the top of the vertical portion.

[0013] In the method for bonding heterogeneous metals of the present invention, in the step (c), the viscosity of the bonding glue is between 15000 cps and 50000 cps.

[0014] In the method for bonding heterogeneous metals of the present invention, in the step (c), the bonding adhesive is implemented using a thermosetting epoxy resin.

[0015] The method for combining heterogeneous metals of the present invention further comprises a step (e) after the step (d), wherein the step (e) is to cure the bonding adhesive after the step (d) to combine the first metal component and the second metal component.

[0016] The method for combining heterogeneous metals of the present invention further comprises a step (f) after the step (e), wherein the step (f) is to remove the lower mold, the first upper mold and the second upper mold.

[0017] The method for bonding heterogeneous metals of the present invention further comprises a step (g) after the step (f), wherein the step (g) is to grind the bonding glue at the gap from the upper surface of the second metal component and the upper surface of the extension portion of the first metal component.

[0018] The method for bonding heterogeneous metals of the present invention further comprises a step (h) after the step (g), wherein the step (h) is to spray a paint layer on the upper surface of the extension portion of the first metal part, the upper surface of the second metal part and the bonding glue at the gap.

[0019] The beneficial effect of the present invention is that in a single step (d), the bonding adhesive can be first flattened laterally in the space of the recessed area of ​​the first metal part, and then the flattened bonding adhesive moves toward the gap to fill the space in the gap due to the reduction of the space in the recessed area, thereby completely combining the upper and lower first metal parts and the second metal parts and filling the gap between the first metal part and the second metal part, thereby simplifying the manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Other features and effects of the present invention will be clearly presented in the embodiments with reference to the accompanying drawings, in which:

[0021] Figure 1 It is a schematic diagram of a manufacturing process, which illustrates a surface treatment process for combining a magnesium die-casting workpiece and an aluminum part disclosed in the invention patent case with Chinese application publication number CN106544674A, a step S1, a step S2 and a step S3;

[0022] Figure 2 Is a continuation Figure 1 A schematic diagram of a manufacturing process, illustrating a step S4, a step S5 and a step S6 of the surface treatment process of combining the magnesium die-casting workpiece and the aluminum part;

[0023] Figure 3 is a schematic diagram illustrating a step (c) of an embodiment of the method for bonding dissimilar metals of the present invention;

[0024] Figure 4 is a schematic diagram illustrating a step (a) of the bonding method of the embodiment of the present invention;

[0025] Figure 5 is a schematic diagram illustrating a step (b) of the bonding method of the embodiment of the present invention;

[0026] Figure 6 is a schematic diagram illustrating a step (d) of the bonding method of the embodiment of the present invention;

[0027] Figure 7 is a schematic diagram illustrating a step (e) of the bonding method of the embodiment of the present invention;

[0028] Figure 8 is a schematic diagram illustrating a step (f) of the bonding method according to an embodiment of the present invention; and

[0029] Fig. 9 is a schematic diagram illustrating a step (h) of the combining method according to the embodiment of the present invention. DETAILED DESCRIPTION

[0030] Before the present invention is described in detail, it should be noted that similar elements are denoted by the same reference numerals in the following description.

[0031] An embodiment of the method for combining heterogeneous metals of the present invention is suitable for making casings of 3C products such as laptops, tablet computers, and mobile phones, and includes the following steps: a step (a), a step (b), a step (c), and a step (d).

[0032] See also Figure 4, the step (a) is to arrange a first metal member 3 in a mold cavity 20 of a lower mold 2. The first metal member 3 has a bottom 31 located in the mold cavity 20 and a vertical portion 32 extending upward from one end of the bottom 31 to define a recessed area 30 together with the bottom 31. The first metal member 3 also has an extension portion 33 extending laterally from a top end 321 of the vertical portion 32 to a top surface 21 of the lower mold 2, and the height of an upper surface 331 of the extension portion 33 of the first metal member 3 is higher than the height of the top surface 21 of the lower mold 2.

[0033] See also Figure 5 The step (b) is to set a first upper mold 4 on the upper surface 331 of the extension portion 33 of the first metal member 3 , and expose the bottom 31 and the vertical portion 32 of the first metal member 3 outside the first upper mold 4 .

[0034] See also Figure 3 , the step (c) is to provide a bonding glue 5 on the bottom 31 of the first metal part 3 before or after the step (a). The bonding glue 5 has a viscosity sufficient to make a top 51 of the bonding glue 5 higher than the top surface 21 of the lower mold 2. In the embodiment of the present invention, the step (c) is implemented before the step (a). Specifically, the step (c) of the embodiment of the present invention is to place the first metal part 3 on a platform of an automatic glue dispensing machine (not shown) before being placed on the lower mold 2, and to position the bottom 31 of the first metal part 3 on the platform by a glue dispensing jig arranged on the platform of the automatic glue dispensing machine, and to automatically provide the bonding glue 5 on the bottom 31 of the positioned first metal part 3 by a glue dispensing mechanism of the automatic glue dispensing machine.

[0035] See also Figure 6, the step (d) is to pressurize the bonding adhesive 5 downward with a lower surface 61 of a second metal member 6 made of a material different from that of the first metal member 3 after the steps (a), (b) and (c) are implemented. In the embodiment of the present invention, the second metal member 6 partially exposes the bottom 31 of the first metal member 3 and forms a gap 301 with the vertical portion 32, and a second upper mold 7 is disposed on an upper surface 62 of the second metal member 6 opposite to the lower surface 61 thereof. A lower surface 71 of the second upper mold 7 shields the gap 301, so that the bonding adhesive 5 is gradually flattened laterally in the recessed area 30 of the first metal member 3 during the pressurization process, and when the lower surface 71 of the second upper mold 7 and the lower surface 61 of the second metal member 6 contact the top 321 of the vertical portion 32 and the top surface 21 of the lower mold 2 respectively, the bonding adhesive 5 fills the gap 301 upward to contact the lower surface 71 of the second upper mold 7. It should be noted that, since the recessed area 30 of the first metal part 3 is defined by its bottom 31 and the vertical part 32, the volume of the recessed area 30 and the gap 301 can be accurately calculated before the step (c) is implemented, and when the step (c) is implemented, the amount of the bonding glue 5 provided by the dispensing mechanism to the bottom 31 of the first metal part 3 is controlled by the dispensing parameters set by the automatic dispensing machine. In this way, the problem of glue overflow during the implementation of the step (d) can be reduced. The metal material suitable for the first metal part 3 and the second metal part 6 of the present invention can be selected from magnesium (Mg), aluminum (Al), stainless steel, or titanium (Ti).

[0036] It should be further explained here that, in order to make the top 51 of the bonding glue 5 after the implementation of the step (c) higher than the top surface 21 of the lower mold 2, so that when the step (d) is implemented, a pressure can be provided to the bonding glue 5 by means of pressurization so as to force the bonding glue 5 to gradually flatten in the recessed area 30. Preferably, in the step (c), the viscosity of the bonding glue is between 15000cps and 50000cps. In the step (c) of the embodiment of the present invention, the bonding glue is implemented using a thermosetting epoxy resin.

[0037] Preferably, the embodiment of the present invention further comprises a step (e) after the step (d); further comprises a step (f) after the step (e); further comprises a step (g) after the step (f); and further comprises a step (h) after the step (g).

[0038] See also Figure 7, the step (e) is to cure the bonding adhesive 5 after the step (d) to bond the first metal member 3 and the second metal member 6. Specifically, the step (e) of the embodiment of the present invention is to place the lower mold 2, the first metal member 3, the first upper mold 4, the bonding adhesive 5, the second metal member 6 and the second upper mold 7 in an oven 8 at a curing temperature between 60° C. and 90° C. for a curing time of 60 seconds to 90 seconds.

[0039] See also Figure 8 , the step (f) is to first remove Figure 7 After the first upper mold 4 and the second upper mold 7 are formed, the lower mold 2 is removed to obtain the first metal component 3 and the second metal component 6 that are bonded together by the bonding adhesive 5 .

[0040] The step (g) is determined to be performed after the step (d) is performed. Specifically, when the bonding glue 5 at the gap 301 is uneven due to overflow of the bonding glue after the step (d) is performed, the step (g) is performed. The step (g) is to grind the bonding glue 5 at the gap 301 from the upper surface 62 of the second metal member 6 and the upper surface 331 of the extension portion 33 of the first metal member 3.

[0041] See also Fig. 9 The step (h) is to spray a paint layer 9 on the upper surface 331 of the extension portion 33 of the first metal member 3 , the upper surface 62 of the second metal member 6 and the bonding adhesive 5 at the gap 301 .

[0042] As can be seen from the above detailed description of the embodiment of the present invention, the present invention can firstly flatten the bonding adhesive 5 horizontally in the space of the recessed area 30 of the first metal member 3 in the step (d), and then move the flattened bonding adhesive 5 toward the gap 301 to fill the space at the gap 301 due to the reduction of the space of the recessed area 30, thereby completely combining the first metal member 3 and the second metal member 6 up and down and filling the gap 301 between the first metal member 3 and the second metal member 6. In short, the embodiment of the present invention can simultaneously combine the first metal member 3 and the second metal member 6 up and down and fill the gap 301 between the first metal member 3 and the second metal member 6 in a single step (d). In contrast, in the process of combining the magnesium die-casting 11 and the aluminum frame 12, the step S3 (i.e., using the glue 13 to combine the bonding surface 111 of the magnesium die-casting 11 and the bonding surface 121 of the aluminum frame 12) must be implemented first, and then the step S4 (i.e., using thermal spraying to form the nickel-aluminum material 14 in the gap between the magnesium die-casting 11 and the aluminum frame 12) must be implemented to completely combine the magnesium die-casting 11 and the aluminum frame 12, and the process is relatively complicated.

[0043] In summary, the heterogeneous metal bonding method of the present invention can simultaneously bond the first metal member 3 and the second metal member 6 up and down in a single step (d) and fill the gap 301 between the first metal member 3 and the second metal member 6, thereby simplifying the manufacturing process and achieving the purpose of the present invention.

[0044] However, what is described above is only an embodiment of the present invention and should not be used to limit the scope of implementation of the present invention. All simple equivalent changes and modifications made according to the claims and the contents of the patent specification of the present invention are still within the scope of the patent of the present invention.

Claims

1. A method for bonding heterogeneous metals, characterized in that: The following steps are involved: Step (a), arranging a first metal piece in the mold cavity of the lower mold, wherein the first metal piece has a bottom located in the mold cavity and a vertical portion extending upward from one end of the bottom to define a recessed area together with the bottom, and the first metal piece also has an extension portion extending laterally from the top end of the vertical portion to the top surface of the lower mold, and the height of the upper surface of the extension portion of the first metal piece is higher than the height of the top surface of the lower mold; Step (b), disposing a first upper mold on the upper surface of the extension portion of the first metal member, and making the bottom and the vertical portion of the first metal member exposed outside the first upper mold; Step (c), before or after step (a), providing a bonding adhesive on the bottom of the first metal member, wherein the bonding adhesive has a viscosity sufficient to make the top of the bonding adhesive higher than the top surface of the lower mold; and Step (d), after implementing steps (a), (b) and (c), pressurizing the bonding adhesive with the lower surface of a second metal member whose material is different from that of the first metal member facing downward, wherein the second metal member partially exposes the bottom of the first metal member and forms a gap with the vertical portion, and a second upper mold is arranged on the upper surface of the second metal member opposite to its lower surface, and the lower surface of the second upper mold covers the gap, so that the bonding adhesive is gradually flattened laterally in the recessed area of ​​the first metal member during the pressurization process, and fills the gap upward to contact the lower surface of the second upper mold when the lower surface of the second upper mold contacts the top of the vertical portion.

2. The method for bonding heterogeneous metals according to claim 1, characterized in that: In the step (c), the viscosity of the bonding adhesive is between 15000 cps and 50000 cps.

3. The method for bonding dissimilar metals according to claim 1, characterized in that: In the step (c), the bonding adhesive is implemented using a thermosetting epoxy resin.

4. The method for bonding dissimilar metals according to claim 1, characterized in that: The method further comprises a step (e) after the step (d), wherein the step (e) is to cure the bonding adhesive after the step (d) to bond the first metal component and the second metal component.

5. The method for bonding dissimilar metals according to claim 4, characterized in that: The method further includes step (f) after step (e), wherein step (f) is to remove the lower mold, the first upper mold and the second upper mold.

6. The method for bonding dissimilar metals according to claim 5, characterized in that: The method further comprises a step (g) after the step (f), wherein the step (g) is to grind the bonding glue at the gap from the upper surface of the second metal component and the upper surface of the extension portion of the first metal component.

7. The method for bonding dissimilar metals according to claim 6, characterized in that: The method further comprises step (h) after step (g), wherein step (h) is to spray a paint layer on the upper surface of the extension portion of the first metal component, the upper surface of the second metal component and the bonding glue at the gap.

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