Miniature spectrum modulation system and preparation method

Abstract

The invention relates to the technical field of spectrum modulation, in particular to a miniature spectrum modulation system and a preparation method thereof.The miniature spectrum modulation system comprises a modulation layer and a substrate which are sequentially connected in the longitudinal direction, the modulation layer is provided with nine modulation channels which are marked as C1, C2, C3, C4, C5, C6, C7, C8 and C9 respectively, the nine modulation channels are arranged in a 3 * 3 arrangement mode, and the width of the modulation channels is larger than that of the substrate. Micro lenses are arranged on the upper surfaces of part of the modulation channels; the nine modulation channels are transparent layers, semitransparent layers or opaque layers; the nine modulation channels are in a square shape or a square-like shape. The miniature spectrum modulation system and the bottom silicon-based detector are jointly controlled through the shape of the modulation channel, the modulation channel is arranged to be in a special shape, then part of pixels are exposed, the spectrum modulation curve of the miniature spectrum modulation system is controlled, and a better spectrum imaging effect is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of spectrum modulation, and in particular to a micro spectrum modulation system and a preparation method thereof. Background Art

[0002] Spectral modulation technology plays a vital role in modern science and technology, especially in the fields of fiber-optic communications, remote sensing, biomedical imaging, chemical analysis, and optical sensing. To achieve better spectral imaging effects, more advanced technologies and more sophisticated components are often required in traditional spectral modulation systems, which usually leads to large size, high cost, and complex operation of spectral modulation systems. How to achieve better spectral imaging effects through a streamlined structural arrangement is an urgent problem that existing technologies need to solve. Summary of the invention

[0003] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art, thereby providing a micro-spectral modulation system and a preparation method.

[0004] A micro-spectral modulation system, comprising: a modulation layer and a substrate connected in sequence longitudinally, wherein the substrate is a silicon-based image sensor, specifically a CMOS image sensor or a CCD image sensor;

[0005] The modulation layer is provided with 9 modulation channels made of different materials, which are respectively denoted as C1, C2, C3, C4, C5, C6, C7, C8 and C9. The 9 modulation channels are arranged in a 3×3 arrangement, and micro lenses are provided on the upper surfaces of the channels.

[0006] 9 of the modulation channels are transparent layers, semi-transparent layers or opaque layers;

[0007] The shapes of the 9 modulation channels are square or quasi-square;

[0008] The square-like types include the following:

[0009] Square with rounded corners;

[0010] The four sides of the square are concave inwards with a certain curvature;

[0011] The four sides of the square bulge outward with a certain curvature;

[0012] The four corners of the square are all provided with arc-shaped corner joints;

[0013] The four corners of the square are provided with square joints;

[0014] The four corners of the square are provided with square joints, and the three corners of the square joints are arc-shaped;

[0015] The four sides of the square are concave inwards with a certain curvature, and square corners are set at the four corners;

[0016] The four sides of the square are concave inwards with a certain curvature, and square corners are set at the four corners, and the three corners of the square corners are arc-shaped;

[0017] The shape of C5 is a square, and the side length of the square is 1.74 μm;

[0018] C5 is a transparent layer, and no microlens is arranged on its upper surface.

[0019] Further, the shape of C1 is a quasi-square, specifically: a rounded square;

[0020] Specific parameters: the side length of the square is 1.75μm, and the curvature of the four corner arcs is 33.33rad / μm;

[0021] A micro lens is disposed on the upper surface of C1.

[0022] Furthermore, the shape of C2 is a quasi-square, specifically: the four sides of the square are concave inwards with a certain curvature;

[0023] Specific parameters: the side length of the square is 1.67μm, and the curvature of the four-sided arc is 0.077rad / μm;

[0024] A micro lens is disposed on the upper surface of C2.

[0025] Furthermore, the shape of C3 is a quasi-square, specifically: the four sides of the square bulge outwards with a certain curvature;

[0026] Specific parameters: the side length of the square is 1.77μm, and the curvature of the four-sided arc is 0.05rad / μm;

[0027] A micro lens is disposed on the upper surface of C3.

[0028] Furthermore, the shape of C4 is quasi-square, specifically: arc-shaped corners are provided at the four corners of the square;

[0029] Specific parameters: the side length of the square is 1.74μm; the curvature of the arc corner is 71.42rad / μm;

[0030] The surface of C4 is provided with micro lenses.

[0031] Furthermore, the shape of C6 is quasi-square, specifically: square corners are provided at the four corners of the square;

[0032] Specific parameters: the side length of the square is 1.72μm, and the specification of the square corner is 0.1×0.005μm;

[0033] A micro lens is provided on the upper surface of C6.

[0034] Furthermore, the shape of C7 is quasi-square, specifically: square corners are provided at the four corners of the square, and the three corners of the square corners are arc-shaped;

[0035] Specific parameters: the side length of the square is 1.74μm; the specification of the square corner is 0.13×0.005μm, and the arc curvature is 33.33rad / μm;

[0036] A micro lens is provided on the upper surface of C6.

[0037] Furthermore, the shape of C8 is quasi-square, specifically: the four sides of the square are concave inwards with a certain curvature, and square corners are provided at the four corners;

[0038] Specific parameters: the side length of the square is 1.72μm, the curvature of the four-side arc is 0.1rad / μm; the specification of the square corner is 0.13×0.005μm;

[0039] The upper surface of C8 is provided with micro lenses.

[0040] Furthermore, the shape of C9 is quasi-square, specifically: the four sides of the square are concave inward with a certain curvature, the four corners are provided with square corners, and the three corners of the square corners are arc-shaped;

[0041] Specific parameters: the side length of the square is 1.73μm, and the arc curvature of the four sides is 0.1rad / μm; the specification of the square corner is 0.13×0.005μm, and the arc curvature is 33.33rad / μm;

[0042] A micro lens is arranged on the upper surface of C9.

[0043] The present invention also includes a method for preparing a micro-spectral modulation system, the method being used to prepare the above-mentioned micro-spectral modulation system, comprising the following steps:

[0044] S1: Detector selection: Confirm the resolution, image size, spectral range and quantum efficiency of the detector according to actual needs; after the detector is selected, confirm the material, shape and specific specifications of each channel;

[0045] S2: Preparation and testing of C1 channel: Make the mask of C1 channel according to the designed shape and specific specifications of C1 channel, adjust the photolithography process parameters, and reproduce the designed shape and specific specifications of C1 channel to the corresponding pixel surface of detector, and use 3D confocal microscope to test the performance of C1 channel to ensure that it meets the use requirements;

[0046] S3: Preparation and testing of C2 channel: According to the designed shape and specific specifications of the C2 channel, the mask of the C2 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the designed C2 channel are reproduced on the pixel surface corresponding to the detector in S2, and the performance of the C2 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel is tested to ensure that the morphology of the C1 channel is not damaged;

[0047] S4: Preparation and testing of C3 channel: According to the designed shape and specific specifications of the C3 channel, the mask of the C3 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the C3 channel are reproduced on the pixel surface corresponding to the detector in S3 according to the designed shape and specific specifications of the C3 channel, and the performance of the C3 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel and the C2 channel is tested to ensure that the morphology of the C1 channel and the C2 channel is not damaged;

[0048] S5: Preparation and testing of C4 channel: According to the designed shape and specific specifications of the C4 channel, the mask of the C4 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the C4 channel are reproduced on the pixel surface corresponding to the detector in S4 according to the designed shape and specific specifications of the C4 channel, and the performance of the C4 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel, C2 channel and C3 channel is tested to ensure that the morphology of the C1 channel, C2 channel and C3 channel is not damaged;

[0049] S6: Preparation and testing of C5 channel: According to the designed shape and specific specifications of the C5 channel, the mask of the C5 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the C5 channel are reproduced on the pixel surface corresponding to the detector in S5 according to the designed shape and specific specifications of the C5 channel, and the performance of the C5 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel, C2 channel, C3 channel and C4 channel is tested to ensure that the morphology of the C1 channel, C2 channel, C3 channel and C4 channel is not damaged;

[0050] S7: Preparation and testing of C6 channel: According to the designed shape and specific specifications of C6 channel, the mask of C6 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of C6 channel are reproduced on the pixel surface corresponding to the detector in S6 according to the designed shape and specific specifications of C6 channel, and the performance of C6 channel is tested by 3D confocal microscope to ensure that it meets the use requirements. At the same time, the performance of C1 channel, C2 channel, C3 channel, C4 channel and C5 channel is tested to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel and C5 channel is not damaged;

[0051] S8: Preparation and testing of C7 channel: According to the designed shape and specific specifications of C7 channel, the mask of C7 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of C7 channel are reproduced on the pixel surface corresponding to the detector in S7 according to the designed shape and specific specifications of C7 channel, and the performance of C7 channel is tested by three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel and C6 channel is tested to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel and C6 channel is not damaged;

[0052] S9: Preparation and testing of C8 channel: According to the designed shape and specific specifications of C8 channel, the mask of C8 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of C8 channel are reproduced on the pixel surface corresponding to the detector in S8 according to the designed shape and specific specifications of C8 channel, and the performance of C8 channel is tested by three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel and C7 channel is tested to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel and C7 channel is not damaged;

[0053] S10: Preparation and testing of C9 channel: according to the designed shape and specific specifications of C9 channel, make the mask of C9 channel, adjust the photolithography process parameters, and reproduce the designed shape and specific specifications of C9 channel to the pixel surface corresponding to the detector in S9, and use a three-dimensional confocal microscope to test the performance of C8 channel to ensure that it meets the use requirements. At the same time, test the performance of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel, C7 channel and C8 channel to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel, C7 channel and C8 channel is not damaged;

[0054] S11: Preparation and testing of surface microlenses of channels C1 to C9: Design a mask without microlenses for channel C5, use photolithography to process surface microlenses of other channels, and use a three-dimensional confocal microscope to test the surface microlenses of each channel to ensure that the surface microlens preparation requirements are met; at the same time, test the performance of channels C1-C9 to ensure that the morphology of channels C1-C9 is not damaged;

[0055] S12: Micro-spectral modulation system test: Connect the prepared micro-spectral modulation system to the module, obtain the spectral image and inversion spectrum of each channel of the micro-spectral modulation system under standard light source conditions, check whether the modulation spectrum of each channel of the micro-spectral modulation system is the same as the design, and compare it with the spectrum obtained by a commercial spectrometer under the same conditions to analyze the spectrum and image quality obtained by the micro-spectral modulation system.

[0056] The technical solution of the present invention realizes controlling the spectral modulation curve of the micro-spectral modulation system by setting the modulation channel into a special shape to expose part of the pixels, thereby achieving good spectral imaging effects. At the same time, it does not require complex structural design, further reducing the volume of the spectral modulation system and reducing the overall cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0058] Figure 1 A schematic diagram of a structure provided in an embodiment of the present invention;

[0059] Figure 2 is a schematic diagram of the shape of the modulation channel;

[0060] Figure 3 is the response curve of silicon-based detector;

[0061] Figure 4 Modulating the spectrum for each channel of the micro-spectral modulation system;

[0062] Figure 5 Flow chart of the preparation method of the micro spectral modulation system. DETAILED DESCRIPTION

[0063] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0064] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0065] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0066] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0067] See also Figure 1 , a micro spectral modulation system, comprising: a modulation layer and a substrate connected in sequence longitudinally, the substrate being a silicon-based image sensor, specifically a CMOS image sensor or a CCD image sensor; since the quantum efficiency of silicon-based detectors in the 300-800nm ​​band is different, in order to obtain the required spectral modulation curve, the modulation layer is set to 9 modulation channels, which are respectively recorded as C1, C2, C3, C4, C5, C6, C7, C8 and C9, and the 9 modulation channels are transparent layers, semi-transparent layers or opaque layers;

[0068] The 9 modulation channels are arranged in a 3×3 single-period manner, and microlenses are provided on the upper surfaces of some modulation channels; the 9 modulation channels are made of different spectral modulation materials, and the transmittance of each spectral modulation material at a wavelength of 300-800nm ​​satisfies the following constraints: Note: T(λ1-λ2) means the transmittance of each wavelength between wavelengths λ1 and λ2, and the wavelength unit is nm;

[0069] T C1 :peak transmittance wavelength ≥ 600nm; T(300-380) ≤ 30%; T(400-550) ≤ 10%; T(600-700) ≥ 80%;

[0070] T C2 :The peak transmittance wavelength is 510-560nm; T(300-420)≤15%; T(530-550)≥80%; T(630-690)≤40%; T(750-800)≥40%;

[0071] T C3 :Trough transmittance wavelength is 520-580nm; T(300-350)≤15%; T(400-440)≥50%; T(520-570)≤20%; T(610-800)≥60%;

[0072] T C4:The peak transmittance wavelength is 430-470nm; T(300-360)≤10%; T(410-480)≥60%; T(510-550)≤40%; T(550-750)≤15%; T(750-800)≤60%;

[0073] T C5 : T(300-350)≤40%; T(420-800)≥80%;

[0074] T C6 : T(300-350)≤10%; T(400-640)≤20%; T(640-700)≤40%;

[0075] T(700-800)≤75%;

[0076] T C7 :Trough transmittance wavelength is 520-580nm; T(300-350)≤25%; T(400-440)≥60%; T(520-570)≤15%; T(610-800)≥60%;

[0077] T C8 :The peak transmittance wavelength is 440-500m; T(300-400)≤60%; T(420-520)≥80%; T(580-700)≤20%; T(700-800)≤90%;

[0078] T C9 : Peak transmittance wavelength ≥510nm; T(300-400)≤40%; T(400-460)≤20%; T(520-800)≥80%;

[0079] The micro-spectral modulation system is controlled by the shape of the modulation channel and the underlying silicon-based detector. The response curve of the silicon-based detector is as follows: Figure 3 As shown, the present application sets the modulation channel into a special shape to expose part of the pixels, thereby realizing the spectral modulation curve of the micro spectral modulation system. For the specific modulation channel shape, please refer to Figure 2 , the shapes of the 9 modulation channels may be square or quasi-square;

[0080] The square-like types include the following:

[0081] Square with rounded corners;

[0082] The four sides of the square are concave inwards with a certain curvature;

[0083] The four sides of the square bulge outward with a certain curvature;

[0084] The four corners of the square are all provided with arc-shaped corner joints;

[0085] The four corners of the square are provided with square joints;

[0086] The four corners of the square are provided with square joints, and the three corners of the square joints are arc-shaped;

[0087] The four sides of the square are concave inwards with a certain curvature, and square corners are set at the four corners;

[0088] The four sides of the square are concave inwards with a certain curvature, and square corners are arranged at the four corners, and the three corners of the square corners are arc-shaped.

[0089] The specific parameter specifications of C1-C9 in this embodiment are shown in Table 1. The shape of C1 is a square, specifically: a rounded square; specific parameters: the side length of the square is 1.75μm, and the curvature of the four corner arcs is 33.33rad / μm; a microlens is arranged on the upper surface of C1.

[0090] The shape of C2 is quasi-square, specifically: the four sides of the square are concave inward with a certain curvature; specific parameters: the side length of the square is 1.67 μm, and the curvature of the four-side arc is 0.077 rad / μm; a microlens is arranged on the upper surface of C2.

[0091] The shape of C3 is quasi-square, specifically: the four sides of the square are convex outward with a certain curvature; specific parameters: the side length of the square is 1.77 μm, and the curvature of the four-side arc is 0.05 rad / μm; and a microlens is arranged on the upper surface of C3.

[0092] The shape of C4 is quasi-square, specifically: arc-shaped corners are arranged at the four corners of the square; specific parameters: the side length of the square is 1.74 μm; the curvature of the arc-shaped corner is 71.42 rad / μm; and a microlens is arranged on the surface of C4.

[0093] The shape of C5 is a square, and the side length of the square is 1.74 μm; C5 is a transparent layer, and no microlens is arranged on its upper surface.

[0094] The shape of C6 is quasi-square, specifically: square corners are arranged at the four corners of the square; specific parameters: the side length of the square is 1.72 μm, and the specification of the square corner is 0.1×0.005 μm; and a microlens is arranged on the upper surface of C6.

[0095] The shape of C7 is quasi-square, specifically: square corners are provided at the four corners of the square, and the three corners of the square corners are arc-shaped; specific parameters: the side length of the square is 1.74μm; the specification of the square corner is 0.13×0.005μm, and the arc curvature is 33.33rad / μm; a microlens is provided on the upper surface of C6.

[0096] The shape of C8 is quasi-square, specifically: the four sides of the square are concave inward with a certain curvature, and square corners are set at the four corners; specific parameters: the side length of the square is 1.72μm, the curvature of the four-side arc is 0.1rad / μm; the specification of the square corner is 0.13×0.005μm; a microlens is set on the upper surface of C8.

[0097] The shape of C9 is quasi-square, specifically: the four sides of the square are concave inward with a certain curvature, square corners are set at the four corners, and the three corners of the square corners are arc-shaped; specific parameters: the side length of the square is 1.73μm, and the curvature of the four-side arc is 0.1rad / μm; the specification of the square corner is 0.13×0.005μm, and the curvature of the arc is 33.33rad / μm; a microlens is set on the upper surface of C9.

[0098] Table 1:

[0099]

[0100] The modulation spectrum of each channel of the micro-spectral modulation system in this embodiment is as follows: Figure 4 shown.

[0101] See also Figure 5 The present invention also includes a method for preparing a micro-spectral modulation system, the method is used to prepare the above-mentioned micro-spectral modulation system, comprising the following steps:

[0102] S1: Detector selection: Confirm the resolution, image size, spectral range and quantum efficiency of the detector according to actual needs; after the detector is selected, confirm the material, shape and specific specifications of each channel;

[0103] S2: Preparation and testing of C1 channel: Make the mask of C1 channel according to the designed shape and specific specifications of C1 channel, adjust the photolithography process parameters, and reproduce the designed shape and specific specifications of C1 channel to the corresponding pixel surface of detector, and use 3D confocal microscope to test the performance of C1 channel to ensure that it meets the use requirements;

[0104] S3: Preparation and testing of C2 channel: According to the designed shape and specific specifications of the C2 channel, the mask of the C2 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the designed C2 channel are reproduced on the pixel surface corresponding to the detector in S2, and the performance of the C2 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel is tested to ensure that the morphology of the C1 channel is not damaged;

[0105] S4: Preparation and testing of C3 channel: According to the designed shape and specific specifications of the C3 channel, the mask of the C3 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the C3 channel are reproduced on the pixel surface corresponding to the detector in S3 according to the designed shape and specific specifications of the C3 channel, and the performance of the C3 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel and the C2 channel is tested to ensure that the morphology of the C1 channel and the C2 channel is not damaged;

[0106] S5: Preparation and testing of C4 channel: According to the designed shape and specific specifications of the C4 channel, the mask of the C4 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the C4 channel are reproduced on the pixel surface corresponding to the detector in S4 according to the designed shape and specific specifications of the C4 channel, and the performance of the C4 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel, C2 channel and C3 channel is tested to ensure that the morphology of the C1 channel, C2 channel and C3 channel is not damaged;

[0107] S6: Preparation and testing of C5 channel: According to the designed shape and specific specifications of the C5 channel, the mask of the C5 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the C5 channel are reproduced on the pixel surface corresponding to the detector in S5 according to the designed shape and specific specifications of the C5 channel, and the performance of the C5 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel, C2 channel, C3 channel and C4 channel is tested to ensure that the morphology of the C1 channel, C2 channel, C3 channel and C4 channel is not damaged;

[0108] S7: Preparation and testing of C6 channel: According to the designed shape and specific specifications of C6 channel, the mask of C6 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of C6 channel are reproduced on the pixel surface corresponding to the detector in S6 according to the designed shape and specific specifications of C6 channel, and the performance of C6 channel is tested by 3D confocal microscope to ensure that it meets the use requirements. At the same time, the performance of C1 channel, C2 channel, C3 channel, C4 channel and C5 channel is tested to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel and C5 channel is not damaged;

[0109] S8: Preparation and testing of C7 channel: According to the designed shape and specific specifications of C7 channel, the mask of C7 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of C7 channel are reproduced on the pixel surface corresponding to the detector in S7 according to the designed shape and specific specifications of C7 channel, and the performance of C7 channel is tested by three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel and C6 channel is tested to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel and C6 channel is not damaged;

[0110] S9: Preparation and testing of C8 channel: According to the designed shape and specific specifications of C8 channel, the mask of C8 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of C8 channel are reproduced on the pixel surface corresponding to the detector in S8 according to the designed shape and specific specifications of C8 channel, and the performance of C8 channel is tested by three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel and C7 channel is tested to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel and C7 channel is not damaged;

[0111] S10: Preparation and testing of C9 channel: according to the designed shape and specific specifications of C9 channel, make the mask of C9 channel, adjust the photolithography process parameters, and reproduce the designed shape and specific specifications of C9 channel to the pixel surface corresponding to the detector in S9, and use a three-dimensional confocal microscope to test the performance of C8 channel to ensure that it meets the use requirements. At the same time, test the performance of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel, C7 channel and C8 channel to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel, C7 channel and C8 channel is not damaged;

[0112] S11: Preparation and testing of surface microlenses of channels C1 to C9: Design a mask without microlenses for channel C5, use photolithography to process surface microlenses of other channels, and use a three-dimensional confocal microscope to test the surface microlenses of each channel to ensure that the surface microlens preparation requirements are met; at the same time, test the performance of channels C1-C9 to ensure that the morphology of channels C1-C9 is not damaged;

[0113] S12: Micro-spectral modulation system test: Connect the prepared micro-spectral modulation system to the module, obtain the spectral image and inversion spectrum of each channel of the micro-spectral modulation system under standard light source conditions, check whether the modulation spectrum of each channel of the micro-spectral modulation system is the same as the design, and compare it with the spectrum obtained by a commercial spectrometer under the same conditions to analyze the spectrum and image quality obtained by the micro-spectral modulation system.

[0114] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A micro-spectral modulation system, characterized in that: include: A modulation layer and a substrate connected in sequence longitudinally, wherein the substrate is a silicon-based image sensor, specifically a CMOS image sensor or a CCD image sensor; The modulation layer is provided with 9 modulation channels made of different materials, which are respectively denoted as C1, C2, C3, C4, C5, C6, C7, C8 and C9. The 9 modulation channels are arranged in a 3×3 arrangement, and micro lenses are provided on the upper surfaces of the channels. 9 of the modulation channels are transparent layers, semi-transparent layers or opaque layers; The shapes of the 9 modulation channels are square or quasi-square; The square-like types include the following: Square with rounded corners; The four sides of the square are concave inwards with a certain curvature; The four sides of the square bulge outward with a certain curvature; The four corners of the square are all provided with arc-shaped corner joints; The four corners of the square are provided with square joints; The four corners of the square are provided with square joints, and the three corners of the square joints are arc-shaped; The four sides of the square are concave inwards with a certain curvature, and square corners are set at the four corners; The four sides of the square are concave inwards with a certain curvature, and square corners are set at the four corners, and the three corners of the square corners are arc-shaped; The shape of C5 is a square, and the side length of the square is 1.74 μm; C5 is a transparent layer, and no microlens is arranged on its upper surface.

2. The micro-spectral modulation system according to claim 1, characterized in that: The shape of C1 is a square, specifically: a rounded square; Specific parameters: the side length of the square is 1.75μm, and the curvature of the four corner arcs is 33.33rad / μm; A micro lens is disposed on the upper surface of C1.

3. The micro-spectral modulation system according to claim 2, characterized in that: The shape of C2 is a quasi-square, specifically: the four sides of the square are concave inwards with a certain curvature; Specific parameters: the side length of the square is 1.67μm, and the curvature of the four-sided arc is 0.077rad / μm; A micro lens is disposed on the upper surface of C2.

4. The micro-spectral modulation system according to claim 3, characterized in that: The shape of C3 is a quasi-square, specifically: the four sides of the square bulge outwards with a certain curvature; Specific parameters: the side length of the square is 1.77μm, and the curvature of the four-sided arc is 0.05rad / μm; A micro lens is disposed on the upper surface of C3.

5. The micro-spectral modulation system according to claim 4, characterized in that: The shape of C4 is quasi-square, specifically: arc-shaped corners are provided at the four corners of the square; Specific parameters: the side length of the square is 1.74μm; the curvature of the arc corner is 71.42rad / μm; The surface of C4 is provided with micro lenses.

6. The micro-spectral modulation system according to claim 5, characterized in that: The shape of C6 is quasi-square, specifically: square corners are provided at the four corners of the square; Specific parameters: the side length of the square is 1.72μm, and the specification of the square corner is 0.1×0.005μm; A micro lens is provided on the upper surface of C6.

7. The micro-spectral modulation system according to claim 6, characterized in that: The shape of C7 is quasi-square, specifically: square corners are provided at the four corners of the square, and the three corners of the square corners are arc-shaped; Specific parameters: the side length of the square is 1.74μm; the specification of the square corner is 0.13×0.005μm, and the arc curvature is 33.33rad / μm; A micro lens is provided on the upper surface of C6.

8. The micro-spectral modulation system according to claim 7, characterized in that: The shape of the C8 is a quasi-square, specifically: the four sides of the square are concave inwards with a certain curvature, and square corners are provided at the four corners; Specific parameters: the side length of the square is 1.72μm, the curvature of the four-side arc is 0.1rad / μm; the specification of the square corner is 0.13×0.005μm; The upper surface of C8 is provided with micro lenses.

9. The micro-spectral modulation system according to claim 8, characterized in that: The shape of C9 is quasi-square, specifically: the four sides of the square are concave inward with a certain curvature, the four corners are provided with square corners, and the three corners of the square corners are arc-shaped; Specific parameters: the side length of the square is 1.73μm, and the arc curvature of the four sides is 0.1rad / μm; the specification of the square corner is 0.13×0.005μm, and the arc curvature is 33.33rad / μm; A micro lens is arranged on the upper surface of C9.

10. A method for preparing a micro-spectral modulation system, the method being used to prepare the micro-spectral modulation system according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: Detector selection: Confirm the resolution, image size, spectral range and quantum efficiency of the detector according to actual needs; after the detector is selected, confirm the material, shape and specific specifications of each channel; S2: Preparation and testing of C1 channel: Make the mask of C1 channel according to the designed shape and specific specifications of C1 channel, adjust the photolithography process parameters, and reproduce the designed shape and specific specifications of C1 channel to the corresponding pixel surface of detector, and use 3D confocal microscope to test the performance of C1 channel to ensure that it meets the use requirements; S3: Preparation and testing of C2 channel: According to the designed shape and specific specifications of the C2 channel, the mask of the C2 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the designed C2 channel are reproduced on the pixel surface corresponding to the detector in S2, and the performance of the C2 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel is tested to ensure that the morphology of the C1 channel is not damaged; S4: Preparation and testing of C3 channel: According to the designed shape and specific specifications of the C3 channel, the mask of the C3 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the C3 channel are reproduced on the pixel surface corresponding to the detector in S3 according to the designed shape and specific specifications of the C3 channel, and the performance of the C3 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel and the C2 channel is tested to ensure that the morphology of the C1 channel and the C2 channel is not damaged; S5: Preparation and testing of C4 channel: According to the designed shape and specific specifications of the C4 channel, the mask of the C4 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the C4 channel are reproduced on the pixel surface corresponding to the detector in S4 according to the designed shape and specific specifications of the C4 channel, and the performance of the C4 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel, C2 channel and C3 channel is tested to ensure that the morphology of the C1 channel, C2 channel and C3 channel is not damaged; S6: Preparation and testing of C5 channel: According to the designed shape and specific specifications of the C5 channel, the mask of the C5 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of the C5 channel are reproduced on the pixel surface corresponding to the detector in S5 according to the designed shape and specific specifications of the C5 channel, and the performance of the C5 channel is tested using a three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of the C1 channel, C2 channel, C3 channel and C4 channel is tested to ensure that the morphology of the C1 channel, C2 channel, C3 channel and C4 channel is not damaged; S7: Preparation and testing of C6 channel: According to the designed shape and specific specifications of C6 channel, the mask of C6 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of C6 channel are reproduced on the pixel surface corresponding to the detector in S6 according to the designed shape and specific specifications of C6 channel, and the performance of C6 channel is tested by 3D confocal microscope to ensure that it meets the use requirements. At the same time, the performance of C1 channel, C2 channel, C3 channel, C4 channel and C5 channel is tested to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel and C5 channel is not damaged; S8: Preparation and testing of C7 channel: According to the designed shape and specific specifications of C7 channel, the mask of C7 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of C7 channel are reproduced on the pixel surface corresponding to the detector in S7 according to the designed shape and specific specifications of C7 channel, and the performance of C7 channel is tested by three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel and C6 channel is tested to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel and C6 channel is not damaged; S9: Preparation and testing of C8 channel: According to the designed shape and specific specifications of C8 channel, the mask of C8 channel is made, the photolithography process parameters are adjusted, and the shape and specific specifications of C8 channel are reproduced on the pixel surface corresponding to the detector in S8 according to the designed shape and specific specifications of C8 channel, and the performance of C8 channel is tested by three-dimensional confocal microscope to ensure that it meets the use requirements. At the same time, the performance of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel and C7 channel is tested to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel and C7 channel is not damaged; S10: Preparation and testing of C9 channel: according to the designed shape and specific specifications of C9 channel, make the mask of C9 channel, adjust the photolithography process parameters, and reproduce the designed shape and specific specifications of C9 channel to the pixel surface corresponding to the detector in S9, and use a three-dimensional confocal microscope to test the performance of C8 channel to ensure that it meets the use requirements. At the same time, test the performance of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel, C7 channel and C8 channel to ensure that the morphology of C1 channel, C2 channel, C3 channel, C4 channel, C5 channel, C6 channel, C7 channel and C8 channel is not damaged; S11: Preparation and testing of surface microlenses of channels C1 to C9: Design a mask without microlenses for channel C5, use photolithography to process surface microlenses of other channels, and use a three-dimensional confocal microscope to test the surface microlenses of each channel to ensure that the surface microlens preparation requirements are met; at the same time, test the performance of channels C1-C9 to ensure that the morphology of channels C1-C9 is not damaged; S12: Micro-spectral modulation system test: Connect the prepared micro-spectral modulation system to the module, obtain the spectral image and inversion spectrum of each channel of the micro-spectral modulation system under standard light source conditions, check whether the modulation spectrum of each channel of the micro-spectral modulation system is the same as the design, and compare it with the spectrum obtained by a commercial spectrometer under the same conditions to analyze the spectrum and image quality obtained by the micro-spectral modulation system.

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