Heat dissipation projector support

Abstract

The invention relates to a heat dissipation projector support. The heat dissipation projector support relates to the technical field of projector supports. The heat dissipation projector support comprises a first aluminum alloy heat dissipation module, a second aluminum alloy heat dissipation module, a VC soaking plate, a plastic tray, an upper heat conduction copper pipe, a height adjusting button, a lower heat conduction copper pipe, an aluminum alloy base, a semiconductor chilling plate and a main board. The temperature of inlet air around and at the bottom of the projector is controlled, the inlet air temperature is kept at low temperature, the inlet air enters the projector, the temperature in the projector is reduced, the rotating speed of the fan is reduced along with the reduction of the temperature due to the cooling logic of the PWM fan in the projector, and the noise of the whole projector is reduced. And after the heat dissipation shell is adsorbed and fixed on the VC vapor chamber through the magnetic plate, the position of the threaded sleeve is adjusted by rotating the threaded sleeve, so that the rubber plate is tightly pressed on the side surface of the projector, and meanwhile, the effect of fixing the projector can be achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of projector brackets, and in particular relates to a heat dissipation projector bracket. Background Art

[0002] A projector is a device that can project images or videos onto a screen. It can be connected to computers, VCDs, DVDs, BDs, game consoles, DVs, etc. through different interfaces to play corresponding video signals.

[0003] At present, many projectors on the market have problems such as overheating and excessive noise when working. When the temperature of the projector is too high, the image quality will continue to deteriorate and the life of the internal optical machine will continue to decline. These problems bring a very bad user experience.

[0004] Therefore, a heat dissipation projector bracket is proposed to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a heat dissipation projector bracket with a simple structure and reasonable design in order to solve the above problems, so as to solve the problem of excessive temperature when the projector is working.

[0006] The present invention achieves the above-mentioned purpose through the following technical solutions:

[0007] A heat dissipation projector bracket, comprising a first aluminum alloy heat dissipation module, a second aluminum alloy heat dissipation module, a VC heat sink, a plastic tray, an upper heat-conducting copper tube, a height adjustment button, a lower heat-conducting copper tube, an aluminum alloy base, a semiconductor cooling sheet and a mainboard;

[0008] The upper heat-conducting copper tube, the height-adjusting button, the lower heat-conducting copper tube and the aluminum alloy base form a "lower heat-conducting assembly", and the upper heat-conducting copper tube, the height-adjusting button, the lower heat-conducting copper tube and the aluminum alloy base are arranged from top to bottom in sequence, the upper end of the upper heat-conducting copper tube is fixedly connected to the middle of the bottom surface of the plastic tray, the lower end of the upper heat-conducting copper tube is connected to the height-adjusting button, the height-adjusting button is connected to the upper end of the lower heat-conducting copper tube, and the lower end of the lower heat-conducting copper tube is fixedly connected to the upper surface of the aluminum alloy base;

[0009] The mainboard and semiconductor cooling sheet are installed in the plastic tray, and a VC heat spreader is installed above the plastic tray. The VC heat spreader is located above the mainboard and the semiconductor cooling sheet, and the first aluminum alloy heat dissipation module and the second aluminum alloy heat dissipation module are adsorbed on the VC heat spreader by magnetic attraction.

[0010] As a further optimization solution of the present invention, the first aluminum alloy heat dissipation module and the second aluminum alloy heat dissipation module are distributed on both sides of the projector, and the projector is mounted on a VC heat sink.

[0011] As a further optimization scheme of the present invention, the first aluminum alloy heat dissipation module and the second aluminum alloy heat dissipation module both include a heat dissipation shell, and air inlet and outlet slots are arranged on both sides of the heat dissipation shell. A motor is fixedly installed in the heat dissipation shell through a bracket, and fan blades are fixedly arranged on the rotating shaft of the motor. The motor and the fan blades are fans with PWM function.

[0012] As a further optimization solution of the present invention, a magnetic attraction plate is fixedly provided on the bottom surface of the heat dissipation housing, and the magnetic attraction plate is adsorbed and fixed on the upper surface of the VC heat spreader.

[0013] As a further optimization scheme of the present invention, the height adjustment button is a cylindrical structure, and a conical groove is arranged on the inner wall of the upper end of the height adjustment button. The upper end opening of the conical groove is large, and the lower end opening is small. An internal thread is arranged on the inner wall of the lower end of the height adjustment button, and an external thread structure is arranged on the outer ring of the upper end of the lower heat-conducting copper tube, and the external thread structure is connected with the internal thread.

[0014] As a further optimization scheme of the present invention, a plurality of arc-shaped elastic plates are further provided at the upper end of the lower heat-conducting copper tube, gaps are provided between the plurality of arc-shaped elastic plates, a circular ring structure is formed between the plurality of arc-shaped elastic plates, and an outer ring of the arc-shaped elastic plates is also provided with an external thread structure.

[0015] As a further optimization solution of the present invention, the diameter of the upper heat-conducting copper tube is smaller than the diameter of the lower heat-conducting copper tube.

[0016] As a further optimization scheme of the present invention, a threaded rod is fixedly provided on one side of the heat dissipation housing close to the projector, a threaded sleeve is connected to the threaded rod through threaded cooperation, a pressure plate is fixedly provided on the end of the threaded sleeve, and the pressure plate is pressed onto the side of the projector.

[0017] As a further optimization solution of the present invention, a rubber plate is fixedly provided on a side of the pressing plate away from the threaded sleeve.

[0018] As a further optimization solution of the present invention, a plurality of threaded rods are provided.

[0019] As a further optimization scheme of the present invention, it also includes a bottom power heat dissipation module, which includes an air inlet, a heat dissipation air outlet duct and a heat dissipation mechanism. The upper heat-conducting copper tube and the lower heat-conducting copper tube are both hollow round rod structures, and the upper heat-conducting copper tube and the lower heat-conducting copper tube are connected to each other. The air inlet is arranged at the upper end of the upper heat-conducting copper tube, and the air inlet is connected to the inside and outside of the upper heat-conducting copper tube. A plurality of air inlets are arranged, and the plurality of air inlets are distributed at equal angles along the axis of the upper heat-conducting copper tube;

[0020] The heat dissipation air outlet duct is fixedly arranged at the lower end of the lower heat-conducting copper tube, and the heat dissipation air outlet duct is an L-shaped duct structure. The upper end of the heat dissipation air outlet duct is connected to the interior of the lower heat-conducting copper tube, and the lower end of the heat dissipation air outlet duct faces the upper surface of the aluminum alloy base. There are multiple heat dissipation air outlet ducts, and the multiple heat dissipation air outlet ducts are distributed at equal angles along the axis of the upper heat-conducting copper tube.

[0021] As a further optimization solution of the present invention, a heat dissipation mechanism bracket is fixedly provided on the inner wall of the lower heat-conducting copper tube, and the heat dissipation mechanism is fixedly installed on the heat dissipation mechanism bracket.

[0022] As a further optimization scheme of the present invention, a suction cup is fixedly provided on the outer ring of the aluminum alloy base, the upper end of the suction cup extends out of the upper surface of the aluminum alloy base, and a voltage stabilizing area is formed between the part of the suction cup extending out of the upper surface of the aluminum alloy base and the aluminum alloy base.

[0023] The beneficial effects of the present invention are:

[0024] 1. The present invention transfers temperature to the VC heat spreader and the upper and lower heat-conducting copper tubes through semiconductor refrigeration sheets, thereby controlling the temperature of the air intake around and at the bottom of the projector, so that the air intake temperature is kept at a low temperature before entering the projector. The internal temperature of the projector is reduced, solving many problems of excessive temperature of the projector, thereby increasing the service life of the projector. Due to the internal PWM fan heat dissipation logic of the projector, the fan speed will decrease as the temperature decreases, thereby reducing the noise of the entire projector, solving the problem of high noise of the projector, and increasing the use for a better listening and speaking experience.

[0025] 2. In the present invention, the upper heat-conducting copper tube and the lower heat-conducting copper tube can be extended and retracted by rotating the height adjustment knob to adjust the upper and lower heights of the projection bracket, which is practical and convenient.

[0026] 3. In the present invention, after the heat dissipation housing is fixed on the VC heat spreader by the magnetic suction plate, the threaded sleeve is rotated to adjust the position of the threaded sleeve, so that the rubber plate is pressed against the side of the projector, which can also play the role of fixing the projector.

[0027] 4. In the present invention, the heat dissipation mechanism is activated, and the heat dissipation mechanism absorbs the heat dissipated from the bottom of the aluminum alloy base from the air inlet. The heat passes through the upper heat-conducting copper tube, the lower heat-conducting copper tube and the heat dissipation air outlet duct in sequence and is blown vertically to the upper surface of the aluminum alloy base. On the one hand, the heat dissipation effect is enhanced, and on the other hand, the stability of the aluminum alloy base when it is fixed can be increased by changing the heat discharge direction.

[0028] 5. In the present invention, a voltage stabilizing area is formed between the portion of the suction cup extending out of the upper surface of the aluminum alloy base and the aluminum alloy base. When the heat discharged from the heat dissipation air outlet duct blows to the upper surface of the aluminum alloy base, it will eventually push the upper outer circle of the suction cup, so that the upper surface of the aluminum alloy base is subjected to a downward or outward pushing force around it, thereby increasing the stability of the aluminum alloy base and avoiding the problem of instability caused by the vibration of the entire bracket due to the setting of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a perspective structural schematic diagram of the heat dissipation projector bracket of the present invention;

[0030] Figure 2 It is a schematic diagram of the disassembled structure of the heat dissipation projector bracket of the present invention;

[0031] Figure 3 It is a schematic structural diagram of the heat dissipation projector bracket of the present invention from another viewing angle;

[0032] Figure 4 is a cross-sectional view of a heat dissipation projector bracket of the present invention;

[0033] Figure 5 It is a schematic structural diagram of a first aluminum alloy heat dissipation module and a second aluminum alloy heat dissipation module of the present invention;

[0034] Figure 6 The present invention Figure 4 A schematic diagram of the structure enlargement in the middle;

[0035] Figure 7 It is a heat simulation diagram of the heat dissipation of the heat dissipation projector bracket of the present invention;

[0036] Figure 8 is a schematic diagram of the heat dissipation projector bracket structure in Example 2 of the present invention;

[0037] Fig. 9 is a schematic diagram of the structure of the aluminum alloy base in Example 2 of the present invention;

[0038] Fig.10 This is a heat simulation diagram of the heat dissipation of the heat dissipation projector bracket in Example 2 of the present invention.

[0039] In the figure: a first aluminum alloy heat dissipation module 1, a second aluminum alloy heat dissipation module 2, a VC heat spreader 3, a plastic tray 4, an upper thermally conductive copper tube 5, a height adjustment button 6, a lower thermally conductive copper tube 7, an aluminum alloy base 8, a semiconductor refrigeration sheet 9, a main board 10, a projector 11, a conical groove 12, an internal thread 13, a gap 14, an arc-shaped elastic plate 15, a fan blade 16, a motor 17, an air inlet and outlet groove 18, a magnetic suction plate 19, a threaded rod 20, a threaded sleeve 21, a pressure plate 22, a rubber plate 23, a heat dissipation housing 24, an air inlet 25, a suction cup 26, a heat dissipation air outlet duct 27, a heat dissipation mechanism 28, a heat dissipation mechanism bracket 29, and a voltage stabilizing area 30. DETAILED DESCRIPTION

[0040] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0041] In Example 1, Figures 1 to 7 As shown, a heat dissipation projector bracket includes a first aluminum alloy heat dissipation module 1, a second aluminum alloy heat dissipation module 2, a VC heat sink 3, a plastic tray 4, an upper heat-conducting copper tube 5, a height adjustment button 6, a lower heat-conducting copper tube 7, an aluminum alloy base 8, a semiconductor cooling sheet 9 and a mainboard 10.

[0042] Among them, the upper thermal conductive copper tube 5, the height adjustment button 6, the lower thermal conductive copper tube 7 and the aluminum alloy base 8 constitute a "lower thermal conductive component", which are arranged from top to bottom in sequence. The upper end of the upper thermal conductive copper tube 5 is fixedly connected to the middle of the bottom surface of the plastic tray 4, the lower end of the upper thermal conductive copper tube 5 is connected to the height adjustment button 6, the height adjustment button 6 is connected to the upper end of the lower thermal conductive copper tube 7, and the lower end of the lower thermal conductive copper tube 7 is fixedly connected to the upper surface of the aluminum alloy base 8.

[0043] Among them, the plastic tray 4 is equipped with a main board 10 and a semiconductor refrigeration sheet 9, the main board 10 is used to control the semiconductor refrigeration sheet 9, and the working principle of the semiconductor refrigeration sheet 9 is mainly based on the Peltier effect; when direct current passes through a thermocouple formed by two different semiconductor materials (N-type and P-type) connected in series, heat absorption and heat release phenomena will occur at both ends of the thermocouple respectively, thereby achieving the purpose of refrigeration; the semiconductor refrigeration sheet 9 is usually composed of N-type semiconductor material and P-type semiconductor material, and the two materials are connected in series in the circuit; when the direct current is turned on, when the current flows from the N-type element to the joint of the P-type element, the joint will absorb heat to form a cold end; on the contrary, the joint flowing from the P-type element to the N-type element will release heat to form a hot end; when the current passes through the semiconductor material, energy transfer will occur, so that heat is transferred from one end to the other end, thereby generating a temperature difference and forming a cold and hot end; the inside of the refrigeration sheet is composed of hundreds of pairs of thermoelectric piles connected by thermocouples to enhance the cooling (or heating) effect. The magnitude of heat absorption and heat release is determined by the magnitude of the current and the number of element pairs of semiconductor materials N and P; this is prior art and will not be elaborated here.

[0044] A VC heat spreader 3 is also installed above the plastic tray 4 , and the VC heat spreader 3 is located above the main board 10 and the semiconductor cooling sheet 9 .

[0045] The heat dissipation projection bracket is driven by a mainboard 10 to drive a semiconductor cooling sheet 9 to perform upper cooling and lower heat conduction work.

[0046] The upper cooling is that the semiconductor cooling sheet 9 conducts the cold air to the VC heat spreader 3, so that the temperature of the VC heat spreader 3 is in a low temperature state.

[0047] Among them, the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2 are adsorbed on the VC heat sink 3 by magnetic attraction, so as to introduce cold air into the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2, so that the external air passes through the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2, and then replaces the cold air and enters the interior of the projector.

[0048] It should be noted that the projector 11 is mounted on the VC heat sink 3 , and the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2 are distributed on both sides of the projector.

[0049] Furthermore, the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2 may also overlap and be magnetically attracted together, which can be adjusted according to actual needs.

[0050] As attached Figure 7 As shown, the semiconductor cooling plate 9 conducts heat from the upper heat-conducting copper tube 5 to the lower heat-conducting copper tube 7, and then to the aluminum alloy base 8 for heat dissipation.

[0051] Among them, the first aluminum alloy heat dissipation module 1 and the second aluminum alloy heat dissipation module 2 both include a heat dissipation shell 24, and air inlet and outlet grooves 18 are arranged on both sides of the heat dissipation shell 24. A magnetic suction plate 19 is fixedly arranged on the bottom surface of the heat dissipation shell 24, and the magnetic suction plate 19 is adsorbed and fixed on the upper surface of the VC heat spreader 3. A motor 17 is fixedly installed in the heat dissipation shell 24 through a bracket, and a fan blade 16 is fixedly arranged on the rotating shaft of the motor 17. The motor 17 and the fan blade 16 are fans with PWM function. When the projector 11 is located between a pair of heat dissipation shells 24, the fan blade 16 rotates to blow air toward the side of the projector 11.

[0052] Furthermore, a threaded rod 20 is fixedly provided on one side of the heat dissipation shell 24 close to the projector 11, and a threaded sleeve 21 is connected to the threaded rod 20 through threaded cooperation. A pressure plate 22 is fixedly provided on the end of the threaded sleeve 21, and a rubber plate 23 is fixedly provided on the side of the pressure plate 22 away from the threaded sleeve 21. There are multiple threaded rods 20. When the heat dissipation shell 24 is fixed on the VC heat spreader 3 by the magnetic suction plate 19, the threaded sleeve 21 is rotated to adjust the position of the threaded sleeve 21, so that the rubber plate 23 is pressed against the side of the projector 11, which can also play the role of fixing the projector 11 at the same time.

[0053] The present invention conducts temperature to the VC heat spreader 3 and the upper and lower heat conducting copper tubes 5 and 7 through the semiconductor cooling sheet 9, thereby controlling the temperature of the air intake around and at the bottom of the projector 11, so that the air intake temperature is kept at a low temperature when entering the projector 11. The internal temperature of the projector 11 is reduced, and due to the internal PWM fan heat dissipation logic of the projector, the fan speed will be reduced as the temperature decreases, thereby reducing the noise of the entire projector.

[0054] The present invention solves the problem of over-high temperature of many projectors 11, thereby increasing the service life of the projector 11; solves the problem of high noise of the projector 11, and increases the user experience for better audition.

[0055] The upper heat-conducting copper tube 5 and the lower heat-conducting copper tube 7 can be extended and retracted by rotating the height-adjusting knob 6 to adjust the upper and lower heights of the projection bracket, which is practical and convenient.

[0056] Specifically, the height adjustment button 6 is a cylindrical structure, and a conical groove 12 is provided on the inner wall of the upper end of the height adjustment button 6. The upper end opening of the conical groove 12 is large, and the lower end opening is small. An internal thread 13 is provided on the inner wall of the lower end of the height adjustment button 6. An external thread structure is provided at the outer ring of the upper end of the lower heat-conducting copper tube 7. The external thread structure is connected with the internal thread 13. The diameter of the upper heat-conducting copper tube 5 is smaller than the diameter of the lower heat-conducting copper tube 7. A plurality of arc-shaped elastic plates 15 are also provided on the upper end of the lower heat-conducting copper tube 7. A gap 14 is provided between the plurality of arc-shaped elastic plates 15 to form a circular space between the plurality of arc-shaped elastic plates 15. The outer ring of the arc-shaped elastic plate 15 is also provided with an external thread structure. When the height adjustment button 6 is rotated so that the internal thread 13 is located at the outer ring of the circular ring structure, the height adjustment button 6 can press and fix the circular ring structure, thereby clamping and fixing the upper heat-conducting copper tube 5 in the lower heat-conducting copper tube 7. When the height adjustment button 6 is rotated so that the arc-shaped elastic plate 15 is located in the conical groove 12, due to the elastic effect of the arc-shaped elastic plate 15 itself, the upper end of the arc-shaped elastic plate 15 opens outward, thereby achieving the purpose of loosening the upper heat-conducting copper tube 5. At this time, the height of the upper heat-conducting copper tube 5 relative to the lower heat-conducting copper tube 7 can be adjusted.

[0057] In the present invention, other conventional methods may also be used to adjust the height of the projector 11, which will not be described in detail here.

[0058] In Example 2, Figures 8 to 10 As shown, a heat dissipation projector bracket also includes a bottom power heat dissipation module, the bottom power heat dissipation module includes an air inlet 25, a heat dissipation air outlet duct 27 and a heat dissipation mechanism 28, the upper heat-conducting copper tube 5 and the lower heat-conducting copper tube 7 are both hollow round rod structures, and the upper heat-conducting copper tube 5 and the lower heat-conducting copper tube 7 are connected to each other, the air inlet 25 is arranged at the upper end of the upper heat-conducting copper tube 5, and the air inlet 25 is connected to the inside and outside of the upper heat-conducting copper tube 5, and a plurality of air inlets 25 are arranged, and the plurality of air inlets 25 are distributed at equal angles along the axis of the upper heat-conducting copper tube 5; the heat dissipation air outlet duct 27 is fixedly arranged at the lower end of the lower heat-conducting copper tube 7, and the heat dissipation air outlet duct 27 is an L-shaped duct structure, and the upper end of the heat dissipation air outlet duct 27 is connected to the inside of the lower heat-conducting copper tube 7, and the heat dissipation air outlet duct 27 is connected to the inside of the lower heat-conducting copper tube 7. The lower end of the pipe 27 faces the upper surface of the aluminum alloy base 8, and a plurality of heat dissipation air outlet pipes 27 are provided, and the plurality of heat dissipation air outlet pipes 27 are distributed at equal angles along the axis of the upper heat-conducting copper tube 5; a heat dissipation mechanism bracket 29 is fixedly provided on the inner wall of the lower heat-conducting copper tube 7, and the heat dissipation mechanism 28 is fixedly installed on the heat dissipation mechanism bracket 29. When working, the heat dissipation mechanism 28 is started, and the heat dissipation mechanism 28 absorbs the heat dissipated from the bottom of the aluminum alloy base 8 from the air inlet 25, and the heat passes through the upper heat-conducting copper tube 5, the lower heat-conducting copper tube 7 and the heat dissipation air outlet pipes 27 in turn and is blown vertically to the upper surface of the aluminum alloy base 8, which, on the one hand, enhances the heat dissipation effect, and on the other hand, can increase the stability of the aluminum alloy base 8 when it is fixed by changing the heat discharge direction.

[0059] Furthermore, in the present invention, a suction cup 26 is fixedly provided at the outer ring of the aluminum alloy base 8, and the bottom of the suction cup 26 is adsorbed and fixed to the fixed object, and the upper end of the suction cup 26 extends out of the upper surface of the aluminum alloy base 8, and a voltage stabilizing area 30 is formed between the part of the suction cup 26 extending out of the upper surface of the aluminum alloy base 8 and the aluminum alloy base 8. When the heat discharged from the heat dissipation air outlet duct 27 blows to the upper surface of the aluminum alloy base 8, it will eventually push the upper outer ring of the suction cup 26, so that the upper surface of the aluminum alloy base 8 is subjected to a downward or peripheral pushing force around, thereby increasing the stability of the aluminum alloy base 8 and avoiding the problem of instability caused by the vibration of the entire bracket due to the setting of the heat dissipation module.

[0060] It should be noted that the heat dissipation mechanism 28 is a combination of a conventional motor and fan blades, which will not be described in detail here.

[0061] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A heat dissipation projector bracket, characterized in that: It comprises a first aluminum alloy heat dissipation module (1), a second aluminum alloy heat dissipation module (2), a VC heat sink (3), a plastic tray (4), an upper heat-conducting copper tube (5), a height adjustment button (6), a lower heat-conducting copper tube (7), an aluminum alloy base (8), a semiconductor cooling sheet (9) and a main board (10); The upper heat-conducting copper tube (5), the height-adjusting button (6), the lower heat-conducting copper tube (7) and the aluminum alloy base (8) form a "lower heat-conducting assembly". The upper heat-conducting copper tube (5), the height-adjusting button (6), the lower heat-conducting copper tube (7) and the aluminum alloy base (8) are arranged in sequence from top to bottom. The upper end of the upper heat-conducting copper tube (5) is fixedly connected to the middle of the bottom surface of the plastic tray (4), the lower end of the upper heat-conducting copper tube (5) is connected to the height-adjusting button (6), the height-adjusting button (6) is connected to the upper end of the lower heat-conducting copper tube (7), and the lower end of the lower heat-conducting copper tube (7) is fixedly connected to the upper surface of the aluminum alloy base (8); The plastic tray (4) is provided with a main board (10) and a semiconductor cooling plate (9), and a VC heat spreader (3) is also provided above the plastic tray (4). The VC heat spreader (3) is located above the main board (10) and the semiconductor cooling plate (9), and the first aluminum alloy heat dissipation module (1) and the second aluminum alloy heat dissipation module (2) are attached to the VC heat spreader (3) by magnetic attraction.

2. The heat dissipation projector bracket according to claim 1, characterized in that: The first aluminum alloy heat dissipation module (1) and the second aluminum alloy heat dissipation module (2) are distributed on both sides of the projector (11), and the projector (11) is mounted on a VC heat sink (3).

3. The heat dissipation projector bracket according to claim 2, characterized in that: The first aluminum alloy heat dissipation module (1) and the second aluminum alloy heat dissipation module (2) both comprise a heat dissipation housing (24), both sides of the heat dissipation housing (24) are provided with air inlet and outlet slots (18), a motor (17) is fixedly mounted in the heat dissipation housing (24) via a bracket, a fan blade (16) is fixedly arranged on the rotating shaft of the motor (17), and the motor (17) and the fan blade (16) are fans with PWM function.

4. The heat dissipation projector bracket according to claim 3, characterized in that: A magnetic attraction plate (19) is fixedly provided on the bottom surface of the heat dissipation housing (24), and the magnetic attraction plate (19) is adsorbed and fixed on the upper surface of the VC heat spreader (3).

5. The heat dissipation projector bracket according to claim 1, characterized in that: The height adjustment button (6) is a cylindrical structure. The inner wall of the upper end of the height adjustment button (6) is provided with a conical groove (12). The upper end opening of the conical groove (12) is large, and the lower end opening is small. The inner wall of the lower end of the height adjustment button (6) is provided with an internal thread (13). The upper outer ring of the lower heat-conducting copper tube (7) is provided with an external thread structure, and the external thread structure is matched and connected with the internal thread (13).

6. The heat dissipation projector bracket according to claim 5, characterized in that: A plurality of arc-shaped elastic plates (15) are also provided at the upper end of the lower heat-conducting copper tube (7), gaps (14) are provided between the plurality of arc-shaped elastic plates (15), a circular ring structure is formed between the plurality of arc-shaped elastic plates (15), and an outer ring of the arc-shaped elastic plate (15) is also provided with an external thread structure, and the diameter of the upper heat-conducting copper tube (5) is smaller than the diameter of the lower heat-conducting copper tube (7).

7. The heat dissipation projector bracket according to claim 3, characterized in that: A threaded rod (20) is fixedly arranged on a side of the heat dissipation housing (24) close to the projector (11); a threaded sleeve (21) is connected to the threaded rod (20) through threaded matching; a pressure plate (22) is fixedly arranged at the end of the threaded sleeve (21); the pressure plate (22) is pressed onto the side of the projector (11); a plurality of threaded rods (20) are arranged; a rubber plate (23) is fixedly arranged on a side of the pressure plate (22) away from the threaded sleeve (21).

8. The heat dissipation projector bracket according to claim 1, characterized in that: It also includes a bottom power heat dissipation module, which includes an air inlet (25), a heat dissipation air outlet duct (27) and a heat dissipation mechanism (28); the upper heat-conducting copper tube (5) and the lower heat-conducting copper tube (7) are both hollow round rod structures, and the upper heat-conducting copper tube (5) and the lower heat-conducting copper tube (7) are connected to each other; the air inlet (25) is arranged at the upper end of the upper heat-conducting copper tube (5), and the air inlet (25) is connected to the inside and outside of the upper heat-conducting copper tube (5); a plurality of air inlets (25) are arranged, and the plurality of air inlets (25) are distributed at equal angles along the axis of the upper heat-conducting copper tube (5); The heat dissipation air outlet duct (27) is fixedly arranged at the lower end of the lower heat-conducting copper tube (7), the heat dissipation air outlet duct (27) is an L-shaped duct structure, the upper end of the heat dissipation air outlet duct (27) is connected to the interior of the lower heat-conducting copper tube (7), and the lower end of the heat dissipation air outlet duct (27) faces the upper surface of the aluminum alloy base (8), and a plurality of heat dissipation air outlet ducts (27) are arranged, and the plurality of heat dissipation air outlet ducts (27) are distributed at equal angles along the axis of the upper heat-conducting copper tube (5).

9. The heat dissipation projector bracket according to claim 8, characterized in that: A heat dissipation mechanism bracket (29) is fixedly arranged on the inner wall of the lower heat-conducting copper tube (7), and the heat dissipation mechanism (28) is fixedly mounted on the heat dissipation mechanism bracket (29).

10. The heat dissipation projector bracket according to claim 8, characterized in that: A suction cup (26) is fixedly arranged at the outer ring of the aluminum alloy base (8), the upper end of the suction cup (26) extends out of the upper surface of the aluminum alloy base (8), and a voltage stabilizing area (30) is formed between the portion of the suction cup (26) extending out of the upper surface of the aluminum alloy base (8) and the aluminum alloy base (8).

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