Solid-state power amplifier life evaluation method based on thermal-mechanical coupling

Abstract

The invention discloses a solid-state power amplifier service life evaluation method based on thermal-mechanical coupling, and belongs to the field of reliability modeling and simulation of radio frequency solid-state power amplifiers, and the method comprises the following steps: creating simulation analysis software of a solid-state amplifier; creating a model by utilizing simulation software; a parameterized interface is formed, and background driving simulation analysis software is used for analysis; the background drives simulation analysis software to carry out simulation solution; the guide software extracts and displays a simulation result by reading an engineering result file of the simulation analysis software; the random vibration fatigue life and the temperature shock fatigue life of the solid-state amplifier product under the random vibration and temperature shock working conditions are calculated, and the life under the random vibration and temperature shock coupling effect is calculated. According to the method, the workload of manual operation is greatly reduced, the work repetition rate is reduced, and the design efficiency of a solid-state power amplifier product is integrally improved.

Description

Technical Field

[0001] The present invention relates to the field of reliability modeling and simulation of radio frequency solid-state power amplifiers, and more specifically, to a solid-state power amplifier life assessment method based on thermal-mechanical coupling. Background Art

[0002] Microwave solid-state power amplifiers are favored in many fields due to their advantages such as small size, low operating voltage, high stability, and good repeatability. They are widely used in modern wireless communications, satellite transceiver equipment, radar, telemetry and remote control systems, etc. In order to cope with various complex operating conditions, a life assessment model needs to be constructed during the design phase. After repeated corrections of product defects, product reliability can be improved.

[0003] At present, the industry generally adopts a life assessment model under a single working condition to complete the random vibration fatigue life assessment and the temperature shock fatigue life assessment. The assessment and optimization are completed under two single working conditions respectively, and it is impossible to achieve comprehensive assessment and optimization under the superposition and coupling of the two working conditions. On the other hand, the designers use the existing commercial structural simulation software to complete the geometric structure modeling, material parameter setting, working condition setting, grid setting, simulation analysis, result analysis and other operations for solid-state amplifier products. The process is cumbersome and repetitive. In the life assessment and analysis stage, manual calculations are required according to ethical formulas. When the results are not ideal, the parameters need to be adjusted repeatedly to optimize the performance of the design product, resulting in the entire design process being very inefficient and difficult to meet the needs of efficient design of solid-state amplifier products. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a solid-state power amplifier life assessment method based on thermal coupling, which greatly reduces the workload of manual operations, reduces the work repetition rate, and overall improves the design efficiency of solid-state power amplifier products.

[0005] The object of the present invention is achieved through the following solutions:

[0006] A method for evaluating the life of a solid-state power amplifier based on thermal-mechanical coupling, comprising:

[0007] S1, creating simulation analysis software for a solid-state amplifier, wherein the simulation analysis software includes a standard model library, wizard software, and a scheduling and visualization interface of background software;

[0008] S2, creating a model using simulation software, extracting parameters to form a simulation model template, packaging and integrating it into a standard model library, and completing the packaging and integration of the simulation model;

[0009] S3, selecting a simulation model from the standard model library, the wizard software extracting simulation parameters of the packaged integrated simulation model to form a parameterized interface, and the user uses the background driving simulation analysis software to perform analysis by modifying the extracted simulation parameters;

[0010] S4, after completing the simulation parameter modification, the background drives the simulation analysis software to perform simulation solution;

[0011] S5, after the solution is completed, the wizard software extracts the simulation results by reading the engineering result file of the simulation analysis software, and displays them in the visual interface;

[0012] S6, according to the simulation results, combined with the fatigue life evaluation algorithm integrated into the simulation analysis software, calculate the random vibration fatigue life and temperature shock fatigue life of the solid-state amplifier product under random vibration and temperature shock conditions, and based on the random vibration fatigue life and temperature shock fatigue life, calculate the life under the coupling of random vibration and temperature shock.

[0013] Further, in step S2, the simulation software includes ANSYS simulation software, and the wizard software supports parsing the ANSYS simulation model with parameters, extracting the simulation model, reading the simulation model file, displaying the three-dimensional geometric model in the software interface, and realizing the visual display of the ANSYS simulation model with parameters.

[0014] Furthermore, step S3 includes a sub-step: the user modifies the simulation parameters of the simulation model according to the design change; the simulation parameters include geometric parameters, material parameters and simulation parameters.

[0015] Further, in step S4, the sub-steps are included: after completing the parameter modification, selecting the ANSYS software version for background call calculation and setting the number of solution cores, calling the simulation software in the background, performing background solution, and completing the solution of the simulation analysis software.

[0016] Furthermore, in step S5, the engineering result file includes picture format results and three-dimensional dynamic visualization results, and the simulation results include result data, result pictures and result data curves.

[0017] Further, in step S6, the method for calculating the random vibration fatigue life specifically includes the following sub-steps:

[0018] According to the principle of the three-interval method, the response stress simulated under random vibration load is divided into three levels, namely 1σ, 2σ, and 3σ levels;

[0019] According to Miner's law, the total damage accumulation D is expressed as:

[0020]

[0021] Among them, n1, n2 and n3 represent the accumulated fatigue cycles at 1σ, 2σ and 3σ stress levels, respectively, and N1, N3 and N3 represent the corresponding failure cycles at 1σ, 2σ and 3σ stress levels, respectively;

[0022] The sizes of n1, n2 and n3 are determined by the following formula:

[0023]

[0024] Where T is the failure time, V0 is the positive zero mean crossing rate;

[0025] Assuming that failure occurs when the total damage accumulation D = 1, then:

[0026]

[0027] The expiration time is:

[0028]

[0029] Further, in step S6, the method for calculating the temperature shock fatigue life specifically includes the following sub-steps:

[0030] The crack initiation life is expressed as:

[0031]

[0032] The crack growth life is expressed as:

[0033]

[0034] The characteristic life is expressed as:

[0035]

[0036] Where N w is the characteristic cycle life, K1, K2, K3 and K4 are BGA package coefficients, depending on the specific package form, ΔW ave is the accumulated plastic strain energy density in a single cycle, and ΔW ave The thermal shock fatigue life can be obtained by substituting the calculated value into the Darveaux equation.

[0037] Further, in step S6, the method for calculating the life prediction after the random vibration and the temperature shock are coupled specifically includes the following sub-steps:

[0038] The linear damage superposition method is used to calculate the life prediction after the coupling of random vibration and temperature shock. The expression of the linear damage superposition method is:

[0039]

[0040] Where, T is the failure time;

[0041] Total cumulative damage D under combined thermal and vibration loading total for:

[0042] D total =D t +D r ;

[0043] Where Dt is the fatigue damage under temperature shock load; Dr is the fatigue damage under random vibration load;

[0044] Then the life prediction function N after random vibration and temperature shock coupling is f for:

[0045]

[0046] The beneficial effects of the present invention include:

[0047] The present invention studies the response characteristics of solid-state power amplifier products under temperature shock and random vibration working environments, realizes the packaging of simulation models of solid-state power amplifier products, establishes a simulation analysis process from geometric structure modeling, material parameter setting, working condition setting, grid setting, simulation solution, result analysis, and parameter optimization iteration, realizes convenient parameter modification and efficient full-process simulation drive, deeply integrates the random vibration test method and temperature shock test method in the GB / T 2423.56 standard, and also constructs a new fatigue life assessment algorithm based on random vibration-temperature shock coupling, integrates the life assessment module of solid-state power amplifiers under the superposition condition of random vibration and temperature shock, and automatically completes fatigue life assessment, which greatly reduces the workload of manual operations, reduces the work repetition rate, and improves the design efficiency of solid-state power amplifier products as a whole.

[0048] The present invention provides a life assessment method for a solid-state power amplifier under the condition of random vibration and temperature shock superposition, and constructs a system for rapidly realizing multi-physics field simulation analysis and reliability assessment of a solid-state amplifier, which can form a simulation analysis component for a packaged simulation model, realize parameter correction of the simulation model, automatic background simulation analysis, and output multi-physics field simulation results. The system integrates the random vibration test method and temperature shock test method in the GB / T 2423.56 standard, and integrates a fatigue life assessment method based on the coupling of random vibration and temperature shock, realizing convenient parameter modification, efficient full-process simulation drive, and automated fatigue life assessment. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0050] Figure 1 It is a flowchart of the steps of the method for implementing the present invention;

[0051] Figure 2 It is an example of the software interface and loading model described in the present invention; it implements the setting of geometric parameters of the instance object;

[0052] Figure 3 An interface for setting working conditions of the present invention;

[0053] Figure 4 It is the material property library data maintenance interface of the present invention;

[0054] Figure 5 A cloud diagram showing the results of the implementation examples of the present invention;

[0055] Figure 6 The figures are life evaluation results under the random vibration-temperature shock coupling of the implementation examples described in the present invention. DETAILED DESCRIPTION

[0056] All features disclosed in all embodiments in this specification, or steps in all methods or processes implicitly disclosed, except for mutually exclusive features and / or steps, can be combined and / or expanded or replaced in any manner.

[0057] The specific implementation process of the present invention is as follows:

[0058] In a preferred embodiment, a method for evaluating the life of a solid-state power amplifier under the condition of random vibration and temperature shock superposition is provided, which specifically includes the following steps:

[0059] Step S1, creating simulation analysis software for a solid-state amplifier, wherein the simulation analysis software includes a standard model library, wizard software, scheduling of background software, and a visualization interface;

[0060] Step S2, using the commercial software ANSYS to create a model, extracting parameters to form a simulation model template, packaging and integrating it into a standard model library, and completing the packaging and integration of the simulation model;

[0061] Step S3, a simulation model is selected from the standard model library, the wizard software extracts simulation parameters of the package integrated simulation model, forms a parameterized interface, and the user uses the background driving simulation analysis software to perform analysis by modifying the extracted simulation parameters;

[0062] Step S4, after completing the simulation parameter modification, the background automatically drives the simulation analysis software to perform simulation solution;

[0063] Step S5, after the solution is completed, the wizard software quickly realizes automatic extraction of the simulation results by reading the engineering result file of the simulation analysis software, and displays them in the visualization interface; the engineering result file includes picture format results and three-dimensional dynamic visualization results, and the simulation results include result data, result pictures and result data curves;

[0064] Step S6, according to the simulation solution results, combined with the fatigue life assessment algorithm integrated into the simulation analysis software, automatically calculate the random vibration fatigue life and temperature shock fatigue life of the solid-state amplifier product under random vibration and temperature shock conditions, and based on the random vibration fatigue life and temperature shock fatigue life, use the linear damage superposition method to calculate the life under the coupling of random vibration and temperature shock.

[0065] In a more specific embodiment, step S2 includes:

[0066] The wizard software supports parsing the ANSYS simulation model with parameters, extracting the simulation model, reading the simulation model file, displaying the three-dimensional geometric model on the software interface, and realizing the visual display of the ANSYS simulation model with parameters.

[0067] In a more specific embodiment, step S3 includes:

[0068] The user modifies the simulation parameters of the simulation model according to the design changes, and the simulation parameters may include but are not limited to geometric parameters, material parameters, and simulation parameters.

[0069] In a more specific embodiment, step S4 includes:

[0070] After completing the parameter modification, select the ANSYS software version for the background call calculation and set the number of solution cores. The background automatically calls the simulation software, performs background solution, and automatically completes the solution of the simulation analysis software.

[0071] In a more specific embodiment, the method for calculating the random vibration fatigue life in step S6 includes:

[0072] According to the principle of the three-interval method, the response stress simulated under random vibration load is divided into three levels, namely 1σ, 2σ, and 3σ levels;

[0073] According to Miner's law, the total damage accumulation D can be expressed as:

[0074]

[0075] Among them, n1, n2 and n3 represent the accumulated fatigue cycles at 1σ, 2σ and 3σ stress levels, respectively, and N1, N3 and N3 represent the corresponding failure cycles at 1σ, 2σ and 3σ stress levels, respectively;

[0076] The sizes of n1, n2 and n3 are determined by the following formula:

[0077]

[0078] Where T is the failure time, V0 is the positive zero mean crossing rate;

[0079] Assuming that failure occurs when the total damage accumulation D = 1, then:

[0080]

[0081] The expiration time is:

[0082]

[0083] In a more specific embodiment, the method for calculating the thermal shock fatigue life includes:

[0084] The crack initiation life is expressed as:

[0085]

[0086] The crack growth life is expressed as:

[0087]

[0088] The characteristic life is expressed as:

[0089]

[0090] Where Nw is the characteristic cycle life, K1, K2, K3 and K4 are BGA packaging coefficients, depending on the specific packaging form, ΔWave is the accumulated plastic strain energy density in a single cycle, and the temperature shock fatigue life can be obtained by substituting the ΔWave value into the Darveaux equation.

[0091] In a more specific embodiment, the method for calculating the life prediction after random vibration and temperature shock coupling includes:

[0092] The linear damage superposition method is used to calculate the life prediction after the coupling of random vibration and temperature shock. The expression of the linear damage superposition method is:

[0093]

[0094] Where, T is the failure time;

[0095] Total cumulative damage D under combined thermal and vibration loading total for:

[0096] D total =D t +D r

[0097] Where Dt is the fatigue damage under temperature shock load; Dr is the fatigue damage under random vibration load;

[0098] Then the life prediction function N after random vibration and temperature shock coupling is f for:

[0099]

[0100] In other embodiments of the present invention, taking the Ka-frequency RF solid-state power amplifier product as an example, a solid-state power amplifier model is created by instantiating a product template, and the entire process of adjusting the geometric structure parameters, setting the random vibration working condition, setting the temperature shock working condition, running the simulation, extracting the simulation result data, and automated fatigue life evaluation is completed in sequence in the wizard-type simulation software, and finally the fatigue life evaluation results based on the random vibration-temperature shock coupling are displayed on the result analysis interface.

[0101] Step 1: Instantiate and create a power amplifier model

[0102] Before conducting simulation design of a specific type of power amplifier product, the simulation model template needs to be integrated. The packaging and integration of the simulation model template can be completed by packaging the simulation model template and its associated files into a specified folder in the wizard software and configuring the .xml file in the same path of the simulation model template.

[0103] Instantiate the created model as Figure 2 As shown, after creating a simulation project, select the appropriate model template in the model library on the left to instantiate the model. The wizard software opens the packaged simulation model to automatically parse the simulation information, extract the simulation model setting parameters, display the model in the 3D interactive visualization window, and display the default parameter values ​​in the parameter setting window.

[0104] Step 2: Setting of geometric parameters

[0105] The instantiation model parameter settings are as follows Figure 2As shown in the red box in the lower left corner, the wizard software extracts the simulation parameters in the simulation model file according to the simulation model integrated into the software, and forms a parameterized setting interface for designers to change the parameters.

[0106] Step 3: Simulation Condition Settings

[0107] Random vibration Electronic packaging structure is subjected to randomly changing vibration acceleration power spectrum density load such as Figure 3 As shown on the left. Temperature shock load loading, 5 temperature shock cycles are carried out in the range of -50℃ to 150℃, and the whole cycle period is 300 minutes. Figure 3 Shown on the right.

[0108] Step 4: Material property settings

[0109] Before setting the structural material in the parameter setting interface, the material property data table required for the model simulation needs to be maintained in the material library. Some material properties are built into the wizard software. Users can add specific materials as needed and fill in the corresponding property values ​​according to the material property dimensions, such as Figure 4 In the parameter setting interface, you can select the corresponding material property value according to the material name.

[0110] Step 5: Run the simulation and display the results

[0111] After setting the acceleration power spectrum density load of random vibration in the random vibration fatigue interface, click the solve button, and the software will call ANSYS to perform background calculations. Wait for the solution to be completed, and you can view the stress cloud diagram in the 3D view. Figure 5 As shown; after setting the thermal temperature cycle load in the thermal fatigue interface, click the solve button, the software will call ANSYS in the background to perform background calculations, wait for the solution to be completed, and the thermal stress cloud map can be viewed in the 3D view.

[0112] Step 6: Random vibration-temperature shock coupled fatigue life assessment

[0113] In the random vibration fatigue interface, complete the input probability distribution parameter settings, including distribution type selection, shape factor setting, and sample quantity setting, to complete the random vibration fatigue failure probability assessment and obtain the N characteristic vibration fatigue life time and the N0 first failure vibration fatigue life time.

[0114] In the thermal fatigue interface, complete the input probability distribution parameter settings, including distribution type selection, shape factor setting, and sample quantity setting, to complete the thermal fatigue failure probability assessment and obtain the Nf characteristic vibration fatigue life time and N0 first failure vibration fatigue life time.

[0115] Finally, combined with the values ​​of random vibration fatigue and thermal fatigue life, the predicted life time after random vibration and temperature shock coupling is calculated according to the linear damage superposition method, and D is output in the software interface. total Numeric values, such as Figure 6 shown.

[0116] It should be noted that within the scope of protection defined in the claims of the present invention, the following embodiments can be combined and / or expanded or replaced in any logical way from the above specific implementation methods, such as disclosed technical principles, disclosed technical features or implicitly disclosed technical features.

[0117] Example 1

[0118] A method for evaluating the life of a solid-state power amplifier based on thermal-mechanical coupling, comprising:

[0119] S1, creating simulation analysis software for a solid-state amplifier, wherein the simulation analysis software includes a standard model library, wizard software, and a scheduling and visualization interface of background software;

[0120] S2, creating a model using simulation software, extracting parameters to form a simulation model template, packaging and integrating it into a standard model library, and completing the packaging and integration of the simulation model;

[0121] S3, selecting a simulation model from the standard model library, the wizard software extracting simulation parameters of the packaged integrated simulation model to form a parameterized interface, and the user uses the background driving simulation analysis software to perform analysis by modifying the extracted simulation parameters;

[0122] S4, after completing the simulation parameter modification, the background drives the simulation analysis software to perform simulation solution;

[0123] S5, after the solution is completed, the wizard software extracts the simulation results by reading the engineering result file of the simulation analysis software, and displays them in the visual interface;

[0124] S6, according to the simulation results, combined with the fatigue life evaluation algorithm integrated into the simulation analysis software, calculate the random vibration fatigue life and temperature shock fatigue life of the solid-state amplifier product under random vibration and temperature shock conditions, and based on the random vibration fatigue life and temperature shock fatigue life, calculate the life under the coupling of random vibration and temperature shock.

[0125] Example 2

[0126] Based on Example 1, in step S2, the simulation software includes ANSYS simulation software, and the wizard software supports parsing the ANSYS simulation model with parameters, extracting the simulation model, reading the simulation model file, displaying the three-dimensional geometric model on the software interface, and realizing the visual display of the ANSYS simulation model with parameters.

[0127] Example 3

[0128] On the basis of Example 1, in step S3, a sub-step is included: the user modifies the simulation parameters of the simulation model according to the design change; the simulation parameters include geometric parameters, material parameters and simulation parameters.

[0129] Example 4

[0130] On the basis of Example 2, in step S4, the sub-steps are included: after completing the parameter modification, selecting the ANSYS software version for background calculation and setting the number of solution cores, calling the simulation software in the background, performing background solution, and completing the solution of the simulation analysis software.

[0131] Example 5

[0132] On the basis of Example 1, in step S5, the engineering result file includes picture format results and three-dimensional dynamic visualization results, and the simulation results include result data, result pictures and result data curves.

[0133] Example 6

[0134] On the basis of Example 1, in step S6, the method for calculating the random vibration fatigue life specifically includes the following sub-steps:

[0135] According to the principle of the three-interval method, the response stress simulated under random vibration load is divided into three levels, namely 1σ, 2σ, and 3σ levels;

[0136] According to Miner's law, the total damage accumulation D is expressed as:

[0137]

[0138] Among them, n1, n2 and n3 represent the accumulated fatigue cycles at 1σ, 2σ and 3σ stress levels, respectively, and N1, N3 and N3 represent the corresponding failure cycles at 1σ, 2σ and 3σ stress levels, respectively;

[0139] The sizes of n1, n2 and n3 are determined by the following formula:

[0140]

[0141] Where T is the failure time, V0 is the positive zero mean crossing rate;

[0142] Assuming that failure occurs when the total damage accumulation D = 1, then:

[0143]

[0144] The expiration time is:

[0145]

[0146] Example 7

[0147] On the basis of Example 1, in step S6, the method for calculating the temperature shock fatigue life specifically includes the following sub-steps:

[0148] The crack initiation life is expressed as:

[0149]

[0150] The crack growth life is expressed as:

[0151]

[0152] The characteristic life is expressed as:

[0153]

[0154] Where N w is the characteristic cycle life, K1, K2, K3 and K4 are BGA package coefficients, depending on the specific package form, ΔW ave is the accumulated plastic strain energy density in a single cycle, and ΔW ave The thermal shock fatigue life can be obtained by substituting the calculated value into the Darveaux equation.

[0155] Example 8

[0156] On the basis of Example 1, in step S6, the method for calculating the life prediction after the random vibration and the temperature shock are coupled specifically includes the following sub-steps:

[0157] The linear damage superposition method is used to calculate the life prediction after the coupling of random vibration and temperature shock. The expression of the linear damage superposition method is:

[0158]

[0159] Where, T is the failure time;

[0160] Total cumulative damage D under combined thermal and vibration loading total for:

[0161] D total =D t +D r;

[0162] Where Dt is the fatigue damage under temperature shock load; Dr is the fatigue damage under random vibration load;

[0163] Then the life prediction function N after random vibration and temperature shock coupling is f for:

[0164]

[0165] The units involved in the embodiments of the present invention may be implemented by software or hardware, and the units described may also be arranged in a processor. The names of these units do not, in some cases, limit the units themselves.

[0166] According to one aspect of an embodiment of the present invention, a computer program product or a computer program is provided, the computer program product or the computer program includes a computer instruction, and the computer instruction is stored in a computer-readable storage medium. A processor of a computer device reads the computer instruction from the computer-readable storage medium, and the processor executes the computer instruction, so that the computer device executes the method provided in the above various optional implementations.

[0167] As another aspect, an embodiment of the present invention further provides a computer-readable medium, which may be included in the electronic device described in the above embodiment; or may exist independently without being assembled into the electronic device. The above computer-readable medium carries one or more programs, and when the above one or more programs are executed by an electronic device, the electronic device implements the method described in the above embodiment.

Claims

1. A method for evaluating the life of a solid-state power amplifier based on thermal-mechanical coupling, characterized in that: include: S1, creating simulation analysis software for a solid-state amplifier, wherein the simulation analysis software includes a standard model library, wizard software, and a scheduling and visualization interface of background software; S2, creating a model using simulation software, extracting parameters to form a simulation model template, packaging and integrating it into a standard model library, and completing the packaging and integration of the simulation model; S3, selecting a simulation model from the standard model library, the wizard software extracting simulation parameters of the packaged integrated simulation model to form a parameterized interface, and the user uses the background driving simulation analysis software to perform analysis by modifying the extracted simulation parameters; S4, after completing the simulation parameter modification, the background drives the simulation analysis software to perform simulation solution; S5, after the solution is completed, the wizard software extracts the simulation results by reading the engineering result file of the simulation analysis software, and displays them in the visual interface; S6, according to the simulation results, combined with the fatigue life evaluation algorithm integrated into the simulation analysis software, calculate the random vibration fatigue life and temperature shock fatigue life of the solid-state amplifier product under random vibration and temperature shock conditions, and based on the random vibration fatigue life and temperature shock fatigue life, calculate the life under the coupling of random vibration and temperature shock.

2. The solid-state power amplifier life assessment method based on thermal-mechanical coupling according to claim 1, characterized in that: In step S2, the simulation software includes ANSYS simulation software, and the wizard software supports parsing the ANSYS simulation model with parameters, extracting the simulation model, reading the simulation model file, displaying the three-dimensional geometric model on the software interface, and realizing the visual display of the ANSYS simulation model with parameters.

3. The solid-state power amplifier life assessment method based on thermal coupling according to claim 1, characterized in that: In step S3, it includes sub-steps: the user modifies the simulation parameters of the simulation model according to the design change; the simulation parameters include geometric parameters, material parameters and simulation parameters.

4. The solid-state power amplifier life assessment method based on thermal coupling according to claim 2, characterized in that: In step S4, the sub-steps are included: after completing the parameter modification, selecting the ANSYS software version for background calculation and setting the number of solution cores, calling the simulation software in the background, performing background solution, and completing the solution of the simulation analysis software.

5. The solid-state power amplifier life assessment method based on thermal-mechanical coupling according to claim 1, characterized in that: In step S5, the engineering result file includes picture format results and three-dimensional dynamic visualization results, and the simulation results include result data, result pictures and result data curves.

6. The solid-state power amplifier life assessment method based on thermal-mechanical coupling according to claim 1, characterized in that: In step S6, the method for calculating the random vibration fatigue life specifically includes the following sub-steps: According to the principle of the three-interval method, the response stress simulated under random vibration load is divided into three levels, namely 1σ, 2σ, and 3σ levels; According to Miner's law, the total damage accumulation D is expressed as: Among them, n1, n2 and n3 represent the accumulated fatigue cycles at 1σ, 2σ and 3σ stress levels, respectively, and N1, N3 and N3 represent the corresponding failure cycles at 1σ, 2σ and 3σ stress levels, respectively; The sizes of n1, n2 and n3 are determined by the following formula: Where T is the failure time, V0 is the positive zero mean crossing rate; Assuming that failure occurs when the total damage accumulation D = 1, then: The expiration time is:

7. The solid-state power amplifier life assessment method based on thermal-mechanical coupling according to claim 1, characterized in that: In step S6, the method for calculating the thermal shock fatigue life specifically includes the following sub-steps: The crack initiation life is expressed as: The crack growth life is expressed as: The characteristic life is expressed as: Where N w is the characteristic cycle life, K1, K2, K3 and K4 are BGA package coefficients, depending on the specific package form, ΔW ave is the accumulated plastic strain energy density in a single cycle, and ΔW ave The thermal shock fatigue life can be obtained by substituting the calculated value into the Darveaux equation.

8. The solid-state power amplifier life assessment method based on thermal-mechanical coupling according to claim 1, characterized in that: In step S6, the method for calculating the life prediction after the random vibration and the temperature shock are coupled includes the following sub-steps: The linear damage superposition method is used to calculate the life prediction after the coupling of random vibration and temperature shock. The expression of the linear damage superposition method is: Where, T is the failure time; Total cumulative damage D under combined thermal and vibration loading total for: D total =D t +D r ; Where Dt is the fatigue damage under temperature shock load; Dr is the fatigue damage under random vibration load; Then the life prediction function N after random vibration and temperature shock coupling is f for:

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