Test data file processing method and device and readable storage medium
By parsing and repairing the incomplete STDF files generated in chip tests, the problem of unavailability of test data under abnormal chip tests is solved, and the efficiency of chip tests is improved.
Patent Information
- Application Number
- CN202411303286.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-02-14
AI Technical Summary
An abnormal situation may occur during the chip testing process, resulting in the test interruption or suspension of tests, and the generated STDF files may have test data errors or missing. The existing technology cannot repair these files data, resulting in the inability to use the test data, affecting the chip testing efficiency.
Provide a method for processing test data files, including parsing the STDF file, determining the file integrity, and if it is incomplete, it will be repaired based on the statistical information in the parsed file, and output the test results.
By repairing incomplete STDF files, the test data generated under abnormal conditions in chip testing can be effectively utilized, which improves the efficiency of chip testing.
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Figure CN119446246A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor testing, and in particular to a method and device for processing a test data file and a readable storage medium. Background Art
[0002] The STDF data format is a common data format in the semiconductor testing industry, which is used to record the test data generated during the chip testing process. Abnormal situations may occur during the chip testing process, causing the test to be interrupted or stopped. At this time, the generated STDF file may have test data errors or missing problems. The STDF file is a binary streaming file that stores data in a specific format, and specific tools are required to parse and analyze the data. The existing STDF test data analysis software can parse the data in the STDF file, but it cannot repair the STDF file with data errors or missing data, resulting in the test data in the STDF file generated under abnormal chip testing conditions being unusable, which seriously affects the efficiency of chip testing. Summary of the invention
[0003] In this embodiment, a method, device and readable storage medium for processing a test data file are provided to solve the problem in the related art that test data generated under abnormal conditions of chip testing cannot be used.
[0004] In a first aspect, a method for processing a test data file is provided in this embodiment, the method comprising:
[0005] Parsing the test data file to obtain a parsed file;
[0006] Determining whether the parsed file is complete;
[0007] In the case where the parsed file is incomplete, corresponding statistical information is obtained based on the test data records in the parsed file, and the statistical information is supplemented into the parsed file to obtain a repaired file;
[0008] Based on the repair file, the test result corresponding to the test data record is output.
[0009] In some embodiments, the test data record includes a test item result record and a chip result record, and obtaining corresponding statistical information based on the test data record in the parsed file includes:
[0010] Based on the test item result records, the number of tested chips and the number of test failures corresponding to each test item are obtained by counting;
[0011] Based on the chip result records, the total number of chips tested, the number of chips that passed the test, and the number of chips tested corresponding to each chip category are statistically obtained.
[0012] In some embodiments, the adding the statistical information to the parsed file to obtain the repaired file includes:
[0013] Based on the number of chips under test and the number of test failures corresponding to each test item, generate a test item statistical field and add it to the parsing file;
[0014] Based on the number of tested chips corresponding to each chip classification, a soft classification statistical field and a hard classification statistical field are generated and added to the parsing file;
[0015] Based on the total number of the chips under test and the number of chips that pass the test, a batch statistics field is generated and added to the parsing file.
[0016] In some embodiments, parsing the test data file to obtain a parsed file includes:
[0017] Mapping at least a portion of the test data file to a pre-acquired memory space;
[0018] Based on the mapping, parsing at least a portion of the test data file to obtain a corresponding parsing result;
[0019] Determine whether all the test data files have been mapped;
[0020] In the case that all mappings are not completed, the above steps are repeated until all the test data files are parsed to obtain the parsed file.
[0021] In some embodiments, determining whether the parsed file is complete includes:
[0022] Determining whether the first test data record of the parsed file meets the preset format requirements;
[0023] Determine whether the last test data record of the parsed file is a batch end record;
[0024] In the case where the first test data record meets the preset format requirement and the last test data record is a batch end record, determining that the parsed file is complete;
[0025] When the first test data record meets the preset format requirement and the last test data record is not a batch end record, it is determined that the parsed file is incomplete.
[0026] In some embodiments, outputting the test result corresponding to the test data record based on the repair file includes:
[0027] Based on the test data record, read the test parameter value of the chip under test, and the upper threshold value and the lower threshold value corresponding to the test parameter value;
[0028] Based on the test parameter value, the upper threshold value and the lower threshold value, a process capability parameter value is calculated and obtained.
[0029] In some embodiments, outputting the test result corresponding to the test data record based on the repair file includes:
[0030] Based on the test data record, reading the coordinates and test results of each chip under test on the wafer;
[0031] A wafer map is obtained based on the coordinates of each tested chip and the test results.
[0032] In some of the embodiments, after adding the statistical information to the parsed file to obtain the repaired file, the method further includes:
[0033] Obtain the export content setting and export station number of the repair file;
[0034] Based on the export content setting and the export station number, the corresponding content of the repair file is exported.
[0035] In a second aspect, a device for processing a test data file is provided in this embodiment, the device comprising:
[0036] A parsing module, used for parsing the test data file to obtain a parsed file;
[0037] A determination module, used to determine whether the parsed file is complete;
[0038] An acquisition module, used for acquiring corresponding statistical information based on the test data records in the parsed file when the parsed file is incomplete, and supplementing the statistical information into the parsed file to obtain a repaired file;
[0039] An output module is used to output the test result corresponding to the test data record based on the repair file.
[0040] According to a third aspect, a readable storage medium is provided in this embodiment, on which a program is stored, and when the program is executed by a processor, the steps of the method for processing the test data file described in the first aspect are implemented.
[0041] Compared with the related art, the method for processing the test data file provided in the present embodiment parses the test data file to obtain a parsed file, converting the binary test data into a text format; determining whether the parsed file is complete, and if it is incomplete, obtaining corresponding statistical information based on the test data record in the parsed file, and supplementing the statistical information into the parsed file to obtain a repair file, and repairing the test data file with interrupted test process or abnormal test; and obtaining the data analysis result of the tested chip by outputting the test result corresponding to the test data record based on the repair file, thereby solving the problem that the test data generated in the case of abnormal chip test cannot be used, and improving the chip testing efficiency.
[0042] Details of one or more embodiments of the present application are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent. BRIEF DESCRIPTION OF THE DRAWINGS
[0043] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0044] Figure 1 is a computer hardware structure block diagram of a method for processing a test data file in some embodiments of the present application;
[0045] Figure 2 is a flowchart of a method for processing a test data file in some embodiments of the present application;
[0046] Figure 3 is a flowchart of obtaining statistical information based on test data records in some embodiments of the present application;
[0047] Figure 4 is a supplementary flow chart of statistical information of some embodiments of the present application;
[0048] Figure 5 is a flowchart of test data file parsing in some embodiments of the present application;
[0049] Figure 6 is a flowchart of determining whether a parsed file is complete in some embodiments of the present application;
[0050] Figure 7 is an output flow chart of process capability parameter values of some embodiments of the present application;
[0051] Figure 8 is a flow chart of outputting a wafer map of some embodiments of the present application;
[0052] Fig. 9 is a flowchart of exporting repair files in some embodiments of the present application;
[0053] Fig.10 is a flow chart of a method for processing a test data file in some preferred embodiments of the present application;
[0054] Fig.11 It is a structural block diagram of a test data file processing device in some embodiments of the present application. DETAILED DESCRIPTION
[0055] In order to more clearly understand the purpose, technical solutions and advantages of the present application, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0056] Unless otherwise defined, the technical terms or scientific terms involved in this application shall have the general meaning understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the", "these" and the like in this application do not represent quantitative restrictions, and they can be singular or plural. The terms "include", "comprise", "have" and any variants thereof involved in this application are intended to cover non-exclusive inclusions; for example, a process, method and system, product or device comprising a series of steps or modules (units) is not limited to the listed steps or modules (units), but may include unlisted steps or modules (units), or may include other steps or modules (units) inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether directly or indirectly. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, "A and / or B" can mean: A exists alone, A and B exist at the same time, and B exists alone. Usually, the character " / " indicates that the objects associated with each other are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.
[0057] The method for processing the test data file provided in the embodiment of the present application can be executed in a server, a computer or a similar computing device. When the method is applied to a computer, Figure 1 1 is a hardware structure diagram of a computer for processing test data files in some embodiments of the present application. Figure 1 As shown, the computer may include one or more ( Figure 1The computer may include a processor 102 and a memory 104 for storing data, wherein the processor 102 may include but is not limited to a processing device of a central processing unit (CPU). The number of CPUs may be one or more, and this embodiment does not limit this. The computer may also include a transmission device 106 and an input / output device 108 for communication functions. A person skilled in the art will understand that Figure 1 The structure shown is only for illustration and does not limit the structure of the above-mentioned computer. Figure 1 More or fewer components as shown, or with Figure 1 Different configurations shown.
[0058] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the method for processing test data files in the present embodiment. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, to implement the above method. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some embodiments, the memory 104 may further include a memory remotely arranged relative to the processor 102, and these remote memories may be connected to the computer via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.
[0059] The transmission device 106 is used to receive or send data via a network. The above network includes a wireless network provided by a communication provider of the computer. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.
[0060] In this embodiment, a method for processing a test data file is provided. Figure 2 is a flowchart of a method for processing a test data file in some embodiments of the present application, such as Figure 2 As shown, the process includes the following steps:
[0061] Step S201, parse the test data file to obtain a parsed file.
[0062] The test data file in this embodiment is a binary STDF file, which is composed of multiple data blocks in a preset format. Each data block includes one or more data records. Different data blocks store different data contents. The data blocks of an STDF file may include but are not limited to the following types:
[0063] FAR: The first record of the STDF file.
[0064] MIR and MRR: used to mark the start and end of a wafer lot test. Usually, an STDF file only includes a pair of MIR and MRR. MIR can be used to record the opening information such as lot number, product name, tester number, opening time, etc., and MRR can be used to record the closing information such as closing time, etc.
[0065] WIR, WCR and WRR: used to record the test process of a wafer. WIR is the start record of wafer test, WCR records the configuration information of wafer test, and WRR is the end record of wafer test. An STDF file can include one or more WIR / WRR pairs.
[0066] PIR, PTR and PRR: PIR / PRR is used to mark the start and end of each parallel test (Insertion). PIR records the test head information and station number, and PRR records the chip test result information of the current parallel test, including the chip number, chip HBin, chip SBin, test time, chip coordinates, etc. of the current parallel test. Each WIR / WRR pair can include one or more PIR / PRR pairs.
[0067] There are multiple PTRs between PIR and PRR, which are test result records of parameter test items. Each PTR includes the test head number, workstation number, test item number and name, test results, pass-fail flag, threshold value and other information corresponding to the pin of each chip in the current parallel test.
[0068] FTR: Test result record of functional test items running test patterns, similar to PTR data but without test results, only pass-fail flag. In addition, it also includes information such as test pattern name and timing configuration (TimmingSet) name.
[0069] MPR: Similar to PTR, it is also a test result record of parameter test items, but one record can contain the test results of multiple pins.
[0070] TSR: Counts the number of test item executions and the number of failures. For each different test item, counts the number of chips executed by the current test item and the number of failures among the chips.
[0071] HBR and SBR: Statistics of the number of hard-classified HBins and the number of soft-classified SBins.
[0072] PCR: The test results of the entire wafer lot, including the total number of tests, the number of passes, and the number of fails.
[0073] According to the preset data formats of the above-mentioned data blocks, the STDF file is parsed to obtain a parsed file, which can be a text file.
[0074] Step S202, determining whether the parsed file is complete.
[0075] According to the parsing results of the above data blocks in the parsed file, it is determined whether the parsed file is complete. Specifically, it can be determined whether the entire parsed file is complete according to whether the data blocks such as FAR, MIR, MRR, PCR, etc. are complete.
[0076] Step S203, when the parsed file is incomplete, corresponding statistical information is obtained based on the test data records in the parsed file, and the statistical information is supplemented into the parsed file to obtain a repaired file.
[0077] When the parsed file is incomplete, the statistical data such as TSR, HBR, SBR and PCR may be erroneous. In this case, the corresponding statistical information can be obtained based on the test data records in the parsed file such as PTR, FTR, MPR, and new TSR, HBR, SBR and PCR data blocks can be generated based on the statistical information, and the new data blocks can be added to the parsed file to obtain a repaired file.
[0078] Step S204: output the test result corresponding to the test data record based on the repair file.
[0079] Output the test results according to the statistical information in the repaired file. The output can be in the form of drawing various statistical analysis graphs and tables, or exporting corresponding text files, Excel files, as well as output after file format conversion, merge output and split output of files, etc.
[0080] Specifically, the statistical analysis charts and tables can be yield statistical charts, such as bar charts, histograms, scatter plots, wafer maps, etc. File format conversion can include conversion between CSV, ATDF, XLSX, JPG image formats, etc. File merging can include merging multiple STDF files and configuring the merging order, as well as merging files corresponding to multiple test heads, etc.
[0081] Through steps S201 to S204, the test data file is parsed to obtain a parsed file, and the binary test data is converted into a text format; by determining whether the parsed file is complete, if it is incomplete, the corresponding statistical information is obtained based on the test data records in the parsed file, and the statistical information is supplemented into the parsed file to obtain a repair file, and the test data file with interrupted test process or test abnormality is repaired; by outputting the test results corresponding to the test data records based on the repair file, the data analysis results of the tested chip are obtained, which solves the problem that the test data generated in the case of chip test abnormality cannot be used, and improves the chip testing efficiency.
[0082] In some embodiments, the test data record includes a test item result record and a chip result record. Figure 3 is a flowchart of obtaining statistical information based on test data records in some embodiments of the present application, such as Figure 3 As shown, the process includes the following steps:
[0083] Step S301: Based on the test item result records, the number of tested chips and the number of test failures corresponding to each test item are statistically obtained.
[0084] Test item result records refer to result records with test items as the record unit, including result records of parameter test items and test vectors (patterns). Specifically, it can include data records in data blocks such as PTR, FTR and MPR in the STDF file. The PTR, FTR and MPR data blocks record the test head number, station number, test item number and name, test results, pass-fail flag, and threshold value corresponding to the pins of each chip; the corresponding PRR records the corresponding chip serial number information. When there is a fail result in each PTR, FTR and MPR corresponding to the same chip, it can be determined that the chip test has failed.
[0085] Therefore, the number of chips tested and the number of test failures corresponding to each test item can be counted according to the pass-fail flag corresponding to each test item recorded in the PTR, FTR and MPR data blocks corresponding to each chip in each parallel test.
[0086] Step S302: Based on the chip result records, the total number of tested chips, the number of tested chips, and the number of tested chips corresponding to each chip category are counted.
[0087] The chip result record refers to the result record with the chip as the record unit, which can include the data record in the PRR data block in the STDF file. The PRR records the chip test result information of the current parallel test, including the chip serial number, chip HBin, chip SBin, test time, chip coordinates, etc. of the current parallel test. Chip HBin and SBin are the hardware classification number and software classification number obtained by classifying the test results of the chip. Whether the chip has passed the test can be determined based on the HBin and SBin values.
[0088] According to the number of chips and the corresponding HBin and SBin data in each parallel test, the total number of chips tested, the number of chips that passed the test, and the number of chips tested corresponding to each chip category are statistically obtained.
[0089] Through steps S301 to S302, based on the test item result records, the number of tested chips and the number of test failures corresponding to each test item are statistically obtained, and based on the chip result records, the total number of tested chips, the number of test passes and the number of tested chips corresponding to each chip category are statistically obtained. The original test data of each chip that has completed the test in the STDF file is counted to obtain the test statistics of the wafer batch. When the STDF file is incomplete, the statistical data of the tested chips are obtained, which provides necessary data support for repairing the parsing file.
[0090] In some embodiments, Figure 4 is a supplementary flow chart of statistical information of some embodiments of the present application, such as Figure 4 As shown, the process includes the following steps:
[0091] Step S401: Based on the number of chips under test and the number of test failures corresponding to each test item, a test item statistical field is generated and added to the parsing file.
[0092] The test item statistics field refers to the TSR data block in the parsed file. According to the number of chips tested and the number of test failures corresponding to each test item, the test item statistics field is generated according to the preset format of the TSR data block. In some embodiments, the incomplete parsed file does not include the TSR data block, and the test item statistics field can be directly added to the preset position of the TSR data block of the parsed file. In other embodiments, the incomplete parsed file includes the TSR data block, but the data in the TSR data block may be abnormal. In this case, the test item statistics field can be used to overwrite the original TSR data block.
[0093] Step S402: based on the number of tested chips corresponding to each chip classification, generate soft classification statistics fields and hard classification statistics fields and add them to the parsing file.
[0094] The soft classification statistics field refers to the SBR data block in the parsed file, and the hard classification statistics field refers to the HBR data block in the parsed file. According to the number of tested chips corresponding to each chip classification, the soft classification statistics field and the hard classification statistics field are generated according to the preset format of the SBR and HBR data blocks, and the positions of the SBR and HBR data blocks in the parsed file are supplemented or overwritten.
[0095] Step S403: Based on the total number of chips tested and the number of chips that pass the test, a batch statistics field is generated and added to the parsing file.
[0096] The batch statistics field refers to the PCR data block in the parsed file, which is used to count the test results of the entire wafer lot, including the total number of tests, the number of passes, and the number of fails. Based on the total number of chips tested and the number of test passes, the batch statistics field is generated according to the preset format of the PCR data block, and the position of the PCR data block in the parsed file is supplemented or overwritten.
[0097] Through steps S401 to S403, based on the number of tested chips and the number of test failures corresponding to each test item, the number of tested chips corresponding to each chip classification, the total number of tested chips and the number of test passes, test item statistical fields, soft classification statistical fields, hard classification statistical fields, and batch statistical fields are generated and added to the parsing file. The test data required for each statistical field of the parsing file is obtained through statistics and calculations, and is filled into the parsing file according to the preset format of each statistical field, thereby realizing the repair of the parsing file and improving the test data utilization rate when the chip testing process is abnormally terminated.
[0098] In some embodiments, Figure 5 is a flowchart of test data file parsing in some embodiments of the present application, such as Figure 5 As shown, the process includes the following steps:
[0099] Step S501: Map at least part of the test data file to the pre-acquired memory space.
[0100] The capacity of STDF files is large, and usually the memory space cannot accommodate the entire STDF file. Therefore, according to the size of the pre-acquired memory space, at least part of the test data file on the hard disk can be mapped to the virtual memory space of the parsing process. The mapping process only allocates address space and does not perform copy operations, which improves the parsing speed of the file.
[0101] Step S502: Based on the mapping, parse at least a portion of the test data file to obtain a corresponding parsing result.
[0102] The content of this part of the STDF file is parsed into text and saved through the memory mapping.
[0103] Step S503, determining whether all test data files have been mapped.
[0104] Determine whether the content of the entire STDF file has been read. If so, end the parsing process.
[0105] Step S504: if all mappings are not completed, repeat the above steps until all test data files are parsed to obtain parsed files.
[0106] If not, the remaining part of the STDF file is mapped to the virtual memory space and parsed until the content of the entire STDF file is fully parsed.
[0107] Through steps S501 to S504, by mapping at least part of the test data file to the pre-acquired memory space, the demand of the STDF file for memory resources is reduced; by parsing at least part of the test data file based on the mapping, the corresponding parsing result is obtained, and there is no need to copy the STDF file, thereby improving the parsing speed of the file; by repeating memory mapping and parsing, the entire STDF file is parsed into text, providing original data for further processing such as statistics and analysis of the test data.
[0108] In some embodiments, Figure 6 is a flowchart of determining whether a parsed file is complete in some embodiments of the present application, such as Figure 6 As shown, the process includes the following steps:
[0109] Step S601, determining whether the first test data record of the parsed file meets the preset format requirement.
[0110] The first test data record of the parsed file may be a FAR data block. The preset format is a text format corresponding to the FAR data block. The first test data record of the parsed file is text-matched with the preset format. If the match is successful, it is determined that the first test data record of the parsed file is a FAR data block.
[0111] Step S602, determining whether the last test data record of the parsed file is a batch end record.
[0112] The batch end record of the parsed file may be an MRR data block. The last test data record of the parsed file is text-matched with a preset format of the MRR data block. If the match succeeds, it is determined that the last test data record of the parsed file is an MRR data block.
[0113] Step S603: When the first test data record meets the preset format requirement and the last test data record is a batch end record, it is determined that the parsed file is complete.
[0114] If the first test data record of the parsed file is a FAR data block and the last test data record is an MRR data block, the parsed file is determined to be complete.
[0115] Step S604: when the first test data record meets the preset format requirement and the last test data record is not a batch end record, it is determined that the parsed file is incomplete.
[0116] If the first test data record of the parsed file is a FAR data block and the last test data record is not an MRR data block, it is determined that the parsed file is incomplete.
[0117] If the first test data record of the parsed file is not a FAR data block, it means that the parsed file is abnormal, and the processing flow of the parsed file can be terminated at this time.
[0118] Through steps S601 to S604, whether the parsed file is normal is determined by determining whether the first test data record of the parsed file meets the preset format requirements; whether the parsed file is complete is determined by determining whether the last test data record of the parsed file is a batch end record. If it is incomplete, the parsed file is repaired to supplement or overwrite the chip test statistical data in the original parsed file, thereby improving the accuracy of the statistical data in the parsed file.
[0119] In some embodiments, Figure 7 is an output flow chart of process capability parameter values of some embodiments of the present application, such as Figure 7 As shown, the process includes the following steps:
[0120] Step S701, based on the test data record, read the test parameter value of the chip under test, and the upper threshold and lower threshold corresponding to the test parameter value.
[0121] The PTR data block records the test item number, test result and threshold corresponding to the pin of each chip. The test result refers to the test parameter value of the chip pin in the current test item, and the threshold refers to the threshold value used to determine whether the test parameter value is Pass or Fail. The threshold can include an upper threshold and a lower threshold. When the test parameter value falls into the numerical interval between the upper threshold and the lower threshold, the test result is judged to be Pass, otherwise it is Fail.
[0122] Step S702: Calculate and obtain the process capability parameter value based on the test parameter value, the upper threshold value, and the lower threshold value.
[0123] The process capability parameter value may be one or more of the precision Cpk, accuracy Cp and accuracy Ca of the chip process.
[0124] The calculation formulas for precision Cpk, accuracy Cp and accuracy Ca are as follows:
[0125]
[0126] Among them, USL is the upper threshold, LSL is the lower threshold, μ is the mean of the test parameter value, and σ is the standard deviation of the test parameter value.
[0127] Through steps S701 to S702, the test parameter values of the tested chip and the upper and lower thresholds corresponding to the test parameter values are read based on the test data records to obtain the test results of each tested chip and the corresponding judgment standard values; the process capability parameter values are calculated based on the test parameter values, the upper and lower thresholds, and the chip process capability parameters are calculated through the test results of the tested chip, providing an effective basis for improving the chip process capability.
[0128] In some embodiments, Figure 8 is a flow chart of outputting wafer images of some embodiments of the present application, such as Figure 8 As shown, the process includes the following steps:
[0129] Step S801, based on the test data record, read the coordinates and test results of each chip under test on the wafer.
[0130] The PRR data block records the chip test result information of the current parallel test, including the chip serial number, chip HBin, chip SBin, test time, chip coordinates, etc. Read the PRR data block and get the Pass or Fail result of each tested chip according to the HBin and SBin data corresponding to each tested chip.
[0131] Step S802, obtaining a wafer map based on the coordinates of each chip under test and the test results.
[0132] According to the Pass or Fail results of each chip under test and the corresponding chip coordinates, a wafer map can be drawn. The drawing method can use the open source library QCustomPlot. Each chip under test in the wafer map is drawn according to its actual coordinate position, and the Pass or Fail results of the chip under test can be reflected in different colors.
[0133] Through steps S801 to S802, the coordinates and test results of each chip under test on the wafer are read based on the test data records, and based on the coordinates and test results of each chip under test, a wafer map is obtained to display the test pass status of each chip under test on the wafer in an intuitive manner, providing a reference for testers.
[0134] In some embodiments, Fig. 9is a flowchart of exporting repair files in some embodiments of the present application, such as Fig. 9 As shown, the process includes the following steps:
[0135] Step S901, obtaining the export content settings and export station number of the repair file.
[0136] Before exporting the repair file, you can set the export content and export station number to determine the exported data. The export content refers to the expression form of the data, such as histogram, scatter plot, etc. The export station number is used to export the chip test data corresponding to the test station.
[0137] Furthermore, the storage path of the exported file and other options can also be configured.
[0138] Step S902, based on the export content setting and the export station number, the corresponding content of the repair file is exported.
[0139] When the histogram and / or scatter plot is selected in the export content setting, since the statistical unit of the histogram or scatter plot is the test item, it is also necessary to set the test item to be exported to export the chip test data corresponding to the test item. According to the export content setting, test item and export station number, the corresponding content in the repair file is exported.
[0140] Through steps S901 to S902, by obtaining the export content setting and the export station number of the repair file, the corresponding content of the repair file is exported, and the chip test data is exported in a targeted manner, thereby improving the flexibility of chip test data processing.
[0141] The present embodiment is described and illustrated below through preferred embodiments. Fig.10 This is a method for processing test data files in some preferred embodiments of the present application, such as Fig.10 As shown, the process includes the following steps:
[0142] Step S1001, mapping at least a portion of the test data file to a pre-acquired memory space;
[0143] Step S1002, parsing the first part based on the mapping to obtain a corresponding parsing result;
[0144] Step S1003, determining whether all test data files have been mapped, if not, repeating steps S1001 to S1003;
[0145] Step S1004: if yes, end the parsing process to obtain the parsed file;
[0146] Step S1005, determining whether the first test data record of the parsed file is a FAR data block; if not, determining that there is an abnormality in the parsed file, and terminating the process;
[0147] Step S1006: If yes, determine whether the last test data record of the parsed file is an MRR data block;
[0148] Step S1007, if not, it is determined that the parsed file is incomplete; if so, proceed to step S1012;
[0149] Step S1008, when the parsed file is incomplete, based on the test item result records, the number of chips tested and the number of test failures corresponding to each test item are statistically obtained; based on the chip result records, the total number of chips tested, the number of test passes, and the number of chips tested corresponding to each chip category are statistically obtained;
[0150] Step S1009, based on the number of chips under test and the number of test failures corresponding to each test item, a TSR data block is generated and added to the parsing file;
[0151] Step S1010, based on the number of tested chips corresponding to each chip classification, generate SBR and HBR data blocks and add them to the parsing file;
[0152] Step S1011, based on the total number of chips tested and the number of chips that passed the test, generate a PCR data block and add it to the parsing file;
[0153] Step S1012, determining that the parsed file is complete;
[0154] Step S1013, based on the test data record, reading the test parameter value of the chip under test, and the upper threshold and lower threshold corresponding to the test parameter value;
[0155] Step S1014, based on the test parameter value, the upper threshold and the lower threshold, the process capability parameter value is calculated and exported;
[0156] Step S1015, reading the coordinates and test results of each chip under test on the wafer based on the test data record;
[0157] Step S1016, based on the coordinates of each chip under test and the test results, a wafer map is obtained and exported.
[0158] Steps S1013 to S1014 and steps S1015 to S1016 can be interchanged.
[0159] Through steps S1001 to S1016, the parsing speed of the file is improved through memory mapping, and the demand of the STDF file for memory resources is reduced; by matching the formats of the first test data record and the last test data record of the parsed file, it is determined whether the parsed file is complete. If it is incomplete, the original test data of each chip that has been tested in the STDF file is statistically analyzed to obtain the test statistical data of the wafer batch, and the statistical data is filled into the parsed file according to the preset format of each statistical field, so as to repair the parsed file and improve the test data utilization rate when the chip testing process is abnormally terminated; through the test results of the tested chip, the capability parameters and statistical charts of the chip process are calculated, providing an effective basis for improving the chip process capability.
[0160] This embodiment also provides a device for processing a test data file. Fig.11 is a structural block diagram of a test data file processing device in some embodiments of the present application, such as Fig.11 As shown, the device comprises:
[0161] The parsing module 1101 is used to parse the test data file to obtain a parsed file;
[0162] Determination module 1102, used to determine whether the parsed file is complete;
[0163] The acquisition module 1103 is used to acquire corresponding statistical information based on the test data records in the parsed file when the parsed file is incomplete, and to add the statistical information to the parsed file to obtain a repaired file;
[0164] The output module 1104 is used to output the test results corresponding to the test data records based on the repair file.
[0165] The processing device for the test data file of the present embodiment parses the test data file through the parsing module 1101 to obtain the parsed file, and converts the binary test data into a text format; determines whether the parsed file is complete through the determination module 1102, and obtains the corresponding statistical information based on the test data record in the parsed file through the acquisition module 1103 in the case of incompleteness, and supplements the statistical information into the parsed file to obtain a repair file, and repairs the test data file with interrupted test process or test abnormality; outputs the test result corresponding to the test data record based on the repair file through the output module 1104, and obtains the data analysis result of the tested chip, thereby solving the problem that the test data generated in the case of chip test abnormality cannot be used, and improving the chip test efficiency.
[0166] In addition, in combination with the test data file processing method provided in the above embodiment, a readable storage medium can also be provided in this embodiment to implement the test data file processing method. The readable storage medium stores a program; when the program is executed by the processor, any test data file processing method in the above embodiment is implemented.
[0167] It should be noted that the specific examples in this embodiment can refer to the examples described in the above embodiments and optional implementation modes, and will not be repeated in this embodiment.
[0168] It should be understood that the specific embodiments described herein are only used to explain the application, rather than to limit it. Based on the embodiments provided in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of this application.
[0169] Obviously, the drawings are only some examples or embodiments of the present application. For ordinary technicians in the field, the present application can also be applied to other similar situations based on these drawings without creative work. In addition, it is understandable that although the work done in this development process may be complicated and lengthy, for ordinary technicians in the field, certain changes in design, manufacturing or production based on the technical content disclosed in this application are only conventional technical means and should not be regarded as insufficient content disclosed in this application.
[0170] The term "embodiment" in this application refers to a specific feature, structure or characteristic described in conjunction with the embodiment that can be included in at least one embodiment of the present application. The appearance of this phrase in various locations in the specification does not necessarily mean the same embodiment, nor does it mean that it is mutually exclusive with other embodiments and is independent or optional. It is clearly or implicitly understood by those of ordinary skill in the art that the embodiments described in this application can be combined with other embodiments without conflict.
[0171] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of patent protection. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the attached claims.
Claims
1. A method for processing a test data file, characterized in that: The method comprises: Parsing the test data file to obtain a parsed file; Determining whether the parsed file is complete; In the case where the parsed file is incomplete, corresponding statistical information is obtained based on the test data records in the parsed file, and the statistical information is supplemented into the parsed file to obtain a repaired file; Based on the repair file, the test result corresponding to the test data record is output.
2. The method according to claim 1, characterized in that The test data record includes a test item result record and a chip result record, and obtaining corresponding statistical information based on the test data record in the parsed file includes: Based on the test item result records, the number of tested chips and the number of test failures corresponding to each test item are obtained by counting; Based on the chip result records, the total number of chips tested, the number of chips that passed the test, and the number of chips tested corresponding to each chip category are statistically obtained.
3. The method according to claim 2, characterized in that The step of adding the statistical information to the parsed file to obtain the repaired file comprises: Based on the number of chips under test and the number of test failures corresponding to each test item, generate a test item statistical field and add it to the parsing file; Based on the number of tested chips corresponding to each chip classification, a soft classification statistical field and a hard classification statistical field are generated and added to the parsing file; Based on the total number of the chips under test and the number of chips that pass the test, a batch statistics field is generated and added to the parsing file.
4. The method according to claim 1, characterized in that: The test data file is parsed to obtain a parsed file including: Mapping at least a portion of the test data file to a pre-acquired memory space; Based on the mapping, parsing at least a portion of the test data file to obtain a corresponding parsing result; Determine whether all the test data files have been mapped; In the case that all mappings are not completed, the above steps are repeated until all the test data files are parsed to obtain the parsed file.
5. The method according to claim 1, characterized in that Determining whether the parsed file is complete includes: Determining whether the first test data record of the parsed file meets the preset format requirements; Determine whether the last test data record of the parsed file is a batch end record; In the case where the first test data record meets the preset format requirement and the last test data record is a batch end record, determining that the parsed file is complete; When the first test data record meets the preset format requirement and the last test data record is not a batch end record, it is determined that the parsed file is incomplete.
6. The method according to claim 1, characterized in that The outputting the test result corresponding to the test data record based on the repair file includes: Based on the test data record, read the test parameter value of the chip under test, and the upper threshold value and the lower threshold value corresponding to the test parameter value; Based on the test parameter value, the upper threshold value and the lower threshold value, a process capability parameter value is calculated and obtained.
7. The method according to claim 1, characterized in that The outputting the test result corresponding to the test data record based on the repair file includes: Based on the test data record, reading the coordinates and test results of each chip under test on the wafer; A wafer map is obtained based on the coordinates of each tested chip and the test results.
8. The method according to claim 1, characterized in that After the statistical information is added to the parsed file to obtain the repaired file, the method further includes: Obtain the export content setting and export station number of the repair file; Based on the export content setting and the export station number, the corresponding content of the repair file is exported.
9. A test data file processing device, characterized in that: The device comprises: A parsing module, used for parsing the test data file to obtain a parsed file; A determination module, used to determine whether the parsed file is complete; An acquisition module, used for acquiring corresponding statistical information based on the test data records in the parsed file when the parsed file is incomplete, and supplementing the statistical information into the parsed file to obtain a repaired file; An output module is used to output the test result corresponding to the test data record based on the repair file.
10. A readable storage medium having a program stored thereon, characterized in that: When the program is executed by a processor, the steps of the method for processing a test data file according to any one of claims 1 to 8 are implemented.
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