Leveling method, electronic equipment and computer readable storage medium

By obtaining and fitting the plane spacing set, calculating and adjusting the angles of the carrier plate and the substrate, the problem of insufficient parallelism between the substrate and the carrier plate is solved, and the bonding quality and efficiency in the production process of Micro LED are improved.

CN119446248AActive Publication Date: 2025-02-14SHENZHEN HYMSON LASER INTELLIGENT EQUIP CO LTD
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Patent Information

Application Number
CN202411512681.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-28
Publication Date
2025-02-14
Estimated Expiration
2044-10-28

AI Technical Summary

Technical Problem

During the Micro LED production process, the parallelism between the substrate and the carrier plate is insufficient, resulting in the substrate and the carrier plate not being very fit, affecting subsequent bonding.

Method used

Provide a leveling method, by obtaining the set of plane spacings between the first plane and the second plane, and fitting the third plane according to the set of plane spacings, and calculating the pitch angle and heading angle of the third plane relative to the second plane and roll angles, and level the second plane according to these angles.

Benefits of technology

By increasing the parallelism between the carrier plate and the substrate, the two are more fit, thereby improving the quality and efficiency of subsequent bonding and reducing production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a leveling method, an electronic device and a computer readable storage medium, a plane spacing set between a first plane and a second plane is obtained, a third plane is fitted according to the plane spacing set, the third plane is a fitting surface of the second plane, and the higher the coincidence degree of the fitted third plane and the second plane is, the higher the coincidence degree of the second plane is. If the first plane and the second plane are parallel, the parallelism of the first plane and the second plane is better, the pitch angle P, the course angle Y and the roll angle R of the third plane relative to the first plane are calculated, the second plane is leveled according to the pitch angle P, the course angle Y and the roll angle R, the specific flatness can be measured according to the data, and accurate adjustment is facilitated.
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Description

Technical Field

[0001] The present invention relates to the field of wafer bonding, and in particular to a leveling method, electronic equipment, and a computer-readable storage medium. Background Art

[0002] In the production process of Micro LED, the traditional bonding method has a complex process and high production cost, which is not conducive to cost reduction and efficiency improvement of Micro LED. As an improvement, the laser mass bonding solution is the only choice. Laser bonding uses a high-precision alignment platform to accurately align the wafer on the carrier and the target substrate, and then fit the carrier and the target substrate together, and then use a light spot with excellent uniformity to perform laser bonding on the transferred Micro LED. It has the advantages of good bonding quality, high efficiency, and low cost. However, in the prior art, the parallelism between the substrate and the carrier is not enough, resulting in the substrate and the carrier not being very close, which affects the subsequent bonding. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a leveling method, an electronic device, and a computer-readable storage medium, which can improve the parallelism of a carrier plate and a substrate so that the two are more closely fitted.

[0004] The technical solution adopted by the present invention to solve the technical problem is: on the one hand, a leveling mechanism is provided, comprising:

[0005] Step 1, obtaining a plane distance set between a first plane and a second plane;

[0006] Step 2, fitting a third plane according to the plane spacing set, wherein the third plane is a fitting plane of the second plane;

[0007] Step 3, calculating the pitch angle P, heading angle Y and roll angle R of the third plane relative to the second plane;

[0008] Step 4: level the second plane according to the pitch angle P, heading angle Y and roll angle R.

[0009] As a further improvement of the above technical solution, in step 11, array scanning is performed on the first plane and the second plane by laser to collect first spatiotemporal data of each scanning point on the first plane and second spatiotemporal data of the second plane;

[0010] Step 12, calculating the distance between each scanning point on the first plane and the second plane according to the first spatiotemporal data and the second spatiotemporal data;

[0011] Step 13: Generate the plane spacing set according to the position arrangement of each scanning point.

[0012] As a further improvement of the above technical solution, the first spatiotemporal data and the second spatiotemporal data include time data and / or space data;

[0013] The time data refers to the time when the laser is projected at each scanning point and returns from the first plane / the second plane;

[0014] The spatial data refers to the distance of each scanning point relative to the laser reference position.

[0015] As a further improvement of the above technical solution, in step 11, the array scanning method is specifically:

[0016] The first plane and the second plane are scanned by moving at least three lasers arranged in a straight line and at equal intervals.

[0017] As a further improvement of the above technical solution, in step 11, the laser is a composite light including at least band a and band b;

[0018] The laser light of band a can be emitted by the carrier of the first plane, and the laser light of band b can penetrate the carrier of the first plane and be reflected by the carrier of the second plane.

[0019] As a further improvement of the above technical solution, in step 11, the array scanning of the first plane and the second plane by the laser is performed simultaneously.

[0020] As a further improvement of the above technical solution, in step 4, a six-axis hexapod displacement platform is used to level the second plane.

[0021] As a further improvement of the above technical solution, a data acquisition module is used to obtain a plane spacing set between the first plane and the second plane;

[0022] A data processing module, configured to fit the third plane according to the plane spacing set, wherein the third plane is a fitting plane of the second plane; and calculate a pitch angle P, a heading angle Y, and a roll angle R of the third plane relative to the first plane;

[0023] The leveling control module is used to level the second plane according to the pitch angle P, the heading angle Y, and the roll angle R.

[0024] An electronic device comprises a memory and a processor, wherein the memory stores a computer program, and the processor implements the above-mentioned leveling method when executing the computer program.

[0025] A computer-readable storage medium stores a computer program, and the computer program implements the above-mentioned leveling method when executed by a processor.

[0026] The beneficial effect of the present invention is as follows: by obtaining a plane spacing set between a first plane and a second plane, and fitting a third plane according to the plane spacing set, the third plane is a fitting plane of the second plane, the higher the coincidence degree between the fitted third plane and the second plane, the better the parallelism between the first plane and the second plane, the pitch angle P, heading angle Y and roll angle R of the third plane relative to the first plane are calculated, and the second plane is leveled according to the pitch angle P, heading angle Y and roll angle R, the specific flatness can be measured according to these data, and precise adjustment is convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0028] Figure 1 It is a schematic diagram of the operation of the leveling method provided by the preferred embodiment of the present invention. DETAILED DESCRIPTION

[0029] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technicians in this field without creative work belong to the scope of protection of the present invention. In addition, all the connection / connection relationships involved in the patent do not refer to the direct connection of components, but refer to the fact that a better connection structure can be formed by adding or reducing connection accessories according to the specific implementation situation. For example, fixed connection / fixed installation can be selected according to the needs of screw connection, bolt connection, pin connection, key connection, bonding, mortise and tenon connection, welding, riveting and other methods. For example, detachable connection can be selected according to the needs of screw connection, bolt connection, threaded connection, snap connection, mortise and tenon connection, Velcro connection and other methods. The various technical features in the invention can be combined interactively without conflicting with each other.

[0030] See also Figure 1 The embodiment of the present invention provides a leveling method for adjusting the parallelism between two planes, which at least includes the following steps:

[0031] Step 1, obtain the plane distance set between the first plane and the second plane:

[0032] First, the first plane and the second plane are moved so that the first plane and the second plane are in relative positions, and the inclination angles of the first plane and the second plane are preliminarily adjusted so that the first plane and the second plane are parallel.

[0033] Secondly, the first plane and the second plane are array-scanned by laser to collect the first spatiotemporal data of each scanning point on the first plane and the second spatiotemporal data of the second plane; the laser scanning method can achieve accurate data, which is conducive to ensuring accuracy. Specifically, the first spatiotemporal data and the second spatiotemporal data include time data and / or space data; time data refers to the time when the laser returns from the first plane / second plane when projected on each scanning point; space data refers to the distance of each scanning point relative to the laser reference position. The distance between the first plane and the second plane is calculated by the two dimensions of time data and space data to improve accuracy.

[0034] Then, the distances between each scanning point on the first plane and the second plane are calculated based on the first spatiotemporal data and the second spatiotemporal data; these distances reflect the parallelism between the two planes, and the smaller the difference between these distances, the better the parallelism between the two planes.

[0035] Finally, a plane spacing set is generated according to the position arrangement of each scanning point; the plane spacing set is represented by (i, j), where i represents the i-th row of the array scan; j represents the j-th column of the array scan. In this embodiment, i is 3, j is n, and the specific value of n is determined by the time interval of the array scan. The shorter the interval time, the larger the value of n. During laser scanning, three laser heads can be used for scanning at the same time, thereby obtaining a 3-row and j-column plane spacing set.

[0036] Step 2, fitting a third plane according to the plane spacing set, the third plane being a fitting plane of the second plane, and the third plane being fitted according to the plane spacing set by a computer software algorithm;

[0037] Step 3, calculate the pitch angle P, heading angle Y and roll angle R of the third plane relative to the second plane. The pitch angle P, heading angle Y and roll angle R reflect the deviation angle between the third plane and the second plane. If these three values ​​are all zero, it means that the third plane coincides with the second plane, that is, the parallelism of the first plane and the second plane at all locations is very high;

[0038] Step 4, level the second plane according to the pitch angle P, the heading angle Y and the roll angle R, and repeat the above steps 1-3 until the values ​​of the pitch angle P, the heading angle Y and the roll angle R in step 3 are zero.

[0039] In step 4 of the above embodiment, the six-axis hexapod is used to level the second plane. The six-axis hexapod can precisely adjust the inclination of the second plane, which is conducive to ensuring the accuracy of leveling the second plane. Specifically, in step 3, after the pitch angle P, heading angle Y and roll angle R of the third plane relative to the second plane are calculated by software, these values ​​are converted into pulse signals. After receiving the signal, the six-axis hexapod controls the movement of each axis to perform leveling.

[0040] In one embodiment, the array scanning method of step 1 is specifically: a combination of three straight lines of equally spaced lasers is used to move and scan the first plane and the second plane. One scan can obtain a set of plane spacings arranged in three rows of equally spaced rows, which is highly efficient. The laser is a composite light containing at least band a and band b; wherein the laser of band a can be emitted by the carrier of the first plane, and the laser of band b can penetrate the carrier of the first plane and be reflected by the carrier of the second plane. This is conducive to improving the accuracy of laser ranging. The array scanning of the laser on the first plane and the second plane is performed simultaneously, further improving the accuracy of laser ranging.

[0041] Among them, array scanning is performed through three laser rangefinders arranged side by side. The three laser rangefinders emit ranging lasers simultaneously, and emit ranging lasers simultaneously for multiple times at the same interval during the uniform movement. The laser rangefinder is light in weight, small in size, simple to operate, fast and accurate.

[0042] In another embodiment, the array scanning method of step 1 is specifically: a laser combination of more than three straight lines and equidistant arrangements is used to move and scan the first plane and the second plane. One scan can obtain a set of plane spacings of more than three rows and equidistant arrangements, and more spacing data at various locations of the first plane and the second plane can be obtained, which further facilitates the control of the flatness of the first plane and the second plane.

[0043] In other embodiments, the difference from the above embodiments lies in the number of array scans. Specifically, a plane spacing set is generated according to the position arrangement of each scanning point; wherein i represents the i-th row of the array scan; j represents the j-th column of the array scan. In this embodiment, i is greater than 3. During laser scanning, more than three laser rangefinders arranged side by side can perform scanning simultaneously to obtain a plane spacing set of i rows and j columns.

[0044] A leveling mechanism includes a data acquisition module for acquiring a set of plane spacings between a first plane and a second plane;

[0045] The data processing module is used to fit a third plane according to the plane spacing set, and the third plane is the fitting plane of the second plane; and at least calculate the pitch angle P of the third plane relative to the first plane, and the rolling angle R in the heading angle Y; the leveling control module is used to level the second plane according to one or more of the pitch angle P, the heading angle Y and the rolling angle R. The leveling mechanism can accurately adjust the parallelism of the first plane and the second plane.

[0046] An electronic device includes a memory and a processor. The memory stores a computer program. When the processor executes the computer program, the leveling method in the above embodiment is implemented.

[0047] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the leveling method according to the above embodiment is implemented.

[0048] The above is a specific description of the preferred implementation of the present invention, but the invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A leveling method for adjusting the parallelism between two planes, characterized in that: At least the following steps are included: Step 1, obtaining a plane distance set between a first plane and a second plane; Step 2, fitting a third plane according to the plane spacing set, wherein the third plane is a fitting plane of the second plane; Step 3, calculating the pitch angle P, heading angle Y and roll angle R of the third plane relative to the second plane; Step 4: level the second plane according to the pitch angle P, heading angle Y and roll angle R.

2. A leveling method according to claim 1, characterized in that: The step 1 at least includes: Step 11, performing array scanning on the first plane and the second plane by laser, collecting first spatiotemporal data of each scanning point on the first plane and second spatiotemporal data of the second plane; Step 12, calculating the distance between each scanning point on the first plane and the second plane according to the first spatiotemporal data and the second spatiotemporal data; Step 13: Generate the plane spacing set according to the position arrangement of each scanning point.

3. A leveling method as claimed in claim 2, characterized in that: The first spatiotemporal data and the second spatiotemporal data include time data and / or space data; The time data refers to the time when the laser is projected at each scanning point and returns from the first plane / the second plane; The spatial data refers to the distance of each scanning point relative to the laser reference position.

4. A leveling method as claimed in claim 2, characterized in that: In step 11, the array scanning method is specifically: The first plane and the second plane are scanned by moving at least three lasers arranged in a straight line and at equal intervals.

5. A leveling method as claimed in claim 2, characterized in that: In step 11, the laser is a composite light including at least band a and band b; The laser light of band a can be emitted by the carrier of the first plane, and the laser light of band b can penetrate the carrier of the first plane and be reflected by the carrier of the second plane.

6. A leveling method according to claim 1, characterized in that: In step 11, the array scanning of the first plane and the second plane by the laser is performed simultaneously.

7. A leveling method according to claim 1, characterized in that: In the step 4, the second plane is leveled using a six-axis hexapod.

8. A leveling mechanism according to claim 1, characterized in that: include: A data acquisition module, used to obtain a set of plane distances between the first plane and the second plane; A data processing module, configured to fit the third plane according to the plane spacing set, wherein the third plane is a fitting plane of the second plane; and calculate a pitch angle P, a heading angle Y, and a roll angle R of the third plane relative to the first plane; The leveling control module is used to level the second plane according to the pitch angle P, the heading angle Y, and the roll angle R.

9. An electronic device, characterized in that: The method comprises a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the leveling method according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the leveling method according to any one of claims 1 to 7 is implemented.

Citation Information

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