Infrared detector chip surface automatic cleaning tool clamp, method and device

Abstract

The invention relates to the technical field of infrared detector manufacturing processes, and discloses an infrared detector chip surface automatic cleaning tool clamp, which comprises a chip bearing disc, a chip cleaning device, a chip cleaning device, a chip cleaning device, a chip cleaning device and a chip cleaning device, and is characterized in that a chip groove is formed in the chip bearing disc; and the chip ceramic frame sheet is used for fixing the chip. By applying the clamp, a full-automatic detector chip cleaning process is provided by combining with automatic cleaning equipment, particles, residual glue and other redundant substances on the surface of the chip are removed through washing of acetone, megasonic water and ethyl alcohol in sequence by utilizing an adjustable chip containing tool clamp, the operation is simple, the time is saved, and the production efficiency is improved. And under the condition that the surface cleanliness of the cleaned detector chip is guaranteed, the loss of the detector chip is reduced, and meanwhile, the chip cleaning efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of infrared detector manufacturing process, and in particular to a fixture, method and device for automatically cleaning the surface of an infrared detector chip. Background Art

[0002] The infrared detector assembly consists of a detector chip, a micro-dewar and a cooler. The cleanliness of the detector chip surface has an important impact on the imaging of the assembly after packaging. The presence of excess materials such as residual glue or particles on the chip surface can easily cause diffraction in the optical path of the detector when it is in service, and change the local light field distribution on the focal plane, resulting in the formation of "black spots" or "Poisson bright spots" on the image plane. Therefore, the cleanliness of the detector chip surface plays a vital role in the imaging of the infrared detector assembly.

[0003] The detector chip is made of a Si readout circuit and an InSb photodiode array interconnected by In bump flip-chip, and finally a thin film is prepared on the surface of the InSb diode. The surface of the detector chip mainly consists of the peripheral silicon readout circuit and the middle detector film. At present, the cleaning of the detector chip is mainly done manually, using tweezers wrapped with cotton to gently wipe the surface of the chip soaked in the solvent. If the wiping force is too strong or the cotton is not wrapped properly, it is easy for the cotton fibers or particles to scratch the thin film on the detector surface, causing damage to the detector.

[0004] In view of this, how to provide an infrared detector chip cleaning solution to reduce the loss of the detector chip has become a technical problem that urgently needs to be solved. Summary of the invention

[0005] The embodiments of the present application provide an automatic cleaning fixture for the surface of an infrared detector chip, an automatic cleaning method for the surface of a detector chip, and an automatic cleaning device for the surface of a detector chip, which are used to solve the problem that the detector chip is easily scratched and has a large loss during the current cleaning process.

[0006] In a first aspect of an embodiment of the present application, there is provided a fixture for automatically cleaning the surface of an infrared detector chip, comprising:

[0007] A chip carrier plate is provided with at least one chip slot for placing a plurality of detector chips to be cleaned;

[0008] The chip ceramic frame plate is used to adjust the chip fixing method according to the different types of the detector chip to be cleaned, and fix the detector chip to be cleaned on the chip carrier plate.

[0009] Optionally, the chip slot is provided with at least one slot hole for discharging the solvent;

[0010] The chip ceramic frame is provided with at least one hole for discharging the solvent.

[0011] In a second aspect of an embodiment of the present application, a method for automatically cleaning the surface of a detector chip is provided, which is applied to an automatic cleaning device, and includes:

[0012] The pre-installed fixture is transported to the acetone cleaning chamber by a mechanical arm in the automatic cleaning equipment, and the chip carrier is rotated at a first speed for a first period of time to perform full acetone spray cleaning on the detector chip to be cleaned, so as to obtain a first chip with residual glue on the chip surface removed, wherein the fixture is a fixture for pre-placing the detector chip to be cleaned in the chip carrier and fixing the chip ceramic frame plate;

[0013] Rotate the chip carrier at a second speed for a second time period to dehydrate the surface of the first chip, wherein the second speed is greater than the first speed and the second time period is less than the first time period;

[0014] The tooling fixture with the first chip is transported to an ethanol cleaning chamber by the mechanical arm, and the chip carrier is rotated at a third speed for a second period of time to perform megasonic water cleaning on the first chip to obtain a second chip with particles removed from the chip surface, wherein the third speed is less than the first speed;

[0015] The chip carrier is rotated at a first speed for a first period of time, and the second chip is cleaned by spraying ethanol to obtain a third chip without any residue on the chip surface;

[0016] The chip carrier is rotated at a second speed for a second period of time to dehydrate the surface of the third chip to obtain a cleaned detector chip.

[0017] According to a third aspect of an embodiment of the present application, there is provided a detector chip surface automatic cleaning device, which is applied to an automatic cleaning device, and includes:

[0018] The acetone cleaning module is configured to transport the pre-installed fixture to the acetone cleaning chamber through the mechanical arm in the automatic cleaning equipment, rotate the chip carrier at a first speed for a first period of time, and perform full acetone spray cleaning on the detector chip to be cleaned to obtain a first chip with residual glue on the chip surface removed, wherein the fixture is a fixture for pre-placing the detector chip to be cleaned in the chip carrier and fixing the chip ceramic frame plate;

[0019] A first dehydration module is configured to rotate the chip carrier at a second speed for a second time period to dehydrate the surface of the first chip, wherein the second speed is greater than the first speed and the second time period is less than the first time period;

[0020] The megasonic water cleaning module is configured to transport the fixture with the first chip mounted thereon to the ethanol cleaning chamber through the mechanical arm, rotate the chip carrier at a third speed for a second period of time, and perform megasonic water cleaning on the first chip to obtain a second chip with particles removed from the chip surface, wherein the third speed is less than the first speed;

[0021] An ethanol cleaning module is configured to rotate the chip carrier at a first speed for a first period of time to perform ethanol spray cleaning on the second chip to obtain a third chip with no residue on the chip surface;

[0022] The second dehydration module is configured to rotate the chip carrier at a second speed for a second period of time to dehydrate the surface of the third chip to obtain a cleaned detector chip.

[0023] The present application provides an automatic cleaning fixture for the surface of an infrared detector chip, comprising: a chip carrier plate provided with a chip slot for placing the chip; and a chip ceramic frame plate for fixing the chip.

[0024] By applying the automatic cleaning fixture for the surface of the infrared detector chip provided in the embodiment of the present application and combining it with the automatic cleaning equipment, a fully automatic detector chip cleaning process is proposed. An adjustable chip holding fixture is used to remove particles, residual glue and other excess materials on the chip surface by washing with acetone, megasonic water and ethanol in sequence. The operation is simple and time-saving. While ensuring the cleanliness of the detector chip surface after cleaning, it not only reduces the loss of the detector chip, but also improves the chip cleaning efficiency.

[0025] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, which can be implemented in accordance with the contents of the specification, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0027] Figure 1 A schematic diagram of the structure of an automatic cleaning fixture for the surface of an infrared detector chip provided in an embodiment of the present application;

[0028] Figure 2 A cross-sectional schematic diagram of an automatic cleaning fixture for the surface of an infrared detector chip provided in an embodiment of the present application;

[0029] Figure 3 A schematic diagram of the structure of a chip ceramic frame piece in an automatic cleaning fixture for the surface of an infrared detector chip provided in an embodiment of the present application;

[0030] Figure 4 A schematic diagram of a flow chart of a method for automatically cleaning the surface of a detector chip provided in an embodiment of the present application;

[0031] Figure 5 A schematic diagram of an amplifier chip after the surface of a detector chip is automatically cleaned according to an embodiment of the present application;

[0032] Figure 6 A schematic structural diagram of an automatic cleaning device for the surface of a detector chip provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0034] In order to reduce the loss of detector chips, the embodiment of the present application proposes a fully automatic detector chip cleaning process in combination with automatic cleaning equipment. An adjustable chip holding fixture is used to sequentially rinse the chip with acetone, megasonic water and ethanol to remove particles, residual glue and other excess materials on the chip surface. The operation is simple and time-saving. While ensuring the cleanliness of the detector chip surface after cleaning, it not only reduces the loss of the detector chip, but also improves the chip cleaning efficiency.

[0035] See also Figure 1-Figure 2 , Figure 1 A schematic diagram of the structure of an automatic cleaning fixture for the surface of an infrared detector chip provided in an embodiment of the present application; Figure 2 A cross-sectional schematic diagram of an automatic cleaning fixture for the surface of an infrared detector chip provided in an embodiment of the present application.

[0036] like Figure 1 As shown, the automatic cleaning fixture for the surface of infrared detector chips includes: a chip carrier plate 1, which is provided with at least one chip slot for placing multiple detector chips to be cleaned; a chip ceramic frame plate 2, which is used to adjust the chip fixing method according to the different types of the detector chips to be cleaned, and fix the detector chips to be cleaned on the chip carrier plate. Figure 3 A schematic diagram of the structure of a chip ceramic frame piece in an automatic cleaning fixture for the surface of an infrared detector chip provided in an embodiment of the present application.

[0037] In addition, at least one slot hole is provided on the chip slot for discharging the solvent; and at least one hole is provided on the chip ceramic frame for discharging the solvent.

[0038] Specifically, the chip carrier plate 1 has 8 chip slots of the same size for placing chips, and a large number of holes are opened at the bottom of the chip slots for discharging solvents; the chip ceramic frame plate 2 is as follows Figure 3 As shown, it is used to hold the main chip and reduce the activity space of the chip in the carrier tray slot; its height is slightly higher than the chip. Figure 2 , which plays a certain role in protecting the chip; at the same time, a large number of holes are opened to discharge the solvent. The inner diameter size design of the ceramic frame of different types of chips can be found in Figure 4 Therefore, different chips can be cleaned by simply changing the structure of the ceramic frame.

[0039] See also Figure 4 , Figure 4 A schematic diagram of a flow chart of a method for automatically cleaning the surface of a detector chip provided in an embodiment of the present application. Figure 4 As shown, the specific steps include the following steps.

[0040] Step S402: transporting the pre-installed fixture to the acetone cleaning chamber by a mechanical arm in the automatic cleaning equipment, rotating the chip carrier at a first speed for a first period of time, and performing full acetone spray cleaning on the detector chip to be cleaned, so as to obtain a first chip with residual glue on the chip surface removed, wherein the fixture is a fixture for pre-placing the detector chip to be cleaned in the chip carrier and fixing the chip ceramic frame plate;

[0041] Step S404: rotating the chip carrier at a second speed for a second time period to dehydrate the surface of the first chip, wherein the second speed is greater than the first speed and the second time period is less than the first time period;

[0042] Step S406: transporting the fixture with the first chip mounted thereon to an ethanol cleaning chamber by the robotic arm, rotating the chip carrier at a third speed for a second period of time, performing megasonic water cleaning on the first chip to obtain a second chip with particles removed from the chip surface, wherein the third speed is less than the first speed;

[0043] Step S408: rotating the chip carrier at a first speed for a first period of time, spraying and cleaning the second chip with ethanol, to obtain a third chip with no residue on the chip surface;

[0044] Step S410: rotating the chip carrier at a second speed for a second period of time to dehydrate the surface of the third chip to obtain a cleaned detector chip.

[0045] In practical applications, the infrared detector chip, carrier plate and corresponding chip ceramic frame are first assembled. Figure 1 ; Then acetone spray cleaning: the assembled structure is placed in the automatic cleaning equipment, and through the transportation of the mechanical arm, it first enters the acetone cleaning chamber, and the full acetone spray cleaning of multiple chips is realized by the rotation of the carrier plate to remove the residual glue on the chip surface. The acetone spray time is 3 minutes, and the carrier plate rotation speed is 20r / min; secondly, acetone dehydration is performed: after the acetone spray is completed, the chip surface is dehydrated by the high-speed rotation of the carrier plate, the carrier plate rotation speed is 600r / min, and the dehydration time is 1min; then megasonic water cleaning is performed: after the acetone dehydration is completed, the mechanical arm puts the carrier plate with the chip into the ethanol cleaning chamber, and first megasonic water cleaning is performed, the carrier plate rotation speed is 10r / min, and the cleaning time is 1min. Megasonic water cleaning mainly removes tiny particles on the chip surface through ultra-high frequency vibration; then ethanol spray cleaning is performed: after the megasonic water cleaning is completed, ethanol spray cleaning is directly performed, the carrier plate rotation speed is 20r / min, and the spraying time is 3min. The purpose of ethanol spray cleaning is to remove acetone, water and other impurities remaining on the chip surface; finally, ethanol dehydration is performed: after the ethanol spray cleaning is completed, the chip surface is dehydrated by high-speed rotation of the carrier plate, the rotation speed of the carrier plate is 600r / min, and the dehydration time is 1min.

[0046] After the infrared detector chip 3 is removed from the test, it is automatically cleaned by acetone spray cleaning, acetone dehydration, megasonic water cleaning, ethanol spray cleaning, and ethanol dehydration. Figure 5 ,in, Figure 5 A schematic diagram of an amplified chip after automatic cleaning of the detector chip surface provided in an embodiment of the present application. The above-mentioned automatic cleaning solution for the infrared detector chip surface and its fixture can ensure the cleanliness of the chip cleaning, while improving the chip cleaning efficiency and reducing chip loss. The present invention is suitable for cleaning all types of chips in the infrared detector component package.

[0047] The scheme of the present invention is mainly realized by means of automatic cleaning equipment, a fixture, i.e., a detector chip (hereinafter referred to as chip) carrier plate, a chip ceramic frame plate and a solvent. The principle of automatic cleaning is to place the carrier plate with the chip into the automatic cleaning equipment, spray and clean the chip surface with a solvent, clean the chip surface with megasonic water to remove fine particles, and realize the full spray cleaning of multiple chips by rotating the carrier plate. The automatic cleaning process steps are as follows: place the chip on a carrier plate equipped with a ceramic frame plate of corresponding size, and then place the carrier plate into the automatic cleaning equipment, first spray and clean the chip with acetone solvent for 3 minutes to remove residual glue on the chip surface, then clean the chip with megasonic water for 1 minute to remove fine particles on the surface, and finally spray and clean the chip with ethanol solvent for 3 minutes to dehydrate. During the whole cleaning process, the rotation speed of the carrier plate during dehydration is 600r / min. Under high-speed rotation, the chip surface has been completely dried, and there is no need to blow the chip surface with solvent. The size of the slot in the chip carrier tray where the chip is placed does not need to be changed according to the size of the chip. The chip ceramic frame sheet used in conjunction with it needs to be designed and customized according to the size of the chip. The design method is simple and the production cost is low. This set of chip holding fixtures can not only realize the process of cleaning multiple chips at one time, but also ensure the safety performance of the chip under high-speed rotation (when the carrier tray is rotating, the chip has a large activity space, and due to the centrifugal force, the chip is easy to fly out of the carrier tray). The automatic cleaning process for the surface of the infrared detector chip ensures the cleanliness and safety of the chip surface, which is conducive to further improving the cleaning efficiency of the infrared detector chip.

[0048] The method for automatically cleaning the surface of the detector chip proposed in this application avoids the problem of scratching the detector when manually wiping the surface of the detector chip, and realizes the process requirements of cleaning multiple chips and multiple chips at one time. This solution can ensure the cleanliness of the surface of the detector chip and improve the cleaning efficiency of the infrared detector chip.

[0049] Specifically, it can realize the automatic cleaning of infrared detector chips, avoiding scratching the detector when manually wiping the chip surface with tweezers, causing chip loss. The detector chip cleaning solution realizes the full spray cleaning of multiple chips through the rotation of the carrier plate; through the adjustment of the chip ceramic frame plate, it can realize the cleaning of various chips. Fully automatic chip cleaning only requires one operator, and 8 chips can be cleaned at a time, which takes 9 minutes each time. Currently, two staff members are arranged online for manual chip cleaning, each of whom cleans 1 chip at a time, which takes 4-6 minutes each time. Compared with manual cleaning, the cleaning efficiency of the detector chip is increased by about 4 times. The residual glue on the surface of the detector chip is removed by spraying acetone solvent, the fine particles on the surface are removed by megasonic water treatment, and the surface water and other impurities are removed by spraying ethanol solvent, ensuring the cleanliness of the surface of the detector chip. The high-speed rotation dehydration of the carrier plate not only removes the residual solvent on the surface of the chip, but also makes the chip surface like the state of being blown dry by a nitrogen gun, and there is no watermark at the same time. (Manual cleaning sometimes causes watermarks on the chip surface, requiring rework.) Since the size of infrared detector chips is generally small, the function of the chip ceramic frame is to reduce the activity space of the chip on the carrier plate and prevent the chip from flying off during the high-speed rotation of the carrier plate.

[0050] Corresponding to the above method embodiment, this specification also provides an embodiment of a warehouse material storage location optimization device, Figure 6 This is a schematic diagram of the structure of an automatic cleaning device for the surface of a detector chip provided in an embodiment of the present application. Figure 6 As shown, the device comprises:

[0051] The acetone cleaning module 602 is configured to transport the pre-installed fixture to the acetone cleaning chamber through the robot arm in the automatic cleaning equipment, rotate the chip carrier at a first speed for a first period of time, and perform full acetone spray cleaning on the detector chip to be cleaned to obtain a first chip with residual glue on the chip surface removed, wherein the fixture is a fixture for pre-placing the detector chip to be cleaned in the chip carrier and fixing the chip ceramic frame plate;

[0052] A first dehydration module 604 is configured to rotate the chip carrier at a second speed for a second time period to dehydrate the surface of the first chip, wherein the second speed is greater than the first speed and the second time period is less than the first time period;

[0053] The megasonic water cleaning module 606 is configured to transport the fixture with the first chip mounted thereon to the ethanol cleaning chamber through the mechanical arm, rotate the chip carrier at a third speed for a second period of time, and perform megasonic water cleaning on the first chip to obtain a second chip with particles removed from the chip surface, wherein the third speed is less than the first speed;

[0054] The ethanol cleaning module 608 is configured to rotate the chip carrier at a first speed for a first period of time to perform ethanol spray cleaning on the second chip to obtain a third chip with no residue on the chip surface;

[0055] The second dehydration module 610 is configured to rotate the chip carrier at a second speed for a second period of time to dehydrate the surface of the third chip to obtain a cleaned detector chip.

[0056] The device for automatically cleaning the surface of the detector chip proposed in this application avoids the problem of scratching the detector when manually wiping the surface of the detector chip, and realizes the process requirements of cleaning multiple chips at one time and cleaning multiple chips at one time. This solution can ensure the cleanliness of the surface of the detector chip and improve the cleaning efficiency of the infrared detector chip.

[0057] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the warehouse material cargo location optimization device, since it is basically similar to the warehouse material cargo location optimization method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the warehouse material cargo location optimization method embodiment.

[0058] It should be noted that the above is a description of a specific embodiment of the present specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the embodiments of the present specification.

[0059] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0060] The preferred embodiments of this specification disclosed above are only used to help explain this specification. The optional embodiments do not describe all the details in detail, nor do they limit the invention to only the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of the embodiments of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the embodiments of this specification, so that technicians in the relevant technical field can well understand and use this specification. This specification is only limited by the claims and their full scope and equivalents.

Claims

1. An automatic cleaning fixture for the surface of an infrared detector chip, characterized in that: include: A chip carrier plate is provided with at least one chip slot for placing a plurality of detector chips to be cleaned; The chip ceramic frame plate is used to adjust the chip fixing method according to the different types of the detector chip to be cleaned, and fix the detector chip to be cleaned on the chip carrier plate.

2. The automatic cleaning fixture for the surface of an infrared detector chip according to claim 1, characterized in that: The chip slot is provided with at least one slot hole for discharging the solvent; The chip ceramic frame is provided with at least one hole for discharging the solvent.

3. A method for automatically cleaning the surface of a detector chip according to any one of claims 1 to 2, characterized in that: Applied to automatic cleaning equipment, including: The pre-installed fixture is transported to the acetone cleaning chamber by a mechanical arm in the automatic cleaning equipment, and the chip carrier is rotated at a first speed for a first period of time to perform full acetone spray cleaning on the detector chip to be cleaned, so as to obtain a first chip with residual glue on the chip surface removed, wherein the fixture is a fixture for pre-placing the detector chip to be cleaned in the chip carrier and fixing the chip ceramic frame plate; Rotate the chip carrier at a second speed for a second time period to dehydrate the surface of the first chip, wherein the second speed is greater than the first speed and the second time period is less than the first time period; The tooling fixture with the first chip is transported to an ethanol cleaning chamber by the mechanical arm, and the chip carrier is rotated at a third speed for a second period of time to perform megasonic water cleaning on the first chip to obtain a second chip with particles removed from the chip surface, wherein the third speed is less than the first speed; The chip carrier is rotated at a first speed for a first period of time, and the second chip is cleaned by spraying ethanol to obtain a third chip without any residue on the chip surface; The chip carrier is rotated at a second speed for a second period of time to dehydrate the surface of the third chip to obtain a cleaned detector chip.

4. An automatic cleaning device for the surface of a detector chip according to any one of claims 1 to 2, characterized in that: Applied to automatic cleaning equipment, including: The acetone cleaning module is configured to transport the pre-installed fixture to the acetone cleaning chamber through the mechanical arm in the automatic cleaning equipment, rotate the chip carrier at a first speed for a first period of time, and perform full acetone spray cleaning on the detector chip to be cleaned to obtain a first chip with residual glue on the chip surface removed, wherein the fixture is a fixture for pre-placing the detector chip to be cleaned in the chip carrier and fixing the chip ceramic frame plate; A first dehydration module is configured to rotate the chip carrier at a second speed for a second time period to dehydrate the surface of the first chip, wherein the second speed is greater than the first speed and the second time period is less than the first time period; The megasonic water cleaning module is configured to transport the fixture with the first chip mounted thereon to the ethanol cleaning chamber through the mechanical arm, rotate the chip carrier at a third speed for a second period of time, and perform megasonic water cleaning on the first chip to obtain a second chip with particles removed from the chip surface, wherein the third speed is less than the first speed; An ethanol cleaning module is configured to rotate the chip carrier at a first speed for a first period of time to perform ethanol spray cleaning on the second chip to obtain a third chip with no residue on the chip surface; The second dehydration module is configured to rotate the chip carrier at a second speed for a second period of time to dehydrate the surface of the third chip to obtain a cleaned detector chip.

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