Lifting equipment for preventing chemical deposition and semiconductor equipment
By installing a heating mechanism on the outer wall of the sealed tube of the semiconductor vacuum equipment, the problem of chemical gases forming deposits when cold in the sealed tube is solved, and the cleanliness and equipment utilization rate in the reaction chamber are improved.
Patent Information
- Application Number
- CN202411531754.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-30
- Publication Date
- 2025-02-14
Smart Images
Figure CN119446993A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a lifting device and semiconductor equipment for preventing chemical deposition. Background Art
[0002] In semiconductor vacuum equipment, in order to guide the chemical gas inside the reaction chamber to the surface of the wafer and to facilitate the robot to pick up and place the wafer, a liftable partition is set in the reaction chamber. Specifically, the partition is connected to a lifting mechanism located outside the reaction chamber, and the lifting mechanism is used to drive the partition to move up and down in the reaction chamber.
[0003] At present, in order to ensure the sealing of the joint between the lifting mechanism and the reaction chamber, a bellows is used for dynamic sealing to isolate the reaction chamber from the atmosphere. However, since the bellows is external and the room temperature of the bellows is 23 degrees Celsius, the temperature of the bellows is also around 23 degrees Celsius. When the reaction chamber is working, there is chemical gas, which will enter the vacuum side space of the bellows. When the chemical gas contacts the bellows below 100°C, chemical crystal deposits will appear on the inner wall of the bellows and adsorb to the inner wall of the bellows. Chemical crystal deposits will cause the cleanliness in the reaction chamber to deteriorate, which will affect the normal operation of the machine. At the same time, because of the deposits, the machine needs to be shut down regularly for manual cleaning, which reduces the utilization rate of the machine. Summary of the invention
[0004] The purpose of the present invention is to provide a lifting device and semiconductor device for preventing chemical deposition, which can maintain the cleanliness of the reaction chamber, avoid contamination of the reaction chamber, and improve the utilization rate of the equipment.
[0005] To achieve the above objectives, in a first aspect, the present invention provides a lifting device for preventing chemical deposition, comprising: A base, used for connecting to the reaction chamber; A lifting mechanism is arranged on the base, and the lifting mechanism includes a lifting rod, the top of which can extend into the reaction chamber, and is used to drive the partition located in the reaction chamber to move up and down; A sealing tube, the length of which can be adjusted along its axial direction, the sealing tube is sleeved on the lifting rod, the sealing tube has a first connecting end and a second connecting end, the first connecting end is used to be sealed and connected to the reaction chamber, and the second connecting end is sealed and connected to the bottom of the lifting rod; The heating mechanism is connected with the lifting mechanism and is sleeved on the sealing tube for heating the sealing tube. The beneficial effect of the lifting device for preventing chemical deposition provided by the present invention is that the heating mechanism sleeved on the outer wall of the sealing tube can heat the sealing tube to ensure that the temperature of the sealing tube is maintained within the required temperature range, and ensure that the lifting mechanism drives the partition in the reaction chamber to rise and fall while avoiding the chemical gas in the reaction chamber from contacting the inner wall of the sealing tube and forming chemical crystal deposits when it is cooled, thereby maintaining the cleanliness of the reaction chamber, avoiding contamination in the reaction chamber, and improving the utilization rate of the equipment.
[0006] In some embodiments, the heating mechanism comprises a heater; The heater is connected to the lifting mechanism, and has a heating chamber, which is sleeved on the sealing tube and used to heat the sealing tube. The beneficial effect is that the heating chamber is sleeved on the sealing tube to ensure uniform heating of the sealing tube.
[0007] In some embodiments, the heating mechanism further comprises a thermally conductive sleeve; The heat-conducting sleeve is located in the heating chamber and connected to the first connecting end, and is sleeved on the sealing tube, and there is a gap between the heat-conducting sleeve, the sealing tube and the heating chamber. The beneficial effect is that by arranging the heat-conducting sleeve in the heating chamber, the sealing tube is separated from the heating chamber while ensuring heat conduction to the sealing tube, so as to avoid the sealing tube from contacting the heating chamber during the length adjustment process.
[0008] In some embodiments, the lifting mechanism further includes a driver, a sliding assembly, and a connecting seat; The driver is connected to the base; The sliding assembly is connected to the driver, and the driver is used to drive the sliding assembly to move; The connecting seat and the heater are both connected to the sliding assembly, and the connecting seat is located in the heating chamber; The bottom of the lifting rod is connected to the connecting seat.
[0009] In some embodiments, the sliding assembly includes a linear guide and a connector; The linear guide rail is arranged on the base, and the extension direction of the linear guide rail is parallel to the extension direction of the lifting rod; The connecting member is arranged on the slider of the linear guide rail; The driving end of the driver is connected to the connecting member, and is used to drive the connecting member to move axially along the linear guide rail; The connecting seat and the heater are both arranged on the connecting piece.
[0010] In some embodiments, the lifting mechanism further includes a first stopper and a second stopper; The first limiting member and the second limiting member are arranged on the base at intervals along the extension direction of the linear guide rail; A limit block is provided on the side wall of the connecting member. The limit block is located between the first limit member and the second limit member and is used to limit the lifting distance of the driver.
[0011] In some embodiments, the lifting mechanism further includes a first limit sensor and a second limit sensor electrically connected to the driver; The first limit sensor and the second limit sensor are arranged on the base at intervals along the extension direction of the linear guide rail; The side wall of the connecting member is further provided with a sensing block, and the sensing block is located between the first limit sensor and the second limit sensor; When the first limit sensor detects the sensing block, the driver stops the upward movement, and when the second limit sensor detects the sensing block, the driver stops the downward movement.
[0012] In some embodiments, the driver includes a servo motor, a coupling, a ball screw, and a bearing seat; The servo motor is arranged at the bottom of the base, and the servo motor has a rotating end; The ball screw is connected to the rotating end through the coupling; The connecting piece is connected to the nut on the ball screw; The bearing seat is arranged on the base and sleeved with the screw of the ball screw.
[0013] In some embodiments, the lifting device further comprises a sealing ring; A sealing groove is provided on the first connecting end, and the sealing groove is in a circular shape; The sealing ring is arranged in the sealing groove and is used for sealing the connection area between the first connection end and the reaction chamber.
[0014] In a second aspect, an embodiment of the present invention provides a semiconductor device, including a reaction chamber, a base, a partition, and the lifting device; A through hole is provided at the bottom of the reaction chamber, and the through hole conducts the reaction chamber; The base is arranged in the reaction chamber and is used to carry the wafer; The lifting device is arranged at the bottom of the reaction chamber, and the lifting rod on the lifting device extends into the reaction chamber through the through hole and is connected to the partition in the reaction chamber to drive the partition to rise and fall.
[0015] The beneficial effect of the semiconductor equipment provided by the present invention is that by adopting the lifting device provided by the present invention to drive the partition in the reaction chamber to rise and fall, it is avoided that the chemical gas in the reaction chamber contacts the inner wall of the sealing tube and forms chemical crystal deposits when it is cooled, thereby maintaining the cleanliness of the reaction chamber, avoiding contamination of the reaction chamber, and improving the utilization rate of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A schematic diagram of the structure of a lifting device for preventing chemical deposition provided by an embodiment of the present invention installed on a reaction chamber; Figure 2 for Figure 1 Sectional view at AA in the middle; Figure 3 for Figure 2 The enlarged view of point B in the middle; Figure 4 An exploded view of a partial area of a lifting device for preventing chemical deposition according to an embodiment of the present invention.
[0017] Reference numerals: Base 1, lifting mechanism 2, lifting rod 21, driver 22, servo motor 221, coupling 222, ball screw 223, bearing seat 224, sliding assembly 23, linear guide rail 231, connecting piece 232, limit block 2321, connecting seat 24, first limit piece 25, second limit piece 26, first limit sensor 27, second limit sensor 28, sealing tube 3, first connecting end 31, second connecting end 32, heating mechanism 4, heater 41, heating chamber 411, heat conductive sleeve 42, sealing ring 5, reaction chamber 6, base 7, partition 8. DETAILED DESCRIPTION
[0018] In order to make the purpose, technical scheme and advantages of the present invention clearer, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meanings understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Unless otherwise specified, the "connection" described in this article can be a direct connection or an indirect connection, that is, connected through an intermediate.
[0019] In view of the problems existing in the prior art, an embodiment of the present invention provides a lifting device to prevent chemical deposition, referring to Figures 1 to 4As shown, the lifting device includes a base 1, a lifting mechanism 2, a sealing tube 3 and a heating mechanism 4. The base 1 is used to be fixedly connected to the bottom of the reaction chamber 6, and the reaction chamber 6 is a vacuum reaction chamber for providing chemical gas to react and process the surface of the wafer. The lifting mechanism 2 is arranged on the base 1, and the lifting mechanism 2 includes a lifting rod 21 that can be lifted and lowered. The top of the lifting rod 21 can extend into the reaction chamber 6, and is used to drive the partition 8 located in the reaction chamber 6 to lift and lower. The sealing tube 3 can adjust its length along its axial direction. The sealing tube 3 is sleeved on the lifting rod 21. The sealing tube 3 has a first connecting end 31 and a second connecting end 32. The first connecting end 31 is sealed and connected to the bottom of the reaction chamber 6, and the second connecting end 32 is sealed and connected to the bottom of the lifting rod 21 to ensure the sealing in the reaction chamber 6. The heating mechanism 4 is connected to the lifting mechanism 2 and sleeved on the sealing tube 3, and is used to heat the sealing tube 3.
[0020] In this embodiment, the sealing tube 3 can be prepared by a bellows, and both ends of the bellows are provided with connecting plates, and the two connecting plates are connected to the bellows to form the first connecting end 31 and the second connecting end 32 respectively. In addition, by arranging the heating mechanism 4 on the outer wall of the sealing tube 3, the heating mechanism 4 can heat the sealing tube 3, so that the temperature of the sealing tube 3 is kept within the required temperature range, ensuring that the lifting mechanism 2 can drive the partition 8 in the reaction chamber 6 to rise and fall, while avoiding the chemical gas in the reaction chamber 6 from contacting the inner wall of the sealing tube 3 to form chemical crystal deposits when being cooled, thereby maintaining the cleanliness of the reaction chamber 6, avoiding contamination in the reaction chamber 6, and improving the utilization rate of the equipment.
[0021] Further, refer to Figure 3 As shown, a sealing groove is provided on the first connecting end 31, and the sealing groove is specifically located on the upper connecting plate. The sealing groove is in a circular ring shape, and a sealing ring 5 is provided in the sealing groove for sealing the connecting area between the first connecting end 31 and the reaction chamber 6 to ensure the sealing of the reaction chamber 6.
[0022] In this embodiment, the sealing ring is made of a rubber material with a certain heat resistance.
[0023] refer to Figures 1 to 4 As shown, in some embodiments, the heating mechanism 4 includes a heater 41 , the heater 41 is connected to the lifting mechanism 2 , the heater 41 has a heating chamber 411 , and the heating chamber 411 is sleeved on the sealing tube 3 for heating the sealing tube 3 .
[0024] In this embodiment, a heating wire is arranged in the heater 41 around the heating cavity 411, and the heating wire conducts electricity to heat the temperature in the heating cavity 411. It can be understood that by adopting the method of sleeve-arranging the heating cavity 411 on the sealing tube 3, the uniformity of heating the sealing tube 3 is ensured, and the expansion and contraction of the sealing tube 3 is not affected.
[0025] In some embodiments, the heating mechanism 4 further includes a heat-conducting sleeve 42 , which is located in the heating chamber 411 and connected to the first connecting end 31 , and is sleeved on the sealing tube 3 , and there is a gap between the heat-conducting sleeve 42 and the sealing tube 3 and the heating chamber 411 .
[0026] In this embodiment, the heat-conducting sleeve 42 is a sleeve structure made of metal material. By arranging the heat-conducting sleeve 42 in the heating chamber 411, uniform heat conduction to the sealing tube 3 is ensured, and the sealing tube 3 can be separated from the heating chamber 411 to avoid the sealing tube 3 from contacting the heating chamber 411 during the telescopic adjustment process, thereby affecting the telescopicity of the sealing tube 3.
[0027] In some embodiments, the lifting mechanism 2 further includes a driver 22, a sliding assembly 23 and a connecting seat 24. The driver 22 is located below the base 1 and is fixedly connected to the base 1, the sliding assembly 23 is disposed on the base 1 and is connected to the driver 22, and the driver 22 can drive the sliding assembly 23 to move up and down. The connecting seat 24 and the heater 41 are both disposed on the sliding assembly 23 and can move up and down with the sliding assembly 23, and the connecting seat 24 is located in the heating chamber 411, and the bottom of the lifting rod 21 is connected to the connecting seat 24.
[0028] In this embodiment, the driver 22 is used to provide power to drive the sliding assembly 23 to perform lifting motion. The connecting seat 24 is a frame-type structure, which is located in the heating chamber 411 and is used to support the lifting rod 21. It can be understood that the connecting seat 24 also plays a role of increasing the height, so that when the lifting rod 21 is lifted, the sealing tube 3 is always located in the heating chamber 411, ensuring the heating effect of the heating chamber 411 on the sealing tube 3.
[0029] In some embodiments, the sliding assembly 23 includes a linear guide rail 231 and a connecting member 232. The linear guide rail 231 is vertically arranged on the base 1, and the extension direction of the linear guide rail 231 is parallel to the extension direction of the lifting rod 21. The connecting member 232 is arranged on the slider of the linear guide rail 231, and the driving end of the driver 22 is connected to the connecting member 232 to drive the connecting member 232 to move axially along the linear guide rail 231. The connecting seat 24 and the heater 41 are both arranged on the connecting member 232.
[0030] In this embodiment, the connecting member 232 is a push slider, and the part of the push slider is fixedly connected to the slider of the linear guide 231. The side wall of the push slider extends a connection portion in the direction of the lifting rod 21, which is used to fix the connection seat 24 and the heater 41. The driving end of the driving mechanism is connected to the push slider. When the driving mechanism moves, the driving end can push the push slider to move along the axial direction of the linear guide 231. During the movement of the push slider, the heater 41, the connection seat 24 and the lifting rod 21 are driven to move, and finally the partition 8 in the reaction chamber 6 is driven to move. It can be understood that since the first connection end 31 of the sealing tube 3 is fixedly connected to the reaction chamber 6, and the second connection end 32 of the sealing tube 3 is fixedly connected to the bottom of the lifting rod 21, the sealing tube 3 will be compressed or stretched during the lifting and lowering movement of the lifting rod 21, thereby ensuring the sealing of the reaction chamber 6.
[0031] In some embodiments, the lifting mechanism 2 further includes a first limiter 25 and a second limiter 26, which are arranged on a side wall of the base 1 at intervals along the extension direction of the linear guide rail 231. A limit block 2321 is provided on the side wall of the connecting member 232, and the limit block 2321 is located between the first limiter 25 and the second limiter 26, and is used to limit the lifting distance of the driver 22.
[0032] In this embodiment, the first limiting member 25 and the second limiting member 26 are both detachably arranged on a side wall of the base 1 by bolts. When the driver 22 rises, the limiting block 2321 on the connecting member 232 can be driven to rise until it abuts against the first limiting member 25, thereby limiting the connecting member 232 when it rises. When the driver 22 descends, the limiting block 2321 on the connecting member 232 descends and abuts against the second limiting member 26, thereby limiting the connecting member 232 when it descends. In addition, it should be noted that the limiting block 2321 is also detachably arranged on the connecting member 232 by bolts, which is convenient for installation and disassembly of the equipment.
[0033] In some embodiments, the lifting mechanism 2 further includes a first limit sensor 27 and a second limit sensor 28 electrically connected to the driver 22. The first limit sensor 27 and the second limit sensor 28 are arranged on the base 1 at intervals along the extension direction of the linear guide rail 231, and a sensing block is further provided on the side wall of the connecting member 232, and the sensing block is located between the first limit sensor 27 and the second limit sensor 28. When the first limit sensor 27 detects the sensing block, the driver 22 stops the upward movement, and when the second limit sensor 28 detects the sensing block, the driver 22 stops the downward movement.
[0034] In this embodiment, by providing the first limit sensor 27 and the second limit sensor 28 on the base 1, the movement range of the driver 22 is further controlled to ensure the accuracy of distance control when the driver 22 performs lifting and lowering movements.
[0035] In some specific embodiments, the driver 22 includes a servo motor 221, a coupling 222, a ball screw 223 and a bearing seat 224. The base 1 is in an "L"-shaped structure, and the servo motor 221 is detachably arranged at the bottom of the base 1. The servo motor 221 has a rotating end, and the rotating end extends toward the top of the base 1. The ball screw 223 is connected to the rotating end through the coupling 222. The connecting member 232 is connected to the nut on the ball screw so that when the rotating end rotates, the connecting member 232 can be driven to move. The bearing seat 224 is arranged on the base 1, and the screw of the ball screw is sleeved. By arranging the bearing seat 224 on the base 1, the stability of the ball screw during rotation is ensured.
[0036] In some embodiments, the driver 22 may also be a telescopic cylinder, which is detachably arranged at the bottom of the base 1, and the telescopic end of the telescopic cylinder is connected to the connecting member 232 to drive the connecting member 232 to perform lifting and lowering movements.
[0037] In another embodiment of the present invention, a semiconductor device is provided, referring to Figure 1 and Figure 2As shown, the semiconductor device includes a reaction chamber 6, a base 7, a partition 8 and the lifting device. A through hole is opened at the bottom of the reaction chamber 6, and the through hole connects the inside of the reaction chamber 6 with the outside. The base 7 is arranged in the reaction chamber 6 for carrying the wafer. The lifting device is arranged at the bottom of the reaction chamber 6, and the lifting rod 21 on the lifting device extends into the reaction chamber 6 through the through hole, and is connected to the partition 8 in the reaction chamber 6, so as to drive the partition 8 to rise and fall.
[0038] In this embodiment, the partition 8 in the reaction chamber 6 is used to guide the chemical gas to the surface of the wafer, and in order to facilitate the robot to take and place the wafer, the lifting device provided in this embodiment is connected to the partition 8. The lifting device can drive the partition 8 to move to a suitable position, thereby facilitating the robot to take and place the wafer.
[0039] More importantly, since the lifting device in this embodiment is provided with the heating mechanism 4 on the outer wall of the sealed tube 3, the heating mechanism 4 can heat the sealed tube 3 to keep the temperature of the sealed tube 3 within the required temperature range, ensuring that the lifting mechanism 2 can drive the partition 8 in the reaction chamber 6 to rise and fall while avoiding the chemical gas in the reaction chamber 6 from contacting the inner wall of the sealed tube 3 and forming chemical crystal deposits when it is cooled, thereby maintaining the cleanliness of the reaction chamber 6, avoiding contamination in the reaction chamber 6, and improving the utilization rate of the equipment.
[0040] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.
Claims
1. A lifting device for preventing chemical deposition, characterized in that: include: A base, used for connecting to the reaction chamber; A lifting mechanism is arranged on the base, and the lifting mechanism includes a lifting rod, the top of which can extend into the reaction chamber, and is used to drive the partition located in the reaction chamber to move up and down; A sealing tube, the length of which can be adjusted along its axial direction, the sealing tube is sleeved on the lifting rod, the sealing tube has a first connecting end and a second connecting end, the first connecting end is used to be sealed and connected to the reaction chamber, and the second connecting end is sealed and connected to the bottom of the lifting rod; The heating mechanism is connected with the lifting mechanism and is sleeved on the sealing tube for heating the sealing tube.
2. The lifting device according to claim 1, characterized in that: The heating mechanism comprises a heater; The heater is connected to the lifting mechanism, and the heater has a heating chamber, which is sleeved on the sealing tube and is used for heating the sealing tube.
3. The lifting device according to claim 2, characterized in that: The heating mechanism also includes a heat-conducting sleeve; The heat-conducting sleeve is located in the heating chamber and connected to the first connecting end, and is sleeved on the sealing tube. There is a gap between the heat-conducting sleeve, the sealing tube and the heating chamber.
4. The lifting device according to claim 2 or 3, characterized in that: The lifting mechanism also includes a driver, a sliding assembly and a connecting seat; The driver is connected to the base; The sliding assembly is connected to the driver, and the driver is used to drive the sliding assembly to move; The connecting seat and the heater are both connected to the sliding assembly, and the connecting seat is located in the heating chamber; The bottom of the lifting rod is connected to the connecting seat.
5. The lifting device according to claim 4, characterized in that: The sliding assembly includes a linear guide rail and a connecting piece; The linear guide rail is arranged on the base, and the extension direction of the linear guide rail is parallel to the extension direction of the lifting rod; The connecting member is arranged on the slider of the linear guide rail; The driving end of the driver is connected to the connecting member, and is used to drive the connecting member to move axially along the linear guide rail; The connecting seat and the heater are both arranged on the connecting piece.
6. The lifting device according to claim 5, characterized in that: The lifting mechanism further includes a first limiting member and a second limiting member; The first limiting member and the second limiting member are arranged on the base at intervals along the extension direction of the linear guide rail; A limit block is provided on the side wall of the connecting member. The limit block is located between the first limit member and the second limit member and is used to limit the lifting distance of the driver.
7. The lifting device according to claim 5, characterized in that: The lifting mechanism further includes a first limit sensor and a second limit sensor electrically connected to the driver; The first limit sensor and the second limit sensor are arranged on the base at intervals along the extension direction of the linear guide rail; The side wall of the connecting member is further provided with a sensing block, and the sensing block is located between the first limit sensor and the second limit sensor; When the first limit sensor detects the sensing block, the driver stops the upward movement, and when the second limit sensor detects the sensing block, the driver stops the downward movement.
8. The lifting device according to claim 5, characterized in that: The driver comprises a servo motor, a coupling, a ball screw and a bearing seat; The servo motor is arranged at the bottom of the base, and the servo motor has a rotating end; The ball screw is connected to the rotating end through the coupling; The connecting piece is connected to the nut on the ball screw; The bearing seat is arranged on the base and sleeved with the screw of the ball screw.
9. The lifting device according to claim 1, characterized in that: Also includes a sealing ring; A sealing groove is provided on the first connecting end, and the sealing groove is in a circular shape; The sealing ring is arranged in the sealing groove and is used for sealing the connection area between the first connection end and the reaction chamber.
10. A semiconductor device, characterized in that: It comprises a reaction chamber, a base, a partition and a lifting device according to any one of claims 1 to 9; A through hole is provided at the bottom of the reaction chamber, and the through hole conducts the reaction chamber; The base is arranged in the reaction chamber and is used to carry the wafer; The lifting device is arranged at the bottom of the reaction chamber, and the lifting rod on the lifting device extends into the reaction chamber through the through hole and is connected to the partition in the reaction chamber to drive the partition to rise and fall.