Clamping device capable of detecting wafer state

Abstract

The invention provides a clamping device capable of detecting a wafer state. The clamping device comprises a disc body, a clamping piece and a detection mechanism, the clamping pieces are movably arranged on the disc body, each clamping piece is provided with an induction part, the positions of the induction parts can be changed according to the movement of the clamping pieces, and the multiple clamping pieces are arranged on the edge of the disc body at intervals and used for clamping and fixing a wafer; and the detection mechanism is arranged close to the disc body and is used for detecting the sensing part and judging the state of the wafer according to the detected sensing part. The clamping device provided by the invention can detect whether the wafer is in a damaged state, a clamped state and an opened state or not, the diversity of wafer state detection is improved, and the accuracy of wafer detection is improved by arranging the detection mechanism to directly detect the sensing part on the clamping piece.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a clamping device capable of detecting a wafer state. Background Art

[0002] The semiconductor manufacturing process includes many processes such as photolithography, ion implantation, and etching. After the relevant processes, the surface of the wafer needs to be cleaned. Wafer cleaning generally involves fixing the wafer in a cleaning chamber and spraying a cleaning agent onto the surface of the wafer through a nozzle while the wafer rotates to remove impurities on the surface of the wafer.

[0003] After the wafer is cleaned, it is usually taken by a robot and transferred to the next process. In this process, the existing technology can only detect whether the wafer is intact, that is, whether the wafer is damaged. Specifically, a detection sensor is installed on the equipment. The signal emitted by the detection sensor is received after being reflected by the wafer. The equipment determines whether the wafer is damaged by whether it can receive the reflected signal. However, it is impossible to determine whether the wafer is in a clamped state. If the wafer is actually in a clamped state when the robot takes the wafer, or if the wafer is actually in an open state when the machine is working, it is easy to cause damage to the wafer, affecting processing efficiency and increasing production costs. Summary of the invention

[0004] The object of the present invention is to provide a clamping device capable of detecting the state of a wafer, which can detect and determine whether the wafer state is a damaged state, a clamped state or an open state, thereby improving the diversity and accuracy of wafer detection and improving processing efficiency.

[0005] To achieve the above-mentioned object, in a first aspect, the present invention provides a clamping device capable of detecting the state of a wafer, comprising a disc body, a clamping member, and a detection mechanism;

[0006] The clamping member is movably arranged on the plate body, and the clamping member has a sensing part, and the sensing part can change position according to the movement of the clamping member, and a plurality of the clamping members are arranged at intervals on the edge of the plate body for clamping and fixing the wafer;

[0007] The detection mechanism is arranged close to the disk body, and is used to detect the sensing part and judge the state of the wafer according to the detected sensing part.

[0008] In some embodiments, the sensing portion includes a first sensing point and a second sensing point that are spaced apart;

[0009] When the clamping member rotates so that the first sensing point and the second sensing point are outside the detection range of the detection mechanism, it is determined that the wafer is in a clamping state;

[0010] When the clamping member rotates so that the first sensing point is located within the detection range of the detection mechanism and the second sensing point is located outside the detection range of the detection mechanism, it is determined that the wafer is in a damaged state;

[0011] When the clamping member rotates so that the first sensing point is located outside the detection range of the detection mechanism and the second sensing point is located within the detection range of the detection mechanism, it is determined that the wafer is in an open state.

[0012] In some embodiments, a plurality of mounting holes are evenly and spaced apart on the edge of the disk;

[0013] The clamping member comprises a rotating shaft, and the rotating shaft is rotatably arranged in the mounting hole. The bottom end of the rotating shaft is provided with the sensing part, and the sensing part is located below the disk body.

[0014] In some embodiments, a clamping portion and a supporting portion are provided at the top end of the rotating shaft, the supporting portion is parallel to the horizontal plane where the disk is located, and the supporting portion is used to support the back side of the wafer;

[0015] The clamping portion protrudes from the surface of the supporting portion and is arranged away from the axis of the rotating shaft. When the rotating shaft is rotated, the clamping portion can be used to abut against the edge of the wafer.

[0016] In some embodiments, the clamping member further includes a sleeve, the sleeve is embedded in the mounting hole, and the rotating shaft passes through the sleeve.

[0017] In some embodiments, it also includes a base and a rotating mechanism;

[0018] The rotating mechanism is arranged on the base, the rotating mechanism has a rotating part, the disk body is arranged on the rotating part, and the rotating part is used to drive the disk body to rotate.

[0019] In some embodiments, it also includes a cylinder and a transmission mechanism;

[0020] The cylinder is arranged on the base, the transmission mechanism is connected with the cylinder and the clamping member, and the cylinder transmits power to the clamping member through the transmission mechanism to rotate the clamping member.

[0021] In some embodiments, the detection mechanism includes a connector and a sensor;

[0022] The connecting member is arranged on the side wall of the base, and is used for connecting the sensor so that the sensing area of ​​the sensor corresponds to the sensing part.

[0023] In some embodiments, the first sensing point and the second sensing point are two protruding structures arranged side by side and spaced apart;

[0024] When the clamping member rotates, the positions of the first sensing point and the second sensing point will change with the rotation angle.

[0025] The beneficial effects of a clamping device capable of detecting wafer status provided by the present invention are:

[0026] 1. It can detect whether the wafer is in a damaged state, clamped state, or open state, which improves the diversity and accuracy of wafer status detection.

[0027] 2. By providing a detection mechanism to directly detect the sensing part on the clamping member, the accuracy of wafer detection is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the structure of a clamping device capable of detecting the state of a wafer according to an embodiment of the present invention;

[0029] Figure 2 for Figure 1 The enlarged view of point A in the middle;

[0030] Figure 3 A schematic structural diagram of the corresponding position relationship between the sensor and the sensing part when the wafer is in a clamping state according to an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of the structure of the corresponding position relationship between the sensor and the sensing part when the wafer of the embodiment provided by the present invention is in a damaged state;

[0032] Figure 5 This is a structural schematic diagram of the corresponding position relationship between the sensor and the sensing part when the wafer of the embodiment provided by the present invention is in an open state.

[0033] Reference numerals:

[0034] Reference numerals:

[0035] The disk body 1, the clamping part 2, the sensing part 21, the first sensing point 211, the second sensing point 212, the rotating shaft 22, the clamping part 23, the supporting part 24, the sleeve 25, the detecting mechanism 3, the connecting part 31, the sensor 32, the base 4, the rotating mechanism 5, and the cylinder 6. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0037] Figure 1 A schematic structural diagram of a clamping device capable of detecting the state of a wafer according to an embodiment of the present invention.

[0038] Figure 2 for Figure 1 Enlarged view of point A in the middle.

[0039] refer to Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a clamping device capable of detecting the state of a wafer, the clamping device comprising a disc body 1, a clamping member 2, and a detection mechanism 3. The disc body 1 is a disc-shaped structure, the clamping member 2 is rotatably arranged on the disc body 1, and the rotation axis of the clamping member 2 is perpendicular to the upper surface of the disc body 1, the bottom end of the clamping member 2 has a sensing portion 21, the sensing portion 21 is located on the lower surface of the disc body 1, and the sensing portion 21 can change position according to the rotation angle of the clamping member 2. A plurality of the clamping members 2 are spaced and evenly located at the edge of the disc body 1, and are used to clamp and fix the wafer.

[0040] The detection mechanism 3 is disposed close to the tray body 1 and is located below the tray body 1 . The detection mechanism 3 is used to detect the sensing part 21 and determine the wafer state according to the detected sensing part 21 .

[0041] Specifically, refer to Figure 2 As shown, the sensing portion 21 includes a first sensing point 211 and a second sensing point 212 that are spaced apart. The first sensing point 211 and the second sensing point 212 are two protruding structures that are spaced apart and arranged side by side.

[0042] Figure 3 This is a structural schematic diagram of the corresponding position relationship between the sensor and the sensing part when the wafer of the embodiment provided by the present invention is in a clamped state.

[0043] refer to Figure 3As shown, in this embodiment, the clamping device is configured so that when the clamping member 2 clamps the wafer, the first sensing point 211 and the second sensing point 212 are located outside the detection range of the detection mechanism 3. For example, the first sensing point 211 and the second sensing point 212 are located on both sides of the sensing area of ​​the detection mechanism 3, so that the detection mechanism 3 cannot detect a signal. Therefore, when the detection mechanism 3 does not detect a signal, it can be determined that the wafer is in a clamped state.

[0044] Figure 4 This is a structural schematic diagram of the corresponding position relationship between the sensor and the sensing part when the wafer of the embodiment provided by the present invention is in a damaged state.

[0045] refer to Figure 4 As shown, when the clamping member 2 is rotated so that the first sensing point 211 is located within the sensing area of ​​the detection mechanism 3, so that the sensor 32 can detect the first sensing point 211, and the second sensing point 212 is located outside the detection range of the detection mechanism 3, this indicates that the clamping member 2 has increased its rotation angle because it does not abut against the edge contour of the wafer, and the wafer can be judged to be in a damaged state.

[0046] Because when the wafer is damaged, the clamping part 23 cannot abut against the edge of the wafer, so that the clamping member 2 has no limit, resulting in a larger rotation angle, so that the first sensing point 211 rotates to the sensing area of ​​the sensor, so that the sensor 32 can detect the first sensing point 211.

[0047] Figure 5 This is a structural schematic diagram of the corresponding position relationship between the sensor and the sensing part when the wafer of the embodiment provided by the present invention is in an open state.

[0048] refer to Figure 5 As shown, when the clamping member 2 rotates so that the first sensing point 211 is outside the detection range of the detection mechanism 3, and the second sensing point 212 is within the detection range of the detection mechanism 3, it means that the clamping member 2 is rotating in the opposite direction, and it can be judged that the wafer is in an open state. At this time, the robot arm can be controlled to pick up the wafer from the clamping device.

[0049] In this embodiment, the clamping device can detect whether the wafer is in a damaged state, a clamped state, and an open state, thereby improving the diversity of wafer state detection. In addition, by setting a detection mechanism 3 to directly detect the sensing part 21 on the clamping member 2, the accuracy of wafer state detection is further ensured.

[0050] In some embodiments, the clamping member can be flipped on the disk, the sensing part can change its position according to the flipping angle of the clamping member, the detection mechanism is used to detect the position of the sensing part and judge the state of the wafer according to the detected sensing part.

[0051] In other embodiments, the clamping member is provided on the disk body and can move radially on the disk body, the sensing part can change position according to the movement of the clamping member, the detection mechanism is used to detect the sensing part and judge the wafer state according to the detected position of the sensing part.

[0052] refer to Figure 1 and Figure 2 As shown, in some embodiments, a plurality of mounting holes (not shown) are provided at intervals and evenly on the edge of the disk body 1. The clamping member 2 includes a rotating shaft 22, which is rotatably disposed in the mounting hole, and the bottom end of the rotating shaft 22 is provided with the sensing portion 21, which is located below the disk body 1. The detection mechanism 3 is provided corresponding to the sensing portion 21, and the top end of the rotating shaft 22 is located on the upper surface of the disk body 1, for supporting and clamping the wafer.

[0053] Specifically, refer to Figure 2 As shown, the top of the rotating shaft 22 is provided with a clamping portion 23 and a supporting portion 24, the supporting portion 24 is higher than the upper surface of the disk body 1, and the supporting surface of the supporting portion 24 is parallel to the upper surface of the disk body 1, and a plurality of the supporting portions 24 are arranged in a ring shape along the circumference of the disk body 1 to support the back side of the wafer. The clamping portion 23 protrudes from the supporting surface of the supporting portion 24 and is arranged away from the axis of the rotating shaft 22. When the rotating shaft 22 is rotated, the clamping portion 23 can be used to abut against the edge of the wafer to clamp the wafer. When rotating in the opposite direction, the clamping portion 23 is away from the edge of the wafer, so that the clamping device opens the wafer to open the wafer.

[0054] Furthermore, the clamping member 2 further comprises a shaft sleeve 25, wherein the shaft sleeve 25 is embedded in the mounting hole, and the rotating shaft 22 is passed through the shaft sleeve 25 to realize rotation.

[0055] In some embodiments, the clamping device further includes a base 4 and a rotating mechanism 5, wherein the rotating mechanism 5 is disposed on the base 4, the rotating mechanism 5 has a rotating part, the back side of the disk body 1 is disposed on the rotating part, and the rotating part is used to drive the disk body 1 to rotate.

[0056] In this embodiment, the rotating mechanism 5 may be a rotating motor.

[0057] refer to Figure 1As shown, the clamping device further includes a cylinder 6 and a transmission mechanism (not shown in the figure). The cylinder 6 is arranged on the side wall of the base 4, and the transmission mechanism is connected with the cylinder 6 and the clamping member 2. The cylinder 6 transmits power to the clamping member 2 through the transmission mechanism to rotate the clamping member 2 on the disk body 1.

[0058] In this embodiment, the cylinder 6 may be a telescopic cylinder 6, which performs telescopic motion to drive the transmission mechanism to move, and the transmission mechanism transmits power to the clamping member 2 to make the clamping member 2 rotate along its rotation axis 22.

[0059] refer to Figure 2 As shown, in some embodiments, the detection mechanism 3 includes a connector 31 and a sensor 32 . The connector 31 is disposed on a side wall of the base 4 and is used to connect the sensor 32 so that a sensing area of ​​the sensor 32 corresponds to the sensing portion 21 .

[0060] Specifically, one end of the connecting member 31 is detachably disposed on the side wall of the base 4 , and the other end of the connecting member 31 fixes the sensor 32 .

[0061] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A clamping device capable of detecting wafer status, characterized in that: It includes a disc body, a clamping part, and a detection mechanism; The clamping member is movably arranged on the plate body, and the clamping member has a sensing part, and the sensing part can change position according to the movement of the clamping member, and a plurality of the clamping members are arranged at intervals on the edge of the plate body for clamping and fixing the wafer; The detection mechanism is arranged close to the disk body, and is used to detect the sensing part and judge the state of the wafer according to the detected sensing part.

2. The wafer state detection device according to claim 1, characterized in that: The sensing portion includes a first sensing point and a second sensing point that are spaced apart; When the clamping member rotates so that the first sensing point and the second sensing point are outside the detection range of the detection mechanism, it is determined that the wafer is in a clamping state; When the clamping member rotates so that the first sensing point is located within the detection range of the detection mechanism and the second sensing point is located outside the detection range of the detection mechanism, it is determined that the wafer is in a damaged state; When the clamping member rotates so that the first sensing point is located outside the detection range of the detection mechanism and the second sensing point is located within the detection range of the detection mechanism, it is determined that the wafer is in an open state.

3. The wafer state detection device according to claim 1, characterized in that: The edge of the disk body is provided with a plurality of mounting holes spaced evenly from each other; The clamping member comprises a rotating shaft, and the rotating shaft is rotatably arranged in the mounting hole. The bottom end of the rotating shaft is provided with the sensing part, and the sensing part is located below the disk body.

4. The wafer state detection device according to claim 3, characterized in that: The top end of the rotating shaft is provided with a clamping portion and a supporting portion, the supporting portion is parallel to the horizontal plane where the disk is located, and the supporting portion is used to support the back side of the wafer; The clamping portion protrudes from the surface of the supporting portion and is arranged away from the axis of the rotating shaft. When the rotating shaft is rotated, the clamping portion can be used to abut against the edge of the wafer.

5. The wafer state detection clamping device according to claim 3, characterized in that: The clamping member also includes a shaft sleeve, which is embedded in the mounting hole, and the rotating shaft is passed through the shaft sleeve.

6. The wafer state detection device according to claim 1, characterized in that: Also includes a base and a rotating mechanism; The rotating mechanism is arranged on the base, the rotating mechanism has a rotating part, the disk body is arranged on the rotating part, and the rotating part is used to drive the disk body to rotate.

7. The wafer state detecting clamping device according to claim 6, characterized in that: It also includes a cylinder and a transmission mechanism; The cylinder is arranged on the base, the transmission mechanism is connected with the cylinder and the clamping member, and the cylinder transmits power to the clamping member through the transmission mechanism to rotate the clamping member.

8. The wafer state detecting clamping device according to claim 6, characterized in that: The detection mechanism includes a connecting piece and a sensor; The connecting member is arranged on the side wall of the base, and is used for connecting the sensor so that the sensing area of ​​the sensor corresponds to the sensing part.

9. The wafer state detection clamping device according to claim 2, characterized in that: The first sensing point and the second sensing point are two convex structures arranged side by side and spaced apart; When the clamping member rotates, the positions of the first sensing point and the second sensing point will change with the rotation angle.

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