Electronic package and heat dissipation structure thereof

Abstract

The invention relates to an electronic packaging piece and a heat dissipation structure thereof, which comprises the steps that a supporting piece of the heat dissipation structure is arranged in an edge area, and no supporting piece is arranged in a corner area. Therefore, the support member is interrupted in the corner area, so that stress can be prevented from being concentrated in the corner area, and delamination caused by warping of the whole electronic packaging member can be avoided.

Description

Technical Field

[0001] The invention relates to a packaging structure, and in particular to an electronic packaging component and a heat dissipation structure thereof with improved reliability. Background Art

[0002] As the demand for electronic products in terms of functions and processing speed increases, semiconductor chips, as the core components of electronic products, need to have higher density electronic components and electronic circuits. Therefore, semiconductor chips will generate more heat energy during operation. The packaging colloid covering the semiconductor chip is a material with poor thermal conductivity (i.e., poor heat dissipation efficiency). Therefore, if the generated heat cannot be effectively dissipated, it will cause damage to the semiconductor chip or cause product reliability issues.

[0003] Therefore, in order to quickly dissipate heat energy into the atmosphere, a heat sink (heat spreader) is usually configured in the semiconductor packaging structure to dissipate the heat generated by the semiconductor chip through the heat sink. Furthermore, it is usually better to expose the top surface of the heat sink to the packaging colloid or directly to the atmosphere, so as to achieve a better heat dissipation effect.

[0004] like Figure 1 As shown, the manufacturing method of the conventional heat dissipation type semiconductor package structure 1 is to first place a semiconductor chip 11 on a package substrate 10 by means of flip chip bonding (i.e., through conductive bumps 110 and bottom glue 111) with its active surface 11a, and to form a gold layer (not shown) on the inactive surface 11b of the semiconductor chip 11, and then to place a heat sink 13 on the gold layer by reflowing its top sheet 130 through a TIM (Thermal Interface Material, thermal interface material) layer 12 (which includes a solder layer and flux), and to mount the support legs 131 of the heat sink 13 on the package substrate 10 through an adhesive layer 14. Next, a package molding operation is performed so that the package colloid (not shown) covers the semiconductor chip 11 and the heat sink 13, and the top sheet 130 of the heat sink 13 is exposed to the package colloid and directly contacts the atmosphere.

[0005] During operation, heat energy generated by the semiconductor chip 11 is conducted to the heat sink 13 through the inactive surface 11 b and the TIM layer 12 to be dissipated to the outside of the semiconductor package structure 1 .

[0006] However, when the thickness of the conventional semiconductor package structure 1 is reduced and its area is increased, the difference in thermal expansion coefficient (CTE Mismatch) between the heat sink 13 and the TIM layer 12, which causes deformation (i.e., warpage), becomes more obvious. In particular, the corners of the semiconductor package structure 1 will be subjected to the maximum stress, making it easy for the top sheet 130 of the heat sink 13 and the TIM layer 12 to delaminate (e.g., Figure 1 The gap d) shown not only reduces the heat conduction effect, but also causes a poor appearance of the semiconductor package structure 1, thus seriously affecting the reliability of the product.

[0007] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the invention

[0008] In view of the various deficiencies of the above-mentioned prior art, the present invention provides a heat dissipation structure, including: a heat dissipation element, which is defined by a central area, a plurality of edge areas located on the sides of the outer periphery of the central area, and a plurality of corner areas located at the corners of the outer periphery of the central area; and at least one support element, which is disposed on the heat dissipation element; wherein the support element is disposed in the edge area of ​​the heat dissipation element and is not disposed in the corner area.

[0009] The present invention also provides an electronic package, comprising: a supporting structure; an electronic component disposed on the supporting structure; and a heat dissipation structure disposed on the supporting structure to cover the electronic component, and the heat dissipation structure comprises: a heat dissipation member defining a central area, a plurality of edge areas located on the sides of the outer periphery of the central area, and a plurality of corner areas located at the corners of the outer periphery of the central area; and at least one support member disposed on the heat dissipation member; wherein the electronic component corresponds to the position of the central area, and the support member is disposed in the edge area of ​​the heat dissipation member but not in the corner area.

[0010] The aforementioned electronic package and its heat dissipation structure further include: at least one joint member disposed in the corner area of ​​the heat dissipation member, and the joint member and the support member are not connected to each other. Alternatively, the aforementioned electronic package and its heat dissipation structure further include: a plurality of joint members disposed in some of the plurality of corner areas, for example, the plurality of joint members are disposed in the plurality of opposite corner areas.

[0011] In the aforementioned electronic package and heat dissipation structure thereof, the joint member is made of a soft material, and the support member is made of a hard material.

[0012] In the aforementioned electronic packaging component and heat dissipation structure thereof, the bonding component is a glue column.

[0013] In the aforementioned electronic package and heat dissipation structure thereof, the support member is a heat dissipation wall or a heat dissipation column.

[0014] In the aforementioned electronic package and heat dissipation structure thereof, a plurality of the supporting members are disposed in at least one edge region, and the plurality of the supporting members are arranged at intervals.

[0015] In the aforementioned electronic package and heat dissipation structure thereof, the support member is arranged in two opposite edge areas.

[0016] In the aforementioned electronic package and heat dissipation structure thereof, the support member is arranged in each of the edge areas.

[0017] In the aforementioned electronic package and heat dissipation structure thereof, the heat dissipation component and the support component are integrally formed.

[0018] In the aforementioned electronic package and heat dissipation structure thereof, the heat dissipation component and the support component are not integrally formed.

[0019] As can be seen from the above, in the electronic package and its heat dissipation structure of the present invention, the support member of the heat dissipation structure is mainly arranged in the edge area, and no support member is arranged in the corner area. Therefore, the support members in the edge area are interrupted in the corner area and are not connected to each other. Therefore, compared with the existing support members that surround the entire outer periphery, the stress of the support members of the present invention will not be concentrated in the corner area, thereby preventing the entire electronic package from warping and delamination.

[0020] Furthermore, the heat dissipation structure of the present invention may be provided with a joint piece at the corner area, and the joint piece may strengthen the connection between the heat dissipation element and the supporting structure. Therefore, the stability of the entire electronic package may be further improved through the joint piece to prevent its bending and deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a cross-sectional schematic diagram of an existing semiconductor packaging structure.

[0022] FIG. 2A to FIG. 2F It is a cross-sectional schematic diagram of the method for manufacturing the electronic package of the present invention.

[0023] Figure 3A FIG. 1 is a three-dimensional schematic diagram of a heat dissipation structure according to a first embodiment of the present invention.

[0024] Figure 3B FIG. 1 is a schematic plan view of a heat dissipation structure according to a first embodiment of the present invention.

[0025] Figure 4A FIG. 4 is a perspective schematic diagram of a heat dissipation structure according to a second embodiment of the present invention.

[0026] Figure 4B FIG. 1 is a schematic plan view of a heat dissipation structure according to a second embodiment of the present invention.

[0027] Figure 5A It is a three-dimensional schematic diagram of a heat dissipation structure according to a third embodiment of the present invention.

[0028] Figure 5B FIG. 4 is a schematic plan view of a heat dissipation structure according to a third embodiment of the present invention.

[0029] Fig. 6A FIG. 4 is a perspective schematic diagram of a heat dissipation structure according to a fourth embodiment of the present invention.

[0030] Figure 6B FIG. 4 is a schematic plan view of a heat dissipation structure according to a fourth embodiment of the present invention.

[0031] Fig. 7A FIG. 4 is a perspective schematic diagram of a heat dissipation structure according to a fifth embodiment of the present invention.

[0032] Figure 7B FIG. 4 is a schematic plan view of a heat dissipation structure according to a fifth embodiment of the present invention.

[0033] Main component symbols

[0034] 1 Semiconductor packaging structure

[0035] 10 Package substrate

[0036] 11. Semiconductor Chip

[0037] 11a Action surface

[0038] 11b Non-active surface

[0039] 110 Conductive bump

[0040] 111 Primer

[0041] 12 TIM layer

[0042] 13 Heat sink

[0043] 130 Top sheet

[0044] 131 Support feet

[0045] 14 Adhesive layer

[0046] 2 Electronic packaging

[0047] 20 Load-bearing structure

[0048] 20a First side

[0049] 20b Second side

[0050] 21 Electronic components

[0051] 21a Action surface

[0052] 21b Non-active surface

[0053] 210 Conductive bump

[0054] 211 Primer

[0055] 22. Thermal Conductive Layer

[0056] 23,23a,23b,23c,23d,23e Heat dissipation structure

[0057] 230 Heat sink

[0058] 231,231a,231b,231c,231d,231e support

[0059] 232 Joints

[0060] 24 Adhesive layer

[0061] 25 Conductive element

[0062] 26 Passive Components

[0063] D Clearance

[0064] A Central Area

[0065] B. Marginal area

[0066] C Corner area. DETAILED DESCRIPTION

[0067] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0068] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any modification of the structure, change in the proportion relationship, or adjustment of the size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "one", "first", and "second" cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0069] FIG. 2A to FIG. 2F It is a cross-sectional schematic diagram of the method for manufacturing the electronic package of the present invention.

[0070] like Figure 2A As shown, a supporting structure 20 is provided, which has a first side 20 a and a second side 20 b opposite to each other, and at least one electronic component 21 is disposed on the first side 20 a of the supporting structure 20 .

[0071] The supporting structure 20 may be a package substrate having a core layer and a circuit portion or a coreless circuit structure.

[0072] In this embodiment, the carrier structure 20 includes at least one dielectric layer and a circuit layer combined with the dielectric layer, such as a fan-out redistribution layer (RDL) specification. For example, the first side 20a of the carrier structure 20 is used as a die placement side for carrying the electronic component 21, and the second side 20b of the carrier structure 20 is used as a ball implantation side.

[0073] It should be understood that the supporting structure 20 may also be other supporting units for supporting chips, such as a leadframe, a wafer, a silicon interposer, or other boards with metal routing, etc., and is not limited to the above.

[0074] The electronic component 21 is an active component, a passive component or a combination of the two. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor.

[0075] In this embodiment, the electronic component 21 is a semiconductor chip having an active surface 21a and an inactive surface 21b relative to each other, and the active surface 21a has a plurality of electrode pads (not shown) so that the electrode pads can be flip-chip bonded and electrically connected to the circuit layer of the supporting structure 20 through a plurality of conductive bumps 210 such as solder materials.

[0076] In other embodiments, the electronic component 21 may also be electrically connected to the circuit layer of the supporting structure 20 by bonding multiple wires; or, the electronic component 21 may directly contact the circuit layer of the supporting structure 20 .

[0077] It should be understood that there are many ways to electrically connect the electronic components 21 to the supporting structure 20 , and the required types and quantities of electronic components 21 can be placed on the supporting structure 20 , which are not limited to the above.

[0078] like Figure 2B As shown, a coating layer such as a primer 211 is filled and formed between the first side 20 a of the supporting structure 20 and the active surface 21 a of the electronic component 21 to cover the conductive bumps 210 .

[0079] like Figure 2C As shown, at least one passive component 26 is disposed on the supporting structure 20 so that the passive component 26 is electrically connected to the circuit layer.

[0080] like Figure 2D As shown, a heat conducting layer 22 is formed on the inactive surface 21 b of the electronic component 21 .

[0081] In this embodiment, the heat-conducting layer 22 is used as a thermal interface material (TIM). For example, the heat-conducting layer 22 can be a liquid metal such as a solder material, which has a high thermal conductivity.

[0082] like Figure 2E As shown, a heat dissipation structure 23 is disposed on the first side 20a of the supporting structure 20 and the heat conductive layer 22 to cover the electronic component 21. The heat dissipation member 23 has a heat dissipation member 230 that contacts and combines with the heat conductive layer 22 and a plurality of support members 231 that extend downward from the heat dissipation member 230 to combine with the supporting structure 20. For example, the heat dissipation member 230 is in a sheet-like form, which can be pressed against the heat conductive layer 22 so that the heat conductive layer 22 is located between the heat dissipation member 230 and the electronic component 21.

[0083] Furthermore, the support member 231 is combined with the support structure 20 through the adhesive layer 24. For example, the adhesive layer 24 is first formed on the first side 20a of the support structure 20 by dispensing, so that the adhesive layer 24 is located at the periphery of the passive component 26, and then the support member 231 is bonded to the adhesive layer 24 to fix the heat dissipation structure 23 on the support structure 20.

[0084] Afterwards, if Figure 2F As shown, a packaging colloid (not shown) covering the electronic component 21 can then be formed on the first side 20a of the supporting structure 20, and a plurality of conductive elements 25 such as metal pillars such as copper pillars, metal bumps covered with insulating blocks, solder balls, solder balls with core copper balls (Cu core balls) or other conductive structures can be arranged on the second side 20b of the supporting structure 20 to obtain the electronic package 2 of the present invention. Subsequently, an electronic device such as a circuit board can be connected through these conductive elements 25 (not shown).

[0085] When the electronic package 2 is in operation, the heat energy generated by the electronic component 21 is conducted to the heat dissipation structure 23 via the inactive surface 21 b and the heat conductive layer 22 , so as to be dissipated to the outside of the electronic package 2 .

[0086] In the following, various implementations of the heat dissipation structure 23 of the electronic package 2 of the present invention will be described in more detail.

[0087] Figure 3A and Figure 3B The heat dissipation structure 23a of the first embodiment of the present invention is shown. Figure 3BAs shown, the heat sink 230 of the heat dissipation structure 23a is defined by a central area A, a plurality of edge areas B located at the sides of the outer periphery of the central area A, and a plurality of corner areas C located at the corners of the outer periphery of the central area A. For example, in this embodiment, the heat sink 230 is defined by a central area A, four edge areas B, and four corner areas C.

[0088] In this embodiment, the central area A corresponds to the area where the electronic component 21 and the passive component 26 are disposed (eg Figure 2E and Figure 2F Furthermore, Figure 3A and Figure 3B As shown, a single support member 231a is disposed in each edge region B, and the support member 231a is not disposed in the corner region C. In other words, the plurality of support members 231a located in the plurality of edge regions B are interrupted in the corner region C and are not connected to each other. In addition, a joint member 232 is disposed in the corner region C, and the joint member 232 and the support member 231 are not connected to each other.

[0089] Thus, the stress of the heat dissipation structure 23a will not be concentrated in the corner area C, thereby preventing the entire structure from warping and delamination. Furthermore, the joint 232 can strengthen the connection between the heat dissipation element 230 and the supporting structure 20. Therefore, the stability of the entire structure can be further improved to avoid bending and deformation.

[0090] The material of the support member 231a can be the same as that of the heat sink 230, for example, a heat sink wall or heat sink column made of a hard material (metal). Thus, the heat dissipation effect of the entire heat sink structure 23a can be improved. However, it should be understood that the support member 231a can also be other components that can support the heat sink 230, and is not limited to the above.

[0091] Furthermore, in the present embodiment, the support member 231 a is disposed in each edge region B. However, it should be understood that the support member 231 a only needs to be sufficient to support the heat sink 230 , and the support member 231 a may not be disposed in each edge region B.

[0092] The joint member 232 may be made of a soft elastic material (adhesive), such as a rubber column. Thus, the toughness of the entire heat dissipation structure 23a can be improved. However, it should be understood that the joint member 232 may also be other components capable of connecting the heat dissipation member 230 and the supporting structure 20, and is not limited to the above.

[0093] Furthermore, in this embodiment, the joint member 232 is disposed in each corner region C. However, it should be understood that the joint member 232 only needs to be sufficient to connect the heat sink 230 to the supporting structure 20 , and the joint member 232 may not be disposed in each corner region C.

[0094] Figure 4A and Figure 4B The heat dissipation structure of the second embodiment of the present invention is shown. The components of the heat dissipation structure 23b of the second embodiment that are identical or corresponding to the heat dissipation structure 23a of the first embodiment are marked with the same or corresponding numbers, and the description of the identical parts is omitted.

[0095] like Figure 4A and Figure 4B As shown, in the second embodiment of the present invention, the aforementioned joint member 232 is not disposed in the corner area C. In other words, the heat sink 230 and the supporting structure 20 are supported and connected only by the support member 231 b located in the edge area B.

[0096] Compared with the first embodiment, the heat dissipation structure 23b of the second embodiment has a simpler structure, so the manufacturing process of the heat dissipation structure 23b can be simplified and the cost can be reduced. In addition, if the subsequent sealing operation is performed, the packaging colloid can be filled into the corner area C to cover the electronic component 21, and the bubbles in the sealing operation can also be discharged from the corner area C.

[0097] Figure 5A and Figure 5B The heat dissipation structure of the third embodiment of the present invention is shown. The components of the heat dissipation structure 23c of the third embodiment that are identical or corresponding to the heat dissipation structure 23a of the first embodiment are marked with the same or corresponding numbers, and the description of the identical parts is omitted.

[0098] like Figure 5A and Figure 5B As shown, in the third embodiment of the present invention, a plurality of support members 231c are provided in at least one edge region B, and the plurality of support members 231c are arranged at intervals. Furthermore, the sizes of the plurality of support members 231c may be the same or different.

[0099] Compared to the first embodiment, the heat dissipation structure 23c of the third embodiment is provided with multiple support members 231c on a single side, and a single support member 231c is provided on the other three sides, thereby interrupting the stress in the single side edge area B, thereby improving the stability of the entire structure and avoiding bending deformation.

[0100] Fig. 6A and Figure 6B The heat dissipation structure of the fourth embodiment of the present invention is shown. The components of the heat dissipation structure 23d of the fourth embodiment that are identical or corresponding to the heat dissipation structure 23a of the first embodiment are marked with the same or corresponding numbers, and the description of the identical parts is omitted.

[0101] like Fig. 6A and Figure 6BAs shown, in the fourth embodiment of the present invention, the joint member 232 is not disposed in the corner area C, and the support member 231d is disposed in two opposite edge areas B. In other words, the heat sink 230 and the supporting structure 20 are supported and connected only by the two support members 231d located in the two edge areas B.

[0102] Compared with the first embodiment, the heat dissipation structure 23d of the fourth embodiment has a simpler structure, so the manufacturing process of the heat dissipation structure 23d can be simplified and the cost can be reduced.

[0103] Furthermore, in this embodiment, the support member 231d is disposed in two opposite edge regions B. However, it should be understood that the support member 231d only needs to be sufficient to support the heat sink 230 in a balanced manner. For example, in other embodiments, the support member 231d may be disposed in the edge region B on adjacent sides.

[0104] Fig. 7A and Figure 7B The heat dissipation structure of the fifth embodiment of the present invention is shown. The components of the heat dissipation structure 23e of the fifth embodiment that are identical or corresponding to the heat dissipation structure 23a of the first embodiment are marked with the same or corresponding numbers, and the description of the identical parts is omitted.

[0105] like Fig. 7A and Figure 7B As shown, in the fifth embodiment of the present invention, a joint member 232 is disposed in a portion of the plurality of corner regions C (for example, in two opposite corner regions C), and a support member 231e is disposed in a portion of the plurality of edge regions B (for example, in two opposite edge regions B). It should be understood that the joint member 232 and the support member 231e may be disposed in three corner regions C and three edge regions B, respectively, without being limited to the diagram of this embodiment.

[0106] In addition, in the above-mentioned embodiments, the heat sink 230 and the support member 231 can be integrally formed. In this case, the support member 231 can be arranged along the outer edge of the heat sink 230, so that the cross section of the heat sink 230 becomes a U-shaped (such as Figure 2E and Figure 2F However, the present invention is not limited to the above, and the integrally formed heat sink 23 may also be in a non-U-shaped shape.

[0107] In addition, in the aforementioned embodiments, the heat sink 230 and the support member 231 may also be non-integrally formed. In this case, the support member 231 may be retracted inward relative to the outer edge of the heat sink 230 and not arranged along the outer edge of the heat sink 230, so that the cross-section of the heat sink structure 23 becomes a π-shaped. However, the present invention is not limited to the above, and the non-integrally formed heat sink structure 23 may also be a non-π-shaped shape.

[0108] In summary, in the electronic package and heat dissipation structure of the present invention, the support member of the heat dissipation structure is mainly arranged in the edge area, and no support member is arranged in the corner area. Therefore, the support members in the edge area are interrupted in the corner area and are not connected to each other, so the stress of the support members will not be concentrated in the corner area, thereby preventing the entire electronic package from warping and delamination.

[0109] Furthermore, the heat dissipation structure of the present invention can be provided with a joint member at the corner area, which can strengthen the connection between the heat dissipation member and the bearing structure and also support the heat dissipation member, thereby further improving the stability of the entire electronic package and preventing it from bending and deforming.

[0110] Furthermore, the present invention can be composed of a plurality of supporting members arranged in a single edge region, and the plurality of supporting members are arranged at intervals, thereby interrupting the stress of the supporting members in the edge region to further avoid bending deformation.

[0111] Furthermore, the supporting member of the present invention can be disposed only in a portion of the edge area, thereby simplifying the structure.

[0112] The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. A heat dissipation structure, comprising: a heat sink defining a central region, a plurality of edge regions located at sides of an outer periphery of the central region, and a plurality of corner regions located at corners of an outer periphery of the central region; and At least one supporting member, which is disposed on the heat dissipation member; Wherein, the support component is arranged in the edge area of ​​the heat dissipation component, and is not arranged in the corner area.

2. The heat dissipation structure according to claim 1, wherein: The heat dissipation structure also includes at least one joint component, which is arranged in the corner area of ​​the heat dissipation component, and the joint component and the supporting component are not connected to each other.

3. The heat dissipation structure according to claim 2, wherein: The joint piece is made of soft material, and the support piece is made of hard material.

4. The heat dissipation structure according to claim 2, wherein: The joint piece is a rubber column.

5. The heat dissipation structure according to claim 1, wherein: The heat dissipation structure also includes a plurality of joint members, which are arranged in some of the plurality of corner areas.

6. The heat dissipation structure according to claim 5, wherein: The plurality of joint members are arranged in the plurality of opposite corner areas.

7. The heat dissipation structure according to claim 1, wherein: The support member is a heat dissipation wall or a heat dissipation column.

8. The heat dissipation structure according to claim 1, wherein: A plurality of the supporting members are arranged in a single edge region, and the plurality of the supporting members are arranged at intervals.

9. The heat dissipation structure according to claim 1, wherein: The support member is arranged in two opposite edge areas.

10. The heat dissipation structure according to claim 1, wherein: The support member is disposed in each of the edge regions.

11. The heat dissipation structure according to claim 1, wherein: The heat sink and the support are integrally formed.

12. The heat dissipation structure according to claim 1, wherein: The heat sink and the support member are not formed in one piece.

13. An electronic package, comprising: load-bearing structure; An electronic component is disposed on the supporting structure; as well as A heat dissipation structure is disposed on the supporting structure to cover the electronic component, and the heat dissipation structure includes: A heat sink is defined by a central region, a plurality of edge regions located at sides of an outer periphery of the central region, and a plurality of corner regions located at corners of an outer periphery of the central region; and At least one supporting member is disposed on the heat dissipating member, so that the heat dissipating structure is disposed on the supporting structure through the supporting member; The electronic component is located at a position corresponding to the central area, and the support member is disposed in the edge area of ​​the heat dissipation member but not in the corner area.

14. The electronic package of claim 13, wherein: The electronic package also includes: at least one joint component, which is arranged in the corner area of ​​the heat dissipation component, and the joint component and the support component are not connected to each other.

15. The electronic package of claim 14, wherein: The joint piece is made of soft material, and the support piece is made of hard material.

16. The electronic package of claim 14, wherein: The joint piece is a rubber column.

17. The electronic package of claim 13, wherein: The electronic package also includes a plurality of joint members disposed in part of the plurality of corner areas.

18. The electronic package of claim 17, wherein: The plurality of joint members are arranged in the plurality of opposite corner areas.

19. The electronic package of claim 13, wherein: The support member is a heat dissipation wall or a heat dissipation column.

20. The electronic package of claim 13, wherein: A plurality of the supporting members are arranged in a single edge region, and the plurality of the supporting members are arranged at intervals.

21. The electronic package of claim 13, wherein: The support member is arranged in two opposite edge areas.

22. The electronic package of claim 13, wherein: The support member is disposed in each of the edge regions.

23. The electronic package of claim 13, wherein: The heat sink and the support are integrally formed.

24. The electronic package of claim 13, wherein: The heat sink and the support member are not formed in one piece.

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