Liquid cooling heat management system of energy storage equipment and control method of liquid cooling heat management system

Abstract

The invention belongs to the technical field of energy storage equipment, and mainly provides a liquid-cooling heat management system of energy storage equipment and a control method of the liquid-cooling heat management system. The liquid cooling heat management system comprises a liquid cooling module and a semiconductor temperature difference power generation module, the hot end of the semiconductor thermoelectric power generation module is tightly attached to the bottom of a battery cell of the energy storage equipment, and the cold end of the semiconductor thermoelectric power generation module is tightly attached to a liquid cooling plate of the liquid cooling module; when the energy storage equipment needs to be cooled, the liquid cooling module serves as a heat dissipation system of the energy storage equipment and the semiconductor thermoelectric power generation module, and the semiconductor thermoelectric power generation module converts heat energy into electric energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of semiconductor thermoelectricity. According to the liquid cooling system, the problem of heat energy waste existing in an existing liquid cooling system is solved, the temperature uniformity among the battery cells of the energy storage equipment is improved, and the energy consumption of the liquid cooling module is reduced.

Description

[0001] This application claims the priority of the Chinese patent application filed with the Chinese Patent Office on October 11, 2024, with application number 202411427451.3 and application name “Liquid Cooling Thermal Management System for Energy Storage Equipment and Control Method for Liquid Cooling Thermal Management System”, the entire contents of which are incorporated by reference in this application. Technical Field

[0002] The present application belongs to the technical field of energy storage equipment, and in particular, relates to a liquid cooling thermal management system for energy storage equipment and a control method for the liquid cooling thermal management system. Background Art

[0003] With the increasing expansion of the energy storage market and the long-term development of energy storage technology, the role of energy storage equipment thermal management system in energy storage system is becoming more and more important. At present, for the liquid cooling system of energy storage equipment, usually the battery pack is simply placed directly on the liquid cooling plate. However, in the heat transfer process between the battery pack and the liquid cooling plate, temperature difference will inevitably occur, resulting in heat energy waste and reduced energy utilization. Summary of the invention

[0004] The present application provides a liquid cooling thermal management system for energy storage equipment and a control method for the liquid cooling thermal management system, which can solve the problems of heat energy waste and low energy utilization rate caused by the liquid cooling method of the current liquid cooling system.

[0005] A first aspect of an embodiment of the present application provides a liquid cooling thermal management system for an energy storage device, the liquid cooling thermal management system comprising: a liquid cooling module and a semiconductor temperature difference power generation module;

[0006] The hot end of the semiconductor temperature difference power generation module is in close contact with the bottom of the battery cell of the energy storage device, and the cold end of the semiconductor temperature difference power generation module is in close contact with the liquid cooling plate of the liquid cooling module;

[0007] When the energy storage device needs to be cooled, the liquid cooling module serves as a heat dissipation system for the energy storage device and the semiconductor thermoelectric power generation module, so that the thermal energy of the energy storage device is transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate in sequence through heat conduction. The semiconductor thermoelectric power generation module converts the thermal energy into electrical energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of semiconductor thermoelectrics.

[0008] The second aspect of the embodiment of the present application further provides a control method for a liquid cooling thermal management system of an energy storage device, the liquid cooling thermal management system comprising: a liquid cooling module and a semiconductor temperature difference power generation module; the hot end of the semiconductor temperature difference power generation module is close to the bottom of the battery cell of the energy storage device, and the cold end of the semiconductor temperature difference power generation module is close to the liquid cooling plate of the liquid cooling module; the control method comprises:

[0009] When the temperature of the energy storage device is greater than or equal to a first preset threshold, the liquid cooling module and the semiconductor thermoelectric power generation module are controlled to work together, so that the liquid cooling module serves as a heat dissipation system for the energy storage device and the semiconductor thermoelectric power generation module, and the thermal energy of the energy storage device is transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate in sequence by heat conduction. The semiconductor thermoelectric power generation module converts the thermal energy into electrical energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of semiconductor thermoelectricity.

[0010] A third aspect of an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a central processing module, the steps of the control method described in the second aspect are implemented.

[0011] In an embodiment of the present application, a semiconductor thermoelectric power generation module is arranged in a liquid-cooled thermal management system, and the hot end of the semiconductor thermoelectric power generation module is made to be close to the bottom of the battery cell of the energy storage device, and the cold end is made to be close to the liquid cooling plate of the liquid cooling module, so that when the temperature of the energy storage device is high and needs to be cooled, the liquid cooling module can serve as a heat dissipation system for the energy storage device and the semiconductor thermoelectric power generation module, so that the thermal energy of the energy storage device can be transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate in sequence through heat conduction, and the semiconductor thermoelectric power generation module can convert the thermal energy into electrical energy based on the temperature difference between its hot end and cold end and the Seebeck effect of semiconductor thermoelectricity, so that the temperature difference between the battery pack and the liquid cooling plate of the energy storage device is effectively utilized, thereby reducing the waste of thermal energy of the energy storage device and improving energy utilization.

[0012] In addition, in the embodiment of the present application, under the joint action of the liquid cooling module and the semiconductor temperature difference power generation module, the temperature of the energy storage device is also reduced, achieving the effect of the liquid cooling module and the semiconductor temperature difference power generation module jointly dissipating the heat of the energy storage device, which helps to reduce the energy consumption of the liquid cooling module, and solves the problem of excessive energy consumption of the liquid cooling module caused by the temperature of the energy storage device being completely adjusted by the liquid cooling module. At the same time, thanks to the fast response characteristics of the semiconductor temperature difference power generation module, and the fact that the power generation capacity of the semiconductor temperature difference power generation module is positively correlated with the temperature difference, the temperature difference between the battery cells is greatly reduced, so that the temperature uniformity between the battery cells is better, and the problem of large temperature difference between the battery cells near the water inlet and the battery cells near the water outlet caused by the liquid cooling method of the traditional liquid cooling system is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a first structural block diagram of a liquid cooling thermal management system for an energy storage device provided in an embodiment of the present application.

[0014] Figure 2This is a power generation principle diagram of the semiconductor temperature difference power generation module provided in an embodiment of the present application.

[0015] Figure 3a This is a first structural schematic diagram of the liquid cooling module and the semiconductor temperature difference power generation module provided in an embodiment of the present application.

[0016] Figure 3b A second structural schematic diagram of the liquid cooling module and the semiconductor temperature difference power generation module provided in an embodiment of the present application.

[0017] Figure 4 This is a second structural block diagram of the liquid cooling thermal management system of the energy storage device provided in an embodiment of the present application.

[0018] Figure 5 A schematic diagram of the processing logic of the central control module provided in an embodiment of the present application.

[0019] Figure 6 A heating principle diagram of the semiconductor temperature difference power generation module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0021] It should be understood that in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0022] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0023] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. appearing in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways.

[0024] At present, the liquid cooling thermal management method of industrial and commercial energy storage systems (energy storage equipment) is mainly to power the liquid cooling system (liquid cooling module) through energy storage equipment or AC power, and the battery pack of the energy storage equipment is in direct contact with the liquid cooling plate to reduce the temperature of the battery pack. However, in the heat transfer process between the battery pack and the liquid cooling plate, a temperature difference will inevitably occur, resulting in a waste of heat energy. In addition, in the cooling method of the pure liquid cooling system, during the cooling process, the water temperature at the water inlet will be lower than the water temperature at the water outlet, resulting in a certain temperature gradient between the battery cells near the water inlet and the battery cells near the water outlet, causing temperature unevenness between the battery cells.

[0025] In order to solve the above technical problems, the embodiment of the present application provides a liquid cooling thermal management system for energy storage equipment, such as Figure 1 As shown, it is a structural block diagram of a liquid cooling thermal management system for an energy storage device provided in an embodiment of the present application. The liquid cooling thermal management system 100 includes: a liquid cooling module 110 and a semiconductor thermoelectric power generation module 120; the hot end of the semiconductor thermoelectric power generation module 120 is close to the bottom of the battery cell of the energy storage device, and the cold end of the semiconductor thermoelectric power generation module 120 is close to the liquid cooling plate of the liquid cooling module 110. When the energy storage device needs to be cooled, the liquid cooling module 110 serves as a heat dissipation system for the energy storage device and the semiconductor thermoelectric power generation module 120, so that the heat energy of the energy storage device is sequentially transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate by heat conduction. The semiconductor thermoelectric power generation module 120 converts the heat energy into electrical energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of semiconductor thermoelectricity.

[0026] like Figure 2 and Figure 3aAs shown, in the embodiment of the present application, by setting a semiconductor thermoelectric power generation module in a liquid cooling thermal management system, and making the hot end of the semiconductor thermoelectric power generation module close to the bottom of the battery cell of the energy storage device, and the cold end close to the liquid cooling plate of the liquid cooling module, when the temperature of the energy storage device is high and needs to be cooled, the liquid cooling module serves as a heat dissipation system for the energy storage device and the semiconductor thermoelectric power generation module, so that the heat energy of the energy storage device can be transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate in sequence by heat conduction, and the semiconductor thermoelectric power generation module can convert heat energy into electrical energy based on the temperature difference between its hot end and the cold end and the Seebeck effect of semiconductor thermoelectricity, so that the temperature difference between the battery pack and the liquid cooling plate of the energy storage device is effectively utilized, reducing the waste of heat energy of the energy storage device and improving energy utilization. At the same time, under the joint action of the liquid cooling module and the semiconductor thermoelectric power generation module, the temperature of the energy storage device is also reduced, achieving the effect of heat dissipation of the energy storage device. In addition, thanks to the fast response characteristics of the semiconductor thermoelectric power generation module, and the fact that the power generation capacity of the semiconductor thermoelectric power generation module is positively correlated with the temperature difference, the temperature difference between the battery cells is greatly reduced, so that the temperature uniformity between the battery cells is better, solving the problem of a large temperature difference between the battery cells near the water inlet and the battery cells near the water outlet caused by the liquid cooling method of the traditional liquid cooling system.

[0027] Among them, Figure 2 As shown, the semiconductor temperature difference power generation module 20 provided in the embodiment of the present application may include a P-type thermoelectric semiconductor 21 and an N-type thermoelectric semiconductor 22, and metal electrodes (for example, Figure 2 The P-type thermoelectric semiconductor 21 and the N-type thermoelectric semiconductor 22 are arranged between the first ceramic plate 26 and the second ceramic plate 27, through the metal electrodes (for example, Figure 2 The metal electrode 23) is connected.

[0028] In the embodiment of the present application, since the semiconductor temperature difference power generation module also absorbs a certain amount of heat energy in the process of generating electricity, it is equivalent to helping the liquid cooling module to lower the temperature of the energy storage device. Therefore, it helps to reduce the energy consumption of the liquid cooling module and solves the problem of excessive energy consumption in regulating the temperature of the energy storage device entirely by the liquid cooling module.

[0029] In one embodiment of the present application, the electric energy generated by the semiconductor temperature difference power generation module can be used to power the liquid cooling module, thereby realizing the recycling of energy.

[0030] In the embodiment of the present application, the liquid cooling module is equivalent to dissipating heat to the cold end of the semiconductor thermoelectric power generation module, and indirectly dissipating heat to the battery cells of the energy storage device. The semiconductor thermoelectric power generation module is mainly used to convert the heat energy generated by the energy storage device into electrical energy, which plays the role of generating electricity and dissipating heat to the energy storage device, while improving the temperature uniformity between the battery cells.

[0031] In the present application embodiment, Figure 3a and Figure 3b As shown, the semiconductor thermoelectric power generation module may include a plurality of semiconductor thermoelectric cells 121 .

[0032] In order to further improve the temperature uniformity between the cells, such as Figure 3b As shown, in one embodiment of the present application, the distribution density between each semiconductor thermoelectric battery 121 can be increased in sequence from the water inlet 113 to the water outlet 114 of the liquid cooling module flow channel, so that fewer semiconductor thermoelectric batteries can be connected in series at a position with a larger temperature difference near the water inlet to save costs, and more semiconductor thermoelectric batteries can be connected in series at a position with a smaller temperature difference near the water outlet to increase the cooling speed, ultimately achieving improved temperature uniformity between each battery cell while saving costs.

[0033] In one embodiment of the present application, the number of series-connected semiconductor temperature difference batteries can be distributed in a step-like ascending direction from the water inlet to the water outlet of the liquid cooling module flow channel.

[0034] In one embodiment of the present application, Figure 3b As shown, an S-shaped flow channel 112 may be provided inside the liquid cooling plate of the liquid cooling module, corresponding to each semiconductor temperature difference battery.

[0035] In one embodiment of the present application, in order to more efficiently utilize the temperature difference between the liquid cooling plate and the energy storage device, the liquid cooling plate is provided with a corresponding concave layer according to the array orientation of each semiconductor thermoelectric battery in the semiconductor thermoelectric power generation module and the size of each semiconductor thermoelectric battery.

[0036] In one embodiment of the present application, the distribution of the semiconductor thermoelectric batteries corresponds to the distribution of the battery cells in the energy storage device.

[0037] In one embodiment of the present application, in order to reduce the thermal resistance among the battery pack, the semiconductor temperature difference power generation module and the liquid cooling plate of the energy storage device, as shown in FIG. Figure 3a and Figure 3b As shown, a thermal conductive film or thermal conductive grease 140 may be provided between the battery cell, the semiconductor temperature difference power generation module and the liquid cooling plate of the energy storage device.

[0038] Among them, for the place where there is no semiconductor temperature difference battery on the surface of the liquid cooling plate, the stacking order between the liquid cooling plate and the battery pack is: battery pack-thermal conductive film or thermal conductive grease-liquid cooling plate; for the case where there is a semiconductor temperature difference battery on the surface of the liquid cooling plate, the stacking order between the battery pack, the semiconductor temperature difference battery and the liquid cooling plate is: battery pack-thermal conductive film or thermal conductive grease-semiconductor temperature difference battery-thermal conductive film or thermal conductive grease-liquid cooling plate.

[0039] In the embodiment of the present application, the battery cell is the core component of the battery pack, which is composed of one or more positive and negative electrode sheets, a separator and an electrolyte. The battery pack is composed of several battery cells and components such as the outer shell around the battery cells and a protection circuit.

[0040] In one embodiment of the present application, Figure 4 As shown, the liquid cooling thermal management system provided by the above-mentioned embodiments may further include a central control module 130, which may be used to control the thermal management mode of the liquid cooling thermal management system.

[0041] Specifically, in one embodiment of the present application, Figure 5 As shown, the central control module controls the thermal management mode of the liquid cooling thermal management system, including: when the temperature T of the energy storage device is greater than or equal to the first preset threshold value T1, the central control module controls the liquid cooling module and the semiconductor thermoelectric power generation module to work together, and the liquid cooling module serves as a heat dissipation system for the energy storage device and the semiconductor thermoelectric power generation module, so that the heat energy of the energy storage device is transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate in turn by heat conduction, and the semiconductor thermoelectric power generation module converts the heat energy into electrical energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of the semiconductor thermoelectric.

[0042] In this embodiment, the liquid cooling thermal management system may include a temperature sensor for collecting the temperature of the energy storage device and sending the temperature of the energy storage device to the central control module. The first preset threshold T1 is a high temperature threshold, and its specific value can be determined according to the actual application scenario. When the temperature of the energy storage device is greater than or equal to the first preset threshold, it means that the temperature of the energy storage device is high and needs to be cooled.

[0043] In one embodiment of the present application, Figure 5 As shown, the above-mentioned central control module may also control the thermal management mode of the liquid cooling thermal management system, including: when the temperature T of the energy storage device is less than or equal to the second preset threshold value T2, the central control module drives the semiconductor temperature difference power generation module to reversely energize, converting the hot end into a heating end to heat the energy storage device.

[0044] In this embodiment, the second preset threshold value T2 is less than the first preset threshold value T1, and the second preset threshold value T2 is a low temperature threshold value. When the temperature of the energy storage device is less than the second preset threshold value, the battery pack of the energy storage device is in a low temperature state, and its discharge performance is weak. If it is in this state for a long time, it is easy to affect its service life, and it needs to be heated. At this time, if Figure 5 and Figure 6 As shown, the central control module can reversely energize the semiconductor thermoelectric power generation module by converting AC mains power into DC power and controlling the output power, so that the hot end of the semiconductor thermoelectric power generation module is converted into a heating end, and the battery pack in the energy storage device is gradually heated. At this time, the semiconductor thermoelectric power generation module works independently, and the liquid cooling module is in an inoperative state. It should be noted that this is only a control method of the central control module when the temperature of the energy storage device provided in the present application is less than the second preset threshold value, and it does not represent a limitation on the scope of protection of the present application.

[0045] In one embodiment of the present application, when the temperature of the energy storage device is less than or equal to the second preset threshold, the central control module can also control the flow channel of the liquid cooling module to pass hot water to gradually heat the battery pack in the energy storage device. At this time, the hot end of the semiconductor temperature difference power generation module near the water inlet will be transformed into a cold end, and the cold end will be transformed into a hot end. The semiconductor temperature difference power generation module near the water inlet generates electrical energy based on the temperature difference between the hot end and the cold end after the transformation and the Seebeck effect of semiconductor thermoelectricity. In one embodiment of the present application, the electrical energy can reversely energize the semiconductor temperature difference power generation module near the water outlet, so that the hot end of the semiconductor temperature difference power generation module near the water outlet is transformed into a heating end, and the battery pack in the energy storage device is gradually heated, which makes up for the problem of uneven temperature between the battery cells caused by the low water temperature at the water outlet and the low heating efficiency of the battery pack, and improves the temperature uniformity between the individual battery cells, and does not need to use AC power to drive the semiconductor temperature difference power generation module.

[0046] In one embodiment of the present application, Figure 5 As shown, the above-mentioned central control module can also control the thermal management mode of the liquid cooling thermal management system, including: when the temperature of the energy storage device is greater than the second preset threshold T2 and less than the first preset threshold T1, reduce the power of the liquid cooling module or shut down the liquid cooling module.

[0047] In the embodiment of the present application, when the temperature of the energy storage device is greater than the second preset threshold value T2 and less than the first preset threshold value T1, it indicates that the temperature of the energy storage device is at a suitable temperature and no additional heat dissipation or heating is required. Therefore, the central control module can reduce the power of the liquid cooling module or turn off the liquid cooling module, and use the semiconductor temperature difference power generation module to dissipate heat, the natural convection heat dissipation inside the energy storage device, or the PCS fan heat dissipation to further reduce the power consumption of the liquid cooling module.

[0048] In the above-mentioned embodiments of the present application, in the process of the semiconductor thermoelectric power generation module converting thermal energy into electrical energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of semiconductor thermoelectricity, the above-mentioned central control module can also be used to calculate the total output power of the semiconductor thermoelectric power generation module and distribute electrical energy according to the total output power.

[0049] In the embodiment of the present application, the liquid cooling thermal management system may further include a temperature sensor for collecting the temperature of the hot end and the temperature of the cold end of the semiconductor thermoelectric power generation module. The central control module may calculate the total output power of the semiconductor thermoelectric power generation module based on the temperature of the hot end and the temperature of the cold end of each semiconductor thermoelectric battery in the semiconductor thermoelectric power generation module. The output power P of a single semiconductor thermoelectric battery may be calculated based on the formula Calculated, where α is the Seebeck coefficient, R, R m are the resistance of the external load and the internal resistance of the semiconductor temperature difference battery, T h is the temperature of the hot end of the semiconductor thermoelectric cell, T c is the temperature of the cold end of the semiconductor thermoelectric cell.

[0050] like Figure 5 As shown, when the central control module distributes electric energy according to the total output power of the semiconductor thermoelectric power generation module, it can first determine whether the total output power is greater than the preset power threshold. If the total output power is greater than the preset power threshold, part of the electric energy is used for the power consumption of the sensors and indicator lights of each module, for example, the power consumption of the sensors and indicator lights of the monitoring system; the other part is used for the power consumption of electrical equipment and the charging of the battery pack in the energy storage device after the boost processing and AC / DC conversion processing, for example, the power consumption of the fan, the power consumption of the liquid cooling module and other electrical equipment. When the total output power is less than or equal to the preset power threshold, the power consumption of the sensors and indicator lights of each module is completed first, and then the central control module adjusts the power output of the battery pack and the semiconductor thermoelectric battery in the energy storage device, and then they are used together for the power consumption of the electrical equipment.

[0051] In addition to providing the liquid cooling thermal management system for the energy storage device described above, the embodiments of the present application also provide a control method for the liquid cooling thermal management system for the energy storage device. The liquid cooling thermal management system may be the liquid cooling thermal management system for the energy storage device shown in any of the embodiments described above, which will not be described in detail here.

[0052] In an embodiment of the present application, the control method of the above-mentioned liquid cooling thermal management system includes: when the temperature of the energy storage device is greater than or equal to a first preset threshold value, controlling the liquid cooling module and the semiconductor thermoelectric power generation module to work together, so that the liquid cooling module serves as a heat dissipation system for the semiconductor thermoelectric power generation module and the energy storage device, and the heat energy of the energy storage device is transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate in sequence by heat conduction, and the semiconductor thermoelectric power generation module converts heat energy into electrical energy based on the Seebeck effect of semiconductor thermoelectricity.

[0053] In one embodiment of the present application, the above-mentioned control method also includes: when the temperature of the energy storage device is less than or equal to a second preset threshold, the central control module drives the semiconductor temperature difference power generation module to reversely energize, converting the hot end into a heating end to heat the energy storage device; the second preset threshold is less than the first preset threshold.

[0054] In one embodiment of the present application, the control method further includes: when the temperature of the energy storage device is greater than a second preset threshold and less than a first preset threshold, reducing the power of the liquid cooling module or shutting down the liquid cooling module.

[0055] In one embodiment of the present application, the control method may further include: calculating the total output power of the semiconductor temperature difference power generation module, and distributing electric energy according to the total output power.

[0056] It should be noted that, for the sake of brevity of description, the execution process of the control method shown in the above-mentioned embodiments can refer to the description of the aforementioned embodiments, and will not be repeated here.

[0057] In one embodiment of the present application, the control method can be executed by a central control module in a liquid cooling thermal management system of an energy storage device, and the liquid cooling thermal management system of the energy storage device can also include a memory and a computer program stored in the memory and executable on the central control module. When the central control module executes the computer program, the steps in the above-mentioned control method embodiments are implemented.

[0058] The central control module may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0059] The memory may be an internal storage unit, such as a hard disk or a memory. The computer program may be divided into one or more units, and the one or more units are stored in the memory and executed by the central control module to complete the present application. The one or more units may be a series of computer program instruction segments capable of completing specific functions, and the instruction segments are used to describe the process of the computer program executing the control method in the terminal.

[0060] For example, the above-mentioned computer program can be divided into: a first control unit, which is used to control the liquid cooling module and the semiconductor thermoelectric power generation module to work together when the temperature of the energy storage device is greater than or equal to a first preset threshold value, so that the liquid cooling module serves as a heat dissipation system for the energy storage device and the semiconductor thermoelectric power generation module, and the heat energy of the energy storage device is transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate in sequence through heat conduction. The semiconductor thermoelectric power generation module converts heat energy into electrical energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of semiconductor thermoelectricity.

[0061] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0062] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0063] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0064] In the embodiments provided in the present application, it should be understood that the disclosed terminals and methods can be implemented in other ways. For example, the terminal embodiments described above are merely schematic. For example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or a feature can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through an interface, system or unit, which can be electrical, mechanical or other forms.

[0065] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0066] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0067] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the central processing module. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable medium does not include electric carrier signals and telecommunication signals.

[0068] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A liquid cooling thermal management system for energy storage equipment, characterized in that: The liquid cooling thermal management system comprises: a liquid cooling module and a semiconductor temperature difference power generation module; The hot end of the semiconductor temperature difference power generation module is in close contact with the bottom of the battery cell of the energy storage device, and the cold end of the semiconductor temperature difference power generation module is in close contact with the liquid cooling plate of the liquid cooling module; When the energy storage device needs to be cooled, the liquid cooling module serves as a heat dissipation system for the energy storage device and the semiconductor thermoelectric power generation module, so that the thermal energy of the energy storage device is transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate in sequence through heat conduction. The semiconductor thermoelectric power generation module converts the thermal energy into electrical energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of semiconductor thermoelectrics.

2. The liquid cooling thermal management system for energy storage equipment according to claim 1, characterized in that: The semiconductor temperature difference power generation module includes a plurality of semiconductor temperature difference batteries, and the distribution density between the semiconductor temperature difference batteries increases in sequence from the water inlet to the water outlet of the liquid cooling module flow channel.

3. The liquid cooling thermal management system for energy storage equipment according to claim 1, characterized in that: The liquid cooling thermal management system further comprises a central control module; the central control module is used to control the thermal management mode of the liquid cooling thermal management system; The central control module controls the thermal management mode of the liquid cooling thermal management system, including: when the temperature of the energy storage device is greater than or equal to a first preset threshold, the central control module controls the liquid cooling module and the semiconductor temperature difference power generation module to work together, and the liquid cooling module serves as a heat dissipation system for the energy storage device and the semiconductor temperature difference power generation module, so that the thermal energy of the energy storage device is transferred to the semiconductor temperature difference power generation module and the liquid cooling plate in sequence through heat conduction, and the semiconductor temperature difference power generation module converts the thermal energy into electrical energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of semiconductor thermoelectricity.

4. The liquid cooling thermal management system for energy storage equipment according to claim 3, characterized in that: The central control module controls the thermal management mode of the liquid cooling thermal management system further comprising: When the temperature of the energy storage device is less than or equal to a second preset threshold, the central control module drives the semiconductor temperature difference power generation module to reversely energize, converting the hot end into a heating end to heat the energy storage device; the second preset threshold is less than the first preset threshold.

5. The liquid cooling thermal management system for energy storage equipment according to claim 4, characterized in that: The central control module controls the thermal management mode of the liquid cooling thermal management system further comprising: When the temperature of the energy storage device is greater than the second preset threshold and less than the first preset threshold, the power of the liquid cooling module is reduced or the liquid cooling module is turned off.

6. The liquid cooling thermal management system for energy storage equipment according to any one of claims 3 to 5, characterized in that: The central control module is also used to calculate the total output power of the semiconductor temperature difference power generation module and distribute electric energy according to the total output power.

7. The liquid cooling thermal management system for energy storage equipment according to any one of claims 1 to 5, characterized in that: The liquid cooling plate is provided with a corresponding concave layer according to the array orientation of each semiconductor thermoelectric cell in the semiconductor thermoelectric power generation module and the size of each semiconductor thermoelectric cell.

8. The liquid cooling thermal management system for energy storage equipment according to any one of claims 1 to 5, characterized in that: A thermal conductive film or thermal conductive grease is provided between the battery pack of the energy storage device, the semiconductor temperature difference power generation module and the liquid cooling plate.

9. A control method for a liquid cooling thermal management system of an energy storage device, characterized in that: The liquid cooling thermal management system comprises: a liquid cooling module and a semiconductor temperature difference power generation module; the hot end of the semiconductor temperature difference power generation module is close to the bottom of the battery cell of the energy storage device, and the cold end of the semiconductor temperature difference power generation module is close to the liquid cooling plate of the liquid cooling module; the control method comprises: When the temperature of the energy storage device is greater than or equal to a first preset threshold, the liquid cooling module and the semiconductor thermoelectric power generation module are controlled to work together, so that the liquid cooling module serves as a heat dissipation system for the energy storage device and the semiconductor thermoelectric power generation module, and the thermal energy of the energy storage device is transferred to the semiconductor thermoelectric power generation module and the liquid cooling plate in sequence through heat conduction. The semiconductor thermoelectric power generation module converts the thermal energy into electrical energy based on the temperature difference between the hot end and the cold end and the Seebeck effect of semiconductor thermoelectricity.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by the central processing module, the steps of the control method described in claim 9 are implemented.

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