Clamp device for bonding micro-strip spacer ring assembly and use method of clamp device

Abstract

The invention discloses a clamp device for bonding a micro-strip spacer ring assembly and a using method thereof. The clamp device comprises a frame body unit. The clamping unit is arranged on the side portion of the frame body unit, the clamping unit comprises a placing cylinder used for placing a microstrip substrate, the placing cylinder is arranged on the top of the frame body unit, a middle pressing plate of a magnetic attraction permanent magnet is arranged on the top of the placing cylinder, and a fixing piece is arranged between the middle pressing plate and the placing cylinder. The outer side of the top surface of the permanent magnet is comprehensively wrapped by thermal shrinkage through alternate pushing thermal shrinkage of the heat conduction blocks corresponding to the side plate I and the side plate II, so that the microstrip substrate and the permanent magnet of which the outer sides are cleaned are relatively and completely wrapped and fixed by the fixing piece, the relative movement between the microstrip substrate and the permanent magnet which are adhered is reduced, the fixing piece plays a role in curing limitation, and the curing efficiency is improved. The glue is formed when the fixed part is coated relative to the microstrip substrate and the permanent magnet, so that the time consumption of a clamping and mounting process is reduced, and the product quality problem caused by the deviation of a bonding position is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of microstrip spacer rings, and in particular to a clamp device for bonding a microstrip spacer ring assembly and a use method thereof. Background Art

[0002] Microstrip spacer ring components are a key electronic component in the microwave industry. They are designed using the microwave gyromagnetic and non-reciprocal properties of ferrite materials and are used for inter-stage decoupling, impedance matching, duplexing and looping in microwave systems. They are widely used in the field of microwave communications.

[0003] Chinese patent CN202311048080.3 discloses a microstrip isolator circulator assembly with a shielding card, which relates to the technical field of isolator circulators. The assembly of the present invention includes a lower shielding card, a thin film circuit substrate is arranged at the top of the lower shielding card, a microstrip thin film circuit is arranged on the thin film circuit substrate, and the microstrip thin film circuit is formed by cascading a double Y junction circulator circuit and a double Y junction isolator circuit. Two dielectric sheets are arranged at the top of the thin film circuit substrate, and permanent magnets are arranged at the tops of the two dielectric sheets respectively. The tops of the two permanent magnets are fixedly connected with an upper shielding card. The above invention is a microstrip isolator circulator assembly with a shielding card, which is cascaded by a double Y junction circulator circuit and a double Y junction isolator circuit, and a matching block is added to adjust the matching between the two junctions to achieve excellent isolation; then, by bonding the shielding card above the magnetic field and tightly combining the upper and lower shielding cards of the product, an effective grounding and magnetic circuit are formed to solve the problems of mutual influence of products and cavity resonance.

[0004] The above patents and prior art have the following problems: The traditional bonding process of shielded microstrip spacer ring components is usually done by hand. The disadvantages of manual bonding are: First, one or more polytetrafluoroethylene dielectric blocks need to be placed during bonding to fix the position of the permanent magnet to prevent the permanent magnet from attracting the magnetic circuit or each other. This process often requires repeated rework to adjust the position of the permanent magnet, which is inefficient. Second, the inconsistent bonding positions lead to performance deviations, resulting in unqualified products in the finished products after curing, resulting in a lower pass rate; Third, the clamping state needs to be maintained continuously after bonding, and this single process is time-consuming. If the clamping is released prematurely, the bonding will not be completely cured, making it easy for the components to separate during subsequent processing or use. Summary of the invention

[0005] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: A clamp device for bonding a microstrip spacer ring assembly, comprising: Shelf unit; A clamping unit is provided on the side of the frame unit, the clamping unit comprises a placement cylinder for placing a microstrip substrate, the placement cylinder is provided on the top of the frame unit, a medium-pressure plate for magnetically attracting a permanent magnet is provided on the top of the placement cylinder, a fixing piece is provided between the medium-pressure plate and the placement cylinder, an upper frame plate and a lower frame plate are symmetrically provided at the upper and lower parts of the fixing piece, a scraping block for cleaning the connection surface between the microstrip substrate and the permanent magnet is provided on the side of the upper frame plate, a scraper is installed on the inner side of the scraping block, a round sticking roller and a heat-conducting block are provided on the side of the lower frame plate, and a heating chamber is provided inside the heat-conducting block.

[0007] As a preferred solution of the clamp device for bonding microstrip spacer ring components described in the present invention, wherein: the frame unit includes a base frame, the base frame is fixedly arranged at the bottom of a plurality of placement tubes, a fixing plate is fixedly connected to the middle end of the bottom surface of the base frame, a disengagement driving source is fixedly connected to the side of the fixing plate, the output shaft of the disengagement driving source is fixedly connected to the bottom inner plate, a disengagement rod is fixedly connected to the top of the bottom inner plate, and the disengagement rod is movably passed through the base frame and fixedly connected to the receiving plate inside the placement tube; The bottom surface of the base frame is fixedly connected with a base clamp driving source, the output shaft of the base clamp driving source is fixedly connected with a bottom outer plate, the top of the bottom outer plate is fixedly connected with a base clamp rod, and the base clamp rod movably passes through the base frame and is fixedly connected with the bottom surface of the lower frame plate.

[0008] As a preferred solution of the clamp device for bonding the microstrip spacer ring assembly of the present invention, wherein: the top of the bottom frame is fixedly connected to the top frame, the center of the top surface of the top frame is installed with an external pressure driving source, the output shaft of the external pressure driving source is fixedly connected to the top surface of the open frame, and the bottom of the open frame is fixedly connected to the external pressure plate; An internal pressure driving source is arranged on the side of the external pressure driving source, and an output shaft of the internal pressure driving source is fixedly connected to a common connecting plate, and the common connecting plate is fixedly connected to the middle pressure plate through a middle pressure rod at the bottom thereof; A top clamping drive source and a cutting drive source are sequentially arranged on the side of the internal pressure drive source, the output shaft of the top clamping drive source is fixedly connected to a synchronous plate, and the synchronous plate is fixedly connected to an upper frame plate through a top clamping rod at the bottom thereof; The output shaft of the cutting drive source is fixedly connected to the folding rod, and the cutting drive source is fixedly connected to the frame through the folding rod.

[0009] As a preferred solution of the clamp device for bonding microstrip spacer ring components of the present invention, wherein: the middle pressure plate is movably arranged inside the outer pressure plate; Two rollers are rotatably mounted on the side of the top frame, the two rollers are symmetrical about the center line of the top frame, and a fixing piece is wound around the surface of the rollers; A storage bin is provided on the outer side of the placing cylinder corresponding to the top surface of the bottom frame.

[0010] As a preferred solution of the clamp device for bonding microstrip spacer ring components of the present invention, wherein: the frame is composed of two side panels 1 and two side panels 2, and the adjacent side panels 1 are fixedly connected by side panels 2; Two third guide rails are arranged on the inner sides of the side panel 1 and the side panel 2, and the side panel 1 and the side panel 2 are fixedly connected to the cutting frame through the third guide rails, and a cutting knife is arranged at the bottom of the cutting frame; The inner side of the side panel 1 is fixedly connected with a first guide rail, and the inner side of the side panel 2 is fixedly connected with a second guide rail.

[0011] As a preferred solution of the clamp device for bonding microstrip spacer ring components of the present invention, wherein: the first guide rail is composed of a bottom straight section 1, a middle inclined section 1, a top straight section 1 and a top inclined section connected from bottom to top; The second guide rail is composed of a bottom straight section 2, a middle inclined section 2, a middle straight section, a top inner inclined section, a top outer inclined section and a top straight section 2 connected from bottom to top; The third guide rail is composed of a bottom straight section 3, a middle inclined section 3 and a top straight section 3 connected from bottom to top.

[0012] As a preferred solution of the fixture device for bonding the microstrip spacer ring assembly of the present invention, the distances between the bottom straight section 1, the middle oblique section 1, the top straight section 1 and the top oblique section and the placement tube decrease in sequence; The distances between the bottom straight section 2, the middle oblique section 2, the middle straight section, the top inner oblique section and the placement tube are reduced in sequence, while the distances between the top outer oblique section and the top straight section 2 and the placement tube are increased in sequence; The distances between the bottom straight section three, the middle oblique section three and the top straight section three and the placement tube decrease in sequence.

[0013] As a preferred solution of the clamp device for bonding the microstrip spacer ring assembly of the present invention, wherein: a vertical plate 1 is installed on the top of the upper frame plate, a scraping rod is movably installed inside the vertical plate 1, a rolling member 1 is arranged on the outer side of the scraping rod, a scraping block is fixedly connected to the inner side of the scraping rod, and a supporting member 1 is arranged between the rolling member 1 and the vertical plate 1; An open opening is provided on a side of the scraping block opposite to the scraping rod, and a scraper is provided at the bottom of the open opening.

[0014] As a preferred solution of the clamp device for bonding the microstrip spacer ring assembly of the present invention, wherein: the bottom of the lower frame plate is connected to a second vertical plate, a fitting rod is movably installed inside the second vertical plate, a second rolling member is installed outside the fitting rod, a fitting member is fixedly connected to the inside of the fitting rod, and a second supporting member is arranged between the second rolling member and the second vertical plate; A circular laminating roller is rotatably mounted on the inner side of the top of the laminating piece, a heat conducting block is fixedly connected to the bottom of the laminating piece, and a heating cavity is arranged at the bottom of the heat conducting block.

[0015] Another object of the present invention is to provide a method for using a clamp for bonding a microstrip spacer ring assembly in view of the deficiencies of the prior art, which comprises the following steps: Step 1: Initial loading: Pull the fixing piece out from the roll to cover the top of the placement cylinder, clamp it by the upper frame plate and the lower frame plate, then press the outer pressure plate and the middle pressure plate downward to make the fixing piece contact with the receiving plate, and then reset the outer pressure plate and the middle pressure plate; Step 2: Clamping installation: Place the microstrip substrate on the surface of the fixing part above the receiving plate, and then make the intermediate pressure plate adsorb the permanent magnet, and apply glue on the bottom surface of the permanent magnet, and then control the intermediate pressure plate and the receiving plate to close, so that the permanent magnet is installed on the surface of the microstrip substrate; Step 3: Active cleaning: by moving the upper frame plate and the lower frame plate upward, the scraper cleans the glue overflowing between the microstrip substrate and the permanent magnet during the upper frame plate moving upward; Step 4: Positioning restriction: By moving the lower frame plate upward, the circular roller rolls the fixing part onto the surface of the microstrip substrate and the permanent magnet, and then the heat conductive block shrinks the fixing part onto the surface of the microstrip substrate and the permanent magnet to restrict the position.

[0016] Beneficial effects of the present invention: 1. Start the outer pressure driving source and the inner pressure driving source, so that the outer pressure plate and the middle pressure plate at the bottom are moved down to the inside of the placement tube together, so that the middle part of the fixing part clamped by the upper frame plate and the lower frame plate at the top of the placement tube is pushed into the inside of the placement tube and contacts the receiving plate by the outer pressure plate and the middle pressure plate, thereby facilitating the subsequent placement of the microstrip substrate into the inside of the placement tube where the fixing part is laid, thereby reducing the production wear of the microstrip substrate relative to the placement tube.

[0017] Second, by pressing down the outer pressure plate and the middle pressure plate, the middle part of the fixing part can fully adapt to the space enclosed by the inner side of the placement tube and the top of the receiving plate for placing the microstrip substrate, and fill the enclosed space with the fixing part, so that the enclosed space is relatively elastically filled with the fixing part of flexible material, so that after the microstrip substrate is placed in the space enclosed by the receiving plate and the placement tube, the side of the microstrip substrate is elastically wrapped and restricted by the fixing part that is stamped and filled in the enclosed space, thereby reducing the shaking of the subsequent microstrip substrate after placement and installation, so that the microstrip substrate and the permanent magnet can be installed more accurately.

[0018] 3. After the permanent magnet and the microstrip substrate are bonded and contacted, the middle pressure plate and the receiving plate that is separated from the control of the driving source move up synchronously, so that the bottom of the microstrip substrate is exposed to the outside of the placement tube and corresponds to the top straight section three position, and then the upper frame plate and the lower frame plate move up synchronously, so that the sides of the microstrip substrate and the permanent magnet are blocked by the fixing parts clamped by the upper frame plate and the lower frame plate, and in the process of the upper frame plate moving up, it will drive the rolling member 1 along the bottom straight section three through the middle oblique section three to reach the inside of the top straight section three, so that the top straight section three pushes the rolling member 1 and the scraping rod and the scraping block to move inward, so that the four scraping blocks that initially have gaps in the bottom straight section three position move inward and combine, so that the area enclosed by the four scraping blocks matches the area of ​​the microstrip substrate, so that the scraping block is in contact with the microstrip substrate when the upper frame plate moves up, so that the glue overflowed from the squeeze contact between the microstrip substrate and the permanent magnet is scraped by the scraper and collected in the storage bin, thereby reducing the quality problems caused by excessive overflow of the bonding glue.

[0019] Fourth, the upper frame plate and the lower frame plate are moved upward synchronously to maintain the clamping state of the fixing part. At this time, the fixing part is located between the receiving plate and the bonding part. When the rolling part 2 on the side of the side plate 1 and the side plate 2 passes through the bottom straight section 1 and the bottom straight section 2 and the middle oblique section 1 and the middle oblique section 2 of the same length, it will enter the top straight section 1 and the middle straight section respectively, so that the distance between the top straight section 1 and the middle straight section and the placement tube is reduced relative to the distance between the bottom straight section 1 and the middle oblique section 1 and the bottom straight section 2 and the middle oblique section 2 and the placement tube, thereby generating extrusion, so that the top straight section 1 and the middle straight section push the rolling part 2, the bonding rod and the bonding part to move inward, so that the bonding parts that initially have remaining gaps corresponding to the side of the side plate 1 and the first guide rail are combined inward, so that the area enclosed by the bonding parts matches the area of ​​the microstrip substrate, so that as the lower frame plate continues to During the continuous upward movement, the rolling element 2 continues to move upward with the lower frame plate, and continues to move along the top straight section 1 and the middle straight section. In the process, the circular roller rolls the fixed element to the side of the microstrip substrate and the permanent magnet, and starts the resistance wire inside the heating chamber, so that the relatively flat fixed element after being rolled by the circular roller is swept by the heat-conducting block at the bottom of the circular roller as the circular roller moves upward, so that the heat-conducting block outputs heat to the fixed element after being flattened by the circular roller, so that the fixed element shrinks to the side of the microstrip substrate and the permanent magnet. At this time, the center of the fixed element is relatively clamped by the microstrip substrate and the receiving plate, and the outer side of the fixed element is clamped and lifted by the upper frame plate and the lower frame plate, so that the microstrip substrate and the permanent magnet are convenient to be taken from the surface of the receiving plate as a whole after being covered by the fixed element, so that the clamping unit can quickly cover and fix the next group of microstrip substrates and permanent magnets.

[0020] 5. When the rolling part 2 corresponding to the side plate 2 passes through the middle straight section and enters the interior of the top outer inclined section, the heating chamber at the bottom of the fitting part corresponding to the side plate 2 fits to the top of the side plate 2 corresponding to the permanent magnet, so that the heating chamber heats and shrinks the fixing part corresponding to the side plate 2 to the top surface of the permanent magnet, that is, the outside of the surface contacted by the middle pressure plate, so that the fixing part heat-shrinks and covers the outside of the top surface of the permanent magnet.

[0021] 6. The heat shrinkage is promoted alternately by the heat conductive blocks corresponding to the side panels 1 and 2, so that the outer side of the top surface of the permanent magnet is fully covered by heat shrinkage, so that the fixing piece can relatively completely cover and fix the microstrip substrate and the permanent magnet that have been cleaned on the outer side, so that the microstrip substrate and the permanent magnet are relatively fixed, thereby reducing the relative movement between the adhesion of the two, and making the fixing piece act as a curing restriction, so that the glue is formed in the fixing piece relative to the microstrip substrate and the permanent magnet, reducing the time consumption of the clamping installation process, and the covering of the fixing piece is also convenient for the subsequent storage and transportation of the microstrip substrate and the permanent magnet. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the following is a brief introduction to the drawings required for describing the embodiment, wherein: Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the top structure connection of the chassis of the present invention; Figure 3 for Figure 2 A schematic diagram of the enlarged structure of part A; Figure 4 This is a schematic diagram of the connection of the clamping unit structure of the present invention; Figure 5 This is a schematic diagram of the internal structure connection of the framework of the present invention; Figure 6 It is a schematic diagram of the structural connection of the first guide rail, the second guide rail and the third guide rail of the present invention; Figure 7 It is a schematic diagram of the closed structure connection between the upper frame plate and the lower frame plate of the present invention; Figure 8 This is a schematic diagram of the upper frame plate structure connection of the present invention; Fig. 9 This is a schematic diagram of the connection of the scraper block structure of the present invention; Fig.10 This is a schematic diagram of the connection of the lower frame plate structure of the present invention; Fig.11 This is a schematic diagram of the connection structure of the clamping fixture of the upper frame plate and the lower frame plate of the present invention; Fig.12 It is a schematic diagram of the process of the present invention.

[0023] In the figure: 1. Frame unit; 101. bottom frame; 1011. fixing plate; 1012. disengagement drive source; 10121. bottom inner plate; 10122. disengagement rod; 10123. receiving plate; 1013. bottom clamping drive source; 1014. bottom outer plate; 10141. bottom clamping rod; 1015. storage bin; 102. top frame; 103. winding roller; 104. external pressure drive source; 1041. opening frame; 1042. external pressure plate; 105. internal pressure drive source; 1051. common connecting plate; 1052. middle pressure rod; 1053. middle pressure plate; 106. top clamping drive source; 1061. synchronous plate; 1062. top clamping rod; 107. cutting drive source; 1071. folding rod; 1072. bending connecting rod; 2. Clamping unit; 201. Frame; 2011. Side panel 1; 2012. First guide rail; 20121. Bottom straight section 1; 20122. Middle oblique section 1; 20123. Top straight section 1; 20124. Top oblique section; 2013. Side panel 2; 2014. Second guide rail; 20141. Bottom straight section 2; 20142. Middle oblique section 2; 20143. Middle straight section; 20144. Top inner oblique section; 20145. Top outer oblique section; 20146. Top straight section 2; 2015. Third guide rail; 20151. Bottom straight section 3; 20152. Middle oblique section 3; 20153. Top Straight section three; 2016, cutting frame; 20161, cutting knife; 202, placing cylinder; 203, upper frame plate; 2031, vertical plate one; 2032, scraping rod; 2033, rolling member one; 2034, supporting member one; 2035, scraping block; 20351, storage bin; 20352, opening; 20353, scraper; 204, lower frame plate; 2041, vertical plate two; 2042, laminating rod; 2043, rolling member two; 2044, supporting member two; 2045, laminating member; 20451, round laminating roller; 20452, heat conducting block; 20453, heating chamber; 3. Fixing parts. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Embodiment 1

[0025] like Figure 1-11 As shown, a fixture device for bonding a microstrip spacer ring assembly comprises: Shelf unit 1; The clamping unit 2 is provided on the side of the frame unit 1, and the clamping unit 2 includes a placement tube 202 for placing the microstrip substrate, and the placement tube 202 is arranged on the top of the frame unit 1, and a medium pressure plate 1053 for magnetically attracting a permanent magnet is arranged on the top of the placement tube 202, and a fixing part 3 is arranged between the medium pressure plate 1053 and the placement tube 202, and the fixing part 3 is preferably a heat shrinkable film, and an upper frame plate 203 and a lower frame plate 204 are symmetrically arranged at the upper and lower parts of the fixing part 3, and a scraping block 2035 for cleaning the connection surface between the microstrip substrate and the permanent magnet is arranged on the side of the upper frame plate 203, and a scraper 20353 is installed on the inner side of the scraping block 2035, and a round sticking roller 20451 and a heat conductive block 20452 are arranged on the side of the lower frame plate 204, and a heating chamber 20453 is arranged inside the heat conductive block 20452.

[0026] like Figure 1-3 As shown, the frame unit 1 includes a base frame 101, the base frame 101 is fixedly arranged at the bottom of a plurality of placement cylinders 202, a fixing plate 1011 is fixedly connected to the middle end of the bottom surface of the base frame 101, a disengagement driving source 1012 is fixedly connected to the side of the fixing plate 1011, an output shaft of the disengagement driving source 1012 is fixedly connected to a bottom inner plate 10121, a disengagement rod 10122 is fixedly connected to the top of the bottom inner plate 10121, and the disengagement rod 10122 movably passes through the base frame 101 and is fixedly connected to a receiving plate 10123 inside the placement cylinder 202; The bottom surface of the base frame 101 is fixedly connected to a bottom clamp driving source 1013, the output shaft of the bottom clamp driving source 1013 is fixedly connected to a bottom outer plate 1014, the top of the bottom outer plate 1014 is fixedly connected to a bottom clamp rod 10141, and the bottom clamp rod 10141 is movable through the base frame 101 and is fixedly connected to the bottom surface of the lower frame plate 204.

[0027] like Figure 1-3 As shown, the top of the bottom frame 101 is fixedly connected to the top frame 102, the center of the top surface of the top frame 102 is installed with an external pressure driving source 104, the output shaft of the external pressure driving source 104 is fixedly connected to the top surface of the open frame 1041, and the bottom of the open frame 1041 is fixedly connected to an external pressure plate 1042; An internal pressure driving source 105 is provided on the side of the external pressure driving source 104, and the internal pressure driving source 105 is installed on the top surface of the top frame 102. The output shaft of the internal pressure driving source 105 is fixedly connected with a common connecting plate 1051, and the common connecting plate 1051 is fixedly connected with a medium pressure rod 1052 and a medium pressure plate 1053 at the bottom thereof; A top clamping driving source 106 and a cutting driving source 107 are sequentially arranged on the side of the internal pressure driving source 105, and the top clamping driving source 106 and the cutting driving source 107 are both fixedly connected to the top surface of the top frame 102, and the output shaft of the top clamping driving source 106 is fixedly connected to a synchronous plate 1061, and the synchronous plate 1061 is fixedly connected to the upper frame plate 203 through a top clamping rod 1062 at its bottom; The output shaft of the cutting drive source 107 is fixedly connected to the folding rod 1071 , the cutting drive source 107 is fixedly connected to the frame 201 via the folding rod 1071 , and adjacent frames 201 are fixedly connected via a bent connecting rod 1072 .

[0028] The disengagement drive source 1012, bottom clamping drive source 1013, external pressure drive source 104, internal pressure drive source 105, top clamping drive source 106 and cutting drive source 107 are all cylinders or electric telescopic cylinders, which are controlled by a unified PLC and powered by external energy.

[0029] like Figure 1-6 As shown, the middle pressure plate 1053 is movably arranged inside the outer pressure plate 1042, and the combined area of ​​the middle pressure plate 1053 and the outer pressure plate 1042 matches the inner area of ​​the placement cylinder 202; Two rollers 103 are rotatably mounted on the side of the top frame 102. The two rollers 103 are symmetrical about the center line of the top frame 102. A fixing member 3 is wound around the surface of the rollers 103. A storage compartment 1015 is provided on the outer side of the placement tube 202 corresponding to the top surface of the base frame 101 .

[0030] like Figure 1-6 As shown, the frame 201 is composed of two side panels 1 2011 and two side panels 2013, and the adjacent side panels 1 2011 are fixedly connected by the side panels 2 2013; Two third guide rails 2015 are disposed on the inner sides of the side panel 1 2011 and the side panel 2 2013. The side panel 1 2011 and the side panel 2 2013 are fixedly connected to a cutting frame 2016 through the third guide rails 2015. A cutting knife 20161 is disposed at the bottom of the cutting frame 2016. The inner side of the side panel 1 2011 is fixedly connected with a first guide rail 2012 , and the inner side of the side panel 2 2013 is fixedly connected with a second guide rail 2014 .

[0031] like Figure 1-6 As shown, the first guide rail 2012 is composed of a bottom straight section 20121, a middle inclined section 20122, a top straight section 20123 and a top inclined section 20124 connected from bottom to top; The second guide rail 2014 is composed of a bottom straight section 20141, a middle inclined section 20142, a middle straight section 20143, a top inner inclined section 20144, a top outer inclined section 20145 and a top straight section 20146 connected from bottom to top; The third guide rail 2015 is composed of a bottom straight section 3 20151, a middle inclined section 3 20152 and a top straight section 3 20153 connected from bottom to top.

[0032] like Figure 1-6 As shown, the distances between the bottom straight section 1 20121, the middle oblique section 1 20122, the top straight section 1 20123 and the top oblique section 20124 and the placement tube 202 decrease in sequence; The distances between the bottom straight section 20141, the middle oblique section 20142, the middle straight section 20143, the top inner oblique section 20144 and the placement tube 202 are reduced in sequence, and the distances between the top outer oblique section 20145 and the top straight section 20146 and the placement tube 202 are increased in sequence; The distances between the bottom straight section 3 20151, the middle oblique section 3 20152 and the top straight section 3 20153 and the placement tube 202 decrease successively.

[0033] It should be noted that the bottom straight section 20121 and the middle inclined section 1 20122 correspond to the height positions of the bottom straight section 20141 and the middle inclined section 20142, and the height of the top straight section 1 20123 is the same as the total height of the middle straight section 20143, the top inner inclined section 20144, the top outer inclined section 20145 and the bottom half of the top straight section 2 20146. The sides of the first guide rail 2012, the second guide rail 2014 and the third guide rail 2015 are all provided with baffles to facilitate the movement of the rolling element 1 2033 in the third guide rail 2015, and the movement of the rolling element 2 2043 inside the first guide rail 2012 and the second guide rail 2014.

[0034] like Figure 5-11 As shown, a vertical plate 2031 is installed on the top of the upper frame plate 203, a scraper rod 2032 is movably installed inside the vertical plate 2031, a rolling member 2033 is arranged on the outside of the scraper rod 2032, a scraper block 2035 is fixedly connected to the inside of the scraper rod 2032, a supporting member 2034 is arranged between the rolling member 2033 and the vertical plate 2031, and the rolling member 2033 is movably arranged inside the third guide rail 2015; An opening 20352 is formed on the side of the scraper block 2035 opposite to the scraper rod 2032 . A scraper 20353 is disposed at the bottom of the opening 20352 . A storage bin 20351 is disposed inside the scraper 20353 .

[0035] like Figure 5-11 As shown, the bottom of the lower frame plate 204 is connected to the second vertical plate 2041, the second vertical plate 2041 is movably installed with a fitting rod 2042, the outer side of the fitting rod 2042 is installed with a second rolling member 2043, the inner side of the fitting rod 2042 is fixedly connected with a fitting member 2045, a second supporting member 2044 is arranged between the second rolling member 2043 and the second vertical plate 2041, and the second rolling members 2043 corresponding to the first side plate 2011 and the second side plate 2013 are movably arranged inside the first guide rail 2012 and the second guide rail 2014 respectively; A round pasting roller 20451 is rotatably installed on the inner side of the top of the pasting part 2045, and a heat-conducting block 20452 is fixedly connected to the bottom of the pasting part 2045. The material of the heat-conducting block 20452 is made of heat-conducting material, such as copper. A heating chamber 20453 is provided at the bottom of the heat-conducting block 20452. A heating resistance wire is installed inside the heating chamber 20453, which is controlled by a unified PLC and powered by external energy. The rolling member 1 2033 and the rolling member 2 2043 are preferably rolling wheels or universal balls, and the support member 1 2034 and the support member 2 2044 are preferably springs.

[0036] Operation process: The fixing member 3 on the winding roller 103 on one side of the top frame 102 is passed through the bottom of the top frame 102 and wound onto the surface of the winding roller 103 on the other side of the top frame 102, so that the top of the placement cylinder 202 on the top of the bottom frame 101 is provided with the fixing member 3, and then the bottom clamping driving source 1013 and the top clamping driving source 106 are started, so that the bottom clamping driving source 1013 and the top clamping driving source 106 respectively control the bottom clamping rod 10141 and the top clamping rod 1062 to move in opposite directions, so that the multiple groups of upper frame plates 203 and lower frame plates 204 clamp the fixing member 3 at the top of the placement cylinder 202, so that the fixing member 3 is clamped by the multiple groups of upper frame plates 203 and lower frame plates 204 in different areas; Then, the external pressure driving source 104 and the internal pressure driving source 105 are started, so that the outer pressure plate 1042 and the middle pressure plate 1053 at the bottom thereof are moved down together to the inside of the placing tube 202, so that the middle part of the fixing member 3 clamped by the upper frame plate 203 and the lower frame plate 204 at the top of the placing tube 202 is pushed into the inside of the placing tube 202 and contacts the receiving plate 10123 by the outer pressure plate 1042 and the middle pressure plate 1053, thereby facilitating the subsequent placement of the microstrip substrate into the inside of the placing tube 202 where the fixing member 3 is laid, thereby reducing the production wear of the microstrip substrate relative to the placing tube 202; The downward pressure of the outer pressure plate 1042 and the middle pressure plate 1053 can make the middle part of the fixing member 3 fully adapt to the space for placing the microstrip substrate formed by the inner side of the placement tube 202 and the top of the receiving plate 10123, and fill the inside of the enclosed space through the fixing member 3, so that the inside of the enclosed space is relatively elastically filled by the fixing member 3 made of flexible material, so that after the microstrip substrate is placed in the space enclosed by the receiving plate 10123 and the placement tube 202, the side of the microstrip substrate is elastically wrapped and restricted by the fixing member 3 that is pressed and filled in the enclosed space, thereby reducing the shaking of the subsequent microstrip substrate after placement and installation, so that the microstrip substrate and the permanent magnet are installed more accurately; After the fixing part 3 is punched into the inside of the placing tube 202, the middle pressure plate 1053 and the outer pressure plate 1042 are lifted successively, so that air can enter between the outer pressure plate 1042 and the fixing part 3, and the situation that the outer pressure plate 1042 lifts up the fixing part 3 is reduced, and then the microstrip substrate to be bonded is manually placed on the top of the receiving plate 10123, and then the permanent magnet to be bonded is placed on the corresponding bottom of the middle pressure plate 1053, so that the iron middle pressure plate 1053 is adsorbed to the top middle part of the permanent magnet, and there is still space between it and the edge of the permanent magnet, and glue is applied to the bottom of the permanent magnet, and then the cutting drive source 107 is started, so that the cutting drive source 107 drives the frame 201 to move downward through the folding rod 1071, and then the frame 201 and the bending connecting rod 1072 are synchronously moved downward to make the cutting at the bottom of the frame 201 When the knife 20161 moves downward, it presses down and cuts the fixing member 3 clamped by the upper frame plate 203 and the lower frame plate 204 between the adjacent frames 201, so that the cutting knife 20161 cuts the fixing member 3 into pieces, and then the cutting frame 2016 continues to move downward and finally contacts the top surface of the accommodating bin 1015, so that the cutting knife 20161 is inserted into the interior of the accommodating bin 1015, thereby reaching the final position. When the frame 201 moves downward to the final position, the four rolling members 1 2033 on the side of the upper frame plate 203 all enter the interior of the bottom straight section 3 20151, and the rolling members 2 2043 on the side of the side plate 1 2011 and the side plate 2 2013 respectively enter the interior of the bottom straight section 1 20121 and the bottom straight section 2 20141, thereby completing the installation preparation between the microstrip substrate and the permanent magnet; At this time, the internal pressure driving source 105 controls the middle pressure plate 1053 at the bottom to move downward, so that the middle pressure plate 1053 drives the magnetically attracted permanent magnet at the bottom to move downward and contact the microstrip substrate inside the placement tube 202, thereby completing the bonding of the microstrip substrate and the permanent magnet, and then the bonding of the microstrip substrate and the permanent magnet is made more accurate through the cooperation of the middle pressure plate 1053 and the placement tube 202, thereby reducing unnecessary adjustments; It should be noted that, in order to ensure sufficient separation of the permanent magnet and the intermediate pressure plate 1053, the intermediate pressure plate 1053 can be preferably an electromagnet so that the intermediate pressure plate 1053 is powered off and separated when it is separated from the permanent magnet.

[0037] When the permanent magnet and the microstrip substrate are in contact with each other, the middle pressure plate 1053 and the receiving plate 10123 which is controlled by the detachment driving source 1012 are synchronously moved upward, so that the bottom of the microstrip substrate is exposed from the outside of the placement tube 202 and corresponds to the position of the top straight section three 20153, and then the upper frame plate 203 and the lower frame plate 204 are synchronously moved upward, so that the side of the microstrip substrate and the permanent magnet are blocked by the fixing member 3 clamped by the upper frame plate 203 and the lower frame plate 204, and in the process of the upper frame plate 203 moving upward, the rolling member 1 2033 is driven to pass through the middle oblique section three 20152 along the bottom straight section three 20151 to reach the inside of the top straight section three 20153, so that the top straight section three 2015 3. Push the rolling element 1 2033, the scraping rod 2032 and the scraping block 2035 to move inward, so that the four scraping blocks 2035 initially with gaps left at the bottom straight section 3 20151 are moved inward to combine, so that the area enclosed by the four scraping blocks 2035 matches the area of ​​the microstrip substrate, so that when the scraping block 2035 moves upward with the upper frame plate 203, the open mouth 20352 of the scraping block 2035 contacts the microstrip substrate, so that the microstrip substrate and the permanent magnet are squeezed and contacted, and the overflowed glue is scraped by the scraper 20353 and collected in the storage bin 20351, thereby reducing the quality problem caused by excessive overflow of the bonding glue; During the upward movement of the upper frame plate 203, it moves upward synchronously with the lower frame plate 204 to maintain the clamping state of the fixing member 3. At this time, the fixing member 3 is located between the receiving plate 10123 and the fitting member 2045. When the rolling member 2043 on the side of the side plate 1 2011 and the side plate 2013 passes through the interior of the bottom straight section 1 20121 and the bottom straight section 20141 of the same length and the interior of the middle oblique section 1 20122 and the middle oblique section 20142, it will enter the interior of the top straight section 1 20123 and the middle straight section 20143 respectively, so that the top straight section 2011 The distance between the top straight section 123 and the middle straight section 20143 and the placement cylinder 202 is reduced relative to the distance between the bottom straight section 1 20121 and the middle oblique section 1 20122 and the bottom straight section 2 20141 and the middle oblique section 2 20142 and the placement cylinder 202, thereby generating an extrusion, so that the top straight section 1 20123 and the middle straight section 20143 push the rolling element 2043, the fitting rod 2042 and the fitting element 2045 to move inward, so that the fitting element 2045 with a gap initially remaining corresponding to the side plate 1 2011 and the side of the first guide rail 2012 is assembled inward, so that the fitting element 20 The area enclosed by 45 matches the area of ​​the microstrip substrate, so that as the lower frame plate 204 continues to move upward, the rolling element 2043 continues to move upward with the lower frame plate 204, and continues to move along the top straight section 1 20123 and the middle straight section 20143, and in this process, the round roller 20451 rolls the fixing element 3 to the side of the microstrip substrate and the permanent magnet, and starts the resistance wire inside the heating chamber 20453, so that the fixing element 3, which is relatively flat after being rolled by the round roller 20451, is heat-conducted by the bottom of the round roller 20451 as the round roller 20451 moves upward. The block 20452 is swept over, so that the heat-conducting block 20452 outputs heat to the fixing part 3 that has been flattened by the round pasting roller 20451, so that the fixing part 3 is heat-shrunk to the side of the microstrip substrate and the permanent magnet. At this time, the center of the fixing part 3 is relatively clamped by the microstrip substrate and the receiving plate 10123, and the outer side of the fixing part 3 is clamped and raised by the upper frame plate 203 and the lower frame plate 204, so that the microstrip substrate and the permanent magnet are convenient to be taken from the surface of the receiving plate 10123 after being coated by the fixing part 3, so that the clamping unit 2 can quickly coat and fix the next group of microstrip substrates and permanent magnets; Then, when the rolling member 2043 corresponding to the side plate 2013 passes through the middle straight section 20143 and enters the interior of the top outer inclined section 20145, the heating chamber 20453 at the bottom of the fitting member 2045 corresponding to the side plate 2013 is fitted to the top of the side plate 2013 corresponding to the permanent magnet, so that the heating chamber 20453 heats and shrinks the fixing member 3 on the side of the side plate 2013 to the top surface of the permanent magnet, that is, the outside of the surface contacted by the middle pressure plate 1053, so that the fixing member 3 heats and shrinks the outside of the top surface of the permanent magnet; At this time, the rolling element 1 2033 corresponding to the side plate 1 2011 will continue to move along the inside of the top straight section 1 20123. When the rolling element 2043 corresponding to the side plate 2013 moves to the inside of the top outer inclined section 20145 along with the lifting of the lower frame plate 204, the rolling element 2043 corresponding to the side plate 2013 drives the heat conducting block 20452 and the fitting member 2045 to withdraw to the outside of the microstrip substrate under the spatial coordination of the support element 2 2044 and the top outer inclined section 20145 relative to the top inner inclined section 20144, and when the rolling element 2043 corresponding to the side plate 2013 moves to the top straight section 2 20146, it completely withdraws from the contact with the microstrip substrate. At this time, the rolling element 2043 corresponding to the side panel 1 2011 moves to the inside of the top inclined section 20124 and under the continuous lifting of the lower frame plate 204, the fitting element 2045 corresponding to the side panel 1 2011 is guided and squeezed by the top inclined section 20124 on the shrinking space of the rolling element 2043, so that the fitting element 2045 moves toward the top center of the permanent magnet. At this time, the bottom surface of the heat conductive block 20452 is in contact with the top of the microstrip substrate. It should be noted that the height of the heat conductive block 20452 corresponding to the side panel 1 2011 is higher than the height of the heat conductive block 20452 corresponding to the second guide rail 2014, so that the heat conductive block 20452 heat shrinks the fixing element 3 on the side of the microstrip substrate corresponding to the side panel 1 2011 to the top surface of the permanent magnet, thereby alternately pushing the heat conductive blocks 20452 corresponding to the side panel 1 2011 and the side panel 2 2013 to push the outer surface of the top surface of the permanent magnet to shrink. The sides are fully heat-shrink-wrapped, so that the fixing part 3 can relatively completely wrap and fix the cleaned outer microstrip substrate and permanent magnet, that is, all positions except the magnetic attraction position of the middle pressure plate 1053 relative to the permanent magnet are wrapped, so that the microstrip substrate and the permanent magnet are relatively fixed, thereby reducing the relative movement between the adhesion of the two. At the same time, the wrapping and fixing of the fixing part 3 can also be completed after the wrapping is completed, so that the upper frame plate 203 and the lower frame plate 204 continue to be lifted, so that the workers can remove the wrapped microstrip substrate and permanent magnet through the gap between the adjacent bottom straight sections 20141, so that the fixing part 3 acts as a curing limiter, so that the glue is formed in the wrapping of the fixing part 3 relative to the microstrip substrate and the permanent magnet, reducing the product quality problems caused by the offset of the bonding position, reducing the time-consuming clamping and installation process, and the wrapping of the fixing part 3 is also convenient for the subsequent storage and transportation of the microstrip substrate and the permanent magnet. Embodiment 2

[0038] like Fig.12 As shown, this embodiment provides a method for using a clamp for bonding a microstrip spacer ring assembly, which includes the following steps: Step 1, initial loading: Pull the fixing member 3 out of the winding roller 103 to cover the top of the placing cylinder 202, and clamp it by the upper frame plate 203 and the lower frame plate 204, then press the outer pressure plate 1042 and the middle pressure plate 1053 downward, so that the fixing member 3 contacts the receiving plate 10123, and then reset the outer pressure plate 1042 and the middle pressure plate 1053; Step 2: Clamping and installation: Place the microstrip substrate on the surface of the fixing member 3 above the receiving plate 10123, and then make the intermediate pressure plate 1053 adsorb the permanent magnet, and apply glue on the bottom surface of the permanent magnet, and then control the intermediate pressure plate 1053 and the receiving plate 10123 to close, so that the permanent magnet is installed on the surface of the microstrip substrate; Step 3: Active cleaning: by moving the upper frame plate 203 and the lower frame plate 204 upward, the scraper 20353 cleans the glue overflowing between the microstrip substrate and the permanent magnet during the upper frame plate 203 moving upward; Step 4: Positioning restriction: by moving the lower frame plate 204 upward, the round roller 20451 rolls the fixing part 3 onto the surface of the microstrip substrate and the permanent magnet, and then the heat conductive block 20452 heat shrinks the fixing part 3 onto the surface of the microstrip substrate and the permanent magnet to restrict the position.

[0039] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0040] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A fixture device for bonding a microstrip spacer ring assembly, characterized in that: include: Frame unit (1); A clamping unit (2), wherein the side of the frame unit (1) is provided with the clamping unit (2), the clamping unit (2) comprises a placement tube (202) for placing a microstrip substrate, the placement tube (202) is arranged on the top of the frame unit (1), a middle pressure plate (1053) with a magnetic permanent magnet is arranged on the top of the placement tube (202), a fixing member (3) is arranged between the middle pressure plate (1053) and the placement tube (202), and the upper and lower parts of the fixing member (3) are An upper frame plate (203) and a lower frame plate (204) are symmetrically arranged, a scraping block (2035) for cleaning the connection surface between the microstrip substrate and the permanent magnet is arranged on the side of the upper frame plate (203), a scraper (20353) is installed on the inner side of the scraping block (2035), a round sticking roller (20451) and a heat conducting block (20452) are arranged on the side of the lower frame plate (204), and a heating chamber (20453) is arranged inside the heat conducting block (20452).

2. The fixture device for bonding microstrip spacer ring components according to claim 1, characterized in that: The frame unit (1) comprises a base frame (101), the base frame (101) is fixedly arranged at the bottom of a plurality of placement cylinders (202), a fixing plate (1011) is fixedly connected to the middle end of the bottom surface of the base frame (101), a disengagement drive source (1012) is fixedly connected to the side of the fixing plate (1011), an output shaft of the disengagement drive source (1012) is fixedly connected to a bottom inner plate (10121), a disengagement rod (10122) is fixedly connected to the top of the bottom inner plate (10121), and the disengagement rod (10122) movably passes through the base frame (101) and is fixedly connected to a receiving plate (10123) inside the placement cylinder (202); The bottom surface of the bottom frame (101) is fixedly connected to a bottom clamp driving source (1013); the output shaft of the bottom clamp driving source (1013) is fixedly connected to a bottom outer plate (1014); the top of the bottom outer plate (1014) is fixedly connected to a bottom clamp rod (10141); the bottom clamp rod (10141) movably passes through the bottom frame (101) and is fixedly connected to the bottom surface of the lower frame plate (204).

3. The fixture device for bonding microstrip spacer ring components according to claim 2, characterized in that: The top of the bottom frame (101) is fixedly connected to the top frame (102); an external pressure driving source (104) is installed at the center of the top surface of the top frame (102); the output shaft of the external pressure driving source (104) is fixedly connected to the top surface of the open frame (1041); and the bottom of the open frame (1041) is fixedly connected to the external pressure plate (1042); An internal pressure driving source (105) is disposed on the side of the external pressure driving source (104); an output shaft of the internal pressure driving source (105) is fixedly connected to a common connecting plate (1051); and the common connecting plate (1051) is fixedly connected via a medium pressure rod (1052) and a medium pressure plate (1053) at the bottom thereof; A top clamping drive source (106) and a cutting drive source (107) are sequentially arranged on the side of the internal pressure drive source (105); an output shaft of the top clamping drive source (106) is fixedly connected to a synchronous plate (1061); and the synchronous plate (1061) is fixedly connected to an upper frame plate (203) via a top clamping rod (1062) at its bottom; The output shaft of the cutting drive source (107) is fixedly connected to the folding rod (1071), and the cutting drive source (107) is fixedly connected to the frame (201) via the folding rod (1071).

4. The fixture device for bonding microstrip spacer ring components according to claim 3, characterized in that: The middle pressure plate (1053) is movably arranged inside the outer pressure plate (1042); Two rolling rollers (103) are rotatably mounted on the side of the top frame (102), the two rolling rollers (103) are symmetrical about the center line of the top frame (102), and the surfaces of the rolling rollers (103) are wound with fixing members (3); A receiving chamber (1015) is provided on the outer side of the placement cylinder (202) corresponding to the top surface of the bottom frame (101).

5. The fixture device for bonding microstrip spacer ring components according to claim 3, characterized in that: The frame (201) is composed of two side panels one (2011) and two side panels two (2013), and adjacent side panels one (2011) are fixedly connected via the side panels two (2013); Two third guide rails (2015) are arranged on the inner sides of the side panel 1 (2011) and the side panel 2 (2013); the side panel 1 (2011) and the side panel 2 (2013) are fixedly connected to a cutting frame (2016) via the third guide rails (2015); and a cutting knife (20161) is arranged at the bottom of the cutting frame (2016); The inner side of the side panel 1 (2011) is fixedly connected to a first guide rail (2012), and the inner side of the side panel 2 (2013) is fixedly connected to a second guide rail (2014).

6. The fixture device for bonding microstrip spacer ring components according to claim 5, characterized in that: The first guide rail (2012) is composed of a bottom straight section 1 (20121), a middle inclined section 1 (20122), a top straight section 1 (20123), and a top inclined section (20124) connected from bottom to top; The second guide rail (2014) is composed of a second bottom straight section (20141), a second middle inclined section (20142), a middle straight section (20143), a top inner inclined section (20144), a top outer inclined section (20145), and a second top straight section (20146) connected from bottom to top; The third guide rail (2015) is composed of a bottom straight section three (20151), a middle inclined section three (20152) and a top straight section three (20153) connected from bottom to top.

7. The fixture device for bonding microstrip spacer ring components according to claim 6, characterized in that: The distances between the bottom straight section 1 (20121), the middle inclined section 1 (20122), the top straight section 1 (20123), and the top inclined section (20124) and the placement tube (202) decrease in sequence; The distances between the bottom straight section 2 (20141), the middle oblique section 2 (20142), the middle straight section (20143), the top inner oblique section (20144) and the placement tube (202) are successively reduced, and the distances between the top outer oblique section (20145) and the top straight section 2 (20146) and the placement tube (202) are successively increased; The distances between the bottom straight section three (20151), the middle oblique section three (20152) and the top straight section three (20153) and the placement tube (202) decrease in sequence.

8. The fixture device for bonding microstrip spacer ring components according to claim 7, characterized in that: A vertical plate 1 (2031) is installed on the top of the upper frame plate (203), a scraping rod (2032) is movably installed inside the vertical plate 1 (2031), a rolling member 1 (2033) is arranged on the outside of the scraping rod (2032), a scraping block (2035) is fixedly connected to the inside of the scraping rod (2032), and a supporting member 1 (2034) is arranged between the rolling member 1 (2033) and the vertical plate 1 (2031); An open opening (20352) is provided on a side of the scraping block (2035) opposite to the scraping rod (2032), and a scraper (20353) is provided at the bottom of the open opening (20352).

9. The fixture device for bonding microstrip spacer ring components according to claim 6, characterized in that: The bottom of the lower frame plate (204) is connected to a second vertical plate (2041); a fitting rod (2042) is movably installed inside the second vertical plate (2041); a second rolling member (2043) is installed on the outside of the fitting rod (2042); a fitting member (2045) is fixedly connected to the inside of the fitting rod (2042); and a second supporting member (2044) is provided between the second rolling member (2043) and the second vertical plate (2041); A circular laminating roller (20451) is rotatably mounted on the inner side of the top of the laminating member (2045), a heat conducting block (20452) is fixedly connected to the bottom of the laminating member (20455), and a heating chamber (20453) is provided at the bottom of the heat conducting block (20452).

10. A method for using a clamp for bonding a microstrip spacer ring assembly, applied to a clamp device for bonding a microstrip spacer ring assembly as claimed in any one of claims 3 to 9, characterized in that: The following steps are involved: Step 1, initial loading: the fixing member (3) is pulled out from the winding roller (103) to cover the top of the placing cylinder (202), clamped by the upper frame plate (203) and the lower frame plate (204), and then the outer pressure plate (1042) and the middle pressure plate (1053) are pressed down to make the fixing member (3) contact with the receiving plate (10123), and then the outer pressure plate (1042) and the middle pressure plate (1053) are reset; Step 2: Clamping and installing: placing the microstrip substrate on the surface of the fixing member (3) above the receiving plate (10123), allowing the intermediate pressure plate (1053) to adsorb the permanent magnet, and applying glue to the bottom surface of the permanent magnet, and then controlling the intermediate pressure plate (1053) and the receiving plate (10123) to close, so that the permanent magnet is installed on the surface of the microstrip substrate; Step 3: Active cleaning: by moving the upper frame plate (203) and the lower frame plate (204) upward, the scraper (20353) cleans the glue overflowing between the microstrip substrate and the permanent magnet during the upward movement of the upper frame plate (203); Step 4: Positioning and limiting: by moving the lower frame plate (204) upward, the circular pasting roller (20451) rolls the fixing part (3) onto the surface of the microstrip substrate and the permanent magnet, and then the heat conductive block (20452) heat-shrunk the fixing part (3) onto the surface of the microstrip substrate and the permanent magnet to limit the position.

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