Transparent antenna and manufacturing method thereof

By using the imprinting process to form flat conductive lines during the production process of transparent antennas, the problems of uneven convexity and pollution of conductive lines in the prior art are solved, and the aesthetics and environmental protection of the antenna are improved.

CN119447777APending Publication Date: 2025-02-14SHENZHEN SUNWAY COMM
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Patent Information

Application Number
CN202411494421.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-24
Publication Date
2025-02-14

AI Technical Summary

Technical Problem

The existing methods for producing transparent antennas have problems such as uneven convexity of conductive lines and the use of large amounts of etching liquid, which leads to contamination.

Method used

Imprinting process is used to form isolation glue blocks and conductive lines on the transparent base film, the conductive lines are filled in the line groove, and a flat conductive lines are formed through curing treatment.

Benefits of technology

The conductive lines are flush with the isolation rubber block, which improves the flatness between the conductive lines and the transparent base film, enhances the aesthetics of the antenna, and reduces pollution.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the invention provides a transparent antenna and a manufacturing method thereof. The transparent antenna includes: a transparent base film; any one surface of the transparent base film in the first direction is a coating surface; a plurality of isolation rubber blocks; the plurality of isolation rubber blocks are uniformly arranged on the coating surface of the transparent base film at preset target intervals, and a wire slot can be formed between every two adjacent isolation rubber blocks; a plurality of conductive circuits; each conductive circuit is filled in one wire slot, and the conductive circuit has a size matched with that of the wire slot; the conductive circuit is flush with the wire slot in the first direction, and the target distance is smaller than 5 microns; the first direction is the thickness direction of the transparent base film. According to the manufacturing method of the transparent antenna, the flatness between the conductive circuit and the transparent base film can be effectively improved, so that the attractiveness of the transparent antenna is improved; in addition, the manufacturing method of the transparent antenna can effectively reduce pollution.
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Description

Technical Field

[0001] The present invention relates to the technical field of antennas, and in particular to a transparent antenna and a manufacturing method thereof. Background Art

[0002] Antennas are one of the most important components in wireless communication systems, used to transmit and receive electromagnetic waves. With the rapid development of 5G wireless communication technology, the application scenarios of antennas are becoming more and more diverse, making users' performance requirements for antennas more and more diverse.

[0003] With the development of antenna miniaturization and integration, transparent antennas have gradually become a research hotspot. Transparent antennas have a wide range of application scenarios in screens, windows and wearable products. Transparent antennas are not only visually beautiful, but also have great value in saving space and enhancing signal transmission.

[0004] Transparent antennas have high transmittance to visible light. In order to achieve visual transparency of transparent antennas, the conductive circuits of the transparent antennas need to be fine enough so that they cannot be detected by the naked eye.

[0005] Research has found that true visual transparency can only be achieved when the line width of the conductive circuit (that is, the target spacing of the wire groove) is below 5um (um means micrometer).

[0006] Currently, the manufacturing method of transparent antennas often adopts the Metal-Mesh process (a process that uses conductive metal materials such as silver, copper or their oxides to form an extremely fine metal mesh on a transparent base film; in other words, the Metal-Mesh process is a metal mesh process).

[0007] In the prior art, the traditional method of making transparent antennas still has some defects:

[0008] (1) The conductive circuits prepared by the traditional method of making transparent antennas are convex and uneven.

[0009] (2) The traditional method of making transparent antennas requires a large amount of etching solution, which will cause serious pollution. Summary of the invention

[0010] The transparent antenna and the manufacturing method thereof provided by the present invention are intended to solve at least part of the defects of the existing transparent antenna and the manufacturing method thereof.

[0011] In a first aspect, the present invention provides a transparent antenna. The transparent antenna comprises:

[0012] A transparent base film; any one surface of the transparent base film in the first direction is a coating surface;

[0013] A plurality of isolation rubber blocks; the plurality of isolation rubber blocks are evenly arranged on the coating surface of the transparent base film at a preset target spacing, and a line groove can be formed between two adjacent isolation rubber blocks;

[0014] A plurality of conductive circuits; each of the conductive circuits is filled in one of the wire slots, and the conductive circuit has a size that matches the wire slot;

[0015] The conductive circuit is flush with the wire slot in the first direction, and the target spacing is less than 5 um;

[0016] Wherein, the first direction is the thickness direction of the transparent base film.

[0017] In some embodiments, the conductive circuit is made of conductive paste; the transparent base film is made of PET material or COP material; and the isolation rubber block is made of acrylic resin glue or silicone resin glue.

[0018] In a second aspect, the present invention provides a method for manufacturing a transparent antenna. The method for manufacturing the transparent antenna comprises:

[0019] Make an embossing die;

[0020] An optical adhesive layer is provided on the transparent base film of the transparent antenna, and the optical adhesive layer is coated on the coating surface of the transparent base film;

[0021] The optical adhesive layer is extruded by the embossing mold, so that a plurality of isolation adhesive blocks of the transparent antenna are formed on the optical adhesive layer, and a wire groove with a target spacing can be formed between two adjacent isolation adhesive blocks;

[0022] Conductive slurry is poured into the wire groove, and after being cured, a conductive circuit of the transparent antenna is formed.

[0023] In some embodiments, making an imprinting mold comprises:

[0024] providing a mold substrate;

[0025] Coating a layer of photoresist on the mold substrate, wherein the photoresist has a size that matches the optical adhesive layer;

[0026] After the photoresist is subjected to exposure / development treatment, a plurality of protrusions protruding from the surface of the mold substrate can be formed, and the protrusions have a size that matches the wire groove;

[0027] The mold substrate and the plurality of protrusions are electroplated to form the imprint mold.

[0028] In some embodiments, the mold substrate is made of PET material or COP material, and the optical adhesive layer is made of acrylic resin adhesive or silicone resin adhesive.

[0029] In some embodiments, the optical adhesive layer or each of the isolation adhesive blocks has a first size in a first direction;

[0030] The photoresist or each of the protrusions has a second size in the second direction, and each of the protrusions has a third size in the third direction;

[0031] The first size is equal to the second size; the third size is equal to the target spacing, and both are less than 5um;

[0032] Wherein, the first direction is the thickness direction of the transparent base film; the second direction is the thickness direction of the mold substrate; and the third direction is the arrangement direction of a plurality of the protrusions and is orthogonal to the second direction.

[0033] In some embodiments, the imprinting mold extrude the optical adhesive layer along the first direction according to a preset target working condition;

[0034] Wherein, the target working condition includes: a pressure parameter for squeezing the optical adhesive layer and a time parameter for squeezing the optical adhesive layer.

[0035] In some embodiments, the pressure parameter is 20 kg, and the time parameter is 30 s.

[0036] In some embodiments, the conductive paste is filled into the wire groove, and the conductive paste flowing into the wire groove is cured according to preset target parameters;

[0037] Wherein, the target parameters include: curing power and curing time.

[0038] In some embodiments, the curing power is 1000 W, and the curing time is 40 min.

[0039] At least one beneficial effect of the transparent antenna and the manufacturing method thereof provided by the embodiments of the present invention is: a new type of transparent antenna and the manufacturing method thereof are proposed, and a stamping process is used to make the conductive circuit and the isolation rubber block flush with each other while ensuring visual transparency or having good optical properties, thereby effectively increasing the flatness between the conductive circuit and the transparent base film, and further increasing the aesthetics of the transparent antenna; at the same time, in the preparation process of the conductive circuit, since the stamping process is used instead of the traditional Metal-Mesh process, the use of a large amount of etching solution can be effectively avoided, so the manufacturing method of the transparent antenna can also effectively reduce pollution. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent the same elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0041] Figure 1 A schematic diagram of the structure of a transparent antenna provided in Embodiment 1 of the present invention;

[0042] Figure 2 A flow chart of a method for making a transparent antenna provided by an embodiment of the present invention;

[0043] Figure 3 The embodiment of the present invention provides Figure 2 , showing the steps of making an imprinting mold;

[0044] Figure 4 A schematic diagram of the structure of a photoresist coated on a mold substrate provided in Embodiment 1 of the present invention;

[0045] Figure 5 A schematic diagram of the structure of an imprinting mold provided in Embodiment 1 of the present invention;

[0046] Figure 6 A schematic diagram of the structure of a transparent antenna provided in Embodiment 2 of the present invention;

[0047] Figure 7 A schematic diagram of the structure of a photoresist coated on a mold substrate provided in the second embodiment of the present invention;

[0048] Figure 8 This is a schematic structural diagram of an imprinting mold provided in Embodiment 2 of the present invention.

[0049] Reference numerals:

[0050] 100, transparent antenna; 1001, first direction; 1, transparent base film; 2, isolation rubber block; 201, wire slot; 3, conductive circuit;

[0051] 200, imprinting mold; 2001, mold substrate; 2002, photoresist; 2003, protrusion; 2004, second direction; 2005, third direction;

[0052] 300, transparent antenna; 3001, transparent base film; 3002, isolation rubber block; 3003, wire slot; 3004, conductive circuit;

[0053] 400, imprinting mold; 4001, mold substrate; 4002, photoresist; 4003, protrusion. DETAILED DESCRIPTION

[0054] The present invention is described in detail below in conjunction with specific embodiments. It should be emphasized that the following description is merely illustrative and is not intended to limit the scope of the present invention and its application.

[0055] It should be noted that, unless otherwise clearly specified and limited, the terms "first direction", "second direction", "third direction", "length direction", "width direction", "thickness direction", "axial direction", "circumferential direction", etc. used in this specification to indicate orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. The terms such as "installation", "fitting", "connection" and "fixation" should be understood in a broad sense. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; "fixation" can be bolted, snap-fitted or glued; the terms "first", "second" and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated; thus, the features defined as "first", "second" and "third" may explicitly or implicitly include one or more of the features; "multiple" or "several" means two or more; in addition, "and / or" includes any and all combinations of one or more related listed items; for ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0057] In this embodiment, the specific implementation of the “transparent antenna and its manufacturing method” is not limited, and those skilled in the art can selectively use any appropriate implementation method according to actual needs.

[0058] Embodiment 1:

[0059] Figure 1 This is a schematic diagram of the structure of a transparent antenna provided in Embodiment 1 of the present invention.

[0060] See also Figure 1 The transparent antenna 100 includes: a transparent base film 1, a plurality of isolation rubber blocks 2 and a plurality of conductive circuits 3.

[0061] In the embodiment of the present application, the transparent base film 1 may be rectangular, and may also be in a roll shape; the plurality of isolation rubber blocks 2 and the plurality of conductive circuits 3 are all in a straight line shape.

[0062] Specifically, when the transparent base film 1 is rectangular, the isolation rubber block 2 and the conductive circuit 3 are arranged along the length direction of the transparent base film 1 and extend along the width direction of the transparent base film 1 .

[0063] To further illustrate, when the transparent base film 1 is in a roll shape, the isolation rubber block 2 and the conductive circuit 3 are arranged along the circumferential direction of the transparent base film 1 and extend along the axial direction of the transparent base film 1 .

[0064] Any surface of the transparent base film 1 in the first direction 1001 is a coating surface, and the first direction 1001 is a thickness direction of the transparent base film 1 .

[0065] In addition, a plurality of isolation rubber blocks 2 are evenly arranged on the coating surface of the transparent base film 1 at a preset target interval, and a linear groove 201 can be formed between two adjacent isolation rubber blocks 2 .

[0066] In addition, each conductive circuit 3 is filled in a wire groove 201, and the conductive circuit 3 has a size that matches the wire groove 201; in other words, the groove width of the wire groove 201 (the groove width is the above-mentioned target spacing) is the line width of the conductive circuit 3; specifically, in order to achieve true visual transparency, it is necessary to control the line width of the conductive circuit 3 to be below 5um (um means micrometer); that is, the above-mentioned target spacing is less than 5um.

[0067] Moreover, in order to solve the flatness between the conductive circuit 3 and the transparent base film 1, the conductive circuit 3 needs to be flush with the wire groove 201 in the first direction 1001; that is, the line thickness of the conductive circuit 3 in the first direction 1001 should be equal to the groove depth of the wire groove 201 in the first direction 1001.

[0068] In some embodiments, Figure 1 As shown, the conductive circuit 3 is made of conductive paste (the conductive paste can be silver paste or copper paste); the transparent base film 1 is made of PET (Polyethylene Terephthalate); and the isolation adhesive block 2 is made of acrylic resin adhesive.

[0069] It should be noted that PET is a thermoplastic polyester with high tensile strength and modulus. Therefore, PET not only has the advantages of high strength, high rigidity and recyclability, but also has excellent film-forming and formability. Among them, since PET is recyclable, the transparent antenna 100 uses PET material as the transparent base film 1, which helps to reduce pollution to the environment.

[0070] It can be understood that acrylic resin glue not only has excellent viscosity, but also has excellent transparency and environmental protection. Among them, since the transparent antenna 100 uses acrylic resin glue as the isolation glue layer, the acrylic resin glue is not only very suitable for bonding with transparent materials (for example, the above-mentioned transparent base film 1) to improve the transparency of the transparent antenna 100, but also has better environmental protection. In other words, using acrylic resin glue as the isolation glue layer can make the transparent antenna 100 further have the advantages of both aesthetics and low pollution.

[0071] Figure 2 A flow chart of a method for manufacturing a transparent antenna provided in an embodiment of the present invention.

[0072] Please refer to Figure 2 The method for making the transparent antenna includes but is not limited to the following steps:

[0073] 10. Make an embossing mold.

[0074] 20. An optical adhesive layer is disposed on the transparent base film of the transparent antenna, and the optical adhesive layer is coated on the coating surface of the transparent base film.

[0075] 30. The optical adhesive layer is extruded by a stamping mold to form a plurality of isolation adhesive blocks of the transparent antenna on the optical adhesive layer, and a wire groove with a target spacing can be formed between two adjacent isolation adhesive blocks.

[0076] 40. The conductive slurry is poured into the wire groove, and after being cured, a conductive circuit of the transparent antenna is formed.

[0077] Figure 3 The embodiment of the present invention provides Figure 2 , showing the steps of making an imprinting mold.

[0078] In some embodiments, in combination Figure 2 and Figure 3 As shown, the above step 10 includes:

[0079] 101. Provide a mold substrate.

[0080] 102. A layer of photoresist is coated on the mold substrate, and the photoresist has a size that matches the optical adhesive layer.

[0081] 103. After the photoresist is exposed and developed, a plurality of protrusions protruding from the surface of the mold substrate can be formed, and the protrusions have a size that matches the wire groove.

[0082] 104. Perform electroplating on the mold substrate and the plurality of protrusions to form an imprint mold.

[0083] Figure 4This is a schematic diagram of the structure in which the photoresist provided in the first embodiment of the present invention is coated on the mold substrate. Figure 5 This is a schematic structural diagram of the imprint mold provided in Embodiment 1 of the present invention.

[0084] In some embodiments, according to Figure 4-Figure 5 It can be seen that the mold substrate 2001 is also made of PET, and the optical adhesive layer (not shown in the figure) is made of acrylic resin glue; in addition, since several isolation adhesive blocks 2 are formed by extruding the above-mentioned optical adhesive layer through the imprinting mold 200, the isolation adhesive blocks 2 and the optical adhesive layer have the same material and thickness.

[0085] In some embodiments, Figure 4-Figure 5 It can be seen that the optical adhesive layer or each isolation adhesive block 2 has a first size in the first direction 1001 .

[0086] The photoresist 2002 or each protrusion 2003 has a second size in the second direction 2004 , and each protrusion 2003 has a third size in the third direction 2005 .

[0087] In addition, the first dimension is equal to the second dimension (in other words, the depth of the groove 201 is equal to the thickness of the protrusion 2003); the third dimension is equal to the target spacing (in other words, the width of the protrusion 2003 is equal to the target spacing), and the above third dimension and target spacing are both less than 5um.

[0088] In addition, the first direction is the thickness direction of the transparent base film; the second direction 2004 is the thickness direction of the mold substrate 2001 ; and the third direction 2005 is the arrangement direction of the plurality of protrusions 2003 , and is orthogonal to the second direction 2004 .

[0089] In the embodiment of the present application, the above-mentioned mold substrate 2001 has a matching shape and size with the transparent base film 1; that is, when the transparent base film 1 is rectangular, the mold substrate 2001 is also rectangular; and, when the transparent base film 1 is in a roll shape, the mold substrate 2001 is also in a roll shape, thereby realizing roll-to-roll production, providing important ideas for the development of the transparent antenna 100.

[0090] In some embodiments, in combination Figure 4-Figure 5 It can be known that the imprinting mold 200 extrude the optical adhesive layer along the first direction 1001 according to the preset target working condition.

[0091] It should be noted that the target working conditions include: pressure parameters for extruding the optical adhesive layer and time parameters for extruding the optical adhesive layer.

[0092] In some embodiments, the pressure parameter is 20 kg (kg represents kilograms), and the time parameter is 30 s (s represents seconds).

[0093] In some embodiments, the conductive paste is filled into the wire groove 201 , and the conductive paste flowing into the wire groove 201 is cured according to preset target parameters.

[0094] It is understood that the target parameters include: curing power and curing time.

[0095] In some embodiments, the curing power is 1000 W (W means watt), and the curing time is 40 min (min means minute).

[0096] Specifically, the conductive paste can be cured by using an ultraviolet lamp.

[0097] In the embodiments of this application, refer to Figure 1-Figure 5 It can be seen that, first, 50um PET is used as the mold substrate 2001, and the traditional exposure-development-electroplating method is used to obtain the imprint mold 200; secondly, 50um PET is used as the transparent base film 1, and a layer of optical adhesive layer with a thickness of 2.5um is coated on the coated surface of the above transparent base film 1; then, the above optical adhesive layer is pre-cured at a temperature of 40℃ (℃ represents degrees Celsius) for 30 minutes; then, the optical adhesive layer after the pre-curing treatment is cooled to room temperature; then, the above imprint mold 200 is used to extrude the above optical adhesive layer that has been pre-cured with a pressure of 20kg, and after 30s of extrusion, a number of line grooves 201 with a groove width (groove width refers to the above target spacing) of 5um, a groove depth of 2.5um and a groove pitch of 100um can be obtained; finally, a UV-curable conductive paste is used to fill it into the interior of the line groove 201 by printing, and then a curing power of 1 is used. After curing with a 1000W ultraviolet lamp and 40 minutes of curing time, a plurality of conductive lines 3 with a line width of 5um can be obtained, thereby manufacturing the transparent antenna 100.

[0098] Embodiment 2:

[0099] Figure 6 This is a schematic diagram of the structure of a transparent antenna provided in Embodiment 2 of the present invention.

[0100] In the embodiments of this application, please refer to Figure 6 The transparent base film 3001 of the transparent antenna 300 is made of COP (CycloOlefin Polymer); the isolation glue block 3002 is made of silicone resin glue.

[0101] It should be noted that COP is an amorphous polymer and an amorphous transparent polymer material with a ring structure. Therefore, COP not only has the characteristics of high transparency, but also has the advantage of high heat resistance. Among them, since COP has high transparency, the transparent antenna 300 uses COP material as the transparent base film 3001, which helps to improve the transparency of the transparent antenna 300, thereby increasing the aesthetics of the transparent antenna 300.

[0102] It can be understood that silicone resin glue can simultaneously possess the dual characteristics of organic resin and inorganic material, and has unique physical and chemical properties; for example, silicone resin glue has excellent electrical properties, and can achieve better moisture-proof, anti-corona and electrical insulation functions; and silicone resin glue also has the advantage of being easy to use, and can reduce the use of primer, thereby effectively reducing the bonding cost and reducing the pollution generated when making the transparent antenna 300.

[0103] Figure 7 This is a schematic diagram of the structure in which the photoresist provided in the second embodiment of the present invention is coated on the mold substrate. Figure 8 This is a schematic structural diagram of an imprinting mold provided in Embodiment 2 of the present invention.

[0104] In some embodiments, Figure 7-Figure 8 As shown, the mold substrate 4001 of the imprint mold 400 is also made of COP, and the isolation rubber block 3002 or the optical adhesive layer (not shown in the figure) coated on the transparent base film 3001 is made of silicone resin glue; in addition, since a plurality of isolation rubber blocks 3002 are formed by extruding the above-mentioned optical adhesive layer through the imprint mold 400, the isolation rubber block 3002 and the optical adhesive layer have the same thickness.

[0105] Specifically, first, a photoresist 4002 is coated on the mold substrate 4001 ; then, the photoresist 4002 is subjected to exposure / development treatment to form a plurality of protrusions 4003 , and then subjected to electroplating treatment to form the final imprint mold 400 .

[0106] In the embodiment of the present application, Figure 6-Figure 8It can be seen that, first, a 50um COP is used as the mold substrate 4001, and the traditional exposure-development-electroplating method is used to obtain the imprint mold 400; secondly, a 50um COP is used as the transparent base film 3001, and a layer of optical adhesive layer with a thickness of 2um is coated on the coated surface of the above transparent base film 3001; then, the above optical adhesive layer is pre-cured at a temperature of 35°C for 30 minutes; then, the optical adhesive layer after the pre-curing treatment is cooled to room temperature; then, the above imprint mold 400 is used to extrude the above optical adhesive layer that has been pre-cured with a pressure of 20kg, and after 30s of extrusion, a number of line grooves 3003 with a groove width (groove width refers to the above target spacing) of 4um, a groove depth of 2um and a groove pitch of 100um can be obtained; finally, a UV-curable conductive paste is used to fill it into the interior of the line groove 3003 by printing, and then a curing power of 1 is used. After curing with a 000W ultraviolet lamp and 40 minutes of curing time, a plurality of conductive lines 3004 with a line width of 4um can be obtained, thereby manufacturing the transparent antenna 300.

[0107] Figure 1 This is a schematic diagram of the structure of a transparent antenna provided in Embodiment 1 of the present invention. Figure 6 This is a schematic diagram of the structure of a transparent antenna provided in Embodiment 2 of the present invention.

[0108] Please refer to Figure 1 and Figure 6 According to the transparent antenna 100 described in the first embodiment and the transparent antenna 300 described in the second embodiment, corresponding conductive properties and optical properties can be obtained.

[0109] Specifically, Figure 1 As shown, in the first embodiment, the square resistance of the transparent antenna 100 is 1Ω / sq (Ω / sq represents ohms per square), and the light transmittance of the transparent antenna 100 is 82%; Figure 6 As shown, in the second embodiment, the square resistance of the transparent antenna 300 is 1.5Ω / sq, and the light transmittance of the transparent antenna 300 is 85%.

[0110] It should be noted that square resistance, also known as antenna impedance, is the resistance property of the antenna input end; further explained, reducing square resistance can improve certain performances of the antenna to a certain extent (for example, improving the stability of the resonant frequency).

[0111] In summary, combined with Figure 1 and Figure 6 It can be seen that the transparent antenna 100 described in the first embodiment and the transparent antenna 300 described in the second embodiment are both manufactured by nanoimprinting technology, and not only have low square resistance, but also have good optical properties (optical properties can refer to transmittance).

[0112] To further explain, nanoimprint lithography (NIL) is a printing technology that transfers the micro-nano structure on the imprint template to the material to be processed, and through high temperature or ultraviolet light curing, the micro-nano structure on the imprint template can be accurately replicated on the material to be processed.

[0113] In summary, the transparent antenna and its manufacturing method provided in the embodiment of the present invention adopts a stamping process to make the conductive circuit and the isolation rubber block flush with each other while ensuring visual transparency or having good optical properties, thereby effectively increasing the flatness between the conductive circuit and the transparent base film, and further increasing the aesthetics of the transparent antenna; at the same time, in the preparation process of the conductive circuit, since the stamping process is used instead of the traditional Metal-Mesh process, the use of a large amount of etching liquid can be effectively avoided, so the manufacturing method of the transparent antenna can also effectively reduce pollution. Therefore, the transparent antenna and its manufacturing method provided in the embodiment of the present invention have certain novelty compared with the traditional transparent antenna and its manufacturing method.

[0114] The above contents are further detailed descriptions of the present invention in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A transparent antenna, characterized in that: include: Transparent base film; Any one surface of the transparent base film in the first direction is a coating surface; A plurality of isolation rubber blocks; the plurality of isolation rubber blocks are evenly arranged on the coating surface of the transparent base film at a preset target spacing, and a line groove can be formed between two adjacent isolation rubber blocks; A plurality of conductive circuits; each of the conductive circuits is filled in one of the wire slots, and the conductive circuit has a size that matches the wire slot; The conductive circuit is flush with the wire slot in the first direction, and the target spacing is less than 5um; Wherein, the first direction is the thickness direction of the transparent base film.

2. The transparent antenna according to claim 1, characterized in that: The conductive circuit is made of conductive paste; the transparent base film is made of PET material or COP material; and the isolation rubber block is made of acrylic resin glue or silicone resin glue.

3. A method for manufacturing a transparent antenna, characterized in that: include: Make an embossing die; An optical adhesive layer is provided on the transparent base film of the transparent antenna according to any one of claims 1 to 2, and the optical adhesive layer is coated on the coating surface of the transparent base film; The optical adhesive layer is extruded by the embossing mold, so that a plurality of isolation adhesive blocks of the transparent antenna are formed on the optical adhesive layer, and a wire groove with a target spacing can be formed between two adjacent isolation adhesive blocks; Conductive slurry is poured into the wire groove, and after being cured, a conductive circuit of the transparent antenna is formed.

4. The method for manufacturing a transparent antenna according to claim 3, characterized in that: The making of an imprinting mold comprises: providing a mold substrate; Coating a layer of photoresist on the mold substrate, wherein the photoresist has a size that matches the optical adhesive layer; After the photoresist is subjected to exposure / development treatment, a plurality of protrusions protruding from the surface of the mold substrate can be formed, and the protrusions have a size that matches the wire groove; The mold substrate and the plurality of protrusions are electroplated to form the imprint mold.

5. The method for manufacturing a transparent antenna according to claim 4, characterized in that: The mold substrate is made of PET material or COP material, and the optical adhesive layer is made of acrylic resin adhesive or silicone resin adhesive.

6. The method for manufacturing a transparent antenna according to claim 4, characterized in that: The optical adhesive layer or each of the isolation adhesive blocks has a first size in a first direction; The photoresist or each of the protrusions has a second size in the second direction, and each of the protrusions has a third size in the third direction; The first size is equal to the second size; The third dimension is equal to the target spacing, and both are less than 5um; Wherein, the first direction is the thickness direction of the transparent base film; the second direction is the thickness direction of the mold substrate; and the third direction is the arrangement direction of a plurality of the protrusions and is orthogonal to the second direction.

7. The method for manufacturing a transparent antenna according to claim 6, characterized in that: The imprinting mold extrude the optical adhesive layer along the first direction according to a preset target working condition; Wherein, the target working condition includes: a pressure parameter for squeezing the optical adhesive layer and a time parameter for squeezing the optical adhesive layer.

8. The method for manufacturing a transparent antenna according to claim 7, characterized in that: The pressure parameter is 20 kg, and the time parameter is 30 s.

9. The method for manufacturing a transparent antenna according to claim 3, characterized in that: Filling the conductive paste into the wire groove, and curing the conductive paste flowing into the wire groove according to preset target parameters; Wherein, the target parameters include: curing power and curing time.

10. The method for manufacturing a transparent antenna according to claim 9, characterized in that: The curing power is 1 000 W, and the curing time is 40 min.