Pressing method for printed circuit board production

Abstract

The invention discloses a press fit method for printed circuit board production, and relates to the technical field of printed circuit boards, the press fit method comprises a first fixing box, the lower surface of the first fixing box is fixedly connected with supporting legs, and the right side of the first fixing box is fixedly connected with a second fixing box. Through the action of a second hydraulic rod, a fixing plate fixedly connected to the upper surface of the second hydraulic rod moves downwards, meanwhile, a motor is started, a second gear fixedly connected to the lower surface of the motor rotates, and therefore a first gear rotates; a rotating column fixedly connected in an inner cavity of a first gear in a sleeved mode rotates under the action of a steel ball and a fixing column, a press-fit structure rotates to the position above a supporting table under the action of the rotating column, a fixing plate moves upwards to the lower surface of a square plate under the action of a second hydraulic rod, and therefore the square plate is fixed; and the rotating column and the pressing structure are greatly fixed, so that the purpose of quickly changing the size of the pressing plate according to requirements is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit boards, and in particular to a pressing method for producing printed circuit boards. Background Art

[0002] PCB, whose Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing technology, it is called a "printed" circuit board. At present, the existing printed circuit board production uses a pressing device.

[0003] For example, the Chinese patent with publication number CN114554695A discloses a pressing method for printed circuit board production, including a support table and a pressing mechanism, the bottom of the support table is fixedly connected to a bottom plate, the top outer wall of the bottom plate is fixedly connected to vertical plates near the edges on both sides, the tops of the two vertical plates are fixedly connected to the same top plate, the top of the pressing mechanism is fixedly connected to the bottom of the top plate, the pressing mechanism is located directly above the support table, the center position of the top outer wall of the support table is fixed with a raised platform by bolts, and the top outer wall of the support table is fixedly connected to four positioning strips. The present invention is a pressing device for printed circuit board production and a pressing method thereof, in the process of producing printed circuit boards, two raw material boards of the printed circuit board can be reciprocatingly lifted and lowered for pressing, and can also be pressed while rotating during pressing, which improves the comprehensiveness of pressing the raw material boards.

[0004] The existing technology has the following problems: When the pressing method for printed circuit board production is in use, the existing pressing method for printed circuit board production is not convenient for quickly adjusting the size of the pressing plate according to needs; when the pressing method for printed circuit board production is in use, the existing pressing method for printed circuit board production cannot play a good buffering role; when the pressing method for printed circuit board production is in use, the existing pressing method for printed circuit board production is complicated, the process flow is long, and it is not convenient to use. Summary of the invention

[0005] The present invention provides a pressing method for producing a printed circuit board to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: A pressing method for producing printed circuit boards comprises a fixing box 1, a lower surface of which is fixedly connected with supporting legs, and a fixing box 2 is fixedly connected to the right side of the fixing box 1.

[0007] The inner cavity of the fixed box one is movably sleeved with a rotating column, the lower surface of the rotating column is fixedly connected with a small pressing structure, the right side of the rotating column is fixedly connected with a large pressing structure, the bottom of the inner cavity of the fixed box one and located below the small pressing structure is fixedly connected with a support platform, the upper surface of the rotating column is overlapped with a steel ball, the upper surface of the steel ball overlaps with the inner cavity of the fixed box two, the inner cavity of the rotating column is movably sleeved with a fixed column, the right side of the fixed column is fixedly connected with the inner cavity of the fixed box two, the outer wall of the rotating column and located on the right side of 923 is fixedly sleeved with gear one, the upper surface of the gear one is overlapped with gear two, and the upper surface of the gear two is fixedly connected with a motor.

[0008] The pressing structure includes a connecting block, the upper surface of the connecting block is fixedly connected to the lower surface of the rotating column, the inner cavity of the connecting block is fixedly connected to a hydraulic rod 1, the lower surface of the hydraulic rod 1 is fixedly connected to a pressure plate 1, the inner cavity of the pressure plate 1 is movably sleeved with a fixed cylinder, and the upper surface of the fixed cylinder and the upper surface of the pressure plate 1 are fixedly connected to a fixed circular plate.

[0009] A further improvement of the technical solution of the present invention is that: the upper surface of the motor is fixedly connected to the top of the inner cavity of the second fixed box, and a square plate is fixedly connected to the right side of the rotating column.

[0010] A further improvement of the technical solution of the present invention is that the inner cavity of the square plate is movably sleeved with the outer wall of the fixed column, and the lower surface of the square plate is overlapped with a fixed plate.

[0011] A further improvement of the technical solution of the present invention is that: a second hydraulic rod is fixedly connected to the lower surface of the fixed plate, and the lower surface of the second hydraulic rod is fixedly connected to the bottom of the inner cavity of the second fixed box.

[0012] A further improvement of the technical solution of the present invention is that a spring is movably sleeved on the outer wall of the fixed cylinder and located on the lower surface of the first pressure plate, and the upper surface of the spring is fixedly connected to the lower surface of the first pressure plate.

[0013] A further improvement of the technical solution of the present invention is that: a second pressing plate is fixedly connected to the lower surface of the spring, and an upper surface of the second pressing plate is fixedly connected to the lower surface of the fixed cylinder.

[0014] A further improvement of the technical solution of the present invention is that the specific steps include: step one, arranging steel plates with organic films containing water-soluble organic films on two surfaces on the top and bottom surfaces of the circuit board in a manner that the organic films face the circuit board; step two, placing the circuit board on the upper surface of the support table, and quickly adjusting the pressing structure according to the size of the circuit board; step three, after the adjustment, vacuuming the laminator to a preset vacuum degree by operating the device, and pressing the stack of printed circuit boards at a preset temperature and a preset vacuum degree, wherein the preset temperature is room temperature, the preset vacuum degree is 1.3Pa~2Pa, and the preset vacuum degree is maintained throughout the entire pressing process.

[0015] Due to the adoption of the above technical solution, the present invention has the following technical advances compared with the prior art: The present invention provides a pressing method for producing printed circuit boards, which adopts mutual cooperation among hydraulic rod two, a fixed plate, a square plate, a motor, a second gear, a first gear, a large pressing structure, a steel ball, a rotating column, a fixed column, and a supporting platform. Through the action of the second hydraulic rod, the fixed plate fixedly connected to the upper surface of the second hydraulic rod moves downward, and at the same time, by starting the motor, the second gear fixedly connected to the lower surface of the motor rotates, thereby rotating the first gear. Through the action of the first gear, the rotating column fixedly sleeved in the inner cavity of the first gear rotates under the action of the steel ball and the fixed column. Through the action of the rotating column, the large pressing structure rotates to the top of the supporting platform. Through the action of the second hydraulic rod, the fixed plate moves upward to the lower surface of the square plate, thereby fixing the square plate. By fixing the square plate, the rotating column and the large pressing structure are fixed, thereby achieving the purpose of facilitating the rapid replacement of the size of the pressing plate according to demand.

[0016] The present invention provides a pressing method for producing printed circuit boards, which adopts the mutual cooperation among a hydraulic rod 1, a pressing plate 1, a spring and a pressing plate 2. Through the action of the hydraulic rod 1, the pressing plate 1 fixedly connected to the lower surface of the hydraulic rod is moved downward, so that the lower surface of the pressing plate 2 overlaps the upper surface of the circuit board. Through the action of the hydraulic rod 1, the pressing plate 1 continues to be pressed downward, so that the pressing plate 2 is closely fitted with the upper surface of the circuit board under the action of the spring. At the same time, through the action of the spring, the circuit board has a certain buffer space during the pressing process, so as to achieve the purpose of facilitating buffering.

[0017] The present invention provides a lamination method for producing a printed circuit board. A water-soluble organic film can effectively fill defects such as depressions on the surface of a steel plate to ensure the flatness of the surface of the steel plate, thereby ensuring that the circuit board does not deform during the lamination process. At the same time, the water-soluble organic film can effectively prevent PP glue stains from directly flowing to the surface of the steel plate, thereby eliminating the laying of copper foil on the steel plate in a traditional lamination process, thereby shortening the lamination process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a side cross-sectional structural schematic diagram of the present invention; Figure 3 This is an enlarged structural schematic diagram of location A of the present invention; Figure 4 It is a cross-sectional structural schematic diagram of the fixing box 2 of the present invention; Figure 5 It is a schematic diagram of the side structure of the square plate of the present invention.

[0019] In the figure: 1. fixed box one; 2. fixed box two; 3. support leg; 4. operating device; 11. support table; 21. fixed column; 22. rotating column; 23. steel ball; 24. small pressing structure; 241. connecting block; 242. hydraulic rod one; 243. pressure plate one; 244. fixed cylinder; 245. fixed circular plate; 246. spring; 247. pressure plate two; 25. large pressing structure; 26. gear one; 27. gear two; 28. motor; 29. ​​square plate; 210. fixed plate; 211. hydraulic rod two. Implementation

[0020] The present invention is further described in detail below in conjunction with embodiments: Example

[0021] like Figure 1-5 As shown, the present invention provides a pressing method for producing printed circuit boards, comprising a fixed box 1, the lower surface of the fixed box 1 is fixedly connected with a support leg 3, the right side of the fixed box 1 is fixedly connected with a fixed box 2, the inner cavity of the fixed box 1 is movably sleeved with a rotating column 22, the lower surface of the rotating column 22 is fixedly connected with a small pressing structure 24, the right side of the rotating column 22 is fixedly connected with a large pressing structure 25, the bottom of the inner cavity of the fixed box 1 and located below the small pressing structure 24 is fixedly connected with a support table 11, the upper surface of the rotating column 22 is overlapped with a steel ball 23, the upper surface of the steel ball 23 overlaps with the inner cavity of the fixed box 2, the inner cavity of the rotating column 22 is movably sleeved with a fixed column 21, and the fixed column 21 The right side is fixedly connected to the inner cavity of fixed box 22, the outer wall of the rotating column 22 and located on the right side of 923 is fixedly sleeved with a gear 26, the upper surface of the gear 26 is overlapped with a gear 27, the upper surface of the gear 27 is fixedly connected with a motor 28, the pressing structure 24 includes a connecting block 241, the upper surface of the connecting block 241 is fixedly connected to the lower surface of the rotating column 22, the inner cavity of the connecting block 241 is fixedly connected with a hydraulic rod 242, the lower surface of the hydraulic rod 242 is fixedly connected with a pressure plate 243, the inner cavity of the pressure plate 243 is movably sleeved with a fixed cylinder 244, the upper surface of the fixed cylinder 244 and the upper surface of the pressure plate 243 are fixedly connected with a fixed circular plate 245.

[0022] In this embodiment, the pressure plate 243 fixedly connected to the lower surface of the hydraulic rod 242 is moved downward by the action of the hydraulic rod 242, so that the lower surface of the second pressure plate 247 overlaps with the upper surface of the circuit board. The pressure plate 243 is pressed downward continuously by the action of the hydraulic rod 242, so that the second pressure plate 247 is closely fitted with the upper surface of the circuit board under the action of the spring 246. At the same time, the circuit board has a certain buffer space during the pressing process by the action of the spring 246. When the pressure plate needs to be replaced, the fixed plate 211 fixedly connected to the upper surface of the hydraulic rod 211 is moved downward by the action of the hydraulic rod 211. 0 moves downward, and at the same time, by starting the motor 28, the gear 27 fixedly connected to the lower surface of the motor 28 rotates, thereby rotating the gear 1 26. Through the action of the gear 1 26, the rotating column 22 fixedly sleeved in the inner cavity of the gear 1 26 rotates under the action of the steel ball 23 and the fixed column 21. Through the action of the rotating column 22, the pressing structure 25 rotates to the top of the support platform 11. Through the action of the hydraulic rod 211, the fixed plate 210 moves upward to the lower surface of the square plate 29, thereby fixing the square plate 29. By fixing the square plate 29, the rotating column 22 and the pressing structure 25 are fixed. Example

[0023] like Figure 1-5 As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the upper surface of the motor 28 is fixedly connected to the top of the inner cavity of the fixed box 22, a square plate 29 is fixedly connected to the right side of the rotating column 22, the inner cavity of the square plate 29 is movably connected to the outer wall of the fixed column 21, the lower surface of the square plate 29 is overlapped with a fixed plate 210, the lower surface of the fixed plate 210 is fixedly connected to a hydraulic rod 211, and the lower surface of the hydraulic rod 211 is fixedly connected to the bottom of the inner cavity of the fixed box 2.

[0024] In this embodiment, the fixed plate 210 fixedly connected to the upper surface of the hydraulic rod 211 is moved downward by the action of the hydraulic rod 211, and the motor 28 is started to rotate the gear 27 fixedly connected to the lower surface of the motor 28, thereby rotating the gear 1 26. The rotating column 22 fixedly sleeved in the inner cavity of the gear 1 26 is rotated by the action of the steel ball 23 and the fixed column 21. The pressing structure 25 is rotated to the top of the support platform 11 by the action of the rotating column 22. The fixed plate 210 is moved upward to the lower surface of the square plate 29 by the action of the hydraulic rod 211, thereby fixing the square plate 29. The rotating column 22 and the pressing structure 25 are fixed by fixing the square plate 29, thereby achieving the purpose of quickly replacing the size of the pressing plate according to needs. Example

[0025] like Figure 1-5As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the outer wall of the fixed cylinder 244 and the lower surface of the pressure plate 243 are movably sleeved with a spring 246, the upper surface of the spring 246 is fixedly connected to the lower surface of the pressure plate 243, the lower surface of the spring 246 is fixedly connected to the pressure plate 247, and the upper surface of the pressure plate 247 is fixedly connected to the lower surface of the fixed cylinder 244.

[0026] In this embodiment, through the action of hydraulic rod 1 242, pressure plate 1 243 fixedly connected to the lower surface of hydraulic rod 1 242 moves downward, so that the lower surface of pressure plate 247 overlaps with the upper surface of the circuit board. Through the action of hydraulic rod 1 242, pressure plate 1 243 continues to be pressed downward, so that pressure plate 247 fits tightly with the upper surface of the circuit board under the action of spring 246. At the same time, through the action of spring 246, the circuit board has a certain buffer space during the pressing process, thereby achieving the purpose of facilitating buffering. Example

[0027] like Figure 1-5 As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the specific steps include: step one, respectively arranging steel plates with organic films containing water-soluble organic films on the two surfaces on the top and bottom surfaces of the circuit board in a manner that the organic films face the circuit board; step two, placing the circuit board on the upper surface of the support table 11, and quickly adjusting the pressing structure according to the size of the circuit board; step three, after the adjustment, vacuuming the laminator to a preset vacuum degree by the operating device 4, and pressing the stack of printed circuit boards at a preset temperature and a preset vacuum degree, wherein the preset temperature is room temperature, the preset vacuum degree is 1.3Pa~2Pa, and the preset vacuum degree is maintained throughout the entire pressing process.

[0028] In this embodiment, the water-soluble organic film can effectively fill the defects such as depressions on the surface of the steel plate to ensure the flatness of the surface of the steel plate, thereby ensuring that the circuit board does not deform during the lamination process. At the same time, the water-soluble organic film can effectively prevent the PP glue stains from flowing directly to the surface of the steel plate, thereby eliminating the laying of copper foil on the steel plate in the traditional lamination process, thereby shortening the lamination process.

[0029] In summary, if Figure 1-5As shown, the water-soluble organic film can effectively fill the defects such as depressions on the surface of the steel plate to ensure the flatness of the surface of the steel plate, thereby ensuring that the circuit board does not deform during the pressing process. At the same time, the water-soluble organic film can effectively prevent the PP glue stains from flowing directly to the surface of the steel plate, thereby eliminating the padding of copper foil on the steel plate in the traditional pressing process, thereby shortening the pressing process. Through the action of the hydraulic rod 242, the pressing plate 243 fixedly connected to the lower surface of the hydraulic rod 242 moves downward, so that the lower surface of the pressing plate 247 overlaps with the upper surface of the circuit board. Through the action of the hydraulic rod 242, the pressing plate 243 continues to be pressed downward, so that the pressing plate 247 is tightly fitted with the upper surface of the circuit board under the action of the spring 246. At the same time, through the action of the spring 246, the circuit board is pressed during the pressing process. There is a certain buffer space in the process. When the pressure plate needs to be replaced, the fixed plate 210 fixedly connected to the upper surface of the hydraulic rod 211 is moved downward by the action of the hydraulic rod 211. At the same time, by starting the motor 28, the gear 27 fixedly connected to the lower surface of the motor 28 is rotated, so that the gear 1 26 is rotated. Through the action of the gear 1 26, the rotating column 22 fixedly sleeved in the inner cavity of the gear 1 26 is rotated under the action of the steel ball 23 and the fixed column 21. Through the action of the rotating column 22, the pressing structure 25 is rotated to the top of the support table 11. Through the action of the hydraulic rod 211, the fixed plate 210 is moved upward to the lower surface of the square plate 29, so that the square plate 29 is fixed. By fixing the square plate 29, the rotating column 22 and the pressing structure 25 are fixed.

[0030] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A method for pressing printed circuit boards, comprising a fixing box (1), characterized in that: The lower surface of the fixed box one (1) is fixedly connected to a support leg (3), the right side of the fixed box one (1) is fixedly connected to a fixed box two (2), and the upper surface of the fixed box one (1) is fixedly connected to an operating device (4); The inner cavity of the fixed box one (1) is movably sleeved with a rotating column (22), the lower surface of the rotating column (22) is fixedly connected with a small pressing structure (24), the right side of the rotating column (22) is fixedly connected with a large pressing structure (25), the bottom of the inner cavity of the fixed box one (1) and located below the small pressing structure (24) is fixedly connected with a support platform (11), the upper surface of the rotating column (22) is overlapped with a steel ball (23), the upper surface of the steel ball (23) overlaps with the inner cavity of the fixed box two (2), the inner cavity of the rotating column (22) is movably sleeved with a fixed column (21), the right side of the fixed column (21) is fixedly connected with the inner cavity of the fixed box two (2), the outer wall of the rotating column (22) and located on the right side of the fixed 923 is fixedly sleeved with a gear one (26), the upper surface of the gear one (26) is overlapped with a gear two (27), and the upper surface of the gear two (27) is fixedly connected with a motor (28); The pressing structure (24) comprises a connecting block (241), the upper surface of the connecting block (241) is fixedly connected to the lower surface of the rotating column (22), the inner cavity of the connecting block (241) is fixedly connected to a hydraulic rod (242), the lower surface of the hydraulic rod (242) is fixedly connected to a pressure plate (243), the inner cavity of the pressure plate (243) is movably sleeved with a fixed cylinder (244), and the upper surface of the fixed cylinder (244) and located on the upper surface of the pressure plate (243) is fixedly connected to a fixed circular plate (245).

2. A method for pressing printed circuit boards according to claim 1, characterized in that: The upper surface of the motor (28) is fixedly connected to the top of the inner cavity of the second fixed box (2), and the right side of the rotating column (22) is fixedly connected to a square plate (29).

3. A method for pressing printed circuit boards according to claim 2, characterized in that: The inner cavity of the square plate (29) is movably sleeved with the outer wall of the fixed column (21), and the lower surface of the square plate (29) is overlapped with a fixed plate (210).

4. A method for pressing printed circuit boards according to claim 3, characterized in that: The lower surface of the fixed plate (210) is fixedly connected to a second hydraulic rod (211), and the lower surface of the second hydraulic rod (211) is fixedly connected to the bottom of the inner cavity of the second fixed box (2).

5. A method for pressing printed circuit boards according to claim 1, characterized in that: A spring (246) is movably sleeved on the outer wall of the fixed cylinder (244) and located on the lower surface of the first pressing plate (243); the upper surface of the spring (246) is fixedly connected to the lower surface of the first pressing plate (243).

6. A method for pressing printed circuit boards according to claim 5, characterized in that: The lower surface of the spring (246) is fixedly connected to a second pressing plate (247), and the upper surface of the second pressing plate (247) is fixedly connected to the lower surface of the fixed cylinder (244).

7. A method for laminating a printed circuit board according to any one of claims 1 to 6, characterized in that: The specific steps include: Step 1: two steel plates with organic films containing water-soluble organic films disposed on their surfaces are disposed on the top and bottom surfaces of the circuit board respectively in a manner that the organic films face the circuit board; Step 2: placing the circuit board on the upper surface of the support platform (11), and quickly adjusting the pressing structure according to the size of the circuit board; Step three, after adjustment, the laminating machine is vacuumed to a preset vacuum degree by operating the device (4), and the stack of printed circuit boards is pressed at a preset temperature and a preset vacuum degree, wherein the preset temperature is room temperature, the preset vacuum degree is 1.3 Pa to 2 Pa, and the preset vacuum degree is maintained throughout the entire pressing process.

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