Method for processing non-metallized hole in mSAP process and circuit board
By setting dry film and electroplating layer on the substrate in the mSAP process and processing non-metalized holes under its support, problems such as burrs and edges at the holes are solved, and the quality of the holes is improved.
Patent Information
- Application Number
- CN202411548297.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-02-14
AI Technical Summary
When processing non-metalized holes in mSAP process, burrs, bristles and other phenomena are prone to appear at the holes, and in severe cases, quality defects such as blasting holes will occur.
The dry film and electroplating layer are provided on the substrate, the dry film covers the drilling area, and the electroplating layer covers the electroplating area. Non-metalized holes are processed on the substrate through the side where the substrate is departed from the metal layer, and the holes penetrate through the substrate, the metal layer and Dry film, finally remove the dry film.
The strength of the drilling area is improved through the support of the dry film and the electroplating layer, avoiding burrs, bladders and hole bursts during drilling, and improving the quality of the non-metalized holes.
Smart Images
Figure CN119450933A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of printed circuit board manufacturing, and in particular to a method for processing non-metallized holes in an mSAP process and a circuit board. Background Art
[0002] With the development of arbitrary-layer interconnection technology in electronic products, the requirements for processing precision of fine circuit layers are gradually increasing. The tenting technology cannot achieve the production of precision circuits within 40μm / 40μm due to the problem of surface copper plating thickness. Therefore, the mSAP (Modified Semi-Additive Process) process technology with the ability to process 30μm / 30μm precision circuits has been developed to achieve precision circuit processing and production.
[0003] Since the mSAP process is used to make circuits below 30um / 30um, the dry films used are all high-resolution and high-adhesion dry film types, and they have no sealing capability for through holes, so non-plated holes (NPTH, NON-Plating through Hole) are all processed by secondary drilling in the post-process. NPTH holes are usually used as positioning holes or bottom holes, and the accuracy and appearance quality of the holes need to be guaranteed.
[0004] In the related art, when the secondary drilling process is used to process non-metallized holes in the mSAP process, burrs and flashes may occur at the hole mouths of the non-metallized holes, and in severe cases, quality defects such as hole bursting may occur. Summary of the invention
[0005] The present application provides a method and circuit board for processing non-metallized holes in the mSAP process, which can improve the problem in the related art that when the non-metallized holes are processed by the secondary drilling process in the mSAP process, burrs and burrs may appear at the hole mouths of the non-metallized holes, and in severe cases, quality defects such as hole burst may occur.
[0006] In a first aspect, an embodiment of the present application provides a method for processing a non-metallized hole in an mSAP process, comprising:
[0007] Providing a substrate, the substrate comprising a substrate and a first metal layer which are stacked, wherein a surface of the first metal layer facing away from the substrate has a first electroplating area and a first drilling area;
[0008] Disposing a dry film on the substrate, the dry film comprising a first film, the first film covering the first drilling area;
[0009] Arranging an electroplating layer on the substrate, the electroplating layer comprising a first layer, the first layer covering the first electroplating area;
[0010] Processing a non-metallized hole on the substrate from a side of the substrate facing away from the first metal layer, wherein the non-metallized hole sequentially penetrates the substrate, the first metal layer and the first film;
[0011] The first film is removed.
[0012] In some embodiments, the thickness of the first layer is less than or equal to the thickness of the first film.
[0013] In some embodiments, the surface of the substrate facing the first metal layer is a connection surface, and the orthographic projection of the non-metallized hole on the connection surface is located inside the orthographic projection of the first drilling area on the connection surface.
[0014] In some embodiments, a distance between an edge of an orthographic projection of the non-metallized hole and an edge of an orthographic projection of the connecting surface and the first drilling area is greater than or equal to 0.1 mm.
[0015] In some embodiments, the substrate includes a second metal layer, the second metal layer and the first metal layer are respectively arranged on opposite sides of the substrate, and the surface of the second metal layer facing away from the substrate has a second electroplating area and a second drilling area; the dry film includes a second film, and the second film covers the second drilling area; the electroplating layer includes a second layer, and the second layer covers the second electroplating area; when the non-metallized hole is processed on the substrate from the side of the substrate facing away from the first metal layer, the non-metallized hole sequentially passes through the second film, the substrate, the first metal layer and the first film; when the first film is removed, the second film is removed.
[0016] In some embodiments, after providing the electroplating layer on the substrate and before processing the non-metallized hole on the substrate on the side of the substrate facing away from the first metal layer, the method for processing the non-metallized hole in the mSAP process further includes:
[0017] The substrate is placed on a pad, and the first film is attached to the pad.
[0018] In some embodiments, after the substrate is placed on the pad and before the non-metallized holes are processed on the substrate on the side of the substrate facing away from the first metal layer, a cover plate is provided on the side of the substrate facing away from the pad, and the cover plate is in contact with the surface of the substrate facing away from the pad.
[0019] In some embodiments, the step of providing a dry film on the substrate comprises:
[0020] A first film is attached to a surface of the first metal layer facing away from the substrate, wherein the first film covers the first electroplating area and the first drilling area;
[0021] The first film is exposed and developed to remove the first film covering the first electroplating area.
[0022] In some embodiments, after removing the first film, the first metal layer corresponding to the first drilling area is removed.
[0023] In a second aspect, an embodiment of the present application provides a circuit board, which is manufactured by the method of processing non-metallized holes in the mSAP process as described in the first aspect.
[0024] The method for processing non-metallized holes in the mSAP process provided in the embodiment of the present application has the beneficial effect that: since a dry film is first set on the substrate, the dry film includes a first film, the first film covers the first drilling area, and then an electroplating layer is set on the substrate, the electroplating layer includes a first layer, the first layer covers the first electroplating area, and then a non-metallized hole is processed on the substrate from the side of the substrate away from the first metal layer, the non-metallized hole passes through the substrate, the first metal layer and the first film in sequence, and finally the first film is removed. Therefore, in the process of processing the non-metallized hole on the substrate from the side of the substrate away from the first metal layer, the first film and the first metal layer can support the substrate, the first film can support the first metal layer, and the strength of the substrate corresponding to the first drilling area is improved, thereby avoiding burrs, burrs and other phenomena at the mouth of the non-metallized hole caused by the lack of support of the first metal layer when the drill bit passes through the first metal layer, and in severe cases, quality defects such as hole bursting may occur.
[0025] The beneficial effects of the circuit board provided in the present application compared with the prior art can be referred to the description of the beneficial effects of the method for processing non-metallized holes in the mSAP process provided in the present application compared with the prior art, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0027] Figure 1 It is a structural schematic diagram of a circuit board in the related art;
[0028] Figure 2 is Figure 1 The schematic diagram of processing non-metallized holes on the circuit board shown;
[0029] Figure 3 is a flow chart of a method for processing a non-metallized hole in an mSAP process in one embodiment of the present application;
[0030] Figure 4 This is a schematic diagram of the structure of a substrate in one of the embodiments of the present application;
[0031] Figure 5 is Figure 4 The schematic diagram shown is of processing a non-metallized hole on a substrate and removing the first metal layer corresponding to the first drilling area.
[0032] The meanings of the marks in the figure are:
[0033] 1. Circuit board; 2. Copper layer; 3. Plating layer; 4. Groove; 5. NPTH hole; 6. Table;
[0034] 10. Substrate; 20. First metal layer; 21. First electroplating area; 22. First drilling area; 30. First layer; 40. Second metal layer; 41. Second electroplating area; 42. Second drilling area; 50. Second layer; 60. First film; 70. Second film; 80. Pad; 81. Cover; 90. Non-metallized hole. DETAILED DESCRIPTION
[0035] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0036] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0038] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of this application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some other embodiments", "in some other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.
[0039] In order to illustrate the technical solution of the present application, a description is given below with reference to specific drawings and embodiments.
[0040] In the related technologies, the mSAP process generally includes inner layer lamination, target drilling, mechanical drilling, unloading copper foil, browning, laser, copper flash plating, mSAP image film exposure, mSAP vertical development, mSAP electroplating, film removal, baking, flash etching, circuit AOI (Automated Optical Inspection), characters, solder mask, secondary drilling, gong plate and electrical measurement.
[0041] Please refer to Figure 1 and Figure 2 , Figure 1 It is a structural schematic diagram of a circuit board in the related art. Figure 2 is Figure 1 Schematic diagram of processing non-metallized holes on a circuit board is shown.
[0042] Secondary drilling is performed after film stripping and flash etching. After circuit etching and solder mask printing, a groove 4 is formed in the area corresponding to the NPTH hole 5, and the bottom of the groove is the exposed substrate of the circuit board 1. The front and back sides of the circuit board 1 do not contain copper layer 2 and plating layer 3, so that the secondary drilling (along the drill bit) is performed. Figure 1 When the drill bit penetrates the bottom surface of the substrate from the top surface of the circuit board 1 to the bottom surface of the circuit board 1, the bottom surface of the circuit board 1 is the cutting surface, and the bottom is exposed without a protective layer. It is suspended without support, which will cause burrs and burrs at the opening of the NPTH hole 5. In severe cases, quality defects such as blowout and different color of the hole ring may occur.
[0043] In view of this, the present application provides a method and circuit board for processing non-metallized holes in an mSAP process, wherein a dry film is first arranged on a substrate, the dry film includes a first film, the first film covers a first drilling area, and then an electroplating layer is arranged on the substrate, the electroplating layer includes a first layer, the first layer covers the first electroplating area, and then a non-metallized hole is processed on the substrate from a side of the substrate away from the first metal layer, the non-metallized hole sequentially penetrates the substrate, the first metal layer and the first film, and finally the first film is removed. Therefore, in the process of processing the non-metallized hole on the substrate from a side of the substrate away from the first metal layer, the first film and the first metal layer can support the substrate, the first film can support the first metal layer, and improve the strength of the substrate corresponding to the first drilling area, thereby avoiding burrs, burrs, etc. at the hole mouth of the non-metallized hole caused by the lack of support of the first metal layer when the drill bit penetrates the first metal layer, and severe quality defects such as hole bursting may occur.
[0044] Please refer to Figures 3 to 5 , Figure 3 is a flow chart of a method for processing a non-metallized hole 90 in an mSAP process in one embodiment of the present application. Figure 4 This is a schematic diagram of the structure of a substrate in one of the embodiments of the present application. Figure 5 is Figure 4 The schematic diagram shown is that a non-metallized hole 90 is processed on a substrate and the first metal layer 20 corresponding to the first drilling area 22 is removed.
[0045] In a first aspect, an embodiment of the present application provides a method for processing a non-metallized hole 90 in an mSAP process, comprising:
[0046] S100 : providing a substrate, the substrate comprising a base material 10 and a first metal layer 20 which are stacked, and a surface of the first metal layer 20 which is away from the base material 10 has a first electroplating area 21 and a first drilling area 22 .
[0047] Specifically, the substrate may be a copper clad laminate, the first metal layer 20 may be a copper layer, or the first metal layer 20 may be a silver layer or an aluminum layer. The substrate may have been subjected to processes such as inner layer lamination, target drilling, mechanical drilling, unloading copper foil, browning, laser and copper flash plating, all of which are processed according to normal process flow.
[0048] S200 : a dry film is disposed on the substrate, wherein the dry film includes a first film 60 , and the first film 60 covers the first drilling area 22 .
[0049] Specifically, a dry film may be provided on the substrate by film lamination, exposure, and development. The first film 60 only covers the first drilling area 22, and the first electroplating area 21 is exposed.
[0050] S300 : disposing an electroplating layer on the substrate, wherein the electroplating layer includes a first layer 30 , and the first layer 30 covers a first electroplating area 21 .
[0051] Specifically, an electroplating layer can be provided on the substrate by electroplating, and the electroplating layer can be a copper layer, a silver layer or an aluminum layer, etc. In this embodiment, the first metal layer 20 and the electroplating layer are both copper layers, the thickness of the first metal layer 20 can be 7um-9um, and the thickness of the dry film can be 25um.
[0052] S400 : a non-metallized hole 90 is processed on the substrate from the side of the substrate 10 facing away from the first metal layer 20 , and the non-metallized hole 90 passes through the substrate 10 , the first metal layer 20 and the first film 60 in sequence.
[0053] Specifically, the drill bit of the drilling rig can be Figure 4 and Figure 5 A non-metallized hole 90 is processed on the substrate in the direction indicated by the middle arrow. During this process, the first film 60 and the first metal layer 20 can support the substrate 10 , and the first film 60 can support the first metal layer 20 .
[0054] It is understood that the non-metallized hole 90 is not plated or is a copper-free hole.
[0055] S500 : removing the first film 60 .
[0056] Specifically, the first film 60 may be removed by film stripping, and the substrate may be baked.
[0057] As can be seen from the above, the method for processing the non-metallized hole 90 in the mSAP process provided by the embodiment of the present application is that a dry film is first set on the substrate, the dry film includes a first film 60, the first film 60 covers the first drilling area 22, and then an electroplating layer is set on the substrate, the electroplating layer includes a first layer 30, the first layer 30 covers the first electroplating area 21, and then a non-metallized hole 90 is processed on the substrate from the side of the substrate 10 away from the first metal layer 20, the non-metallized hole 90 passes through the substrate 10, the first metal layer 20 and the first film 60 in sequence, and finally the first film is removed. 60, so in the process of machining the non-metallized hole 90 on the substrate from the side of the substrate 10 away from the first metal layer 20, the first film 60 and the first metal layer 20 can support the substrate 10, the first film 60 can support the first metal layer 20, and improve the strength of the substrate corresponding to the first drilling area 22, so as to avoid burrs, burrs and other phenomena at the hole mouth of the non-metallized hole 90 caused by the lack of support of the first metal layer 20 when the drill bit penetrates the first metal layer 20, and serious quality defects such as hole bursting may occur.
[0058] Optionally, the thickness of the first layer 30 is less than or equal to the thickness of the first film 60 .
[0059] With such configuration, the first metal layer 20 can be more effectively supported by the first film 60 .
[0060] Please refer to Figures 3 to 5 In this embodiment, the surface of the substrate 10 facing the first metal layer 20 is the connection surface, and the orthographic projection of the non-metallized hole 90 on the connection surface is located inside the orthographic projection of the first drilling area 22 on the connection surface.
[0061] By adopting the above solution, it is possible to avoid the drill bit damaging the first layer 30 when the non-metallized hole 90 is processed on the substrate from the side of the substrate 10 facing away from the first metal layer 20 .
[0062] Optionally, a distance between an edge of an orthographic projection of the non-metallized hole 90 on the connection surface and an edge of an orthographic projection of the first drilling region 22 on the connection surface is greater than or equal to 0.1 mm.
[0063] Such an arrangement can better prevent the drill from damaging the first layer 30 when the non-metallized hole 90 is processed on the substrate from the side of the substrate 10 facing away from the first metal layer 20 .
[0064] Please refer to Figures 3 to 5 In this embodiment, the substrate includes a second metal layer 40, and the second metal layer 40 and the first metal layer 20 are respectively arranged on opposite sides of the substrate 10, and the surface of the second metal layer 40 away from the substrate 10 has a second electroplating area 41 and a second drilling area 42; the dry film includes a second film 70, and the second film 70 covers the second drilling area 42; the electroplating layer includes a second layer 50, and the second layer 50 covers the second electroplating area 41; when the non-metallized hole 90 is processed on the substrate from the side of the substrate 10 away from the first metal layer 20, the non-metallized hole 90 sequentially penetrates the second film 70, the substrate 10, the first metal layer 20 and the first film 60; when the first film 60 is removed, the second film 70 is removed.
[0065] By adopting the above solution, it is possible to avoid burrs and flashes at the opening of the non-metallized hole 90 due to the lack of support of the first metal layer 20 when the drill bit penetrates the first metal layer 20. In severe cases, quality defects such as hole bursting may occur.
[0066] After the electroplating layer is provided on the substrate, and before the non-metallized hole 90 is processed on the substrate from the side of the substrate 10 away from the first metal layer 20, the method for processing the non-metallized hole 90 in the mSAP process further includes:
[0067] The substrate is placed on the backing plate 80 , and the first film 60 is attached to the backing plate 80 .
[0068] By adopting the above scheme, in the process of machining the non-metallized hole 90 on the substrate on the side of the substrate 10 away from the first metal layer 20, the pad 80 can be used to support the first film 60, so that the first film 60 can more effectively support the first metal layer 20, thereby better avoiding the occurrence of burrs, flashes and other quality defects at the mouth of the non-metallized hole 90 due to the lack of support of the first metal layer 20 when the drill bit penetrates the first metal layer 20, and in severe cases, quality defects such as hole bursting may occur.
[0069] It can be understood that the first layer 30 is also in contact with the pad 80, and the cutting edge of the drill bit is the side of the first film 60 that is in contact with the pad 80. It is basically flush with the surface of the pad 80 without any overhang, thus avoiding the problems of burrs, burrs, burst holes and different colors of the hole rings in the drilled non-metallized holes 90.
[0070] Optionally, after placing the substrate on the pad 80 and before processing the non-metallized hole 90 on the substrate from the side of the substrate 10 facing away from the first metal layer 20, a cover plate 81 is set on the side of the substrate facing away from the pad 80, and the cover plate 81 is in contact with the surface of the substrate facing away from the pad 80.
[0071] With such arrangement, the cover plate 81 can be used to press the substrate, ensuring that the substrate remains flat and stable during the process of machining the non-metallized hole 90 on the substrate.
[0072] For example, the second layer 50 and the second film 70 are both attached to the cover plate 81 .
[0073] Please refer to Figure 4 In this embodiment, a dry film is provided on a substrate, comprising:
[0074] First, the first film 60 is attached to the surface of the first metal layer 20 facing away from the substrate 10 , and the first film 60 covers the first electroplating area 21 and the first drilling area 22 .
[0075] Next, the first film 60 is exposed and developed to remove the first film 60 covering the first plating region 21 .
[0076] By adopting the above solution, the first film 60 covering the first drilling area 22 can be provided more conveniently.
[0077] It should be noted that, by exposing and developing the dry film, the first plating area 21 to be plated is developed, and the first drilling area 22 not to be developed is covered with the first film 60. The second film 70 may be arranged on the substrate in a manner similar to the first film 60.
[0078] Please refer to Figure 4 and Figure 5Optionally, after removing the first film 60 , the first metal layer 20 corresponding to the first drilling area 22 is removed.
[0079] By adopting the above solution, the first metal layer 20 corresponding to the first drilling area 22 can be removed, thereby exposing the substrate 10 .
[0080] For example, the first metal layer 20 corresponding to the first drilling area 22 can be removed by flash etching, and then AOI, character, solder mask, gong plate and electrical testing and other processes can be continued according to the normal process flow.
[0081] In a second aspect, an embodiment of the present application provides a circuit board, which is manufactured by the method of processing non-metallized holes 90 in the mSAP process as in the first aspect.
[0082] The circuit board provided in the embodiment of the present application is manufactured by firstly setting a dry film on the substrate, the dry film includes a first film 60, the first film 60 covers the first drilling area 22, and then setting an electroplating layer on the substrate, the electroplating layer includes a first layer 30, the first layer 30 covers the first electroplating area 21, and then processing a non-metallized hole 90 on the substrate from the side of the substrate 10 away from the first metal layer 20, the non-metallized hole 90 sequentially penetrates the substrate 10, the first metal layer 20 and the first film 60, and finally removes the first film 60, so that after the substrate 1 is formed, the first metal layer 20 and the first film 60 are formed. In the process of machining the non-metallized hole 90 on the substrate on the side away from the first metal layer 20, the first film 60 and the first metal layer 20 can support the substrate 10, and the first film 60 can support the first metal layer 20 and improve the strength of the substrate corresponding to the first drilling area 22, so as to avoid burrs and flashes at the hole mouth of the non-metallized hole 90 due to the lack of support of the first metal layer 20 when the drill bit penetrates the first metal layer 20, and in severe cases, quality defects such as hole bursting may occur.
[0083] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.
Claims
1. A method for processing non-metallized holes in an mSAP process, characterized in that: include: Providing a substrate, the substrate comprising a substrate and a first metal layer which are stacked, wherein a surface of the first metal layer facing away from the substrate has a first electroplating area and a first drilling area; Disposing a dry film on the substrate, the dry film comprising a first film, the first film covering the first drilling area; Arranging an electroplating layer on the substrate, the electroplating layer comprising a first layer, the first layer covering the first electroplating area; Processing a non-metallized hole on the substrate from a side of the substrate facing away from the first metal layer, wherein the non-metallized hole sequentially penetrates the substrate, the first metal layer and the first film; The first film is removed.
2. The method for processing non-metallized holes in the mSAP process according to claim 1, characterized in that: The thickness of the first layer is less than or equal to the thickness of the first film.
3. The method for processing non-metallized holes in mSAP process according to claim 1, characterized in that: The surface of the substrate facing the first metal layer is a connection surface, and the orthographic projection of the non-metallized hole on the connection surface is located inside the orthographic projection of the first drilling area on the connection surface.
4. The method for processing non-metallized holes in the mSAP process according to claim 3, characterized in that: A distance between an edge of an orthographic projection of the non-metallized hole on the connection surface and an edge of an orthographic projection of the first drilling area on the connection surface is greater than or equal to 0.1 mm.
5. The method for processing non-metallized holes in mSAP process according to claim 1, characterized in that: The substrate comprises a second metal layer, the second metal layer and the first metal layer are respectively arranged on opposite sides of the substrate, and the surface of the second metal layer facing away from the substrate has a second electroplating area and a second drilling area; the dry film comprises a second film, and the second film covers the second drilling area; the electroplating layer comprises a second layer, and the second layer covers the second electroplating area; when the non-metallized hole is processed on the substrate from the side of the substrate facing away from the first metal layer, the non-metallized hole sequentially penetrates the second film, the substrate, the first metal layer and the first film; when the first film is removed, the second film is removed.
6. The method for processing non-metallized holes in the mSAP process according to any one of claims 1 to 5, characterized in that: After the electroplating layer is provided on the substrate and before the non-metallized hole is processed on the substrate on the side of the substrate facing away from the first metal layer, the method for processing the non-metallized hole in the mSAP process further includes: The substrate is placed on a pad, and the first film is attached to the pad.
7. The method for processing non-metallized holes in mSAP process according to claim 6, characterized in that: After placing the substrate on the pad, and before processing the non-metallized hole on the substrate on the side of the substrate facing away from the first metal layer, a cover is provided on the side of the substrate facing away from the pad, and the cover is in contact with the surface of the substrate facing away from the pad.
8. The method for processing non-metallized holes in the mSAP process according to any one of claims 1 to 5, characterized in that: The step of providing a dry film on the substrate comprises: A first film is attached to a surface of the first metal layer facing away from the substrate, wherein the first film covers the first electroplating area and the first drilling area; The first film is exposed and developed to remove the first film covering the first electroplating area.
9. The method for processing non-metallized holes in the mSAP process according to any one of claims 1 to 5, characterized in that: After removing the first film, the first metal layer corresponding to the first drilling area is removed.
10. A circuit board, characterized in that: The circuit board is manufactured by the method for processing non-metallized holes in the mSAP process as described in any one of claims 1 to 9.