Mark point offset adjusting method and device, equipment and medium

Abstract

The invention discloses a Mark point offset adjustment method and device, equipment and a medium. The method comprises the following steps: respectively acquiring a first Mark point image, a second Mark point image and a mounting image; the similarity of the images is calculated according to the material positions of the first Mark point image and the second Mark point image, and the position similarity is obtained; when the position similarity is smaller than a preset similarity, determining a shaking amplitude value of the mounting equipment based on the mounting image; if the shaking amplitude value is greater than the preset amplitude value, adjusting a power value of a shaft motor of the surface mounting equipment according to the shaking amplitude value, so as to control the surface mounting equipment to perform surface mounting according to the adjusted power value; and if the shaking amplitude value is smaller than the preset amplitude value, calculating a position compensation value of the material according to the first Mark point image and the second Mark point image so as to control the surface mounting equipment to perform surface mounting according to the position compensation value. According to the invention, the deviated material is adjusted, so that the material is matched with the Mark point of the circuit board, and the mounting precision and the circuit manufacturing precision are improved.

Description

Background Art

[0002] Mark points are the position identification points of PCBs used in automatic placement machines in circuit board design. As the demand for electronic devices increases, the accuracy requirements of electronic devices also increase. For this reason, it is necessary to determine the mark points of the circuit board before the circuit board is placed.

[0003] Since the selection of Mark points directly affects the efficiency and accuracy of automatic placement machines, in order to improve the placement accuracy, the current commonly used method is to first obtain the positioning Mark point image of the carrier or circuit, and obtain the position of the positioning Mark point from the image; then absorb the material and obtain the material image after absorption, and calculate the first compensation value about the material position and angle according to the material image; obtain the position of the circuit Mark point, and obtain the second compensation value in combination with the position of the positioning Mark point, and adjust the placement in combination with the first compensation value and the second compensation value.

[0004] However, the commonly used methods currently have the following technical problems: when the SMT equipment is moving, sucking materials and then moving them to the circuit for SMT, the equipment may shake or loosen when it starts and stops. Once shaking or loosening occurs, the position of the sucked materials and their corresponding Mark points will deviate, making it impossible for the materials to accurately reach the Mark point during mounting, thereby reducing the accuracy of the SMT. Summary of the invention

[0005] The present invention provides a method, device, equipment and medium for adjusting the mark point offset, and the method can solve one or more of the above-mentioned technical problems.

[0006] A first aspect of an embodiment of the present invention provides a method for adjusting a mark point offset, the method comprising: Acquire a first mark point image, a second mark point image and a mounting image respectively, wherein the first mark point image is an image of the material position on the circuit board to be mounted, the second mark point image is an image of the material position after the mounting device absorbs the material, and the mounting image is an operation image of the mounting device in the process of absorbing the material; Calculating image similarity based on material positions of the first Mark point image and the second Mark point image to obtain position similarity; When the position similarity is less than a preset similarity, the shaking amplitude value of the mounting device is determined based on the mounting image, and the shaking amplitude value is the amplitude of shaking of the mounting device after the mounting device absorbs the material and moves to the top of the circuit board to be mounted; If the shaking amplitude value is greater than the preset amplitude value, the power value of the axis motor of the mounting device is adjusted according to the shaking amplitude value, so as to control the mounting device to perform mounting according to the adjusted power value; If the shaking amplitude value is less than the preset amplitude value, a position compensation value of the material is calculated according to the first Mark point image and the second Mark point image, so as to control the placement equipment to perform placement according to the position compensation value.

[0007] In a possible implementation manner of the first aspect, calculating image similarity according to material positions of the first Mark point image and the second Mark point image to obtain position similarity includes: If the number of sucked materials is multiple, determine the position coordinates of each material in the first Mark point image and the second Mark point image to obtain the first position information of each material; Calculating the similarity of each material in position using the first position information to obtain multiple first similarities; A first similarity with the largest value is selected from the multiple first similarities, and the first similarity with the largest value is used as the position similarity.

[0008] In a possible implementation manner of the first aspect, calculating image similarity according to material positions of the first Mark point image and the second Mark point image to obtain position similarity includes: If the number of the sucked material is one, determine the position coordinates of each pin of the material in the first Mark point image and the second Mark point image to obtain the second position information of each pin; Using the second position information to calculate the similarity of each pin in position, to obtain multiple second similarities; An average value of the plurality of second similarities is calculated to obtain a position similarity.

[0009] In a possible implementation manner of the first aspect, calculating the position compensation value of the material according to the first Mark point image and the second Mark point image includes: Determine the position coordinates of the material in the first Mark point image and the position coordinates of the second Mark point image to obtain first coordinates and second coordinates respectively; The coordinate distances of the material on the X-axis and the Y-axis are calculated using the first coordinate and the second coordinate to obtain a position compensation value.

[0010] In a possible implementation manner of the first aspect, determining the shaking amplitude value of the placement device based on the placement image includes: Extracting a plurality of mounting images from the mounting image, wherein the plurality of mounting images are images extracted at preset time intervals during the process of the mounting device sucking the material and moving it to the circuit board to be mounted; After identifying the mark of each mounting image according to the preset pattern mark to obtain the image mark, determine the image coordinates of each image mark; Calculating the marking distance between two adjacent mounting images using the image coordinates to obtain a plurality of marking distance values; The identification distance value with the largest value is selected from the multiple identification distance values, and the identification distance value with the largest value is used as the shaking amplitude value.

[0011] In a possible implementation manner of the first aspect, adjusting the power value of the axis motor of the placement device according to the shaking amplitude value includes: Calculate the ratio of the shaking amplitude value to the preset shaking upper limit value to obtain a shaking ratio value; The output power of the shaft motor of the mounting device is adjusted according to the shaking ratio value to obtain a power value.

[0012] In a possible implementation manner of the first aspect, after the step of calculating image similarity according to material positions of the first Mark point image and the second Mark point image to obtain position similarity, the method further includes: When the position similarity is greater than a preset similarity, the placement device is controlled to place the material and a real-time image of the placement process is displayed on the device screen for user reference.

[0013] A second aspect of an embodiment of the present invention provides a device for adjusting a mark point offset, the device comprising: An acquisition module is used to respectively acquire a first Mark point image, a second Mark point image and a mounting image, wherein the first Mark point image is an image of the material position on the circuit board to be mounted, the second Mark point image is an image of the material position after the mounting device absorbs the material, and the mounting image is an operation image of the mounting device in the process of absorbing the material; A similarity calculation module, used to calculate the image similarity according to the material positions of the first Mark point image and the second Mark point image to obtain position similarity; A shaking amplitude calculation module, used for determining a shaking amplitude value of the mounting device based on the mounting image when the position similarity is less than a preset similarity, wherein the shaking amplitude value is the amplitude of shaking of the mounting device after the mounting device absorbs the material and moves to the top of the circuit board to be mounted; A power adjustment module, used for adjusting the power value of the shaft motor of the placement device according to the swing amplitude value if the swing amplitude value is greater than a preset amplitude value, so as to control the placement device to perform placement according to the adjusted power value; A position compensation calculation module is used to calculate the position compensation value of the material according to the first Mark point image and the second Mark point image if the shaking amplitude value is less than a preset amplitude value, so as to control the mounting equipment to perform mounting according to the position compensation value.

[0014] In a possible implementation manner of the second aspect, calculating image similarity according to material positions of the first Mark point image and the second Mark point image to obtain position similarity includes: If the number of sucked materials is multiple, determine the position coordinates of each material in the first Mark point image and the second Mark point image to obtain the first position information of each material; Calculating the similarity of each material in position using the first position information to obtain multiple first similarities; A first similarity with the largest value is selected from the multiple first similarities, and the first similarity with the largest value is used as the position similarity.

[0015] In a possible implementation manner of the second aspect, calculating image similarity according to material positions of the first Mark point image and the second Mark point image to obtain position similarity includes: If the number of the sucked material is one, determine the position coordinates of each pin of the material in the first Mark point image and the second Mark point image to obtain the second position information of each pin; Using the second position information to calculate the similarity of each pin in position, to obtain multiple second similarities; An average value of the plurality of second similarities is calculated to obtain a position similarity.

[0016] In a possible implementation manner of the second aspect, calculating the position compensation value of the material according to the first Mark point image and the second Mark point image includes: Determine the position coordinates of the material in the first Mark point image and the position coordinates of the second Mark point image to obtain first coordinates and second coordinates respectively; The coordinate distances of the material on the X-axis and the Y-axis are calculated using the first coordinate and the second coordinate to obtain a position compensation value.

[0017] In a possible implementation manner of the second aspect, determining the shaking amplitude value of the placement device based on the placement image includes: Extracting a plurality of mounting images from the mounting image, wherein the plurality of mounting images are images extracted at preset time intervals during the process of the mounting device sucking the material and moving it to the circuit board to be mounted; After identifying the mark of each mounting image according to the preset pattern mark to obtain the image mark, determine the image coordinates of each image mark; Calculating the marking distance between two adjacent mounting images using the image coordinates to obtain a plurality of marking distance values; The identification distance value with the largest value is selected from the multiple identification distance values, and the identification distance value with the largest value is used as the shaking amplitude value.

[0018] In a possible implementation manner of the second aspect, adjusting the power value of the axis motor of the placement device according to the shaking amplitude value includes: Calculate the ratio of the shaking amplitude value to the preset shaking upper limit value to obtain a shaking ratio value; The output power of the shaft motor of the mounting device is adjusted according to the shaking ratio value to obtain a power value.

[0019] In a possible implementation manner of the second aspect, the apparatus further includes: The image display module is used to control the mounting equipment to mount materials and display the real-time image of the mounting process when the position similarity is greater than a preset similarity, and display the real-time image on the device screen for user reference.

[0020] Compared with the prior art, the embodiments of the present invention provide a method, device, equipment and medium for adjusting the Mark point offset, and the beneficial effects are as follows: the present invention can respectively obtain images and mounting images; determine whether there is a position deviation between the material and the corresponding Mark point according to the image; when there is a position deviation, determine whether there is equipment shaking causing the position deviation according to the mounting image; if the position deviation is caused by equipment shaking, adjust the power value of the axis motor of the mounting equipment according to the shaking amplitude value of the equipment, and perform mounting according to the adjusted power value; if the position deviation is not caused by equipment shaking, calculate the position compensation value of the material, and perform mounting according to the position compensation value; through the above method, not only can the cause of the mounting deviation be accurately determined, but also adjustments can be made according to the cause of the deviation, so that the material matches the Mark point of the circuit board, so as to improve the mounting accuracy and circuit manufacturing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a flowchart of a method for adjusting a mark point offset provided by an embodiment of the present invention; Figure 2 It is a structural schematic diagram of a Mark point offset adjustment device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] In order to solve the above problems, a method for adjusting the Mark point offset provided in an embodiment of the present application will be introduced and explained in detail through the following specific embodiments.

[0024] Reference Figure 1 , shows a flow chart of a method for adjusting a mark point offset provided by an embodiment of the present invention.

[0025] In one embodiment, the method for adjusting the Mark point offset can be applied to a patch device or a mounting device for a circuit board, and can be specifically applied to a control system of the patch device or the mounting device, which control system can be a computer or an intelligent terminal.

[0026] Adjustments can be made when the equipment is mounting materials on the circuit board, so that the materials can accurately reach the mark point during mounting, thereby improving the accuracy of the mounting.

[0027] As an example, the method for adjusting the Mark point offset may include: S11. Acquire a first mark point image, a second mark point image and a mounting image respectively, wherein the first mark point image is an image of the material position on the circuit board to be mounted, the second mark point image is an image of the material position after the mounting equipment absorbs the material, and the mounting image is an operation image of the mounting equipment during the material absorption process.

[0028] In one embodiment, a camera may be provided inside the patch device or mounting device, and a first mark point image, a second mark point image and a mounting image may be acquired respectively when the patch is started and the patch is performed.

[0029] The first Mark point image is an image of the material position on the circuit board to be mounted. Specifically, after placing the circuit board to be mounted, a camera can be called to shoot the circuit board to be mounted to determine the Mark point position of each material on the circuit board to be mounted, thereby obtaining the first Mark point image.

[0030] The second Mark point image is an image of the material position after the mounting device absorbs the material. Specifically, after placing the circuit board to be mounted, the mounting device can identify the first Mark point image to obtain the Mark point of each material. Then, the material suction device can be controlled to go to the material area to absorb the material according to the position of the identified Mark point. After absorbing the material, the camera can be called to shoot the material suction device to determine the arrangement position of each material on the material suction device, thereby obtaining the second Mark point image.

[0031] The mounting image is an operation image of the mounting equipment sucking materials. Specifically, when the material sucking device is controlled to suck materials from the material area, the camera is called to start recording images, and the material sucking device is recorded from the current position to the material area, sucking materials from the material area, and then moving from the material area to the circuit board to be mounted.

[0032] In a preferred embodiment, the material suction device will move after sucking the material. After the material suction device moves from the material area to the circuit board to be mounted and stabilizes, the camera can be called to shoot the material on the material suction device to obtain a second mark point image.

[0033] The image can be used to determine whether the position of the material is deviated, and whether the material is loose or shaking during the material collection and movement process. If there is deviation, looseness or shaking, corresponding adjustments can be made to improve the accuracy of the patch.

[0034] S12. Calculate image similarity based on the material positions of the first Mark point image and the second Mark point image to obtain position similarity.

[0035] In one embodiment, the first mark point image has the mark point position where the material is placed, and the second mark point image has the position where the material is placed. After acquiring the first mark point image and the second mark point image, the mark point position and the material position can be compared to see whether they overlap, thereby determining whether there is a position deviation.

[0036] Since there are one or more materials to be absorbed, the similarity of the positions in the two images can be calculated based on the probability of overlapping the positions of the materials in the images, and the position similarity can be obtained.

[0037] In an optional embodiment, the sucked materials may be multiple, which may be multiple components, for example, multiple resistors or capacitors need to be mounted at the same time. When mounting multiple components, if any component has a deviation, the circuit may be unusable or faulty. Therefore, it is necessary to calculate the similarity for each component.

[0038] Wherein, as an example, the calculating the image similarity according to the material positions of the first Mark point image and the second Mark point image to obtain the position similarity may include the following sub-steps: S21. If the number of sucked materials is multiple, determine the position coordinates of each material in the first Mark point image and the second Mark point image to obtain first position information of each material.

[0039] S22. Calculate the similarity of each material in position using the first position information to obtain multiple first similarities.

[0040] S23: Select a first similarity with the largest value from the multiple first similarities, and use the first similarity with the largest value as the position similarity.

[0041] Specifically, if there are multiple materials to be sucked, the position coordinates of each material in the first Mark point image and the position coordinates of each material in the second Mark point image can be determined to obtain the first position information of each material. The position coordinates can be image coordinates.

[0042] In one embodiment, when designing a circuit board, in order to reduce the volume of the circuit board, the components are generally arranged in a certain order. For example, if the entire circuit is designed with 50 resistors, the 50 resistors may be arranged in a rule of 10 rows and 5 columns. Then, the image coordinates of the resistors in each row and each column are obtained respectively.

[0043] Similarly, under normal circumstances, the absorbed resistor material is also arranged in a regular pattern of 10 rows and 5 columns, and the resistors in the second mark point image are also arranged in a regular pattern of 10 rows and 5 columns. The coordinates of each resistor in the image can also be obtained.

[0044] The first position information is used to calculate the similarity of each material in position to obtain multiple first similarities.

[0045] In an optional calculation method, in order to unify the format, the first Mark point image and the second Mark point image can be images of the same size and have the same image center. For example, the center of the arranged multiple components can be used as the image center. When calculating the similarity, the image coordinates of the image center can be obtained, and then the coordinate distance between the image coordinates of each material and the image coordinates of the image center can be calculated respectively. Then the ratio of the coordinate distances of the same material in the two images is calculated as the first similarity.

[0046] For example, first calculate the coordinate distance between the image coordinates of the first Mark point of the first Mark point image and the image coordinates of the image center of the first Mark point image, and then calculate the coordinate distance between the image coordinates of the first material component of the second Mark point image and the image coordinates of the image center of the second Mark point image. Finally, calculate the ratio of these two coordinate distances to obtain the first similarity of the first material component.

[0047] Similarly, the coordinate distance between the image coordinates of the second mark point of the first mark point image and the image coordinates of the image center of the first mark point image can be calculated, and then the coordinate distance between the image coordinates of the second material component of the second mark point image and the image coordinates of the image center of the second mark point image can be calculated. Finally, the ratio of these two coordinate distances is calculated to obtain the first similarity of the second material component.

[0048] Since the images are of the same size and the selected image centers are the same, the image coordinates of the image centers of the two images are the same. If the materials and the Mark points corresponding to the materials in the two images are the same, the corresponding image coordinates are also the same, and the calculated coordinate distances are also the same. However, if there is looseness or shaking, the material position of the second Mark point image will deviate, and its image coordinates will deviate from the image coordinates of its corresponding Mark point in the first Mark point image, and the calculated coordinate distances will also be different. Therefore, the coordinate distance can be used to determine whether there is a deviation between the two, and then the ratio of the coordinate distances can be used as the similarity between the two.

[0049] If the first similarity is calculated by the ratio of coordinate distances, the larger the ratio, the greater the deviation between the two, and vice versa, the smaller the ratio, the smaller the deviation between the two. Since there are multiple components, there are also multiple first similarities calculated. If any component has a deviation, the circuit may not be turned on. Therefore, the component with the largest deviation can be selected to determine whether adjustment is needed.

[0050] Specifically, a first similarity with the largest value may be selected from multiple first similarities, and the first similarity with the largest value may be used as the position similarity.

[0051] In another optional embodiment, there may be only one material to be sucked, and the component may be a chip or a single component. A single component or chip may have multiple pins, although the shape and structure of each pin are relatively fixed. However, when any pin patch has a deviation, the chip or component may not be used. For example, the power pin of the chip is not attached to the circuit, and the chip cannot be powered on and cannot be used. For this reason, it is necessary to calculate the similarity for all pins of a single component.

[0052] Wherein, as an example, the calculating the image similarity according to the material positions of the first Mark point image and the second Mark point image to obtain the position similarity may include the following sub-steps: S31. If the number of the sucked material is one, determine the position coordinates of each pin of the material in the first Mark point image and the second Mark point image to obtain second position information of each pin.

[0053] S32: Calculate the position similarity of each pin using the second position information to obtain multiple second similarities.

[0054] S33: Calculate an average value of the multiple second similarities to obtain position similarity.

[0055] Specifically, if the number of the sucked material is one, the position coordinates of each pin of the material in the first Mark point image and the second Mark point image are determined to obtain the second position information of each pin.

[0056] Specifically, the image coordinates of the Mark point of each pin in the first Mark point image can be determined according to the above steps to obtain its position coordinates. Similarly, the image coordinates of the second Mark point image of each pin can be determined to obtain its position coordinates.

[0057] Since there is only one material, the coordinates of the center of the material in the first Mark point image and the second Mark point image can be obtained. Specifically, the coordinates of the Mark point of the center of the material in the first Mark point image and the second Mark point image can be obtained.

[0058] When calculating the similarity, you can also follow the above steps to first calculate the coordinate distance between the image coordinates of the first component pin at the mark point of the first mark point image and the image coordinates of the image center of the first mark point image, and then calculate the coordinate distance between the image coordinates of the first component pin at the second mark point image and the image coordinates of the image center of the second mark point image. Finally, calculate the ratio of these two coordinate distances to obtain the second similarity of the first component pin. Then calculate the second similarity of the second component pin in the above manner.

[0059] After calculating multiple component pins, multiple second similarities can be obtained. Finally, the average value of the multiple second similarities can be calculated, and the average value is used as the position similarity.

[0060] S13. When the position similarity is less than a preset similarity, a shaking amplitude value of the mounting device is determined based on the mounting image, where the shaking amplitude value is the amplitude of shaking of the mounting device after the mounting device absorbs the material and moves to the top of the circuit board to be mounted.

[0061] After calculating the position similarity, you can determine whether the position similarity is less than the preset similarity. If the position similarity is less than the preset similarity, it means that the actual position of the material deviates greatly from the position of the Mark point. After mounting, the material or component cannot be at the Mark point. When powered on, the component may not be able to conduct, and the circuit may not communicate or fail. In order to correct this situation in time, you can first determine whether the cause of the deviation is looseness, shaking, or deflection of the component itself.

[0062] In one embodiment, the previous process has recorded the process of the equipment transporting materials, and the shaking amplitude value of the mounting equipment can be determined based on the recorded mounting image. The shaking amplitude value is the amplitude of the shaking of the mounting equipment after sucking the material and moving it above the circuit board to be mounted.

[0063] Optionally, the shaking amplitude value may also identify the amplitude of shaking of the material suction device of the placement equipment during the process of sucking the material and moving it above the circuit board to be placed.

[0064] In one embodiment, the trajectory that the mounting device needs to move may be long, and the duration of the recorded mounting image may also be long. If each frame of the mounting image is identified one by one, it will take a long time and be inefficient. In order to improve the processing efficiency, as an example, the determination of the shaking amplitude value of the mounting device based on the mounting image may include the following sub-steps: S131, extracting a plurality of mounting images from the mounting image, wherein the plurality of mounting images are images extracted at preset time intervals when the mounting equipment absorbs the material and moves it to the circuit board to be mounted.

[0065] S132, after identifying the mark of each mounting image according to the preset pattern mark to obtain the image mark, determine the image coordinates of each image mark.

[0066] S133, calculating the marking distance between two adjacent mounting images using the image coordinates to obtain a plurality of marking distance values.

[0067] S134, selecting the largest identification distance value from the multiple identification distance values, and taking the largest identification distance value as the shaking amplitude value.

[0068] Specifically, a number of mounting images can be extracted from the mounting image, and the plurality of mounting images are images extracted at preset time intervals during the process of the mounting device sucking the material and moving it to the circuit board to be mounted. For example, the preset time interval is 10ms, and then the mounting device sucks the material and moves it to the circuit board to be mounted for 30ms, then a mounting image is extracted every 10ms according to the preset time interval, and a total of 3 mounting images are extracted.

[0069] In a preferred embodiment, a plurality of mounting images can be continuously acquired during the period from when the mounting device absorbs the material and moves to above the circuit board to be mounted to when the mounting image ends.

[0070] Then, after the identification of each mounting image is obtained according to the preset pattern mark, the image coordinates of each image identification are determined.

[0071] In an actual operation mode, an artificial mark can be set in advance in the material suction device, and the mark can be an object or a color.

[0072] Then, the image coordinates of the mark in each mounting image can be obtained, and then the coordinate distance can be calculated using the image coordinates of two adjacent mounting images to obtain the identification distance between the two adjacent mounting images. Since there are several mounting images, multiple identification distance values ​​can be calculated.

[0073] If the material suction device does not shake during the movement, its image mark will not move. Correspondingly, the image coordinates of the image marks of the two adjacent mounting images will not change, and the calculated mark distance can be zero. Similarly, if the material suction device shakes during the movement, its image mark will move. Correspondingly, the image coordinates of the image marks of the two adjacent mounting images will also change, and the calculated mark distance can be greater than zero.

[0074] Next, the largest identification distance value may be selected from the plurality of identification distance values, and the largest identification distance value may be used as the shaking amplitude value, which is the distance value with the largest identification change.

[0075] S14. If the shaking amplitude value is greater than a preset amplitude value, the power value of the axis motor of the mounting equipment is adjusted according to the shaking amplitude value, so as to control the mounting equipment to perform mounting according to the adjusted power value.

[0076] After calculating the shaking amplitude value, it can be determined that the shaking amplitude value is greater than the preset amplitude value. If the shaking amplitude value is greater than the preset amplitude value, it means that the material suction device shakes greatly. It may be because the shaking of the material suction device causes the position of the material to deviate, and the material suction device needs to be adjusted.

[0077] Specifically, the power value of the axis motor of the placement equipment can be adjusted according to the swing amplitude value. After the adjustment and correction, the swing of the material suction device is small, and the placement equipment can be controlled to perform placement with the adjusted power value. This avoids further placement deviation of the circuit.

[0078] Optionally, in order to further reduce the mounting deviation, since the position deviation may be large, even if the mounting equipment is controlled to mount with an adjusted power value, the material with position deviation may still not be mounted on its corresponding Mark point.

[0079] When it is determined that the position similarity is less than the preset similarity, the technician of the placement equipment can be notified, and the technician will check the materials and the circuits to be mounted. If the placement technician determines that the placement equipment can be controlled by the adjusted power value for placement, the shaking amplitude value will be calculated. Alternatively, after the technician checks the materials and manually adjusts the materials, the shaking amplitude value will be calculated to avoid subsequent placement errors.

[0080] In one of the embodiments, the shaking amplitude value is large, which may be due to a fault in any component of the material suction device, which makes it impossible to suck the material tightly, causing the material to shake during the movement of the material suction device. In order to reduce the impact of the shaking, the output power value of the material suction device can be reduced according to the numerical value of the shaking amplitude value, thereby reducing the moving speed of the material suction device and further reducing the impact on the material during the movement or transportation of the material.

[0081] Wherein, as an example, adjusting the power value of the axis motor of the placement device according to the shaking amplitude value may include the following sub-steps: S141, calculating the ratio of the shaking amplitude value to a preset shaking upper limit value to obtain a shaking ratio value.

[0082] S142, adjusting the output power of the shaft motor of the mounting device according to the shaking ratio value to obtain a power value.

[0083] Specifically, the ratio of the sway amplitude value to the preset sway upper limit value can be calculated to obtain the sway ratio value. In one embodiment, the preset sway upper limit value can be the maximum distance value of the left and right swing of the material suction device. Specifically, a fulcrum of the material suction device can be used as the origin, and the length of the moving arm of the material suction device can be used as the radius to calculate the length of the semicircle, which can be used as the preset sway upper limit value.

[0084] Then adjust the output power of the axis motor of the placement equipment according to the shaking ratio value to obtain the power value. For example, assuming the shaking amplitude value is 10 mm and the preset shaking upper limit value is 100 mm, the shaking ratio value is 10 / 100=0.1. At this time, the output power of the axis motor of the placement equipment is 100kw, and the output power of the axis motor can be reduced by 0.1, and the power value is 100*(1-0.1)=90kw. Finally, use this power to control the output power of the axis motor of the placement equipment, and control the material suction device through the axis motor to place the material on the circuit.

[0085] S15. If the shaking amplitude value is less than a preset amplitude value, a position compensation value of the material is calculated according to the first Mark point image and the second Mark point image, so as to control the placement equipment to perform placement according to the position compensation value.

[0086] Similarly, if the shaking amplitude is less than the preset amplitude, it means that the deviation of the material position may be caused by the deflection of the component itself. The position compensation value of the material can be calculated based on the first mark point image and the second mark point image to control the placement equipment for placement according to the position compensation value.

[0087] In one embodiment, in order to accurately calculate the position compensation value, as an example, the calculating the position compensation value of the material according to the first Mark point image and the second Mark point image may include the following sub-steps: S151. Determine the position coordinates of the material in the first Mark point image and the second Mark point image to obtain first coordinates and second coordinates respectively.

[0088] S152. Calculate the coordinate distance of the material on the X-axis and the Y-axis using the first coordinate and the second coordinate to obtain a position compensation value.

[0089] Specifically, if there are multiple materials, the position coordinates of the first Mark point image and the second Mark point image of each material can be calculated respectively to obtain the first coordinates and the second coordinates of each material respectively.

[0090] Next, the coordinate distances of the first coordinate and the second coordinate of each material on the X-axis and the Y-axis may be calculated, thereby obtaining the position compensation value corresponding to each material.

[0091] If it is a material, the position coordinates of each pin of the material in the first mark point image and the second mark point image can be calculated to obtain the first coordinate and the second coordinate of each pin respectively. Then the coordinate distances of the first coordinate and the second coordinate of each pin on the X-axis and Y-axis are calculated to obtain the position compensation value corresponding to each pin.

[0092] Then adjust each position compensation value, specifically the current position of the material suction device, or show the position compensation value to the technicians of the placement equipment so that they can adjust it according to the position compensation value. After the adjustment, control the placement equipment to perform placement.

[0093] In another optional embodiment, the position similarity may be greater than a preset similarity, and the position offset of the material is small, so the mounting process may be performed directly without adjustment.

[0094] In order to facilitate technicians to view the process of mounting processing, as an example, after the step of calculating the image similarity according to the material positions of the first Mark point image and the second Mark point image to obtain the position similarity, the method further includes: When the position similarity is greater than a preset similarity, the placement device is controlled to place the material and a real-time image of the placement process is displayed on the device screen for user reference.

[0095] Specifically, when the position similarity is greater than the preset similarity, the placement equipment can be directly controlled to place materials. At the same time, the camera can be called to record the real-time image of the placement process and display the real-time image on the screen of the placement equipment for real-time reference by users or technicians.

[0096] In this embodiment, the embodiment of the present invention provides a method for adjusting the offset of a mark point, and its beneficial effects are: the present invention can respectively obtain an image and a mounting image; determine whether there is a position deviation between the material and its corresponding mark point according to the image, and when there is a position deviation, determine whether there is equipment shaking causing the position deviation according to the mounting image; if the position deviation is caused by equipment shaking, adjust the power value of the axis motor of the mounting equipment according to the shaking amplitude value of the equipment, and perform mounting according to the adjusted power value; if the position deviation is not caused by equipment shaking, calculate the position compensation value of the material, and perform mounting according to the position compensation value; through the above method, not only can the cause of the mounting deviation be accurately determined, but also adjustments can be made according to the cause of the deviation, so that the material matches the mark point of the circuit board, so as to improve the mounting accuracy and circuit manufacturing accuracy.

[0097] The embodiment of the present invention also provides a device for adjusting the Mark point offset, see Figure 2 , shows a schematic structural diagram of a Mark point offset adjustment device provided by an embodiment of the present invention.

[0098] Wherein, as an example, the Mark point offset adjustment device may include: The acquisition module 201 is used to respectively acquire a first mark point image, a second mark point image and a mounting image, wherein the first mark point image is an image of the material position on the circuit board to be mounted, the second mark point image is an image of the material position after the mounting device absorbs the material, and the mounting image is an operation image of the mounting device in the process of absorbing the material; A similarity calculation module 202 is used to calculate the image similarity according to the material positions of the first Mark point image and the second Mark point image to obtain position similarity; A shaking amplitude calculation module 203 is used to determine the shaking amplitude value of the mounting device based on the mounting image when the position similarity is less than a preset similarity, wherein the shaking amplitude value is the amplitude of shaking of the mounting device after the mounting device absorbs the material and moves to the top of the circuit board to be mounted; The power adjustment module 204 is used to adjust the power value of the axis motor of the placement device according to the swing amplitude value if the swing amplitude value is greater than the preset amplitude value, so as to control the placement device to perform placement according to the adjusted power value; The position compensation calculation module 205 is used to calculate the position compensation value of the material according to the first Mark point image and the second Mark point image if the shaking amplitude value is less than the preset amplitude value, so as to control the placement equipment to perform placement according to the position compensation value.

[0099] Optionally, calculating image similarity according to material positions of the first Mark point image and the second Mark point image to obtain position similarity includes: If the number of sucked materials is multiple, determine the position coordinates of each material in the first Mark point image and the second Mark point image to obtain the first position information of each material; Calculating the similarity of each material in position using the first position information to obtain multiple first similarities; A first similarity with the largest value is selected from the multiple first similarities, and the first similarity with the largest value is used as the position similarity.

[0100] Optionally, calculating image similarity according to material positions of the first Mark point image and the second Mark point image to obtain position similarity includes: If the number of the sucked material is one, determine the position coordinates of each pin of the material in the first Mark point image and the second Mark point image to obtain the second position information of each pin; Using the second position information to calculate the similarity of each pin in position, to obtain multiple second similarities; An average value of the plurality of second similarities is calculated to obtain a position similarity.

[0101] Optionally, calculating the position compensation value of the material according to the first Mark point image and the second Mark point image includes: Determine the position coordinates of the material in the first Mark point image and the position coordinates of the second Mark point image to obtain first coordinates and second coordinates respectively; The coordinate distances of the material on the X-axis and the Y-axis are calculated using the first coordinate and the second coordinate to obtain a position compensation value.

[0102] Optionally, determining the shaking amplitude value of the placement device based on the placement image includes: Extracting a plurality of mounting images from the mounting image, wherein the plurality of mounting images are images extracted at preset time intervals during the process of the mounting device sucking the material and moving it to the circuit board to be mounted; After identifying the mark of each mounting image according to the preset pattern mark to obtain the image mark, determine the image coordinates of each image mark; Calculating the marking distance between two adjacent mounting images using the image coordinates to obtain a plurality of marking distance values; The identification distance value with the largest value is selected from the multiple identification distance values, and the identification distance value with the largest value is used as the shaking amplitude value.

[0103] Optionally, adjusting the power value of the shaft motor of the placement device according to the shaking amplitude value includes: Calculate the ratio of the shaking amplitude value to the preset shaking upper limit value to obtain a shaking ratio value; The output power of the shaft motor of the mounting device is adjusted according to the shaking ratio value to obtain a power value.

[0104] Optionally, the device further comprises: The image display module is used to control the mounting equipment to mount materials and display the real-time image of the mounting process when the position similarity is greater than a preset similarity, and display the real-time image on the device screen for user reference.

[0105] Those skilled in the art can clearly understand that, for the sake of convenience and brevity of description, the specific working process of the device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0106] Furthermore, an embodiment of the present application also provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the method for adjusting the mark point offset as described in the above embodiment is implemented.

[0107] Furthermore, an embodiment of the present application also provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer-executable program, and the computer-executable program is used to enable a computer to execute the method for adjusting the mark point offset as described in the above embodiment.

[0108] It should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. When an element such as a layer, region or substrate is referred to as being "on" or "above" another element, it can be directly on the other element, or there can also be an intermediate element. On the contrary, when an element is referred to as "directly on" or "above" another element, there is no intermediate element. It should also be understood that when an element is referred to as being "under" or "below" another element, it can be directly under or below the other element, or there can also be an intermediate element. On the contrary, when an element is referred to as being "directly under" or "below" another element, there is no intermediate element. Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0109] Those skilled in the art will appreciate that the embodiments of the present application may also provide computer program products. Therefore, the present application may adopt the form of complete hardware embodiments, complete software embodiments, or embodiments in combination with software and hardware. Moreover, the present application may adopt the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program codes.

[0110] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), apparatuses, and computer program products according to the embodiments of the present application. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0111] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0112] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0113] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for adjusting a mark point offset, characterized in that: The method comprises: Acquire a first mark point image, a second mark point image and a mounting image respectively, wherein the first mark point image is an image of the material position on the circuit board to be mounted, the second mark point image is an image of the material position after the mounting device absorbs the material, and the mounting image is an operation image of the mounting device in the process of absorbing the material; Calculating image similarity based on material positions of the first Mark point image and the second Mark point image to obtain position similarity; When the position similarity is less than a preset similarity, the shaking amplitude value of the mounting device is determined based on the mounting image, and the shaking amplitude value is the amplitude of shaking of the mounting device after the mounting device absorbs the material and moves to the top of the circuit board to be mounted; If the shaking amplitude value is greater than the preset amplitude value, the power value of the axis motor of the mounting device is adjusted according to the shaking amplitude value, so as to control the mounting device to perform mounting according to the adjusted power value; If the shaking amplitude value is less than the preset amplitude value, a position compensation value of the material is calculated according to the first Mark point image and the second Mark point image, so as to control the placement equipment to perform placement according to the position compensation value.

2. The method for adjusting the Mark point offset according to claim 1, characterized in that: The calculating the image similarity according to the material positions of the first Mark point image and the second Mark point image to obtain the position similarity includes: If the number of sucked materials is multiple, determine the position coordinates of each material in the first Mark point image and the second Mark point image to obtain the first position information of each material; Calculating the similarity of each material in position using the first position information to obtain multiple first similarities; A first similarity with the largest value is selected from the multiple first similarities, and the first similarity with the largest value is used as the position similarity.

3. The method for adjusting the Mark point offset according to claim 1, characterized in that: The calculating the image similarity according to the material positions of the first Mark point image and the second Mark point image to obtain the position similarity includes: If the number of the sucked material is one, determine the position coordinates of each pin of the material in the first Mark point image and the second Mark point image to obtain the second position information of each pin; Using the second position information to calculate the similarity of each pin in position, to obtain multiple second similarities; An average value of the plurality of second similarities is calculated to obtain a position similarity.

4. The method for adjusting the Mark point offset according to claim 1, characterized in that: The calculating the position compensation value of the material according to the first Mark point image and the second Mark point image includes: Determine the position coordinates of the material in the first Mark point image and the position coordinates of the second Mark point image to obtain first coordinates and second coordinates respectively; The coordinate distances of the material on the X-axis and the Y-axis are calculated using the first coordinate and the second coordinate to obtain a position compensation value.

5. The method for adjusting the Mark point offset according to claim 1, characterized in that: The determining the shaking amplitude value of the placement device based on the placement image includes: Extracting a plurality of mounting images from the mounting image, wherein the plurality of mounting images are images extracted at preset time intervals during the process of the mounting device sucking the material and moving it to the circuit board to be mounted; After identifying the mark of each mounting image according to the preset pattern mark to obtain the image mark, determine the image coordinates of each image mark; Calculating the marking distance between two adjacent mounting images using the image coordinates to obtain a plurality of marking distance values; The identification distance value with the largest value is selected from the multiple identification distance values, and the identification distance value with the largest value is used as the shaking amplitude value.

6. The method for adjusting the mark point offset according to claim 1, characterized in that: The step of adjusting the power value of the shaft motor of the placement device according to the shaking amplitude value includes: Calculate the ratio of the shaking amplitude value to the preset shaking upper limit value to obtain a shaking ratio value; The output power of the shaft motor of the mounting device is adjusted according to the shaking ratio value to obtain a power value.

7. The method for adjusting the mark point offset according to any one of claims 1 to 6, characterized in that: After the step of calculating the image similarity according to the material positions of the first Mark point image and the second Mark point image to obtain the position similarity, the method further includes: When the position similarity is greater than a preset similarity, the placement device is controlled to place the material and a real-time image of the placement process is displayed on the device screen for user reference.

8. A device for adjusting the offset of a mark point, characterized in that: The device comprises: An acquisition module is used to respectively acquire a first Mark point image, a second Mark point image and a mounting image, wherein the first Mark point image is an image of the material position on the circuit board to be mounted, the second Mark point image is an image of the material position after the mounting device absorbs the material, and the mounting image is an operation image of the mounting device in the process of absorbing the material; A similarity calculation module, used to calculate the image similarity according to the material positions of the first Mark point image and the second Mark point image to obtain position similarity; A shaking amplitude calculation module, used for determining a shaking amplitude value of the mounting device based on the mounting image when the position similarity is less than a preset similarity, wherein the shaking amplitude value is the amplitude of shaking of the mounting device after the mounting device absorbs the material and moves to the top of the circuit board to be mounted; A power adjustment module, used for adjusting the power value of the shaft motor of the placement device according to the swing amplitude value if the swing amplitude value is greater than a preset amplitude value, so as to control the placement device to perform placement according to the adjusted power value; A position compensation calculation module is used to calculate the position compensation value of the material according to the first Mark point image and the second Mark point image if the shaking amplitude value is less than a preset amplitude value, so as to control the mounting equipment to perform mounting according to the position compensation value.

9. An electronic device, comprising: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method for adjusting the mark point offset as described in any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer-executable program, and the computer-executable program is used to enable a computer to execute the method for adjusting the mark point offset as described in any one of claims 1 to 7.

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