A chip placement mechanism for processing electronic components

Abstract

The invention discloses a patch mechanism for processing electronic components in the technical field of electronic component processing, comprising a working groove, a feeding device, a patch positioning device and a material moving device, wherein the material moving device comprises a moving component, a support plate and a rotating shaft, wherein a plurality of adjustment components, a moving plate and a suction cup are arranged on the rotating shaft, switching components are arranged at both ends of the rotating shaft, and a pushing plate and a switching shaft are arranged on the supporting plate. The invention loads and quickly positions a circuit board through a patch positioning device, realizes automatic loading of electronic components through a feeding device, and retrieves and transfers the electronic components on the feeding device through a material moving device; by arranging a plurality of adjustment components on the rotating shaft, and connecting the moving plate and a plurality of suction cups through the adjustment components, the number of materials retrieved by the material moving component is increased; the pushing plate moves outward, drives the adjustment component and the moving plate to move downward to retrieve materials, and the pushing plate moves inward, drives the switching shaft and the switching component to move, and switches the positions of a plurality of moving plates.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component processing, in particular to a patch mechanism for electronic component processing. Background Art

[0002] SMD electronic components are a new type of miniature components without leads or with short leads. They are suitable for installation on printed circuit boards without through holes. They are special components for surface mounting technology, with the characteristics of small size, light weight, good high-frequency characteristics, high reliability, and high production efficiency. Compared with traditional through-hole components, SMD electronic components have high installation density, reduced the influence of lead distribution, reduced parasitic capacitance and inductance, good high-frequency characteristics, and enhanced anti-electromagnetic interference and radio frequency interference capabilities. At present, SMD components have been widely used in high-tech products such as computers, mobile communication equipment, medical electronic products, and electrical equipment such as camcorders, LCD TVs, VCD players, and DVD players.

[0003] When performing patch processing on electronic components, it is usually necessary to pick up and transfer the electronic components so that the electronic components are transferred to the circuit board. Patent publication number CN217825579U is a fully automatic patch machine for electronic component processing, the structure of which mainly includes a workbench and a support frame located above the workbench, a placement slot located in the middle of the workbench, and patch slots located on both sides of the placement slot. A movable fixed frame and partition are provided in the patch slot, which can be used to fix the circuit board. A movable mounting plate and patch actuator are provided on the top of the support frame; the electronic components in the placement slot are transferred by the patch actuator that moves alternately left and right, and are transferred to the patch slots on both sides in turn to perform patch work.

[0004] However, during the process of the above device, due to the lack of a loading structure for electronic components, each time the patch actuator completes the picking and transfer of electronic components, it is necessary to manually place the electronic components into the placement slot so that the patch actuator can accurately pick up the materials, resulting in inconvenience in loading and transferring electronic components.

[0005] Based on this, the present invention designs a patch mechanism for electronic component processing to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide a chip placement mechanism for processing electronic components to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A patch mechanism for processing electronic components, comprising a working tank, a patch positioning device and a material moving device, wherein the working tank comprises a bottom plate and side plates fixed to both sides of the top of the bottom plate;

[0009] A loading device is provided on the top of the bottom plate, the loading device and the patch positioning device are both located between the two side plates, and the loading device is located on one side of the patch positioning device, and the material moving device is located above the loading device and the patch positioning device;

[0010] The material moving device includes a moving component located on the outer side of the side plate, a support plate fixed to the inner side of the top of the moving component, and a support cylinder fixed to the support plate, and the two support cylinders are rotatably connected with the same rotating shaft, and the outer side of the rotating shaft is evenly provided with a plurality of adjustment components along the circumferential direction, and the moving plate is connected through the adjustment components, and the outer side surface of each moving plate is provided with a plurality of suction cups along the length direction, and the plurality of suction cups are connected with pipelines and air pumps;

[0011] Both ends of the rotating shaft pass through the corresponding supporting cylinders and are fixed with switching components. A horizontal first electric telescopic rod is provided at the lower part of the supporting plate. A pushing plate is provided at one end of the first electric telescopic rod close to the adjusting component. A horizontal slide is fixed to the top of the pushing plate close to one side of the supporting plate. The slide is slidably connected to the supporting plate, and a vertical switching shaft is provided at the top of the slide corresponding to the position of the switching component, and the top end of the switching shaft is correspondingly connected to the switching component.

[0012] Preferably, the patch positioning device comprises two first material receiving plates symmetrically arranged between the side plates, two second material receiving plates symmetrically arranged below the first material receiving plates, the top surfaces of the first material receiving plates and the second material receiving plates are both provided with a plurality of positioning grooves, and positioning components are arranged at the positioning grooves, a fixed vertical plate is arranged on the top surface of the bottom plate, the first material receiving plates and the second material receiving plates are in contact with the fixed vertical plate on one side close to the feeding device, and the feeding device is located on the other side of the fixed vertical plate;

[0013] A rotating cylinder is fixed to one end of the two first material receiving plates close to the side plate, a fixed horizontal plate is provided at the corresponding position on the fixed vertical plate, the top of the rotating cylinder is rotatably connected to the fixed horizontal plate, and a torsion spring is provided at the rotating connection, the bottom of the rotating cylinder is connected to a lifting rotating assembly, and the corresponding end of the bottom of the second material receiving plate is connected to the lifting rotating assembly on the corresponding side through a connecting frame.

[0014] Preferably, the positioning assembly includes a top plate located above the inner ends of the plurality of positioning grooves, fixed blocks are symmetrically fixed on both sides of the bottom of the top plate, and are fixedly connected to the top surface of the corresponding first material receiving plate or the second material receiving plate through the fixed blocks, a slide groove is provided on the fixed block, a slider is slidably connected in the slide groove, and a pressure plate is fixed between the two sliders;

[0015] The top surface of the pressing plate and the bottom surface of the top plate are respectively provided with electromagnets, which are electrically connected to a power supply and a switch. A positioning block is fixed at the bottom of the pressing plate corresponding to the position of each positioning groove, and the bottom end of the positioning block extends into the positioning groove. The bottom surface of the pressing plate is connected to the corresponding top surface of the first material receiving plate or the second material receiving plate through a plurality of evenly arranged springs, and the positions of the springs and the positioning blocks are staggered.

[0016] Preferably, the lifting and rotating assembly includes a lifting plate located above the bottom plate, the bottom of the lifting plate is connected to the bottom plate through a second electric telescopic rod, two ends of the lifting plate are symmetrically arranged and rotatably connected with a vertical lifting shaft, and a torsion spring is provided at the rotating connection, the connecting frame is fixedly connected to the lifting shaft on the corresponding side, and the top end of the lifting shaft extends into the rotating cylinder, and a first guide shaft is fixed to one side of the top end, a fixed cylinder is provided at a position on the bottom plate corresponding to the lifting shaft, the bottom end of the lifting shaft extends into the fixed cylinder, and a second guide shaft is fixed to one side of the bottom end;

[0017] A first guide groove is provided on the inner wall of the rotating cylinder at a position corresponding to the first guide axis, and a second guide groove is provided on the inner wall of the fixed cylinder at a position corresponding to the second guide axis. The upper and lower parts of the first guide groove are vertically arranged, and the middle part is inclined. Both ends of the inclined section of the first guide groove are connected with the upper and lower parts of the first guide groove. The middle and upper part of the second guide groove is vertically arranged, and the lower part is inclined.

[0018] Preferably, the adjusting component includes a rotating plate located outside the rotating shaft, the inner side surface of the rotating plate is fixedly connected to the rotating shaft through a connecting rod, and two pushing grooves are symmetrically provided on the outer side surface of the rotating plate, a pushing block is slidably connected in the pushing groove, a pushing shaft is fixed on one side of the pushing block, the end of the pushing shaft extends out of the pushing groove and is correspondingly connected to the pushing plate, and one end of the pushing shaft is provided on the pushing block and is connected to the inner end of the pushing groove through a spring, and an inclined pushing rod is rotatably connected to the other side of the pushing block, the two pushing rods are symmetrically arranged, and the outer ends are both rotatably connected to the inner side surface of the movable plate.

[0019] Preferably, a spring shaft is fixed in the middle of the inner side surface of the movable plate, one end of the spring shaft passes through the rotating plate and is fixed with a spring plate, and a spring is connected between the spring plate and the rotating plate.

[0020] Preferably, the moving assembly includes a guide plate fixed to the outside of the side plate, a connecting plate is fixed between the top two ends of the guide plate and the side plates, the top surface of the guide plate is slidably connected to a moving seat, two screws are threadedly connected in the moving seat, the screws are rotatably connected to the connecting plate, a transmission gear is fixed to one end of the screw, the two transmission gears are meshed with each other, and the threads of the two screws are in opposite directions, the other end of one of the screws is connected to a motor, a fixed frame is fixed to the top surface of the moving seat, the top of the fixed frame is horizontally arranged, and the support plate is fixed to the bottom of the horizontal section of the fixed frame.

[0021] Preferably, the switching assembly includes a switching column fixed to the end of the rotating shaft, a plurality of shaft grooves are evenly arranged on the circumferential side wall of the switching shaft, two adjacent shaft grooves are connected by an inclined switching groove, and the top end of the switching shaft is located in the shaft groove at the bottom of the switching column, and an inclined first one-way baffle is arranged at a position corresponding to the switching groove in the shaft groove, one end of the first one-way baffle is rotatably connected to the higher end of the bottom surface of the switching groove, and a torsion spring is arranged at the rotation connection, and a first baffle is arranged on the side wall of the shaft groove at a position corresponding to the other end of the first one-way baffle;

[0022] A second one-way baffle is provided at the lower end of the switching slot, and the top end of the second one-way baffle is rotatably connected to the top of the lower end of the switching slot. A torsion spring is provided at the rotating connection, and a second baffle is correspondingly provided at the bottom of the lower end of the switching slot, and a third baffle is correspondingly provided on the side wall of the shaft slot away from the second one-way baffle.

[0023] Preferably, a plurality of V-shaped slots are evenly arranged along the circumferential direction on the switching column near the supporting tube, and the positions of the slots correspond one-to-one to the positions of the movable plate. A telescopic slot is fixed correspondingly to the top of one end of the supporting tube, and a card block is connected to the telescopic slot through a spring. The bottom end of the card block is set to a semicircular shape and extends out of the telescopic slot and is located in the slot at the top of the switching column.

[0024] Preferably, the loading device includes a conveying wheel rotatably connected between two side plates, a conveying belt is provided on the conveying wheel, a first pulley is coaxially fixed to one side of the conveying belt, the first pulley is connected to the second pulley through a transmission belt, the second pulley is connected to a motor, and the motor is fixed to the bottom plate, a plurality of transverse and parallel carrying belts are evenly arranged on the conveying belt, the carrying belt is provided with a plurality of material troughs, and the plurality of material troughs correspond one-to-one to the positions of a plurality of suction cups on the same rotating plate.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] 1. The present invention uses a patch positioning device to load and quickly position the circuit board, uses the loading device to realize automatic loading of electronic components, and uses a material transfer device to pick up and transfer the electronic components on the loading device, so that the electronic patch is faster and more convenient, and the processing efficiency is improved;

[0027] 2. The present invention increases the number of materials taken by the material transfer component by arranging multiple adjustment components on the rotating shaft and connecting the moving plate and multiple suction cups through the adjustment components, thereby reducing the number of reciprocating movements during subsequent patch processing and further improving processing efficiency;

[0028] 3. The present invention moves the push plate outward to drive the adjustment assembly and the movable plate downward to pick up materials, and moves the push plate inward to drive the switching shaft and the switching assembly to move so as to switch the positions of the rotating shaft and multiple movable plates, thereby realizing position switching and material picking of multiple movable plates through intermittent reciprocating movement of the push plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0030] Figure 1 It is a schematic diagram of the structure of the present invention;

[0031] Figure 2 It is a structural schematic diagram of the side plate of the present invention;

[0032] Figure 3 for Figure 1 Schematic diagram of the structure at A in the middle;

[0033] Figure 4 It is a structural schematic diagram of the rotating plate of the present invention;

[0034] Figure 5 It is a structural schematic diagram of the support plate of the present invention;

[0035] Figure 6 It is a schematic diagram of the expansion of the circumferential side wall of the switching column of the present invention;

[0036] Figure 7 for Figure 6 Schematic diagram of the structure at C in the middle;

[0037] Figure 8 It is a structural schematic diagram of the card block of the present invention;

[0038] Fig. 9 It is a structural schematic diagram of the first material receiving plate of the present invention;

[0039] Fig.10 It is a structural schematic diagram of the lifting shaft of the present invention;

[0040] Fig.11 for Figure 1 Schematic diagram of the structure at B in the middle;

[0041] Fig.12 It is a structural schematic diagram of the pressing plate of the present invention;

[0042] Fig.13 It is a schematic structural diagram of the carrier tape of the present invention.

[0043] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0044] 100-bottom plate, 101-side plate, 102-fixed vertical plate, 103-guide plate, 104-connecting plate, 105-fixed horizontal plate, 106-fixed cylinder, 107-second guide groove;

[0045] 200- conveyor belt, 201- conveyor wheel, 202- first pulley, 203- second pulley, 204- material carrying belt, 205- material trough;

[0046] 300-moving seat, 301-screw rod, 302-transmission gear, 303-fixed frame, 304-support plate, 305-support cylinder, 306-first electric telescopic rod, 307-pushing plate, 308-slide plate, 309-switching shaft;

[0047] 400-rotating shaft, 401-rotating plate, 402-connecting rod, 403-moving plate, 404-suction cup, 405-driving shaft, 406-driving block, 407-driving groove, 408-driving rod, 409-spring shaft, 410-spring plate;

[0048] 500-first material receiving plate, 501-second material receiving plate, 502-connecting frame, 503-positioning groove, 504-top plate, 505-positioning block, 506-pressing plate, 507-fixing block, 508-sliding groove, 509-sliding block, 510-electromagnet;

[0049] 600-switching column, 601-shaft slot, 602-first one-way baffle, 603-switching slot, 604-second one-way baffle, 605-first baffle slot, 606-second baffle slot, 607-third baffle slot, 608-card slot, 609-telescopic slot, 610-card block;

[0050] 700-lifting shaft, 701-lifting plate, 702-second electric telescopic rod, 703-rotating cylinder, 704-first guide groove, 705-first guide shaft, 706-second guide shaft. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Embodiment 1

[0052] Please refer to the accompanying drawings, the present invention provides a technical solution:

[0053] A chip placement mechanism for processing electronic components, such as Figure 1 As shown, it includes a working tank, a patch positioning device and a material moving device, and the working tank includes a bottom plate 100 and side plates 101 fixed on both sides of the top of the bottom plate 100;

[0054] A loading device is provided on the top of the bottom plate 100. The loading device and the patch positioning device are both located between the two side plates 101. The loading device is located on one side of the patch positioning device, and the material moving device is located above the loading device and the patch positioning device.

[0055] like Figure 2 As shown, the material moving device includes a moving component located on the outer side of the side plate 101, a support plate 304 fixed to the inner side of the top of the moving component, and a support cylinder 305 fixed to the support plate 304, and the two support cylinders 305 are rotatably connected to the same rotating shaft 400, and the outer side of the rotating shaft 400 is evenly provided with a plurality of adjustment components along the circumferential direction, and is connected to the moving plate 403 through the adjustment components, as shown in FIG. Figure 3 As shown, a plurality of suction cups 404 are provided on the outer side surface of each movable plate 403 along the length direction, and the plurality of suction cups 404 are connected to pipelines and air pumps;

[0056] Both ends of the rotating shaft 400 pass through the corresponding supporting cylinders 305 and are fixed with switching components, such as Figure 5 As shown, a horizontal first electric telescopic rod 306 is provided at the lower part of the support plate 304, and a pushing plate 307 is provided at one end of the first electric telescopic rod 306 close to the adjusting component, and a horizontal slide plate 308 is fixed to the top of the pushing plate 307 close to the side of the support plate 304, the slide plate 308 is slidably connected to the support plate 304, and a vertical switching shaft 309 is provided at the top of the slide plate 308 corresponding to the position of the switching component, and the top of the switching shaft 309 is correspondingly connected to the switching component.

[0057] When performing patch processing on electronic components, the circuit board is loaded and positioned by the patch positioning device, the electronic components are loaded and conveyed in batches by the loading device, and then the electronic components on the loading device are picked up and transferred by the moving device, and transferred to the patch positioning device for patch processing, thereby realizing rapid positioning of the circuit board and automatic loading of electronic components, as well as transfer patch of electronic components, making electronic patching faster and more convenient, and improving processing efficiency.

[0058] When the material moving device is located at the loading device, the first electric telescopic rod 306 drives the push plate 307 and the slide plate 308 to move, and the push plates 307 on both sides contact the two ends of the adjustment component below the rotating shaft 400, and drive the adjustment component to move, so that the corresponding moving plate 403 drives the suction cup 404 thereon to move downward, and the electronic components at the loading device correspond to the positions of the suction cup 404 one by one, so that the electronic components are adsorbed and taken out by the suction cup 404;

[0059] Then the first electric telescopic rod 306 drives the pushing plate 307 and the sliding plate 308 away from the adjusting component, and drives the switching shaft 309 to move. Through the relative movement of the switching shaft 309 and the switching component, the switching component drives the rotating shaft 400 to rotate a certain angle and switch the positions of two adjacent moving plates 403. Therefore, during the multiple intermittent reciprocating movements of the pushing plate 307 and other structures, the rotating shaft 400 rotates intermittently. Each time it rotates, the position of the moving plate 403 is switched once, and multiple moving plates 403 complete the adsorption and material collection in sequence, thereby increasing the number of material collections, reducing the number of reciprocating movements during subsequent patch processing, and further improving the processing efficiency.

[0060] When the material moving device drives the electronic components to move to the patch positioning device, through each movement of the push plate 307, the adjustment component below the rotating shaft 400 drives the movable plate 403 to drive the suction cup 404 and the electronic components to move onto the circuit board. When the electronic components are fixed to the circuit board by gluing or soldering, the suction cup 404 cancels the adsorption and fixation of the electronic components and moves back up. Then, through the intermittent reciprocating movement of the push plate 307 and other structures, the positions of multiple movable plates 403 are switched in turn, and the electronic components can be fixed to the corresponding circuit boards in turn.

[0061] Different electronic components can be fixed on the movable plate 403 at different positions on the rotating shaft 400, and the rotating shaft 400 can be moved relative to the circuit board through the cooperation of the movable components, so as to fix different electronic components to different positions on the circuit board.

[0062] Among them, Figure 1 As shown, the patch positioning device includes two first material receiving plates 500 symmetrically arranged between the side plates 101, two second material receiving plates 501 are symmetrically arranged below the first material receiving plates 500, the top surfaces of the first material receiving plates 500 and the second material receiving plates 501 are both provided with a plurality of positioning grooves 503, and positioning components are arranged at the positioning grooves 503, a fixed vertical plate 102 is arranged on the top surface of the bottom plate 100, the first material receiving plates 500 and the second material receiving plates 501 are in contact with the fixed vertical plate 102 on one side close to the feeding device, and the feeding device is located on the other side of the fixed vertical plate 102;

[0063] like Fig. 9 As shown, a rotating cylinder 703 is fixed to one end of the two first receiving plates 500 close to the side plate 101, a fixed horizontal plate 105 is provided at a corresponding position on the fixed vertical plate 102, the top of the rotating cylinder 703 is rotatably connected to the fixed horizontal plate 105, and a torsion spring is provided at the rotatable connection, the bottom of the rotating cylinder 703 is connected to a lifting and rotating assembly, and the corresponding end of the bottom of the second receiving plate 501 is connected to the lifting and rotating assembly on the corresponding side through a connecting frame 502.

[0064] When performing patch processing, multiple circuit boards are placed in the corresponding positioning grooves 503 on the first receiving plate 500, and the top inner section of the circuit board is positioned by the positioning assembly. Then, the electronic components are picked up and transferred by the material moving device and transferred to the circuit board for the corresponding patch processing operation.

[0065] After the circuit board on the first receiving plate 500 is processed, the lifting and rotating assembly drives the second receiving plate 501 to move upward, and during the upward movement of the second receiving plate 501, the rotating cylinder 703 and the first receiving plate 500 are driven to rotate toward the side plate 101, so that the positions of the second receiving plate 501 and the first receiving plate 500 are staggered, and the second receiving plate 501 can be moved up to the height position of the first receiving plate 500 and perform corresponding patch processing. At the same time, the first receiving plate 500 is located at the side plate 101, and the processed circuit boards are unloaded, and the new circuit boards are loaded and positioned.

[0066] After the circuit board on the second receiving plate 501 is processed, the lifting and rotating assembly drives the second receiving plate 501 to move downward, and during the downward movement of the second receiving plate 501, drives the rotating cylinder 703 and the first receiving plate 500 to rotate back to the fixed vertical plate 102 to continue the patch processing, and then the second receiving plate 501 continues to move downward, and during the downward movement, is driven by the lifting and rotating assembly to rotate toward the side plate 101 so as to be staggered with the first receiving plate 500 for unloading and reloading of circuit boards.

[0067] Among them, Fig. 9 As shown, the lifting and rotating assembly includes a lifting plate 701 located above the bottom plate 100, the bottom of the lifting plate 701 is connected to the bottom plate 100 through a second electric telescopic rod 702, and the two ends of the lifting plate 701 are symmetrically arranged and rotatably connected with a vertical lifting shaft 700, and a torsion spring is provided at the rotating connection, the connecting frame 502 is fixedly connected to the lifting shaft 700 on the corresponding side, and the top end of the lifting shaft 700 extends into the rotating cylinder 703, and a first guide shaft 705 is fixed on one side of the top end, and a fixed cylinder 106 is provided at a position corresponding to the lifting shaft 700 on the bottom plate 100, the bottom end of the lifting shaft 700 extends into the fixed cylinder 106, and a second guide shaft 706 is fixed on one side of the bottom end;

[0068] like Fig.10 As shown, a first guide groove 704 is provided on the inner wall of the rotating cylinder 703 at a position corresponding to the first guide axis 705, and a second guide groove 107 is provided on the inner wall of the fixed cylinder 106 at a position corresponding to the second guide axis 706. The upper and lower parts of the first guide groove 704 are both vertically arranged, and the middle part is inclined. Both ends of the inclined section of the first guide groove 704 are connected to the upper and lower parts of the first guide groove 704, and the middle and upper part of the second guide groove 107 is vertically arranged, and the lower part is inclined.

[0069] When the first receiving plate 500 and the second receiving plate 501 are both located at the fixed vertical plate 102 , the first guide shaft 705 is located in the vertical section at the lower part of the first guide groove 704 , and the second guide shaft 706 is located in the vertical section at the middle and upper part of the second guide groove 107 .

[0070] When the first material receiving plate 500 completes the patch processing, the second electric telescopic rod 702 drives the lifting plate 701, the connecting frame 502 and the second material receiving plate 501 to move upward, and in the process of moving upward, the first guide shaft 705 enters the inclined section of the first guide groove 704, and the second guide shaft 706 is still located in the vertical section of the second guide groove 107, so that the position of the lifting shaft 700 is limited by the second guide groove 107 and the second guide shaft 706, so that it can only move but not rotate. At the same time, the first guide shaft 705 drives the rotating cylinder 703 to rotate through the action of the inclined section of the first guide groove 704, and then drives the first material receiving plate 500 to rotate through the rotating cylinder 703, approaches the side plate 101, and staggers the position of the second material receiving plate 501;

[0071] Then the lifting plate 701 and the lifting shaft 700 continue to move upward, so that the first guide shaft 705 is located in the upper vertical section of the first guide groove 704, and the second material receiving plate 501 is moved up to the height position of the first material receiving plate 500 through the connecting frame 502 to facilitate subsequent patch processing. During the upward movement, the lifting shaft 700 is always limited by the second guide shaft 706 and the vertical section of the second guide groove 107 and will not rotate.

[0072] When the second material receiving plate 501 completes the patch processing and the first material receiving plate 500 completes the circuit board loading and positioning, the lifting plate 701 drives the lifting shaft 700 and the second material receiving plate 501 to move downward, and in the process of moving downward, through the action of the first guide groove 704 and the first guide shaft 705, the first material receiving plate 500 can rotate under the action of the torsion spring after the second material receiving plate 501 moves downward and return to the fixed vertical plate 102;

[0073] When the first guide shaft 705 moves downward and disengages from the rotating cylinder 703 and the first guide groove 704, the second guide shaft 706 enters the inclined section of the second guide groove 107, and the second guide shaft 706 drives the lifting shaft 700 to rotate through the fixed second guide groove 107, and then drives the second material receiving plate 501 to rotate toward the side plate 101 through the connecting frame 502, so as to unload the circuit boards on the second material receiving plate 501, and load and position the circuit boards again.

[0074] Among them, Figure 3 As shown, the switching assembly includes a switching column 600 fixed to the end of the rotating shaft 400, and a plurality of shaft grooves 601 are evenly arranged on the circumferential side wall of the switching shaft 309. Figure 6 As shown, two adjacent shaft grooves 601 are connected through an inclined switching groove 603, and the top end of the switching shaft 309 is located in the shaft groove 601 at the bottom of the switching column 600, and an inclined first one-way baffle 602 is provided at a position corresponding to the switching groove 603 in the shaft groove 601, one end of the first one-way baffle 602 is rotatably connected to the higher end of the bottom surface of the switching groove 603, and a torsion spring is provided at the rotation connection, and a first baffle groove 605 is provided on the side wall of the shaft groove 601 corresponding to the other end of the first one-way baffle 602;

[0075] like Figure 7 As shown, a second one-way baffle 604 is provided at the lower end of the switching slot 603, and the top of the second one-way baffle 604 is rotatably connected to the top of the lower end of the switching slot 603, a torsion spring is provided at the rotational connection, and a second baffle 606 is correspondingly provided at the bottom of the lower end of the switching slot 603, and a third baffle 607 is correspondingly provided on the side wall of the shaft slot 601 away from the second one-way baffle 604.

[0076] When the switching shaft 309 moves toward the direction of the rotating shaft 400 along with the slide plate 308 and the pushing plate 307, the switching shaft 309 moves along the shaft groove 601, and when passing through the first one-way baffle 602, it pushes the first one-way baffle 602 to rotate, and continues to move along the shaft groove 601, so that the rotating shaft 400 and the structure thereon do not rotate, and during the movement of the pushing plate 307, it contacts and moves the pushing shaft 405, thereby adjusting the position of the movable plate 403 and the suction cup 404.

[0077] When the push plate 307 and the switching shaft 309 return to their original positions, the push plate 307 is disengaged from the push shaft 405, and the switching shaft 309 moves to the first one-way baffle 602. The end of the first one-way baffle 602 is limited by the first stop groove 605 and cannot rotate, so that the switching shaft 309 moves along the first one-way baffle 602 and the switching groove 603 to the shaft groove 601 at the adjacent position when continuing to move, and pushes the second one-way baffle 604 away to move to the inside of the adjacent shaft groove 601.

[0078] Since the switching shaft 309 can only move in a straight line direction and the switching column 600 can only rotate, the switching column 600 and the rotating shaft 400 rotate accordingly through the relative movement of the switching shaft 309 and the switching column 600, so that the next movable plate 403 and the suction cup 404 and other structures thereon can rotate to the bottom of the rotating shaft 400.

[0079] Therefore, during the intermittent and reciprocating movement of the push plate 307, the slide plate 308 and the switching shaft 309, the adjustment component and the switching component can be driven to move in turn, thereby realizing the operation of moving and fetching materials and switching positions of multiple moving plates 403.

[0080] Among them, Figure 1As shown, the loading device includes a conveying wheel 201 rotatably connected between two side plates 101, and a conveying belt 200 is provided on the conveying wheel 201. Figure 3 As shown, a first pulley 202 is coaxially fixed to one side of the conveyor belt 200, the first pulley 202 is connected to a second pulley 203 through a transmission belt, the second pulley 203 is connected to a motor, and the motor is fixed on the bottom plate 100, and a plurality of transverse and parallel carrying belts 204 are evenly arranged on the conveyor belt 200, as shown in FIG. Fig.13 As shown, the carrier belt 204 is provided with a plurality of material slots 205 , and the plurality of material slots 205 correspond one-to-one to the positions of the plurality of suction cups 404 on the same rotating plate 401 .

[0081] When loading electronic components, the electronic components are placed in the material slots 205 on each carrier belt 204 in sequence. The material slots 205 can be set according to the shapes of the electronic components so that the electronic components can be stably placed therein, which is convenient for subsequent suction cups 404 and other structures to take out the materials.

[0082] When the conveyor belt 200 needs to move, the conveyor wheel 201 is rotated by the drive of the motor and the first pulley 202 and the second pulley 203, and then the conveyor belt 200 and the multiple carrying belts 204 thereon are driven to move through the conveyor wheel 201; when the carrying belt 204 moves to the material picking position, the conveyor belt 200 pauses to allow the movable plate 403 and the suction cup 404 below the rotating shaft 400 to pick up the material, and then the movable plate 403 moves back to its position, and the rotating shaft 400 rotates to switch the position, and the conveyor belt 200 moves again, so that the next carrying belt 204 moves to the material picking position for the next movable plate 403 to pick up the material, thereby realizing the loading, conveying and picking of electronic components.

[0083] According to processing requirements, several carrier belts 204 can be divided into a group, and the number of carrier belts 204 in a group corresponds to the number of movable plates 403 on the rotating shaft 400, and different electronic components are placed on different carrier belts 204 in the same group, so that the material picking device can absorb and pick up multiple electronic components at the same time, and perform chip processing of multiple electronic components on the circuit board. Embodiment 2

[0084] The structure of this embodiment is basically the same as that of the first embodiment, except that Fig. 9 As shown, the positioning assembly includes a top plate 504 located above the inner ends of a plurality of positioning slots 503, such as Fig.11 As shown, fixed blocks 507 are symmetrically fixed on both sides of the bottom of the top plate 504, and are fixedly connected to the top surface of the corresponding first material receiving plate 500 or the second material receiving plate 501 through the fixed blocks 507. A slide groove 508 is provided on the fixed block 507, and a slider 509 is slidably connected in the slide groove 508. A pressing plate 506 is fixed between the two sliders 509.

[0085] like Fig.12 As shown, the top surface of the pressing plate 506 and the bottom surface of the top plate 504 are respectively provided with an electromagnet 510, and the electromagnet 510 is electrically connected to a power supply and a switch. A positioning block 505 is fixed at the bottom of the pressing plate 506 corresponding to the position of each positioning groove 503, and the bottom end of the positioning block 505 extends into the positioning groove 503. The bottom surface of the pressing plate 506 is connected to the corresponding top surface of the first material receiving plate 500 or the second material receiving plate 501 through a plurality of evenly arranged springs, and the positions of the springs and the positioning blocks 505 are staggered.

[0086] After the circuit board is placed in the positioning groove 503, the electromagnet 510 is energized and repels each other, so that the pressure plate 506 moves downward under the guidance of the slide groove 508 and the slider 509, thereby compressing the spring and driving the positioning block 505 to move downward, so that the top of the positioning block 505 is pressed tightly against the top of the corresponding inner section of the circuit board, and the circuit board is pressed and positioned for subsequent patch processing; after the processing is completed, the electromagnet 510 is powered off, so that the pressure plate 506 drives the positioning block 505 to move back to its position under the action of the spring, quickly canceling the positioning of the circuit board, and facilitating the unloading of the circuit board. Embodiment 3

[0087] The structure of this embodiment is basically the same as that of the first embodiment, except that Figure 4 As shown, the adjustment component includes a rotating plate 401 located on the outside of the rotating shaft 400, the inner side surface of the rotating plate 401 is fixedly connected to the rotating shaft 400 through a connecting rod 402, and two pushing grooves 407 are symmetrically arranged on the outer side surface of the rotating plate 401, a pushing block 406 is slidably connected in the pushing groove 407, a pushing shaft 405 is fixed to one side of the pushing block 406, the end of the pushing shaft 405 extends out of the pushing groove 407 and is correspondingly connected to the pushing plate 307, and one end of the pushing shaft 405 is provided on the pushing block 406 and is connected to the inner end of the pushing groove 407 through a spring, and the other side of the pushing block 406 is rotatably connected to an inclined pushing rod 408, the two pushing rods 408 are symmetrically arranged, and the outer ends are both rotatably connected to the inner side surface of the movable plate 403.

[0088] When the rotating plate 401 and the movable plate 403 thereon rotate to the position below the rotating shaft 400, the rotating plate 401 is located between the two pushing plates 307, and the first electric telescopic rod 306 drives the pushing plate 307 to move, and the pushing plate 307 contacts the pushing shaft 405, and moves the pushing shaft 405 and the pushing block 406, and the pushing blocks 406 on both sides move toward the middle direction of the rotating plate 401 at the same time, thereby driving the pushing rod 408 to move, and driving the movable plate 403 and the suction cup 404 thereon to move downward through the outer ends of the two pushing rods 408, and then contact the electronic components to absorb and take materials.

[0089] Among them, Figure 4As shown, a spring shaft 409 is fixed in the middle of the inner side surface of the movable plate 403, one end of the spring shaft 409 passes through the rotating plate 401 and is fixed with a spring plate 410, and a spring is connected between the spring plate 410 and the rotating plate 401. The spring shaft 409 provides a limiting guide for the movement of the movable plate 403, and the spring and the spring plate 410 further increase the pulling force on the movable plate 403, thereby improving the position stability of the movable plate 403 when it is retracted to the rotating plate 401. Embodiment 4

[0090] The structure of this embodiment is basically the same as that of the first embodiment, except that Figure 2 As shown, the moving assembly includes a guide plate 103 fixed to the outside of the side plate 101, a connecting plate 104 is fixed between the top two ends of the guide plate 103 and the side plate 101, a moving seat 300 is slidably connected to the top surface of the guide plate 103, two screws 301 are threadedly connected in the moving seat 300, the screws 301 are rotatably connected to the connecting plate 104, a transmission gear 302 is fixed to one end of the screw 301, the two transmission gears 302 are meshed with each other, and the threads of the two screws 301 are opposite, the other end of one of the screws 301 is connected to a motor, a fixing frame 303 is fixed to the top surface of the moving seat 300, the top of the fixing frame 303 is horizontally arranged, and a support plate 304 is fixed to the bottom of the horizontal section of the fixing frame 303.

[0091] After the material moving device takes the material from the loading device, the screw 301 is rotated through the drive of the motor and the transmission gear 302, and the movable seat 300 and the fixed frame 303 are driven to move along the guide plate 103, thereby driving the support plate 304 and the rotating shaft 400 and other structures to move from the loading device to the patch positioning device, so as to perform the corresponding patch work. Embodiment 5

[0092] The structure of this embodiment is basically the same as that of the first embodiment, except that Figure 8 As shown, a plurality of V-shaped slots 608 are evenly arranged along the circumferential direction on the switching column 600 near the supporting cylinder 305, and the positions of the slots 608 correspond one-to-one to the positions of the movable plate 403. A telescopic slot 609 is fixed correspondingly to the top of one end of the supporting cylinder 305, and a block 610 is connected to the telescopic slot 609 through a spring. The bottom end of the block 610 is set to be semicircular and extends out of the telescopic slot 609 and is located in the slot 608 at the top of the switching column 600.

[0093] When the switch column 600 is not moving, the position stability of the switch column 600 is improved by the slot 608 and the block 610; when the switch shaft 309 moves and the switch column 600 is rotated by the cooperation of the switch slot 603 and other structures, the slot 608 moves relative to the block 610, and under the action of the inclined inner wall of the slot 608, the block 610 retracts and disengages from the slot 608, and then moves along the circumferential side of the switch column 600 to the position of the next slot 608, and the switch column 600 stops moving, and the bottom of the switch column 600 is limited by the switch shaft 309, while the top of the switch column 600 is limited by the slot 608 and the block 610, so as to further improve the position stability of the switch column 600 when it is not moving.

[0094] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0095] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A chip placement mechanism for processing electronic components, comprising a working tank, a chip placement positioning device and a material moving device, wherein the working tank comprises a bottom plate (100) and side plates (101) fixed to both sides of the top of the bottom plate (100), characterized in that: A loading device is provided on the top of the bottom plate (100), the loading device and the patch positioning device are both located between the two side plates (101), and the loading device is located on one side of the patch positioning device, and the material moving device is located above the loading device and the patch positioning device; The material moving device comprises a moving component located on the outer side of the side plate (101), a support plate (304) fixed to the inner side of the top of the moving component, and a support cylinder (305) fixed to the support plate (304), and the two support cylinders (305) are rotatably connected to a same rotating shaft (400), a plurality of adjustment components are evenly arranged on the outer side of the rotating shaft (400) along the circumferential direction, and the moving plate (403) is connected through the adjustment components, and a plurality of suction cups (404) are arranged on the outer side of each of the moving plates (403) along the length direction, and the plurality of suction cups (404) are connected to pipelines and air pumps; Both ends of the rotating shaft (400) pass through corresponding support tubes (305) and are fixed with a switching assembly; a first horizontal electric telescopic rod (306) is provided at the lower part of the support plate (304); a push plate (307) is provided at one end of the first electric telescopic rod (306) close to the adjustment assembly; a horizontal slide plate (308) is fixed at the top of the push plate (307) close to the side of the support plate (304); the slide plate (308) is slidably connected to the support plate (304); a vertical switching shaft (309) is provided at the top of the slide plate (308) at a position corresponding to the switching assembly; and the top end of the switching shaft (309) is correspondingly connected to the switching assembly; The adjustment component comprises a rotating plate (401) located outside the rotating shaft (400), the inner side surface of the rotating plate (401) is fixedly connected to the rotating shaft (400) via a connecting rod (402), and two pushing grooves (407) are symmetrically arranged on the outer side surface of the rotating plate (401), a pushing block (406) is slidably connected in the pushing groove (407), a pushing shaft (405) is fixed on one side of the pushing block (406), an end of the pushing shaft (405) extends out of the pushing groove (407) and is correspondingly connected to the pushing plate (307), and one end of the pushing shaft (405) is provided on the pushing block (406) and is connected to the inner side end of the pushing groove (407) via a spring, and an inclined pushing rod (408) is rotatably connected to the other side of the pushing block (406), the two pushing rods (408) are symmetrically arranged, and the outer ends are both rotatably connected to the inner side surface of the movable plate (403); The switching assembly comprises a switching column (600) fixed to the end of the rotating shaft (400); a plurality of shaft grooves (601) are evenly arranged on the circumferential side wall of the switching shaft (309); two adjacent shaft grooves (601) are connected via an inclined switching groove (603); the top end of the switching shaft (309) is located in the shaft groove (601) at the bottom of the switching column (600); an inclined first one-way baffle (602) is arranged at a position in the shaft groove (601) corresponding to the switching groove (603); one end of the first one-way baffle (602) is rotatably connected to the higher end of the bottom surface of the switching groove (603); a torsion spring is arranged at the rotatable connection; a first baffle groove (605) is arranged on the side wall of the shaft groove (601) at a position corresponding to the other end of the first one-way baffle (602); A second one-way baffle (604) is provided at the lower end of the switching slot (603); the top end of the second one-way baffle (604) is rotatably connected to the top of the lower end of the switching slot (603); a torsion spring is provided at the rotatable connection; a second baffle (606) is correspondingly provided at the bottom of the lower end of the switching slot (603); and a third baffle (607) is correspondingly provided on the side wall of the shaft slot (601) away from the second one-way baffle (604); The patch positioning device comprises two first material receiving plates (500) symmetrically arranged between the side plates (101), two second material receiving plates (501) are symmetrically arranged below the first material receiving plates (500), the top surfaces of the first material receiving plates (500) and the second material receiving plates (501) are both provided with a plurality of positioning grooves (503), and positioning components are arranged at the positioning grooves (503), the top surface of the bottom plate (100) is provided with a fixed vertical plate (102), the first material receiving plates (500) and the second material receiving plates (501) are in contact with the fixed vertical plate (102) on one side close to the feeding device, and the feeding device is located on the other side of the fixed vertical plate (102); A rotating cylinder (703) is fixed to one end of the two first material receiving plates (500) close to the side plate (101), a fixed horizontal plate (105) is provided at a corresponding position on the fixed vertical plate (102), the top of the rotating cylinder (703) is rotatably connected to the fixed horizontal plate (105), and a torsion spring is provided at the rotatable connection, the bottom of the rotating cylinder (703) is connected to a lifting rotating assembly, and the corresponding end of the bottom of the second material receiving plate (501) is connected to the lifting rotating assembly on the corresponding side through a connecting frame (502); The lifting and rotating assembly comprises a lifting plate (701) located above the bottom plate (100), the bottom of the lifting plate (701) is connected to the bottom plate (100) via a second electric telescopic rod (702), two ends of the lifting plate (701) are symmetrically arranged and rotatably connected with a vertical lifting shaft (700), and a torsion spring is provided at the rotation connection, the connecting frame (502) is fixedly connected to the lifting shaft (700) on the corresponding side, and the top end of the lifting shaft (700) extends into the rotating cylinder (703), and a first guide shaft (705) is fixed on one side of the top end, and a fixed cylinder (106) is provided at a position on the bottom plate (100) corresponding to the lifting shaft (700), the bottom end of the lifting shaft (700) extends into the fixed cylinder (106), and a second guide shaft (706) is fixed on one side of the bottom end; A first guide groove (704) is provided on the inner side wall of the rotating cylinder (703) at a position corresponding to the first guide shaft (705), and a second guide groove (107) is provided on the inner side wall of the fixed cylinder (106) at a position corresponding to the second guide shaft (706). The upper and lower parts of the first guide groove (704) are both vertically arranged, and the middle part is inclined. The middle and upper part of the second guide groove (107) is vertically arranged, and the lower part is inclined.

2. The chip placement mechanism for electronic component processing according to claim 1, characterized in that: The positioning assembly comprises a top plate (504) located above the inner ends of the plurality of positioning grooves (503), fixed blocks (507) are symmetrically fixed on both sides of the bottom of the top plate (504), and are fixedly connected to the top surface of the corresponding first material receiving plate (500) or the second material receiving plate (501) through the fixed blocks (507), a sliding groove (508) is provided on the fixed block (507), a sliding block (509) is slidably connected in the sliding groove (508), and a pressing plate (506) is fixed between the two sliding blocks (509); The top surface of the pressing plate (506) and the bottom surface of the top plate (504) are respectively provided with an electromagnet (510), and the electromagnet (510) is electrically connected to a power supply and a switch. A positioning block (505) is fixed at the bottom of the pressing plate (506) at a position corresponding to each positioning groove (503), and the bottom end of the positioning block (505) extends into the positioning groove (503). The bottom surface of the pressing plate (506) is connected to the top surface of the corresponding first material receiving plate (500) or the second material receiving plate (501) through a plurality of evenly arranged springs, and the positions of the springs and the positioning blocks (505) are staggered.

3. The chip placement mechanism for electronic component processing according to claim 1, characterized in that: A spring shaft (409) is fixed in the middle of the inner side surface of the movable plate (403), one end of the spring shaft (409) passes through the rotating plate (401) and is fixed with a spring plate (410), and a spring is connected between the spring plate (410) and the rotating plate (401).

4. The chip placement mechanism for electronic component processing according to claim 1, characterized in that: The moving assembly comprises a guide plate (103) fixed to the outside of the side plate (101); a connecting plate (104) is fixed between the two ends of the top of the guide plate (103) and the side plate (101); a moving seat (300) is slidably connected to the top surface of the guide plate (103); two screw rods (301) are threadedly connected in the moving seat (300); the screw rods (301) are rotatably connected to the connecting plate (104); a transmission gear (302) is fixed to one end of the screw rod (301); the two transmission gears (302) are meshed with each other; the other end of one of the screw rods (301) is connected to a motor; a fixing frame (303) is fixed to the top surface of the moving seat (300); the top of the fixing frame (303) is horizontally arranged; and the support plate (304) is fixed to the bottom of the horizontal section of the fixing frame (303).

5. The chip placement mechanism for electronic component processing according to claim 1, characterized in that: A plurality of V-shaped slots (608) are evenly arranged along the circumferential direction on the switching column (600) near the supporting tube (305), and the positions of the slots (608) correspond one-to-one to the positions of the movable plate (403). A telescopic slot (609) is correspondingly fixed to the top of one end of the supporting tube (305), and a block (610) is connected to the telescopic slot (609) via a spring. The bottom end of the block (610) extends out of the telescopic slot (609) and is located in the slot (608) at the top of the switching column (600).

6. The chip placement mechanism for electronic component processing according to any one of claims 1 to 5, characterized in that: The loading device comprises a conveying wheel (201) rotatably connected between two side plates (101), a conveying belt (200) is provided on the conveying wheel (201), a first pulley (202) is coaxially fixed to one side of the conveying belt (200), the first pulley (202) is connected to a second pulley (203) via a transmission belt, the second pulley (203) is connected to a motor, and the motor is fixed on the bottom plate (100), a plurality of transverse and parallel carrying belts (204) are evenly arranged on the conveying belt (200), the carrying belt (204) is provided with a plurality of material slots (205), and the plurality of material slots (205) correspond one to one to the positions of a plurality of suction cups (404) on the same rotating plate (401).

Images