Multi-wire solder strip tin plating device and solder strip processing equipment

Abstract

The invention provides a multi-wire solder strip tin plating device and solder strip processing equipment. The multi-wire solder strip tin plating device comprises a tin plating rack, a tin plating mechanism and a multi-path traction cooling mechanism. The tin coating mechanism is arranged on the tin coating rack, the two opposite sides of the tin coating mechanism are configured to be a wire inlet side and a wire outlet side, the multi-base material enters from the wire inlet side, is subjected to tin coating and then is pulled out from the wire outlet side, the tin coating traction direction points to the wire outlet side from the wire inlet side, and the tin coating traction direction is configured to be perpendicular or basically perpendicular to the front face when an operator conducts base material traction threading. The multiple traction cooling mechanisms are located on the wire outlet side of the tin plating mechanism and are sequentially distributed on the tin plating rack in the direction perpendicular to or intersecting with the traction face, and the traction face is a plane formed by the tin plating traction direction and the gravity direction. Each traction cooling mechanism comprises a wire outlet traction assembly and at least one cooling piece, wherein the wire outlet traction assembly is used for vertically or approximately vertically pulling the tin-coated welding strip, and the cooling piece is arranged on each wire outlet traction assembly to cool the welding strip.

Description

Technical Field

[0001] The present invention relates to the photovoltaic field, and in particular to a multi-wire soldering strip tinning device and soldering strip processing equipment. Background Art

[0002] The welding ribbon is an important component of the photovoltaic module. It is an electrical connection component used for the series or parallel connection of photovoltaic cells. It plays an important role in conducting electricity and collecting electricity to improve the output voltage and power of the photovoltaic module. The welding ribbon is composed of a substrate and a surface tin alloy coating. The substrate is usually made of copper material. The surface tin alloy coating needs to be evenly coated on the surface of the copper substrate according to a certain composition ratio and thickness. Tin coating is the main process of photovoltaic welding ribbon processing. The efficiency of tin coating will directly affect the processing efficiency of the welding ribbon, and the quality of the coating (such as the thickness, uniformity of the layer, and the brightness and flatness of the layer surface) will directly affect the efficiency of photovoltaic modules in collecting solar energy.

[0003] In the existing solder strip tinning device, due to the distribution position of the tinning mechanism and the traction mechanism on the frame, the operator needs to have the front side parallel to the traction direction of the solder strip when threading the substrate. Therefore, the solder strip can only be threaded and pulled along the surface of the equipment to achieve the operation, and this operation mode also makes one tinning device only be used to process one solder strip, so there is a problem of low processing efficiency, which directly affects the overall processing efficiency of the solder strip. Further, due to the limitation of this operation mode, when the line needs to be expanded to achieve multi-line tinning, multiple tinning devices can only be arranged in sequence along the tinning traction direction, and the substrate on the latter tinning device needs to be pulled through the previous tinning device and then enter the tinning mechanism. Such an arrangement method greatly increases the size of the tinning device in the traction direction of the solder strip, and the independent and bulky tinning device will further increase the space size it occupies, which makes this expansion method difficult to be compatible with the factory with limited space. In addition, the existing solder strip processing equipment also has problems such as poor uniformity of the thickness of the tin alloy layer after tinning and excessive waste of tin material, resulting in high tinning costs. Summary of the invention

[0004] In order to overcome the deficiencies of the prior art, the present invention provides a multi-wire soldering ribbon tinning device and soldering ribbon processing equipment.

[0005] In order to achieve the above-mentioned purpose, the present invention provides a multi-wire solder strip tinning device, which includes a tinning rack, a tinning mechanism, and a multi-way traction cooling mechanism. The tinning mechanism is arranged on the tinning rack and its two opposite sides are configured as an input side and an output side. Multiple substrates are input from the input side and pulled out from the output side after tinning. The tinning traction direction points from the input side to the output side and is configured to be vertical or substantially vertical to the front of the operator when pulling and threading the substrate. The multi-way traction cooling mechanism is located on the output side of the tinning mechanism and is sequentially distributed on the tinning rack in a direction perpendicular to or intersecting the traction surface. The traction surface is a plane formed by the tinning traction direction and the gravity direction. Each traction cooling mechanism includes an output traction component for vertically or nearly vertically traction of the solder strip after tinning and at least one cooling component arranged on each output traction component to cool the solder strip.

[0006] According to one embodiment of the present invention, the multi-way traction cooling mechanism is distributed in an inclined row on the tin coating rack and between adjacent traction cooling mechanisms and in a stepped distribution; or, the multi-way traction cooling structure is distributed in multiple rows in the tin coating traction direction and the corresponding traction cooling mechanisms on adjacent rows are staggered.

[0007] According to an embodiment of the present invention, the multi-channel traction cooling mechanism is separately and independently arranged on the tin coating rack; or, the multi-channel traction cooling mechanism is integrated into one and then assembled on the tin coating rack.

[0008] According to one embodiment of the present invention, the tin coating mechanism includes a tin furnace and a plurality of tin coating drive components. The tin furnace extends in a direction perpendicular to the traction surface. The plurality of tin coating drive components are distributed corresponding to the multi-path traction cooling mechanism. Each tin coating drive component drives the corresponding substrate to move relative to the tin furnace so that the substrate is immersed in the tin furnace or separated from the tin furnace.

[0009] According to an embodiment of the present invention, a furnace body of the tin furnace is formed with an inclined furnace body section with a gradually decreasing furnace depth on the side close to the inlet line of the tin coating mechanism.

[0010] According to one embodiment of the present invention, the furnace body of the tin furnace also includes a flat-bottomed furnace body section close to the outlet side of the tin coating mechanism and with an inner wall of the furnace body close to a plane. The tin furnace has a maximum furnace depth at the flat-bottomed furnace body section, and multiple tin coating drive components are arranged at the flat-bottomed furnace body section.

[0011] According to one embodiment of the present invention, the tin furnace also includes at least one circle of first heating elements arranged at the bottom of the inclined furnace body section and distributed in a U shape; and / or, at least one circle of second heating elements arranged at the bottom of the flat bottom furnace body section and distributed in a U shape.

[0012] According to one embodiment of the present invention, the tin coating drive assembly includes a tin coating drive member and a pushing member driven by the tin coating drive member to move up and down relative to the tin furnace, the pushing member includes a pushing body and a guide member connected to the pushing body, and a guide groove is formed on the guide member for accommodating the solder strip and the width of which matches the diameter of the solder strip.

[0013] According to one embodiment of the present invention, a cooling assembly is arranged on the traction path of the outgoing wire traction assembly, and includes at least one wind knife located on the outgoing wire side of the tin coating mechanism and a vertical cooling member located at the rear end of at least one wind knife and extending along the height direction of the tin coating frame, and the vertical cooling member has a cooling channel for transmitting the solder strip.

[0014] According to one embodiment of the present invention, the vertical cooling member is a vertical air row, and a wind nozzle for cooling the tin layer on the solder strip is arranged in the cooling channel of the vertical air row, and there is one wind nozzle; or, there are multiple wind nozzles and they are arranged in sequence along the height direction of the vertical air row.

[0015] According to an embodiment of the present invention, a plurality of air nozzles are symmetrically distributed on two side walls of the cooling channel, and the air outlet of each air nozzle is a parallel air outlet or an inclined air outlet toward the top of the tin coating rack.

[0016] According to an embodiment of the present invention, the outgoing wire pulling assembly includes an outgoing wire pulling driving member, a lifting frame driven by the outgoing wire pulling driving member and connected to the tin coating frame in an elevating manner, and a plurality of outgoing wire pulling guide wheels arranged on the lifting frame.

[0017] According to one embodiment of the present invention, the multi-wire solder ribbon tinning device further comprises a wire entry traction component which is arranged on the tinning frame and located on the wire entry side of the tinning frame to pull the substrate into the tinning mechanism.

[0018] On the other hand, the present invention also provides a solder strip processing device, which includes the above-mentioned multi-wire solder strip tinning device.

[0019] In summary, in the multi-wire solder strip tinning device and solder strip processing equipment provided by the present invention, the pulling direction of the substrate on the tinning mechanism is configured to be vertical or substantially vertical to the front of the operator when pulling and threading the substrate. This setting provides the operator with sufficient working space to thread each path of the substrate, thereby providing conditions for integrating the multi-path traction and cooling mechanisms into the same tinning rack. The multi-path traction and cooling mechanisms are arranged to be distributed in sequence along the direction perpendicular to or intersecting the traction surface, so that the multi-path solder strip tinning device after multi-path expansion only increases in size in the direction perpendicular to the traction surface, and its size in the tinning traction direction can still be kept basically the same as the existing single-path tinning device, thereby well solving the problem that when the existing multi-path solder strip tinning device is expanded to multiple paths, it is difficult to arrange it in a factory with limited space due to the overall length being too long.

[0020] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Shown is a schematic structural diagram of a multi-wire solder strip tinning device provided in one embodiment of the present invention.

[0022] Figure 2 Shown Figure 1 Schematic diagram of the distribution of the middle tin coating pulling direction K1 and the operator's orientation.

[0023] Figure 3 and Figure 4 Shown Figure 1 Schematic diagram of the structure from another perspective.

[0024] Figure 5 Shown Figure 4 A magnified schematic diagram of center A.

[0025] Figure 6 Shown Figure 4 A magnified schematic diagram of point B in the middle.

[0026] Figure 7 Shown Figure 1 Schematic diagram of the structure of the intermediate tin coating mechanism.

[0027] Figure 8 Shown Figure 7 Schematic cross-section diagram of .

[0028] Fig. 9 and Fig.10 Shown is a schematic diagram of the distribution of multiple tinning drive components in a multi-wire solder strip tinning device provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0029] like Figure 1 and Figure 2As shown, the multi-wire solder strip tinning device provided in this embodiment includes a tinning rack 1, a tinning mechanism 2, and a multi-way traction cooling mechanism 3. The tinning mechanism 2 is arranged on the tinning rack 1, and the opposite sides of the tinning mechanism 2 are configured as an inlet side 201 and an outlet side 202. Multiple substrates are fed in from the inlet side 201 and pulled out from the outlet side 202 after tinning. The tinning traction direction K1 points from the inlet side 201 to the outlet side 202 and is also configured to be vertical or substantially vertical to the front side 101 of the operator 100 when pulling and threading the substrate. The multi-way traction cooling mechanism 3 is sequentially distributed on the tinning rack 1 in a direction perpendicular to or intersecting the traction surface and is located on the outlet side of the tinning mechanism 2. The traction surface is a plane formed by the tinning traction direction K1 and the gravity direction G. Each traction and cooling mechanism 3 includes an outlet traction component 31 for vertically or nearly vertically traction of the tinned solder strip and at least one cooling component 32 arranged on each outlet traction component 31 for cooling the solder strip.

[0030] The substrate referred to in this embodiment can be a copper substrate annealed by an annealing device; or a substrate annealed and coated with flux.

[0031] In the multi-wire solder strip tinning device provided in the present embodiment, the multi-channel traction cooling mechanism 3 is sequentially integrated along the directions intersecting or perpendicular to the traction surface. This arrangement enables the multi-wire solder strip tinning device to only increase the size of the solder strip tinning device in the direction K2 perpendicular to the traction surface, but the overall length in the tinning traction direction K1 is not increased. That is, the size of the multi-wire solder strip tinning device provided in the present embodiment in the tinning traction direction K1 is basically close to that of the traditional single-wire tinning device, which solves the problem of being difficult to be compatible with the existing factory space due to the excessive length of the tinning traction direction K1 when the line is expanded. Further, as Figure 2 As shown, in the multi-wire solder strip tinning device provided in this embodiment, the tinning pulling direction K1 is also configured to be substantially perpendicular to the front side 101 of the operator 100 when threading the substrate on the traction cooling mechanism 3. This setting allows the outlet side 202 of the tinning mechanism 2 to serve as a threading operation space, and the front side of the operator can face multiple substrates at the same time, thereby realizing the threading operation of multiple substrates.

[0032] In this embodiment, the multi-channel traction cooling mechanism 3 is separately and independently arranged on the tinning rack 1. However, the present invention does not limit this. In other embodiments, the multi-channel traction cooling mechanism can also be integrated into one body and then assembled on the tinning rack. The integrated multi-channel traction cooling mechanism can pull multiple solder strips simultaneously or asynchronously.

[0033] In this embodiment, if Figures 1 to 7As shown, the tin coating mechanism 2 includes a tin furnace 21 and a plurality of tin coating drive components 22 disposed on one side of the tin furnace 21 and distributed corresponding to the multi-channel traction cooling mechanism 3. Each tin coating drive component 22 drives the corresponding substrate to move in the vertical direction relative to the tin furnace 21, so that the substrate is immersed in the tin furnace 21 for tin coating or separated from the tin furnace 21 after tin coating. However, the present invention does not make any limitation to this. In other embodiments, the tin coating mechanism may also be a spray-type tin coating mechanism, and the tin coating device may include an integral spray-type tin coating mechanism to achieve tin coating of multiple substrates; or, the tin coating device may also include multiple independent spray-type tin coating mechanisms.

[0034] In this embodiment, if Figure 1 and Figure 2 As shown, a plurality of tin coating drive components 22 and a multi-channel traction cooling mechanism 3 are vertically installed on the tin coating frame 1, and the plurality of tin coating drive components 22 and the multi-channel traction cooling mechanism 3 are respectively distributed in a row in the direction K2 perpendicular to the traction surface. However, the present invention does not impose any limitation on this. In other embodiments, the column direction formed by the arrangement of the plurality of tin coating drive components may also intersect with the tin coating traction direction K1, that is, the arrangement direction of the plurality of tin coating drive components is obliquely distributed relative to the solder strip traction direction K1; correspondingly, the multi-channel traction cooling mechanism 3 is also distributed in an inclined column or a stepped column (such as Fig. 9 Alternatively, the multi-channel traction cooling mechanism 3 is distributed in multiple rows on the tinning rack 1 in the solder strip traction direction K1, and the corresponding multi-channel traction cooling mechanisms 3 on adjacent rows are staggered. On the vertical projection plane of the tinning rack 1, the distribution of the multi-channel traction cooling mechanism 3 is similar to one or more W shapes (such as Fig.10 As shown); correspondingly, in this structure, multiple tin-coated drive components are also distributed in multiple rows.

[0035] In this embodiment, the tin furnace 21 extends in a direction perpendicular to the traction surface formed by the solder strip traction direction K1 and the gravity G direction (i.e. Figure 1 The arrangement enables multiple substrates to be immersed in the same tin pot 21 for tin coating. Although the present embodiment is described by taking multiple substrates sharing one tin pot as an example. However, the present invention does not make any limitation to this. In other embodiments, each substrate may correspond to an independent tin pot, and multiple independent tin pots may be distributed in sequence along the direction K2; or, when there are a large number of substrate circuits, two or three tin pots may be arranged to achieve that some circuit substrates share one tin pot.

[0036] In this embodiment, the tinning of the substrate is mainly driven by the pressing of the tinning drive assembly 22, and the tensioning traction of the substrate will inevitably make the substrate on the tinning drive assembly 22 close to the inlet side 201 of the tinning mechanism be inclined. In the solder strip tinning device, the tin material in the tin furnace needs to be replaced regularly after a period of use. The traditional flat-bottomed tin furnace will inevitably form a large area that does not work on the inlet side of the tinning mechanism while satisfying the complete infiltration of the substrate at the tinning drive assembly 22 (i.e., the tin material area under the inclined substrate), and the tin material in this area also needs to be replaced after the use time reaches the upper limit, resulting in a large waste of tin material. The price of tin is second only to precious metals, which will seriously affect the tinning cost of the solder strip.

[0037] To solve this problem, Figure 3 and Figure 4 As shown, the tin furnace 21 provided in this embodiment is formed with an inclined furnace body section 211 with a gradually decreasing furnace depth on the side 201 near the inlet of the tin coating mechanism. This arrangement greatly reduces the tin content of the tin furnace near the inlet 201 of the tin coating mechanism while realizing the tinning of the inclined section substrate, thereby realizing a substantial reduction in the tinning cost. In this embodiment, the furnace body of the tin furnace 21 also includes a flat-bottomed furnace body section 212 near the outlet side 202 of the tin coating mechanism and the inner wall of the furnace body is close to the plane. The tin furnace has the largest furnace depth at the flat-bottomed furnace body section 212, and a plurality of tinning drive assemblies 22 are arranged above the flat-bottomed furnace body section 212. The flat-bottomed furnace body section 212 provides sufficient infiltration depth for the substrate at the tinning drive group 22. However, the present invention does not make any limitation to this. In other embodiments, the flat-bottomed furnace body section may not be required in the tin furnace, and the tinning drive group is correspondingly arranged at the inclined furnace body section near the outlet side 202 of the tinning mechanism.

[0038] In this embodiment, the tin furnace 21 further includes a heating element 23 disposed at the bottom of the furnace body, and the heating element 23 includes a first heating element with multiple circles disposed at the bottom of the inclined furnace body section 211 and in a U-shaped distribution, and a second heating element with multiple circles disposed at the bottom of the flat bottom furnace body section 212 and in a U-shaped distribution. However, the present invention does not make any limitation to this. In other embodiments, when the tin furnace does not have a flat bottom furnace body section, the heating element may not include the second heating element. As for the number and distribution of the first heating element and the second heating element, the present invention also does not make any limitation.

[0039] like Figure 3 , Figure 4 as well as Figure 6As shown, the tinning drive assembly 22 includes a tinning drive member 221 and a pusher 222 driven by the tinning drive member 221 to move up and down relative to the tin furnace 21, and the pusher 222 includes a push body 2221 and a guide member 2222 connected to the pusher body, and a guide groove 2223 is formed on the guide member 2222 to accommodate the welding strip and the width matches the diameter of the welding strip. Specifically, the cross section of the guide groove 2223 is a V-shaped structure, and the two side walls of the guide groove 2223 limit the welding strip to prevent the welding strip from detaching from the tinning drive assembly 422. The matching of the width of the guide groove 2223 and the diameter of the welding strip can effectively prevent the welding strip from sliding in the guide groove 2223, and ensure the accurate traction of the welding strip after tinning while avoiding the coating wear caused by lateral sliding of the welding strip during the traction process. Preferably, the guide groove 2223 is arc-shaped on the traction path to facilitate the smooth traction of the welding strip. Furthermore, the pushing member 222 can also move along the length direction (ie, K2 direction) of the tin furnace 21 under the action of the tinning driving member 221. However, the present invention does not impose any limitation on this.

[0040] In the traction cooling mechanism 3 provided in the present embodiment, the cooling assembly 32 is arranged on the traction path of the outlet traction assembly 31, and includes at least one wind knife 321 located on the outlet side 202 of the tin coating mechanism and a vertical cooling member 322 located at the rear end of at least one wind knife 321 and extending along the height direction of the tin coating rack 1, and the vertical cooling member 322 has a cooling channel 3220 for the welding ribbon transmission. Preferably, each cooling assembly 32 includes two wind knives 321, and the vertical cooling member 322 is a vertical air row, and the two side walls of the cooling channel 3220 of the vertical air row are symmetrically distributed with a plurality of air nozzles 3221, and the air outlet of each air nozzle 3221 is an inclined air outlet facing the top of the tin coating rack 1, such as Figure 2 However, the present invention does not impose any limitation on this. In other examples, the air outlet of the air nozzle 3221 may also discharge air in parallel or obliquely downward, and the present invention does not impose any limitation on the number of air nozzles and the number of wind knives. In other embodiments, the vertical cooling member may also have an integral air outlet in a long strip shape.

[0041] In the solder strip tinning device provided in this embodiment, at least one wind knife 321 in the cooling assembly 32 quickly blows off the remaining tin material on the surface of the solder strip with a high-speed wind curtain, thereby achieving precise control of the thickness of the tin layer. The upward traction of the solder strip after tinning ensures the uniformity of the tin layer at various locations on the cross section of the solder strip, thereby avoiding the problem of unevenness of the thickness of the lower tin layer being greater than the thickness of the upper tin layer at the same cross section caused by gravity during horizontal or inclined traction.

[0042] In order to more accurately and flexibly control the thickness of the tin layer after the soldering strip is tinned, the position of each wind knife 321 is adjustable, and it can move along the height direction of the tinning rack 1 and / or move horizontally along the distribution direction (i.e., K2 direction) of the plurality of tinning drive components 22. However, the present invention does not make any limitation to this.

[0043] In this embodiment, if Figure 1 As shown, the outgoing wire pulling assembly 31 includes an outgoing wire pulling driving member 311, a lifting frame 312 driven by the outgoing wire pulling driving member 311 and connected to the tinning frame 1 in a lifting manner, and a plurality of outgoing wire pulling guide wheels 313 arranged on the lifting frame 312. Specifically, in the working state, the plurality of outgoing wire pulling guide wheels 313 are located at the top of the tinning frame 1, and the substrate needs to be wound and threaded to the plurality of outgoing wire pulling guide wheels 313 before tinning. Before tinning, the operator can control the outgoing wire pulling driving member 311 through the controller to drive the lifting frame 312 and the plurality of outgoing wire pulling guide wheels 313 to move down to a suitable height, so as to wind the substrate to the plurality of outgoing wire pulling guide wheels 313; thereafter, the controller controls the outgoing wire pulling driving member 311 to drive the lifting frame 312 and the plurality of outgoing wire pulling guide wheels 313 to the top of the tinning frame 1 to realize the vertical traction of the welding strip. Specifically, the outgoing line traction driving member can be a driving motor or a cylinder, and the tin coating frame is provided with a slide rail that matches the lifting frame.

[0044] Further, such as Figure 1 As shown, the solder strip tinning device provided in this embodiment also includes a rear end traction component 4 disposed on the tinning rack 1 and located on one side of the traction and cooling mechanism 3, and the rear end traction component 4 pulls the solder strip after tinning and cooling to the next process, such as the solder strip winding process. Specifically, the rear end traction component 4 includes a traction fixing frame 41 that can be movably connected to the tinning rack 1 and a plurality of rear end traction members 42 disposed on the traction fixing frame 41, and each rear end traction member 42 pulls a solder strip. Specifically, the rear end traction member 42 includes a traction motor and a plurality of traction gears. However, the present invention does not make any limitation to this.

[0045] Further, such as Figure 1 and Figure 3 As shown, the multi-wire solder strip tinning device provided in this embodiment also includes a wire entry traction component 5 arranged on the tinning rack 1 and located at the wire entry side 201 of the tinning rack to pull the substrate into the tinning mechanism 2.

[0046] Correspondingly, this example also provides a solder strip processing device including the above-mentioned multi-wire solder strip tinning device. Specifically, the solder strip processing device may include a wire unwinding device and an annealing device located at the front end of the solder strip tinning device, and a wire taking-up device located at the rear end of the solder strip tinning device. However, the present invention does not make any limitation to this.

[0047] In other embodiments, the solder strip processing equipment also includes a wire drawing device disposed between the wire paying-off device and the annealing device, and a column welding coating device located between the annealing device and the solder strip tinning device.

[0048] In summary, in the multi-wire solder strip tinning device and solder strip processing equipment provided by the present invention, the pulling direction of the substrate on the tinning mechanism is configured to be vertical or substantially vertical to the front of the operator when pulling and threading the substrate. This setting provides the operator with sufficient working space to thread each path of the substrate, thereby providing conditions for integrating the multi-path traction and cooling mechanisms into the same tinning rack. The multi-path traction and cooling mechanisms are arranged to be distributed in sequence along the direction perpendicular to or intersecting the traction surface, so that the multi-path solder strip tinning device after multi-path expansion only increases in size in the direction perpendicular to the tinning traction direction, and its size in the tinning traction direction can still be kept basically the same as the existing single-path tinning device, thereby well solving the problem that when the existing multi-path solder strip tinning device is expanded into a multi-path device, the overall length is too long and it is difficult to arrange it in a factory with limited space.

[0049] Although the present invention has been disclosed as above by the preferred embodiment, it is not intended to limit the present invention. Anyone familiar with this technology can make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope of protection required by the claims.

Claims

1. A multi-wire solder strip tinning device, characterized in that: include: Tinning rack; The tin coating mechanism is arranged on the tin coating frame and its two opposite sides are configured as an inlet side and an outlet side. Multiple substrates are fed in from the inlet side and pulled out from the outlet side after tin coating. The tin coating pulling direction points from the inlet side to the outlet side and is configured to be vertical or substantially vertical to the front side of the operator when pulling and threading the substrate; A multi-path traction and cooling mechanism is located on the outlet side of the tinning mechanism and is distributed in sequence on the tinning rack in a direction perpendicular to or intersecting the traction surface, wherein the traction surface is a plane formed by the tinning traction direction and the gravity direction; each traction and cooling mechanism includes an outlet traction component for vertically or nearly vertically traction of the tinned solder strip and at least one cooling component arranged on each outlet traction component for cooling the solder strip.

2. The multi-wire solder strip tinning device according to claim 1, characterized in that: The multi-channel traction cooling mechanism is distributed in an inclined row on the tin coating rack and between adjacent traction cooling mechanisms and is distributed in a stepped manner; or, the multi-channel traction cooling structure is distributed in multiple rows in the tin coating traction direction and the corresponding traction cooling mechanisms on adjacent rows are staggered.

3. The multi-wire solder strip tinning device according to claim 1, characterized in that: The multi-channel traction cooling mechanism is separately and independently arranged on the tin coating frame; or, the multi-channel traction cooling mechanism is integrated into one body and then assembled on the tin coating frame.

4. The multi-wire solder strip tinning device according to claim 1, characterized in that: The tin coating mechanism includes a tin furnace and multiple tin coating drive components. The tin furnace extends in a direction perpendicular to the traction surface. The multiple tin coating drive components are distributed corresponding to the multi-path traction cooling mechanism. Each tin coating drive component drives the corresponding road substrate to move relative to the tin furnace so that the substrate is immersed in the tin furnace or separated from the tin furnace.

5. The multi-wire solder strip tinning device according to claim 4, characterized in that: The furnace body of the tin furnace is formed with an inclined furnace body section with a gradually decreasing furnace depth on the side close to the inlet line of the tin coating mechanism.

6. The multi-wire solder strip tinning device according to claim 5, characterized in that: The furnace body of the tin furnace also includes a flat-bottom furnace body section close to the outlet side of the tin coating mechanism and with an inner wall of the furnace body close to a plane. The tin furnace has a maximum furnace depth at the flat-bottom furnace body section, and multiple tin coating drive components are arranged at the flat-bottom furnace body section.

7. The multi-wire solder strip tinning device according to claim 6, characterized in that: The tin furnace also includes at least one circle of first heating elements arranged at the bottom of the inclined furnace body section and distributed in a U shape; and / or, at least one circle of second heating elements arranged at the bottom of the flat bottom furnace body section and distributed in a U shape.

8. The multi-wire solder strip tinning device according to claim 4, characterized in that: The tin coating drive assembly includes a tin coating drive member and a pushing member driven by the tin coating drive member to move up and down relative to the tin furnace. The pushing member includes a pushing body and a guide member connected to the pushing body. The guide member is formed with a guide groove for accommodating the soldering strip and having a width matching the diameter of the soldering strip.

9. The multi-wire solder strip tinning device according to claim 1, characterized in that: The cooling component is arranged on the traction path of the outgoing wire traction component, and includes at least one wind knife located on the outgoing wire side of the tin coating mechanism and a vertical cooling member located at the rear end of at least one wind knife and extending along the height direction of the tin coating frame, and the vertical cooling member has a cooling channel for transmitting the solder strip.

10. The multi-wire solder strip tinning device according to claim 9, characterized in that: The vertical cooling member is a vertical air row, and a wind nozzle for cooling the tin layer on the solder strip is arranged in the cooling channel of the vertical air row, and there is one wind nozzle; or, there are multiple wind nozzles and they are arranged in sequence along the height direction of the vertical air row.

11. The multi-wire solder strip tinning device according to claim 10, characterized in that: A plurality of air nozzles are symmetrically distributed on the two side walls of the cooling channel, and the air outlet of each air nozzle is a parallel air outlet or an inclined air outlet toward the top of the tin coating rack.

12. The multi-wire solder strip tinning device according to claim 1, characterized in that: The outgoing wire traction assembly comprises an outgoing wire traction driving member, a lifting frame driven by the outgoing wire traction driving member and connected to the tin coating frame in a lifting manner, and a plurality of outgoing wire traction guide wheels arranged on the lifting frame.

13. The multi-wire solder strip tinning device according to claim 1, characterized in that: The multi-wire solder strip tinning device also includes a wire entry traction component which is arranged on the tinning frame and located on the wire entry side of the tinning frame to pull the substrate into the tinning mechanism.

14. A welding strip processing device, characterized in that: It comprises the multi-wire solder strip tinning device as described in any one of claims 1 to 13.

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