Total static pressure integrated aviation atmospheric pressure sensor

Abstract

The invention discloses a total static pressure integrated aviation atmospheric pressure sensor which comprises a mounting box with a closed cavity formed by a base and a cover plate, and pins are arranged on the base; the interior of the mounting box is divided into a static pressure chamber and a total pressure chamber which are independent through a partition wall, and a total pressure air entraining port and a static pressure air entraining port are formed in the cover plate corresponding to the static pressure chamber and the total pressure chamber respectively; a total pressure circuit board and a static pressure circuit board are respectively arranged in the static pressure chamber and the total pressure chamber; a total pressure chip and a static pressure chip are placed on bottom plates of the static pressure cavity and the total pressure cavity respectively, and pins corresponding to a total pressure circuit board penetrate through the total pressure circuit board and then are electrically connected with the total pressure chip through a lead bonding process; a pin corresponding to the static pressure circuit board penetrates through the static pressure circuit board and then is electrically connected with the static pressure chip through a lead bonding process; the total voltage circuit board and the static pressure circuit board are respectively provided with a total voltage SIP chip and a static pressure SIP chip which are used as interface circuits of the total voltage chip and the static pressure chip.

Description

Technical Field

[0001] The invention relates to an aviation atmosphere collection device, in particular to an aviation atmosphere pressure sensor integrated with total static pressure. Background Art

[0002] Aviation atmospheric pressure sensors are core components of aircraft atmospheric data systems. They are used to measure total pressure and static pressure parameters during the flight of an aircraft, and thereby calculate flight parameters such as the aircraft's altitude, speed, and angle of attack.

[0003] At present, traditional atmospheric pressure sensors are mainly constructed with discrete components. When measuring the total and static pressure parameters of an aircraft, a set of static pressure sensors and a set of total pressure sensors are often used for separate measurements. This will result in the entire atmospheric measurement system not having advantages in terms of volume, weight, cost, etc. At the same time, the use of discrete components will affect the maintainability of the total static pressure product and the power consumption of the product, which will put higher requirements on the aircraft's load capacity. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the aviation atmospheric pressure sensor with integrated total static pressure provided by the present invention solves the problem of large volume caused by separate arrangement of the total pressure sensor and the static pressure sensor in the prior art.

[0005] In order to achieve the above-mentioned object of the invention, the technical solution adopted by the present invention is:

[0006] Provided is an aviation atmospheric pressure sensor with total static pressure integration, comprising an installation box with a closed cavity formed by a base and a cover plate, wherein the base is provided with a plurality of pins penetrating into the closed cavity; the interior of the installation box is divided into two independent chambers by a partition wall, namely, a static pressure chamber and a total pressure chamber, and the covers corresponding to the static pressure chamber and the total pressure chamber are respectively provided with a total pressure air inlet and a static pressure air inlet;

[0007] A total pressure circuit board and a static pressure circuit board are respectively arranged in the static pressure chamber and the total pressure chamber, and avoidance holes are arranged on the total pressure circuit board and the static pressure circuit board; a total pressure chip and a static pressure chip passing through the avoidance holes are respectively placed on the bottom plates of the static pressure chamber and the total pressure chamber, and the corresponding pins of the total pressure circuit board pass through the total pressure circuit board and are electrically connected to the total pressure chip through a wire bonding process;

[0008] The corresponding pins of the static pressure circuit board pass through the static pressure circuit board and are electrically connected to the static pressure chip through a wire bonding process; the total pressure circuit board and the static pressure circuit board are respectively provided with a total pressure SIP chip and a static pressure SIP chip which serve as interface circuits of the total pressure chip and the static pressure chip.

[0009] Furthermore, pressure chip spacers for placing the total pressure chip and the static pressure chip are provided on the base corresponding to the total pressure chip and the static pressure chip.

[0010] Furthermore, the height of the pressure chip spacer is set to 2-3 mm, and it is bonded together with the total pressure chip and the static pressure chip through a die bonding process.

[0011] Furthermore, circuit board spacers for placing the total pressure circuit board and the static pressure circuit board are provided on the base corresponding to the total pressure circuit board and the static pressure circuit board, so that a height difference is formed between the top surface of the total pressure circuit board and the top surface of the total pressure chip, and between the top surface of the static pressure circuit board and the top surface of the static pressure chip.

[0012] Furthermore, the height of the circuit board spacer is set to 4-5 mm.

[0013] Furthermore, the top surface height of the pin is flush with the top surface height of the total pressure chip and the static pressure chip.

[0014] Furthermore, the total pressure SIP chip and the static pressure SIP chip both include a linear voltage regulated power supply chip and a memory and an integrated circuit chip connected to the linear voltage regulated power supply chip. The memory is connected to the total pressure chip and the static pressure chip, and stores fitting coefficients of the total pressure chip and the static pressure chip for temperature compensation. The integrated circuit chip is connected to the total pressure chip and the static pressure chip, and is used to amplify and condition the frequency signals of the total pressure chip and the static pressure chip.

[0015] Furthermore, the cover plate is made of 316L stainless steel material, and a nickel layer is plated on its surface.

[0016] The beneficial effects of the present invention are as follows: the present solution adopts a system-in-package (SIP) chip to replace discrete components, breaking through the bottlenecks of the existing atmospheric pressure sensor in terms of performance, power consumption and volume. In terms of structural design, the total and static pressure isolation integrated package is adopted to integrate the total pressure sensor and the static pressure sensor into one, further reducing the product volume while enabling the total static pressure sensor to have a dual margin measurement function, greatly ensuring the safety and reliability of the aircraft. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A perspective view of an integrated aviation barometric pressure sensor for total static pressure.

[0018] Figure 2 A perspective view of the integrated aerospace barometric pressure sensor for total static pressure with the cover removed.

[0019] Figure 3 A three-dimensional view after setting the pins, pressure chip spacers and circuit board spacers on the base.

[0020] Among them, 1. total pressure air inlet; 2. static pressure air inlet; 3. cover plate; 4. pins; 5. total pressure chip; 6. static pressure chip; 7. total pressure SIP chip; 8. static pressure SIP chip; 9. total pressure circuit board; 10. static pressure circuit board; 11. isolation wall; 12. circuit board gasket; 13. pressure chip gasket. DETAILED DESCRIPTION

[0021] The specific implementation modes of the present invention are described below so that those skilled in the art can understand the present invention. However, it should be clear that the present invention is not limited to the scope of the specific implementation modes. For those of ordinary skill in the art, as long as various changes are within the spirit and scope of the present invention as defined and determined by the attached claims, these changes are obvious, and all inventions and creations utilizing the concept of the present invention are protected.

[0022] like Figure 1 As shown, the present solution provides an aviation atmospheric pressure sensor with total static pressure integration, which includes an installation box that forms a closed cavity through a base and a cover plate 3, and a plurality of pins 4 that penetrate into the closed cavity are arranged on the base; the interior of the installation box is divided into two independent chambers by a partition wall 11, namely a static pressure chamber and a total pressure chamber, and the total pressure chamber and the static pressure chamber are respectively provided with a total pressure air inlet 1 and a static pressure air inlet 2 on the cover plates 3 corresponding to the total pressure chamber.

[0023] In this solution, the cover plate 3 is preferably made of 316L stainless steel material, and the surface of the cover plate 3 is plated with a nickel layer to form a three-proof protection function, specifically against moisture and heat, mold and salt spray. In this solution, the total pressure gas and the static pressure gas can be connected to the static pressure chamber and the total pressure chamber respectively by connecting the external air hose to the total pressure air inlet 1 and the static pressure air inlet 2. If the external air hose is connected to the total pressure air inlet 1 and the static pressure air inlet 2 at the same time, a dual-margin total pressure measurement sensor or a dual-margin static pressure measurement sensor can be formed, which greatly improves the reliability and safety adaptability of the product.

[0024] like Figure 2 As shown, a total pressure circuit board 9 and a static pressure circuit board 10 are respectively arranged in the static pressure chamber and the total pressure chamber, and avoidance holes are arranged on the total pressure circuit board 9 and the static pressure circuit board 10; a total pressure chip 5 and a static pressure chip 6 passing through the avoidance holes are respectively placed on the bottom plates of the static pressure chamber and the total pressure chamber, and the pins 4 corresponding to the total pressure circuit board 9 pass through the total pressure circuit board 9 and are electrically connected to the total pressure chip 5 through a wire bonding process;

[0025] The pin 4 corresponding to the static pressure circuit board 10 passes through the static pressure circuit board 10 and is electrically connected to the static pressure chip 6 through a wire bonding process; the total pressure circuit board 9 and the static pressure circuit board 10 are respectively provided with a total pressure SIP chip 7 and a static pressure SIP chip 8 which serve as interface circuits for the total pressure chip 5 and the static pressure chip 6.

[0026] During implementation, the present solution preferably provides a pressure chip spacer 13 for placing the total pressure chip 5 and the static pressure chip 6 on the base corresponding to the total pressure chip 5 and the static pressure chip 6. Figure 3 The height of the pressure chip spacer 13 is set to 2-3 mm, and it is bonded together with the total pressure chip 5 and the static pressure chip 6 by a die bonding process.

[0027] The die bonding process usually uses silicone with a relatively small Young's modulus to isolate the packaging stress between the total pressure chip 5 and the static pressure chip 6 and the base, thereby increasing the measurement accuracy of the pressure chip.

[0028] During implementation, the present solution preferably has a circuit board spacer 12 for placing the total pressure circuit board 9 and the static pressure circuit board 10 on the base corresponding to the total pressure circuit board 9 and the static pressure circuit board 10, for specific reference Figure 3 The height of the circuit board spacer 12 is set to 4-5 mm, so that a height difference is formed between the top surface of the total pressure circuit board 9 and the top surface of the total pressure chip 5, and between the top surface of the static pressure circuit board 10 and the top surface of the static pressure chip 6.

[0029] The introduction of the height difference can facilitate the wire bonding process between the total pressure chip 5 and the static pressure chip 6 and the total pressure circuit board 9 and the static pressure circuit board 10, thereby improving the stability of the connection.

[0030] Furthermore, the top surface height of the pin 4 is flush with the top surface height of the total pressure chip 5 and the static pressure chip 6 , and this arrangement can ensure the wire bonding strength between the pin 4 and the total pressure chip 5 and the static pressure chip 6 .

[0031] The structure of the plurality of pins 4 not only serves as an external electrical connection, but also can improve the structural rigidity of the entire pressure sensor product, especially in the environment of vibration, impact, and acceleration, it can reduce the impact of external environmental impact on the pressure sensor and improve the measurement accuracy. The isolation wall 11 is used to isolate the total static pressure measurement chambers on the left and right sides to avoid the cross-influence of the total static pressure gas paths at both ends.

[0032] During implementation, the present scheme preferably comprises the total pressure SIP chip 7 and the static pressure SIP chip 8 both including a linear voltage regulated power supply chip LDO and a memory EEPROM and an integrated circuit chip ASIC connected to the linear voltage regulated power supply chip LDO; the memory EEPROM is connected to the total pressure chip 5 and the static pressure chip 6, and stores therein the fitting coefficients of the total pressure chip 5 and the static pressure chip 6 for temperature compensation; the integrated circuit chip ASIC is connected to the total pressure chip 5 and the static pressure chip 6, and is used to amplify and condition the frequency signals of the total pressure chip 5 and the static pressure chip 6.

[0033] The working principle of the total static pressure integrated aviation atmospheric pressure sensor of this scheme is:

[0034] The external pressure load enters the cover plate 3 through the total pressure air inlet 1 and the static pressure air inlet 2, and acts on the total pressure chip 5 and the static pressure chip 6 respectively. The total pressure chip 5 and the static pressure chip 6 sense the external pressure load, causing the stiffness of the internal resonant sensitive element to change. The change in stiffness causes the change in the natural frequency of the resonant signal. The external load pressure can be obtained by measuring the natural frequency. The natural frequency signal is amplified and conditioned by the total static pressure SIP signal, and finally outputs a digital signal that can communicate with the atmospheric data system.

[0035] In summary, the sensor products made of high-performance SIP chips in this solution not only achieve breakthroughs in power consumption, volume and weight, but also reduce the crosstalk of coupling capacitors and coupling inductors between discrete components, so as to achieve higher comprehensive performance.

Claims

1. A total static pressure integrated aviation atmospheric pressure sensor, characterized in that: The invention comprises an installation box which forms a closed cavity through a base and a cover plate, wherein the base is provided with a plurality of pins which penetrate into the closed cavity; the interior of the installation box is divided into two independent chambers through a partition wall, namely a static pressure chamber and a total pressure chamber, and the cover plates corresponding to the static pressure chamber and the total pressure chamber are respectively provided with a total pressure air inlet and a static pressure air inlet; The static pressure chamber and the total pressure chamber are respectively provided with a total pressure circuit board and a static pressure circuit board, and avoidance holes are provided on the total pressure circuit board and the static pressure circuit board; the bottom plates of the static pressure chamber and the total pressure chamber are respectively provided with a total pressure chip and a static pressure chip passing through the avoidance holes, and the pins corresponding to the total pressure circuit board pass through the total pressure circuit board and are electrically connected to the total pressure chip through a wire bonding process; The pins corresponding to the static pressure circuit board pass through the static pressure circuit board and are electrically connected to the static pressure chip through a wire bonding process; the total pressure circuit board and the static pressure circuit board are respectively provided with a total pressure SIP chip and a static pressure SIP chip serving as interface circuits of the total pressure chip and the static pressure chip.

2. The total static pressure integrated aviation atmospheric pressure sensor according to claim 1, characterized in that: Pressure chip spacers for placing the total pressure chip and the static pressure chip are arranged on the base at locations corresponding to the total pressure chip and the static pressure chip.

3. The total static pressure integrated aviation atmospheric pressure sensor according to claim 2, characterized in that: The height of the pressure chip spacer is set to 2-3 mm, and it is bonded together with the total pressure chip and the static pressure chip through a die bonding process.

4. The total static pressure integrated aviation atmospheric pressure sensor according to claim 1, characterized in that: Circuit board spacers for placing the total pressure circuit board and the static pressure circuit board are arranged on the base corresponding to the total pressure circuit board and the static pressure circuit board, so that a height difference is formed between the top surface of the total pressure circuit board and the top surface of the total pressure chip, and between the top surface of the static pressure circuit board and the top surface of the static pressure chip.

5. The total static pressure integrated aviation atmospheric pressure sensor according to claim 1, characterized in that: The height of the circuit board spacer is set to 4-5 mm.

6. The total static pressure integrated aviation atmospheric pressure sensor according to claim 1, characterized in that: The top surface height of the pin is flush with the top surface height of the total pressure chip and the static pressure chip.

7. The total static pressure integrated aviation atmospheric pressure sensor according to claim 1, characterized in that: The total pressure SIP chip and the static pressure SIP chip both include a linear voltage-stabilized power supply chip and a memory and an integrated circuit chip connected to the linear voltage-stabilized power supply chip. The memory is connected to the total pressure chip and the static pressure chip, and stores fitting coefficients used by the total pressure chip and the static pressure chip for temperature compensation. The integrated circuit chip is connected to the total pressure chip and the static pressure chip, and is used to amplify and condition the frequency signals of the total pressure chip and the static pressure chip.

8. The total static pressure integrated aviation atmospheric pressure sensor according to claim 1, characterized in that: The cover plate is made of 316L stainless steel material, and a nickel layer is plated on its surface.

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