Chip packaging integrity detection method and system

Abstract

The invention provides a chip packaging integrity detection method and system. Acquiring infrared scanning information of the chip outer package and radiation imaging information of the chip outer package; constructing an actual three-dimensional structure model of the chip outer package and acquiring deviation structure information; obtaining a radiation difference image of each packaging surface; and based on the deviation structure information and the radiation difference image of each packaging surface, analyzing a deviation reason to obtain target packaging deviation information of the outer package of the chip, and obtaining a target packaging integrity detection result of the chip. According to the invention, the problem that the detection accuracy of the chip packaging integrity is low due to the fact that the chip integrity information cannot be intelligently obtained when the packaging integrity is integrally detected through an appearance inspection instrument and a microscope in the prior art is solved. According to the invention, the integrity information of the chip can be intelligently and comprehensively identified, and the accuracy of detecting the packaging integrity of the chip is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of Internet of Things chips, and in particular to a chip packaging integrity detection method and system. Background Art

[0002] During the production process of integrated circuit chips, the chips need to be packaged. At the same time, the integrity detection of chip packaging is a key step to ensure chip performance and reliability. It involves multiple aspects of testing and inspection to ensure that the chip can work stably and reliably under various environmental conditions.

[0003] At present, the general packaging integrity detection method of the existing technology is to use large-scale precision detection equipment to perform packaging integrity detection on chips one by one. More specifically, the overall detection of the package integrity is performed through an appearance inspection instrument and a microscope. However, when the overall detection of the package integrity is performed through an appearance inspection instrument and a microscope, the chip integrity information cannot be intelligently obtained, resulting in the problem of low accuracy in chip package integrity detection. Summary of the invention

[0004] In order to solve the above problems, the present invention proposes a chip packaging integrity detection method and system, which realizes intelligent chip packaging detection and improves chip packaging detection accuracy.

[0005] To achieve the above object, an embodiment of the present invention provides a chip packaging integrity detection method, comprising:

[0006] Obtain infrared scanning information of the chip outer package and radiation imaging information of the chip outer package;

[0007] Based on the infrared scanning information of the chip outer package, construct an actual three-dimensional structural model of the chip outer package;

[0008] Obtaining deviation structure information by mapping the actual three-dimensional structure model of the chip outer package to a preset target three-dimensional structure model;

[0009] Based on the radiation imaging information of the chip outer package, separate each packaging surface of the chip outer package to obtain a radiation difference image of each packaging surface;

[0010] Based on the deviation structure information and the radiation difference image of each packaging surface, the cause of the deviation is analyzed to obtain target packaging deviation information of the chip outer packaging;

[0011] Based on the target packaging deviation information of the chip outer packaging, the target packaging integrity test result of the chip is obtained.

[0012] The embodiment of the present invention proposes a chip packaging integrity detection method, which obtains infrared scanning information of the chip outer package and radiation imaging information of the chip outer package by infrared scanning and radiation imaging, and can amplify the significant distinguishing features of small difference information, so that the method can improve the accuracy of identifying the chip packaging integrity information, and also split the radiation imaging information into radiation images corresponding to multiple packaging surfaces, thereby improving the comprehensiveness of the recognition of radiation imaging information, and then respectively constructs an actual three-dimensional structure model of the chip outer package and obtains the radiation difference image of each packaging surface, and then maps and analyzes the actual three-dimensional structure model of the chip outer package with the preset target three-dimensional structure model to obtain the deviation structure corresponding to the chip. The three-dimensional structure model is constructed through infrared scanning information to improve the accuracy of obtaining deviation structure information. The deviation structure information corresponding to the chip and the radiation difference image of each packaging surface are combined to analyze the cause of the deviation, obtain the target packaging deviation information of the chip outer packaging and detect the target packaging integrity of the chip; through the combination of the above-mentioned infrared processing method and the radiation processing method, the target packaging integrity information of the chip is analyzed based on the target packaging deviation information of the chip outer packaging, and the deformation, cracks, scratches and packaging gaps of the chip can be intelligently and comprehensively identified, which not only reduces the cost of detecting the chip packaging integrity, but also further intelligently improves the accuracy of detecting the chip packaging integrity.

[0013] Furthermore, the step of obtaining the infrared scanning information of the chip outer package and the radiation imaging information of the chip outer package is specifically as follows:

[0014] Based on infrared structure scanning technology, the chip outer package is scanned in all directions to obtain infrared scanning information of the chip outer package;

[0015] Based on the radiation marking technology, the radiation information of different packaging surfaces of the chip outer packaging is detected respectively to obtain the radiation imaging information of the chip outer packaging.

[0016] Furthermore, the actual three-dimensional structure model of the chip outer package is constructed based on the infrared scanning information of the chip outer package, specifically:

[0017] Based on the infrared scanning information of the chip outer package, acquiring the three-dimensional structure data of the chip outer package;

[0018] The actual three-dimensional structure model of the chip outer package is obtained by simulating and constructing the three-dimensional structure data of the chip outer package.

[0019] Furthermore, the actual three-dimensional structure model of the chip package is mapped to a preset target three-dimensional structure model to obtain the deviation structure information, specifically:

[0020] Based on the preset target three-dimensional structure model, obtaining the target three-dimensional position information of the three-dimensional coordinate system and each reference point;

[0021] By mapping the actual three-dimensional structural model of the chip package to the three-dimensional coordinate system, the actual three-dimensional position information of each reference point is read;

[0022] Based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point, the deviation structure information is acquired.

[0023] Furthermore, the obtaining of the deviation structure information based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point is specifically as follows:

[0024] Aligning the actual three-dimensional position information of each reference point with the target three-dimensional position information of each reference point to construct a three-dimensional structural model;

[0025] By calculating the deviation value of each position point in the actual three-dimensional model and each position point in the target three-dimensional model, the three-dimensional structure deviation value between each position point is obtained;

[0026] Based on a preset clustering algorithm, the location points corresponding to the three-dimensional structure deviation values ​​that meet the preset clustering conditions are clustered to obtain several abnormal location point groups;

[0027] Based on the plurality of abnormal position point groups, the three-dimensional structure deviation value corresponding to each abnormal position point is obtained to obtain the deviation structure information.

[0028] Furthermore, based on the radiation imaging information of the chip outer package, each packaging surface of the chip outer package is split to obtain a radiation difference image of each packaging surface, specifically:

[0029] Based on the acquisition viewing angles of each radiation image in the radiation imaging information of the chip outer package, splitting to obtain the radiation image of the packaging surface of the chip outer package corresponding to each acquisition viewing angle;

[0030] Based on the radiation image of the packaging surface of the chip outer packaging corresponding to each acquisition angle, by extracting the image feature content in the radiation image and the image range corresponding to the image feature content, a sub-radiation image of each image feature content is obtained;

[0031] Based on the sub-radiation images of the image feature contents, obtaining the radiation intensity distribution information of each image feature content and calculating the average radiation intensity of each image feature content;

[0032] Based on the average radiation intensity of each image feature content, a radiation deviation value between the radiation intensity of each radiation position point of the image feature content and the average radiation intensity is calculated to obtain sub-radiation difference images of several image feature contents;

[0033] The sub-radiance difference images of all image feature contents that meet the preset radiation deviation threshold are screened to obtain the radiation difference image of each packaging surface.

[0034] An embodiment of the present invention proposes a chip packaging integrity detection method, which determines a radiation difference image in a radiation image by extracting feature content of each image and calculating the average radiation intensity, thereby improving the accuracy of the radiation difference image in the determined radiation image.

[0035] Furthermore, based on the deviation structure information and the radiation difference image of each packaging surface, the deviation cause is analyzed to obtain the target packaging deviation information of the chip outer packaging, specifically:

[0036] Based on the structural deviation trend ranges corresponding to the preset several structural deviation reasons and the outer packaging ranges corresponding to the packaging areas of the chip outer packaging, deviation analysis is performed on each abnormal position point group to obtain the structural deviation distribution information of the corresponding abnormal position point group;

[0037] Based on the structural deviation distribution information of the corresponding abnormal position point group, corresponding to the target structural deviation trend range of each abnormal position point group, obtaining the structural deviation cause of each abnormal position point group;

[0038] Based on the abnormal image range corresponding to each sub-radiation difference image in the radiation difference image of each packaging surface and the packaging surface corresponding to the radiation difference image, a target outer packaging range of the chip outer packaging is obtained;

[0039] Based on the target outer packaging range of the chip outer packaging, matching and analyzing the difference reasons of each sub-radiation difference image within the abnormal image range, and obtaining the radiation difference reasons of the radiation difference image;

[0040] Based on the structural deviation reasons of each abnormal position point group and the radiation difference reasons of the radiation difference image, the target packaging deviation information of the chip outer package is obtained.

[0041] An embodiment of the present invention proposes a chip packaging integrity detection method, which determines the target packaging integrity information by identifying the packaging deviation type corresponding to each sub-package deviation information and the target outer packaging range, thereby reducing the cost of detecting the chip packaging integrity, intelligently improving the accuracy of detecting the chip packaging integrity, and improving the chip packaging integrity detection efficiency through full-process intelligent identification and analysis.

[0042] Furthermore, the target packaging deviation information of the chip outer package is obtained based on the structural deviation reasons of each abnormal position point group and the radiation difference reasons of the radiation difference image, specifically:

[0043] Based on the structural deviation reasons of each abnormal position point group and the radiation difference reasons of the radiation difference image, first deviation structural information and a first sub-radiation difference image of the same packaging range and second deviation structural information and a second sub-radiation difference image of different packaging ranges are obtained;

[0044] Based on the first deviation structure information and the first sub-radiation difference image of the same packaging range, by matching the target abnormality cause of the same outer packaging range, the first sub-packaging deviation information corresponding to the same outer packaging range is obtained;

[0045] Based on the second deviation structural information of different packaging ranges and the second sub-radiation difference images, the structural deviation cause corresponding to the second deviation structural information and the radiation difference cause of the second sub-radiation difference image are analyzed respectively to obtain the second sub-package deviation information corresponding to the different outer packaging ranges; wherein the second sub-package deviation information corresponding to the different outer packaging ranges includes: the sub-package deviation information corresponding to each of the second deviation structural information and the sub-package deviation information of each of the second sub-radiation difference images;

[0046] Based on the first sub-package deviation information corresponding to the same outer package range and the second sub-package deviation information corresponding to the different outer package ranges, the target package deviation information of the chip outer package is obtained.

[0047] The embodiment of the present invention proposes a chip packaging integrity detection method, which obtains deviation information of each sub-package by determining different abnormal ranges, abnormal causes and the abnormal degree of the abnormal causes, thereby improving the comprehensiveness of the target packaging deviation information for identifying the chip outer packaging.

[0048] Furthermore, the target packaging deviation information of the chip outer package is used to obtain the target packaging integrity test result of the chip, specifically:

[0049] Based on the abnormal reasons corresponding to the target packaging deviation information of the chip outer packaging, obtaining the packaging deviation type corresponding to each target packaging deviation information;

[0050] Based on the completeness evaluation strategy of the preset packaging deviation type, the packaging deviation type corresponding to each target packaging deviation information is tested for completeness, and the target packaging completeness test result of the chip is obtained.

[0051] The embodiment of the present invention also provides a chip packaging integrity detection system, including: an information acquisition module, an actual model construction module, a deviation structure information acquisition module, a radiation difference image acquisition module, a packaging deviation information acquisition module, and a deviation detection module;

[0052] The information acquisition module is used to acquire infrared scanning information of the chip outer package and radiation imaging information of the chip outer package;

[0053] The actual model building module is used to build an actual three-dimensional structure model of the chip outer package based on the infrared scanning information of the chip outer package;

[0054] The deviation structure information acquisition module is used to acquire the deviation structure information by mapping the actual three-dimensional structure model of the chip package to a preset target three-dimensional structure model;

[0055] The radiation difference image acquisition module is used to separate each packaging surface of the chip outer package based on the radiation imaging information of the chip outer package, and acquire the radiation difference image of each packaging surface;

[0056] The packaging deviation information acquisition module is used to analyze the deviation cause based on the deviation structure information and the radiation difference image of each packaging surface to obtain the target packaging deviation information of the chip outer package;

[0057] The deviation detection module is used to obtain a target packaging integrity detection result of the chip based on target packaging deviation information of the chip outer packaging.

[0058] The embodiment of the present invention proposes a chip packaging integrity detection system, which uses infrared scanning and radiation imaging to obtain infrared scanning information of the chip outer package and radiation imaging information of the chip outer package through an information acquisition module, which can amplify the significant distinguishing features of small difference information, so that the method can improve the accuracy of identifying the chip packaging integrity information, and also split the radiation imaging information into radiation images corresponding to multiple packaging surfaces, thereby improving the comprehensiveness of the recognition of radiation imaging information. Then, the actual three-dimensional structure model of the chip outer package is constructed by the actual model construction module and the radiation difference image acquisition module, and the radiation difference image of each packaging surface is acquired. Then, the deviation structure information acquisition module performs mapping analysis on the actual three-dimensional structure model of the chip outer package and the preset target three-dimensional structure model. The deviation structure information corresponding to the chip is obtained, and a three-dimensional structure model is constructed through infrared scanning information to improve the accuracy of obtaining the deviation structure information. The deviation structure information corresponding to the chip and the radiation difference image of each packaging surface are combined, and the cause of the deviation is analyzed through the packaging deviation information acquisition module to obtain the target packaging deviation information of the chip outer package and detect the target packaging integrity of the chip through the deviation detection module; through the combination of the above-mentioned infrared processing method and radiation processing method, and based on the target packaging deviation information of the chip outer package, the target packaging integrity information of the chip is analyzed, and the deformation, cracks, scratches and packaging gaps of the chip can be intelligently and comprehensively identified, which not only reduces the cost of detecting the chip packaging integrity, but also further intelligently improves the accuracy of detecting the chip packaging integrity. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Figure 1A schematic flow chart of the steps of a chip packaging integrity detection method provided by an embodiment of the present invention;

[0060] Figure 2 A schematic diagram of the module structure of a chip packaging integrity detection system provided by an embodiment of the present invention;

[0061] Figure 3 A schematic diagram of the module structure of a chip packaging integrity detection terminal provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0063] The chip packaging integrity detection method provided by the embodiment of the present invention can be applied to the application environment of IoT chip and integrated circuit chip packaging detection. The method can be applied to a terminal, a server, or a system including a terminal and a server, and is implemented through the interaction between the terminal and the server. The terminal can be, but is not limited to, various personal computers, laptops, smart phones, and tablet computers. For details, see Figure 3 , Figure 3 A schematic diagram of the module structure of a chip packaging integrity detection terminal provided in a certain embodiment of the present invention. In the embodiment of the present invention, the following Figure 3 The package integrity detection terminal of a chip shown explains the content of the present invention. The package integrity detection terminal of a chip includes: an infrared scanning device 301, a radiation detection device 302, a terminal 303, an infrared information processing device 304, a radiation information processing device 305 and an integrity detection device 306, which will not be repeated below.

[0064] Example 1

[0065] See also Figure 1 , Figure 1 A schematic flow chart of the steps of a chip packaging integrity detection method provided by an embodiment of the present invention. Figure 1 As shown, the embodiment of the present invention provides a chip packaging integrity detection method, including steps 101 to 106, each step is specifically as follows:

[0066] Step 101, obtaining infrared scanning information of the chip outer package and radiation imaging information of the chip outer package;

[0067] As an example of this embodiment, based on the infrared structure scanning technology, the chip outer package is scanned in all directions to obtain the infrared scanning information of the chip outer package; based on the radiation marking technology, the radiation information of different packaging surfaces of the chip outer package is detected respectively to obtain the radiation imaging information of the chip outer package. In a specific implementation method, the infrared scanning device 301 performs an all-round scan on the outer package of the chip to obtain the infrared scanning information of the chip outer package, and then transmits the infrared scanning information to the terminal 303 to obtain the infrared scanning information of the chip outer package. Then, by performing radiation marking on the chip outer package, the chip outer package is subjected to radiation marking treatment, and then the radiation information of different packaging surfaces of the chip outer package is detected respectively by the radiation detection device 302, and the radiation information of different packaging surfaces of the chip outer package is transmitted to the terminal 303 to obtain the radiation imaging information of the chip outer package. Among them, the infrared scanning device is a scanning device corresponding to the infrared structure scanning technology, and the radiation marking method is a method of marking each packaging surface of the chip with a radioactive radioactive element, and the radioactive element can be a low-radioactive element that is radioactive and harmless to the user's body. For example, tritium, radioactive elements contained in yttrium iron garnet, etc.

[0068] Step 102, constructing an actual three-dimensional structure model of the chip outer package based on the infrared scanning information of the chip outer package;

[0069] As an example of this embodiment, based on the infrared scanning information of the chip outer package, the three-dimensional structure data of the chip outer package is obtained; by simulating and constructing the three-dimensional structure data of the chip outer package, the actual three-dimensional structure model of the chip outer package is obtained. In a specific implementation method, the terminal 303 generates the actual three-dimensional structure model of the chip outer package through the three-dimensional structure data of the chip outer package in the infrared scanning information; wherein, the method of constructing the actual three-dimensional structure model can be to construct the three-dimensional structure model by the method of constructing the finite element simulation model.

[0070] Step 103, obtaining deviation structure information by mapping the actual three-dimensional structure model of the chip package to a preset target three-dimensional structure model;

[0071] As an example of this embodiment, based on the preset target three-dimensional structure model, the three-dimensional coordinate system and the target three-dimensional position information of each reference point are obtained; by mapping the actual three-dimensional structure model of the chip outer package to the three-dimensional coordinate system, the actual three-dimensional position information of each reference point is read; based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point, the deviation structure information is obtained. Specifically, the actual three-dimensional position information of each reference point is aligned with the target three-dimensional position information of each reference point to construct a coincident three-dimensional structure model; by calculating the deviation value of each position point in the actual three-dimensional model and each position point in the target three-dimensional model, the three-dimensional structure deviation value between each position point is obtained; based on the preset clustering algorithm, the position points corresponding to the three-dimensional structure deviation value that meets the preset clustering condition are clustered to obtain a number of abnormal position point groups; based on the several abnormal position point groups, the three-dimensional structure deviation value corresponding to each abnormal position point is obtained to obtain the deviation structure information. In a specific implementation method, the terminal 303 collects the target three-dimensional structure model of the chip outer package, and maps the actual three-dimensional structure model to the target three-dimensional structure model to obtain the deviation structure information in the actual three-dimensional structure model. The target three-dimensional structure model is a sample packaging structure model with a packaging integrity of 100%. Then, the terminal 303 sends the infrared scanning information to the infrared information processing device 304, and maps the two three-dimensional structure models to the same coordinate system through coordinate system mapping, so as to identify the deviation structure information in the actual three-dimensional structure model. The deviation structure information is the deviation information corresponding to the cause of structural abnormality in the packaging process, for example, the deviation information corresponding to the cause of structural depression, deformation and scratches.

[0072] As another example of the present embodiment, the actual three-dimensional structure model is mapped to the target three-dimensional structure model to obtain deviation structure information in the actual three-dimensional structure model, including: identifying the three-dimensional coordinate system of the target three-dimensional structure model and the target three-dimensional position information of each reference point of the target three-dimensional structure model in the three-dimensional coordinate system, and aligning or overlapping the actual three-dimensional position information of each reference point in the actual three-dimensional structure model with the target three-dimensional position information of each reference point to obtain a coincident three-dimensional structure model; in the coincident three-dimensional structure model, identifying the three-dimensional structure deviation value between each position point in the actual three-dimensional structure model and each position point in the target three-dimensional structure model, and clustering the abnormal position points corresponding to the three-dimensional structure deviation values ​​greater than the preset deviation threshold to obtain multiple abnormal position point groups; and using the three-dimensional structure deviation value corresponding to each abnormal position point in each abnormal position point group as each deviation structure information in the actual three-dimensional structure model.

[0073] Step 104, based on the radiation imaging information of the chip outer package, separate each packaging surface of the chip outer package to obtain a radiation difference image of each packaging surface;

[0074] As an example of this embodiment, based on the acquisition angle of each radiation image in the radiation imaging information of the chip outer package, the radiation image of the packaging surface of the chip outer package corresponding to each acquisition angle is split; based on the radiation image of the packaging surface of the chip outer package corresponding to each acquisition angle, the sub-radiation image of each image feature content is obtained by extracting the image feature content in the radiation image and the image range corresponding to the image feature content; based on the sub-radiation image of each image feature content, the radiation intensity distribution information of each image feature content is obtained and the average radiation intensity of each image feature content is calculated; based on the average radiation intensity of each image feature content, the radiation deviation value between the radiation intensity of each radiation position point of the image feature content and the average radiation intensity is calculated to obtain a sub-radiation difference image of several image feature contents; the sub-radiation difference images of all image feature contents that meet the preset radiation deviation threshold are screened to obtain the radiation difference image of each packaging surface. In a specific implementation method, the terminal 303 sends the radiation imaging information to the radiation information processing device 305, and the radiation information processing device 305 splits according to each packaging surface of the chip outer package to obtain the radiation image corresponding to each packaging surface, and identifies the radiation difference image in each radiation image. The radiation difference image is deviation information corresponding to the packaging abnormality cause in the packaging process, for example, deviation information corresponding to packaging misalignment and incomplete packaging. When the packaging abnormality cause is a crack, the packaging cause includes both the radiation difference image and the deviation structure information.

[0075] As another example of this embodiment, identifying the radiation difference image in each radiation image includes: for each radiation image, extracting the image feature content of the radiation image and the image range corresponding to each image feature content; based on the sub-radiation image of each image feature content, identifying the radiation intensity distribution information of each image feature content, and for each image feature content, based on the radiation intensity distribution information of the image feature content, calculating the average radiation intensity of the image feature content and the radiation deviation value between the radiation intensity of each radiation position point of the image feature content and the average radiation intensity; screening all radiation position points corresponding to the radiation deviation values ​​lower than the radiation deviation threshold in the abnormal image range of the image feature content as the sub-radiation difference image of the image feature content, and taking the sub-radiation difference images of all image feature contents as the radiation difference image in the radiation image. The radiation information processing device 305 extracts the image feature content of the radiation image and the image range corresponding to each image feature content for each radiation image. The method of extracting the image feature content is to extract the image feature content based on the enhanced convolutional neural network corresponding to the image feature recognition algorithm; the radiation deviation threshold is the radiation deviation threshold preset in the terminal 303.

[0076] Step 105, analyzing the deviation cause based on the deviation structure information and the radiation difference image of each packaging surface to obtain target packaging deviation information of the chip outer package;

[0077] As an example of this embodiment, based on the structural deviation trend ranges corresponding to several preset structural deviation reasons and the outer packaging ranges corresponding to each packaging area of ​​the chip outer packaging, deviation analysis is performed on each abnormal position point group to obtain the structural deviation distribution information of the corresponding abnormal position point group; based on the structural deviation distribution information of the corresponding abnormal position point group and the target structural deviation trend range of each abnormal position point group, the structural deviation cause of each abnormal position point group is obtained; based on the abnormal image range corresponding to each sub-radiation difference image in the radiation difference image of each packaging surface and the packaging surface corresponding to the radiation difference image, the target outer packaging range of the chip outer packaging is obtained; based on the target outer packaging range of the chip outer packaging, the difference reasons of each sub-radiation difference image within the abnormal image range are matched and analyzed to obtain the radiation difference reasons of the radiation difference image; based on the structural deviation reasons of each abnormal position point group and the radiation difference reasons of the radiation difference image, the target packaging deviation information of the chip outer packaging is obtained. Specifically, based on the structural deviation reasons of the abnormal position point groups and the radiation difference reasons of the radiation difference images, the first deviation structural information and the first sub-radiation difference image of the same packaging range and the second deviation structural information and the second sub-radiation difference image of different packaging ranges are obtained; based on the first deviation structural information and the first sub-radiation difference image of the same packaging range, by matching the target abnormal reasons of the same outer packaging range, the first sub-package deviation information corresponding to the same outer packaging range is obtained; based on the second deviation structural information and the second sub-radiation difference image of different packaging ranges, the structural deviation reasons corresponding to the second deviation structural information and the radiation difference reasons of the second sub-radiation difference image are analyzed respectively to obtain the second sub-package deviation information corresponding to the different outer packaging ranges; wherein, the second sub-package deviation information corresponding to the different outer packaging ranges includes: the sub-package deviation information corresponding to each of the second deviation structural information and the sub-package deviation information of each of the second sub-radiation difference images; based on the first sub-package deviation information corresponding to the same outer packaging range and the second sub-package deviation information corresponding to the different outer packaging ranges, the target package deviation information of the chip outer packaging is obtained.A specific possible implementation method is to obtain the structural deviation trend range corresponding to each structural deviation cause and the outer packaging range corresponding to each packaging area of ​​the chip outer packaging, and for each abnormal position point group, based on the three-dimensional structural deviation value corresponding to each abnormal position point in the abnormal position point group and the position information of each abnormal position point in the abnormal position point group, identify the structural deviation distribution information of the abnormal position point group; based on the structural deviation distribution information of the abnormal position point group, identify the target structural deviation trend range of the abnormal position point group, and determine the structural deviation cause of the abnormal position point group based on the structural deviation trend range to which the target structural deviation trend range belongs; for each radiation difference image, based on the abnormal image range corresponding to each sub-radiation difference image in the radiation difference image and the packaging surface corresponding to the radiation difference image, identify the target outer packaging range of each abnormal image range in the chip outer packaging, and based on the target outer packaging range corresponding to each abnormal image range and the outer packaging range corresponding to each packaging area of ​​the chip outer packaging, identify the target packaging area corresponding to each abnormal image range; based on the target packaging area corresponding to each abnormal image range and the radiation difference cause corresponding to the target packaging area, determine the radiation difference cause of the sub-radiation difference image corresponding to each abnormal image range, and use the radiation difference causes of all sub-radiation difference images as the radiation difference cause of the radiation difference image. The packaging area includes the welding area, the splicing area, the shell area, and the base motherboard area, etc. Each area corresponds to a radiation difference principle, for example, the radiation difference in the welding area is caused by loose welding, the radiation difference in the splicing area is caused by abnormal splicing, the radiation difference in the shell area is caused by abnormal structure, and the radiation difference in the base motherboard area is caused by loose base, etc.

[0078] As another example of this embodiment, based on the first outer packaging range to which all abnormal position points in each deviation structure information belong and the target outer packaging range corresponding to each sub-radiation difference image in each radiation difference image, the first deviation structure information and the first sub-radiation difference image of the same outer packaging range and the second deviation structure information and the second sub-radiation difference image of different outer packaging ranges are identified; based on the structural deviation reasons corresponding to each first deviation structure information and the radiation difference reasons corresponding to each first sub-radiation difference image, the target abnormal reasons of each same outer packaging range are determined, and the range information corresponding to each same outer packaging range and the target abnormal reasons of each same outer packaging range are used as the sub-package deviation information corresponding to each same outer packaging range; the structural deviation reasons corresponding to each second deviation structure information and the first outer packaging range corresponding to each second deviation structure information are used as the sub-package deviation information corresponding to each second deviation structure information, and the radiation difference reasons of each second sub-radiation difference image and the target outer packaging range corresponding to each second sub-radiation difference image are used as the sub-package deviation information of each second sub-radiation difference image; the sub-package deviation information corresponding to each same outer packaging range, the sub-package deviation information corresponding to each second deviation structure information and the sub-package deviation information of each second sub-radiation difference image are used as the target packaging deviation information of the chip outer packaging. Among them, the target abnormality cause is a crack, and the target abnormality cause includes the depth of the crack and the range of the crack. Then, the radiation information processing device 305 uses the range information corresponding to each same outer packaging range and the target abnormality cause of each same outer packaging range as the sub-package deviation information corresponding to each same outer packaging range. The structural deviation cause also includes: the deviation degree of the structural deviation cause, and the deviation degree of the structural deviation cause is the structural deviation distribution information. The radiation deviation cause includes: the radiation difference range of the radiation difference cause, and the radiation difference range of the radiation difference cause is the abnormal image range of the second sub-radiation difference image.

[0079] Step 106 , obtaining a target packaging integrity test result of the chip based on the target packaging deviation information of the chip outer package.

[0080] As an example of this embodiment, based on the abnormal cause corresponding to the target packaging deviation information of the chip outer package, the packaging deviation type corresponding to each target packaging deviation information is obtained; in a specific implementation mode, the integrity detection device 306 obtains the integrity evaluation strategy for different packaging deviation types, and identifies the packaging deviation type corresponding to each sub-package deviation information based on the abnormal cause corresponding to each sub-package deviation information of the target packaging deviation information; based on the packaging deviation type corresponding to each sub-package deviation information and the target outer package range corresponding to each sub-package deviation information, the packaging integrity information of each sub-package deviation information is evaluated through the integrity evaluation strategy of each packaging deviation type, and the packaging integrity information of all sub-package deviation information is used as the target packaging integrity information of the chip.

[0081] Based on the completeness evaluation strategy of the preset packaging deviation type, the packaging deviation type corresponding to each target packaging deviation information is tested for completeness, and the target packaging completeness test result of the chip is obtained.

[0082] The embodiment of the present invention proposes a chip packaging integrity detection method, which obtains infrared scanning information and radiation imaging information of the chip outer package by infrared scanning and radiation imaging, and can amplify the significant distinguishing features of small difference information, so that the method can improve the accuracy of identifying the chip packaging integrity information, and also split the radiation imaging information into radiation images corresponding to multiple packaging surfaces, thereby improving the comprehensiveness of the recognition of radiation imaging information, and then respectively construct an actual three-dimensional structure model of the chip outer package and obtain the radiation difference image of each packaging surface, and then map and analyze the actual three-dimensional structure model of the chip outer package with the preset target three-dimensional structure model to obtain the deviation structure information corresponding to the chip, and construct the three-dimensional structure model through the infrared scanning information to improve the accuracy of obtaining the deviation structure information, and combine the deviation structure information corresponding to the chip and the radiation difference image of each packaging surface to analyze the cause of the deviation, obtain the target packaging deviation information of the chip outer package, and detect the target packaging integrity of the chip; through the above-mentioned infrared processing method and radiation processing method The target packaging integrity information of the chip is analyzed based on the target packaging deviation information of the chip outer packaging, which can intelligently and comprehensively identify the deformation, cracks, scratches and packaging gaps in the chip, which not only reduces the cost of detecting the chip packaging integrity, but also further intelligently improves the accuracy of detecting the chip packaging integrity; by extracting the feature content of each image and calculating the average radiation intensity, the radiation difference image in the radiation image is determined, and the accuracy of the radiation difference image in the determined radiation image is improved; by identifying the packaging deviation type corresponding to each sub-package deviation information and the target outer packaging range, the target packaging integrity information is determined, which reduces the cost of detecting the chip packaging integrity, intelligently improves the accuracy of detecting the chip packaging integrity, and improves the detection efficiency of the chip packaging integrity through the full-process intelligent identification and analysis; by determining different abnormal ranges, abnormal causes and the abnormal degree of the abnormal causes, the deviation information of each sub-package is obtained, and the comprehensiveness of the target packaging deviation information of the chip outer packaging is improved.

[0083] Example 2

[0084] See also Figure 2 , Figure 2 The module structure diagram of a chip packaging integrity detection system provided by an embodiment of the present invention is as follows. Figure 2 As shown, an embodiment of the present invention provides a chip packaging integrity detection system, including:

[0085] Information acquisition module 201, actual model building module 202, deviation structure information acquisition module 203, radiation difference image acquisition module 204, packaging deviation information acquisition module 205, deviation detection module 206;

[0086] The information acquisition module 201 is used to acquire infrared scanning information of the chip outer package and radiation imaging information of the chip outer package;

[0087] The actual model building module 202 is used to build an actual three-dimensional structure model of the chip outer package based on the infrared scanning information of the chip outer package;

[0088] The deviation structure information acquisition module 203 is used to acquire the deviation structure information by mapping the actual three-dimensional structure model of the chip package to a preset target three-dimensional structure model;

[0089] The radiation difference image acquisition module 204 is used to separate each packaging surface of the chip outer package based on the radiation imaging information of the chip outer package, and acquire the radiation difference image of each packaging surface;

[0090] The packaging deviation information acquisition module 205 is used to analyze the deviation cause based on the deviation structure information and the radiation difference image of each packaging surface to obtain the target packaging deviation information of the chip outer package;

[0091] The deviation detection module 206 is used to obtain a target packaging integrity detection result of the chip based on the target packaging deviation information of the chip outer package.

[0092] The embodiment of the present invention proposes a chip packaging integrity detection system, which uses infrared scanning and radiation imaging to obtain infrared scanning information of the chip outer package and radiation imaging information of the chip outer package through an information acquisition module, which can amplify the significant distinguishing features of small difference information, so that the method can improve the accuracy of identifying the chip packaging integrity information, and also split the radiation imaging information into radiation images corresponding to multiple packaging surfaces, thereby improving the comprehensiveness of the recognition of radiation imaging information. Then, the actual three-dimensional structure model of the chip outer package is constructed by the actual model construction module and the radiation difference image acquisition module, and the radiation difference image of each packaging surface is acquired. Then, the deviation structure information acquisition module performs mapping analysis on the actual three-dimensional structure model of the chip outer package and the preset target three-dimensional structure model. The deviation structure information corresponding to the chip is obtained, and a three-dimensional structure model is constructed through infrared scanning information to improve the accuracy of obtaining the deviation structure information. The deviation structure information corresponding to the chip and the radiation difference image of each packaging surface are combined, and the cause of the deviation is analyzed through the packaging deviation information acquisition module to obtain the target packaging deviation information of the chip outer package and detect the target packaging integrity of the chip through the deviation detection module; through the combination of the above-mentioned infrared processing method and radiation processing method, and based on the target packaging deviation information of the chip outer package, the target packaging integrity information of the chip is analyzed, and the deformation, cracks, scratches and packaging gaps of the chip can be intelligently and comprehensively identified, which not only reduces the cost of detecting the chip packaging integrity, but also further intelligently improves the accuracy of detecting the chip packaging integrity.

[0093] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

[0094] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0095] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

Claims

1. A chip packaging integrity detection method, characterized in that: include: Obtain infrared scanning information of the chip outer package and radiation imaging information of the chip outer package; Based on the infrared scanning information of the chip outer package, construct an actual three-dimensional structural model of the chip outer package; Obtaining deviation structure information by mapping the actual three-dimensional structure model of the chip outer package to a preset target three-dimensional structure model; Based on the radiation imaging information of the chip outer package, separate each packaging surface of the chip outer package to obtain a radiation difference image of each packaging surface; Based on the deviation structure information and the radiation difference image of each packaging surface, the cause of the deviation is analyzed to obtain target packaging deviation information of the chip outer packaging; Based on the target packaging deviation information of the chip outer packaging, the target packaging integrity test result of the chip is obtained.

2. A chip packaging integrity detection method as claimed in claim 1, characterized in that: The step of obtaining the infrared scanning information of the chip outer package and the radiation imaging information of the chip outer package is specifically as follows: Based on infrared structure scanning technology, the chip outer package is scanned in all directions to obtain infrared scanning information of the chip outer package; Based on the radiation marking technology, the radiation information of different packaging surfaces of the chip outer packaging is detected respectively to obtain the radiation imaging information of the chip outer packaging.

3. A chip packaging integrity detection method as claimed in claim 1, characterized in that: Based on the infrared scanning information of the chip outer package, an actual three-dimensional structure model of the chip outer package is constructed, specifically: Based on the infrared scanning information of the chip outer package, acquiring the three-dimensional structure data of the chip outer package; The actual three-dimensional structure model of the chip outer package is obtained by simulating and constructing the three-dimensional structure data of the chip outer package.

4. A chip packaging integrity detection method as claimed in claim 1, characterized in that: The deviation structure information is obtained by mapping the actual three-dimensional structure model of the chip package to the preset target three-dimensional structure model, specifically: Based on the preset target three-dimensional structure model, obtaining the target three-dimensional position information of the three-dimensional coordinate system and each reference point; By mapping the actual three-dimensional structural model of the chip package to the three-dimensional coordinate system, the actual three-dimensional position information of each reference point is read; Based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point, the deviation structure information is acquired.

5. A chip packaging integrity detection method as claimed in claim 4, characterized in that: Based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point, the deviation structure information is obtained, specifically: Aligning the actual three-dimensional position information of each reference point with the target three-dimensional position information of each reference point to construct a three-dimensional structural model; By calculating the deviation value of each position point in the actual three-dimensional model and each position point in the target three-dimensional model, the three-dimensional structure deviation value between each position point is obtained; Based on a preset clustering algorithm, the location points corresponding to the three-dimensional structure deviation values ​​that meet the preset clustering conditions are clustered to obtain several abnormal location point groups; Based on the plurality of abnormal position point groups, the three-dimensional structure deviation value corresponding to each abnormal position point is obtained to obtain the deviation structure information.

6. A chip packaging integrity detection method as claimed in claim 5, characterized in that: Based on the radiation imaging information of the chip outer package, each packaging surface of the chip outer package is split to obtain a radiation difference image of each packaging surface, specifically: Based on the acquisition viewing angles of each radiation image in the radiation imaging information of the chip outer package, splitting to obtain the radiation image of the packaging surface of the chip outer package corresponding to each acquisition viewing angle; Based on the radiation image of the packaging surface of the chip outer packaging corresponding to each acquisition angle, by extracting the image feature content in the radiation image and the image range corresponding to the image feature content, a sub-radiation image of each image feature content is obtained; Based on the sub-radiation images of each image feature content, obtaining radiation intensity distribution information of each image feature content and calculating the average radiation intensity of each image feature content; Based on the average radiation intensity of each image feature content, a radiation deviation value between the radiation intensity of each radiation position point of the image feature content and the average radiation intensity is calculated to obtain sub-radiation difference images of several image feature contents; The sub-radiance difference images of all image feature contents that meet the preset radiation deviation threshold are screened to obtain the radiation difference image of each packaging surface.

7. A chip packaging integrity detection method as claimed in claim 6, characterized in that: Based on the deviation structure information and the radiation difference image of each packaging surface, the deviation cause is analyzed to obtain the target packaging deviation information of the chip outer package, specifically: Based on the structural deviation trend ranges corresponding to the preset several structural deviation reasons and the outer packaging ranges corresponding to the packaging areas of the chip outer packaging, deviation analysis is performed on each abnormal position point group to obtain the structural deviation distribution information of the corresponding abnormal position point group; Based on the structural deviation distribution information of the corresponding abnormal position point group, corresponding to the target structural deviation trend range of each abnormal position point group, obtaining the structural deviation cause of each abnormal position point group; Based on the abnormal image range corresponding to each sub-radiation difference image in the radiation difference image of each packaging surface and the packaging surface corresponding to the radiation difference image, a target outer packaging range of the chip outer packaging is obtained; Based on the target outer packaging range of the chip outer packaging, matching and analyzing the difference reasons of each sub-radiation difference image within the abnormal image range, and obtaining the radiation difference reasons of the radiation difference image; Based on the structural deviation reasons of each abnormal position point group and the radiation difference reasons of the radiation difference image, the target packaging deviation information of the chip outer package is obtained.

8. A chip packaging integrity detection method as claimed in claim 7, characterized in that: Based on the structural deviation reasons of each abnormal position point group and the radiation difference reasons of the radiation difference image, the target packaging deviation information of the chip outer package is obtained, specifically: Based on the structural deviation reasons of each abnormal position point group and the radiation difference reasons of the radiation difference image, first deviation structural information and a first sub-radiation difference image of the same packaging range and second deviation structural information and a second sub-radiation difference image of different packaging ranges are obtained; Based on the first deviation structure information and the first sub-radiation difference image of the same packaging range, by matching the target abnormality cause of the same outer packaging range, the first sub-packaging deviation information corresponding to the same outer packaging range is obtained; Based on the second deviation structural information of different packaging ranges and the second sub-radiation difference images, the structural deviation cause corresponding to the second deviation structural information and the radiation difference cause of the second sub-radiation difference image are analyzed respectively to obtain the second sub-package deviation information corresponding to the different outer packaging ranges; wherein the second sub-package deviation information corresponding to the different outer packaging ranges includes: the sub-package deviation information corresponding to each of the second deviation structural information and the sub-package deviation information of each of the second sub-radiation difference images; Based on the first sub-package deviation information corresponding to the same outer package range and the second sub-package deviation information corresponding to the different outer package ranges, the target package deviation information of the chip outer package is obtained.

9. A chip packaging integrity detection method according to any one of claims 1 to 8, characterized in that: Based on the target packaging deviation information of the chip outer packaging, the target packaging integrity test result of the chip is obtained, specifically: Based on the abnormal reasons corresponding to the target packaging deviation information of the chip outer packaging, obtaining the packaging deviation type corresponding to each target packaging deviation information; Based on the completeness evaluation strategy of the preset packaging deviation type, the packaging deviation type corresponding to each target packaging deviation information is tested for completeness, and the target packaging completeness test result of the chip is obtained.

10. A chip packaging integrity detection system, characterized in that: include: Information acquisition module, actual model building module, deviation structure information acquisition module, radiation difference image acquisition module, package deviation information acquisition module, deviation detection module; The information acquisition module is used to acquire infrared scanning information of the chip outer package and radiation imaging information of the chip outer package; The actual model building module is used to build an actual three-dimensional structure model of the chip outer package based on the infrared scanning information of the chip outer package; The deviation structure information acquisition module is used to acquire the deviation structure information by mapping the actual three-dimensional structure model of the chip package to a preset target three-dimensional structure model; The radiation difference image acquisition module is used to separate each packaging surface of the chip outer package based on the radiation imaging information of the chip outer package, and acquire the radiation difference image of each packaging surface; The packaging deviation information acquisition module is used to analyze the deviation cause based on the deviation structure information and the radiation difference image of each packaging surface to obtain the target packaging deviation information of the chip outer package; The deviation detection module is used to obtain a target packaging integrity detection result of the chip based on target packaging deviation information of the chip outer packaging.

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