Fault detection circuit, electronic equipment, self-checking method and vehicle

Abstract

The invention provides a fault detection circuit, electronic equipment, a self-checking method and a vehicle. The fault detection circuit comprises a signal acquisition sensor used for acquiring a response signal output by a to-be-detected module to obtain a signal measurement value; the controller is used for inputting a detection signal to the to-be-detected module and generating a preliminary detection result of the to-be-detected module based on the signal measurement value and a preset signal reference value of the to-be-detected module; and the controller is also used for controlling the to-be-detected module to carry out multiple times of detection when the preliminary detection results comprise the fault information of the to-be-detected module, and carrying out fault positioning based on the obtained multiple preliminary detection results. According to the circuit, the detection signal is sent to the to-be-detected module, the signal measurement value of the response signal is obtained, and fault detection and fault analysis are performed based on the signal measurement value and the preset signal reference value, so that fault detection can be performed on the electronic equipment in time, and the fault can be accurately positioned.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and more specifically to a fault detection circuit, an electronic device, a self-test method and a vehicle. Background Art

[0002] After electronic equipment is powered on, the self-test work before operation is related to whether the equipment can operate safely and normally; at the same time, it is inevitable to face the design and aging problems of hardware circuits during its use, especially in a long-term high-load operation environment, which can easily lead to failures. Therefore, it is necessary for these products to perform self-tests in order to discover and eliminate faults in time to ensure the safety and normal operation of the products.

[0003] Due to the limitation of product cost, the self-test of electronic equipment is usually only for modules that can monitor the operating status, relying on the operating status information fed back by the module, such as the battery fault alarm of the battery module fed back by the communication module, the software / hardware operation of the high temperature warning, overcharge, over-discharge and other detection modules; and for modules that cannot be monitored, it is usually assumed that the module functions normally or the software is used for detection. However, software detection can usually be performed after the actual operating conditions are collected during system operation, and it is impossible to detect faults in time before operation; and when a fault occurs, it is difficult to determine the cause of the fault, such as whether it is a physical module fault or a sensor fault, or a fault caused by a sudden change in the operating conditions; or when multiple faults coexist, it is difficult to locate the fault, resulting in the failure to eliminate the fault in time.

[0004] Therefore, how to timely detect and locate faults of modules without state monitoring in electronic equipment has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] The present application is proposed in view of the above problems. The present application provides a fault detection circuit, an electronic device, a self-test method and a vehicle, which can detect faults of the electronic device in a timely manner and accurately locate faults by sending a detection signal to a module to be tested and obtaining a signal measurement value of a response signal, and performing fault detection and fault analysis based on the signal measurement value and a preset signal reference value.

[0006] According to one aspect of the present application, a fault detection circuit is provided, comprising:

[0007] A signal acquisition sensor is used to acquire the response signal output by the module to be tested to obtain a signal measurement value;

[0008] A controller, configured to input a detection signal to the module to be tested, and generate a preliminary detection result of the module to be tested based on the signal measurement value and a signal reference value preset by the module to be tested;

[0009] The controller is further configured to control the module to be tested to perform testing when the preliminary testing result includes fault information of the module to be tested, and to locate the fault based on the obtained preliminary testing result.

[0010] In one embodiment of the present application, the controller is also used to use the fault location result obtained by fault location as the final fault detection result of the module to be tested, and the fault detection result includes at least one of the following: there is no fault in the module to be tested, there is a fault in the module to be tested, fault location information when there is a fault in the module to be tested, and the fault type.

[0011] In one embodiment of the present application, the fault detection circuit further includes a selection circuit, and the selection circuit includes a first selector;

[0012] The first selector takes the plurality of modules to be tested as outputs, and is used to send the detection signal to the corresponding module to be tested according to the first selection signal sent by the controller.

[0013] In one embodiment of the present application, the selection circuit further includes a second selector;

[0014] The second selector takes the signal measurement values ​​output by the signal acquisition sensors of the multiple modules to be tested as input, and is used to send the signal measurement values ​​of the corresponding modules to be tested to the controller according to the second selection signal sent by the controller.

[0015] In one embodiment of the present application, the controller is used to determine whether a corresponding signal acquisition sensor fails based on a signal measurement value corresponding to the fault information and the signal reference value when multiple preliminary detection results of multiple modules to be tested include at least one fault information.

[0016] In one embodiment of the present application, the controller is used to determine that the signal acquisition sensor collecting the response signal is not faulty when the difference between the signal measurement value and the signal reference value is greater than a first preset threshold value; and to determine that the signal acquisition sensor collecting the response signal is faulty when the difference between the signal measurement value and the signal reference value is less than or equal to the first preset threshold value.

[0017] In one embodiment of the present application, the controller is used to:

[0018] When the signal acquisition sensor is not faulty, multiple preliminary detection results are obtained by inputting multiple detection signals to each of the modules to be tested;

[0019] When the multiple preliminary detection results include fault information, and the multiple detection signals are within a preset value range, it is determined that the module to be tested has a hardware fault;

[0020] When the plurality of preliminary detection results include fault information and the signal measurement values ​​of the plurality of detection signals are not within the preset value range, it is determined that the module to be tested has a software fault.

[0021] In one embodiment of the present application, the detection signal and the response signal are respectively one of a voltage signal, a current signal, and an optical signal.

[0022] According to a second aspect of the present application, an electronic device with a self-test function is provided, the electronic device comprising one or more modules to be tested and a fault detection circuit as described in any one of the first aspects above.

[0023] According to a third aspect of the present application, a self-test method for an electronic device is provided, which is applied to the above-mentioned electronic device with a self-test function, and the self-test method includes:

[0024] The controller inputs a detection signal to the module to be tested and obtains a signal measurement value of a response signal output by the module to be tested through a signal acquisition sensor;

[0025] The controller generates a preliminary detection result of the module to be tested based on the signal measurement value and a preset signal reference value of the module to be tested;

[0026] When the preliminary detection result includes the fault information of the module to be tested, the controller controls the module to be tested to perform detection, and locates the fault based on the obtained preliminary detection result.

[0027] In one embodiment of the present application, the self-test method also includes: using the fault location result obtained by fault location as the final fault detection result of the module to be tested, and the fault detection result includes at least one of the following: there is no fault in the module to be tested, there is a fault in the module to be tested, fault location information when there is a fault in the module to be tested, and the fault type.

[0028] In one embodiment of the present application, the controller is connected to the plurality of modules to be tested via a selection circuit, and the selection circuit includes a first selector that takes the plurality of modules to be tested as outputs;

[0029] Inputting a detection signal to the module to be tested and obtaining a signal measurement value of a response signal output by the module to be tested through a signal acquisition sensor includes:

[0030] The controller sends out a first selection signal and a detection signal, and controls the first selector to send the detection signal to a corresponding module to be tested.

[0031] In one embodiment of the present application, the selection circuit further includes a second selector that takes the signal measurement values ​​of the signal acquisition sensors of the plurality of modules to be tested as input;

[0032] Inputting a detection signal to the module to be tested and obtaining a signal measurement value of a response signal output by the module to be tested through a signal acquisition sensor also includes:

[0033] According to the second selection signal sent by the controller, the second selector is controlled to send the signal measurement value of the module to be tested acquired by the corresponding signal acquisition sensor to the controller.

[0034] In one embodiment of the present application, locating the fault based on the obtained preliminary detection result includes:

[0035] When a plurality of preliminary detection results of a plurality of modules to be tested include a piece of fault information, the controller determines whether a corresponding signal acquisition sensor fails based on a signal measurement value corresponding to the fault information and the signal reference value.

[0036] In one embodiment of the present application, determining whether a fault occurs in the signal acquisition sensor based on the signal measurement value corresponding to the fault information and the signal reference value includes:

[0037] When the difference between the signal measurement value and the signal reference value is greater than a first preset threshold, determining that the signal acquisition sensor that acquires the response signal is not faulty;

[0038] When the difference between the voltage value determined by the response signal and the signal reference value is smaller than a first preset threshold, it is determined that a signal acquisition sensor that acquires the response signal fails.

[0039] In one embodiment of the present application, locating the fault based on the obtained preliminary detection result further includes:

[0040] When the signal acquisition sensor is not faulty, multiple preliminary detection results are obtained by inputting multiple detection signals to each of the modules to be tested;

[0041] When the multiple preliminary detection results include fault information, and the multiple detection signals are within a preset value range, it is determined that the module to be tested has a hardware fault;

[0042] When the plurality of preliminary detection results include fault information and the plurality of detection signals are not within the preset value range, it is determined that the module to be tested has a software fault.

[0043] In one embodiment of the present application, the detection signal and the response signal are respectively one of a voltage signal, a current signal, and an optical signal.

[0044] According to a fourth aspect of the present application, a vehicle is provided, the vehicle comprising the above-mentioned electronic device with a self-checking function.

[0045] The fault detection circuit of the embodiment of the present application sends a detection signal to the module to be tested and obtains the signal measurement value of the response signal of the module to be tested, and performs fault detection and fault analysis based on the signal measurement value and the preset signal reference value, so that fault detection of the electronic device can be carried out in a timely manner after the device is powered on, before operation, and during daily operation, and the fault can be accurately located. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The above and other purposes, features and advantages of the present invention will become more apparent by describing the embodiments of the present invention in more detail in conjunction with the accompanying drawings. The accompanying drawings are used to provide a further understanding of the embodiments of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0047] Figure 1 is a schematic block diagram of a fault detection circuit according to an embodiment of the present application;

[0048] Figure 2 is a schematic block diagram of a fault detection circuit according to a first embodiment of the present application;

[0049] Figure 3 is a schematic block diagram of an electronic device with a self-checking function according to an embodiment of the present application;

[0050] Figure 4 is a schematic flow chart of a self-checking method of an electronic device according to an embodiment of the present application;

[0051] Figure 5 is an algorithm flow chart of a self-check process of an electronic device according to the first embodiment of the present application;

[0052] Figure 6 It is an algorithm flow chart of the self-check process of the electronic device according to the second embodiment of the present application.

[0053] Description of Reference Numerals

[0054] 100-fault detection circuit, 110-controller, 111-MCU, 120-signal acquisition sensor, 121-first voltage converter, 122-second voltage converter, 123-third voltage converter, 131-first selector, 132-second selector, 133-third selector;

[0055] 200 - module to be tested, 201 - first module to be tested, 202 - second module to be tested, 203 - third module to be tested. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical scheme and advantages of the present invention more obvious, the exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments of the present invention, and it should be understood that the present invention is not limited to the exemplary embodiments described herein. Based on the embodiments of the present invention described in the present invention, all other embodiments obtained by those skilled in the art without creative work should fall within the protection scope of the present invention.

[0057] Since the self-test of current electronic equipment is usually only for modules that can monitor the operating status, the module software / hardware is tested based on the operating status information fed back by the module, and the module that cannot perform status monitoring is assumed to be functioning normally or is tested using software. Based on this, the present application proposes a fault detection circuit, an electronic device, a self-test method and a vehicle, wherein the fault detection circuit can be applied to electronic equipment to perform fault detection on a module to be tested in the same electronic device.

[0058] First, refer to Figure 1 To describe the fault detection circuit according to the embodiment of the present application.

[0059] like Figure 1 As shown, the fault detection circuit 100 includes:

[0060] The signal acquisition sensor 120 is used to acquire the response signal output by the module to be tested 200 to obtain a signal measurement value;

[0061] The controller 110 is used to input a detection signal to the module under test 200, and generate a preliminary detection result of the module under test 200 based on the signal measurement value and the signal reference value preset by the module under test 200;

[0062] The controller 110 is further used to control the module to be tested 200 to perform detection when the preliminary detection result includes fault information of the module to be tested 200 , locate the fault based on the obtained preliminary detection result, and obtain the final fault detection result of the module to be tested 200 .

[0063] Specifically, the module to be tested 200 may be a circuit composed of multiple components in an electronic device, such as resistors, inductors, capacitors, semiconductors, transformers, relays, etc., but not limited thereto. These components are connected together in a predetermined manner and are used to implement a preset function.

[0064] The controller 110 in the fault detection circuit 100 may be a general purpose processor, an application specific integrated circuit (ASIC), a programmable logic device (PLD), a digital signal processor (DSP) or a combination thereof. The above-mentioned PLD may be a complex programmable logic device (CPLD), a field programmable gate array (FPGA), a generic array logic (GAL) or any combination thereof, which is not specifically limited in the embodiments of the present application.

[0065] The controller 110 also includes a memory for storing program instructions, a preset voltage value of a voltage detection signal, a preset reference voltage value of the module to be tested 200, and a drive circuit, etc., which can be a non-volatile memory (NVM), such as a read-only memory (ROM), specifically an electrically erasable programmable read-only memory (EEROM) or an erasable programmable read-only memory (EPROM).

[0066] It should be noted that the controller of the present application can be independently set up from other controllers or processors in the electronic device, or can be implemented by the same controller, for example, by different programs or functional modules running in the same controller.

[0067] The controller 110 can input a detection signal to the detection circuit of the module to be tested 200 through a built-in digital to analog converter (DAC) or an external digital to analog converter circuit. The detection signal can be a voltage signal, a current signal, or an optical signal, etc. For example, it can be a DC voltage signal or an AC voltage signal with known parameters, or a pulse current signal or a non-periodic current signal, that is, the parameters of the detection signal are predetermined. For example, the voltage value, frequency and other parameters of the voltage detection signal are pre-configured and saved, and are called when fault detection is performed to generate the required detection signal.

[0068] Here, the detection signal and the response signal may be a voltage signal, a current signal or a light signal. Correspondingly, the signal measurement value may be a voltage value, a current value, a light intensity value, etc. Moreover, the detection signal and the response signal may be signals of the same form or signals of different forms. This application does not specifically limit the forms of the detection signal and the response signal.

[0069] The signal acquisition sensor 120 in the fault detection circuit 100 is determined according to the form of the response signal, and may be a voltage sensor, a current sensor, or a light sensor, etc. The present application does not specifically limit the signal acquisition sensor.

[0070] For example, when the detection signal is a voltage detection signal, the input end of the module to be tested 200 inputs the voltage detection signal, and the output end outputs a voltage response signal. The voltage response signal can be a DC signal or an AC signal, or a pulse signal or a non-periodic signal, and the voltage response signal is transmitted to the controller 110.

[0071] The signal acquisition sensor 120 in the fault detection circuit 100 may be a voltage transformer, a voltage Hall sensor, etc., or other types of voltage sensors, which are not specifically limited here.

[0072] The controller 110 can receive the response signal output by the signal acquisition sensor 120 through a built-in analog to digital converter (ADC) or an external analog to digital conversion circuit, and generate a preliminary detection result of the module to be tested 200 based on the signal measurement value of the response signal and the signal reference value preset by the module to be tested 200.

[0073] Here, the signal reference value is the measured value of the output signal when the calibration signal is input to the module to be tested without failure. The signal reference value can also be a voltage value, a current value, a light intensity value, etc., but is not limited thereto.

[0074] For example, the controller 110 may compare the output voltage value determined by the voltage response signal with a preset reference voltage value of the module under test 200, and preliminarily determine whether a fault occurs in the module under test 200 by judging whether the difference between the two is within a preset range.

[0075] When the module to be tested 200 is tested, one or more tests can be performed. For example, when the fault detection circuit only includes one module to be tested 200 and the sensor is faulty, the controller 110 only needs to perform one test on the module to be tested to locate the fault in the sensor. When the controller detects multiple modules to be tested 200 through a signal acquisition sensor, it is necessary to detect multiple modules separately before locating the fault. For another example, when the controller detects a module to be tested through a signal acquisition sensor, multiple tests can be performed to further determine the fault and avoid false detection. Therefore, in this application, there is no limit on the number of times the module to be tested 200 is controlled to be tested after the initial inspection.

[0076] When the preliminary detection result includes fault information of the module under test 200, that is, it is preliminarily determined that the module under test 200 has a fault, the controller controls the module under test 200 to perform one or more detections, and performs fault location based on the one or more preliminary detection results obtained. Fault location is used to determine whether the module under test has a fault, and the specific location that caused the fault information to occur.

[0077] The fault information here refers to that the difference between the signal measurement value of the output response signal and the preset signal reference value is within the preset range.

[0078] Through multiple inspections, on the one hand, false detection can be avoided, and on the other hand, the cause of the fault can be further analyzed or the fault can be located by appropriately adjusting the input detection signal.

[0079] The fault detection circuit in the present application sends a detection signal to the module to be tested and obtains a response signal from the module to be tested, and performs fault detection and fault analysis based on the signal measurement value and the preset signal reference value, so that the electronic device can be timely detected and the fault in the electronic device can be discovered after the device is powered on and before operation, and the fault can be accurately located, providing a strong guarantee for the timely elimination of the fault.

[0080] According to an embodiment of the present application, the controller 110 is also used to use the fault location result obtained by fault location as the final fault detection result of the module to be tested 200, and the fault detection result includes at least one of the following: there is no fault in the module to be tested 200, there is a fault in the module to be tested 200, fault location information when there is a fault in the module to be tested 200, and the fault type.

[0081] For example, when a fault occurs in the module to be tested 200 , the fault type may be a software fault or a hardware fault.

[0082] According to an embodiment of the present application, the controller is used to obtain multiple preliminary detection results by inputting multiple detection signals to each module to be tested when the preliminary detection results include fault information of the module to be tested; when the multiple preliminary detection results include fault information and the signal measurement values ​​of the multiple detection signals are within a preset numerical range, it is determined that the module to be tested has a hardware fault; when the multiple preliminary detection results include fault information and the signal measurement values ​​of the multiple detection signals are not within the preset numerical range, it is determined that the module to be tested has a software fault.

[0083] For example, when the detection signal is a voltage signal, the controller can adjust the voltage to be tested within a preset voltage range until the controller can detect fault information. If fault information is detected after multiple voltage detection signals within the preset voltage range are input to the module to be tested, it means that there is a fault in the hardware circuit of the corresponding module. If fault information is detected after multiple voltage detection signals outside the preset voltage range are input to the module to be tested, it is determined that there is a software fault in the fault detection circuit. This is because:

[0084] If there is no hardware failure: when the voltage detection signal within the preset voltage range is input, the sampled output signal should be normal, so the hardware failure can be ruled out and the software failure can be deduced.

[0085] If the hardware is faulty: Even if the voltage detection signal is input within the preset voltage range, the sampled output signal is problematic, and it is considered that the hardware itself is faulty.

[0086] Preferably, the positioning of hardware faults and software faults is performed after the possibility of a fault in the signal acquisition sensor is eliminated.

[0087] According to an embodiment of the present application, the controller is also used to determine whether a corresponding signal acquisition sensor fails based on a signal measurement value and a signal reference value corresponding to the fault information when multiple preliminary detection results of multiple modules to be tested include at least one fault information.

[0088] Specifically, when the difference between the signal measurement value and the signal reference value is greater than a first preset threshold, it is determined that the signal acquisition sensor for collecting the response signal is not faulty; when the difference between the signal measurement value and the signal reference value is less than or equal to the first preset threshold, it is determined that the signal acquisition sensor for collecting the response signal is faulty.

[0089] Figure 2 1 is a schematic block diagram of a fault detection circuit according to the first embodiment of the present application. According to the first embodiment of the present application, the controller is a microcontroller unit (MCU) 111 having a DAC and an ADC, and the fault detection circuit further includes a selection circuit, which includes a first selector 131 and may also include a second selector 132.

[0090] The first selector 131 takes the plurality of modules to be tested as outputs and is used to send the detection signal to the corresponding module to be tested according to the first selection signal sent by the MCU 111;

[0091] The second selector 132 takes the signal measurement values ​​output by the signal acquisition sensors of the multiple modules to be tested as input, and is used to send the output voltage value of the corresponding module to be tested to the MCU111 according to the second selection signal sent by the MCU111.

[0092] In this embodiment, the first selector 131 and the second selector 132 may be a multiplexer (MUX), a relay or an optical coupler, but are not limited thereto.

[0093] It should be noted that Figure 2 The components and structure of the controller 110 shown are merely exemplary and non-limiting. The control device may also have other components and structures as required.

[0094] In a specific implementation, the detection signal is a voltage detection signal and the fault detection circuit has three detection branches, such as Figure 2 As shown, the first module to be tested 201, the second module to be tested 202, and the third module to be tested 203 are respectively arranged on the three branches, the output port of the first selector 131 is connected to the first module to be tested 201, the second module to be tested 202, and the third module to be tested 203, and the input port of the second selector 132 is respectively connected to the first voltage converter 121, the second voltage converter 122, and the third voltage converter 123. MCU111 outputs a voltage detection signal to the input port of the first selector 131 through a DAC, and the first selector 131 selects the corresponding module to be tested to output the voltage detection signal. After the module to be tested outputs a corresponding voltage response signal, the output voltage value is obtained by collecting it through a voltage sensor, and the second selector 132 outputs the output voltage value to the ADC module of MCU111. MCU111 determines whether the corresponding module to be tested has a fault according to the voltage value.

[0095] In the above implementation process, multiple detection branches in the fault detection circuit collect the output voltage signal of each module to be tested, and then input it into MCU111 through the second selector 132. MCU111 converts the electrical signal into a digital signal. Then, MCU111 determines whether a fault occurs in the module to be tested connected to the corresponding detection branch by comparing the voltage value of the collected signal with a preset reference voltage value, thereby ensuring that the fault detection circuit can accurately detect the faulty module, which not only saves the cost of the self-test equipment, but also improves the safety of the equipment.

[0096] It should be noted that the number of detection branches in the fault detection circuit can be specifically set according to actual conditions, and this embodiment does not specifically limit the number of detection branches.

[0097] It should be understood that the multiple modules to be tested may be circuit modules with the same structure or circuit modules with different structures. For example, the multiple modules with different structures may be multiple modules belonging to the same functional circuit.

[0098] Figure 3 is a schematic block diagram of an electronic device with a self-checking function according to an embodiment of the present application; Figure 3 As shown, the electronic device includes one or more modules to be tested 200 and the fault detection circuit 100 of the above embodiment.

[0099] The electronic device sends a detection signal to the module under test 200 and obtains a response signal from the module under test, and performs fault detection and fault analysis based on the signal measurement value of the response signal and a preset signal reference value, thereby being able to timely detect faults in the electronic device and accurately locate the faults.

[0100] Figure 4 is a schematic flow chart of a self-test method for an electronic device according to an embodiment of the present application, the method is applied to the electronic device with a self-test function in the above embodiment; Figure 4 A self-check method for an electronic device according to an embodiment of the present application is described.

[0101] First, in step S410, the controller inputs a detection signal to the module to be tested and obtains a signal measurement value of a response signal output by the module to be tested through a signal acquisition sensor.

[0102] Here, the detection signal and the response signal may be a voltage signal, a current signal or a light signal. Correspondingly, the signal measurement value may be a voltage value, a current value, a light intensity value, etc. Moreover, the detection signal and the response signal may be signals of the same form or signals of different forms. This application does not specifically limit the forms of the detection signal and the response signal.

[0103] In step S420, the controller generates a preliminary detection result of the module to be tested based on the signal measurement value and a preset signal reference value of the module to be tested.

[0104] Here, the signal reference value is a measured value of the output signal when the calibration signal is input to the module under test that has not failed.

[0105] In step S430, when the preliminary detection result includes the fault information of the module to be tested, the controller controls the module to be tested to perform detection, and locates the fault based on the obtained preliminary detection result.

[0106] Fault location can be used to determine whether the module under test fails and the fault location that causes the fault information. The fault information here refers to the difference between the signal measurement value of the output response signal and the preset signal reference value that is within the preset range.

[0107] By sending a detection signal to the module under test and obtaining a response signal from the module under test, fault detection and fault analysis are performed based on the signal measurement value and the preset signal reference value, so that not only faults of electronic equipment can be detected in a timely manner, but also the faults can be accurately located.

[0108] According to one embodiment of the present application, the self-test method also includes: using the fault location result obtained by fault location as the final fault detection result of the module to be tested, the fault detection result includes at least one of the following: there is no fault in the module to be tested, there is a fault in the module to be tested, fault location information when there is a fault in the module to be tested, and the fault type.

[0109] Specifically, the fault location result may include a signal acquisition sensor fault, no fault in the module under test, or a fault in the module under test. The fault type may include a hardware fault in the module under test and a software fault in the module under test.

[0110] Figure 5 The self-test method of the electronic device according to the first embodiment of the present application can be applied to the self-test process of the device when it is powered on, specifically, to the modules in the device whose operating status cannot be monitored.

[0111] See also Figure 5 As an example, in this embodiment, the specific steps of the self-checking method of the electronic device include:

[0112] In step S510, the system is powered on and reset.

[0113] Here the power-on reset generates an internal reset pulse to avoid competition and keep the device static until the power supply voltage reaches a threshold that ensures normal operation.

[0114] In step S520, it is determined whether the self-check time has been exceeded. If so, the process goes to step S590; otherwise, the process goes to step S530.

[0115] It should be noted that the time can be used as a threshold to determine whether to stop the self-check, or the number of self-checks can be used as a threshold, that is, when the number of self-checks reaches the threshold, the self-check is stopped. In this embodiment, the judgment of whether the self-check time is exceeded is only used as an example for explanation, and does not limit the conditions for whether to stop the self-check.

[0116] In step S530, a module self-check is performed.

[0117] Specific self-test methods include:

[0118] The controller inputs a detection signal to the module to be tested and obtains a signal measurement value of a response signal output by the module to be tested through a signal acquisition sensor;

[0119] The controller generates a preliminary detection result of the module to be tested based on the signal measurement value and the signal reference value preset by the module to be tested.

[0120] Here, the controller may be connected to one or more modules to be tested.

[0121] In step S540, determine whether the self-test passes, if so, go to step S580; if not, go to step S550.

[0122] In step S550, a fault analysis is performed and the fault cause is stored.

[0123] In this embodiment, when the preliminary detection result includes fault information of the module to be tested, the controller controls the module to be tested to perform multiple detections, locates the fault based on the multiple preliminary detection results obtained, and obtains the final fault detection result of the module to be tested.

[0124] Specifically, multiple preliminary detection results are obtained by respectively inputting multiple detection signals to the modules to be tested;

[0125] When multiple preliminary detection results include fault information and the measured values ​​of multiple detection signals are within a preset numerical range, it is determined that the module to be tested has a hardware fault; when multiple preliminary detection results include fault information and multiple detection signals are not within the preset numerical range, it is determined that the module to be tested has a software fault.

[0126] In step S560, report to the host computer.

[0127] Specifically, if the self-check process does not match the reference value, it means that a fault exists. The fault information is uploaded to the host computer and recorded in FALSH for next retrieval.

[0128] In step S570, a delay is performed and the process returns to step S520.

[0129] The time required for storage and reporting is used as a parameter to determine whether the detection time is too long.

[0130] In this embodiment, for a faulty module, the controller will re-circulate and test the failed modules after the detection is completed.

[0131] For example, for a device with multiple detection branches, each branch is self-checked in turn until all modules are tested. If some branches, such as branches 2 and 3, fail, branches 2 and 3 are re-tested in turn until the timeout, then the self-test is stopped, thereby eliminating false detection.

[0132] In step S580, the system starts running after the self-check passes.

[0133] In step S590, if the self-check exceeds the self-check time, it means that the self-check has failed and the machine is shut down for processing.

[0134] It can be understood that during the system power-on pre-operation period, the system power-on self-test determines that each functional module of the device is normal. The functional circuit and corresponding software algorithm of the module to be tested are known. During the power-on self-test, if there is a communication self-test module, the self-test status is uploaded through communication, and if there is no communication self-test module, the self-test is implemented through the method of this embodiment, thereby ensuring the safe and reliable operation of the entire device.

[0135] During long-term operation, equipment aging is inevitable due to drastic changes in the external environment, etc. During normal operation, when abnormal fault information is detected, that is, the occurrence of a fault is detected, the cause of the fault and the source of the fault can be determined through the following self-test process method of the electronic device of the second embodiment of the present application.

[0136] Figure 6 It is an algorithm flow chart of the self-test process of the electronic device according to the second embodiment of the present application. The self-test method of the electronic device according to the second embodiment of the present application can be used for a test scenario in which a controller is connected to multiple modules to be tested, wherein the detection signal and the response signal are both voltage signals, the signal acquisition sensor is a voltage sensor, the controller is an MCU with a DAC and an ADC inside, and the selector is a MUX multiplexer. The MUX multiplexer includes a first MUX multiplexer and a second MUX multiplexer. The MCU is connected to multiple modules to be tested through the first MUX multiplexer and the second MUX multiplexer, the first MUX multiplexer uses the multiple modules to be tested as outputs, and the second MUX multiplexer uses the output voltage values ​​of the voltage sensors of the multiple modules to be tested as inputs.

[0137] During the detection process, the MCU sends a first selection signal to the first MUX multiplexer and inputs a voltage detection signal to the module to be tested. The MCU controls the first MUX multiplexer to send the voltage detection signal to the corresponding module to be tested. The MCU sends a second selection signal to control the second MUX multiplexer to send the output voltage value of the module to be tested obtained by the corresponding voltage sensor to the MCU, thereby obtaining the output voltage value of the voltage response signal output by the module to be tested.

[0138] See also Figure 6In this embodiment, the specific steps of the self-test method of the electronic device include:

[0139] In step S610, when a fault is detected, the MCU enables the corresponding circuit module for detection.

[0140] The failure here refers to when only one of the multiple detection points fails. Due to the failure caused by line aging, the probability of multiple sensors failing at the same time is small. Therefore, when multiple paths fail at the same time, the focus is on analyzing the cause of the failure of the module under test. For the case where only one path fails, it is necessary to analyze whether it is caused by a sensor failure.

[0141] In step S620, the DAC circuit of the MCU generates a voltage detection signal of a set voltage value that can be received by the module to be detected, and the signal is transmitted to the ADC module of the MCU after being processed by the module.

[0142] In step S630, the ADC samples and acquires voltage information output by the circuit, wherein the voltage information includes an output voltage value.

[0143] In step S640, it is determined whether the ADC sampling value differs greatly from the reference value. If not, the sensor for collecting the voltage response signal fails. If so, the sensor for collecting the voltage response signal fails, which may be caused by circuit aging. Further judgment is required at this time.

[0144] For example, the output voltage value is compared with the reference voltage value, and whether the difference is large can be determined by a preset threshold.

[0145] When the difference between the output voltage value and the reference voltage value is greater than a preset threshold, the difference between the two is large;

[0146] When the difference between the voltage value determined by the voltage response signal and the reference voltage value is smaller than the preset threshold, the difference between the two is small.

[0147] In step S650, the module to be tested is further tested by a fault detection circuit to determine whether a fault is detected. If so, the process goes to step S660; if not, the process goes to step S670.

[0148] In step S660, determine whether the voltage setting value in the voltage detection signal that causes the fault is within the set value range. If so, it is determined to be a hardware circuit fault; if not, it is a software fault in the fault detection circuit; then, go to step S680.

[0149] In step S670, the set voltage value output by the DAC is adjusted to the circuit module to be detected, and then the process goes to step S620.

[0150] In step S680, the fault information is uploaded to a host computer running an electronic equipment management system or a monitoring system.

[0151] In step S690, the host computer records the fault information into FALSH for storage.

[0152] By performing self-checking by the method of this embodiment, physical modules and software modules can be checked at the same time. When the detected result deviates from the expected result, the method of this embodiment can be used to further troubleshoot sensor failure, hardware failure or software failure during operation, thereby ensuring the safe and reliable operation of the electronic device.

[0153] An embodiment of the present application also provides a vehicle, which includes the above-mentioned electronic device with self-checking function.

[0154] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present invention thereto. Various changes and modifications may be made therein by one of ordinary skill in the art without departing from the scope and spirit of the present invention. All such changes and modifications are intended to be included within the scope of the present invention as required by the appended claims.

[0155] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0156] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed.

[0157] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0158] Similarly, it should be understood that in order to streamline the present invention and help understand one or more of the various inventive aspects, in the description of the exemplary embodiments of the present invention, the various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present invention should not be interpreted as reflecting the following intention: the claimed invention requires more features than the features explicitly stated in each claim. More specifically, as reflected in the corresponding claims, the inventive point is that the corresponding technical problem can be solved with less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present invention.

[0159] It will be understood by those skilled in the art that, except for mutually exclusive features, all features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed in this specification may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature that provides the same, equivalent or similar purpose.

[0160] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the claims, any one of the claimed embodiments may be used in any combination.

[0161] The various component embodiments of the present invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. It should be understood by those skilled in the art that a microprocessor or digital signal processor (DSP) may be used in practice to implement some or all of the functions of some modules in the article analysis device according to an embodiment of the present invention. The present invention may also be implemented as a device program (e.g., a computer program and a computer program product) for executing part or all of the methods described herein. Such a program implementing the present invention may be stored on a computer-readable medium, or may be in the form of one or more signals. Such a signal may be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0162] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

[0163] The above is only a specific embodiment of the present invention or an explanation of a specific embodiment, and the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. The protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A fault detection circuit, characterized in that: The fault detection circuit (100) comprises: A signal acquisition sensor (120) for acquiring a response signal output by the module to be tested (200) to obtain a signal measurement value; A controller (110) for inputting a detection signal to the module to be tested (200), and generating a preliminary detection result of the module to be tested (200) based on the signal measurement value and a preset signal reference value of the module to be tested (200); The controller (110) is further configured to control the module to be tested (200) to perform detection when the preliminary detection result includes fault information of the module to be tested (200), and to perform fault location based on the obtained preliminary detection result.

2. The fault detection circuit according to claim 1, characterized in that: The controller (110) is further configured to use a fault location result obtained by fault location as a final fault detection result of the module to be tested (200), wherein the fault detection result comprises at least one of the following: the module to be tested (200) does not have a fault, the module to be tested (200) has a fault, fault location information when the module to be tested (200) has a fault, and the fault type.

3. The fault detection circuit according to claim 1, characterized in that: The fault detection circuit (100) further comprises a selection circuit, wherein the selection circuit comprises a first selector (131); The first selector (131) takes the plurality of modules to be tested (200) as outputs and is used to send the detection signal to the corresponding module to be tested (200) according to the first selection signal sent by the controller (110).

4. The fault detection circuit according to claim 3, characterized in that: The selection circuit also includes a second selector (132); The second selector (132) takes the signal measurement values ​​output by the signal acquisition sensors (120) of the plurality of modules to be tested (200) as input, and is used to send the signal measurement values ​​of the corresponding modules to be tested (200) to the controller (110) according to the second selection signal sent by the controller (110).

5. The fault detection circuit according to claim 1, characterized in that: The controller (110) is used to determine whether a corresponding signal acquisition sensor (120) has a fault based on a signal measurement value corresponding to the fault information and the signal reference value when multiple preliminary detection results of multiple modules to be tested (200) include at least one fault information.

6. The fault detection circuit according to claim 5, characterized in that: The controller (110) is used to determine that the signal acquisition sensor (120) that collects the response signal has not failed when the difference between the signal measurement value and the signal reference value is greater than a first preset threshold value; and to determine that the signal acquisition sensor (120) that collects the response signal has failed when the difference between the signal measurement value and the signal reference value is less than or equal to the first preset threshold value.

7. The fault detection circuit according to claim 5, characterized in that: The controller (110) is used to: When the signal acquisition sensor (120) is not faulty, a plurality of preliminary detection results are obtained by inputting a plurality of detection signals to each of the modules to be tested (200); When multiple preliminary detection results include fault information, and the signal measurement values ​​of multiple detection signals are within a preset value range, it is determined that the module to be tested (200) has a hardware fault; When the plurality of preliminary detection results include fault information and the signal measurement values ​​of the plurality of detection signals are not within the preset value range, it is determined that the module to be tested (200) has a software fault.

8. The fault detection circuit according to claim 1, characterized in that: The detection signal and the response signal are respectively one of a voltage signal, a current signal, and an optical signal.

9. An electronic device with a self-checking function, characterized in that: The electronic device comprises one or more modules to be tested (200) and a fault detection circuit (100) according to any one of claims 1 to 8.

10. A self-test method for an electronic device, characterized in that: Applied to the electronic device with self-checking function as claimed in claim 9, the self-checking method comprises: The controller inputs a detection signal to the module to be tested and obtains a signal measurement value of a response signal output by the module to be tested through a signal acquisition sensor; The controller generates a preliminary detection result of the module to be tested based on the signal measurement value and a preset signal reference value of the module to be tested; When the preliminary detection result includes the fault information of the module to be tested, the controller controls the module to be tested to perform detection, and locates the fault based on the obtained preliminary detection result.

11. The self-test method according to claim 10, characterized in that: The self-test method also includes: using the fault location result obtained by fault location as the final fault detection result of the module to be tested, and the fault detection result includes at least one of the following: there is no fault in the module to be tested, there is a fault in the module to be tested, fault location information when the module to be tested has a fault, and the fault type.

12. The self-test method according to claim 10, characterized in that: The controller is connected to a plurality of modules to be tested via a selection circuit, wherein the selection circuit includes a first selector that takes the plurality of modules to be tested as outputs; Inputting a detection signal to the module to be tested and obtaining a signal measurement value of a response signal output by the module to be tested through a signal acquisition sensor includes: The controller sends out a first selection signal and a detection signal, and controls the first selector to send the detection signal to a corresponding module to be tested.

13. The self-test method according to claim 10, characterized in that: The selection circuit also includes a second selector that takes the signal measurement values ​​of the signal acquisition sensors of the plurality of modules to be tested as input; Inputting a detection signal to the module to be tested and obtaining a signal measurement value of a response signal output by the module to be tested through a signal acquisition sensor also includes: According to the second selection signal sent by the controller, the second selector is controlled to send the signal measurement value of the module to be tested acquired by the corresponding signal acquisition sensor to the controller.

14. The self-test method according to claim 10, characterized in that: Fault location based on the preliminary detection results includes: When a plurality of preliminary detection results of a plurality of modules to be tested include a piece of fault information, the controller determines whether a corresponding signal acquisition sensor fails based on a signal measurement value corresponding to the fault information and the signal reference value.

15. The self-test method according to claim 14, characterized in that: Determining whether a fault occurs in the signal acquisition sensor acquisition based on the signal measurement value corresponding to the fault information and the signal reference value includes: When the difference between the signal measurement value and the signal reference value is greater than a first preset threshold, determining that the signal acquisition sensor that acquires the response signal is not faulty; When the difference between the voltage value determined by the response signal and the signal reference value is smaller than a first preset threshold, it is determined that a signal acquisition sensor that acquires the response signal fails.

16. The self-test method according to claim 14, characterized in that: Fault location based on the preliminary detection results also includes: When the signal acquisition sensor is not faulty, multiple preliminary detection results are obtained by inputting multiple detection signals to each of the modules to be tested; When the multiple preliminary detection results include fault information, and the multiple detection signals are within a preset value range, it is determined that the module to be tested has a hardware fault; When the plurality of preliminary detection results include fault information and the plurality of detection signals are not within the preset value range, it is determined that the module to be tested has a software fault.

17. The self-test method according to claim 10, characterized in that: The detection signal and the response signal are respectively one of a voltage signal, a current signal, and an optical signal.

18. A vehicle, characterized in that: The vehicle includes the electronic device with a self-checking function according to claim 9.

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