Heat dissipation unit of industrial personal computer

Abstract

The invention discloses a heat dissipation unit of an industrial personal computer, which relates to the technical field of industrial control system core equipment, and comprises a shielding machine body which is arranged at the top of a low-temperature control panel and is used for shielding and protecting electromagnetic interference of a storage unit and an external processing unit, under the cooperation of the dynamic array heat dissipation assembly, the dynamic air channel regulation and control assembly and the dynamic layered prediction regulation and control heat dissipation assembly, a heating part is integrally and accurately positioned, the problem of local overheating is effectively solved, an integrated heat dissipation system is integrally formed, the heat dissipation efficiency and reliability are improved, damage to a storage unit caused by heat accumulation and overheating is reduced, and the service life of the storage unit is prolonged. According to the industrial personal computer, the service life of the high-speed solid state disk and the large-capacity mechanical hard disk set is prolonged, cold air can be effectively conveyed to all heating parts of the storage unit, the heat dissipation efficiency is improved, meanwhile, the heat dissipation strategy is automatically adjusted, the adaptability is high, the intelligent degree is high, efficient heat dissipation can be achieved in different environments, and the operation performance of the whole industrial personal computer is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of cooling core equipment of industrial control systems, in particular to a heat dissipation unit for an industrial computer. Background Art

[0002] Industrial control computers are commonly used core equipment in industrial control systems. Some industrial control computers are not designed with cooling fans, but only heat sinks. The heat generated by the industrial control computers during operation cannot be dissipated in time, which will cause the equipment to operate at a high temperature. Long-term operation of industrial control computers at high temperatures will cause equipment performance degradation and shorten service life. Some industrial control computers are installed with cooling fans in the installation room, which are used to achieve internal and external airflow exchange to achieve the purpose of heat exchange.

[0003] At present, in the effective use of heat dissipation of industrial computers, the heat dissipation control of the internal storage unit is mostly processed outside the storage unit through water cooling or air cooling. However, in actual use, it is impossible to effectively form an integrated heat dissipation processing module to adjust the heat dissipation of the storage unit, resulting in the water cooling or air cooling system being unable to accurately deliver cold air or coolant to the various heating parts of the storage unit, causing frequent local overheating, and it is difficult to dynamically adjust according to the real-time heating conditions of the storage unit. When heat is generated and accumulated, it is impossible to dissipate heat in time, affecting the service life of the storage unit in the industrial computer. Therefore, it is necessary to propose a heat dissipation unit for the industrial computer. Summary of the invention

[0004] The purpose of the present invention is to provide an industrial computer heat dissipation unit to solve the problem proposed in the above background technology that in the effective use of industrial computer heat dissipation, the heat dissipation control of the internal storage unit is mostly processed by water cooling or air cooling the outside of the storage unit, but in actual use, it is impossible to effectively form an integrated heat dissipation processing module to adjust the heat dissipation of the storage unit, resulting in the water cooling or air cooling system being unable to accurately deliver cold air or coolant to the various heating parts of the storage unit, causing frequent local overheating, and it is difficult to dynamically adjust according to the real-time heating conditions of the storage unit, resulting in the inability to dissipate heat in time when heat is generated and accumulated, affecting the service life of the storage unit in the industrial computer.

[0005] To achieve the above object, the present invention provides the following technical solution: an industrial computer heat dissipation unit, comprising: A shielding body, which is installed on the top of the cryogenic control panel and is used to shield and protect the storage unit and the external processing unit from electromagnetic interference; Dynamic hierarchical prediction and control heat dissipation components are installed on the inner top wall of the low-temperature control board. When the temperature of the high-speed solid-state hard disk of the primary storage device is too high, it automatically migrates some infrequently accessed data to the large-capacity mechanical hard disk group of the secondary storage device to achieve reasonable utilization and heat dissipation of storage resources; Dynamic air duct control components are fastened to the two side surfaces of the shielding body and are connected through mounting holes and external heat dissipation holes, wherein the external heat dissipation holes are respectively opened on the surface of the shielding body, and are used to form real-time monitoring according to the prediction analysis and judgment data of the prediction control processor, and to make intelligent predictions according to historical data and the current system operation status, so as to predict the temperature increase trend of the high-speed solid-state hard disk in advance and start adjusting the heat dissipation operation before the temperature reaches the excessively high threshold; The dynamic array heat dissipation component is installed on the top wall surface of the shielding body and is used to locate and perform heat dissipation processing based on the monitoring data of the high-precision infrared temperature sensors built into the high-speed solid-state hard disk and large-capacity mechanical hard disk group.

[0006] Preferably, the dynamic array heat dissipation component includes: A longitudinal micro linear guide, a transverse micro linear guide, a micro electromagnetic guide rod, a micro-control angle adjuster and an array control board. The top surface of the longitudinal micro linear guide and the inner surface of the shielding body form a fastening connection. The transverse micro linear guide forms a sliding connection inside the bottom end of the longitudinal micro linear guide. The top of the micro electromagnetic guide rod forms a sliding connection with the bottom end of the transverse micro linear guide through a position sliding seat. The micro-control angle adjuster is installed at the bottom of the micro electromagnetic guide rod, and it drives the array control board at the bottom to form an angle micro-control operation.

[0007] Preferably, a plurality of groups of phase change material columns are equally arranged at the bottom of the array control board, and high-temperature heat-conductive transfer sheets are connected in series on the sides of the plurality of groups of phase change material columns. The side ends of the high-temperature heat-conductive transfer sheets are connected to a thermoelectric conversion control unit, one side of the thermoelectric conversion control unit is used to contact the high-temperature end of the phase change material column after absorbing heat through the high-temperature heat-conductive transfer sheet, and the other side is connected to an external heat dissipation structure to form a low-temperature end. The potential energy of the temperature difference is used to make the thermoelectric conversion control unit generate an electromotive force and supply energy to the micro servo motors on the sides of the longitudinal micro linear guide and the transverse micro linear guide.

[0008] Preferably, the dynamic hierarchical prediction and regulation heat dissipation component includes: A semiconductor heat sink support frame, an optical fiber line and a connecting line end, wherein the internal mounting groove of the semiconductor heat sink support frame is used to place a high-speed solid-state hard disk and a large-capacity mechanical hard disk group, and to form a heat dissipation treatment on the bottom surface of the high-speed solid-state hard disk and the large-capacity mechanical hard disk group, both sides of the high-speed solid-state hard disk form data transmission through the optical fiber line and the large-capacity mechanical hard disk group, and a heat-conducting aggregation plate is installed on the top surface of the high-speed solid-state hard disk, and heat-conducting aggregation points are evenly divided and evenly spaced on the surface of the heat-conducting aggregation plate.

[0009] Preferably, the dynamic air duct control component includes: The mounting frame, the horizontal side frame and the stepping push rod, the side end of the stepping push rod is fastened with a positioning sliding saddle, the positioning sliding saddle is located on the surface of the horizontal side frame to form a sliding connection, the top of the positioning sliding saddle is fastened with a vertical guide groove frame, the back surface of the vertical guide groove frame is fastened with a pneumatic guide rod, the side end of the pneumatic guide rod is fastened with a push-rotating force-bearing member, the internal sliding connection of the vertical guide groove frame is connected with a sliding seat, and the side end of the push-rotating force-bearing member is fastened with the bottom end of the sliding seat.

[0010] Preferably, a micro-controlled rotating motor adjustment box is installed inside the sliding seat, and a rotating drive adjustment column structure is installed on the surface of the micro-controlled rotating motor adjustment box. The side end of the rotating drive adjustment column structure is fastened with a stable elastic frame, and the side end of the stable elastic frame is fastened with a regulating air duct cavity. An axial flow cooling fan is installed on the inner side end of the regulating air duct cavity. The top end of the regulating air duct cavity is connected to a conical guide cavity groove, and the top end of the conical guide cavity groove is connected to a flexible connecting tube, and the side end of the flexible connecting tube is connected to the mounting channel.

[0011] Preferably, a rotating column is connected through the surface of the regulating air duct cavity, an air guide plate is installed on the outside of the rotating column, an angle rotating plate is installed on the side end of the rotating column, and an engaging slot hole and an arc slot are respectively opened on the surface of the angle rotating plate, and the engaging slot hole and the side end of the rotating column are connected.

[0012] Preferably, teeth are installed on the surface of one side of the inner wall of the arc groove, and the side end of the teeth is meshed with a rotating tooth. The side end of the rotating tooth is connected to a driving motor, and the output end of the driving motor drives the rotating tooth located on the surface of the stable elastic frame to form a fixed-point rotation, so that the meshed teeth drive the angle rotating plate to rotate, and then the embedded slot drives the rotating column and the wind guide plate to form regulation.

[0013] Preferably, a microcontroller, an alarm terminal and a data processing detector are respectively installed on the surface of the low-temperature control panel, and the microcontroller, the alarm terminal and the data processing detector are connected to the predictive control processor in sequence.

[0014] Preferably, a thermally conductive adsorption frame is installed on the left and right side ends of the shielding body, and a plurality of groups of memory metal columns are fastened to the inner wall surface of the thermally conductive adsorption frame. The side ends of the plurality of groups of memory metal columns are in contact with the outer left and right surfaces of the high-speed solid-state hard disk and the large-capacity mechanical hard disk group. The four ends of the shielding body are provided with line connection dustproof ports.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, by cooperating with the dynamic array heat dissipation component, the high-precision infrared temperature sensor monitors the temperature data of the high-speed solid-state hard disk and the large-capacity mechanical hard disk group in real time. Once the temperature area change is detected, the high-precision infrared sensor transmits the temperature data to the array control board, so that the multiple groups of phase change material columns on the array control board are in contact with the heat accumulation points of the high-speed solid-state hard disk through the movement of the micro-electromagnetic guide rod and the transverse micro-linear guide rail. The phase change material column is used to efficiently absorb the heat of the heat accumulation point. After absorbing the heat, the phase change material column transfers the heat to the thermoelectric conversion control unit through the high-temperature heat transfer sheet, and one side of the thermoelectric conversion control unit is in contact with the high-temperature heat transfer sheet to obtain The heat at the high-temperature end is connected to the external heat dissipation structure on the other side to form a low-temperature end. Through the effect of this temperature difference, an electromotive force is generated, which makes it convenient for the electromotive force generated by the thermoelectric conversion control unit to provide energy for the micro servo motors on the sides of the longitudinal micro linear guide and the transverse micro linear guide. The heating parts are accurately located as a whole, and the problem of local overheating is effectively solved. The heat dissipation strategy is adjusted in real time according to temperature changes to ensure that the heat dissipation effect is always in the best state. An integrated heat dissipation system is formed as a whole to improve the heat dissipation efficiency and reliability. The energy of the heat source is effectively recovered and utilized to reduce energy consumption, reduce heat accumulation and damage to the storage unit caused by overheating, and extend the service life of high-speed solid-state drives and large-capacity mechanical hard disk groups.

[0016] 2. In the present invention, dynamic adjustment is formed by cooperating with the dynamic air duct control component, using the stepping push rod, the positioning sliding saddle, the horizontal frame, the vertical guide groove frame, the pneumatic guide rod, the push-rotating force-bearing member, the sliding seat, the micro-control rotating motor adjustment box, the rotating drive adjustment column structure, the stable elastic frame, the rotating column, and the wind guide and drainage plate. At the same time, according to the heat dissipation requirements, the driving motor drives the rotating gear to rotate, and the rotating gear meshes with the teeth, so that the teeth drive the angle rotating plate to rotate. Through this rotation, the embedded slot hole drives the rotating column to synchronously adjust and rotate according to the angle trajectory of the arc slot, so that the angle of the wind guide and drainage plate is changed, thereby adjusting the wind direction and wind speed in the air duct, and the axial cooling fan To work, the air is blown or sucked toward the cone guide cavity groove by regulating the air duct cavity. The cold air is connected to the installation hole through a flexible connecting pipe, and the sucked air is directed to the outside, or the high-speed solid-state hard disk and large-capacity mechanical hard disk group mentioned above are cooled. During the operation of the system, according to the temperature changes of the high-speed solid-state hard disk and the large-capacity mechanical hard disk group and other related factors, the micro-control rotation motor adjustment box adjusts the rotation angle of the rotation drive adjustment column structure in real time, thereby changing the angle of the air guide plate, and realizing real-time adjustment of the wind direction and wind speed in the air duct. By accurately adjusting the wind direction and wind speed in the air duct, the cold air can be more effectively transported to various heating parts of the storage unit, thereby improving the heat dissipation efficiency.

[0017] 3. In the present invention, by using a high-precision infrared temperature sensor to monitor the temperature data of the high-speed solid-state hard disk in real time in cooperation with the dynamic hierarchical prediction and control heat dissipation component, when a large amount of data is quickly written or read, the workload of the high-speed solid-state hard disk increases, thereby causing the temperature of the high-speed solid-state hard disk to rise, the prediction control processor analyzes the temperature monitoring data and the operating status and historical data of the storage device, and migrates some infrequently accessed data from the high-speed solid-state hard disk to the large-capacity mechanical hard disk group through the optical fiber line in advance, and gathers the heat of the high-speed solid-state hard disk through the heat-collecting points on the heat-conducting collection plate on the top surface, and continuously monitors the temperature data and data transmission of the high-speed solid-state hard disk and the large-capacity mechanical hard disk group according to the temperature monitoring data and prediction analysis, and dynamically adjusts the heat dissipation parameters of the above-mentioned dynamic array heat dissipation component and the dynamic air duct control component according to the temperature change and data migration. The overall system can automatically adjust the heat dissipation strategy according to the operating status, temperature change and data migration of the high-speed solid-state hard disk and the large-capacity mechanical hard disk group, has strong adaptability and high intelligence, can achieve efficient heat dissipation in different environments, and ensure the operating performance of the overall industrial control computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the main structure of a heat dissipation unit for an industrial computer according to the present invention; Figure 2 A schematic diagram of the structure of the installation position of a heat dissipation component for dynamic hierarchical prediction and control in a heat dissipation unit of an industrial computer according to the present invention; Figure 3 This is a schematic diagram of the installation position structure of a dynamic air duct control component in a heat dissipation unit of an industrial computer according to the present invention; Figure 4 This is a schematic diagram of the structure of a main body separation in a heat dissipation unit of an industrial computer according to the present invention; Figure 5 It is a structural schematic diagram of a dynamic air duct control component in a heat dissipation unit of an industrial computer according to the present invention; Figure 6 It is a partial structural schematic diagram of a dynamic air duct control component in a heat dissipation unit of an industrial computer according to the present invention; Figure 7 It is a schematic diagram of the installation position structure of the rotating gear and the teeth in the heat dissipation unit of an industrial computer of the present invention; Figure 8 It is a structural schematic diagram of a dynamic array heat dissipation component in a heat dissipation unit of an industrial computer according to the present invention; Fig. 9 A schematic diagram of the structure of a heat dissipation component for dynamic hierarchical prediction and control in a heat dissipation unit of an industrial computer according to the present invention; Fig.10 It is a schematic diagram of a dynamic array heat dissipation component in a heat dissipation unit of an industrial computer of the present invention performing dynamic heat dissipation regulation on a dynamic layered predictive control heat dissipation component.

[0019] In the figure: 1. Shielding body; 2. External heat dissipation holes; 3. Line connection dustproof port; 4. Dynamic array heat dissipation component; 41. Longitudinal micro linear guide; 42. Horizontal micro linear guide; 43. Micro electromagnetic guide rod; 44. Micro-control angle adjuster; 45. Array control board; 46. Phase change material column; 47. High temperature heat transfer plate; 48. Thermoelectric conversion control unit; 5. Dynamic air duct control component; 51. Mounting frame; 52. Horizontal side frame; 53. Stepping push rod; 54. Positioning sliding saddle; 55. Vertical guide groove frame; 56. Pneumatic guide rod; 57. Push-rotation force bearing member; 58. Sliding seat; 59. Micro-control rotation motor adjustment box; 590. Rotation drive adjustment column structure; 591. Stable elastic frame; 592. Control Air duct cavity; 593, rotating column; 594, axial flow cooling fan; 595, cone guide cavity groove; 596, flexible connecting pipe; 597, installation channel; 598, air guide and drainage plate; 599, angle rotating plate; 510, driving motor; 511, rotating gear; 512, tooth; 513, fitting slot; 6, dynamic layered prediction and control of heat dissipation components; 61, high-speed solid-state hard disk; 62, optical fiber line; 63, large-capacity mechanical hard disk group; 64, connecting line end; 65, semiconductor heat sink support frame; 66, heat conduction collection plate; 67, heat collection point; 7, heat conduction adsorption frame; 8, memory metal column; 9, prediction control processor; 10, microcontroller; 11, alarm terminal; 12, data processing detector; 13, low-temperature control board. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Reference Figure 1 - Fig.10 Shown: An industrial computer cooling unit, comprising: The shielding body 1 is mounted on the top of the cryogenic control panel 13 and is used to shield and protect the storage unit and the external processing unit from electromagnetic interference; The dynamic hierarchical prediction and control heat dissipation component 6 is installed on the inner top wall of the low temperature control board 13, and is used to automatically migrate some infrequently accessed data to the large-capacity mechanical hard disk group 63 of the secondary storage device when the temperature of the high-speed solid-state hard disk 61 of the primary storage device is too high, so as to achieve reasonable utilization and heat dissipation of storage resources; The dynamic air duct control component 5 is fastened to the two side surfaces of the shielding body 1, and is connected to the external heat dissipation holes 2 through the installation holes 597, wherein the external heat dissipation holes 2 are respectively opened on the surface of the shielding body 1, and is used to form real-time monitoring according to the prediction analysis and judgment data of the prediction control processor 9, and to make intelligent predictions according to historical data and the current system operation status, so as to predict the temperature increase trend of the high-speed solid-state hard disk 61 in advance, and start adjusting the heat dissipation operation before the temperature reaches the excessively high threshold; The dynamic array heat dissipation component 4 is installed on the top wall surface of the shielding body 1 and is used to locate and perform heat dissipation processing based on the monitoring data of the high-precision infrared temperature sensors built into the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63.

[0022] Embodiment 1: In the present invention, according to Figure 2 - Figure 4 and Figure 8 As shown, the dynamic array heat dissipation component 4 includes: The longitudinal micro linear guide 41, the transverse micro linear guide 42, the micro electromagnetic guide rod 43, the micro control angle adjuster 44 and the array control board 45, the top surface of the longitudinal micro linear guide 41 and the inner surface of the shielding body 1 form a fastening connection, the transverse micro linear guide 42 forms a sliding connection inside the bottom end of the longitudinal micro linear guide 41, the top of the micro electromagnetic guide rod 43 forms a sliding connection with the bottom end of the transverse micro linear guide 42 through a position sliding seat, the micro control angle adjuster 44 is installed at the bottom of the micro electromagnetic guide rod 43, and it drives the array control board 45 at the bottom to form an angle fine-tuning operation.

[0023] A plurality of groups of phase change material columns 46 are equally arranged at the bottom of the array control board 45, and high-temperature heat conductive transfer sheets 47 are connected in series on the sides of the plurality of groups of phase change material columns 46. A thermoelectric conversion control unit 48 is connected to the side end of the high-temperature heat conductive transfer sheet 47. One side of the thermoelectric conversion control unit 48 is used to contact the high-temperature end of the phase change material column 46 after absorbing heat through the high-temperature heat conductive transfer sheet 47, and the other side is connected to an external heat dissipation structure to form a low-temperature end. The potential energy of the temperature difference is used to make the thermoelectric conversion control unit 48 generate an electromotive force and supply energy to the micro servo motors on the sides of the longitudinal micro linear guide 41 and the transverse micro linear guide 42.

[0024] In a specific solution, during the operation, a high-precision infrared temperature sensor monitors the temperature data of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63 in real time. Once a temperature zone change is detected, the high-precision infrared sensor transmits the temperature data to the array control board 45, so that the multiple groups of phase change material columns 46 on the array control board 45 are in contact with the heat accumulation points 67 of the high-speed solid-state hard disk 61 through the movement of the micro electromagnetic guide rods 43 and the transverse micro linear guide rails 42. The phase change material columns 46 are used to efficiently absorb the heat of the heat accumulation points 67, so that after absorbing the heat, the phase change material columns 46 The heat is transferred to the thermoelectric conversion control unit 48 through the high-temperature heat-conducting transfer sheet 47, and one side of the thermoelectric conversion control unit 48 is in contact with the high-temperature heat-conducting transfer sheet 47 to obtain the heat of the high-temperature end, and the other side is connected to the external heat dissipation structure to form a low-temperature end. Through the effect of this temperature difference, an electromotive force is generated, so that the electromotive force generated by the thermoelectric conversion control unit 48 can provide energy for the micro servo motors on the sides of the longitudinal micro linear guide 41 and the transverse micro linear guide 42, so that the micro servo motors can drive the longitudinal micro linear guide 41 and the transverse micro linear guide 42 to move after receiving the electric energy. The longitudinal micro linear guide rail 41 and the transverse micro linear guide rail 42 are driven to move, thereby adjusting the position and angle of the array control board 45. Through the above operation, the phase change material column 46 can better contact with the heat gathering point 67, further optimizing the heat dissipation effect. In the whole heat dissipation process, the high-precision infrared temperature sensor continuously monitors the temperature data of the high-speed solid state hard disk 61 and the large-capacity mechanical hard disk group 63. According to the temperature change, the micro electromagnetic guide rod 43 and the transverse micro linear guide rail 42 dynamically adjust the position of the phase change material column 46 to ensure that it maintains good contact with the heat gathering point 67, thereby adjusting the array control board 45. The position and angle of the control board 45 are controlled, and the micro-control angle regulator 44 adjusts the angle of the array control board 45 in real time according to the temperature change, ensuring that the heat dissipation effect is always in the best state, accurately positioning the heat-generating parts as a whole, effectively solving the problem of local overheating, and adjusting the heat dissipation strategy in real time according to the temperature change to ensure that the heat dissipation effect is always in the best state, and forming an integrated heat dissipation system as a whole to improve the heat dissipation efficiency and reliability, and reduce energy consumption by effectively recovering and utilizing the heat source energy, so as to reduce the damage to the storage unit caused by heat accumulation and overheating, and extend the service life of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63.

[0025] Embodiment 2: In the present invention, according to Figure 2 - Figure 4 and Fig. 9 As shown, the dynamic hierarchical prediction and control heat dissipation component 6 includes: A semiconductor heat sink support frame 65, an optical fiber line 62 and a connecting line terminal 64, the internal mounting groove of the semiconductor heat sink support frame 65 is used to place a high-speed solid-state hard disk 61 and a large-capacity mechanical hard disk group 63, and to form heat dissipation treatment on the bottom surface of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63, both sides of the high-speed solid-state hard disk 61 form data transmission through the optical fiber line 62 and the large-capacity mechanical hard disk group 63, and a heat-conducting aggregation plate 66 is installed on the top surface of the high-speed solid-state hard disk 61, and heat-conducting aggregation points 67 are evenly divided and evenly spaced on the surface of the heat-conducting aggregation plate 66.

[0026] In a specific solution, the high-speed solid-state hard disk 61 transmits data with the large-capacity mechanical hard disk group 63 through the optical fiber line 62. During the data transmission process, the semiconductor heat sink support frame 65 performs heat dissipation treatment on the bottom surface of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63. At the same time, a high-precision infrared temperature sensor is used to monitor the temperature data of the high-speed solid-state hard disk 61 in real time. When a large amount of data is quickly written or read, the workload of the high-speed solid-state hard disk 61 increases, thereby causing the temperature of the high-speed solid-state hard disk 61 to rise. The predictive control processor 9 analyzes according to the temperature monitoring data and the operating status and historical data of the storage device, and migrates some infrequently accessed data from the high-speed solid-state hard disk 61 to the large-capacity mechanical hard disk group 63 in advance through the optical fiber line 62, and gathers the heat of the high-speed solid-state hard disk 61 through the heat gathering points 67 on the heat conduction gathering plate 66 on the top surface, and continuously monitors the temperature data and data transmission of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63 according to the temperature monitoring data and predictive analysis, and dynamically adjusts the heat dissipation parameters of the above-mentioned dynamic array heat dissipation component 4 and the dynamic air duct control component 5 according to the temperature change and data migration.

[0027] Embodiment 3: In the present invention, according to Figure 2 - Figure 7 As shown, the dynamic air duct control component 5 includes: The mounting frame 51, the horizontal side frame 52 and the stepping push rod 53, the side end of the stepping push rod 53 is fastened with a positioning sliding saddle 54, the positioning sliding saddle 54 is located on the surface of the horizontal side frame 52 to form a sliding connection, the top of the positioning sliding saddle 54 is fastened with a vertical guide groove frame 55, the back surface of the vertical guide groove frame 55 is fastened with a pneumatic guide rod 56, the side end of the pneumatic guide rod 56 is fastened with a push-rotating force-bearing member 57, the internal sliding connection of the vertical guide groove frame 55 is connected with a sliding seat 58, and the side end of the push-rotating force-bearing member 57 and the bottom end of the sliding seat 58 are fastened.

[0028] A micro-controlled rotating motor adjustment box 59 is installed inside the sliding seat 58, and a rotating drive adjustment column structure 590 is installed on the surface of the micro-controlled rotating motor adjustment box 59. The side end of the rotating drive adjustment column structure 590 is fastened with a stable elastic frame 591, and the side end of the stable elastic frame 591 is fastened with a regulating air duct cavity 592. An axial flow cooling fan 594 is installed on the inner side end of the regulating air duct cavity 592. The top end of the regulating air duct cavity 592 is connected to a conical guide cavity groove 595, and the top end of the conical guide cavity groove 595 is connected to a flexible connecting tube 596. The side end of the flexible connecting tube 596 is connected to the installation channel 597.

[0029] A rotating column 593 is connected through the surface of the regulating air duct cavity 592, an air guide plate 598 is installed on the outside of the rotating column 593, an angle rotating plate 599 is installed on the side end of the rotating column 593, and a fitting slot 513 and an arc slot are respectively opened on the surface of the angle rotating plate 599, and the fitting slot 513 and the side end of the rotating column 593 are connected.

[0030] A tooth 512 is installed on the surface of one side of the inner wall of the arc groove, and the side end of the tooth 512 is meshed with a rotating tooth 511. The side end of the rotating tooth 511 is connected to a driving motor 510. The output end of the driving motor 510 drives the rotating tooth 511 located on the surface of the stable elastic frame 591 to form a fixed-point rotation, so that the meshed tooth 512 drives the angle rotating plate 599 to rotate, and then the embedded slot hole 513 drives the rotating column 593 and the wind guide plate 598 to form regulation.

[0031] In a specific scheme, when the above-mentioned high-speed solid-state hard disk 61 and large-capacity mechanical hard disk group 63 are operating, the stepping push rod 53 starts to move, and the stepping push rod 53 pushes the positioning sliding saddle 54 to slide on the surface of the horizontal frame 52, thereby driving the vertical guide groove frame 55 to move. At the same time, the pneumatic guide rod 56 pushes the push-rotation force-bearing member 57 to rotate, and the rotation force of the push-rotation force-bearing member 57 is used to apply a force from bottom to top to the sliding seat 58, so that the sliding seat 58 slides inside the vertical guide groove frame 55. Then the micro-control rotation motor adjustment box 59 starts to work, and the rotation drive adjustment column structure 590 on its surface drives the stable elastic frame 591 to rotate. The rotation of the stable elastic frame 591 causes the rotating column 593 and the wind guide plate 598 to rotate accordingly. At the same time, according to the heat dissipation requirement, the driving motor 510 drives the rotating gear 511 to rotate, and the rotating gear 511 engages with the tooth 512, so that the tooth 512 drives the angle rotating plate 599 to rotate. Through this rotation, the engaging groove The hole 513 drives the rotating column 593 to adjust and rotate synchronously according to the angle trajectory of the arc groove, so that the angle of the wind guide plate 598 is changed, thereby adjusting the wind direction and wind speed in the air duct, and the axial cooling fan 594 works, by adjusting the air duct cavity 592 to blow or suck air to the cone guide cavity groove 595, and the cold air is connected to the installation hole 597 through the flexible connecting pipe 596, and the sucked air is directed to the outside, or the above-mentioned high-speed solid-state hard disk 61 and large-capacity mechanical hard disk group 63 are heat-dissipated. During the operation of the system, according to the temperature changes of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63 and other related factors, the micro-control rotating motor adjustment box 59 adjusts the rotation angle of the rotating drive adjustment column structure 590 in real time, thereby changing the angle of the wind guide plate 598, and realizing real-time adjustment of the wind direction and wind speed in the air duct. By accurately adjusting the wind direction and wind speed in the air duct, the cold air can be more effectively transported to various heating parts of the storage unit, thereby improving the heat dissipation efficiency.

[0032] Embodiment 4: In the present invention, according to Figure 1 - Figure 4 As shown, a microcontroller 10, an alarm terminal 11 and a data processing detector 12 are respectively installed on the surface of the low-temperature control board 13, and the microcontroller 10, the alarm terminal 11, and the data processing detector 12 are connected to the predictive control processor 9 in sequence.

[0033] The left and right side ends of the shielding body 1 are installed with a heat-conducting adsorption frame 7, and the inner wall surface of the heat-conducting adsorption frame 7 is fastened with multiple groups of memory metal columns 8. The side ends of the multiple groups of memory metal columns 8 are in contact with the outer left and right surfaces of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63. The four ends of the shielding body 1 are opened with line connection dustproof ports 3.

[0034] In a specific scheme, the microcontroller 10 receives the monitoring data of the data processing detector 12 and transmits it to the predictive control processor 9, so that the predictive control processor 9 analyzes the data according to the preset algorithm and model, and determines the operating status and temperature change trend of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63. The microcontroller 10 controls the cooling system of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63 according to the analysis results of the predictive control processor 9, and adjusts the cooling strategy. When the temperature of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63 is abnormal, the alarm terminal 11 sounds an alarm, and the microcontroller 10 controls the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63 according to the instructions of the predictive control processor 9. The heat dissipation system of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63 is controlled. At the same time, the data processing detector 12 monitors the transmission data of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63 to ensure the normal operation of the data transmission of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63. The thermal adsorption frame 7 absorbs the heat generated by the side of the high-speed solid-state hard disk 61 and the large-capacity mechanical hard disk group 63 through the memory metal column 8, and the memory metal column 8 can automatically adjust the adsorption state according to the temperature change. When the temperature of the storage device rises, the memory metal column 8 absorbs heat and expands to increase the adsorption area. When the temperature of the storage device decreases, the memory metal column 8 releases heat and shrinks to reduce the adsorption area.

[0035] The wiring diagram of the high-precision infrared temperature sensor, micro-control angle adjuster 44, drive motor 510, predictive control processor 9, microcontroller 10 and data processing detector 12 in the present invention is common knowledge in the field, and its working principle is a well-known technology. The model is selected according to the actual use. Therefore, the control method and wiring layout of the high-precision infrared temperature sensor, micro-control angle adjuster 44, drive motor 510, predictive control processor 9, microcontroller 10 and data processing detector 12 will not be explained in detail.

[0036] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An industrial computer cooling unit, characterized in that: Included are: A shielding body (1) is mounted on the top of the cryogenic control panel (13) and is used to shield and protect the storage unit and the external processing unit from electromagnetic interference; A dynamic hierarchical prediction and control heat dissipation component (6) is installed on the inner top wall of the low-temperature control board (13) and is used to automatically migrate some infrequently accessed data to a large-capacity mechanical hard disk group (63) of a secondary storage device when the temperature of the high-speed solid-state hard disk (61) of the primary storage device is too high, thereby achieving reasonable utilization of storage resources and heat dissipation; A dynamic air duct control component (5) is fastened to the two side surfaces of the shielding body (1) and is connected to the external heat dissipation holes (2) through the installation holes (597), wherein the external heat dissipation holes (2) are respectively opened on the surface of the shielding body (1), and is used to form real-time monitoring according to the prediction analysis and judgment data of the prediction control processor (9), and to perform intelligent prediction according to historical data and the current system operation status, so as to predict the temperature increase trend of the high-speed solid-state hard disk (61) in advance and start adjusting the heat dissipation operation before the temperature reaches the excessively high threshold; A dynamic array heat dissipation component (4) is mounted on the top wall surface of the shielding body (1) and is used to locate and perform heat dissipation processing according to monitoring data of high-precision infrared temperature sensors built into the high-speed solid-state hard disk (61) and the large-capacity mechanical hard disk group (63).

2. The heat dissipation unit for an industrial computer according to claim 1, characterized in that: The dynamic array heat dissipation component (4) comprises: A longitudinal micro linear guide rail (41), a transverse micro linear guide rail (42), a micro electromagnetic guide rod (43), a micro-angle control regulator (44) and an array control board (45); the top surface of the longitudinal micro linear guide rail (41) is fastened to the inner surface of the shielding body (1); the transverse micro linear guide rail (42) is slidably connected to the bottom of the longitudinal micro linear guide rail (41); the top of the micro electromagnetic guide rod (43) is slidably connected to the bottom of the transverse micro linear guide rail (42) via a position sliding seat; the micro-angle control regulator (44) is mounted on the bottom of the micro electromagnetic guide rod (43) and drives the array control board (45) at the bottom to perform angle micro-control operation.

3. The heat dissipation unit for an industrial computer according to claim 2, characterized in that: A plurality of groups of phase change material columns (46) are equally spaced at the bottom of the array control board (45), and high-temperature heat transfer sheets (47) are connected in series on the sides of the plurality of groups of phase change material columns (46). The side ends of the high-temperature heat transfer sheets (47) are connected to a thermoelectric conversion control unit (48). One side of the thermoelectric conversion control unit (48) is used to contact the high-temperature end of the phase change material column (46) after absorbing heat through the high-temperature heat transfer sheet (47), and the other side is connected to an external heat dissipation structure to form a low-temperature end. The potential energy of the temperature difference is used to generate an electromotive force in the thermoelectric conversion control unit (48), and to supply energy to the micro servo motors on the sides of the longitudinal micro linear guide (41) and the transverse micro linear guide (42).

4. The heat dissipation unit for an industrial computer according to claim 1, characterized in that: The dynamic hierarchical prediction and control heat dissipation component (6) comprises: A semiconductor heat sink support frame (65), an optical fiber line (62) and a connecting line end (64); the internal mounting groove of the semiconductor heat sink support frame (65) is used to place a high-speed solid-state hard disk (61) and a large-capacity mechanical hard disk group (63), and the bottom surfaces of the high-speed solid-state hard disk (61) and the large-capacity mechanical hard disk group (63) are subjected to heat dissipation treatment; both sides of the high-speed solid-state hard disk (61) are subjected to data transmission through the optical fiber line (62) and the large-capacity mechanical hard disk group (63); a heat-conducting aggregation plate (66) is installed on the top surface of the high-speed solid-state hard disk (61); and heat-conducting aggregation points (67) are arranged at equal intervals on the surface of the heat-conducting aggregation plate (66).

5. The heat dissipation unit for an industrial computer according to claim 1, characterized in that: The dynamic air duct control component (5) comprises: A mounting frame (51), a horizontal frame (52) and a stepping push rod (53), the side end of the stepping push rod (53) is fastened to a positioning sliding saddle (54), the positioning sliding saddle (54) is located on the surface of the horizontal frame (52) to form a sliding connection, the top of the positioning sliding saddle (54) is fastened to a vertical guide groove frame (55), the back surface of the vertical guide groove frame (55) is fastened to a pneumatic guide rod (56), the side end of the pneumatic guide rod (56) is fastened to a push-rotation force-bearing member (57), the interior of the vertical guide groove frame (55) is slidably connected to a sliding seat (58), and the side end of the push-rotation force-bearing member (57) is fastened to the bottom end of the sliding seat (58).

6. The heat dissipation unit for an industrial computer according to claim 5, characterized in that: A micro-controlled rotating motor adjustment box (59) is installed inside the sliding seat (58), and a rotating drive adjustment column structure (590) is installed on the surface of the micro-controlled rotating motor adjustment box (59). The side end of the rotating drive adjustment column structure (590) is fastened with a stable elastic frame (591), and the side end of the stable elastic frame (591) is fastened with a regulating air duct cavity (592). An axial flow cooling fan (594) is installed on the inner side end of the regulating air duct cavity (592). The top end of the regulating air duct cavity (592) is connected to a cone guide cavity groove (595), and the top end of the cone guide cavity groove (595) is connected to a flexible connecting tube (596), and the side end of the flexible connecting tube (596) is connected to the installation channel (597).

7. The heat dissipation unit for an industrial computer according to claim 6, characterized in that: A rotating column (593) is connected through the surface of the regulating air duct cavity (592), an air guide plate (598) is installed on the outside of the rotating column (593), an angle rotating plate (599) is installed on the side end of the rotating column (593), and a fitting slot (513) and an arc slot are respectively opened on the surface of the angle rotating plate (599), and the fitting slot (513) and the side end of the rotating column (593) are connected.

8. The heat dissipation unit for an industrial computer according to claim 7, characterized in that: A tooth (512) is mounted on the surface of one side of the inner wall of the arc groove, and a side end of the tooth (512) is meshedly connected with a rotating tooth (511), and a driving motor (510) is connected to the side end of the rotating tooth (511), and an output end of the driving motor (510) drives the rotating tooth (511) located on the surface of the stable elastic frame (591) to form a fixed-point rotation, so that the meshed tooth (512) drives the angle rotating plate (599) to rotate, and then the embedded slot hole (513) drives the rotating column (593) and the wind guide and drainage plate (598) to form a regulation.

9. The heat dissipation unit for an industrial computer according to claim 1, characterized in that: A microcontroller (10), an alarm terminal (11) and a data processing detector (12) are respectively mounted on the surface of the low-temperature control panel (13); the microcontroller (10), the alarm terminal (11) and the data processing detector (12) are connected to the predictive control processor (9) in sequence.

10. The heat dissipation unit for an industrial computer according to claim 1, characterized in that: The left and right side ends of the shielding body (1) are provided with a heat-conducting adsorption frame (7), and the inner wall surface of the heat-conducting adsorption frame (7) is fastened with a plurality of groups of memory metal columns (8), and the side ends of the plurality of groups of memory metal columns (8) are in contact with the outer left and right surfaces of the high-speed solid-state hard disk (61) and the large-capacity mechanical hard disk group (63), and the four ends of the shielding body (1) are provided with line connection dustproof ports (3).

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