Display panel and display device

Abstract

The embodiment of the invention discloses a display panel and a display device. A substrate in the display panel comprises a first main surface, a second main surface and a side surface, wherein the first main surface and the second main surface are oppositely arranged, and the side surface is connected between the first main surface and the second main surface. The plurality of connecting parts are arranged on the first main surface. At least one connecting part comprises a first connecting branch part and a second connecting branch part which are connected, and the second connecting branch part is located on the side, close to the side surface, of the first connecting branch part. The display panel further comprises a plurality of side wires, and at least part of each side wire is arranged on the side surface. And the side wires are in lap joint with the second connecting sub-part. In the first direction, the maximum width of the first connecting subsection is different from the maximum width of the second connecting subsection. Thus, when the second connecting subsection is in lap joint with the side wires, a redundant space can be formed in the first direction, the requirement for positioning precision when the second connecting subsection and the side wires are aligned is lowered, and the yield of the display panel is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] The borderless display panel of the prior art does not have the lower step structure of the traditional display panel around the display panel due to the technical characteristics of the borderless display panel. The borderless display panel is designed with corresponding side signal lead-out pads at the lower edge for transmitting and introducing the driving signals required for all screen displays. The side signal lead-out pads should be matched with side wiring, and the signals are led to the back of the display panel through the side wiring, and the binding is realized on the back.

[0003] Currently, when the side signal lead-out pad is overlapped with the side routing line, the alignment accuracy is poor, resulting in poor electrical connection stability between the side routing line and the side signal lead-out pad. Summary of the invention

[0004] The present invention provides a display panel display device. By setting the maximum width of a first connection section different from the maximum width of a second connection section along a first direction, a redundant space can be formed in the first direction when the second connection section is overlapped with a side wiring, thereby reducing the positioning accuracy requirement when the second connection section and the side wiring are aligned, and improving the yield of the display panel.

[0005] In a first aspect, an embodiment of the present invention provides a display panel, including:

[0006] A substrate, the substrate comprising a first main surface and a second main surface arranged opposite to each other, and a side surface connected between the first main surface and the second main surface;

[0007] A plurality of connection parts are arranged on the first main surface; at least one connection part comprises a first connection sub-part and a second connection sub-part connected to each other, and the second connection sub-part is located on a side of the first connection sub-part close to the side surface;

[0008] A plurality of side routings are at least partially arranged on the side surface; the side routings overlap with the second connection section; along a first direction, a maximum width of the first connection section is different from a maximum width of the second connection section, wherein the first direction intersects with an extension direction of the side routings.

[0009] In a second aspect, an embodiment of the present invention further provides a display device, comprising the display panel provided by any embodiment of the first aspect of the present invention.

[0010] At least one connection portion in the display panel provided by the embodiment of the present invention includes a first connection portion and a second connection portion connected, wherein the second connection portion is located on a side of the first connection portion close to the side surface, and the connection portion overlaps with the side wiring through the second connection portion. Then, by setting the maximum width of the first connection portion to be different from the maximum width of the second connection portion, the maximum width of the second connection portion is increased or decreased, so that when the second connection portion overlaps with the side wiring, the change in the maximum width of the second connection portion and the side wiring form a redundant space in the first direction, and when there is a positioning error between the second connection portion and the side wiring in the first direction, due to the existence of the redundant space, the width of the actual overlapping area of ​​the second connection portion and the side wiring can still meet the connection requirements of the second connection portion and the side wiring, thereby reducing the positioning accuracy requirements of the second connection portion and the side wiring during alignment, and improving the yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0012] Figure 2 is a schematic structural diagram of another display panel provided by an embodiment of the present invention;

[0013] Figure 3 yes Figure 2 An enlarged schematic diagram of the A area in the middle;

[0014] Figure 4 yes Figure 2 Another enlarged schematic diagram of the A area in the middle;

[0015] Figure 5 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0016] Figure 6 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0017] Figure 7 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0018] Figure 8 yes Figure 7 A schematic cross-sectional view along the B-B' direction;

[0019] Fig. 9 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0020] Fig.10 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0021] Fig.11 yes Fig.10 A schematic cross-sectional view along C-C';

[0022] Fig.12 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0023] Fig.13 yes Fig.12 A schematic cross-sectional view along the middle line D-D';

[0024] Fig.14 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0025] Fig.15 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0026] Fig.16 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0027] Fig.17 yes Figure 2 Another enlarged schematic diagram of the middle A area;

[0028] Fig.18 is a structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0029] Fig.19 A schematic structural diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be fully described below in combination with the drawings in the embodiments of the present invention through specific implementation methods. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work fall within the protection scope of the present invention.

[0031] Figure 1 is a schematic diagram of the structure of a display panel provided by an embodiment of the present invention. Figure 1The display panel includes a substrate 10, the substrate 10 includes a first main surface 110 and a second main surface 120 arranged opposite to each other, and a side surface 130 connected between the first main surface 110 and the second main surface 120. The display panel also includes a plurality of connecting portions 20, the connecting portions 20 are arranged on the first main surface 110. At least one connecting portion 20 includes a first connecting sub-portion 210 and a second connecting sub-portion 220 connected to each other. The second connecting sub-portion 220 is located on a side of the first connecting sub-portion 210 close to the side surface 130. The display panel also includes a plurality of side wirings 30, at least part of which is arranged on the side surface 130. The side wirings 30 overlap with the second connecting sub-portion 220. Along a first direction X, the maximum width of the first connecting sub-portion 210 is different from the maximum width of the second connecting sub-portion 220, wherein the first direction X intersects with the extension direction of the side wirings 30.

[0032] For example, Figure 1 As shown, the display panel includes a first main surface 110, a second main surface 120 and a plurality of side surfaces 130. The first main surface 110 and the second main surface 120 are arranged opposite to each other, and the first main surface 110 and the second main surface 120 are arranged adjacent to the plurality of side surfaces 130. Among them, the first main surface 110 can be a light-emitting side surface of the display panel, that is, the first main surface 110 includes a display area, and the display area includes a plurality of light-emitting elements 140, and the display of the picture is realized by emitting light from the plurality of light-emitting elements 140. The first main surface 110 of the display panel is also provided with a plurality of signal lines 150. The signal line 150 may include at least one of a scanning signal line, a data signal line, a positive power signal line, a negative power signal line and a reset signal line. The signal line 150 is electrically connected to the light-emitting element 140, and then provides the light-emitting element 140 with various driving signals required for emitting light through the signal line 150, so as to ensure that the light-emitting element 140 works normally. The second main surface 120 of the display panel can be the back of the display panel, that is, the second main surface 120 of the display panel is the non-light-emitting side surface of the display panel. A flexible circuit board (not shown in the figure) may be provided on the second main surface 120, and the flexible circuit board may provide various types of driving signals for the signal line 150. Specifically, the first main surface 110 further includes a plurality of connecting portions 20. The connecting portion 20 may be a connecting pad, and the connecting portion 20 is located on a side of the light-emitting element 140 close to the side surface 130, that is, the connecting portion 20 is located in the first main surface 110 close to the side surface 130, so that the light-emitting element 140 in the first main surface 110 is conveniently electrically connected to one end of the side wiring 30 through the connecting portion 20, so as to realize the transmission of signals between the light-emitting element 140 and the side wiring 30. The other end of the side wiring 30 is bound to the flexible circuit board of the second main surface 120, so as to realize the transmission of signals between the flexible circuit board and the side wiring 30.

[0033] In the prior art, the width of the side routing is substantially the same as the width of the connecting pad. When the side routing and the connecting pad are aligned and overlapped, the alignment accuracy of the side routing and the connecting pad is limited, resulting in a risk of misalignment. That is, the side routing and the connecting pad are easily offset, resulting in a smaller width of the actual overlapping area between the side routing and the connecting pad, thereby increasing the contact resistance between the side routing and the connecting pad, and even causing a circuit break between the side routing and the connecting pad, resulting in poor electrical stability of the routing.

[0034] To this end, the embodiment of the present invention provides at least one connection portion 20 including an electrically connected first connection sub-portion 210 and a second connection sub-portion 220, wherein the second connection sub-portion 220 is located on a side of the first connection sub-portion 210 close to the side surface 130, and the side wiring 30 overlaps the second connection sub-portion 220, and then along the first direction X, the maximum width of the second connection sub-portion 220 is set to be different from the maximum width of the first connection sub-portion 210, so as to increase or decrease the maximum width of the second connection sub-portion. For example, along the first direction X, the maximum width of the second connection sub-portion 220 can be set to be greater than the maximum width of the first connection sub-portion 210, which is equivalent to increasing the width of the overlapped portion with the side wiring 30 on the basis of the originally uniformly arranged connection portion, so that the width of the formed second connection sub-portion 220 is greater than the width of the side wiring 30. Alternatively, along the first direction X, the maximum width of the second connection sub-portion 220 may be set smaller than the maximum width of the first connection sub-portion 210, which is equivalent to reducing the width of the overlapped portion with the side wiring 30 on the basis of the originally uniformly arranged connection portion, so that the width of the formed second connection sub-portion 220 is smaller than the width of the side wiring 30. In this way, when the second connection sub-portion 220 overlaps the side wiring 30, the change in the maximum width of the second connection sub-portion 220 (increased or decreased width) and the side wiring 30 form a redundant space in the first direction X. When there is a positioning error between the second connection division 220 and the side routing 30 in the first direction X, due to the existence of redundant space, the actual overlapping width of the second connection division 220 and the side routing 30 can still meet the connection requirements of the second connection division 220 and the side routing 30, so that the connection between the second connection division 220 and the side routing 30 can have good physical connection and electrical connection stability, and can also increase the maximum positioning error between the second connection division 220 and the side routing 30 in the first direction X, thereby reducing the positioning accuracy requirements of the manufacturing process and improving the yield of the display panel.

[0035] It should be noted that Figure 1The example in which the maximum width of the second connection section 220 is smaller than the maximum width of the first connection section 210 is used for illustration only, but this is not a limitation. In other embodiments, the maximum width of the second connection section 220 may also be greater than the maximum width of the first connection section 210, and those skilled in the art may set it as needed.

[0036] It should also be noted that the side wiring 30 overlaps with the second connection section 220, that is, along the thickness direction of the display panel, the side wiring 30 and the second connection section 220 at least partially overlap to ensure the stability of the electrical connection between the side wiring 30 and the second connection section 220.

[0037] In summary, the embodiment of the present invention increases or decreases the maximum width of the second connection section by setting the maximum width of the second connection section to be different from the maximum width of the first connection section along the first direction. In this way, when the second connection section overlaps with the side routing, the change in the maximum width of the second connection section and the side routing form a redundant space in the first direction. When there is a positioning error between the second connection section and the side routing in the first direction, due to the existence of the redundant space, the actual overlapping width of the second connection section and the side routing can still meet the connection requirements of the second connection section and the side routing, thereby reducing the contact resistance between the second connection section and the side routing, increasing the maximum positioning error between the second connection section and the side routing in the first direction, reducing the positioning accuracy requirements of the manufacturing process, and improving the yield of the display panel.

[0038] Optional, Figure 2 is a schematic diagram of the structure of another display panel provided by an embodiment of the present invention. Figure 2 , along the first direction X, the maximum width of the second connection section 220 is greater than the maximum width of the first connection section 210 .

[0039] For example, Figure 2In the illustrated embodiment, the maximum width of the second connection sub-section 220 is greater than the maximum width of the first connection sub-section 210. It can be understood that, on the basis of the original uniformly arranged connection section, the maximum width of the portion of the connection section overlapping with the side wiring 30 is increased to form the second connection sub-section 220, and the maximum width of the portion of the connection section that does not overlap with the side wiring 30 is reduced to form the first connection sub-section 210, so that the connection section 20 forms a "convex" structure that is narrow at the top and wide at the bottom. In this way, by increasing the width of the portion of the connection section 20 overlapping with the side wiring 30, the width of the formed second connection sub-section 220 is greater than the width of the side wiring 30. When the second connection sub-section 220 overlaps with the side wiring 30, the increased width of the second connection sub-section 220 and the side wiring 30 form a redundant space in the first direction X. When there is a positioning error between the second connection section 220 and the side routing 30 in the first direction X, due to the existence of redundant space, the actual overlapping width of the second connection section 220 and the side routing 30 can still meet the connection requirements between the second connection section 220 and the side routing 30, so that the connection between the second connection section 220 and the side routing 30 can have good physical connection and electrical connection stability, thereby improving the yield of the display panel.

[0040] Optional, Figure 3 yes Figure 2 An enlarged schematic diagram of area A in the middle. Figure 2 and Figure 3 The display panel further includes at least one isolation layer 40 located on one side of the substrate 10. The isolation layer 40 includes a boundary 50 close to the side surface 130. The first connection portion 210 overlaps with at least one boundary 50 along the thickness direction of the display panel.

[0041] Specifically, Figure 2 and Figure 3 As shown, the isolation layer 40 may be an insulating layer for separating different metal film layers, and the isolation layer 40 includes a boundary 50 near the side surface 130. It should be noted that when setting the isolation layer 40, the isolation layer 40 may extend along the second direction Y from the edge area of ​​the display panel where the connection portion 20 is provided to the other side of the display panel, or may extend from one side of the display panel to the edge area of ​​the display panel where the connection portion 20 is provided, wherein the second direction Y is the extension direction of the side wiring 30. The embodiment of the present invention does not limit the extension direction of the insulating layer 40, and those skilled in the art may set it as needed. It is understandable that no matter in which direction the isolation layer 40 extends, it includes the boundary 50 near the side surface 130. In other words, the boundary 50 is the boundary line of the isolation layer 40 near the connection portion 20. Among them, the boundary 50 is a dividing line used to distinguish whether the isolation layer 40 is provided. As shown in FIG. Figure 3In the illustrated embodiment, the isolation layer 40 is not provided below the boundary 50, and the isolation layer 40 is provided above the boundary 50, so that the height of the area above the boundary 50 is different from the height of the area below the boundary 50, and a step exists at this position. The first connection segment 210 overlaps with at least one boundary 50, that is, part of the first connection segment 210 is provided on the step, so that metal residue is easily left at the step position when the first connection segment 210 is etched. If the width of the first connection segment 210 at the boundary 50 is large, the distance between two adjacent first connection segments 210 is small, and it is easy to contact and conduct with the residual metal at the step position to cause a short circuit. To this end, in the embodiment of the present invention, along the first direction X, the maximum width of the first connection section 210 is set to be smaller than the maximum width of the second connection section 220, which is equivalent to reducing the maximum width of the portion of the connection section that does not overlap with the side wiring 30 on the basis of the original uniformly arranged connection section to form the first connection section 210, that is, reducing the maximum width of the first connection section 210, thereby increasing the distance between two adjacent first connection sections 210, avoiding the phenomenon that the two adjacent first connection sections 210 are connected to the residual metal at the step position and causing a short circuit, thereby further improving the yield of the display panel.

[0042] It should be noted that Figure 3 The isolation layer 40 includes one isolation layer as an example, but this is not limiting. In other embodiments, the display panel may include multiple isolation layers. Figure 4 yes Figure 2 Another enlarged schematic diagram of area A in the middle. Figure 2 and Figure 4 , the display panel further includes at least one isolation layer 40 located on one side of the substrate 10. The isolation layer 40 includes a first isolation layer 410 and a second isolation layer 420 that are stacked, and the first isolation layer 410 is located on a side of the second isolation layer 420 that is close to the substrate 10. The first isolation layer 410 includes a first boundary 510 close to the side surface 130, and the second isolation layer 420 includes a second boundary 520 close to the side surface, and the first boundary 510 is located on a side of the second boundary 520 that is close to the side surface 130. The display panel further includes a step area S1, the first boundary 510 and the second boundary 520 are arranged in the step area S1, and at least part of the first connection section 210 is arranged in the step area S1.

[0043] Specifically, Figure 4In the illustrated embodiment, at least one isolation layer 40 includes a first isolation layer 410 and a second isolation layer 420. Along the thickness direction of the display panel, the first isolation layer 410 and the second isolation layer 420 at least partially overlap, and the first isolation layer 410 is located on the side of the second isolation layer 420 close to the substrate 10. The boundary 50 includes a first boundary 510 and a second boundary 520. The first boundary 510 and the second boundary 520 are both formed by extending from the central area of ​​the display panel to the edge area of ​​the display panel. Specifically, the boundary of the first isolation layer 410 close to the side surface 130 is the first boundary 510, and the boundary of the second isolation layer 420 close to the side surface 130 is the second boundary 520. In other words, the first boundary 510 is the boundary line of the first isolation layer 410 close to the connection portion 20, and the second boundary 520 is the boundary line of the second isolation layer 420 close to the connection portion 20. The first boundary 510 is located on the side of the second boundary 520 close to the side surface 130, that is, a portion of the first isolation layer 410 is exposed between the first boundary 510 and the second boundary 520. In addition, the display panel further includes a step area S1 , and the first boundary 510 and the second boundary 520 are disposed in the step area S1 .

[0044] For example, Figure 4 In the illustrated embodiment, the area where the first boundary 510 is extended downward by a preset distance and the area where the second boundary 520 is extended upward by a preset distance is used as the step area S1. Then, along the thickness direction of the display panel, both the first boundary 510 and the second boundary 520 overlap at least partially with the first connection sub-section 210, and both the first boundary 510 and the second boundary 520 do not overlap with the second connection sub-section 220, so that at least part of the first connection sub-section 210 is arranged in the step area S1. In this way, by setting the maximum width of the first connection sub-section 210 to be smaller than the maximum width of the second connection sub-section 220, the maximum width of the first connection sub-section 210 is reduced, thereby increasing the spacing between two adjacent first connection sub-sections 210, avoiding the phenomenon that the residual metal of the two adjacent first connection sub-sections 210 and the step area S1 are connected to each other and cause a short circuit, and further improving the yield of the display panel.

[0045] It should be noted that one side of the substrate 10 may include a first metal layer, a first interlayer insulating layer, a second metal layer, a second interlayer insulating layer, a third metal layer, a third interlayer insulating layer and a fourth metal layer arranged in a stacked manner. Among them, the first isolation layer 410 may be a second interlayer insulating layer, and the second isolation layer 420 may be a third interlayer insulating layer. Specifically, the second interlayer insulating layer may be a first flat layer, and the third interlayer insulating layer may be a second flat layer. It is understandable that since both the first flat layer and the second flat layer have organic materials, in order to prevent the organic materials from flowing to the edge area of ​​the display panel and causing the inability to cut, the first flat layer and the second flat layer are set to be cut off in advance at the edge of the display panel, thereby forming a first boundary 510 and a second boundary 520.

[0046] Optionally, based on the above embodiment, continue to refer to Figure 4 The maximum distance between two adjacent second connection parts 220 is L1, where L1<10 μm. The minimum distance between two adjacent first connection parts 210 is L2, where L2>40 μm.

[0047] Specifically, Figure 4 As shown, by increasing the maximum width of the second connection sub-portion 220 in the first direction X, a redundant space between the second connection sub-portion 220 and the side wiring 30 in the first direction X is formed, thereby reducing the contact resistance between the second connection sub-portion 220 and the side wiring 30. On this basis, the embodiment of the present invention sets the maximum spacing L1 between two adjacent second connection sub-portions 220 to be less than 10 μm, so that the width of the second connection sub-portion 220 is increased sufficiently, thereby further reducing the contact resistance between the second connection sub-portion 220 and the side wiring 30. In addition, Figure 4 In the illustrated embodiment, the spacing between two adjacent first connection sections 210 is increased by reducing the maximum width of the first connection section 210 in the first direction X, thereby avoiding the phenomenon that the two adjacent first connection sections 210 are connected to the residual metal of the step area S1 and cause a short circuit. On this basis, the inventors have found that by setting the minimum spacing L2 between the two adjacent first connection sections 210 to be greater than 40 μm, it can be ensured that the spacing between the two adjacent first connection sections 210 is increased enough. In other words, the maximum width of the first connection section 210 is reduced enough, thereby further avoiding the phenomenon that the two adjacent first connection sections 210 are connected to the residual metal of the step area S1 and cause a short circuit.

[0048] Optionally, in the above embodiments, the connection portion 20 is described as a "convex" structure, but the embodiments of the present invention are not limited to this. In other embodiments, Figure 5 yes Figure 2 Another enlarged schematic diagram of area A in the middle. Figure 5 , along the direction from the first connecting section 210 to the second connecting section 220, the width of the connecting section 20 in the first direction X gradually changes. That is, the first connecting section 210 and the second connecting section 220 form a "trapezoidal" structure. Figure 5In the example, the maximum width of the second connection division 220 is greater than the maximum width of the first connection division 210, that is, a "trapezoidal" structure that is narrow at the top and wide at the bottom is used for explanation, but this is not limited to this. In other embodiments, the maximum width of the second connection division 220 can also be set to be smaller than the maximum width of the first connection division 210, that is, a "trapezoidal" structure that is wide at the top and narrow at the bottom is formed. In this way, by setting the width of the first connection division 210 and the second connection division 220 at the junction to gradually change, it is avoided that the first connection division 210 and the second connection division 220 have a large width difference at the junction and are prone to breakage.

[0049] Optional, Figure 6 yes Figure 2 Another enlarged schematic diagram of area A in the middle. Figure 6 The connection portion 20 includes a connection pad 200, and the connection pad 200 includes an i-th solder sub-layer Xi and a j-th solder sub-layer Xj that are stacked and electrically connected, and the j-th solder sub-layer Xj is located on the side of the i-th solder sub-layer Xi away from the substrate. i and j are both positive integers, and along the thickness direction of the display panel, the j-th solder sub-layer Xj covers the i-th solder sub-layer Xi.

[0050] For example, Figure 6 In the illustrated embodiment, the connection pad 200 includes three layers of solder sub-layers as an example for explanation, that is, the connection pad 200 includes a first layer of solder sub-layer X1, a second layer of solder sub-layer X2, and a third layer of solder sub-layer X3. Among them, the first layer of solder sub-layer X1 is located on the side of the second layer of solder sub-layer X2 close to the substrate, and the first layer of solder sub-layer X1 is electrically connected to the second layer of solder sub-layer X2, and then it is arranged that along the thickness direction of the display panel, the second layer of solder sub-layer X2 covers the first layer of solder sub-layer X1, that is, the area of ​​the second layer of solder sub-layer X2 is larger than the area of ​​the first layer of solder sub-layer X1, so as to avoid etching the upper layer of solder sub-layer onto the lower layer of solder sub-layer in the etching process, causing the problem of over-etching. The second layer of solder sub-layer X2 is located on the side of the third layer of solder sub-layer X3 close to the substrate, and the second layer of solder sub-layer X2 is electrically connected to the third layer of solder sub-layer X3. Similarly, along the thickness direction of the display panel, the third solder sublayer X3 covers the second solder sublayer X2, that is, the area of ​​the third solder sublayer X3 is larger than the area of ​​the second solder sublayer X2, thereby preventing over-engraving and causing damage to the lower solder sublayer.

[0051] Optionally, based on the above embodiment, continue to refer to Figure 6 The connection pad 200 includes a stacked and electrically connected multi-layer solder sublayer X. The area of ​​the multi-layer solder sublayer X gradually increases along the direction from the substrate to the connection pad 200. For example, Figure 6In the illustrated embodiment, the multi-layer solder sub-layer X includes a first solder sub-layer X1, a second solder sub-layer X2, and a third solder sub-layer X3. In the direction from the first solder sub-layer X1 to the third solder sub-layer X3, the area of ​​the multi-layer solder sub-layer X gradually increases. On the one hand, by setting the area of ​​the upper solder sub-layer X to be larger than the area of ​​the lower solder sub-layer, over-engraving is prevented to avoid damage to the lower solder sub-layer. On the other hand, the area of ​​the solder sub-layer X gradually changes, so that the area difference between two adjacent solder sub-layers X can be smaller, thereby reducing the production cost of the connecting portion 20.

[0052] Optional, Figure 7 yes Figure 2 Another enlarged schematic diagram of the A area in the middle, Figure 8 yes Figure 7 A schematic cross-sectional view along the B-B' direction. Figure 7 and Figure 8 The connection portion 20 includes a connection pad 200, which includes a plurality of stacked solder sublayers X, and two adjacent solder sublayers X are electrically connected through a connection via 60. The connection via 60 does not overlap with the first connection subpart 210 along the thickness direction of the display panel.

[0053] Specifically, Figure 8 In the illustrated embodiment, the connection pad 200 includes a first solder sublayer X1 and a second solder sublayer X2 that are stacked. The first solder sublayer X1 is located on a side of the second solder sublayer X2 that is close to the substrate 10, and the first solder sublayer X1 is electrically connected to the second solder sublayer X2 through a connecting via 60. Figure 7 The connection portion 20 further includes an electrically connected first connection sub-portion 210 and a second connection sub-portion 220. Along the thickness direction of the display panel, the second connection sub-portion 220 overlaps with the connection via 60, and the first connection sub-portion 210 does not overlap with the connection via 60. In other words, in the second connection sub-portion 220, the first solder sub-layer X1 is electrically connected to the second solder sub-layer X2 through the connection via 60, while in the first connection sub-portion 210, the connection via 60 is not provided between the first solder sub-layer X1 and the second solder sub-layer X2, thereby ensuring that the multi-layer solder sub-layer X is electrically connected, and making the setting method of the connection via 60 simple.

[0054] Optionally, based on the above implementation, continue to refer to Figure 2 and Figure 7The connection portion 20 includes a connection pad 200, and the connection pad 200 includes a multi-layer solder sub-layer X arranged in a stacked manner, and two adjacent solder sub-layers X are electrically connected through a connection via 60. The display panel also includes at least one isolation layer 40 located on one side of the substrate 10, and the isolation layer 40 includes a boundary 50 close to the side surface 130. The display panel also includes a step area S1, and at least one boundary 50 is located in the step area S1. At least part of the first connection sub-portion 210 is arranged in the step area S1, and along the thickness direction of the display panel, the connection via 60 does not overlap with the step area S1.

[0055] For example, Figure 7 In the illustrated embodiment, the boundary of the first isolation layer 410 close to the side surface 130 is the first boundary 510, and the boundary of the second isolation layer 420 close to the side surface 130 is the second boundary 520. The area where the first boundary 510 is extended downward by a preset distance and the area where the second boundary 520 is extended upward by a preset distance is referred to as the step area S1. Since at least part of the first connection section 210 is located in the step area S1, and there are film layers of different heights in the step area S1, when the connection via 60 is provided on the first connection section 210 of the step area S1, there is a problem that the preparation of the connection via 60 is difficult. To this end, the embodiment of the present invention ensures that the preparation method of the connection via 60 is simple by providing the connection via 60 not overlapping with the step area S1, that is, the connection via 60 is provided on the second connection section 220 that does not overlap with the step area S1.

[0056] Optional, Fig. 9 yes Figure 2 Another enlarged schematic diagram of the A area in the middle, see Fig. 9 The connection portion 20 includes a connection pad 200, and the connection pad 200 includes a plurality of solder sublayers X stacked in layers, and two adjacent solder sublayers X are electrically connected through a connection via 60. Along the thickness direction of the display panel, the connection via 60 at least partially overlaps with the first connection subpart 210. For example, Fig. 9 In the illustrated embodiment, the connecting pad 200 includes a first solder sub-layer X1 and a second solder sub-layer X2 which are stacked. The first solder sub-layer X1 is located on the side of the second solder sub-layer X2 close to the substrate 10, and the first solder sub-layer X1 is electrically connected to the second solder sub-layer X2 through a connecting via 60. The connecting portion 20 also includes an electrically connected first connecting sub-part 210 and a second connecting sub-part 220. Along the thickness direction of the display panel, the second connecting sub-part 220 overlaps with the connecting via 60, and the first connecting sub-part 210 overlaps with the connecting via 60, thereby ensuring that in the second connecting sub-part 220 and the first connecting sub-part 210, there are connecting vias 60 to realize the electrical connection between the first solder sub-layer X1 and the second solder sub-layer X2, reducing the contact resistance between the first solder sub-layer X1 and the second solder sub-layer X2, and ensuring that the connecting portion 20 has good performance.

[0057] Optional, Fig.10 yes Figure 2 Another enlarged schematic diagram of the A area in the middle, Fig.11 yes Fig.10 A schematic cross-sectional view of the C-C' line in FIG. Fig.10 and Fig.11 The connection pad 200 includes an m-th solder sub-layer Xm, an (m+1)-th solder sub-layer X(m+1), and an (m+2)-th solder sub-layer X(m+2) stacked in layers, where m is a positive integer. The m-th solder sub-layer Xm is electrically connected to the (m+1)-th solder sub-layer X(m+1) through a first connection via 610, and the (m+1)-th solder sub-layer X(m+1) is electrically connected to the (m+2)-th solder sub-layer X(m+2) through a second connection via 620. Along the thickness direction of the display panel, the first connection via 610 and the second connection via 620 are staggered.

[0058] For example, Fig.10 and Fig.11 In the illustrated embodiment, the connection pad 200 includes three layers of solder sub-layers for explanation, that is, the connection pad 200 includes a first layer of solder sub-layer X1, a second layer of solder sub-layer X2, and a third layer of solder sub-layer X3. Among them, the first layer of solder sub-layer X1 is located on the side of the second layer of solder sub-layer X2 close to the substrate, and the second layer of solder sub-layer X2 is located on the side of the third layer of solder sub-layer X3 close to the substrate. That is, the first layer of solder sub-layer X1 is located at the bottom layer of the multi-layer solder sub-layer, and the third layer of solder sub-layer X3 is located at the top layer of the multi-layer solder sub-layer. The first layer of solder sub-layer X1 is electrically connected to the second layer of solder sub-layer X2 through the first connection via 610. In other words, along the thickness direction of the display panel, the first layer of solder sub-layer X1 covers a plurality of first connection vias 610. The second solder sub-layer X2 is electrically connected to the third solder sub-layer X3 through the second connection vias 620. In other words, along the thickness direction of the display panel, the second solder sub-layer X2 covers a plurality of second connection vias 620. In addition, since the first connection vias 610 and the second connection vias 620 are respectively used to realize electrical connection between different film layers, the first connection vias 610 and the second connection vias 620 are staggered along the thickness direction of the display panel, thereby avoiding the problem of poor flatness of the film layer and poor electrical connection stability when the first connection vias 610 and the second connection vias 620 are arranged at the same position of different film layers.

[0059] It should be noted that, in one embodiment, Fig.12 yes Figure 2 Another enlarged schematic diagram of the A area in the middle, Fig.13 yes Fig.12 A schematic cross-sectional view of the middle section along D-D'. Fig.12 and Fig.13 In the illustrated embodiment, the connection pad 200 includes four layers of solder sub-layers as an example for explanation, that is, the connection pad 200 includes a first solder sub-layer X1, a second solder sub-layer X2, a third solder sub-layer X3, and a fourth solder sub-layer X4. Among them, the first solder sub-layer X1 is located on the side of the second solder sub-layer X2 close to the substrate 10, the second solder sub-layer X2 is located on the side of the third solder sub-layer X3 close to the substrate 10, and the third solder sub-layer X3 is located on the side of the fourth solder sub-layer X4 close to the substrate 10. That is, the first solder sub-layer X1 is located at the bottom layer of the multi-layer solder sub-layer, and the fourth solder sub-layer X4 is located at the top layer of the multi-layer solder sub-layer. It should be noted that an insulating layer is provided between two adjacent solder sub-layers, and the embodiment of the present invention realizes the electrical connection between two adjacent solder sub-layers by providing a connecting via, for example, the first solder sub-layer X1 is electrically connected to the second solder sub-layer X2 through the first connecting via 610. The second solder sub-layer X2 is electrically connected to the third solder sub-layer X3 through the second connection via 620, and the third solder sub-layer X3 is electrically connected to the fourth solder sub-layer X4 through the third connection via 630. In addition, since the first connection via 610, the second connection via 620, and the third connection via 630 are respectively used to realize electrical connection between different film layers, illustratively, along the thickness direction of the display panel, the first connection via 610 and the second connection via 620 can be staggered, and the second connection via 620 and the third connection via 630 can be staggered. Or along the thickness direction of the display panel, the first connection via 610, the second connection via 620 can be staggered, and any two of the third connection via 630 can be staggered, so as to avoid the problem of poor flatness and electrical connection stability of the film layer when the first connection via 610, the second connection via 620, and the third connection via 630 are all set at the same position of different film layers.

[0060] Optionally, based on the above embodiment, Fig.14 yes Figure 2 Another enlarged schematic diagram of area A in the middle. Fig.14 The display panel further includes a third isolation layer 430 located on a side of the connection pad 200 away from the substrate 10 . The third isolation layer 430 contacts and covers at least a portion of an edge region of the first connection portion 210 .

[0061] For example, Fig.14In the illustrated embodiment, the display panel includes a first isolation layer 410, a second isolation layer 420, and a third isolation layer 430 located on one side of the substrate 10. The connection pad 200 includes a solder sublayer X. The first isolation layer 410 is located on a side of the second isolation layer 420 close to the substrate 10. The solder sublayer X is disposed on a side of the second isolation layer 420 away from the first isolation layer 410. The third isolation layer 430 is disposed on the solder sublayer X. When at least part of the first connection subsection 210 is located in the step area S1, since the boundary line of the first connection subsection 210 overlaps with the boundary line of the first isolation layer 410 and the boundary line of the second isolation layer 420, the third isolation layer 430 may be disposed to contact and cover at least part of the edge area of ​​the first connection subsection 210, so that the third isolation layer 430 hems at least part of the edge of the first connection subsection 210. For example, the first isolation layer 410, the second isolation layer 420, and the third isolation layer 430 may be a first planarization layer, a second planarization layer, and a protective layer, respectively. In this way, the first isolation layer 410 and the second isolation layer 420 can be covered by the third isolation layer 430 and the first connection portion 210 to prevent the first isolation layer 410 and the second isolation layer 420 from leaking out, thereby improving the reliability of the display panel.

[0062] It should be noted that one side of the substrate 10 may include a first metal layer, a first interlayer insulating layer, a second metal layer, a second interlayer insulating layer, a third metal layer, a third interlayer insulating layer, a fourth metal layer, and a fourth interlayer insulating layer arranged in a stacked manner. Among them, the third isolation layer 430 may be a fourth interlayer insulating layer, and specifically, the fourth interlayer insulating layer may be a passivation layer.

[0063] Optional, Fig.15 yes Figure 2 Another enlarged schematic diagram of area A in the middle. Fig.15 The connection portion 20 includes a first metal layer 201 and a second metal layer 202 that are stacked. The first metal layer 201 is located on a side of the second metal layer 202 close to the substrate, and the first metal layer 201 is in contact and electrically connected with the second metal layer 202. Along the first direction X, the width of the first metal layer 201 is smaller than the width of the second metal layer 202. At least part of the first metal layer 201 forms a first connection sub-portion 210, and at least part of the second metal layer 202 forms a second connection sub-portion 220.

[0064] Specifically, Fig.15 As shown, the connection portion 20 includes a connection pad 200. The connection pad 200 includes a multi-layered solder sublayer X. There is a solder sublayer X including a first metal layer 201 and a second metal layer 202, the first metal layer 201 is located on a side of the second metal layer 202 close to the substrate, and the first metal layer 201 and the second metal layer 202 are directly in electrical contact. Fig.13In the illustrated embodiment, along the thickness direction of the display panel, there is an overlapping portion between the first metal layer 201 and the second metal layer 202, and the first metal layer 201 and the second metal layer 202 are in contact and electrically connected through the overlapping portion. In the first direction X, the width of the first metal layer 201 is smaller than the width of the second metal layer 202, and thus the portion of the first metal layer 201 that is staggered from the second metal layer 202 can be set as the first connection segment 210, and the second metal layer 202 can be set as the second connection segment 220, so that the width of the formed second connection segment 220 is greater than the width of the first connection segment 210, ensuring that the connection between the second connection segment 220 and the side wiring 30 can have good physical connection and electrical connection stability.

[0065] Optionally, based on the above embodiment, Fig.16 yes Figure 2 Another enlarged schematic diagram of area A in the middle. Fig.16 , the connection portion 20 includes a first connection pad 20A and a second connection pad 20B. Along the first direction X, the maximum width of the second connection sub-portion 220 in the first connection pad 20A is greater than the maximum width of the first connection sub-portion 210, and the maximum width of the second connection sub-portion 220 in the second connection pad 20B is less than the maximum width of the first connection sub-portion 210. Along the first direction X, the first connection pad 20A and the second connection pad 20B are spaced apart.

[0066] Specifically, Figure 2 and Fig.16 As shown, in the first connection pad 20A, the maximum width of the second connection sub-portion 220 in the first direction X is greater than the maximum width of the first connection sub-portion 210 in the first direction X, and thus the first connection pad 20A forms a redundant space in the first direction X when the second connection sub-portion 220 overlaps the side wiring 30 by increasing the width of the second connection sub-portion 220. In the second connection pad 20B, the maximum width of the second connection sub-portion 220 in the first direction X is less than the maximum width of the first connection sub-portion 210 in the first direction X, and thus the first connection pad 20A forms a redundant space in the first direction X when the second connection sub-portion 220 overlaps the side wiring 30 by reducing the width of the second connection sub-portion 220. Along the first direction X, the first connecting pad 20A and the second connecting pad 20B are arranged at intervals, that is, along the first direction X, the width of the second connecting section 220 in the multiple connecting pads 200 is alternately increased and decreased. In this way, the space utilization when setting the connecting pads 200 can be increased, and the setting density of the connecting part 20 is ensured.

[0067] Optional, Fig.17 yes Figure 2 Another enlarged schematic diagram of area A in the middle. Fig.17 The connecting portion 20 further includes a third connecting portion 230 located on the side of the second connecting portion 220 away from the first connecting portion 210. Along the first direction X, the width of the second connecting portion 220 is between the width of the first connecting portion 210 and the width of the third connecting portion 230. For example, Fig.17 In the illustrated embodiment, the connection portion 20 further includes a third connection portion 230. Along the direction from the first connection portion 210 to the third connection portion 230, the widths of the plurality of connection portions gradually change, i.e., the width of the second connection portion 220 is a transition width from the width of the first connection portion 210 to the width of the third connection portion 230, thereby avoiding a large width difference between the first connection portion 210 and the second connection portion 220 when the width changes, which may easily lead to breakage.

[0068] Optionally, based on the above embodiment, Fig.18 FIG. 1 is a schematic diagram of the structure of another display panel provided by an embodiment of the present invention. Fig.18 The side routing 30 includes a first side routing sub-section 310 disposed on the first main surface 110 and a second side routing sub-section 320 disposed on the side surface 130, and the first side routing sub-section 310 is electrically connected to the second side routing sub-section 320. The first side routing sub-section 310 overlaps the second connection sub-section 220, and the line width of the first side routing sub-section 310 is smaller than the line width of the second side routing sub-section 320.

[0069] Specifically, Fig.18 As shown, the side routing 30 is overlapped with the second connection division 220 through the first side routing division 310 located on the first main surface 110. Furthermore, by setting the line width of the first side routing division 310 to be smaller than the line width of the second side routing division 320, the line width of the first side routing division 310 is reduced. In this way, when the second connection division 220 overlaps with the first side routing division 310, the reduced width of the first side routing division 310 and the second connection division 220 form a redundant space in the first direction X, further increasing the maximum positioning error of the second connection division 220 and the first side routing division 310 in the first direction X, reducing the demand for positioning accuracy in the manufacturing process, and improving the yield of the display panel.

[0070] It should be noted that Fig.18The example in which the line width of the first side routing section 310 is smaller than the line width of the second side routing section 320 is used for explanation, but the present invention is not limited to this. In other embodiments, the line width of the first side routing section 310 can also be set to be larger than the line width of the second side routing section 320 to increase the line width of the first side routing section 310. In this way, the increased width of the first side routing section 310 and the second connecting section 220 form a redundant space in the first direction X, further increasing the maximum positioning error of the second connecting section 220 and the first side routing section 310 in the first direction X, reducing the demand for positioning accuracy in the manufacturing process, and improving the yield of the display panel.

[0071] Based on the same inventive concept, an embodiment of the present invention further provides a display device. Fig.19 FIG. 1 is a schematic diagram of a display device provided by an embodiment of the present invention. Fig.19 As shown, the display device includes the display panel 01 in the above embodiment. The display device includes the display panel 01 of any embodiment of the present invention. Therefore, the display device provided by the embodiment of the present invention has the corresponding beneficial effects of the display panel 01 provided by the embodiment of the present invention, which will not be repeated here. Exemplarily, the display device can be an electronic device such as a mobile phone, a computer, a smart wearable device (for example, a smart watch), and a vehicle-mounted display device, which is not limited in the embodiment of the present invention.

[0072] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: include: A substrate, the substrate comprising a first main surface and a second main surface arranged opposite to each other, and a side surface connected between the first main surface and the second main surface; A plurality of connection parts are arranged on the first main surface; at least one connection part comprises a first connection sub-part and a second connection sub-part connected to each other, and the second connection sub-part is located on a side of the first connection sub-part close to the side surface; a plurality of side routing lines, at least partially disposed on the side surface; The side wiring is overlapped with the second connection section; Along a first direction, a maximum width of the first connection section is different from a maximum width of the second connection section, wherein the first direction intersects with an extension direction of the side routing line.

2. The display panel according to claim 1, characterized in that: Along the first direction, a maximum width of the second connection section is greater than a maximum width of the first connection section.

3. The display panel according to claim 2, characterized in that: The display panel further comprises at least one isolation layer located on one side of the substrate; The isolation layer includes a boundary near the side surface; Along a thickness direction of the display panel, the first connection section overlaps with at least one of the boundaries.

4. The display panel according to claim 2, characterized in that: The display panel further comprises at least one isolation layer located on one side of the substrate; The isolation layer comprises a first isolation layer and a second isolation layer which are stacked, wherein the first isolation layer is located on a side of the second isolation layer close to the substrate; The first isolation layer includes a first boundary close to the side surface, the second isolation layer includes a second boundary close to the side surface, and the first boundary is located on a side of the second boundary close to the side surface; The display panel further includes a step area, the first boundary and the second boundary are arranged in the step area; and at least a portion of the first connection section is arranged in the step area.

5. The display panel according to claim 1, characterized in that: The connecting portion includes a connecting pad, and the connecting pad includes an i-th solder sublayer and a j-th solder sublayer that are stacked and electrically connected, and the j-th solder sublayer is located on a side of the i-th solder sublayer away from the substrate; i and j are both positive integers; along the thickness direction of the display panel, the j-th solder sublayer covers the i-th solder sublayer.

6. The display panel according to claim 5, characterized in that: The connecting pads include a plurality of layers of pads that are stacked and electrically connected; Along the direction from the substrate to the connecting pad, the areas of the multiple layers of the connecting pad gradually increase.

7. The display panel according to claim 1, characterized in that: The connecting portion includes a connecting pad, and the connecting pad includes a plurality of stacked solder sub-layers, and two adjacent solder sub-layers are electrically connected through a connecting via; Along a thickness direction of the display panel, the connection via hole does not overlap with the first connection portion.

8. The display panel according to claim 1, characterized in that: The connecting portion includes a connecting pad, and the connecting pad includes a plurality of stacked solder sub-layers, and two adjacent solder sub-layers are electrically connected through a connecting via; The display panel further comprises at least one isolation layer located on one side of the substrate; The isolation layer includes a boundary near the side surface; The display panel further comprises a step region, and at least one of the boundaries is located in the step region; At least part of the first connecting section is disposed in the step area; Along the thickness direction of the display panel, the connecting via hole does not overlap with the step area.

9. The display panel according to claim 1, characterized in that: The connecting portion includes a connecting pad, and the connecting pad includes a plurality of stacked solder sub-layers, and two adjacent solder sub-layers are electrically connected through a connecting via; Along a thickness direction of the display panel, the connection via hole at least partially overlaps with the first connection portion.

10. The display panel according to claim 7 or 8, characterized in that: The connecting pads include an m-th solder sub-layer, an (m+1)-th solder sub-layer and an (m+2)-th solder sub-layer which are stacked, where m is a positive integer; The m-th solder sub-layer is electrically connected to the (m+1)-th solder sub-layer through a first connection via, and the (m+1)-th solder sub-layer is electrically connected to the (m+2)-th solder sub-layer through a second connection via; Along the thickness direction of the display panel, the first connection via hole and the second connection via hole are staggered.

11. The display panel according to claim 1, characterized in that: The display panel further comprises a third isolation layer located on a side of the connection pad away from the substrate; The third isolation layer contacts and covers at least a portion of an edge region of the first connection portion.

12. The display panel according to claim 2, characterized in that: The side routing includes a first side routing section arranged on the first main surface and a second side routing section arranged on the side surface, and the first side routing section is electrically connected to the second side routing section; The first side routing section overlaps the second connection section, and a line width of the first side routing section is smaller than a line width of the second side routing section.

13. The display panel according to claim 2, characterized in that: The maximum distance between two adjacent second connecting portions is less than 10 μm.

14. The display panel according to claim 2, characterized in that: The minimum distance between two adjacent first connecting sections is greater than 40 μm.

15. The display panel according to claim 1, characterized in that: The connecting portion includes a first metal layer and a second metal layer which are stacked; The first metal layer is located on a side of the second metal layer close to the substrate, and the first metal layer is in contact and electrically connected with the second metal layer; Along the first direction, the width of the first metal layer is smaller than the width of the second metal layer; At least a portion of the first metal layer forms the first connection portion, and at least a portion of the second metal layer forms the second connection portion.

16. The display panel according to claim 1, characterized in that: Along the direction from the first connecting portion to the second connecting portion, the width of the connecting portion in the first direction gradually changes.

17. The display panel according to claim 1, characterized in that: The connecting portion includes a first connecting pad and a second connecting pad; along the first direction, the maximum width of the second connecting sub-portion in the first connecting pad is greater than the maximum width of the first connecting sub-portion, and the maximum width of the second connecting sub-portion in the second connecting pad is less than the maximum width of the first connecting sub-portion; Along the first direction, the first connecting pad and the second connecting pad are arranged at intervals.

18. The display panel according to claim 1, characterized in that: The connecting portion further comprises a third connecting section located on a side of the second connecting section away from the first connecting section; Along the first direction, the width of the second connection section is between the width of the first connection section and the width of the third connection section.

19. A display device, characterized in that: A display panel comprising any one of claims 1-18.

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