Heat dissipation structure of capacitor

Abstract

The invention discloses a heat dissipation structure of a capacitor, and relates to the technical field of capacitors, the heat dissipation structure comprises a capacitor main body, the upper end of the capacitor main body is movably connected with a top cover, the outer wall of the capacitor main body is movably sleeved with a heat dissipation assembly, and the outer wall of the heat dissipation assembly is sleeved with a fixing assembly; the heat dissipation assembly comprises a first heat conduction plate, and multiple sets of heat dissipation holes are formed in the outer surface of the first heat conduction plate. And one end of the first heat conducting plate is fixedly connected with a first T-shaped block. Heat dissipation is performed on the capacitor through the heat dissipation holes and the heat dissipation fins, the heat dissipation effect of the heat dissipation assembly is improved, the first heat conduction plate and the second heat conduction plate are clamped through the T-shaped grooves and the T-shaped blocks, the heat dissipation assembly is fixed to the capacitor body through the fixing assembly, and therefore the capacitor is cooled, operation is easy, use is convenient and fast, and the heat dissipation effect is improved. Capacitors in various states can be installed, so that the capacitors are cooled, and the flexibility is high.

Description

Technical Field

[0001] The invention relates to the technical field of capacitors, and in particular to a heat dissipation structure of a capacitor. Background Art

[0002] A capacitor consists of two conductors close to each other and a non-conductive insulating medium sandwiched between them. When a voltage is applied between the two plates of the capacitor, it can store charge. The capacitance of a capacitor is numerically the ratio of the charge on one conductive plate to the voltage between the two plates.

[0003] However, the existing capacitor heat dissipation structure has obvious shortcomings. Its installation and disassembly are relatively cumbersome. The heat dissipation structure needs to be fixed to the capacitor before the capacitor can be used. After the capacitor is installed on the circuit board, the heat dissipation structure can no longer be installed on the capacitor. The overall flexibility is poor and the applicability is low.

[0004] The existing patent (Announcement No.: CN216412881U) is a low-voltage filter capacitor with a high heat dissipation structure. By using parts such as a heat dissipation sleeve, an annular sleeve, and a condenser, the capacitor body is cooled to prevent the capacitor body from being overheated after long-term use, thereby causing damage to the capacitor and affecting the service life of the capacitor.

[0005] However, the above technology still has certain defects. There are many problems when using the existing heat dissipation structure. First, the heat dissipation structure and the capacitor must be completely fixed before the capacitor can be used. Once the capacitor has been put into use, the heat dissipation device can no longer be installed and used, and the capacitor cannot be effectively cooled, which will cause the temperature of the capacitor to continue to rise during operation. Due to the excessively high temperature, the capacitor is easily damaged and then fails, seriously affecting normal operation. In addition, the adaptability of this heat dissipation structure is low, and it cannot flexibly meet the heat dissipation needs of the capacitor in different usage scenarios. Summary of the invention

[0006] Based on this, an object of the present invention is to provide a heat dissipation structure of a capacitor to solve the technical problem of heat dissipation of the capacitor proposed in the above background.

[0007] To achieve the above object, the present invention provides the following technical solution: a heat dissipation structure of a capacitor, comprising a capacitor body, the upper end of the capacitor body is movably connected to a top cover, the outer wall of the capacitor body is movably sleeved with a heat dissipation component, and the outer wall of the heat dissipation component is sleeved with a fixing component;

[0008] The heat dissipation assembly includes a first heat conducting plate, and a plurality of heat dissipation holes are provided on the outer surface of the first heat conducting plate; a first T-shaped block is fixedly connected to one end of the first heat conducting plate, and a first T-shaped slot is provided on the other end of the first heat conducting plate; a second heat conducting plate is provided on one side of the first heat conducting plate, and a plurality of heat dissipation fins are fixedly provided on the outer surface of the second heat conducting plate, a second T-shaped block is fixed to one end of the second heat conducting plate, and a second T-shaped slot is provided on the other end of the second heat conducting plate, and two groups of slots are provided on the lower end surfaces of the first heat conducting plate and the second heat conducting plate;

[0009] The fixing assembly comprises a fixing ring, two groups of clamping blocks are fixed on the inner wall of the fixing ring, and a spring is fixed on the lower surface of the fixing ring.

[0010] As a preferred technical solution of the heat dissipation structure of a capacitor of the present invention, the capacitor body includes a capacitor, an electrical pin is fixed to the upper end of the capacitor, a rotating disk is fixedly connected to the bottom end of the capacitor, and a connecting block is fixed to the top end of the capacitor.

[0011] As a preferred technical solution of a heat dissipation structure of a capacitor of the present invention, the top cover includes a connecting groove, and the width of the top cover is the same as the width of the first heat conducting plate and the second heat conducting plate.

[0012] As a preferred technical solution of the heat dissipation structure of a capacitor of the present invention, the bottom end of the spring is fixedly connected to the upper surface of the rotating disk.

[0013] As a preferred technical solution for the heat dissipation structure of a capacitor of the present invention, the first T-shaped block and the second T-shaped slot are clamped together, the first T-shaped slot and the second T-shaped block are clamped together, and the inner walls of the first heat conducting plate and the second heat conducting plate are tightly attached to the outer wall of the first heat conducting plate.

[0014] As a preferred technical solution of the heat dissipation structure of a capacitor of the present invention, the two groups of card blocks are card-engaged with the card slots.

[0015] As a preferred technical solution of the heat dissipation structure of a capacitor of the present invention, the connection groove and the connection block are connected by threads.

[0016] In summary, the present invention mainly has the following beneficial effects:

[0017] The present invention fans the heat of the capacitor through the heat dissipation holes and the heat dissipation fins, thereby improving the heat dissipation effect of the heat dissipation component. The first heat conduction plate and the second heat conduction plate are clamped together by the T-shaped groove and the T-shaped block, and the heat dissipation component is fixed to the capacitor body through the fixing component, thereby cooling the capacitor. The operation is simple and the use is convenient. The capacitor in various states can be installed to dissipate the heat of the capacitor, and the flexibility is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a schematic diagram of the overall structure of the present invention in use;

[0020] Figure 3 It is a schematic diagram of the overall structure of the heat dissipation assembly of the present invention;

[0021] Figure 4 A detailed disassembly diagram of the heat dissipation component and some fixing components of the present invention;

[0022] Figure 5 It is a side view schematic diagram of the present invention.

[0023] In the figure: 100, capacitor body; 200, top cover; 300, heat dissipation assembly; 400, fixing assembly; 110, capacitor; 120, electrical pin; 130, rotating disk; 140, connecting block;

[0024] 210, connection slot;

[0025] 310, first heat conducting plate; 311, first T-shaped block; 312, first T-shaped slot; 320, heat dissipation hole; 330, second heat conducting plate; 331, second T-shaped block; 332, second T-shaped slot; 340, heat dissipation fin; 350, card slot;

[0026] 410, fixing ring; 420, clamping block; 430, spring. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0028] The following describes an embodiment of the present invention based on its overall structure.

[0029] A capacitor heat dissipation structure anti-theft fire extinguisher storage box, such as Figure 1-5 As shown, it includes a capacitor body 100, the upper end of the capacitor body 100 is movably connected to a top cover 200, the outer wall of the capacitor body 100 is movably sleeved with a heat dissipation component 300, and the outer wall of the heat dissipation component 300 is sleeved with a fixing component 400;

[0030] The heat dissipation assembly 300 includes a first heat conducting plate 310, and a plurality of heat dissipation holes 320 are provided on the outer surface of the first heat conducting plate 310; a first T-shaped block 311 is fixedly connected to one end of the first heat conducting plate 310, and a first T-shaped slot 312 is provided on the other end of the first heat conducting plate 310; a second heat conducting plate 330 is provided on one side of the first heat conducting plate 310, and a plurality of heat dissipation fins 340 are fixedly provided on the outer surface of the second heat conducting plate 330; a second T-shaped block 331 is fixed to one end of the second heat conducting plate 330, and a second T-shaped slot 332 is provided on the other end of the second heat conducting plate 330; and two groups of slots 350 are provided on the lower end surfaces of the first heat conducting plate 310 and the second heat conducting plate 330;

[0031] The fixing assembly 400 includes a fixing ring 410 , two groups of clamping blocks 420 are fixed to the inner wall of the fixing ring 410 , and a spring 430 is fixed to the lower surface of the fixing ring 410 .

[0032] The staff first inserts the first heat conducting plate 310 into the fixing ring 410, and then slides the second heat conducting plate 330 into the second T-slot 332 through the first T-shaped block 311, slides the second T-shaped block 331 into the first T-slot 312, connects the first heat conducting plate 310 with the second heat conducting plate 330, moves the fixing ring 410 upward, and then rotates the fixing ring 410. The fixing ring 410 drives the rotating disk 130 to rotate synchronously through the spring 430, and inserts the clamping block 420 into the clamping slot 350, thereby fixing the capacitor 110 and the heat dissipation component 300, and then connects the connecting slot 210 to the connecting block 140 through bolts, clamps the heat dissipation component 300, and further fixes it.

[0033] Please refer to Figure 1 , Figure 2 , Figure 5 The capacitor body 100 includes a capacitor 110 , an electrical pin 120 is fixed to the upper end of the capacitor 110 , a rotating disk 130 is fixedly connected to the bottom end of the capacitor 110 , and a connecting block 140 is fixed to the top end of the capacitor 110 .

[0034] The capacitor 110 is connected to the top cover 200 via the connecting block 140 , and then the heat dissipation assembly 300 is limited.

[0035] Please refer to Figure 1 , Figure 2 , Figure 5 The top cover 200 includes a connecting groove 210 , and the width of the top cover 200 is the same as the width of the first heat conducting plate 310 and the second heat conducting plate 330 .

[0036] The capacitor 110 is connected to the top cover 200 by bolts, and the heat dissipation assembly 300 is limited by the top cover 200 .

[0037] Please refer to Figure 2 and Figure 5 The bottom end of the spring 430 is fixedly connected to the upper surface of the rotating disk 130 .

[0038] The spring 430 is driven to move by the fixing ring 410 , and the spring 430 drives the rotating disk 130 to move.

[0039] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 The first T-shaped block 311 and the second T-shaped groove 332 are mutually engaged, the first T-shaped groove 312 and the second T-shaped block 331 are mutually engaged, and the inner walls of the first heat conducting plate 310 and the second heat conducting plate 330 are tightly attached to the outer wall of the first heat conducting plate 310 .

[0040] The first heat conducting plate 310 is connected to the second heat conducting plate 330 by sliding the first T-shaped block 311 into the second T-shaped slot 332 and sliding the second T-shaped block 331 into the first T-shaped slot 312 .

[0041] Please refer to Figure 2 , Figure 4 , Figure 5 , the two groups of card blocks 420 are engaged with the card slots 350 .

[0042] The clamping block 420 is clamped into the inside of the clamping slot 350 , and the heat dissipation assembly 300 is fixed by the fixing assembly 400 .

[0043] Please refer to Figure 1 , Figure 2 , Figure 5 , the connecting groove 210 is connected to the connecting block 140 by threads.

[0044] When in use, first insert the first heat conducting plate 310 into the fixing ring 410, then slide and snap the second heat conducting plate 330 into the second T-slot 332 through the first T-shaped block 311, slide and snap the second T-shaped block 331 into the first T-slot 312, connect the first heat conducting plate 310 with the second heat conducting plate 330, move the fixing ring 410 upward, and then rotate the fixing ring 410. The fixing ring 410 drives the rotating disk 130 to rotate synchronously through the spring 430, and snaps the clamping block 420 into the clamping slot 350, thereby fixing the capacitor 110 and the heat dissipation component 300, and then connects the connecting slot 210 to the connecting block 140 through bolts, clamps the heat dissipation component 300, and further fixes it.

[0045] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A heat dissipation structure of a capacitor, comprising a capacitor body (100), characterized in that: The upper end of the capacitor body (100) is movably connected to a top cover (200), the outer wall of the capacitor body (100) is movably sleeved with a heat dissipation component (300), and the outer wall of the heat dissipation component (300) is sleeved with a fixing component (400); The heat dissipation component (300) comprises a first heat conducting plate (310), wherein the outer surface of the first heat conducting plate (310) is provided with a plurality of heat dissipation holes (320); one end of the first heat conducting plate (310) is fixedly connected with a first T-shaped block (311), and the other end of the first heat conducting plate (310) is provided with a first T-shaped slot (312); a second heat conducting plate (330) is provided on one side of the first heat conducting plate (310), and the outer surface of the second heat conducting plate (330) is fixedly provided with a plurality of heat dissipation fins (340); a second T-shaped block (331) is fixedly provided at one end of the second heat conducting plate (330), and a second T-shaped slot (332) is provided at the other end of the second heat conducting plate (330); and two groups of slots (350) are provided on the lower end surfaces of the first heat conducting plate (310) and the second heat conducting plate (330); The fixing assembly (400) comprises a fixing ring (410), two groups of clamping blocks (420) are fixed on the inner wall of the fixing ring (410), and a spring (430) is fixed on the lower surface of the fixing ring (410).

2. A heat dissipation structure for a capacitor according to claim 1, characterized in that: The capacitor body (100) comprises a capacitor (110), an electric pin (120) is fixed to the upper end of the capacitor (110), a rotating disk (130) is fixedly connected to the bottom end of the capacitor (110), and a connecting block (140) is fixed to the top end of the capacitor (110).

3. The heat dissipation structure of a capacitor according to claim 1, characterized in that: The top cover (200) comprises a connection groove (210), and the width of the top cover (200) is the same as the width of the first heat conducting plate (310) and the second heat conducting plate (330).

4. The heat dissipation structure of a capacitor according to claim 2, characterized in that: The bottom end of the spring (430) is fixedly connected to the upper surface of the rotating disk (130).

5. The heat dissipation structure of a capacitor according to claim 1, characterized in that: The first T-shaped block (311) and the second T-shaped groove (332) are mutually clamped, the first T-shaped groove (312) and the second T-shaped block (331) are mutually clamped, and the inner walls of the first heat conducting plate (310) and the second heat conducting plate (330) are tightly fitted to the outer wall of the first heat conducting plate (310).

6. The heat dissipation structure of a capacitor according to claim 1, characterized in that: The two groups of the card blocks (420) are card-engaged with the card slots (350).

7. The heat dissipation structure of a capacitor according to claim 3, characterized in that: The connection groove (210) is connected to the connection block (140) via threads.

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