Substrate conveying device and conveying method applied to semiconductor processing

Abstract

The invention discloses a substrate conveying device and method applied to semiconductor processing, relates to the field of semiconductor part conveying, and solves the problems that an organic substrate is inconvenient to transport and is inconvenient to be directly processed into a semiconductor substrate in the transportation process. According to the substrate conveying device applied to semiconductor processing and the conveying method, a substrate processing table top is included, a substrate conveying structure is installed on one side of the top end of the organic substrate roller shaft substrate processing table top, the substrate conveying structure conveys a substrate, and the organic substrate roller shaft substrate conveying structure comprises an H-shaped transmission gear; the H-shaped transmission gears are installed in the middle of the top end of the substrate processing table top, the number of the H-shaped transmission gears of the organic substrate roll shaft is two, and a semiconductor substrate cutting assembly is installed in the middle of the two H-shaped transmission gears; according to the invention, the glass fiber substrate is conveyed through the organic substrate roll shaft, and the embedded grooves in the organic substrate grouping supporting plate adsorb and cut into the glass fiber substrate with the size of a semiconductor chip in a groove clamping and static mode.

Description

Technical Field

[0001] The invention relates to the field of semiconductor parts conveying, and in particular to a substrate conveying device and a conveying method used in semiconductor processing. Background Art

[0002] Substrates are the basic materials for manufacturing printed circuit boards. Usually, substrates are copper foil laminates. They have three functions: conductivity, insulation, and support. According to the different materials, substrates can be divided into organic substrates and inorganic substrates. Organic substrates include glass fiber composites, paper bases, glass fibers, and polyimide. Organic substrates are elastic and soft. Inorganic substrates include aluminum substrates, ceramic substrates, various metal plates, and porcelain substrates. Inorganic substrates are harder and have their own support.

[0003] The conveying method is a process of conveying a substrate from a first position to a second position, which generally involves using an arm body and a support mechanism mounted on the arm body to support the substrate and electronic parts, and positioning the substrate by moving the arm body.

[0004] Comparative Document 1: The existing Chinese patent with publication number CN110729215B discloses a substrate conveying device and a substrate conveying method. The present invention provides a substrate conveying device and a conveying method for conveying multiple substrates at a time with higher conveying reliability. The substrate conveying device includes: a base; a holding portion; at least three detection portions; and a control portion. The holding portion is arranged in a manner that it can move forward and backward freely relative to the base and can hold multiple substrates in multiple layers. The detection portion is used to detect the outer edge of the substrate held by the holding portion at different positions. The control portion infers the position of the substrate based on the detection result of the detection portion, and calculates the deviation between the inferred position of the substrate and a predetermined reference position. When it is judged that the calculated deviation is within a threshold value, the multiple substrates held by the holding portion are conveyed.

[0005] However, the substrate conveying device and conveying method used in semiconductor processing still have the following defects:

[0006] 1. In actual use, organic substrates such as glass fiber substrates are relatively soft and have poor transportation effects. In addition, because the semiconductor material is small in size, the area of ​​the glass fiber substrate material used is also small, so the glass fiber substrate material is easy to fall during transportation and is easily affected by the external environment. In addition, due to the small size of the glass fiber substrate material, too much glass fiber substrate material cannot be transported at one time. When transporting multiple substrates, the glass fiber substrate material will be wrinkled during the transportation process.

[0007] 2. In addition, the glass fiber substrate cannot be cut in batches according to the shape of the semiconductor material when in use, the manual cutting method has a poor automation effect, and the substrate support cannot be released in time when it reaches the unloading point during the transportation process, that is, it cannot be unloaded automatically, and the driving mechanism and the adsorption state cannot be freely switched according to different substrate materials, thereby selectively controlling the working state of the supporting components. Summary of the invention

[0008] The object of the present invention is to provide a substrate conveying device and a conveying method for semiconductor processing to solve the problems raised in the above background technology.

[0009] The technical solution of the present invention is: a substrate conveying device used for semiconductor processing, comprising a substrate processing table, a substrate conveying structure is installed on one side of the top of the substrate processing table, and the substrate conveying structure conveys the substrate, the substrate conveying structure comprises an H-shaped transmission gear, and the H-shaped transmission gear is installed in the middle position of the top of the substrate processing table, and

[0010] The H-shaped transmission gears are provided with two groups, and a semiconductor substrate cutting assembly is installed at the middle position of the two groups of H-shaped transmission gears. The semiconductor substrate cutting assembly includes an organic substrate grouping support plate and a material receiving frame. A cutting pressure plate is provided at the top of the organic substrate grouping support plate, and the glass fiber substrate material passes through the bottom of the cutting pressure plate. The cutting pressure plate cuts the glass fiber substrate material, and the organic substrate grouping support plate is assembled with a semiconductor substrate.

[0011] Furthermore, the substrate conveying structure also includes a support frame, and the support frame is installed on the top of the substrate processing table, and

[0012] An organic substrate roller is installed on one side of the support frame, and there are two groups of organic substrate rollers, one group of which is filled with materials, and the other group of organic substrate rollers is empty, and the glass fiber substrate material is transported between the two groups of organic substrate rollers, and an extension roller is provided at the bottom end of the organic substrate roller, and the extension roller is installed on one side of the support frame,

[0013] A third motor is installed on one side of the top of the substrate processing table, and the third motor is provided with two groups, the two groups of third motors rotate in the same direction, the output end of the third motor is connected to the first gear, and one end of the first gear is connected to the first spur gear, one end of the first spur gear is in contact with a meshing track, and the top of the meshing track is provided with a second spur gear, the first spur gear, the meshing track and the second spur gear are meshed for transmission, and

[0014] An auxiliary roller is installed at the middle position of the toothed track.

[0015] Furthermore, a transmission tooth plate is installed on one side of the second spur gear, and an H-type transmission gear is installed on one side of the transmission tooth plate.

[0016] The glass fiber substrate material on the surface of the organic substrate roller is in contact with and connected to the H-shaped transmission gear, and an H-shaped groove is inlaid on the edge of the H-shaped transmission gear.

[0017] Furthermore, embedding grooves are inlaid on the edges of the transmission tooth plate, and a fourth motor is installed at one end of the support frame close to the transmission tooth plate. A telescopic rod is installed at the output end of the fourth motor, and a stop plate is installed at one end of the telescopic rod. The stop plate and the embedding groove can be engaged.

[0018] Furthermore, a first motor is installed on one side of the top of the substrate processing table, and the output end of the first motor is connected to a first moving screw rod, the top of the first moving screw rod is connected to a moving base, and second limiting slide rails are installed on both sides of the bottom of the moving base.

[0019] Among them, a second motor is installed on one side of the movable base, and the second motor and the first motor are distributed in a cross shape, a second movable screw rod is installed at the output end of the second motor, and a connecting piece is installed at the top of the second movable screw rod, and first limiting slide rails are installed on both sides of the bottom end of the connecting piece.

[0020] Furthermore, a dust cover is installed at the middle position of the top of the connector, and the dust cover is hollow inside and penetrated on both sides.

[0021] Wherein, an organic substrate grouping support plate is installed on one side of the dust cover, and a cutting press plate is installed on the top of the organic substrate grouping support plate.

[0022] Wherein, a plurality of groups of concave grooves are inlaid on the top of the organic substrate grouping support plate, and the shape of the grooves is the mold of the semiconductor substrate.

[0023] Furthermore, a flip rod is installed on the top of the connecting member at a side away from the organic substrate grouping support plate.

[0024] Wherein, a supporting rod is installed at the output end of the flip rod, and the bottom end of the supporting rod is hinged to the top end of the connecting piece, and the supporting rod has an appearance of a tree branch opened at the tail end.

[0025] Furthermore, when the flip rod is extended or retracted, it drives the support rod to flip about the hinge point between the support rod and the connecting piece.

[0026] Furthermore, a vacuum suction cup is installed at the tail end of the support rod.

[0027] The vacuum chuck has an outer ring shape with a middle portion made of rubber material, and the vacuum chuck does not cause damage to the surface of the substrate when sucking and putting down the semiconductor substrate;

[0028] Wherein, the surface of the middle part of the vacuum suction cup is a corrugated shape.

[0029] A delivery method comprises the following steps:

[0030] S1. First, the third motor is started to drive the first gear to rotate, and the first gear drives the first spur gear to rotate. The first spur gear drives the second spur gear to rotate through the meshing track. The auxiliary roller increases the stability of the meshing track transmission. The second spur gear drives the transmission tooth plate and the H-type transmission gear to rotate. When in use, the glass fiber substrate material on a set of full organic substrate rollers passes through the extension roller and the H-type transmission gear and then is pulled to another set of empty organic substrate rollers. The friction force of the H-type transmission gear during rotation drives the glass fiber substrate material to be transmitted. This structure facilitates the automatic transmission of the glass fiber substrate material, and the extension roller extends and stretches the glass fiber substrate material. Because it is elastic, it will shrink if it is not used for a long time.

[0031] S2. Start the first motor to push the movable base between the two sets of H-shaped transmission gears, and then start the cutting plate to press down and cut the glass fiber substrate. This method facilitates flexible cutting. Then start the second motor to drive the top connector to move, so as to adjust the position of the organic substrate grouping support plate between the two sets of H-shaped transmission gears, so as to adjust the position of the cutting point more flexibly. The dust cover can prevent dust and debris from splashing during cutting. Finally, start the flip rod to flip the support rod, so that the glass fiber substrate adsorbed on the vacuum suction cup can be uniformly collected in the receiving frame. In addition, if further processing is required on the semiconductor substrate, it can be directly transferred to the organic substrate grouping support plate.

[0032] S3. Then, when the organic substrate grouping pallet is transported to the cutting plate and arrives at the unloading point receiving frame, the flip rod is started to flip the support rod, and the suction of the vacuum suction cup is temporarily closed, so that the glass fiber substrate adsorbed on the vacuum suction cup can be uniformly collected into the receiving frame, so as to achieve the effect of timely releasing the support for the substrate. The structure can actively unload, and control the free switching of the driving mechanism and the adsorption state according to different substrate materials. The adsorption force of organic substrates and inorganic substrates is different due to different materials, thereby selectively controlling the working state of the supporting component.

[0033] S4. Finally, when the device fails, the fourth motor is started to push the stop plate at one end of the telescopic rod and the embedded groove arranged on the surface of the transmission gear plate to get stuck, so that the device can be stopped, which is convenient for timely inspection of the substrate material, because the organic substrate is relatively soft and easy to get stuck during transportation.

[0034] The present invention provides a substrate conveying device and conveying method for semiconductor processing through improvement, which has the following improvements and advantages compared with the prior art:

[0035] First, the glass fiber substrate is transmitted by an organic substrate roller. When the glass fiber substrate passes through the organic substrate grouping pallet, it passes through the cutting plate. The cutting plate presses down so that the glass fiber substrate can be cut into multiple groups of semiconductor substrates. The device uses a hard organic substrate grouping pallet to support the cut glass fiber substrate. First of all, it is necessary to ensure that no wrinkles are generated during the transportation process when transporting a single substrate or multiple substrates. In addition, the embedded grooves on the organic substrate grouping pallet adsorb the glass fiber substrate cut into the size of a semiconductor chip by groove clamping and static electricity. The grooves on the organic substrate grouping pallet can stably hold the substrate to prevent movement or tilting during transportation, and the force required for a single semiconductor substrate after dispersion is smaller, making the adsorption more stable.

[0036] Secondly, the cutting plate and the two groups of organic substrate rollers enable the glass fiber substrate to be cut in batches according to the shape of the semiconductor material when in use, and the automatic cutting has a better automation effect and the quality of the cut product is more stable. Specifically, the first motor is started to push the movable base between the two groups of H-type transmission gears, and then the cutting plate is started to press down and cut the glass fiber substrate. This method facilitates flexible cutting, and then the second motor is started to drive the top connector to move, so that the position of the organic substrate grouping support plate between the two groups of H-type transmission gears is adjusted, so that the position of the cutting point is adjusted more flexibly, and the dust cover can prevent dust and debris from splashing during cutting. In addition, if further processing is required on the semiconductor substrate, it can be directly transferred to the organic substrate grouping support plate.

[0037] Thirdly, by transporting the machine substrate grouping pallet to the cutting plate and then arriving at the unloading point receiving frame during the conveying process, the flip rod is started to flip the support rod, and the suction of the vacuum suction cup is temporarily closed, so that the glass fiber substrate adsorbed on the vacuum suction cup can be uniformly collected in the receiving frame, so as to achieve the effect of timely releasing the support for the substrate. The structure can actively unload, and control the free switching of the driving mechanism and the adsorption state according to different substrate materials. The adsorption force of organic substrates and inorganic substrates is different due to different materials, thereby selectively controlling the working state of the supporting components. The substrate conveying device and conveying method used in semiconductor processing are key technologies for efficiently and accurately moving and positioning substrates in the manufacturing process.

[0038] Fourthly, the vacuum cup is made of a hard ring on the outside and a rubber material in the middle. The soft material used in the vacuum cup will not damage the surface of the substrate when sucking or putting down the workpiece. This advantage is especially important for workpieces such as substrates that may require high precision and surface integrity. In addition, the surface of the substrate material is lubricated and airtight, and the vacuum cup increases the friction and adsorption capacity of the substrate through its corrugated surface design. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The present invention will be further explained below in conjunction with the accompanying drawings and Examples:

[0040] Figure 1 It is a front view structural schematic diagram of the present invention;

[0041] Figure 2 It is a schematic diagram of the top view of the structure of the present invention;

[0042] Figure 3 It is a side view structural schematic diagram of the present invention;

[0043] Figure 4 It is a schematic diagram of the first three-dimensional appearance structure of the present invention;

[0044] Figure 5 For the present invention Figure 4 The enlarged structural diagram at A in the middle;

[0045] Figure 6 It is a schematic diagram of a second three-dimensional appearance structure of the present invention;

[0046] Figure 7 For the present invention Figure 6 The enlarged structural diagram at B in the middle;

[0047] Figure 8 For the present invention Figure 6 The enlarged structural diagram at C in the middle;

[0048] Fig. 9 It is a first exploded stereoscopic schematic diagram of a semiconductor substrate cutting assembly of the present invention;

[0049] Fig.10 It is a second exploded stereoscopic schematic diagram of the semiconductor substrate cutting assembly of the present invention;

[0050] Fig.11 It is a third exploded stereoscopic schematic diagram of the semiconductor substrate cutting assembly of the present invention;

[0051] Fig.12 It is a three-dimensional enlarged schematic diagram of the vacuum suction cup of the present invention.

[0052] Description of reference numerals: 1, substrate processing table; 2, semiconductor substrate cutting assembly; 201, moving base; 202, dust cover; 203, first motor; 204, material receiving frame; 205, flip rod; 206, support rod; 207, vacuum suction cup; 208, organic substrate grouping support plate; 209, cutting plate; 210, first moving lead screw; 211, second motor; 212, second moving lead screw; 213, first limit slide rail; 214, second limit slide rail; 215. Connecting piece; 3. Substrate conveying structure; 301. Organic substrate roller; 302. Support frame; 303. Third motor; 304. First gear; 305. Fixed base; 306. First spur gear; 307. Geared track; 308. Second spur gear; 309. Transmission gear plate; 310. H-type transmission gear; 311. Extension roller; 312. Fourth motor; 313. Telescopic rod; 314. Stop plate; 315. Embedded groove; 316. Auxiliary roller. DETAILED DESCRIPTION

[0053] The following will be combined with the attached Figures 1 to 12 The present invention is described in detail, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] The present invention provides a substrate conveying device and a conveying method for semiconductor processing by improving the substrate conveying device and the conveying method. Figure 1-12 As shown in the figure, a substrate conveying device used for semiconductor processing includes a substrate processing table 1, a substrate conveying structure 3 is installed on one side of the top of the substrate processing table 1, and the substrate conveying structure 3 conveys the substrate, and the substrate conveying structure 3 includes an H-shaped transmission gear 310, and the H-shaped transmission gear 310 is installed in the middle position of the top of the substrate processing table 1.

[0055] The substrate conveying structure 3 further includes a support frame 302, and the support frame 302 is installed on the top of the substrate processing table 1, and

[0056] The organic substrate roller 301 is installed on one side of the support frame 302, and there are two groups of organic substrate rollers 301, one group of organic substrate rollers 301 is filled with materials, and the other group of organic substrate rollers 301 is empty. The glass fiber substrate material is transported between the two groups of organic substrate rollers 301. The bottom end of the organic substrate roller 301 is provided with an extension roller 311, and the extension roller 311 is installed on one side of the support frame 302.

[0057] The third motor 303 is installed on one side of the top of the substrate processing table 1, and the third motor 303 is provided with two groups, and the two groups of the third motor 303 rotate in the same direction, the output end of the third motor 303 is connected to the first gear 304, and one end of the first gear 304 is connected to the first spur gear 306, one end of the first spur gear 306 is contacted and connected with a meshing track 307, and the top of the meshing track 307 is provided with a second spur gear 308, and the first spur gear 306, the meshing track 307 and the second spur gear 308 are meshed for transmission, and

[0058] An auxiliary roller 316 is installed at the middle position of the toothed track 307;

[0059] A transmission gear plate 309 is installed on one side of the second spur gear 308, and an H-shaped transmission gear 310 is installed on one side of the transmission gear plate 309.

[0060] The glass fiber substrate material on the surface of the organic substrate roller 301 is in contact with and connected to the H-shaped transmission gear 310, and an H-shaped groove is embedded at the edge of the H-shaped transmission gear 310;

[0061] The transmission gear plate 309 is inlaid with an embedding groove 315 at the edges thereof, and a fourth motor 312 is installed at one end of the support frame 302 close to the transmission gear plate 309, a telescopic rod 313 is installed at the output end of the fourth motor 312, and a stop plate 314 is installed at one end of the telescopic rod 313, and the stop plate 314 and the embedding groove 315 can be engaged;

[0062] There are two sets of H-shaped transmission gears 310. A semiconductor substrate cutting assembly 2 is installed at the middle position of the two sets of H-shaped transmission gears 310. The semiconductor substrate cutting assembly 2 includes an organic substrate grouping support plate 208 and a material receiving frame 204. A cutting press plate 209 is provided at the top of the organic substrate grouping support plate 208. The glass fiber substrate material passes through the bottom of the cutting press plate 209. The cutting press plate 209 cuts the glass fiber substrate material and transmits the glass fiber substrate through the organic substrate roller 301. When the glass fiber substrate passes through the organic substrate grouping support plate 208, it passes through the cutting press plate 209. 9. The glass fiber substrate can be cut into multiple groups of semiconductor substrates by pressing down the cutting plate 209. The device uses a hard organic substrate grouping pallet 208 to support the cut glass fiber substrate. First, it is necessary to ensure that no wrinkles are generated during the transportation process when transporting a single substrate or multiple substrates. The organic substrate grouping pallet 208 is equipped with semiconductor substrates. The cutting plate 209 and two groups of organic substrate rollers 301 enable the glass fiber substrates to be cut in batches according to the shape of the semiconductor material when in use. The automatic cutting has a better automation effect and the quality of the cut product is more stable.

[0063] A first motor 203 is installed on one side of the top of the substrate processing table 1, and the output end of the first motor 203 is connected to a first moving screw rod 210, the top of the first moving screw rod 210 is connected to a moving base 201, and second limiting slide rails 214 are installed on both sides of the bottom of the moving base 201. Specifically, the first motor 203 is started to push the moving base 201 between the two sets of H-shaped transmission gears 310, and then the cutting plate 209 is started to press down and cut the glass fiber substrate. This method is convenient for flexible cutting.

[0064] Among them, a second motor 211 is installed on one side of the mobile base 201, and the second motor 211 and the first motor 203 are arranged in a cross shape. A second moving screw rod 212 is installed at the output end of the second motor 211, and a connecting piece 215 is installed at the top of the second moving screw rod 212. Then, by starting the second motor 211, the connecting piece 215 at the top is driven to move, so as to adjust the position of the organic substrate grouping support plate 208 between the two sets of H-shaped transmission gears 310, so as to adjust the position of the cutting point more flexibly. First limiting slide rails 213 are installed on both sides of the bottom of the connecting piece 215;

[0065] A dust cover 202 is installed at the middle position of the top of the connecting member 215, and the dust cover 202 is hollow inside and penetrated on both sides.

[0066] An organic substrate grouping support plate 208 is installed on one side of the dust cover 202, and a cutting press plate 209 is installed on the top of the organic substrate grouping support plate 208. The dust cover 202 can prevent dust and debris from splashing during re-cutting. In addition, if further processing is required on the semiconductor substrate, the organic substrate grouping support plate 208 can be directly used.

[0067] Among them, the top of the organic substrate grouping pallet 208 is inlaid with multiple groups of concave grooves, and the shape of the grooves is a mold of the semiconductor substrate; the embedded grooves on the organic substrate grouping pallet 208 are used to place the glass fiber substrate and the electrostatic adsorption method enables the device to adsorb the glass fiber substrate cut into the size of the semiconductor chip. The grooves on the organic substrate grouping pallet 208 can stably hold the substrate to prevent movement or tilting during transportation, and the force required for a single semiconductor substrate after dispersion is smaller, making the adsorption more stable;

[0068] A flip rod 205 is installed on the top of the connecting member 215 away from the organic substrate grouping support plate 208.

[0069] Among them, the output end of the flip rod 205 is equipped with a support rod 206, and the bottom end of the support rod 206 is hinged with the top end of the connecting piece 215. During the conveying process, when the organic substrate grouping pallet 208 is transported to the cutting plate 209 and arrives at the unloading point receiving frame 204, the flip rod 205 is started to flip the support rod 206, and the suction force of the vacuum suction cup 207 is temporarily closed, so that the glass fiber substrate adsorbed on the vacuum suction cup 207 can be uniformly collected in the receiving frame 204, so as to achieve the effect of timely releasing the support for the substrate. The structure can actively unload, and control the free switching of the driving mechanism and the adsorption state according to different substrate materials. The organic substrate and the inorganic substrate have different adsorption forces due to different materials, so as to selectively control the working state of the supporting component. The substrate conveying device and conveying method used in semiconductor processing are key technologies for efficiently and accurately moving and positioning the substrate in the manufacturing process. The support rod 206 has a tree-like shape with a branch-like opening at the tail end, which is convenient for installing multiple groups of vacuum suction cups 207.

[0070] When the flip rod 205 is extended or retracted, the support rod 206 is driven to flip about the hinge point between the support rod 206 and the connecting member 215;

[0071] A vacuum suction cup 207 is installed at the tail end of the support rod 206.

[0072] The vacuum suction cup 207 is in the shape of an outer ring with a rubber material in the middle. The vacuum suction cup 207 is made of a hard outer ring and a rubber material in the middle. The soft material used by the vacuum suction cup 207 will not damage the substrate surface when sucking or putting down the workpiece. This advantage is particularly important for workpieces such as substrates that may require high precision and surface integrity. In addition, the surface of the substrate material is lubricated and airtight.

[0073] The surface of the middle part of the vacuum suction cup 207 is in a corrugated shape, and the vacuum suction cup 207 increases the friction and adsorption capacity of the substrate through its corrugated surface design.

[0074] Working principle: First, the third motor 303 is started to drive the first gear 304 to rotate, and the first gear 304 drives the first spur gear 306 to rotate. The first spur gear 306 drives the second spur gear 308 to rotate through the meshing track 307. The auxiliary roller 316 increases the transmission stability of the meshing track 307. The second spur gear 308 drives the transmission tooth plate 309 and the H-type transmission gear 310 to rotate. When in use, the glass fiber substrate material on a group of full organic substrate rollers 301 passes through the extension roller 311 and the H-type transmission gear 310 and then is pulled to another group of empty organic substrate rollers 301. The friction force of the H-type transmission gear 310 during rotation drives the glass fiber substrate material to be transmitted. This structure facilitates the automatic transmission of the glass fiber substrate material, and the extension roller 311 extends and stretches the glass fiber substrate material. Because it is elastic, it will shrink if it is not used for a long time.

[0075] Then, the first motor 203 is started to push the movable base 201 between the two groups of H-shaped transmission gears 310, and then the cutting plate 209 is started to press down and cut the glass fiber substrate. This method is convenient for flexible cutting. Then, the second motor 211 is started to drive the top connector 215 to move, so as to adjust the position of the organic substrate grouping support plate 208 between the two groups of H-shaped transmission gears 310, so as to adjust the position of the cutting point more flexibly. The dust cover 202 can prevent dust and debris from splashing during cutting. Finally, the flip rod 205 is started to flip the support rod 206, so that the glass fiber substrate adsorbed on the vacuum suction cup 207 can be uniformly collected in the receiving frame 204. In addition, if further processing is required on the semiconductor substrate, it can be directly transferred to the organic substrate grouping support plate 208.

[0076] When the organic substrate grouping pallet 208 is transported to the cutting plate 209 and arrives at the unloading point receiving frame 204, the flip rod 205 is started to flip the supporting rod 206, and the suction force of the vacuum suction cup 207 is temporarily closed, so that the glass fiber substrate adsorbed on the vacuum suction cup 207 can be uniformly collected in the receiving frame 204, so as to achieve the effect of timely releasing the support for the substrate. The structure can actively unload, and control the free switching of the driving mechanism and the adsorption state according to different substrate materials. The adsorption force of organic substrates and inorganic substrates is different due to different materials, thereby selectively controlling the working state of the supporting component.

[0077] Finally, when the device fails, the fourth motor 312 is started to push the stop plate 314 at one end of the telescopic rod 313 and the embedding groove 315 set on the surface of the transmission gear plate 309 to get stuck, so that the device can be stopped, which is convenient for timely inspection of the substrate material, because the organic substrate is relatively soft and easy to get stuck during transportation.

[0078] In combination with the above-mentioned substrate conveying device applied to semiconductor processing, a conveying method is provided below, which specifically includes the following steps:

[0079] S1. First, the third motor 303 is started to drive the first gear 304 to rotate, and the first gear 304 drives the first spur gear 306 to rotate. The first spur gear 306 drives the second spur gear 308 to rotate through the meshing track 307. The auxiliary roller 316 increases the transmission stability of the meshing track 307. The second spur gear 308 drives the transmission tooth plate 309 and the H-type transmission gear 310 to rotate. When in use, the glass fiber substrate material on a group of full organic substrate rollers 301 passes through the extension roller 311 and the H-type transmission gear 310 and then is pulled to another group of empty organic substrate rollers 301. The friction force of the H-type transmission gear 310 during rotation drives the glass fiber substrate material to be transmitted. This structure facilitates the automatic transmission of the glass fiber substrate material, and the extension roller 311 is used to extend and stretch the glass fiber substrate material. Because it is elastic, it will shrink if it is not used for a long time.

[0080] S2. Start the first motor 203 to push the movable base 201 between the two groups of H-shaped transmission gears 310, and then start the cutting plate 209 to press down and cut the glass fiber substrate. This method is convenient for flexible cutting. Then start the second motor 211 to drive the top connector 215 to move, so as to adjust the position of the organic substrate grouping support plate 208 between the two groups of H-shaped transmission gears 310, so as to adjust the position of the cutting point more flexibly. The dust cover 202 can prevent dust and debris from splashing during cutting. Finally, start the flip rod 205 to flip the support rod 206, so that the glass fiber substrate adsorbed on the vacuum suction cup 207 can be uniformly collected in the receiving frame 204. In addition, if further processing is required on the semiconductor substrate, it can be directly transferred to the organic substrate grouping support plate 208.

[0081] S3. Then, when the organic substrate grouping pallet 208 is transported to the cutting plate 209 and arrives at the unloading point receiving frame 204, the flip rod 205 is started to flip the supporting rod 206, and the suction force of the vacuum suction cup 207 is temporarily closed, so that the glass fiber substrate adsorbed on the vacuum suction cup 207 can be uniformly collected in the receiving frame 204, so as to achieve the effect of timely releasing the support for the substrate. The structure can actively unload, and control the free switching of the driving mechanism and the adsorption state according to different substrate materials. The adsorption force of organic substrates and inorganic substrates is different due to different materials, thereby selectively controlling the working state of the supporting component.

[0082] S4. Finally, when the device fails, the fourth motor 312 is started to push the stop plate 314 at one end of the telescopic rod 313 and the embedded groove 315 set on the surface of the transmission gear plate 309 to get stuck, so that the device can be stopped, which is convenient for timely inspection of the substrate material, because the organic substrate is relatively soft and easy to get stuck during transportation.

[0083] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A substrate conveying device for semiconductor processing, comprising a substrate processing table (1), characterized in that: A substrate conveying structure (3) is installed on one side of the top of the substrate processing table (1), and the substrate conveying structure (3) conveys the substrate, and the substrate conveying structure (3) comprises an H-shaped transmission gear (310), and the H-shaped transmission gear (310) is installed at the middle position of the top of the substrate processing table (1), and The H-shaped transmission gear (310) is provided with two groups, and a semiconductor substrate cutting assembly (2) is installed at the middle position of the two groups of H-shaped transmission gears (310). The semiconductor substrate cutting assembly (2) comprises an organic substrate grouping support plate (208) and a material receiving frame (204). A cutting pressing plate (209) is provided at the top of the organic substrate grouping support plate (208), and the glass fiber substrate material passes through the bottom of the cutting pressing plate (209). The cutting pressing plate (209) cuts the glass fiber substrate material, and the organic substrate grouping support plate (208) assembles the semiconductor substrate.

2. A substrate conveying device for semiconductor processing according to claim 1, characterized in that: The substrate conveying structure (3) further comprises a support frame (302), and the support frame (302) is installed on the top of the substrate processing table (1), and An organic substrate roller (301) is installed on one side of a support frame (302), and two groups of organic substrate rollers (301) are provided, one group of organic substrate rollers (301) is filled with material, and the other group of organic substrate rollers (301) is empty, and the glass fiber substrate material is transported between the two groups of organic substrate rollers (301), and an extension roller (311) is provided at the bottom end of the organic substrate roller (301), and the extension roller (311) is installed on one side of the support frame (302), A third motor (303), the third motor (303) is installed on one side of the top of the substrate processing table (1), and the third motor (303) is provided with two groups, the two groups of third motors (303) rotate in the same direction, the output end of the third motor (303) is connected to the first gear (304), and one end of the first gear (304) is connected to the first spur gear (306), one end of the first spur gear (306) is contact-connected with a meshing track (307), and the top of the meshing track (307) is provided with a second spur gear (308), the first spur gear (306), the meshing track (307) and the second spur gear (308) are meshed and driven, and An auxiliary roller (316) is installed at the middle position of the toothed track (307).

3. A substrate conveying device for semiconductor processing according to claim 2, characterized in that: A transmission tooth plate (309) is installed on one side of the second spur gear (308), and an H-shaped transmission gear (310) is installed on one side of the transmission tooth plate (309). The glass fiber substrate material on the surface of the organic substrate roller (301) is in contact with and connected to the H-shaped transmission gear (310), and an H-shaped groove is inlaid at the edge of the H-shaped transmission gear (310).

4. The substrate conveying device for semiconductor processing according to claim 3, characterized in that: Embedding grooves (315) are inlaid on the edges of the transmission tooth plate (309), and a fourth motor (312) is installed at one end of the support frame (302) close to the transmission tooth plate (309), a telescopic rod (313) is installed at the output end of the fourth motor (312), and a stop plate (314) is installed at one end of the telescopic rod (313), and the stop plate (314) and the embedding groove (315) can be engaged.

5. The substrate conveying device for semiconductor processing according to claim 1, characterized in that: A first motor (203) is installed on one side of the top end of the substrate processing table (1), and the output end of the first motor (203) is connected to a first movable lead screw (210), the top end of the first movable lead screw (210) is connected to a movable base (201), and second limiting slide rails (214) are installed on both sides of the bottom end of the movable base (201). A second motor (211) is installed on one side of the movable base (201), and the second motor (211) and the first motor (203) are arranged in a cross shape. A second movable screw rod (212) is installed at the output end of the second motor (211), and a connecting piece (215) is installed at the top end of the second movable screw rod (212), and first limiting slide rails (213) are installed on both sides of the bottom end of the connecting piece (215).

6. The substrate conveying device for semiconductor processing according to claim 5, characterized in that: A dust cover (202) is installed at the middle position of the top of the connecting member (215), and the dust cover (202) is hollow inside and penetrated on both sides. Wherein, an organic substrate grouping support plate (208) is installed on one side of the dust cover (202), and a cutting pressing plate (209) is installed on the top of the organic substrate grouping support plate (208). The top of the organic substrate grouping support plate (208) is inlaid with a plurality of groups of concave grooves, and the shape of the grooves is the mold of the semiconductor substrate.

7. A substrate conveying device for semiconductor processing according to claim 6, characterized in that: A turning rod (205) is installed on the top of the connecting member (215) at a side away from the organic substrate grouping support plate (208). Wherein, a supporting rod (206) is installed at the output end of the flip rod (205), and the bottom end of the supporting rod (206) is hinged to the top end of the connecting piece (215), and the supporting rod (206) has an appearance of a tree branch opened at the tail end.

8. The substrate conveying device for semiconductor processing according to claim 7, characterized in that: When the flip rod (205) is extended or retracted, it drives the support rod (206) to flip about the hinge point between the support rod (206) and the connecting member (215).

9. The substrate conveying device for semiconductor processing according to claim 7, characterized in that: A vacuum suction cup (207) is installed at the tail end of the support rod (206). The vacuum suction cup (207) is in the shape of an outer ring with a middle portion made of rubber material, and the vacuum suction cup (207) will not cause damage to the surface of the semiconductor substrate when sucking and placing the semiconductor substrate; Wherein, the surface of the middle part of the vacuum suction cup (207) is a corrugated shape.

10. A conveying method, comprising a substrate conveying device for semiconductor processing according to any one of claims 1 to 9, characterized in that , including the following steps: S1. First, the third motor (303) is started to drive the first gear (304) to rotate. The first gear (304) drives the first spur gear (306) to rotate. The first spur gear (306) drives the second spur gear (308) to rotate through the meshing track (307). The auxiliary roller (316) is used to increase the transmission stability of the meshing track (307). The second spur gear (308) drives the transmission tooth plate (309) and the H-type transmission gear (310) to rotate. When in use, a full set of The glass fiber substrate material on the organic substrate roller (301) is pulled onto another set of empty organic substrate rollers (301) through an extension roller (311) and an H-shaped transmission gear (310). The glass fiber substrate material is driven to be transmitted by the friction force when the H-shaped transmission gear (310) rotates. This structure facilitates the automatic transmission of the glass fiber substrate material. The extension roller (311) has the function of extending and stretching the glass fiber substrate material. Because the glass fiber substrate material is elastic, it will shrink if it is not used for a long time. S2, by starting the first motor (203), the movable base (201) is pushed between the two groups of H-shaped transmission gears (310), and then the cutting pressing plate (209) is started to press down and cut the glass fiber substrate. This method facilitates flexible cutting. Then, by starting the second motor (211), the top connecting piece (215) is driven to move, so as to facilitate adjustment of the position of the organic substrate grouping support plate (208) between the two groups of H-shaped transmission gears (310), so as to facilitate more flexible adjustment of the position of the cutting point. The dust cover (202) can play a role in preventing dust and debris from splashing during cutting. Finally, the flip rod (205) is started to flip the support rod (206), so that the glass fiber substrates adsorbed on the vacuum suction cup (207) can be uniformly collected in the material receiving frame (204). In addition, if further processing is required on the semiconductor substrate, it can be directly transferred to the organic substrate grouping support plate (208). S3, when the organic substrate grouping support plate (208) is transported to the cutting plate (209) and arrives at the unloading point receiving frame (204), the flip rod (205) is started to flip the support plug rod (206), and the suction force of the vacuum suction cup (207) is temporarily closed, so that the glass fiber substrates adsorbed on the vacuum suction cup (207) can be uniformly collected in the receiving frame (204), so as to achieve the effect of timely releasing the support for the substrate. The structure can actively unload, and control the free switching of the driving mechanism and the adsorption state according to different substrate materials. The adsorption force of the organic substrate and the inorganic substrate is different due to the different materials, thereby selectively controlling the working state of the supporting component. S4. Finally, when the device fails, the fourth motor (312) is started to push the stop plate (314) at one end of the telescopic rod (313) and the embedding groove (315) provided on the surface of the transmission gear plate (309) to get stuck, so that the device can be stopped, which is convenient for timely inspection of the substrate material, because the organic substrate is relatively soft and is easy to get stuck during transportation.

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