Horizontal CSP product carrying carrier
By designing horizontally placed CSP products to transport vehicles, using sinking structure and multi-directional buffering points, the existing vehicles are not adaptable and protective in special structural CSP products, and the product is realized during the handling process Improved stability and protection.
Patent Information
- Application Number
- CN202411696381.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-02-18
AI Technical Summary
The existing CSP product transport vehicle is inadequately adaptable and protective in CSP products with special structures, especially products with glue strips on the edges, resulting in glue strips being easily scratched during the handling process, affecting the appearance of the product. Quality and electrical performance.
A horizontally placed CSP product transport vehicle was designed, and the sinking structure was used to reduce the area where the upper vehicle was directly in contact with the CSP product, and a limit table and limit protrusion were set in the vehicle to form a gap, combining multi-directional buffering. Points and protective layers ensure the stability and protection of the product during handling.
Through the sinking structure and multi-directional buffering design, the product surface is effectively avoided from being damaged by grips or vehicles, improves the stability and protection of the product, reduces the risk of scratches, and improves the yield of production.
Smart Images
Figure CN119480727A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of transport carriers, and in particular to a horizontally placed CSP product transport carrier. Background Art
[0002] CSP products are a kind of high-precision packaging products widely used in the field of electronics. With their miniaturization and high performance, they are widely used in consumer electronics, communication equipment, automotive electronics and other fields. However, since CSP products have high requirements for processing accuracy and surface quality, during the production and transportation process, specially designed transport carriers must be used to fix and protect the products to ensure the integrity and stability of the products in multiple links of operation.
[0003] The existing CSP product transport carrier is usually used in conjunction with an upper carrier and a lower carrier. The substrate of the CSP product is placed in the substrate position in the middle of the carrier and fixed by the clamping points around the carrier. Although this design can achieve product positioning and stability to a certain extent, for CSP products with special structures, especially products with injection strips on the edges, its adaptability and protection are gradually becoming more and more prominent.
[0004] The injection strip of CSP products is usually a bare metal part with no ink covering its surface and is directly exposed to the outside world. When the traditional clamping point contacts the substrate, mechanical friction will occur at the injection strip position because the clamping point material is hard and the contact area is small. This contact can easily cause scratches at the injection strip position. Scratches not only directly affect the appearance quality of the product, but may also cause a decrease in sealing performance and even affect the electrical performance or long-term reliability of the CSP product. This problem is particularly evident during transportation and multiple uses, resulting in a large number of products being classified as poor in appearance or directly discarded, which significantly reduces the production yield.
[0005] In addition, the existing carrier design lacks a buffer protection mechanism. The vibration or impact that may occur during transportation will further aggravate the friction between the clamping point and the injection strip, making the scratch problem more serious. Summary of the invention
[0006] The present invention provides a horizontally placed CSP product transport carrier, wherein the sinking structure reduces the area of direct contact between the upper carrier and the CSP product, effectively preventing the product surface from being pinched or damaged by the carrier.
[0007] To achieve the above-mentioned object, the present invention provides the following technical solution: a horizontally placed CSP product conveying carrier, the overall structure of the conveying carrier is a symmetrical structure, including an upper carrier and a lower carrier; the upper carrier is buckled on the lower carrier and packages the CSP product, and sinking structures are provided on both sides of the upper carrier to form a gap between the upper carrier and the lower carrier; the sinking structure includes a limit platform provided on both side edges of the lower carrier and a limit protrusion provided on both side edges of the upper carrier and matched with the limit platform.
[0008] The upper carrier includes a first upper clamp side, a second upper clamp side and a third clamp side; the first upper clamp side is provided with a plurality of clamping points for fixing the CSP product on one side in the long side direction, the second upper clamp side is a linear structure for fixing the CSP product on the other side in the long side direction, and the third clamp side is provided with a plurality of clamping points for fixing the product in the short side direction; the spacing between the clamping points of the first upper clamp side is 40 mm; the spacing between the clamping points of the third clamp side is 36 mm; the clamp side and the clamping point design are combined to provide multi-directional stability of the long side and the short side; the linear design of the second clamp side limits the movement of the CSP product in the long side direction to avoid shaking; the clamping points with reasonable spacing reduce the contact area and reduce the risk of scratches.
[0009] Preferably, a plurality of partition plates are arranged in the longitudinal direction of the carrier, and symmetrical first buffer points are arranged on both sides of the partition plates, and the shape of the first buffer points is a wave-shaped structure; the amplitude of the first buffer points is 1 mm; the wavelength is 5 mm; the wave-shaped structure absorbs vibrations and reduces impacts during transportation; the partition plates provide an independent placement area for each product to prevent products from colliding with each other; the partition plates are combined with the buffer points to improve product positioning accuracy and transportation safety.
[0010] Preferably, a second buffer point is provided on the side of the lower carrier, and the shape of the second buffer point is a wave-shaped structure; the amplitude of the second buffer point is 1.5 mm; the wavelength is 7 mm; the second buffer point further enhances the lateral protection performance of the CSP product; the wave-shaped structure provides a lateral shock absorption effect and improves the overall vibration resistance; and effectively fixes the product position to avoid lateral sliding caused by handling.
[0011] Preferably, a third buffer point is provided on the upper and lower sides of the lower carrier; the third buffer point; the height of the third buffer point is 1 mm; the third buffer point provides additional support, improves the all-round protection performance of the carrier during transportation, and further reduces the upper and lower vibrations and impacts caused by transportation.
[0012] Preferably, the partition plate is provided with a connecting hole.
[0013] Preferably, the four corners of the transport carrier are arc-shaped.
[0014] Preferably, a protective layer is provided on the clamping point of the first upper clamp side and the clamping point of the third clamp side; the protective layer increases the friction between the clamping point and the substrate, thereby improving the fixing stability.
[0015] Compared with the prior art, the present invention has the following beneficial effects: the device is symmetrical in design, does not need to distinguish directions, is easy to install and adjust quickly, and improves the efficiency of production line operation. The fixed gap between the upper carrier and the lower carrier is maintained by the sinking structure design, which not only avoids excessive clamping of the product, but also improves the fixing effect. At the same time, the sinking structure reduces the area of direct contact between the upper carrier and the CSP product, effectively preventing the product surface from being pinched or damaged by the carrier.
[0016] Multi-directional buffer and protective layer effectively protect the integrity of CSP products during handling. The combination of clamp edge, partition plate and buffer point ensures multi-directional fixation of the product and strong earthquake resistance. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.
[0018] Figure 2 It is a schematic diagram of the structure of the upper carrier of the present invention.
[0019] Figure 3 It is a schematic diagram of the structure of the downloading tool of the present invention.
[0020] In the figure: 1. upper carrier; 2. lower carrier; 3. first upper fixture edge; 4. second upper fixture edge; 5. third fixture edge; 6. limit table; 7. partition plate; 8. first buffer point; 9. second buffer point; 10. third buffer point; 11. connecting hole; 12. limit protrusion. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0022] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0023] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0024] refer to Figure 1-3 As shown, the present invention provides a horizontally placed CSP product conveying carrier, the overall structure of the conveying carrier presents a symmetrical structure, the center of the conveying carrier is based on a horizontal and a vertical central axis, and is divided into multiple modules, which include an upper carrier 1 and a lower carrier 2; the upper carrier 1 is buckled on the lower carrier 2 and encapsulates the CSP product, and sinking structures are arranged on both sides of the upper carrier 1 to form a gap between the upper carrier 1 and the lower carrier 2; the upper carrier 1 includes a first upper clamp side 3, a second upper clamp side 4 and a third clamp side 5; the first upper clamp side 3 is provided with a plurality of clamping points for fixing the CSP product on one side in the long side direction, and the second upper clamp side 4 is a linear structure for fixing the CSP product to be limited on the other side in the long side direction, so as to avoid the injection strip from contacting the carrier and reduce operation interference; the third clamp side 5 is provided with a plurality of clamping points for fixing the position of the product in the short side direction; the spacing between the clamping points of the first upper clamp side 3 is 40 mm; the spacing between the clamping points of the third clamp side 5 is 36 mm. The first upper clamp edge 3 fixes the CSP product through the clamping point to reduce the shaking of the product during transportation; the linear structure of the second upper clamp edge 4 prevents the injection strip from contacting the carrier, reducing operational interference; the clamping point of the third clamp edge 5 further increases the friction with the substrate to enhance the fixing effect.
[0025] The gap between the upper carrier 1 and the lower carrier 2 is greater than or equal to 1 mm. The upper carrier 1 has a length of 440 mm, a width of 300 mm, and a thickness of 3 mm; the lower carrier 2 has a length of 450 mm, a width of 300 mm, and a thickness of 6 mm.
[0026] The sinking structure includes a limit platform 6 provided on both side edges of the lower carrier 2 and a limit protrusion 12 provided on both side edges of the upper carrier 1 and cooperating with the limit platform 6. The limit platform 6 has a width of 3 mm and a thickness of 3 mm; the limit protrusion 12 has a width less than 3 mm and a depth greater than or equal to 4 mm; the upper carrier 1 and the lower carrier 2 cooperate with the limit platform 6 and the limit protrusion 12 to achieve gap control, ensuring that the upper carrier 1 and the lower carrier 2 always maintain a gap of more than 1 mm. Since the upper carrier 1 and the lower carrier 2 cooperate with the limit platform 6 and the limit protrusion 12 to achieve accurate positioning, the CSP product is ensured to remain stable during loading and handling; the cooperation between the upper carrier 1 and the lower carrier 2 ensures the safe fixation of the CSP product, reduces product sliding or displacement, and the gap design avoids product damage caused by excessive clamping.
[0027] The said lower carrier 2 is provided with a plurality of partition plates 7 in the longitudinal direction, and symmetrical first buffer points 8 are provided on both sides of the said partition plates 7, and the shape of the first buffer points 8 is a wave-shaped structure; the amplitude (height) of the first buffer points 8 is 1mm; the wavelength (period) is 5mm; the said lower carrier 2 is provided with a second buffer point 9 on the side, and the shape of the second buffer point 9 is a wave-shaped structure. The amplitude (height) of the second buffer point 9 is 1.5mm; the wavelength (period) is 7mm; the said lower carrier 2 is provided with a third buffer point 10 on both sides, and the height of the third buffer point 10 is 1mm; the partition plates 7 separate the product areas, and the first buffer point 8 absorbs the impact force when in contact, ensuring the stable placement of the CSP product; the second buffer point 9 and the third buffer point 10 provide multi-directional buffering functions to prevent the product from slipping during transportation.
[0028] The partition plate 7 is provided with a connecting hole 11, and when in use, the connecting hole 11 can be fixed to the matching hole of the lower tool 2 by screws to ensure its stability.
[0029] The four corners of the transport carrier are arc-shaped ( Figure 3 The arc-shaped fillet radius is 5 mm. The modular and symmetrical design of the transport carrier allows the carrier to flexibly adjust its direction on the production line through the arc shape, and can adapt to different positions and transport directions of the product without additional operation; at the same time, the modular design improves the adaptability of the transport carrier and the versatility of the production line, and the symmetrical structure reduces the restrictions on the installation direction and improves production efficiency.
[0030] A protective layer is provided on the clamping point of the first upper clamp edge 3 and the clamping point of the third clamp edge 5. The thickness of the protective layer is 0.5 mm and is made of wear-resistant silicone or polyurethane material. The friction between the clamping point and the substrate is increased, thereby improving the fixing effect and reducing scratches. The clamping point of the first upper clamp edge 3 and the third clamp edge 5 is in contact with the CSP product through the protective layer, providing gentle protection during transportation and assembly, and reducing surface damage caused by over-tight clamping.
[0031] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.
Claims
1. A horizontally placed CSP product transport carrier, characterized in that: The overall structure of the transport carrier is a symmetrical structure, comprising an upper carrier (1) and a lower carrier (2); the upper carrier (1) is buckled onto the lower carrier (2) and packages the CSP product, and a sinking structure is provided on both sides of the upper carrier (1) so that a gap is formed between the upper carrier (1) and the lower carrier (2); the sinking structure comprises a limit platform (6) provided on both side edges of the lower carrier (2) and a limit protrusion (12) provided on both side edges of the upper carrier (1) and cooperating with the limit platform (6).
2. The horizontally placed CSP product transport carrier according to claim 1, characterized in that: The upper carrier (1) comprises a first upper clamp side (3), a second upper clamp side (4) and a third clamp side (5); the first upper clamp side (3) is provided with a plurality of clamping points for fixing the CSP product on one side in the long side direction; the second upper clamp side (4) is a linear structure for fixing the CSP product to be limited on the other side in the long side direction; the third clamp side (5) is provided with a plurality of clamping points for fixing the position of the product in the short side direction; the spacing between the clamping points of the first upper clamp side (3) is 40 mm; the spacing between the clamping points of the third clamp side (5) is 36 mm.
3. The horizontally placed CSP product transport carrier according to claim 1, characterized in that: The lower tool (2) is provided with a plurality of partition plates (7) in the longitudinal direction, and symmetrical first buffer points (8) are provided on both sides of the partition plates (7), the first buffer points (8) being in the shape of a wave-shaped structure; the amplitude of the first buffer points (8) is 1 mm; and the wavelength is 5 mm.
4. The horizontally placed CSP product transport carrier according to claim 3, characterized in that: A second buffer point (9) is provided on the side of the lower tool (2); the second buffer point (9) is in the shape of a wave-shaped structure; the amplitude of the second buffer point (9) is 1.5 mm; and the wavelength is 7 mm.
5. The horizontally placed CSP product transport carrier according to claim 4, characterized in that: The lower and upper sides of the lower tool (2) are provided with third buffer points (10); the height of the third buffer point (10) is 1 mm.
6. The horizontally placed CSP product transport carrier according to claim 3, characterized in that: The partition plate (7) is provided with a connecting hole (11).
7. The horizontally placed CSP product transport carrier according to claim 1, characterized in that: The four corners of the transport carrier are arc-shaped.
8. The horizontally placed CSP product transport carrier according to claim 2, characterized in that: A protective layer is provided on the clamping point of the first upper clamp edge (3) and the clamping point of the third clamp edge (5).