Double-peak deceleration control method and system during Wafer rising and falling of Liftpin
By dividing the Liftpin lift path into different speed areas, the precise control of Liftpin lift speed is achieved, which solves the problems of inaccurate wafer lift speed control, large impact force and lack of real-time state monitoring in semiconductor manufacturing, significantly improving the processing accuracy and stability.
Patent Information
- Application Number
- CN202411590974.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-02-18
AI Technical Summary
During semiconductor manufacturing, the speed control accuracy of the wafer lifting system is insufficient, causing the wafer to vibrate or shake, affecting the processing accuracy; at the same time, the direct drive method generates a large impact force during the lifting process, which may damage the wafer surface and Accelerate equipment wear; traditional systems lack real-time status monitoring, which increases the risk of processing.
A bimodal deceleration control method is proposed, and precise control of the Liftpin lifting speed is achieved by dividing the Liftpin lifting path into a slow speed area, a first normal speed area and a second normal speed area. The specific steps include running at a preset speed in the first normal speed area and the second normal speed area, and running at a slow speed in the slow speed area to ensure that the Wafer can fall smoothly on the robot arm or the Liftpin can stabilize during the descent. Push up the Wafer.
By accurately controlling the lifting and lowering speed of Liftpin, the accuracy and stability of wafer processing are significantly improved, mechanical impact and damage caused by sudden speed changes are reduced, the control of the lifting and lowering state of the wafer is enhanced, and production costs and maintenance costs are reduced.
Smart Images
Figure CN119480732A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of precision agriculture detection technology, and in particular to a double-peak deceleration control method and system for liftpin lifting wafers. Background Art
[0002] In the semiconductor manufacturing process, the lifting action of the wafer is the core link in many process steps. In the past, most wafer lifting systems used direct drive mode, that is, using stepper motors or servo motors to directly control the wafer lifting device (Liftpin) to achieve lifting. However, this direct drive method has the following disadvantages:
[0003] First, the speed control accuracy is insufficient. When the wafer is lifted or lowered at high speed, the direct drive method is difficult to achieve precise speed control. The wafer may vibrate or shake due to excessive speed, which will adversely affect the processing accuracy.
[0004] Secondly, the impact force is significant. When the wafer contacts other parts of the lifting device during the lifting process, a large impact force will be generated, which may not only damage the wafer surface, but also accelerate the wear of the equipment.
[0005] Furthermore, there is a lack of real-time status monitoring. The traditional lifting system fails to monitor the wafer lifting status in real time, making it difficult to detect and correct abnormal movements in time, thus increasing the risk of the processing process.
[0006] In order to solve the above problems, the prior art has proposed some improvement solutions, such as using buffer elements to reduce impact force, adding sensors to monitor wafer status in real time, etc. However, these solutions generally face challenges such as complex structure, high cost, and difficulty in integration, making them difficult to be widely used in actual production. Summary of the invention
[0007] The purpose of the present invention is to propose a double-peak deceleration control method and system for liftpin lifting wafers, so as to achieve precise control and smooth adjustment of the liftpin lifting speed, thereby significantly improving the stability and accuracy of wafer handling.
[0008] According to a first aspect of an embodiment of the present disclosure, a double-peak deceleration control method for liftpin lifting a wafer is provided, comprising:
[0009] Divide the movement path of the liftpin from the starting up position to the target down position into a slow speed area, a first normal speed area, and a second normal speed area;
[0010] In the first normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency;
[0011] In the slow speed area, the Liftpin runs at a slow speed to ensure that the wafer can land smoothly on the robot arm during the descent process or to ensure that the Liftpin can lift the wafer steadily, thereby effectively avoiding position displacement or damage caused by vibration or impact;
[0012] In the second normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency.
[0013] In one embodiment, the position where the lift pin first contacts the wafer during the descent process is used as the reference transfer position, and the first distance upward from this reference transfer position is marked as Uptodownupper, and the second distance downward is marked as Uptodownlower, and the area between Uptodownupper and Uptodownlower is the slow area.
[0014] In one embodiment, the first normal speed area is located above the slow speed area, and the second normal speed area is located below the slow speed area.
[0015] In one embodiment, when the wafer position is higher than or equal to the up position, the lift pin moves in the first normal speed area with the up position as the starting point and Uptodownupper as the end point.
[0016] In one of the embodiments, a first deceleration area is obtained, which is above the Uptodownupper position. When the liftpin enters the first deceleration area, it decelerates until it reaches the Uptodownupper position, which just drops to the slow speed area speed; then the liftpin moves in the slow speed area with the Uptodownupper position as the starting point and the Uptodownlower position as the end point, ensuring that the wafer can be placed stably and accurately on the robot arm; finally, the liftpin moves in the second normal speed area with the Uptodownlower position as the starting point and the down position as the end point, and returns to the PAD.
[0017] In one embodiment, when the wafer position is lower than or equal to the down position, the lift pin moves in the second normal speed area starting from the down position and ending at Uptodownlower.
[0018] In one of the embodiments, a second deceleration area is obtained, which is below the Uptodownlower position. When the liftpin enters the second deceleration area, it decelerates until it reaches the Uptodownlower position, which just drops to the slow speed area speed; then the liftpin moves in the slow speed area with the Uptodownlower position as the starting point and the Uptodownupper position as the end point, ensuring that the liftpin can lift the wafer smoothly; finally, the liftpin moves in the first normal speed area with the Uptodownupper position as the starting point and the up position as the end point.
[0019] According to a second aspect of an embodiment of the present disclosure, a double-peak deceleration control system for liftpin lifting wafer is provided, comprising:
[0020] An area division module divides the moving path of the liftpin from the starting up position to the target down position into a slow speed area, a first normal speed area, and a second normal speed area;
[0021] In the first normal speed zone module, the Liftpin runs at a preset normal speed to meet the needs of production efficiency;
[0022] In the slow zone module, the Liftpin runs at a slow speed to ensure that the wafer can land smoothly on the robot arm during the descent process or that the Liftpin can lift the wafer steadily, thereby effectively avoiding position displacement or damage caused by vibration or impact;
[0023] In the second normal speed zone module, the Liftpin runs at a preset normal speed to meet the needs of production efficiency.
[0024] According to a third aspect of an embodiment of the present disclosure, an electronic device is provided, including a memory, a processor, and a computer program stored and running on the memory, wherein when the processor executes the program, a double-peak deceleration control method for liftpin lifting wafer is implemented.
[0025] According to a fourth aspect of an embodiment of the present disclosure, a computer-readable storage medium is provided, on which a computer program is stored. When the program is executed by a processor, the double-peak deceleration control method for liftpin lifting wafer is implemented.
[0026] Compared with the prior art, the above technical solution adopted by the present invention has the following advantages: 1) The present invention realizes precise control of the lifting speed of the liftpin. Compared with the traditional direct drive method, it effectively avoids the vibration or shaking problems caused by excessive speed, thereby significantly improving the accuracy and stability of wafer processing.
[0027] 2) During the wafer lifting process, the present invention can effectively absorb the impact force generated, greatly reducing the risk of damage to the wafer surface, which is of vital importance for protecting expensive wafer materials.
[0028] 3) It can accurately capture key parameters such as position and speed during the wafer lifting process, realize precise control and timely adjustment of the wafer lifting state, and further enhance the processing accuracy and stability. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The drawings in the specification, which constitute a part of the present application, are used to provide further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.
[0030] Figure 1 Schematic diagram of the distribution of key positions involved in this method;
[0031] Figure 2 It is the actual position curve of Wafer and the actual speed curve of Wafer. DETAILED DESCRIPTION
[0032] The present disclosure is further described below in conjunction with the accompanying drawings and embodiments.
[0033] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.
[0034] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.
[0035] It should be noted that the flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the methods and systems according to various embodiments of the present disclosure. It should be noted that each box in the flowchart or block diagram can represent a module, a program segment, or a part of a code, and the module, program segment, or a part of a code may include one or more executable instructions for implementing the logical functions specified in each embodiment. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, or they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the flowchart and / or block diagram, and the combination of boxes in the flowchart and / or block diagram can be implemented using a dedicated hardware-based system that performs a specified function or operation, or can be implemented using a combination of dedicated hardware and computer instructions.
[0036] Embodiment 1:
[0037] In view of the problem that the speed control is not accurate and the acceleration change is large when the liftpin lifts the wafer in the semiconductor manufacturing process, which causes the wafer to vibrate, deflect or even be damaged, this embodiment provides a double-peak deceleration control method when the liftpin lifts the wafer, including the following steps:
[0038] Divide the movement path of the liftpin from the starting up position to the target down position into a slow speed area, a first normal speed area, and a second normal speed area;
[0039] Specifically, the position where the wafer first contacts the robot arm during the liftpin's descent is used as the reference transfer position. The first distance upward (for example, 2.5 mm) from this reference transfer position is marked as Uptodownupper, and the second distance downward (for example, 1.1 mm) is marked as Uptodownlower. The area between Uptodownupper and Uptodownlower (for example, 3.6 mm) is the slow area.
[0040] like Figure 1 As shown, the first normal speed area is located above the slow speed area, and the second normal speed area is located below the slow speed area.
[0041] In the first normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency;
[0042] Specifically, when the Wafer position is higher than or equal to the up position, the Liftpin starts from the up position and ends at Uptodownupper, and moves within the first normal speed area. When the Wafer position is lower than or equal to the down position, the Liftpin starts from the Uptodownupper position and ends at the up position, and moves within the first normal speed area; the Wafer position in this embodiment can be obtained by a position sensor;
[0043] In the slow speed area, the Liftpin runs at a slow speed to ensure that the wafer can land smoothly on the robot arm during the descent process or to ensure that the Liftpin can lift the wafer steadily, thereby effectively avoiding position displacement or damage caused by vibration or impact;
[0044] Specifically, Figure 2 As shown, when the wafer position is higher than or equal to the up position, the first deceleration area is obtained, and the first deceleration area is above the Uptodownupper position. When the liftpin enters the first deceleration area, it decelerates until it reaches the Uptodownupper position and just drops to the slow speed area speed; then the liftpin takes the Uptodownupper position as the starting point and the Uptodownlower position as the end point, and moves in the slow speed area to ensure that the wafer can be placed on the robot arm stably and accurately;
[0045] When the Wafer position is lower than or equal to the down position, the second deceleration area is obtained, which is below the Uptodownlower position. When the Liftpin enters the second deceleration area, it decelerates until it reaches the Uptodownlower position, which just drops to the slow speed area speed; then the Liftpin moves in the slow speed area with the Uptodownlower position as the starting point and the Uptodownupper position as the end point, ensuring that the Liftpin can lift the Wafer smoothly; finally, the Liftpin moves in the first normal speed area with the Uptodownupper position as the starting point and the up position as the end point.
[0046] In this embodiment, based on the deceleration mechanism of Servo, the output torque can be changed by controlling the intensity of the electromagnetic field, thereby achieving precise control of the lifting speed of the Liftpin.
[0047] In the second normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency.
[0048] Specifically, when the Wafer position is lower than or equal to the down position, the Liftpin starts from the down position and ends at Uptodownlower, moving within the second normal speed area; when the Wafer position is higher than or equal to the up position, the Liftpin starts from the Uptodownlower position and ends at the down position, moving within the second normal speed area and returning to the PAD.
[0049] The present invention significantly improves the stability and accuracy of wafer handling through a refined speed adjustment mechanism, thereby ensuring high efficiency and high quality of the semiconductor manufacturing process.
[0050] Embodiment 2:
[0051] This embodiment provides a double-peak deceleration control system for liftpin lifting wafer, including:
[0052] An area division module divides the moving path of the liftpin from the starting up position to the target down position into a slow speed area, a first normal speed area, and a second normal speed area;
[0053] In the first normal speed zone module, the Liftpin runs at a preset normal speed to meet the needs of production efficiency;
[0054] In the slow zone module, the Liftpin runs at a slow speed to ensure that the wafer can land smoothly on the robot arm during the descent process or that the Liftpin can lift the wafer steadily, thereby effectively avoiding position displacement or damage caused by vibration or impact;
[0055] In the second normal speed zone module, the Liftpin runs at a preset normal speed to meet the needs of production efficiency.
[0056] This system can be widely used in various wafer handling systems in the field of semiconductor manufacturing, such as wafer processing machines, inspection machines, storage cabinets and other equipment. By improving the stability and accuracy of the wafer lifting process, the reliability and yield of the semiconductor manufacturing process can be significantly improved, and production costs and maintenance costs can be reduced.
[0057] Embodiment three:
[0058] An electronic device includes a memory, a processor, and a computer program stored and running on the memory, wherein the processor implements the above-mentioned double-peak deceleration control method for liftpin lifting wafer when executing the program, including:
[0059] Divide the movement path of the liftpin from the starting up position to the target down position into a slow speed area, a first normal speed area, and a second normal speed area;
[0060] In the first normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency;
[0061] In the slow speed area, the Liftpin runs at a slow speed to ensure that the wafer can land smoothly on the robot arm during the descent process or to ensure that the Liftpin can lift the wafer steadily, thereby effectively avoiding position displacement or damage caused by vibration or impact;
[0062] In the second normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency.
[0063] Embodiment 4:
[0064] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the above-mentioned double-peak deceleration control method for liftpin lifting wafer, including:
[0065] Divide the movement path of the liftpin from the starting up position to the target down position into a slow speed area, a first normal speed area, and a second normal speed area;
[0066] In the first normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency;
[0067] In the slow speed area, the Liftpin runs at a slow speed to ensure that the wafer can land smoothly on the robot arm during the descent process or to ensure that the Liftpin can lift the wafer steadily, thereby effectively avoiding position displacement or damage caused by vibration or impact;
[0068] In the second normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency.
[0069] The present invention can effectively slow down the speed change of the liftpin during the lifting process, reduce the impact of acceleration changes on the wafer, and thus improve the stability of wafer handling. By accurately controlling the lifting speed of the liftpin, it is ensured that the wafer maintains a precise position and posture during the handling process, thereby improving the process accuracy. Since the mechanical impact and damage caused by the sudden change in speed are reduced, the yield of the semiconductor manufacturing process is significantly improved.
[0070] Those skilled in the art should understand that the modules or steps of the present disclosure can be implemented by a general-purpose computer device, or alternatively, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. The present disclosure is not limited to any specific combination of hardware and software.
[0071] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
[0072] Although the above describes the specific implementation methods of the present disclosure in conjunction with the accompanying drawings, it is not intended to limit the scope of protection of the present disclosure. Technical personnel in the relevant field should understand that on the basis of the technical solution of the present disclosure, various modifications or variations that can be made by those skilled in the art without creative work are still within the scope of protection of the present disclosure.
Claims
1. A double-peak deceleration control method for liftpin lifting wafer, characterized in that: include: Divide the movement path of the liftpin from the starting up position to the target down position into a slow speed area, a first normal speed area, and a second normal speed area; In the first normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency; In the slow speed area, the Liftpin runs at a slow speed to ensure that the wafer can land smoothly on the robot arm during the descent process or to ensure that the Liftpin can lift the wafer steadily, thereby effectively avoiding position displacement or damage caused by vibration or impact; In the second normal speed area, the Liftpin runs at a preset normal speed to meet the needs of production efficiency.
2. According to claim 1, a double-peak deceleration control method for liftpin lifting wafer, characterized in that: The position where the wafer first contacts the robot arm during the liftpin's descent is taken as the reference transfer position. The first distance upward from this reference transfer position is marked as Uptodownupper, and the second distance downward is marked as Uptodownlower. The area between Uptodownupper and Uptodownlower is the slow area.
3. According to claim 1, a double-peak deceleration control method for liftpin lifting wafer, characterized in that: The first normal speed area is located above the slow speed area, and the second normal speed area is located below the slow speed area.
4. According to claim 2, a double-peak deceleration control method for liftpin lifting wafer, characterized in that: When the Wafer position is higher than or equal to the up position, the Liftpin moves in the first normal speed area with the up position as the starting point and Uptodownupper as the end point.
5. According to claim 4, a double-peak deceleration control method for liftpin lifting wafer, characterized in that: Get the first deceleration area, which is above the Uptodownupper position. When the Liftpin enters the first deceleration area, it decelerates until it reaches the Uptodownupper position, which is just the speed of the slow area. Then the Liftpin moves in the slow area with the Uptodownupper position as the starting point and the Uptodownlower position as the end point, ensuring that the Wafer can be placed on the robot arm steadily and accurately. Finally, the Liftpin moves in the second normal speed area with the Uptodownlower position as the starting point and the down position as the end point, and returns to the PAD.
6. According to claim 2, a double-peak deceleration control method for liftpin lifting wafer, characterized in that: When the Wafer position is lower than or equal to the down position, the Liftpin moves in the second normal speed area with the down position as the starting point and Uptodownlower as the end point.
7. According to claim 6, a double-peak deceleration control method for liftpin lifting wafer, characterized in that: Get the second deceleration area, which is below the Uptodownlower position. When the Liftpin enters the second deceleration area, it decelerates until it reaches the Uptodownlower position, which is just the speed of the slow area. Then the Liftpin moves in the slow area with the Uptodownlower position as the starting point and the Uptodownupper position as the end point, ensuring that the Liftpin can lift the Wafer smoothly. Finally, the Liftpin moves in the first normal speed area with the Uptodownupper position as the starting point and the up position as the end point.
8. A double-peak deceleration control system for liftpin lifting wafer, characterized in that: include: An area division module divides the moving path of the liftpin from the starting up position to the target down position into a slow speed area, a first normal speed area, and a second normal speed area; In the first normal speed zone module, the Liftpin runs at a preset normal speed to meet the needs of production efficiency; In the slow zone module, the Liftpin runs at a slow speed to ensure that the wafer can land smoothly on the robot arm during the descent process or that the Liftpin can lift the wafer steadily, thereby effectively avoiding position displacement or damage caused by vibration or impact; In the second normal speed zone module, the Liftpin runs at a preset normal speed to meet the needs of production efficiency.
9. An electronic device, comprising a memory, a processor and a computer program stored and running on the memory, wherein when the processor executes the program, the double-peak deceleration control method for liftpin lifting wafer as described in any one of claims 1-7 is implemented.
10. A computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the double-peak deceleration control method for lift pin lifting wafer as described in any one of claims 1-7.