Wafer jacking device and semiconductor equipment applying same

Abstract

The invention discloses a wafer jacking device and semiconductor equipment applying the same, the wafer jacking device is used for matching with a through hole in a heating plate, the wafer jacking device comprises an ejector pin, a connecting piece and a heavy hammer, the connecting piece is located in the heavy hammer, one end of the ejector pin is inserted into the heavy hammer and is matched with the connecting piece, and the other end of the ejector pin can be inserted into the through hole; the side face of the ejector pin is provided with an edge cutting structure. According to the edge cutting structure, the gap between the ejector pin and the through hole can be increased, so that the ejector pin and the through hole are prevented from being clamped, and the original arc-shaped edge has a good guiding effect, so that the heating disc cannot incline when moving up and down along the ejector pin. According to the wafer jacking device provided by the invention, on the basis of ensuring that the general structure of the ejector pin is cylindrical, the gap between the through hole and the ejector pin is increased to the maximum extent through edge cutting, and the problems that a traditional wafer jacking device is prone to being stuck with the through hole in the heating disc, and the wafer jacking device is prone to damage are solved. And thus, the whole semiconductor device stops working.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer lifting device and semiconductor equipment using the same. Background Art

[0002] Wafer refers to the round silicon piece or substrate used in semiconductor process, also known as silicon wafer or liner. It is the basic material for manufacturing integrated circuits. Wafers are generally made of single-crystal silicon materials with a very flat surface. The process of manufacturing wafers is called wafer manufacturing or semiconductor manufacturing, which involves multiple process steps, such as wafer growth, cutting, polishing and cleaning. On the wafer, various components and layers of integrated circuits can be manufactured through process steps such as lithography, thin film deposition, ion implantation, diffusion and metal deposition. Multiple chips can be manufactured on a wafer. Through cutting and packaging, each chip is used as an independent product. Wafer manufacturing is a crucial step in the semiconductor industry, affecting the quality, efficiency and cost of integrated circuits.

[0003] In the wafer manufacturing process, there is a step that requires the wafer to be lifted by a wafer lifting device to separate the wafer from the heating plate. During the lifting process, the wafer lifting device needs to pass through the heating plate to lift the wafer on the heating plate. However, when the levelness of the heating plate is not enough or when a certain amount of process film has accumulated on the lifting device, the wafer lifting device is prone to get stuck with the through hole on the heating plate during the process of cooperating with the heating plate, causing the entire semiconductor equipment to stop working and causing time loss. Summary of the invention

[0004] The embodiments of the present invention provide a wafer lifting device and a semiconductor device using the same, which solve the technical problem that a conventional wafer lifting device is easily stuck with a through hole on a heating plate, thereby causing the entire semiconductor device to stop working.

[0005] In order to solve the above problems, according to one aspect of the present application, an embodiment of the present invention provides a wafer lifting device, which is used to cooperate with a through hole on a heating plate, and includes a ejector pin, a connecting piece and a weight, wherein the connecting piece is located in the weight, one end of the ejector pin is inserted into the weight and cooperates with the connecting piece, and the other end of the ejector pin can be inserted into the through hole; wherein the side surface of the ejector pin has a trimming structure to increase the gap between the ejector pin and the through hole.

[0006] In some embodiments, the top of the ejector pin is an arc-shaped structure.

[0007] In some embodiments, the connector is a snap ring, which is at least a portion of a circular ring.

[0008] In some embodiments, a fitting hole is provided in the weight, and a snap-fit ​​groove is provided on the inner wall of the fitting hole along the circumferential direction. When the connecting member is arranged in the fitting hole, the top end thereof can be snap-fitted in the snap-fit ​​groove.

[0009] In some embodiments, the inner wall of the connector has a protrusion, and the outer surface of the ejector pin has a groove. When one end of the ejector pin is matched with the connector, the protrusion can be snapped into the groove.

[0010] In some embodiments, the lower section of the ejector pin is an arc structure, wherein the lower section is the portion of the ejector pin located inside the connector.

[0011] In some embodiments, the weight includes a first columnar structure and a second columnar structure that are concentrically arranged up and down, and the cross-sectional diameter of the second columnar structure is larger than the cross-sectional diameter of the first columnar structure to lower the center of gravity of the weight.

[0012] In some embodiments, the wafer lifting device further includes a blowing assembly, which is disposed at the bottom of the weight and is capable of blowing out gas through the upper end surface of the weight.

[0013] In some embodiments, the upper end surface of the weight is recessed inward to form a first annular concave surface, and the lower end surface of the weight is recessed inward to form a second annular concave surface; the blowing assembly includes an air path channel and an air hole, and the air path channel extends from the second annular concave surface to the first annular concave surface and is connected to the air hole opened on the first annular concave surface.

[0014] According to another aspect of the present application, an embodiment of the present invention provides a semiconductor device, which includes a heating plate and the above-mentioned wafer lifting device, wherein the wafer lifting device is located below the heating plate, and when the heating plate moves downward, the ejector pin can pass through the through hole on the heating plate and lift the wafer on the heating plate.

[0015] Compared with the prior art, the wafer lifting device of the present invention has at least the following beneficial effects:

[0016] The wafer lifting device provided by the present invention is used to cooperate with the through hole on the heating plate, and the wafer lifting device includes a ejector pin, a connecting piece and a weight, the connecting piece is located in the weight, one end of the ejector pin is inserted into the weight and cooperates with the connecting piece, and the other end of the ejector pin can be inserted into the through hole; wherein the side surface of the ejector pin has a trimming structure to increase the gap between the ejector pin and the through hole.

[0017] The side of the ejector pin in the present invention has a trimming structure, that is, along the axial direction of the columnar structure, the ejector pin has a flat edge, which is equivalent to cutting off a portion along the axial direction. In this structure, the flat edge can increase the gap between the ejector pin and the through hole to avoid the ejector pin and the through hole from getting stuck, and the original arc edge has a good guiding effect, which prevents the heating plate from tilting when moving up and down along the ejector pin. That is to say, in the wafer lifting device provided by the present invention, on the basis of ensuring that the general structure of the ejector pin is cylindrical, the gap between the through hole and the ejector pin is increased to the maximum extent by trimming, thereby solving the technical problem of the traditional wafer lifting device being easily stuck with the through hole on the heating plate, which then causes the entire semiconductor device to stop working.

[0018] The semiconductor device provided by the present invention is designed based on the above-mentioned wafer lifting device. Its beneficial effects refer to the beneficial effects of the above-mentioned wafer lifting device, which will not be described in detail here.

[0019] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0021] Figure 1 is a cross-sectional view of a wafer lifting device provided by an embodiment of the present invention;

[0022] Figure 2 yes Figure 1 Cross-sectional view along AA direction;

[0023] Figure 3 It is a front view of a wafer lifting device provided by an embodiment of the present invention;

[0024] Figure 4 It is a structural schematic diagram of a wafer lifting device provided by an embodiment of the present invention;

[0025] Figure 5 It is a schematic structural diagram of a ejector pin in a wafer lifting device provided by an embodiment of the present invention;

[0026] Figure 6 yes Figure 5 A partial enlarged view of point B in the middle;

[0027] Figure 7It is a structural schematic diagram of a connecting member in a wafer lifting device provided by an embodiment of the present invention;

[0028] Figure 8 is a bottom view of a wafer lifting device provided by an embodiment of the present invention;

[0029] Fig. 9 It is a structural schematic diagram of a Chinese weight hammer of a wafer lifting device provided by an embodiment of the present invention;

[0030] Fig.10 It is a cross-sectional view of a Chinese weight hammer of a wafer lifting device provided by an embodiment of the present invention;

[0031] Fig.11 is a partial cross-sectional view of a semiconductor device provided by an embodiment of the present invention;

[0032] Fig.12 yes Fig.11 A partial enlarged view of point C in the middle;

[0033] Reference numerals:

[0034] 1. Ejector pin; 11. Groove; 12. Trimming structure; 2. Connector; 21. Protrusion; 3. Weight; 31. First columnar structure; 32. Second columnar structure; 33. First annular concave surface; 34. Second annular concave surface; 35. Matching hole; 36. Snap-in groove; 4. Blowing assembly; 41. Air passage; 42. Air hole; 5. Heating plate. DETAILED DESCRIPTION

[0035] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0036] In the description of the present invention, it should be clarified that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, but are not necessarily used to describe a specific order or sequence; the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, and do not mean that the referred device or element must have a specific direction or position, and therefore cannot be understood as a limitation on the present invention.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the process of semiconductor processing equipment processing wafers, the wafer to be processed is transferred to the reaction chamber by the robot arm, the ejector pin rises to support the wafer to be processed, and then the ejector pin descends to place the wafer to be processed on the electrostatic chuck, ready to process the wafer. The processed wafer is lifted up again by the ejector pin, and the processed wafer is transferred out of the reaction chamber by the robot arm. Usually three to four ejector pins are used to lift the wafer. During the lifting process, the ejector pin needs to pass through the heating plate to lift the wafer on the heating plate. When the levelness of the heating plate is not enough or when a certain process film has accumulated on the ejector pin, the ejector pin is easy to get stuck with the through hole on the heating plate during the cooperation with the heating plate, which causes the entire semiconductor equipment to stop working and cause time loss.

[0039] It can be seen that there are at least two reasons for the jamming of the ejector pin and the heating plate. One of them is that the heating plate is not level enough. For example, when the heating plate is tilted, the through hole on the heating plate will also be tilted, so that the through hole cannot cooperate well with the ejector pin, and the ejector pin is stuck in the through hole or even unable to pass through the through hole. The other is that a certain thickness of film accumulates on the ejector pin, which increases the diameter of the ejector pin, while the size of the through hole is fixed. Therefore, in this case, the ejector pin and the through hole may also be jammed.

[0040] In view of the above-mentioned problem, this embodiment mainly changes the structural shape of the ejector pin so that it will not be stuck with the through hole.

[0041] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0042] Example 1

[0043] This embodiment provides a wafer lifting device, such as Figure 1-Figure 10 As shown, the wafer lifting device is used to cooperate with the through hole on the heating plate, and the wafer lifting device includes a pin 1, a connector 2 and a weight 3, wherein the connector 2 is located in the weight 3, one end of the pin 1 is inserted into the weight 3 and cooperates with the connector 2, and the other end of the pin 1 can be inserted into the through hole; wherein the side surface of the pin 1 has a trimming structure 12 to increase the gap between the pin 1 and the through hole.

[0044] The general outline of the ejector pin 1 is a cylindrical structure with a certain height. The weight 3 is also a columnar structure, but its height is changed. The inside of the weight 3 has a cavity. The connecting piece 2 is arranged in the cavity, which is mainly used to connect the ejector pin 1 and the weight 3. The wafer lifting device in this embodiment cooperates with the heating plate. The heating plate is a circular structure, which is arranged in the vacuum chamber. There is a wafer or a film on the upper surface of the heating plate, and the heating plate can move up and down. At the bottom of the vacuum chamber, located below the heating plate, a plurality of wafer lifting devices are evenly distributed along the circumference. In the initial state, there is a certain distance between the heating plate and the ejector pin 1 of the wafer lifting device. As the process proceeds, when the heating plate moves downward, the ejector pin 1 can pass through the through hole on the heating plate to lift the wafer or film on the heating plate.

[0045] In this embodiment, the side surface of the ejector pin 1 has a trimming structure 12, such as Figure 6 As shown. Specifically, the ejector pin 1 is a columnar structure with a certain height, and its outer surface should be arc-shaped, but in the present embodiment, the ejector pin 1 has a flat edge along the axial direction of the columnar structure, which is equivalent to cutting off a portion along the axial direction. Preferably, the ejector pin 1 has two cut edges arranged at intervals, so that a flat edge and an arc edge are formed on the outer surface of the ejector pin 1 at intervals. In this structure, the flat edge can increase the gap between the ejector pin 1 and the through hole to avoid the ejector pin and the through hole from getting stuck, while the arc edge has a good guiding effect, which prevents the heating plate from tilting when moving up and down along the ejector pin 1. That is to say, in the wafer lifting device provided in the present embodiment, on the basis of ensuring that the general structure of the ejector pin 1 is cylindrical, the gap between the through hole and the ejector pin 1 is increased to the maximum extent by cutting the edges, thereby solving the technical problem that the conventional wafer lifting device is easily stuck with the through hole on the heating plate, thereby causing the entire semiconductor device to stop working.

[0046] In a specific embodiment, Figure 5 As shown, the top of the ejector pin 1 is an arc-shaped structure.

[0047] The wafer plays a vital role in the semiconductor manufacturing process. As the basic material of semiconductor equipment, it provides a reliable carrier. Various types of semiconductor devices can be manufactured on the wafer, such as integrated circuits, optoelectronic devices, power devices, etc. It is a bridge connecting the semiconductor chip and the external circuit, and can effectively transmit signals between the semiconductor device and the outside world. Therefore, parameters such as the quality, performance and precision of the wafer are crucial. In traditional wafer lifting devices, the top of the ejector pin 1 is generally not specially processed, and it has edges and corners, which may damage the wafer shape. In this embodiment, the top of the ejector pin 1 is designed as an arc structure. Compared with the edges and corners, the arc structure is smoother, which can avoid scratches on the wafer.

[0048] In addition, in order to make the wafer have a larger force-bearing area, the arc structure can have a larger area. For example, it can be extended outward along the edge of the ejector pin 1, and then a layer of arc structure is added on the top of the ejector pin 1. This ensures that the wafer will not be scratched and increases the force-bearing area of ​​the wafer.

[0049] In a specific embodiment, the connecting member 2 is a snap ring, and the snap ring is at least a portion of a circular ring, such as Figure 7 As shown. The connecting member 2 is mainly used to connect the ejector pin 1 and the weight 3. The connecting member 2 in this embodiment is a snap ring, which is at least a part of a circular ring. Specifically, the snap ring can be a whole circular ring. In this way, the circular ring is set in the weight 3, and then one end of the ejector pin 1 is set in the circular ring to achieve the connection between the ejector pin 1 and the weight 3. In addition, the snap ring can also be a part of a circular ring, such as one-third of a circular ring or one-half of a circular ring, which can not only save costs but also make installation more convenient. Regardless of whether it is the entire circular ring or a part of the circular ring, the snap ring needs to have a certain height to prevent the ejector pin 1 from shaking.

[0050] In a specific embodiment, Fig.10 As shown, a fitting hole 35 is provided in the weight 3 , and a snap-fit ​​groove 36 is provided on the inner wall of the fitting hole 35 along the circumferential direction. When the connecting member 2 is arranged in the fitting hole 35 , its top end can be snap-fitted in the snap-fit ​​groove 36 .

[0051] The matching hole 35 is a columnar structure and runs through the height direction of the weight 3, and is used to fix the ejector pin 1. In this solution, the connection between the ejector pin 1 and the weight 3 relies on the connector 2, so the connector 2 is set in the matching hole 35. At a certain height of the matching hole 35, a snap-in groove 36 is set. When the connector 2 is a whole ring, a circle of snap-in grooves 36 are set along the circumference of the matching hole 35. When the connector 2 is a partial ring, the snap-in groove 36 is not a whole circle. During assembly, the connector 2 is inserted into the matching hole 35 from the bottom. When the top of the connector 2 abuts against the groove wall above the snap-in groove 36, it is proved that the assembly is in place.

[0052] In a specific embodiment, Figure 7 As shown, the inner wall of the connecting member 2 has a protrusion 21, and the outer surface of the ejector pin 1 has a groove 11. When one end of the ejector pin 1 cooperates with the connecting member 2, the protrusion 21 can be snapped into the groove 11. Specifically, when the connecting member 2 is a whole ring, the groove 11 on the outer surface of the ejector pin 1 is also a whole circle. When the connecting member 2 is a half ring, the groove 11 on the outer surface of the ejector pin 1 is also a half circle. In this embodiment, the matching of the connecting member 2 and the ejector pin 1 is achieved through the matching of the protrusion 21 and the groove 11.

[0053] That is to say, the connector 2 is located between the matching hole 35 of the ejector pin 1 and the weight 3; in order to achieve the matching between the connector 2 and the weight 3, the hole wall of the matching hole 35 is provided with a snap-in groove 36, so that the top of the connector 2 can abut against the groove wall of the snap-in groove 36 located above, and the connection between the connector 2 and the weight 3 is achieved through this matching method. In order to achieve the matching between the connector 2 and the ejector pin 1, the inner surface of the connector 2 has a protrusion 21, and the outer surface of the ejector pin 1 has a groove 11. When one end of the ejector pin 1 is matched with the connector 2, the protrusion 21 can be snap-fitted into the groove 11, and the connection between the connector 2 and the ejector pin 1 is achieved through this matching method.

[0054] In a specific embodiment, the lower section of the ejector pin 1 is an arc structure, wherein the lower section is the portion of the ejector pin 1 located inside the connector 2. When the ejector pin 1 is matched with the connector 2, the outer surface of the portion located inside the connector 2 is an arc structure, that is, the connection between the lower section of the lower section of the ejector pin 1 and the connector 2 and the weight 3 is designed with an arc transition, which can minimize the stress mutation point.

[0055] In a specific embodiment, the weight 3 includes a first columnar structure 31 and a second columnar structure 32 which are concentrically arranged up and down, and the cross-sectional diameter of the second columnar structure 32 is larger than the cross-sectional diameter of the first columnar structure 31, so as to lower the center of gravity of the weight 3. The matching hole 35 passes through the first columnar structure 31 and the second columnar structure 32. In the prior art, whether it is an active or passive lifting device, the contact position between the weight 3 and the bottom driving mechanism is mostly point contact or surface contact with a small contact surface angle. In this embodiment, the weight 3 adopts a design of being narrow at the top and wide at the bottom, and the bottom is contacted through the second columnar structure 32. The second columnar structure 32 not only has a large area, but also has a large overall mass, so that the center of gravity of the entire wafer lifting device is lower, not easy to tilt, and more stable.

[0056] In a specific embodiment, the wafer lifting device further includes a blowing assembly 4, which is disposed at the bottom of the weight 3 and can blow out gas through the upper end surface of the weight 3. During the wafer cleaning process, the blowing assembly 4 works synchronously, which can reduce the probability of aluminum fluoride formation during cleaning and extend the service life of the ejector pin 1.

[0057] In a specific embodiment, the upper end surface of the weight 3 is recessed inward to form a first annular concave surface 33, and the lower end surface of the weight 3 is recessed inward to form a second annular concave surface 34; the blowing assembly 4 includes an air path channel 41 and an air hole 42, and the air path channel 41 extends from the second annular concave surface 34 to the first annular concave surface 33, and is connected to the air hole 42 opened on the first annular concave surface 33.

[0058] Specifically, the upper end surface of the first columnar structure 31 is provided with a matching hole 35 extending downward, and the outer surface of the matching hole 35 is bent upward after extending radially outward, and a first annular concave surface 33 is formed between the bent portion and the outer surface of the matching hole 35. A circle of grooves is provided on the lower end surface of the second columnar structure 32, and the groove is the second annular concave surface 34 mentioned above. The blowing assembly 4 includes an air path channel 41 and an air hole 42. After the air path channel 41 extends from the second annular concave surface 34 to the first annular concave surface 33, it is connected with the air hole 42 provided on the first annular concave surface 33. In the specific working process, the external air source blows the gas medium to the ejector pin 1 through the air path channel 41 and the air hole 42 in turn, reducing the probability of aluminum fluoride formation.

[0059] The operation of the wafer lifting device provided in this embodiment includes the following stages:

[0060] Initial position; when the semiconductor device is not in process, there is a gap between the wafer lifting device and the heating plate 5;

[0061] Lifting process: When the semiconductor equipment is in process, the heating plate 5 changes its relative position with the wafer lifting device by descending, thereby achieving wafer transmission and corresponding process GAP requirements;

[0062] Falling back process: When the wafer is removed, the heating plate 5 rises to the corresponding Clean preset position. Make sure that all the ejector pins are on the back of the heating plate, that is, they are separated from the through holes of the heating plate 5;

[0063] In the cleaning process, the air blowing component 4 starts to work and then cleans.

[0064] In the wafer lifting device provided in this embodiment, the top of the ejector pin 1 is in a semicircular arc shape (i.e., the arc structure mentioned above), which is used to directly contact the wafer. This embodiment uses point contact to minimize the loss of foreign objects to the wafer. Its main structure is a trimming design, which maximizes the gap between the through hole of the heating plate and the cylindrical ejector pin 1. To prevent the ejector pin 1 from being covered by the semiconductor process film for too long a time, causing its diameter to increase and get stuck during the lifting process. The bottom of the ejector pin 1 and the connection between the connector 2 and the weight 3 use an arc transition design to minimize the stress mutation point. The connector 2 is a semicircular arc structure, and its main function is to connect the ejector pin 1 and the weight 3 to prevent the wafer lifting device from decomposing during the lifting process. The weight 3 adopts a narrow upper and wide lower design, with a large bottom contact area and a large overall mass, so that the center of gravity of the entire wafer lifting mechanism is low, not easy to tilt, and more stable. The blowing assembly 4 is composed of a circle of dense air channels 41 and air holes 42. During the process of Clean, the uniform air holes 42 on the weight 3 will form a gas protection layer around the ejector pin 1, thereby preventing the formation of ALF.

[0065] Example 2

[0066] This embodiment provides a semiconductor device, such as Fig.11 and Fig.12 As shown, the semiconductor device includes a heating plate 5 and the wafer lifting device described in Example 1, wherein the wafer lifting device is located below the heating plate 5. When the heating plate 5 moves downward, the ejector pin 1 can pass through the through hole on the heating plate 5 and lift up the wafer on the heating plate 5.

[0067] The semiconductor device provided in this embodiment adopts the wafer lifting device in Embodiment 1. Since the ejector pins in the wafer lifting device have a trimming structure 12, the gap between the through hole of the heating plate 5 and the ejector pin 1 is maximized through trimming, thereby solving the technical problem of the traditional wafer lifting device being easily stuck with the through hole on the heating plate, thereby causing the entire semiconductor device to stop working.

[0068] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A wafer lifting device, characterized in that: The wafer lifting device is used to cooperate with the through hole on the heating plate, and the wafer lifting device includes a ejector pin, a connecting piece and a weight. The connecting piece is located in the weight, one end of the ejector pin is inserted into the weight and cooperates with the connecting piece, and the other end of the ejector pin can be inserted into the through hole; wherein the side surface of the ejector pin has a trimming structure to increase the gap between the ejector pin and the through hole.

2. The wafer lifting device according to claim 1, characterized in that: The top end of the ejector pin is an arc-shaped structure.

3. The wafer lifting device according to claim 1, characterized in that: The connecting member is a snap ring, and the snap ring is at least a part of a circular ring.

4. The wafer lifting device according to claim 1, characterized in that: A matching hole is provided in the weight, and a clamping groove is provided on the inner wall of the matching hole along the circumferential direction. When the connecting member is arranged in the matching hole, the top end of the connecting member can be clamped in the clamping groove.

5. The wafer lifting device according to claim 1, characterized in that: The inner wall of the connecting piece has a protrusion, and the outer surface of the ejector pin has a groove. When one end of the ejector pin is matched with the connecting piece, the protrusion can be clamped in the groove.

6. The wafer lifting device according to claim 1, characterized in that: The lower section of the ejector pin is an arc structure, wherein the lower section is the portion of the ejector pin located inside the connector.

7. The wafer lifting device according to claim 1, characterized in that: The weight includes a first columnar structure and a second columnar structure which are concentrically arranged up and down. The cross-sectional diameter of the second columnar structure is larger than the cross-sectional diameter of the first columnar structure so as to lower the center of gravity of the weight.

8. The wafer lifting device according to any one of claims 4 to 7, characterized in that: The wafer lifting device also includes a blowing assembly, which is arranged at the bottom of the heavy hammer and can blow out gas through the upper end surface of the heavy hammer.

9. The wafer lifting device according to claim 8, characterized in that: The upper end surface of the weight is recessed inward to form a first annular concave surface, and the lower end surface of the weight is recessed inward to form a second annular concave surface; the blowing assembly includes an air path channel and an air hole, and the air path channel extends from the second annular concave surface to the first annular concave surface and is connected to the air hole opened on the first annular concave surface.

10. A semiconductor device, characterized in that: The semiconductor device includes a heating plate and a wafer lifting device according to any one of claims 1 to 9, wherein the wafer lifting device is located below the heating plate, and when the heating plate moves downward, the ejector pin can pass through the through hole on the heating plate and lift up the wafer on the heating plate.

Images