Integrated circuit packaging structure for multi-chip packaging

Abstract

The present invention proposes an integrated circuit packaging structure for multi-chip packaging, which relates to the field of chip packaging technology, including a packaging box, a plurality of chip mounting slots are arranged at intervals on one side of the packaging box, pin mounting slots are provided on both sides of the bottom of the chip mounting slot, and a filling sheet is provided in the pin mounting slot, the filling sheet can fill the pin mounting slot, and the top surface of the filling sheet is flush with the bottom inner wall of the chip mounting slot, and the inner walls on both sides of the chip mounting slot are provided with a storage slot, and the filling sheet can be received in the storage slot; a compression strip is installed in the storage slot. The present invention proposes an integrated circuit packaging structure for multi-chip packaging, which ensures the disassembly of the chip and reduces the jamming during the disassembly and assembly process by providing a packaging box, a filling sheet, a compression strip, a heat sink and an adjustment structure, and can also simultaneously complete the compression of the pins and the installation of the heat sink, reduce the installation and disassembly processes, improve work efficiency, and make the operation simple and convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to an integrated circuit packaging structure of a multi-chip package. Background Art

[0002] The integrated circuit packaging structure of multi-chip package is to integrate multiple integrated circuit chips (IC) in one package. This structure is usually used to improve integration, reduce costs, optimize performance and simplify system design; the integrated circuit packaging structure of multi-chip package (MCP) is to package multiple chips with different or the same functions together to form a powerful whole. These chips can be packaged with materials such as metal wires, ceramics or plastics to provide physical protection, heat dissipation channels and electrical connections. Specific packaging forms may include DIP (dual in-line package), PQFP / TQFP (quad flat package), BGA (ball grid array package), QFN (leadless quad flat package), etc. In multi-chip packaging, the connection between each chip is usually achieved through internal wiring, metal wire bonding or wireless connection technology. Packaging plays an important role for CPU and other LSI integrated circuits.

[0003] The existing packaging structure usually welds and installs multiple chips on a plane, which increases the installation area and occupies a large space. In addition, most chips are directly welded on the printed circuit board, and a soldering iron is required during disassembly and assembly, and flux may also be required, which requires the skills of the staff. Improper operation may also cause burns to the staff, causing the pins of other adjacent electronic components on the circuit board to be accidentally heated and desoldering. Summary of the invention

[0004] Based on the technical problems existing in the background technology, the present invention proposes an integrated circuit packaging structure of a multi-chip package.

[0005] The present invention provides an integrated circuit packaging structure for multi-chip packaging, comprising a packaging box, a plurality of chip mounting slots are arranged at intervals through one side of the packaging box, pin mounting slots are provided on both sides of the bottom of the chip mounting slot, a filling sheet is provided in the pin mounting slot, the filling sheet can fill the pin mounting slot, and the top surface of the filling sheet is flush with the bottom inner wall of the chip mounting slot, and the inner walls on both sides of the chip mounting slot are provided with receiving slots, and the filling sheet can be received in the receiving slots;

[0006] A compression strip is installed in the receiving groove, and the compression strip is used to compress the chip pins in the pin installation groove;

[0007] A heat sink is provided on the top of the chip slot, and the heat sink can be against the chip;

[0008] An adjustment structure is installed on the packaging box, and the adjustment structure can drive the filling piece to slide horizontally in the pin mounting groove. The adjustment structure can also drive the clamping strip to clamp and fix the pins on both sides of the chip in the pin mounting groove. The adjustment structure can also drive the heat sink to descend in the chip mounting groove and fit on the chip.

[0009] Preferably, the adjustment structure includes a sliding block, a guide rod and a gate-shaped driving member; the sliding block is slidably installed in the storage groove, the filling piece is fixedly installed on one side of the sliding block, the top of the guide rod is fixedly installed on the bottom of the sliding block, the bottom inner wall of the storage groove is provided with a linear groove that slidably cooperates with the guide rod, the side of the packaging box is provided with an adjustment groove that slidably cooperates with the gate-shaped driving member, the gate-shaped driving member is provided with a guide inclined groove, the guide rod slides in the guide inclined groove, the length direction of the guide inclined groove is inclined to the movement direction of the gate-shaped driving member, and the length direction of the guide inclined groove is inclined to the length direction of the linear groove.

[0010] Preferably, the adjustment structure also includes a shaft, a gear, an eccentric block and an arc-shaped rack; the shaft is rotatably installed in the storage groove, the gear is fixedly installed on the shaft, the axis of the gear coincides with the axis of the shaft, the gear is meshed with the sliding block, the eccentric block is fixedly installed on the shaft, the arc-shaped rack is fixedly installed on the side of the eccentric block away from the gear, and the clamping strip is fixedly installed on the end of the arc-shaped rack.

[0011] Preferably, the adjustment structure further includes a bevel drive block; the bevel drive block is slidably installed in the storage groove, the bevel drive block is meshed with the arc-shaped rack, and the two sides of the top surface of the heat sink are respectively slidably matched with the bevels of the two bevel drive blocks.

[0012] Preferably, a limit frame is fixedly installed in the chip mounting slot, and a lifting slot is penetrated through the limit frame to be slidably matched with the heat sink, and the heat sink is slidably installed in the lifting slot;

[0013] A lifting and resetting component is installed on the heat sink, and the lifting and resetting component is used to drive the heat sink to lift and reset on the limit frame.

[0014] Preferably, the lifting and resetting member includes a V-shaped elastic member; welding grooves are provided on both sides of the heat sink, one side of the V-shaped elastic member is fixedly installed in the welding groove, the V-shaped notch of the V-shaped elastic member is arranged downward, and a limiting groove is provided on the limit frame, and the other end of the V-shaped elastic member slides in the limiting groove.

[0015] Preferably, there are a plurality of pin installation slots, and the number of the filling pieces is the same as the number of the pin installation slots and are arranged in one-to-one correspondence.

[0016] Preferably, a side of the filling piece away from the sliding block is an inclined surface.

[0017] The integrated circuit packaging structure of a multi-chip package proposed by the present invention has the following beneficial effects: by providing a packaging box, a filling sheet, a compression strip, a heat sink and an adjustment structure, the chip can be disassembled to reduce the jamming during the disassembly and assembly process, and the pin compression and heat sink installation can be completed at the same time, reducing the installation and disassembly processes, improving work efficiency, and making the operation simple and convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of a multi-chip package integrated circuit packaging structure proposed by the present invention;

[0019] Figure 2 A cross-sectional view of an integrated circuit packaging structure of a multi-chip package proposed by the present invention;

[0020] Figure 3 A schematic structural diagram of a chip box sliding block filled in a multi-chip package integrated circuit packaging structure proposed by the present invention;

[0021] Figure 4 A schematic diagram of the structure of a compression strip, a shaft rod, a gear, an eccentric block and an arc-shaped rack in a multi-chip package integrated circuit packaging structure proposed by the present invention;

[0022] Figure 5 A schematic structural diagram of a heat sink and a V-shaped elastic member in a multi-chip package integrated circuit packaging structure proposed by the present invention;

[0023] Figure 6 A multi-chip package integrated circuit packaging structure proposed by the present invention Figure 2 Enlarged view of point A in the middle;

[0024] Figure 7 A schematic diagram of the structure of a gate-shaped driving component in a multi-chip package integrated circuit packaging structure proposed by the present invention;

[0025] Figure 8 A schematic structural diagram of a ramp driving block in a multi-chip package integrated circuit packaging structure proposed by the present invention;

[0026] Fig. 9 The present invention provides a schematic structural diagram of a limit frame in a multi-chip package integrated circuit packaging structure.

[0027] In the figure: 1. packaging box; 2. chip slot; 3. filling sheet; 4. pressing strip; 5. heat sink; 6. sliding block; 7. guide rod; 8. door-shaped driving member; 9. guiding inclined groove; 10. shaft rod; 11. gear; 12. eccentric block; 13. arc-shaped rack; 14. inclined driving block; 15. limit frame; 16. V-shaped elastic member; 17. limit groove. DETAILED DESCRIPTION

[0028] Reference Figure 1-Figure 9 The present invention provides an integrated circuit packaging structure for multi-chip packaging, comprising a packaging box 1, a plurality of chip mounting grooves 2 are arranged at intervals through one side of the packaging box 1, the chip is installed in the chip mounting groove 2, both sides of the bottom of the chip mounting groove 2 are provided with pin mounting grooves (the pins of the chip are Z-shaped, the transverse sections of the chip pins are placed in the pin mounting grooves, and the thickness of the chip pins is greater than the depth of the pin mounting grooves). When installing the chip, the chip is placed in the chip mounting groove 2 so that the pins on both sides of the chip are placed in the pin mounting grooves. It is opened from the side of the packaging box 1, and the chip is inserted into the chip mounting slot 2 from the side. When the chip pins encounter the pin mounting slots, the chip pins will be stuck in the pin mounting slots. When the chip is inserted, it may be stuck. Therefore, a filling piece 3 is provided. The specific function is as follows: a filling piece 3 is provided in the pin mounting slot. The filling piece 3 can fill the pin mounting slot, and the top surface of the filling piece 3 is flush with the bottom inner wall of the chip mounting slot 2. When installing the chip, the chip is inserted into the chip mounting slot 2 from the side. The chip is affected by gravity, and the chip pins are against the chip The bottom inner wall of the slot 2, when the chip is inserted, the chip pins slide, because the pin mounting slot is filled with the filling piece 3, so that the chip can be smoothly inserted into the chip slot 2, the inner walls on both sides of the chip slot 2 are provided with storage slots, the filling piece 3 can be received into the storage slot, the chip pins need to be pressed and contacted with the metal contacts in the pin mounting slot, the chip pins need to be placed in the corresponding pin mounting slot, so as to ensure the installation of the chip, the stability of the chip pin docking, when the chip pins are inserted into the pin mounting slot, the filling piece 3 needs to be removed from the pin mounting slot Pull it out to make room for the chip pins, ensure that the chip pins are in contact with the metal contacts in the pin mounting groove, and a clamping strip 4 is installed in the receiving groove. The clamping strip 4 is used to clamp the chip pins in the pin mounting groove. The chip pins are installed in the pin mounting groove, and then the clamping strip 4 is used to clamp and fix the chip pins in the pin mounting groove, thereby ensuring the firmness and stability of the chip pin installation and the normal operation of the chip. When installing the chip, the clamping strip 4 is stored in the receiving groove to ensure that the chip will not be hindered by the clamping strip 4 when inserted into the chip mounting groove 2.

[0029] In actual situations, the chip is one of the components on the motherboard that generates more heat, so it needs to be heat-dissipated to ensure the stable operation of the chip. A heat sink 5 is arranged on the top of the chip mounting slot 2. The heat sink 5 includes a heat conducting plate and multiple heat sinks. The multiple heat sinks are fixedly and vertically mounted on the heat conducting plate. The heat conducting plate and the chip are arranged in parallel. The heat conducting plate rests on the chip. A silicone pad or silicone grease is provided between the heat conducting plate and the chip to make the contact between the heat conducting plate and the chip closer, thereby improving the heat conduction effect. The heat sink 5 can rest on the chip. When the chip is installed, the heat sink 5 is pressed against the chip to conduct the heat generated by the chip and volatilize it, thereby increasing the heat dissipation area.

[0030] like Figure 2 As shown in , an adjustment structure is installed on the packaging box 1, and the adjustment structure can drive the filling piece 3 to slide horizontally in the pin mounting groove. The adjustment mechanism drives the filling piece 3 to slide in the pin mounting groove, thereby driving the filling piece 3 to fill the pin mounting groove, which is convenient for the chip to be inserted into the chip mounting groove 2. When the chip pins and metal contacts are in contact, the adjustment structure pulls the filling piece 3 out of the pin mounting groove and into the storage groove, making room for the chip pins, facilitating the chip pins to be inserted into the pin mounting groove, ensuring that the chip pins and metal contacts are in contact, and limiting the chip pins and the chip, ensuring the stability of the chip during installation. The adjustment structure can also drive the clamping strip 4 to clamp and fix the pins on both sides of the chip in the pin mounting groove. There are multiple pin mounting grooves, and the number of the filling pieces 3 is the same as the number of the pin mounting grooves and is set one by one (ensuring that the chip pins are one by one The heat sink 5 is required to be tightly attached to the chip after the chip is inserted into the chip slot 2, ensuring that the heat on the chip can be dissipated by conduction to the heat sink 5 to increase the heat dissipation area. The heat sink 5 needs to be driven down and attached to the chip through the adjustment structure, ensuring that the chip will not be hindered by the heat sink 5 when inserted into the chip slot 2. After the chip is inserted into the chip slot 2, the filling piece 3, the pressing strip 4 and the heat sink 5 are driven to move at the same time through the adjustment structure to ensure the installation of the chip, reduce installation operations and improve installation efficiency.

[0031] like Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 7 As shown in FIG. , the adjustment structure includes a sliding block 6, a guide rod 7 and a door-shaped driving member 8; the sliding block 6 is slidably installed in the receiving groove; the sliding block 6 is Figure 6The filling piece 3 is fixedly mounted on one side of the sliding block 6, and the top of the guide rod 7 is fixedly mounted on the bottom of the sliding block 6. A linear groove is provided on the inner wall of the bottom of the storage groove to slide with the guide rod 7. An adjustment groove is provided on the side of the packaging box 1 to slide with the door-shaped driving member 8. A guide bevel 9 is provided on the door-shaped driving member 8. The guide rod 7 slides in the guide bevel 9. The length direction of the guide bevel 9 is inclined to the movement direction of the door-shaped driving member 8. The length direction of the guide bevel 9 is inclined to the length direction of the linear groove. In the specific operation, after the chip is placed in the chip mounting slot 2 (in the initial state, the filling piece 3 is located in the pin mounting slot to ensure that the chip is smoothly inserted into the chip mounting slot The guide rod 7 is driven by the guide rod 7 to slide in the linear groove, and the guide rod 7 drives the sliding block 6 and the filling piece 3 to slide synchronously. The filling piece 3 slides out from the side of the pin mounting groove and retracts into the storage groove, exposing the pin mounting groove, making it convenient for the pins of the chip to enter the pin mounting groove, thereby limiting the pins of the chip and ensuring that the pins of the chip can contact the metal contacts in the pin mounting groove. The chip is installed with simple and convenient operation.

[0032] like Figure 2 , Figure 3 , Figure 4 and Figure 6 As shown in, the adjustment structure also includes a shaft 10, a gear 11, an eccentric block 12 and an arc-shaped rack 13; the shaft 10 is rotatably installed in the storage groove, the gear 11 is fixedly installed on the shaft 10, the gear 11 coincides with the axis of the shaft 10, the gear 11 is meshed with the sliding block 6 (the sliding block 6 is provided with a No. 1 rack, and the No. 1 rack on the sliding block 6 is meshed with the gear 11), the eccentric block 12 is fixedly installed on the shaft 10, the arc-shaped rack 13 is fixedly installed on the side of the eccentric block 12 away from the gear 11, and the compression strip 4 is fixed Installed at the end of the arc-shaped rack 13, when the filling piece 3 is pulled out from the pin mounting groove, the laterally moving sliding block 6 drives the gear 11 and the shaft 10 to rotate, and the shaft 10 drives the eccentric block 12 and the arc-shaped rack 13 to rotate. When the arc-shaped rack 13 rotates, it drives the clamping strip 4 at its end, so that the clamping strip 4 rotates and presses against the chip pins, and the chip pins are pressed and fixed in the pin mounting groove, ensuring that the chip pins and the metal contacts in the pin mounting groove are in close contact, reducing the situation where the pins become loose and cause poor contact.

[0033] like Figure 2 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown in , the adjustment structure also includes a bevel drive block 14; the bevel drive block 14 is slidably installed in the storage groove, the bevel drive block 14 is meshed with the arc rack 13 (a No. 2 rack is installed on the bottom surface of the bevel drive block 14, and the No. 2 rack is meshed with the arc rack 13), and the two sides of the top surface of the heat sink 5 are respectively slidably matched with the bevels of the two bevel drive blocks 14. When the arc rack 13 rotates, the arc rack 13 drives the bevel drive block 14 to slide (the bevel drive blocks 14 on both sides slide synchronously), and the bevel of the bevel drive block 14 is slidably matched with the two sides of the top surface of the heat sink 5, driving the heat sink 5 (a silicone grease pad can be pasted on the heat sink 5 or silicone grease can be applied) to descend and rest against the chip, and the silicone grease pad or silicone grease ensures the thermal conductivity between the heat sink 5 and the chip, thereby ensuring the heat dissipation effect.

[0034] In the actual operation process, during the installation of the chip, the chip pin installation and the installation of the heat sink 5 are carried out simultaneously, which reduces the installation steps and improves the installation efficiency.

[0035] like Figure 1 , Figure 2 , Figure 6 and Fig. 9 As shown in , a limit frame 15 is fixedly installed in the chip mounting slot 2, and the two sides of the limit frame 15 are fixedly installed on the two side inner walls of the chip mounting slot 2, and there are gaps between the upper and lower surfaces of the limit frame 15 and the top inner wall and the bottom inner wall of the chip mounting slot 2. The upper gap facilitates the flow of air to take away the heat on the heat sink 5, and the lower gap ensures the installation of the chip. A lifting groove that slides with the heat sink 5 is opened on the limit frame 15, and the heat sink 5 is slidably installed in the lifting groove. A lifting and resetting member is installed on the heat sink 5, and the lifting and resetting member is used to drive the heat sink 5 to rise and reset in the limit frame 15. In actual situations, the heat sink 5 needs to be limited during the lifting process to reduce the deflection of the heat sink 5 during the lifting process. When disassembling the chip, in order to reduce the obstruction of the heat sink 5 to the chip disassembly, the reset member drives the heat sink 5 to rise away from the chip, which facilitates the disassembly of the chip.

[0036] like Figure 2 , Figure 5 , Figure 6 and Fig. 9 As shown in the figure, the lifting and resetting member includes a V-shaped elastic member 16; welding grooves are provided on both sides of the heat sink 5, one side of the V-shaped elastic member 16 is fixedly installed in the welding groove, the V-shaped notch of the V-shaped elastic member 16 is arranged downward, and a limiting groove 17 is provided on the limit frame 15, and the other end of the V-shaped elastic member 16 slides in the limiting groove 17. During specific operation, the elastic deformation and rebound of the V-shaped elastic member 16 drive the heat sink 5 to move upward to complete the reset. The structure is simple, the installation is convenient, and it is suitable for use in small spaces.

[0037] like Figure 2 , Figure 3 and Figure 6 As shown in the figure, the side of the filling piece 3 away from the sliding block 6 is an inclined surface. When the chip is disassembled, the heat sink 5 and the clamping strip 4 need to be moved away from the chip. At the same time, the filling piece 3 will slide into the pin mounting groove. The inclined surface of the filling piece 3 will scoop up the chip pins. When the chip is removed, the chip pins are less likely to be stuck in the pin mounting groove, so that the chip pins are detached from the pin mounting groove, which makes it convenient for the staff to remove the chip.

[0038] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A multi-chip package integrated circuit packaging structure, characterized in that: The packaging box (1) comprises a packaging box (1), wherein a plurality of chip mounting slots (2) are arranged at intervals through one side of the packaging box (1), pin mounting slots are provided on both sides of the bottom of the chip mounting slot (2), a filling sheet (3) is provided in the pin mounting slot, the filling sheet (3) can fill the pin mounting slot, and the top surface of the filling sheet (3) is flush with the bottom inner wall of the chip mounting slot (2), and the inner walls on both sides of the chip mounting slot (2) are provided with storage slots, and the filling sheet (3) can be stored in the storage slots; A compression strip (4) is installed in the receiving groove, and the compression strip (4) is used to compress the chip pins in the pin installation groove; A heat sink (5) is provided at the top of the chip mounting slot (2), and the heat sink (5) can be placed against the chip; The packaging box (1) is provided with an adjustment structure, which can drive the filling sheet (3) to slide horizontally in the pin installation groove, and can also drive the pressing strip (4) to press and fix the pins on both sides of the chip in the pin installation groove, and can also drive the heat sink (5) to descend in the chip installation groove (2) to fit on the chip; The adjustment structure comprises a sliding block (6), a guide rod (7) and a gate-shaped driving member (8); the sliding block (6) is slidably mounted in the storage groove, the filling piece (3) is fixedly mounted on one side of the sliding block (6), the top end of the guide rod (7) is fixedly mounted on the bottom of the sliding block (6), a linear groove slidably matched with the guide rod (7) is provided on the bottom inner wall of the storage groove, an adjustment groove slidably matched with the gate-shaped driving member (8) is provided on the side of the packaging box (1), a guide inclined groove (9) is provided on the gate-shaped driving member (8), the guide rod (7) slides in the guide inclined groove (9), the length direction of the guide inclined groove (9) is inclinedly arranged with respect to the movement direction of the gate-shaped driving member (8), and the length direction of the guide inclined groove (9) is inclinedly arranged with respect to the length direction of the linear groove; The adjustment structure further comprises a shaft (10), a gear (11), an eccentric block (12) and an arc-shaped rack (13); the shaft (10) is rotatably mounted in the receiving groove, the gear (11) is fixedly mounted on the shaft (10), the axes of the gear (11) and the shaft (10) coincide, the gear (11) is meshed with the sliding block (6), the eccentric block (12) is fixedly mounted on the shaft (10), the arc-shaped rack (13) is fixedly mounted on a side of the eccentric block (12) away from the gear (11), and the pressing strip (4) is fixedly mounted on the end of the arc-shaped rack (13); The adjustment structure also includes an inclined plane driving block (14); the inclined plane driving block (14) is slidably mounted in the receiving groove, the inclined plane driving block (14) is meshed with the arc-shaped rack (13), and the top surfaces of the heat sink (5) are respectively slidably matched with the inclined surfaces of the two inclined plane driving blocks (14).

2. The integrated circuit packaging structure of a multi-chip package according to claim 1, characterized in that: A limit frame (15) is fixedly installed in the chip mounting slot (2), and a lifting slot is provided through the limit frame (15) for slidingly cooperating with the heat sink (5), and the heat sink (5) is slidably installed in the lifting slot; A lifting and resetting component is installed on the heat sink (5), and the lifting and resetting component is used to drive the heat sink (5) to lift and reset on the limit frame (15).

3. The integrated circuit packaging structure of a multi-chip package according to claim 2, characterized in that: The lifting and resetting member comprises a V-shaped elastic member (16); welding grooves are provided on both sides of the heat sink (5); one side of the V-shaped elastic member (16) is fixedly installed in the welding groove, the V-shaped notch of the V-shaped elastic member (16) is arranged downward, and a limiting groove (17) is provided on the limiting frame (15); the other end of the V-shaped elastic member (16) slides in the limiting groove (17).

4. The integrated circuit packaging structure of a multi-chip package according to claim 3, characterized in that: The number of the pin installation slots is multiple, and the number of the filling pieces (3) is the same as the number of the pin installation slots and are arranged in a one-to-one correspondence.

5. The integrated circuit packaging structure of a multi-chip package according to claim 4, characterized in that: The side of the filling piece (3) away from the sliding block (6) is an inclined surface.

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