Photovoltaic module for testing and preparation method thereof

Abstract

The invention discloses a photovoltaic module for testing and a preparation method thereof, and relates to the technical field of photovoltaic module manufacturing, and the method specifically comprises the steps: 1, preparing each independent standard part; step 2, assembling the plurality of to-be-tested parts with the matched standard parts respectively to obtain a plurality of stacked parts; and step 3, mounting a splicing frame on each laminated piece, and splicing the plurality of laminated pieces by using the splicing frames to obtain the photovoltaic module for testing. According to the embodiment, the standard parts matched with the to-be-tested parts can be selected according to the requirements of the to-be-tested parts to be assembled to obtain different stacked parts, and the flexibility of the photovoltaic module preparation process is improved. And meanwhile, various different laminated pieces can be synchronously tested at one time, so that the testing efficiency of the photovoltaic module is improved. And after the test is completed, the standard component can still be reused, so that the reuse rate of each component in the photovoltaic module used for testing is improved.

Description

Technical Field

[0001] The invention relates to the technical field of photovoltaic component manufacturing, and in particular to a photovoltaic component for testing and a preparation method thereof. Background Art

[0002] In the testing process of existing photovoltaic modules, it is necessary to first prepare a photovoltaic module of conventional size by laminating the components to be tested with other non-test components (for example, the battery array to be tested with other non-test cover plates, back plates, etc.) to meet the requirements of the test device and realize independent testing of the prepared photovoltaic modules. However, in order to reduce the test error, the specifications of conventional photovoltaic modules are often set larger, and it takes a lot of manpower and material costs to prepare independent photovoltaic modules for each component to be tested. Moreover, due to the material properties of the front film and the rear film, the existing photovoltaic modules are all laminated, and the front film and the rear film are fused through the lamination process to form an integral film layer sealed on the outside of the battery array. This results in the prepared test photovoltaic module being an integral structure, and after the test is completed, the components cannot be reused. Summary of the invention

[0003] In view of this, an embodiment of the present invention provides a photovoltaic module for testing and a preparation method thereof. By preparing each independent standard component, the standard component matching the component to be tested can be selected according to the needs of the component to be tested for assembly to obtain multiple different stacked parts, thereby improving the flexibility of the preparation process of the photovoltaic module to be tested. Then, the assembly after splicing multiple stacked parts is used as the photovoltaic module for testing, and multiple different stacked parts can be tested simultaneously at one time, thereby improving the testing efficiency of the photovoltaic module. In addition, since each standard component is relatively independent and will not undergo deformation and chemical changes during the test process, it can still be reused after the test is completed, thereby improving the reuse rate of each component in the photovoltaic module used for testing.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0005] In a first aspect, the present invention provides a method for preparing a photovoltaic module for testing, comprising: step 1, preparing each independent standard component; the standard component comprises: at least one of a standard cover plate, a standard adhesive film, a standard battery array and a standard back plate; step 2, assembling a plurality of components to be tested with matching standard components respectively to obtain a plurality of stacked parts; wherein the components to be tested are one of a cover plate to be tested, a battery array to be tested, and a back plate to be tested; step 3, installing a splicing frame on each of the stacked parts, and using the splicing frame to splice a plurality of the stacked parts to obtain a photovoltaic module for testing.

[0006] Optionally, the step 1 includes: step 11, stacking a standard back panel, a first anti-adhesive layer, an adhesive film layer, a second anti-adhesive layer and a standard cover panel from bottom to top; step 12, laminating using a laminator until the adhesive film layer is formed; step 13, after lamination is completed, removing the standard cover panel, the second anti-adhesive layer, the first anti-adhesive layer and the standard back panel in sequence to obtain the standard adhesive film.

[0007] Optionally, the lamination temperature in step 12 is 100°C to 160°C.

[0008] Optionally, step 3 includes: step 31, installing a splicing frame around each of the stacked components, and filling a sealing layer between the splicing frame and the stacked components; step 32, connecting multiple stacked components in series into a stacked component as a whole using slots and sockets respectively arranged on the sides of the splicing frame; step 33, installing an outer frame on the periphery of the stacked component as a whole, and fixing the outer frame to the stacked component as a whole using interlocking parts to obtain the photovoltaic module for testing.

[0009] Optionally, the material of the first anti-adhesion layer and / or the second anti-adhesion layer is anti-adhesion polytetrafluoroethylene cloth or adhesive-blocking release film.

[0010] In a second aspect, the present invention provides a photovoltaic module for testing, comprising: a plurality of stacks and a splicing frame arranged on the periphery of the stacks; wherein the stacks are assembled from a component to be tested and a plurality of independent standard components matching the component to be tested; the standard components include: at least one of a standard cover plate, a standard adhesive film, a standard battery array and a standard back plate; the component to be tested is one of a cover plate to be tested, a battery array to be tested, and a back plate to be tested; wherein every two adjacent stacks are spliced ​​into a stack as a whole by the splicing frame.

[0011] Optionally, the splicing frames on each two adjacent stacked components are spliced ​​by at least one set of splicing components.

[0012] Optionally, the splicing assembly includes a slot arranged on one of the splicing frames and a socket arranged on another splicing frame and matching the slot; wherein the position of the slot corresponds to the position of the first welding strip in the adjacent stack, and is used for placing the first welding strip.

[0013] Optionally, a first soldering tape through hole for placing the first soldering tape is provided on a side of the slot adjacent to the splicing frame; a conductive member corresponding to the first soldering tape through hole is provided on a side of the slot adjacent to the socket; wherein the interior of the conductive member is a hollow structure; after the first soldering tape is placed in the first soldering tape through hole of the slot, the first soldering tape is located in the hollow structure of the conductive member, so that the first soldering tape is electrically connected to the conductive member.

[0014] Optionally, a second solder strip through hole is provided on the socket for placing a second solder strip in a stack adjacent to the socket; wherein the second solder strip through hole is provided through and corresponds to the position of the conductive member; after an adjacent slot is spliced ​​with a socket, the conductive member on the slot is inserted into the second solder strip through hole on the socket and is electrically connected to the second solder strip located in the second solder strip through hole.

[0015] Optionally, the socket further comprises a plurality of concave structures and a plurality of plug-in bodies located on a side opposite to the concave structures; the socket further comprises a plurality of convex structures matching the concave structures and a plurality of plug-in slots plugged into the plug-in bodies.

[0016] Optionally, it also includes: a plurality of outer frames arranged around the entire stack and an interlocking member arranged at the connection between each two adjacent outer frames; wherein the two ends of the interlocking member are respectively connected to the two adjacent outer frames to fix the two adjacent outer frames into one.

[0017] Optionally, one or more interlocking holes are provided on the outer frame, and interlocking wings matching the interlocking holes are provided on the interlocking pieces; the interlocking wings are engaged with the interlocking holes to connect each of the interlocking pieces to two adjacent outer frames.

[0018] Optionally, the interlocking member is an L-shaped structure; the interlocking wings are multiple and are respectively arranged on both sides of the L-shaped structure; wherein the interlocking wings on different sides are respectively connected to different outer frames.

[0019] Optionally, a sealing layer is further provided between the stacking member and the splicing frame.

[0020] The technical solution of the first aspect of the above invention has the following advantages or beneficial effects: by preparing each independent standard component, it is possible to select standard components that match the components to be tested according to the requirements of the components to be tested for assembly to obtain multiple different stacked parts, thereby improving the flexibility of the preparation process of the photovoltaic module to be tested. Then, the assembly after splicing multiple stacked parts is used as the photovoltaic module to be tested, and multiple different stacked parts can be tested simultaneously at one time, thereby improving the testing efficiency of the photovoltaic module. In addition, since each standard component is relatively independent and will not undergo deformation and chemical changes during the test, it can still be reused after the test is completed, thereby improving the reuse rate of each component in the photovoltaic module used for testing and reducing material costs and labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to better understand the present invention and do not constitute an improper limitation of the present invention.

[0022] Figure 1 is a schematic diagram of a process for testing a photovoltaic module according to an embodiment of the present invention;

[0023] Figure 2 is a schematic diagram of the main process of preparing a standard adhesive film according to an embodiment of the present invention;

[0024] Figure 3 is a schematic diagram of the main flow of step S103 according to an embodiment of the present invention;

[0025] Figure 4 is a schematic diagram of the structure of a slot and a socket according to an embodiment of the present invention;

[0026] Figure 5 is a top view of the overall structure of a photovoltaic module according to an embodiment of the present invention;

[0027] Figure 6 is a top view of another overall structure of a photovoltaic module according to an embodiment of the present invention;

[0028] Figure 7 is a schematic diagram of the arrangement structure of multilayer components in a stack according to an embodiment of the present invention;

[0029] Figure 8 is a structural schematic diagram of the arrangement positions of slots and sockets according to an embodiment of the present invention;

[0030] Fig. 9 is a schematic structural diagram of interlocking holes and interlocking wings according to an embodiment of the present invention;

[0031] Fig.10 is a schematic diagram of the installation position between the interlocking member and the outer frame according to an embodiment of the present invention;

[0032] Fig.11 is a schematic diagram of the three-dimensional structure of an interlocking member according to an embodiment of the present invention;

[0033] Fig.12 Schematic diagram of the positional relationship between the first soldering strip through hole and the first soldering strip on the slot according to an embodiment of the present invention.

[0034] The reference numerals are as follows:

[0035] 1-Layer stack; 2-Splicing frame; 21-Splicing assembly; 211-Slot; 212-Socket; 213-Conductive member; 214-Second welding belt through hole; 215-Concave structure; 216-Plug-in body; 217-Convex structure; 218-Plug-in slot; 3-Outer frame; 31-Interlocking hole; 4-Interlocking member; 41-Interlocking wing;

[0036] 100-back panel; 200-rear adhesive film; 300-battery array; 400-front adhesive film; 500-cover panel; 600-sealing layer. DETAILED DESCRIPTION

[0037] A solar cell is a photoelectric semiconductor wafer that uses sunlight to generate electricity directly. It is also called a "solar chip" or "photovoltaic cell". As long as it is illuminated by light that meets certain illumination conditions, it can instantly output voltage and generate current in the presence of a circuit. In physics, it is called solar photovoltaic (PV), or photovoltaic for short. In order to conveniently and clearly describe the method for preparing a solar cell and the solar cell of the present invention, the following exemplary embodiments of the present invention are described in conjunction with the accompanying drawings, which include various details of the embodiments of the present invention to facilitate understanding, and they should be considered to be merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. Similarly, for the sake of clarity and conciseness, the description of well-known functions and structures is omitted in the following description.

[0038] In one embodiment of the present invention, Figure 1 As shown, this embodiment provides a method for preparing a photovoltaic module for testing, and the preparation method may include the following steps:

[0039] Step S101, preparing each independent standard component; the standard component includes: at least one of a standard cover plate, a standard adhesive film, a standard battery array and a standard back plate;

[0040] Step S102, assembling a plurality of components to be tested with matching standard components respectively to obtain a plurality of stacked components 1; wherein the component to be tested is one of a cover plate to be tested, a battery array to be tested, and a back plate to be tested;

[0041] Step S103 , installing a splicing frame 2 on each stack 1 , and splicing a plurality of stacks 1 using the splicing frame 2 to obtain a photovoltaic module for testing.

[0042] In the actual testing of photovoltaic modules, a certain component in the module is usually used as a single variable for testing. For example, when testing a cover plate, the cover plate to be tested needs to be stacked with other standard adhesive films, standard battery arrays, and standard back plates to prepare a complete photovoltaic module before testing can be performed. Therefore, in the embodiment of the present invention, the component to be tested refers to the single component to be tested, and the matching standard component refers to other components that together with the single component constitute the photovoltaic module.

[0043] In the actual testing process of photovoltaic modules, the battery array, cover plate, and back plate in the photovoltaic module are usually tested, and the front film and the back film have little effect on the photovoltaic module, and the material is relatively universal, so the components to be tested in the embodiment of the present invention are mainly one of the cover plate to be tested, the battery array to be tested, and the back plate to be tested. In addition, for the standard component in step S101, it refers to the component whose performance and parameters meet the requirements prepared in accordance with the industry specification. Specifically, the standard film in step S101 can be used as both the front film and the back film when assembled with the component to be tested. Generally, the material of the front film and the back film is the same, so the embodiment of the present invention only prepares one standard film. It can be understood that when the front film and the back film are films of different materials in the actual application process, standard front films and standard back films can also be prepared separately, and for cover plates or back plates of different materials, multiple standard cover plates and standard back plates can also be prepared according to the different materials, so as to select according to actual needs, and the embodiment of the present invention does not make specific restrictions on this.

[0044] In the process of preparing the standard adhesive film in step S101, in an optional embodiment, as Figure 2 As shown, including:

[0045] Step S201, stacking a standard back plate, a first anti-adhesion layer, a film layer, a second anti-adhesion layer and a standard cover plate from bottom to top;

[0046] Step S202, laminating by using a laminator until the adhesive film layer is formed;

[0047] Step S203, after the lamination is completed, the standard cover plate, the second anti-adhesion layer, the first anti-adhesion layer and the standard back plate are removed in sequence to obtain a standard adhesive film.

[0048] It should be noted that in the prior art, although the front film and the rear film are laminated by lamination, the front film and the rear film are both non-transparent and fluid before lamination, and cannot be used as an independent component. Instead, they must go through a lamination process to make the film undergo a physical change, from a non-transparent fluid material to a transparent solidified material, and bonded to the battery array as a whole, thereby obtaining the final photovoltaic module. Different from the prior art, the independent standard film prepared by the embodiment of the present invention is itself in a transparent form after curing, and can be directly used as a component for assembly, and will not be bonded to the battery array during the assembly process of the photovoltaic module, nor will it undergo physical changes during the assembly process. After the test is completed, it can be disassembled into independent components and reused.

[0049] Among them, the purpose of the first anti-adhesion layer and the second anti-adhesion layer is to separate the adhesive film layer from the back plate and the cover plate, so that during the lamination process, the adhesive film layer can be formed separately to obtain a standard adhesive film, so the material of the first anti-adhesion layer and the second anti-adhesion layer should be a material that does not adhere to the adhesive film layer. In an optional embodiment, the material of the first anti-adhesion layer and / or the second anti-adhesion layer is anti-adhesion polytetrafluoroethylene cloth or an adhesive release film.

[0050] For the specific process of lamination in step S202, in an optional embodiment, the lamination temperature is 100°C to 160°C, such as 100°C, 120°C, 130°C, 150°C, 160°C, etc. Specifically, the lamination process is divided into multiple processes:

[0051] (1) First, the upper chamber and the lower chamber are set to a vacuum state for a vacuum treatment for 60 seconds to 420 seconds, so that the pressure of the upper chamber and the lower chamber is -110 kPa to -90 kPa, for example, -110 kPa, -100 kPa or -90 kPa;

[0052] (2) converting the upper chamber into an inflated state, inflating the upper chamber to a pressure of -90 kPa to -75 kPa, such as -90 kPa, -80 kPa or -75 kPa, while ensuring that the lower chamber is always in a vacuum state and the pressure is maintained at -110 kPa to -90 kPa, such as -110 kPa, -100 kPa or -90 kPa; laminating for 10 s to 60 s, such as 10 s, 20 s, 30 s, 40 s, 50 s or 60 s;

[0053] (3) adjusting the pressure of the upper chamber to -55 kPa to -45 kPa, such as -55 kPa, -50 kPa or -45 kPa, and maintaining the pressure of the lower chamber unchanged, and continuing the lamination for 10 s to 60 s, such as 10 s, 20 s, 30 s, 40 s, 50 s or 60 s;

[0054] (4) adjusting the pressure of the upper chamber to -35 kPa to -25 kPa, for example, -35 kPa, -20 kPa or -25 kPa, and maintaining the pressure of the lower chamber unchanged, and continuing the lamination for 180 s to 600 s, for example, 180 s, 200 s, 300 s, 400 s, 500 s or 600 s;

[0055] (5) The upper chamber and the lower chamber are both adjusted to an inflated state, and the lamination is continued for 30s to 60s, for example, 30s, 40s, 50s or 60s. Through the above process, the lower chamber can be used to discharge the air in the film layer, eliminate the bubbles generated during the lamination process and realize the formation of the film layer. At the same time, the pressure difference between the upper chamber and the lower chamber is used to completely dissolve the film layer, thereby obtaining a transparent standard film.

[0056] After obtaining each standard component, the standard components matching the component to be tested can be assembled according to the requirements of the component to be tested to obtain the stack 1. For example, when the component to be tested is a cover plate to be tested, the cover plate to be tested, the standard adhesive film, the standard battery array and the standard back plate are assembled to obtain the stack 1, and when the component to be tested is a battery array to be tested, the standard cover plate, the standard adhesive film, the battery array to be tested and the standard back plate are assembled to obtain the stack 1.

[0057] As for the specific process of assembly, it is actually achieved through lamination. However, compared with the lamination process of preparing the standard adhesive film in step S202, the lamination in step S102 is only for assembling multiple parts, and does not need to change the physical properties of the adhesive film. Therefore, room temperature lamination technology can be used. Compared with the lamination process in step S202, the pressure of the upper chamber and the lower chamber can be appropriately reduced, and the lamination time can be shortened to achieve the purpose of assembly. Specifically, it can include:

[0058] (1) The upper chamber and the lower chamber are set to a vacuum state, the pressure is -40 kPa to -20 kPa, for example, -40 kPa, -30 kPa or -20 kPa, and the vacuum time is 30 s to 70 s, for example, 30 s, 40 s, 50 s, 60 s or 70 s;

[0059] (2) The upper chamber is adjusted to an inflated state, and the pressure is set to -15 kPa to -5 kPa, such as -15 kPa, -10 kPa or -5 kPa, etc. The pressure of the lower chamber is kept unchanged, and the lamination is performed for 30 s to 600 s, such as 30 s, 100 s, 300 s, 500 s or 600 s, etc.;

[0060] (3) The upper chamber and the lower chamber are both set to an inflated state, and the lamination is performed for 10 seconds to 30 seconds, for example, 10 seconds, 20 seconds, 30 seconds, etc.

[0061] It should be noted that in the prior art, each stack 1 is tested, so the test equipment needs to be installed separately with each stack 1, which invisibly increases the complexity of the test. Therefore, the embodiment of the present invention utilizes a splicing frame 2 to splice multiple stacks 1. Only one test equipment needs to be installed to test multiple stacks 1 at the same time, which greatly improves the test efficiency.

[0062] For step S103, in an optional embodiment, as Figure 3 As shown, including:

[0063] Step S301, installing a splicing frame 2 around each stacking piece 1, and filling a sealing layer between the splicing frame 2 and the stacking piece 1;

[0064] Step S302, using the slots 211 and the sockets 212 respectively provided on the side of the splicing frame 2, a plurality of stacked components 1 are serially connected into a stacked component 1 as a whole;

[0065] Step S303 , installing an outer frame 3 on the outer periphery of the stack 1 as a whole, and using an interlocking member 4 to fix the outer frame 3 and the stack 1 as a whole into one, so as to obtain a photovoltaic module for testing.

[0066] In order to ensure the sealing performance of each stack 1 during the test, the splicing frame 2 is arranged around the stack 1, and the stack 1 is sealed by a sealing layer between the splicing frame 2 and the stack 1.

[0067] For the slots 211 and the sockets 212 in step S302, in an optional embodiment, when multiple stacks 1 need to be connected in series, the slots 211 and the sockets 212 can be respectively arranged on two symmetrical sides of the stack 1, such as Figure 4 As shown, the left stack 1 can be plugged into the socket 212 of the right stack 1 through the slot 211 set on the right, so that multiple stacks 1 are connected in series. It can be understood that in the actual test process, multiple rows of stacks 1 can be set, such as Figure 5 As shown, each row of stacked components 1 is connected in series as a whole, and multiple rows of stacked components 1 are fixed together as a whole using an outer frame 3 and an interlocking member 4.

[0068] In summary, the method for preparing a photovoltaic module for testing provided by an embodiment of the present invention can prepare each independent standard component, and can select standard components that match the components to be tested according to the needs of the components to be tested for assembly to obtain different multiple stacked parts, thereby improving the flexibility of the photovoltaic module preparation process. Then, the assembly after splicing multiple stacked parts is used as the photovoltaic module for testing, and multiple different stacked parts can be tested simultaneously at one time, thereby improving the testing efficiency of the photovoltaic module. In addition, since each standard component is relatively independent and will not undergo deformation and chemical changes during the test process, it can still be reused after the test is completed, thereby improving the reuse rate of the photovoltaic module.

[0069] Figure 5 and Figure 6 The specific structure of the photovoltaic module for testing provided by the embodiment of the present invention is shown. Figure 5 and Figure 6 All of them are top views of the overall structure of the photovoltaic module, but Figure 5 Mainly to illustrate the location of the splicing assembly 21 and the connection relationship between the stacking member 1, the outer frame 3 and the interlocking member 4, the specific structures of the stacking member 1 and the splicing frame 2 are simplified. Figure 6 Mainly to illustrate the positional relationship between the splicing frame 2 and the stacking member 1, Figure 6 The external structures such as the outer frame 3 and the interlocking parts 4 are not shown.

[0070] like Figure 5 and Figure 6 As shown, the photovoltaic component for testing provided by the present invention includes: a plurality of stacks 1 and a splicing frame 2 arranged on the periphery of the stacks 1; wherein the stacks 1 are assembled from components to be tested and a plurality of independent standard components matching the components to be tested; the components to be tested are mainly one of a cover plate to be tested, a battery array to be tested, and a back plate to be tested, and the standard components include: at least one of a standard cover plate, a standard adhesive film, a standard battery array and a standard back plate; wherein, each two adjacent stacks 1 are spliced ​​by the splicing frame 2 to obtain a stack as a whole.

[0071] During the assembly process, standard components can be selected according to the components to be tested to assemble a complete stack 1. For example, the arrangement structure of the multi-layer components in the stack 1 is as follows: Figure 7As shown, from top to bottom are: cover plate 500, front adhesive film 400, battery array 300, rear adhesive film 200, back plate 100. When the component to be tested is a cover plate to be tested, the cover plate to be tested, the standard adhesive film, the standard battery array and the standard back plate are stacked and assembled to obtain a photovoltaic module to be tested. In addition, in order to ensure the sealing performance and insulation performance between the stack 1 and the splicing frame 2, in the embodiment of the present invention, a sealing layer is also provided between the stack 1 and the splicing frame 2, which can be specifically as follows: Figure 7 Specifically, the sealing layer can be obtained by injecting a sealing material into the gap between the stacking member 1 and the splicing frame 2 and drying it after the splicing frame 2 is installed on the outside of the stacking member 1. It can also be a pre-prepared film structure, in which a film-like sealing layer is first attached to the outside of the stacking member 1, and then the outermost splicing frame 2 is installed, so that under the action of the external force of the splicing frame 2, the film-like sealing layer is sandwiched between the splicing frame 2 and the stacking member 1, thereby achieving a sealing effect.

[0072] In an optional embodiment, adjacent stacked pieces 1 are actually spliced ​​by splicing components 21 on the splicing frame 2, that is, the splicing frames 2 on each two adjacent stacked pieces 1 are spliced ​​by at least one group of splicing components 21. For example, one or more groups of splicing components 21 can be set between two adjacent splicing frames 2 according to the firmness of the splicing. In an optional embodiment, in order to facilitate splicing, a splicing frame 2 with a splicing component 21 can be directly produced, and different styles of splicing frames 2 are generated for different setting positions and different setting numbers, so that in the actual application process, the installer can directly select the splicing frame 2 according to the needs of the splicing orientation.

[0073] In a further optional embodiment, if Figure 4 and Figure 8 As shown, the splicing assembly 21 includes a slot 211 arranged on a splicing frame 2 and a socket 212 arranged on another splicing frame 2 and matching the slot 211; wherein the position of the slot 211 corresponds to the position of the first welding strip in the adjacent stack 1, and is used to place the first welding strip. From the above, it can be seen that the splicing assembly 21 in the present invention actually includes slots 211 and sockets 212 arranged on different splicing frames 2, so as to realize the connection between the two splicing frames 2 by plugging the slots 211 and the sockets 212, and then realize the connection between the two stacks 1. It can be understood that in order to connect multiple stacks 1 in series and then test them together, it is necessary to connect the welding strips between different stacks 1 in series as a whole, so as to realize the electrical connection between the multiple stacks 1 by using the welding strips. Therefore, the slot 211 in the embodiment of the present invention needs to correspond to the position of the first welding strip in the adjacent stack 1, so as to facilitate the insertion of the first welding strip in the adjacent stack 1 into the slot 211, and then through the plugging of the slot 211 and the socket 212, the Figure 8 The first welding strip of the left stack 1 is electrically connected to the welding strip in the right stack 1 .

[0074] The slots 211 and the sockets 212 are not necessarily arranged symmetrically on both sides of the splicing frame 2. Figure 5 For the stacked components 1 located in the middle of each row, it is necessary to use the slots 211 and the sockets 212 on the splicing frame 2 to realize the electrical connection between the multiple stacked components 1 in the horizontal row, so the slots 211 and the sockets 212 can be symmetrically arranged on both sides of the splicing frame 2. For the stacked components 1 located at the head and tail ends of each row, in an optional embodiment, the S-shaped electrical connection of multiple rows of stacked components 1 can also be realized by the slots 211 and the sockets 212 arranged above and below the splicing frame 2. Therefore, splicing frames 2 of various shapes can be produced according to the different setting positions of the slots 211 and the sockets 212, and in actual application, the series connection between multiple stacked components 1 can be realized according to the positions of the stacked components 1 that need to be electrically connected.

[0075] Regarding how to place the first solder strip in the slot 211, in a further optional embodiment, as Fig.12 As shown. A first welding strip through hole for placing the first welding strip is provided on one side of the slot 211 adjacent to the splicing frame 2; a conductive member 213 corresponding to the first welding strip through hole is provided on one side of the slot 211 adjacent to the socket 212; wherein the interior of the conductive member 213 is a hollow structure; after the first welding strip is placed in the first welding strip through hole of the slot 211, the first welding strip is located in the hollow structure of the conductive member 213, so that the first welding strip is electrically connected to the conductive member 213. It can be seen that by providing the first welding strip through hole and the conductive member 213 corresponding to the first welding strip through hole, the first welding strip in the stack 1 provided on one side of the slot 211 can be inserted into the hollow structure of the conductive member 213, so that the position of the first welding strip is fixed by the conductive member 213, and because the conductive member 213 has the conductive ability, it can be electrically connected to the first welding strip inside the conductive member 213, so that after being plugged into the socket 212, it can be electrically connected to the adjacent stack 1 (that is, another stack 1 adjacent to the socket 212). Exemplarily, the conductive member 213 may be a hollow cylinder or a hollow prism, and the hollow structure is circular, and its radius is slightly larger than the radius of the first welding strip, so as to avoid displacement of the first welding strip after the conductive member 213 is placed, thereby causing the problem of poor electrical connection. It is understandable that the above-mentioned setting only fixes the first welding strip on one side of the slot 211. In order to ensure the effective connection between the first welding strip of the stack 1 on one side of the slot 211 and the welding strip of the other stack 1 on the side of the socket 212, the welding strip on one side of the socket 212 also needs to be fixed to ensure that it can be electrically connected to the first welding strip. Therefore, in a further optional embodiment, such as Fig.12As shown, a second welding strip through hole 214 for placing the second welding strip in the stack 1 adjacent to the socket 212 is provided on the socket 212; wherein the second welding strip through hole 214 is provided through and corresponds to the position of the conductive member 213; after an adjacent slot 211 is spliced ​​with a socket 212, the conductive member 213 on the slot 211 is inserted into the second welding strip through hole 214 on the socket 212, and is electrically connected to the second welding strip located in the second welding strip through hole 214. That is, for the second welding strip through hole 214 provided through, one end is used to insert the conductive member 213, and the other end is used to insert the second welding strip, so that the conductive member 213 located in the second welding strip through hole 21 is in contact with the second welding strip, thereby achieving electrical connection. It can be understood that in order to ensure the effectiveness of the connection, the apertures at both ends of the second welding tape through hole 214 can be different, that is, the aperture for inserting one end of the conductive member 213 corresponds to the cross-sectional diameter of the conductive member 213, and the aperture for inserting one end of the second welding tape corresponds to the cross-sectional area of ​​the second welding tape, and the center line of the second welding tape can coincide with the axis of the second welding tape through hole 21, so that the second welding tape is located in the middle of the second welding tape through hole 21, so as to ensure that the second welding tape and the conductive member 213 are not misaligned and cannot be connected.

[0076] In order to further ensure the firmness of the plug-in connection between the slot 211 and the socket 212, in an optional embodiment, the slot 211 further includes a plurality of concave structures 215 located on one side of the conductive member 213 and a plurality of plug-in bodies 216 located on the side opposite to the concave structures; the socket 212 further includes a plurality of convex structures 217 matching the concave structures 215, and a plurality of plug-in slots 218 plugged with the plug-in bodies 216. That is, in the process of realizing the plug-in connection between the slot 211 and the socket 212, in addition to inserting the conductive member 213 into the second solder strip through hole 21, the plug-in connection between the convex structure 217 and the concave structure 215, and the plug-in body 216 and the plug-in slot 218 is also realized simultaneously, further ensuring the firmness of the plug-in connection.

[0077] In an optional embodiment, if Figure 5 As shown, the photovoltaic assembly provided by the present invention further includes: a plurality of outer frames 3 arranged around the entire stack and an interlocking member 4 arranged at the connection between each two adjacent outer frames 3; wherein the two ends of the interlocking member 4 are respectively connected to the two adjacent outer frames 3 to fix the two adjacent outer frames 3 into one body. Figure 5 It can be seen that in the embodiment of the present invention, an interlocking member 4 is provided at the connection between each two outer frames 3. When the outer frames 3 are enclosed in a rectangle, the interlocking members 4 are provided at the four corners of the rectangle. By providing the interlocking members 4, the outer frames 3 and the multiple stacking members 1 can be fixed as a whole to ensure the stability of the connection between the multiple stacking members 1 during the test process.

[0078] In a further optional embodiment, if Fig. 9 and Fig.10 As shown, one or more interlocking holes 31 are provided on the outer frame 3, and interlocking wings 41 matching the interlocking holes 31 are provided on the interlocking member 4; the interlocking wings 41 are engaged with the interlocking holes 31 to connect the two ends of each interlocking member 4 to the two adjacent outer frames 3. Fig. 9 The positional relationship between the interlocking hole 31 and the interlocking wing 41 is shown. Fig.10 The installation position between the interlocking member 4 and the outer frame 3 is shown. Fig. 9 It can be seen that the positions of the interlocking holes 31 and the interlocking wings 41 are arranged correspondingly, and through the engagement between the interlocking holes 31 and the interlocking wings 41 , the interlocking member 4 can be used to effectively fix the plurality of outer frames 3 into one.

[0079] Further, Fig.11 The three-dimensional structure diagram of the interlocking member 4 according to the embodiment of the present invention is shown. Fig.11 It can be seen that in an optional embodiment, the interlocking wing 41 on the interlocking part 4 can be a strip or columnar structure with a certain elasticity. When the interlocking wing 41 and the interlocking hole 31 are engaged, the interlocking wing 41 is deformed to a certain extent by an external force so as to pass from one side of the interlocking hole 31 to the other side, and after passing through the interlocking hole 31, the elastic deformation is restored, thereby realizing the interlocking part 4 being engaged on the outer frame 3 by utilizing the strip or columnar structure of the interlocking wing 41.

[0080] In summary, the photovoltaic module for testing provided by the embodiment of the present invention can prepare each independent standard component, and can select standard components that match the components to be tested according to the needs of the components to be tested for assembly to obtain different multiple stacked parts, thereby improving the flexibility of the photovoltaic module preparation process. Then, the assembly after splicing multiple stacked parts is used as the photovoltaic module for testing, and multiple different stacked parts can be tested simultaneously at one time, thereby improving the testing efficiency of the photovoltaic module. In addition, since each standard component is relatively independent and will not undergo deformation and chemical changes during the test process, it can still be reused after the test is completed, thereby improving the reuse rate of each component in the photovoltaic module for testing.

[0081] Example 1

[0082] A method for preparing a standard adhesive film, comprising:

[0083] S1, placing a standard glass back plate on a stage, laying an anti-sticking polytetrafluoroethylene cloth having a surface area larger than that of the standard glass back plate on the upper surface of the back plate, cutting the adhesive film layer into a size corresponding to the laminated component and laying it on the anti-sticking polytetrafluoroethylene cloth, and then laminating a layer of anti-sticking polytetrafluoroethylene cloth and a standard glass cover plate on the adhesive film layer to obtain a laminated structure;

[0084] S2, putting the stacked structure into a laminator for lamination; wherein the lamination temperature is 150°C, the upper chamber and the lower chamber are both in a vacuum state, the vacuum time is 420s, and the pressure is -100kPa; the upper chamber is in an inflated state, the pressure of the inflated lamination is -85kPa, the lower chamber is in a vacuum state, the pressure is -100kPa, and the lamination 1 time is 30s; then the pressure of the upper chamber is adjusted to -50kPa, the lower chamber is in a vacuum state, the pressure is -100kPa, and the lamination 2 time is 30s; then the pressure of the upper chamber is adjusted to -30kPa, the lower chamber is in a vacuum state, the pressure is -100kPa, and the lamination 3 time is 420s; finally, the upper chamber and the lower chamber are inflated for 30s;

[0085] S3, removing the upper and lower glass cover plates and the anti-sticking polytetrafluoroethylene cloth on both sides of the film layer to obtain a standard film.

[0086] Example 2

[0087] A method for preparing a standard adhesive film, comprising:

[0088] S1, placing a standard glass back panel on a stage, laying a glue-blocking release film having a surface area larger than that of the standard glass back panel on the upper surface of the back panel, cutting the glue film layer into a size corresponding to the stacked component and laying it on the glue-blocking release film, and then laminating a layer of glue-blocking release film and a standard glass cover panel on the glue film layer to obtain a stacked structure;

[0089] S2, putting the stacked structure into a laminator for lamination; wherein the lamination temperature is 150°C, the upper chamber and the lower chamber are both in a vacuum state, the vacuum time is 420s, and the pressure is -100kPa; the upper chamber is in an inflated state, the pressure of the inflated lamination is -85kPa, the lower chamber is in a vacuum state, the pressure is -100kPa, and the lamination 1 time is 30s; then the pressure of the upper chamber is adjusted to -50kPa, the lower chamber is in a vacuum state, the pressure is -100kPa, and the lamination 2 time is 30s; then the pressure of the upper chamber is adjusted to -30kPa, the lower chamber is in a vacuum state, the pressure is -100kPa, and the lamination 3 time is 420s; finally, the upper chamber and the lower chamber are inflated for 30s;

[0090] S3, removing the upper and lower glass cover plates and the adhesive barrier release films on both sides of the adhesive film layer to obtain a standard adhesive film.

[0091] Example 3

[0092] A method for preparing a photovoltaic module for testing, comprising:

[0093] S1, using the standard adhesive film prepared in Example 1 and the battery array to be tested to form a stacked assembly, including: placing a standard backplane on a stage, and laying the cut standard adhesive film, the battery array to be tested, the standard adhesive film, and the standard cover plate in sequence;

[0094] S2, placing the stacked components into a laminator for lamination to obtain a laminated component with an integrated structure; wherein the lamination temperature is room temperature, the upper chamber and the lower chamber are in a vacuum state, the pressure is -30 kPa, and the vacuum time is 60 s; the upper chamber is in an inflated state, the pressure is -10 kPa, the lower chamber is in a vacuum state, the pressure is -30 kPa, and the lamination time is 500 s; finally, the upper chamber and the lower chamber are in an inflated state for 20 s;

[0095] S3, installing a splicing frame around the stacked components, and injecting a sealing liquid into the gap between the splicing frame and the stacked components to form a sealing layer after drying;

[0096] S4, using a splicing assembly on a splicing frame to splice a plurality of stacked components into a stacked component as a whole; wherein the splicing assembly includes a slot disposed on one side of the splicing frame and a socket disposed on the other side of the splicing frame;

[0097] S5, installing a seal on the outside of the stack as a whole, and installing an outer frame and an interlocking member on the outside of the seal, and using the interlocking member to fix the outer frame and the stack as a whole into one, so as to obtain a photovoltaic module for testing.

[0098] Example 4

[0099] A method for preparing a photovoltaic module for testing, comprising:

[0100] S1, using the standard adhesive film prepared in Example 1 and the cover plate to be tested to form a stacked assembly, including: placing the standard back plate on a stage, and laying the cut standard adhesive film, the standard battery array, the standard adhesive film, and the cover plate to be tested in sequence;

[0101] S2, placing the stacked components into a laminator for lamination to obtain a laminated component with an integrated structure; wherein the lamination temperature is room temperature, the upper chamber and the lower chamber are in a vacuum state, the pressure is -30 kPa, and the vacuum time is 60 s; the upper chamber is in an inflated state, the pressure is -10 kPa, the lower chamber is in a vacuum state, the pressure is -30 kPa, and the lamination time is 500 s; finally, the upper chamber and the lower chamber are in an inflated state for 20 s;

[0102] S3, placing a sealing layer around the stacked member, and installing a splicing frame outside the sealing layer to sandwich the sealing layer between the splicing frame and the stacked member;

[0103] S4, using a splicing assembly on a splicing frame to splice a plurality of stacked components into a stacked component as a whole; wherein the splicing assembly includes a slot disposed on one side of the splicing frame and a socket disposed on the other side of the splicing frame;

[0104] S5, installing a seal on the outside of the stack as a whole, and installing an outer frame and an interlocking member on the outside of the seal, and using the interlocking member to fix the outer frame and the stack as a whole into one, to obtain a photovoltaic module for testing

[0105] Comparative Example 1 (Components used for testing in the prior art)

[0106] A method for preparing a photovoltaic module for testing, comprising:

[0107] S1, stacking a backplane, a rear film, a battery array to be tested, a front film and a backplane in sequence from bottom to top to obtain a stacked assembly;

[0108] S2, placing the stacked components into a laminator for lamination to obtain a stacked component with an integrated structure;

[0109] S3, installing a seal on the outside of the stack, and installing an outer frame on the outside of the seal to obtain a photovoltaic module for testing.

[0110] The photovoltaic modules prepared in the above-mentioned Examples 3 and 4 and Comparative Example 1 were respectively subjected to performance tests, and the electrical performance test results were as follows:

[0111] type <![CDATA[P MPP (In)]]> <![CDATA[I sc (A)]]> <![CDATA[U oc (V)]]> <![CDATA[I MPP (A)]]> <![CDATA[U MPP (V)]]> FF(%) <![CDATA[R s (Oh)]]> <![CDATA[R sh (Oh)]]> Example 3 541.5 13.80 49.15 13.14 41.21 79.84 0.14 2311 Example 4 541.3 13.82 49.00 13.10 41.16 79.76 0.14 2311 Comparative Example 1 535.1 13.86 48.89 13.04 41.05 79.00 0.16 2310

[0112] It can be seen from the above test results that the photovoltaic module for testing provided by the embodiment of the present invention has a slightly higher current than the photovoltaic module in the prior art. This may be due to the larger distance between battery cells in the battery array, which increases the reflected light. At the same time, the increase in the distance between battery cells causes the welding strip to be extended, resulting in a slightly higher series resistance and a slightly reduced voltage and fill factor. However, the test results of the overall photovoltaic module are within a reasonable range and meet the test requirements of the photovoltaic module.

[0113] The introduction provided in the above steps is only used to help understand the structure, method and core idea of ​​the present invention. For ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also belong to the scope of protection of the claims of the present invention.

Claims

1. A method for preparing a photovoltaic module for testing, characterized in that: include: Step 1, preparing each independent standard component; The standard components include: at least one of a standard cover plate, a standard adhesive film, a standard battery array and a standard back plate; Step 2, assembling a plurality of components to be tested with matching standard components respectively to obtain a plurality of laminated parts (1); wherein the component to be tested is one of a cover plate to be tested, a battery array to be tested, and a back plate to be tested; Step 3: installing a splicing frame (2) on each of the stacked components (1), and using the splicing frame (2) to splice a plurality of the stacked components (1) to obtain a photovoltaic module for testing.

2. The preparation method according to claim 1, characterized in that: The step 1 comprises: Step 11, stacking a standard back plate, a first anti-adhesive layer, a film layer, a second anti-adhesive layer and a standard cover plate from bottom to top; Step 12, laminating by using a laminator until the adhesive film layer is formed; Step 13, after lamination is completed, removing the standard cover plate, the second anti-adhesion layer, the first anti-adhesion layer and the standard back plate in sequence to obtain the standard adhesive film; Preferably, the lamination temperature in step 12 is 100°C to 160°C.

3. The preparation method according to claim 1, characterized in that: The step 3 comprises: Step 31, installing a splicing frame (2) around each of the stacked components (1), and filling a sealing layer between the splicing frame (2) and the stacked components (1); Step 32, using the slots (211) and sockets (212) respectively arranged on the side of the splicing frame (2), a plurality of the stacked components (1) are serially connected to form a stacked component as a whole; Step 33, installing an outer frame (3) on the outer periphery of the stack as a whole, and using an interlocking member (4) to fix the outer frame (3) and the stack (1) as a whole into one, so as to obtain the photovoltaic module for testing.

4. The preparation method according to claim 2, characterized in that: The material of the first anti-adhesion layer and / or the second anti-adhesion layer is anti-adhesion polytetrafluoroethylene cloth or adhesive-blocking release film.

5. A photovoltaic module for testing, characterized in that: include: A plurality of stacked components (1) and a splicing frame (2) arranged on the periphery of the stacked components (1); wherein the stacked components (1) are assembled from a component to be tested and a plurality of independent standard components matching the component to be tested; the standard components include: at least one of a standard cover plate, a standard adhesive film, a standard battery array and a standard back plate; the component to be tested is one of a cover plate to be tested, a battery array to be tested and a back plate to be tested; Wherein, every two adjacent stacked components (1) are spliced ​​together into a stacked component as a whole through the splicing frame (2).

6. The photovoltaic module according to claim 5, characterized in that: The splicing frames (2) on each two adjacent stacked pieces (1) are spliced ​​together by at least one set of splicing components (21); Preferably, the splicing assembly (21) comprises a slot (211) arranged on one of the splicing frames (2) and a socket (212) arranged on another of the splicing frames (2) and matching with the slot (211); The slot (211) has a position corresponding to the position of a first welding strip in the adjacent stack (1) and is used for placing the first welding strip; Preferably, a first soldering ribbon through hole for placing the first soldering ribbon is provided on one side of the slot (211) adjacent to the splicing frame (2); A conductive member (213) corresponding to the first soldering strip through hole is provided on one side of the slot (211) adjacent to the socket (212); wherein the interior of the conductive member (213) is a hollow structure; After the first welding strip is placed in the first welding strip through hole of the slot (211), the first welding strip is located in the hollow structure of the conductive member (213), so that the first welding strip is electrically connected to the conductive member (213).

7. The photovoltaic module according to claim 6, characterized in that: A second soldering strip through hole (214) for accommodating a second soldering strip in a stacked component (1) adjacent to the socket (212) is provided on the socket (212); wherein the second soldering strip through hole (214) is provided through and corresponds to the position of the conductive component (213); After an adjacent slot (211) and a socket (212) are spliced ​​together, the conductive member (213) on the slot (211) is inserted into a second soldering strip through hole (214) on the socket (212) and is electrically connected to a second soldering strip located in the second soldering strip through hole (214).

8. The photovoltaic module according to claim 7, characterized in that: The slot (211) further comprises a plurality of concave structures (215) located on one side of the conductive member (213) and a plurality of plug-in bodies (216) located on a side opposite to the concave structures; The socket (212) further comprises a plurality of convex structures (217) matching the concave structures (215), and a plurality of plug-in slots (218) plugged into the plug-in body (216).

9. The photovoltaic module according to claim 6, characterized in that: Also includes: A plurality of outer frames (3) arranged around the plurality of stacked components as a whole, and an interlocking member (4) arranged at the connection between each two adjacent outer frames (3); Wherein, the two ends of the interlocking member (4) are respectively connected to the two adjacent outer frames (3) so as to fix the two adjacent outer frames (3) into one body; Preferably, one or more interlocking holes (31) are provided on the outer frame (3). The interlocking piece (4) is provided with an interlocking wing (41) matching the interlocking hole (31); The interlocking wings (41) are engaged with the interlocking holes (31) to connect each of the interlocking pieces (4) to two adjacent outer frames (3); Preferably, the interlocking member (4) is an L-shaped structure; There are a plurality of interlocking wings (41), which are respectively arranged on both sides of the L-shaped structure; wherein the interlocking wings (41) on different sides are respectively connected to different outer frames (3).

10. The photovoltaic module according to claim 6, characterized in that: A sealing layer is also provided between the stacked component (1) and the splicing frame (2).

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