High-precision preparation method of flexible die cutting circuit board FDC

Abstract

The invention relates to the field of intelligent manufacturing, and provides a high-precision preparation method of a flexible die cutting circuit board FDC, and the method comprises the steps: installing a high-precision temperature sensor on a die cutting head, monitoring the temperature change of a flexible circuit board material in real time through the high-precision temperature sensor, generating temperature change data, and calculating a die cutting thermosensitive curve according to the temperature change data. And the cutting speed of the die cutting head is adjusted through the die cutting thermosensitive curve. According to the method, the temperature change of the flexible circuit board material can be monitored in real time, and the thermosensitive curve is constructed based on the generated temperature data, so that the cutting speed of the die cutting head is dynamically adjusted, the cutting precision is fully improved, meanwhile, the die cutting process parameters can be optimized, the machining error is reduced, and the production efficiency is improved. And material deformation or finished product quality reduction caused by temperature fluctuation is effectively avoided, so that the size precision and the appearance quality of the flexible die cutting circuit board product can reach higher standards.

Description

Technical Field

[0001] The present invention relates to the field of intelligent manufacturing, and in particular to a high-precision preparation method for a flexible die-cut circuit board (FDC). Background Art

[0002] The rapid development of new energy driving and energy storage has put forward higher requirements for lightweight circuit boards, space utilization and automated assembly. Flexible circuit boards such as FPC, FFC, FDC, etc. have become the preferred solution to replace traditional wiring harnesses due to their light weight, thin thickness, high bending performance and small space occupation. Among them, flexible die-cut circuit boards (FDC) have gradually become the mainstream choice in the battery industry chain due to their low-cost, high-efficiency and environmentally friendly preparation methods.

[0003] Invention patent CN116963395B discloses a method for preparing flexible circuit boards for circular die cutting, which specifically includes obtaining data of pressure values ​​received by each flexible circuit board during circular die cutting to form each pressure value image, and comparing the data with the template image to screen out unqualified flexible circuit boards, thereby improving the product quality of flexible circuit boards prepared by circular die cutting. The method focuses on screening after preparation, that is, detecting unqualified products by comparing pressure value images, but does not monitor and control key parameters in the preparation process, such as temperature, cutting pressure, speed, etc. in real time.

[0004] However, flexible circuit board materials are more sensitive to temperature changes during the die-cutting process. The rapid temperature rise during the die-cutting process may cause the material to soften and delaminate, affecting the accuracy of the finished product. Therefore, it is necessary to monitor and adjust the temperature changes during the die-cutting process in real time to improve the production quality of flexible die-cut circuit boards. Summary of the invention

[0005] The purpose of the present invention is to provide a high-precision preparation method for a flexible die-cut circuit board (FDC) to solve one or more technical problems existing in the prior art and at least provide a beneficial choice or create conditions.

[0006] The present invention provides a high-precision preparation method for a flexible die-cut circuit board (FDC), by installing a high-precision temperature sensor on a die-cutting head, using the high-precision temperature sensor to monitor the temperature change of the flexible circuit board material in real time, generating temperature change data, calculating a die-cutting thermal curve based on the temperature change data, and adjusting the cutting speed of the die-cutting head by the die-cutting thermal curve. The method can monitor the temperature change of the flexible circuit board material in real time, and construct a thermal curve based on the generated temperature data, so as to dynamically adjust the cutting speed of the die-cutting head, fully improve the cutting accuracy, and optimize the die-cutting process parameters, reduce processing errors, and effectively avoid material deformation or finished product quality degradation caused by temperature fluctuations, so that the dimensional accuracy and appearance quality of the flexible die-cut circuit board products can reach higher standards.

[0007] In order to achieve the above object, according to one aspect of the present invention, a high-precision preparation method for a flexible die-cut circuit board FDC is provided, the method comprising the following steps:

[0008] Install a high-precision temperature sensor on the die-cutting head;

[0009] Use high-precision temperature sensors to monitor the temperature changes of flexible circuit board materials in real time and generate temperature change data;

[0010] Calculate the die-cutting thermal curve based on the temperature change data;

[0011] The cutting speed of the die-cutting head is adjusted by the die-cutting thermal curve.

[0012] Furthermore, the method for installing a high-precision temperature sensor on the die-cutting head is specifically as follows: a non-contact high-precision temperature sensor is installed on the edge of the die-cutting head through a bracket, and the sensing angle of the sensor is aligned with the flexible circuit board material to obtain the temperature of the flexible circuit board material in real time.

[0013] Furthermore, the die-cutting head is used to cut the flexible circuit board material to obtain a flexible die-cut circuit board.

[0014] Furthermore, the temperature change of the flexible circuit board material is monitored in real time by a high-precision temperature sensor, and the method for generating temperature change data is specifically as follows: the sampling interval of the high-precision temperature sensor is set to t milliseconds, and the temperature of the flexible circuit board material is continuously sampled for M seconds according to the sampling interval to obtain multiple sampling data (i.e., the sampling data of the temperature of the flexible circuit board material), and the multiple sampling data are stored in an array tvm, and the array tvm is used as the temperature change data.

[0015] Preferably, t is set to an integer in the interval [5, 50], and M is set to an integer in the interval [30, 60].

[0016] Furthermore, the method for calculating the die-cutting thermal curve according to the temperature change data is specifically as follows:

[0017] Let array tvm contain N values, tvm(i) represents the i-th value in array tvm, and each value in array tvm is subtracted from Max(tvm) in turn to obtain N first values ​​and store them in array M1; each value in array tvm is subtracted from Min(tvm) in turn to obtain N second values ​​and store them in array M2; Max(tvm) and Min(tvm) represent the maximum value and minimum value in array tvm respectively;

[0018] Create a blank array Tf and define the first algorithm as follows: If the value of thv(i) is greater than the value of Max(tvm)÷Ave(tvm), or, the value of thv(i) is less than Max(tvm)÷Ave(tvm) 2 , then add tvm(i) corresponding to the sequence number i in thv(i) to the array Tf, where thv(i) = 1 ÷ (M1(i) + tvm(i)) + 1 ÷ (M2(i) + tvm(i)), M1(i) and M2(i) represent the i-th value in the array M1 and the i-th value in the array M2, respectively, and Ave(tvm) represents the average value of the N values ​​in the array tvm;

[0019] In the first algorithm, the sequence number i is traversed from i=1 to i=N, thereby obtaining an array Tf filled with multiple values ​​(a number of tvm(i) are filled into the array Tf), and the die-cutting thermal curve is established with the array Tf.

[0020] The beneficial effect of this step is that in the preparation process of the flexible circuit board, there are many factors that affect the temperature change of the flexible circuit board material, such as the heating of high-frequency components caused by thermal radiation of the equipment or electromagnetic interference. When the heat accumulation reaches a certain range and continues to be cut, it will affect the quality of the finished product of the circuit board, such as rough edges or damage, resulting in poor appearance and affecting its performance. However, most of the heat still comes from the high-speed cutting process of the die-cutting head, and the simplest, most direct and effective way to control the material temperature is to adjust the speed parameter of the die-cutting head. Therefore, the method of this step monitors the temperature change data of the circuit board cutting material and extracts part of the data that can reflect its temperature change trend to establish a die-cutting thermal curve. It can be seen that the thv(i) value obtained by screening based on the array M1 and the array M2 is close to a part of the values ​​with large fluctuations in the array tvm (the fluctuations here refer to those values ​​concentrated near the median), and therefore has modeling value, thereby providing a reliable data basis for real-time adjustment of the cutting speed of the die-cutting head.

[0021] Furthermore, the method of establishing the die-cutting thermal curve with the array Tf is specifically as follows: performing function fitting on all values ​​in the array Tf by the spline regression method, and outputting a piecewise fitting function Y=Tf(X), and using the fitting function as the die-cutting thermal curve.

[0022] Furthermore, the method for adjusting the cutting speed of the die-cutting head by the die-cutting thermal curve is as follows: input each value in the array tvm as the function independent variable X into the die-cutting thermal curve Y=Tf(X) in turn, thereby obtaining N output values ​​Tf(tvm(1)), Tf(tvm(2)), …, Tf(tvm(N)), and accumulating these N output values ​​as the fitting cumulative sum Fcs;

[0023] Calculate the thermal sensitive interval, and at any time after the thermal sensitive interval calculation is completed, sample the temperature data of the flexible circuit board material through a high-precision temperature sensor, and record the sampled temperature value as Stvm. If the value of Stvm is greater than the right end value of the thermal sensitive interval, the cutting speed of the die-cutting head is reduced; if the value of Stvm is less than the left end value of the thermal sensitive interval, the cutting speed of the die-cutting head is increased;

[0024] Among them, the thermal sensitive interval is [L1, R1], R1 = C ÷ Max (Tf (tvm)), L1 = C ÷ Min (Tf (tvm)), C = max {Fcs, Acs}, max {Fcs, Acs} means taking the maximum value of Fcs and Acs, and Acs is the cumulative sum of all values ​​in the array tvm (called the actual cumulative sum).

[0025] The beneficial effect of this step is that compared with controlling the cutting speed of the die-cutting head according to the maximum and minimum values ​​of the temperature data in the historical period (i.e., decelerating when exceeding the maximum value and accelerating when falling below the minimum value), the strategy of controlling the cutting head speed according to the thermal sensitive interval used in this step is more accurate, because the thermal sensitive interval is narrower than the maximum and minimum interval (the left end of the interval is larger and the right end is smaller), and it can intervene before the material temperature reaches the limit (causing the quality of the finished product to decline), while controlling the cutting head speed according to the maximum and minimum intervals often causes adjustment hysteresis, resulting in slight deformation of the material. The method of this step realizes secondary prediction of the temperature change of the material through the die-cutting thermal curve, takes the actual cumulative sum and the fitted cumulative sum as the basis for calculating the thermal sensitive interval, and adjusts the cutting speed of the die-cutting head based on the thermal sensitive interval to accurately control the temperature material, and can continuously update the strategy of increasing or decreasing the cutting speed of the die-cutting head by calculating the thermal sensitive interval multiple times in different time periods, so that the temperature control and the processing process are coordinated with each other, and the precision performance of the prepared finished product is fully improved, while reducing the deformation risk of the die-cut circuit board caused by temperature factors, so that it is more consistent with the quality requirements of the drawing.

[0026] The beneficial effects of the present invention are as follows: the method can monitor the temperature changes of the flexible circuit board material in real time, and construct a thermal curve based on the generated temperature data, so as to dynamically adjust the cutting speed of the die-cutting head, fully improve the cutting accuracy, and optimize the die-cutting process parameters, reduce processing errors, and effectively avoid material deformation or finished product quality degradation caused by temperature fluctuations, so that the dimensional accuracy and appearance quality of the flexible die-cut circuit board products can reach higher standards. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Shown is a flow chart of a high-precision preparation method for a flexible die-cut circuit board FDC. DETAILED DESCRIPTION

[0028] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other without conflict.

[0029] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0030] like Figure 1 The flowchart of the method for preparing a high-precision flexible die-cut circuit board FDC according to the present invention is shown below. Figure 1 A high-precision preparation method for a flexible die-cut circuit board FDC according to an embodiment of the present invention is described.

[0031] The present invention provides a high-precision preparation method for a flexible die-cut circuit board (FDC), the method comprising the following steps:

[0032] Install a high-precision temperature sensor on the die-cutting head;

[0033] Use high-precision temperature sensors to monitor the temperature changes of flexible circuit board materials in real time and generate temperature change data;

[0034] Calculate the die-cutting thermal curve based on the temperature change data;

[0035] The cutting speed of the die-cutting head is adjusted by the die-cutting thermal curve.

[0036] Furthermore, the method for installing a high-precision temperature sensor on the die-cutting head is specifically as follows: a non-contact high-precision temperature sensor is installed on the edge of the die-cutting head through a bracket, and the sensing angle of the sensor is aligned with the flexible circuit board material to obtain the temperature of the flexible circuit board material in real time.

[0037] Furthermore, the die-cutting head is used to cut the flexible circuit board material to obtain a flexible die-cut circuit board.

[0038] Specifically, the accuracy of the high-precision temperature sensor is not less than ±0.5°C and the response time is not less than 100ms.

[0039] Specifically, the high-precision temperature sensor and the die-cutting head are also connected to control modules respectively. The control module is used to store temperature data collected by the high-precision temperature sensor and control the cutting speed of the die-cutting head according to changes in the temperature data.

[0040] Furthermore, the temperature change of the flexible circuit board material is monitored in real time by a high-precision temperature sensor, and the method for generating temperature change data is specifically as follows: the sampling interval of the high-precision temperature sensor is set to t milliseconds, and the temperature of the flexible circuit board material is continuously sampled for M seconds according to the sampling interval to obtain multiple sampling data (i.e., the sampling data of the temperature of the flexible circuit board material), and the multiple sampling data are stored in an array tvm, and the array tvm is used as the temperature change data.

[0041] Specifically, t is set to 5 and M is set to 60.

[0042] According to 1s=1000ms, the length of the array tvm (ie the number of sampled data) is N=1000×M÷t.

[0043] Furthermore, the method for calculating the die-cutting thermal curve according to the temperature change data is specifically as follows:

[0044] Suppose that the array tvm contains N values, and tvm(i) represents the i-th value in the array tvm, i is the serial number, i=1, 2, ..., N, and each value in the array tvm is subtracted from Max(tvm) in turn to obtain N first values ​​and store them in the array M1; each value in the array tvm is subtracted from Min(tvm) in turn to obtain N second values ​​and store them in the array M2; Max(tvm) and Min(tvm) represent the maximum value and the minimum value in the array tvm respectively;

[0045] Create a blank array Tf and define the first algorithm as follows: If the value of thv(i) is greater than the value of Max(tvm)÷Ave(tvm), or, the value of thv(i) is less than Max(tvm)÷Ave(tvm) 2, then add tvm(i) corresponding to the sequence number i in thv(i) to the array Tf, where thv(i) = 1 ÷ (M1(i) + tvm(i)) + 1 ÷ (M2(i) + tvm(i)), M1(i) and M2(i) represent the i-th value in the array M1 and the i-th value in the array M2, respectively, and Ave(tvm) represents the average value of the N values ​​in the array tvm;

[0046] In the first algorithm, the sequence number i is traversed from i=1 to i=N, thereby obtaining an array Tf filled with multiple values ​​(a number of tvm(i) are filled into the array Tf), and the die-cutting thermal curve is established with the array Tf.

[0047] Furthermore, the method of establishing the die-cutting thermal curve with the array Tf is specifically as follows: performing function fitting on all values ​​in the array Tf by the spline regression method, and outputting the fitting function Y=Tf(X) in a piecewise form, and using the fitting function as the die-cutting thermal curve; wherein X is the function independent variable and Y is the dependent variable.

[0048] Furthermore, the method for adjusting the cutting speed of the die-cutting head by the die-cutting thermal curve is as follows: input each value in the array tvm as the function independent variable X into the die-cutting thermal curve Y=Tf(X) in turn, thereby obtaining N output values ​​Tf(tvm(1)), Tf(tvm(2)), …, Tf(tvm(N)), and accumulating these N output values ​​as the fitting cumulative sum Fcs;

[0049] Calculate the thermal sensitive interval, and at any time after the thermal sensitive interval calculation is completed, sample the temperature data of the flexible circuit board material through a high-precision temperature sensor, and record the sampled temperature value as Stvm. If the value of Stvm is greater than the right end value of the thermal sensitive interval, the cutting speed of the die-cutting head is reduced; if the value of Stvm is less than the left end value of the thermal sensitive interval, the cutting speed of the die-cutting head is increased;

[0050] Among them, the thermal sensitive interval is [L1, R1], R1 = C ÷ Max (Tf (tvm)), L1 = C ÷ Min (Tf (tvm)), C = max {Fcs, Acs}, max {Fcs, Acs} means taking the maximum value of Fcs and Acs, and Acs is the cumulative sum of all values ​​in the array tvm (called the actual cumulative sum).

[0051] Specifically, an experimental group and a control group were set up to verify the effectiveness of the high-precision preparation method of the flexible die-cutting circuit board FDC based on a high-precision temperature sensor and dynamic cutting speed adjustment provided by the present invention.

[0052] The experimental group process uses the flexible die-cutting circuit board FDC preparation method provided by the present invention, including a high-precision temperature sensor, real-time temperature monitoring, and a die-cutting thermal curve to adjust the cutting speed function; the control group process uses a traditional flexible die-cutting method, and does not use a high-precision temperature sensor and a real-time temperature dynamic adjustment function; the experimental material selects PI substrate (with thermosensitive properties), and each group prepares no less than 100 flexible circuit boards. The environment is set to normal temperature conditions (ambient temperature fluctuations within ±1°C) and high temperature fluctuation conditions (ambient temperature fluctuations within ±5°C), and the two groups maintain the same die-cutting process parameters.

[0053] Under two environmental conditions, the same flexible circuit board material was die-cut using the experimental group and control group processes respectively, and the four indicators of size deviation, cutting shape accuracy, processing error rate, and yield rate of the die-cut products were statistically analyzed. Table 1 shows the experimental results.

[0054] Table 1 Comparative experimental results of performance differences between the experimental group and the control group under normal temperature and high temperature fluctuation environments

[0055]

[0056] Among them, dimensional deviation refers to the degree of deviation between the finished circuit board after die cutting and the designed size. This indicator is expressed in the form of average deviation value and standard deviation, reflecting the dimensional accuracy and consistency during the processing. The smaller the value, the closer the processing result is to the design requirements and the higher the accuracy.

[0057] Cutting shape accuracy describes the edge quality of die-cut circuit boards, including whether the edge is smooth, burred or deformed, etc. High-precision cutting should have smooth, neat edges without obvious burrs or roughness, which directly affects the appearance and function of the finished product.

[0058] The processing error rate refers to the proportion of unqualified finished products due to insufficient precision or defects in the die-cutting process, expressed as a percentage. This indicator reflects the reliability and stability of the die-cutting technology. The lower the value, the less error there is in the processing and the higher the yield rate.

[0059] The yield rate refers to the proportion of good products that meet the design requirements after die-cutting to the total processed products, expressed as a percentage. The higher the value, the better the process stability and production efficiency, and the lower the scrap rate.

[0060] The present invention provides a high-precision preparation method for a flexible die-cut circuit board FDC, by installing a high-precision temperature sensor on a die-cutting head, using the high-precision temperature sensor to monitor the temperature change of the flexible circuit board material in real time, generating temperature change data, calculating the die-cutting thermosensitive curve according to the temperature change data, and adjusting the cutting speed of the die-cutting head by the die-cutting thermosensitive curve. The method can monitor the temperature change of the flexible circuit board material in real time, and construct a thermosensitive curve based on the generated temperature data, so as to dynamically adjust the cutting speed of the die-cutting head, fully improve the cutting accuracy, and optimize the die-cutting process parameters, reduce processing errors, and effectively avoid material deformation or finished product quality degradation caused by temperature fluctuations, so that the dimensional accuracy and appearance quality of the flexible die-cut circuit board product can reach higher standards. Although the description of the present invention has been quite detailed and several embodiments are described in particular, it is not intended to be limited to any of these details or embodiments or any special embodiments, so as to effectively cover the predetermined scope of the present invention. In addition, the above describes the present invention with embodiments that the inventor can foresee, and the purpose is to provide a useful description, and those non-substantial changes to the present invention that have not yet been foreseen can still represent equivalent changes to the present invention.

Claims

1. A high-precision preparation method for a flexible die-cut circuit board FDC, characterized in that: The method comprises the following steps: Install a high-precision temperature sensor on the die-cutting head; Use high-precision temperature sensors to monitor the temperature changes of flexible circuit board materials in real time and generate temperature change data; Calculate the die-cutting thermal curve based on the temperature change data; Adjust the cutting speed of the die-cutting head through the die-cutting thermal curve; The temperature change of the flexible circuit board material is monitored in real time by a high-precision temperature sensor. The method for generating temperature change data is specifically as follows: the sampling interval of the high-precision temperature sensor is set to t milliseconds, and the temperature of the flexible circuit board material is continuously sampled for M seconds according to the sampling interval to obtain multiple sampling data, and the multiple sampling data are stored in an array tvm, and the array tvm is used as the temperature change data.

2. A high-precision preparation method for a flexible die-cut circuit board FDC according to claim 1, characterized in that: The method for installing a high-precision temperature sensor on a die-cutting head is specifically as follows: a non-contact high-precision temperature sensor is installed on the edge of the die-cutting head through a bracket, and the sensing angle of the sensor is aligned with the flexible circuit board material to obtain the temperature of the flexible circuit board material in real time.

3. A high-precision preparation method for a flexible die-cut circuit board FDC according to claim 1, characterized in that: The die-cutting head is used to cut the flexible circuit board material to obtain a flexible die-cut circuit board.

4. The high-precision preparation method of a flexible die-cut circuit board FDC according to claim 1, characterized in that: The specific method for calculating the die-cutting thermal curve based on temperature change data is: Let array tvm contain N values, tvm(i) represents the i-th value in array tvm, and each value in array tvm is subtracted from Max(tvm) in turn to obtain N first values ​​and store them in array M1; each value in array tvm is subtracted from Min(tvm) in turn to obtain N second values ​​and store them in array M2; Max(tvm) and Min(tvm) represent the maximum value and minimum value in array tvm respectively; Create a blank array Tf and define the first algorithm as follows: If the value of thv(i) is greater than the value of Max(tvm)÷Ave(tvm), or, the value of thv(i) is less than Max(tvm)÷Ave(tvm) 2 , then add tvm(i) corresponding to the sequence number i in thv(i) to the array Tf, where thv(i) = 1 ÷ (M1(i) + tvm(i)) + 1 ÷ (M2(i) + tvm(i)), M1(i) and M2(i) represent the i-th value in the array M1 and the i-th value in the array M2, respectively, and Ave(tvm) represents the average value of the N values ​​in the array tvm; In the first algorithm, the sequence number i is traversed from i=1 to i=N, thereby obtaining an array Tf filled with multiple values, and the die-cutting thermal curve is established with the array Tf.

5. A high-precision preparation method for a flexible die-cut circuit board FDC according to claim 4, characterized in that: The method of establishing the die-cutting thermal curve with the array Tf is specifically as follows: performing function fitting on all values ​​in the array Tf by the spline regression method, and outputting a piecewise fitting function Y=Tf(X), and using the fitting function as the die-cutting thermal curve.

6. A high-precision preparation method for a flexible die-cut circuit board FDC according to claim 4, characterized in that: The method for adjusting the cutting speed of the die-cutting head by the die-cutting thermal curve is as follows: each value in the array tvm is sequentially input as a function independent variable X into the die-cutting thermal curve Y=Tf(X), thereby obtaining N output values ​​Tf(tvm(1)), Tf(tvm(2)),…, Tf(tvm(N)), and the N output values ​​are accumulated as the fitting cumulative sum Fcs; Calculate the thermal sensitive interval, and sample the temperature data of the flexible circuit board material once through a high-precision temperature sensor at any time after the thermal sensitive interval calculation is completed, and record the sampled temperature value as Stvm. If the value of Stvm is greater than the right end value of the thermal sensitive interval, the cutting speed of the die-cutting head is reduced; if the value of Stvm is less than the left end value of the thermal sensitive interval, the cutting speed of the die-cutting head is increased; wherein, the thermal sensitive interval is [L1, R1], R1 = C ÷ Max (Tf (tvm)), L1 = C ÷ Min (Tf (tvm)), C = max {Fcs, Acs}, max {Fcs, Acs} means taking the maximum value of Fcs and Acs, and Acs is the cumulative sum of all values ​​in the array tvm.

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