Low-flow-resistance bionic micro-channel heat dissipation structure for concentrated heat source and case

Abstract

The invention relates to a low-flow-resistance bionic micro-channel heat dissipation structure aiming at a concentrated heat source and a case, the heat dissipation structure comprises a heat dissipation plate, a plurality of edge hollowed-out parts are arranged at intervals on the part close to the edge of the heat dissipation plate, and a central hollowed-out part is arranged at the center of the heat dissipation plate; the central hollowed-out part and the edge hollowed-out parts enable the heat dissipation plate to form a closed heat dissipation area, a cooling flow channel is formed in the heat dissipation area, and a cooling liquid inlet and a cooling liquid outlet which are communicated with the cooling flow channel are formed in the two ends of the heat dissipation plate respectively. The invention has the beneficial effects that the structure is simple, the design is reasonable, the flow channel layout design is optimized through a low flow resistance bionic method, the mechanical property of the whole plate is considered, the redundant structure is removed, the overall strength is considered through the flow channel structure, the weight of the heat dissipation structure is reduced, and the heat dissipation and weight reduction effects are realized; meanwhile, in combination with the 3D printing technology, local large-heat heat source micro-channel design is achieved so as to enhance the heat dissipation capacity, and meanwhile the heat dissipation structure is integrally formed.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic equipment, and in particular to a low-resistance bionic microchannel heat dissipation structure and a chassis for a concentrated heat source. Background Art

[0002] The increasing integration of electronic devices has led to a significant increase in the heat generated by the devices, and the heat dissipation problem has become the main problem that needs to be solved in structural design. The electronic plug-ins and boards are in contact with the top of the device through the heat dissipation structure to conduct heat and dissipate heat. The heat dissipation structure is processed with heat dissipation fins or flow channels to enhance the heat dissipation capacity. The heat dissipation efficiency of the coolant passing through the heat dissipation structure is much greater than the fin air cooling method, thereby improving the heat dissipation capacity of the board. Conventional flow channel design basically follows the mature process (vacuum brazing / friction stir welding / electron beam welding), and the flow channel layout is carried out according to the heating device. The flow channel design is relatively fixed, and it is impossible to reasonably distribute the flow according to the heat generated by each device, especially for high-power heat sources. It is easy to cause differences in the heat dissipation capacity of different heating positions on the whole board, resulting in uneven real-time temperature of the whole board, affecting the heat dissipation efficiency. Summary of the invention

[0003] The present invention provides a low-resistance bionic microchannel heat dissipation structure and a chassis for concentrated heat sources, aiming to solve the problems in the prior art.

[0004] The technical solution of the present invention to solve the above technical problems is as follows:

[0005] A low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources, comprising a heat dissipation plate, wherein a plurality of edge hollowings are arranged at intervals near the edge of the heat dissipation plate, and a central hollowing is arranged at the center of the heat dissipation plate; the central hollowing and the plurality of edge hollowings enable the heat dissipation plate to form a closed heat dissipation area, a cooling channel is arranged in the heat dissipation area, and a coolant inlet and a coolant outlet connected to the cooling channel are respectively arranged at both ends of the heat dissipation plate.

[0006] The beneficial effect of the present invention is that during use, the coolant is sent into the cooling channel from the coolant inlet in a manner that can be thought of by a person skilled in the art, and the coolant flows in the cooling channel to dissipate heat for the electronic equipment, with better heat dissipation effect.

[0007] The present invention has a simple structure and a reasonable design. It optimizes the flow channel layout design through a low flow resistance bionic method, while taking into account the mechanical properties of the entire plate, removing redundant structures, and taking into account the overall strength through the flow channel structure, thereby reducing the weight of the heat dissipation structure and achieving the effect of heat dissipation and weight reduction. At the same time, combined with 3D printing technology, it realizes the design of local large heat source microchannels to enhance the heat dissipation capacity, and at the same time, the heat dissipation structure is integrated into one.

[0008] Based on the above technical solution, the present invention can also be improved as follows.

[0009] Furthermore, a portion of the heat dissipation region close to the coolant inlet is provided with an end hollowing-out portion, and the end hollowing-out portion divides the coolant fed from the coolant inlet into three cooling paths.

[0010] The beneficial effects of adopting the above further scheme are simple structure, reasonable setting of the end hollowing out, and optimization design combined with the bionic optimization analysis method, which reduces the flow resistance and improves the heat dissipation capacity of the local high heat flux density position, and the heat dissipation effect is greatly improved; in addition, the design of the end hollowing out can reduce the weight of the entire heat sink.

[0011] Furthermore, a plurality of heat dissipation hollows are respectively arranged at intervals on the three cooling paths of the heat dissipation area close to the coolant inlet.

[0012] The beneficial effects of adopting the above-mentioned further scheme are simple structure, reasonable arrangement of multiple heat dissipation hollows, and optimized design combined with bionic optimization analysis method, which reduces flow resistance and improves heat dissipation capacity at local high heat flux density locations, greatly improving the heat dissipation effect; in addition, the design of multiple heat dissipation hollows can reduce the weight of the entire heat sink.

[0013] Furthermore, a portion of the heat dissipation region close to the coolant outlet is provided with a plurality of end hollowing portions at intervals, and the end hollowing portions divide the portion of the heat dissipation region close to the coolant outlet into a plurality of cooling paths.

[0014] The beneficial effects of adopting the above-mentioned further scheme are simple structure, reasonable arrangement of multiple end hollowing parts, and optimized design combined with bionic optimization analysis method, which reduces flow resistance and improves heat dissipation capacity at local high heat flux density locations, greatly improving the heat dissipation effect; in addition, the design of multiple end hollowing parts can reduce the weight of the entire heat sink.

[0015] Furthermore, the shapes of the plurality of end hollowings 2 are different, and the shapes of the plurality of end hollowings 2 are different from the shape of the end hollowing 1.

[0016] The beneficial effect of adopting the above further scheme is that the shapes of the plurality of end hollowings 2 and end hollowings 1 are reasonably designed, and can be reasonably designed according to the heat distribution of the electronic device to be dissipated, thereby ensuring the heat dissipation effect of the electronic device.

[0017] Furthermore, a plurality of heat dissipation hollow portions are provided at intervals in the heat dissipation region near the other side of the coolant outlet.

[0018] The beneficial effect of adopting the above-mentioned further scheme is that the multiple heat dissipation hollows are reasonably designed, which can be reasonably designed according to the heat distribution of the electronic equipment to be dissipated, ensuring the heat dissipation effect of the electronic equipment. The structure is simple, and the multiple end hollows are reasonably set. The bionic optimization analysis method is combined for optimization design to reduce the flow resistance and improve the heat dissipation capacity of the local high heat flux density position, and the heat dissipation effect is greatly improved. In addition, the design of multiple heat dissipation hollows can reduce the weight of the entire heat sink.

[0019] Furthermore, the shapes of the plurality of heat dissipation hollows 2 are different.

[0020] The beneficial effect of adopting the above further solution is that the shapes of the plurality of heat dissipation hollows 2 are reasonably designed, and can be reasonably designed according to the heat distribution of the electronic device to be dissipated, thereby ensuring the heat dissipation effect of the electronic device.

[0021] Furthermore, locking strips for connecting to a chassis are relatively fixedly installed at both ends of the heat sink, one end of the two locking strips is respectively fixedly connected to a fluid connector, one end of the two fluid connectors is respectively connected to the coolant inlet and the coolant outlet, and the other end is respectively used to connect to a liquid-cooled chassis.

[0022] The beneficial effect of adopting the above-mentioned further scheme is that the structure is simple and the design is comprehensive. The heat sink can be fixedly connected to the chassis frame by means of a locking strip. At the same time, the two fluid connectors can realize the connection between the coolant inlet and the coolant outlet of the liquid-cooled chassis and the cooling channel, thereby realizing the cooling of the electronic equipment and achieving a better cooling effect.

[0023] Furthermore, a plurality of pullers for connecting to a chassis are fixedly connected at intervals on the heat dissipation plate, and an electrical printed circuit board is fixedly connected to one side of the heat dissipation plate.

[0024] The beneficial effects of adopting the above further solution are simple structure and comprehensive design. The heat sink can be fixedly connected to the chassis frame by using a puller, and the assembly is convenient.

[0025] The present invention also relates to a chassis, comprising a chassis body, and also comprising a plurality of low-resistance bionic microchannel heat dissipation structures for concentrated heat sources as described above, wherein the plurality of heat dissipation plates are evenly spaced and installed side by side in the chassis body.

[0026] The beneficial effect of adopting the above-mentioned further scheme is that the present invention also provides a chassis with a simple structure and reasonable design. The flow channel layout design is optimized through a low flow resistance bionic method, while taking into account the mechanical properties of the entire board, removing redundant structures, and taking into account the overall strength through the flow channel structure, thereby reducing the weight of the heat dissipation structure and achieving the effect of heat dissipation and weight reduction; at the same time, combined with 3D printing technology, a local large heat source microchannel design is realized to enhance the heat dissipation capacity, and the heat dissipation structure is integrated into one. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of the heat dissipation plate in the present invention;

[0028] Figure 2 It is a front view of the heat dissipation plate in the present invention;

[0029] Figure 3 for Figure 2 Sectional view along AA direction;

[0030] Figure 4 It is a structural schematic diagram of the chassis in the present invention;

[0031] Figure 5 It is a schematic diagram of the three-dimensional structure of a heat dissipation plate in the prior art;

[0032] Figure 6 It is a front view of a heat sink in the prior art;

[0033] Figure 7 for Figure 6 Cross-sectional view along the BB axis.

[0034] Figure 8 A temperature distribution diagram of the electronic device when the heat dissipation plate of the present invention dissipates heat;

[0035] Fig. 9 This is a temperature distribution diagram of an electronic device when a heat sink dissipates heat in the prior art.

[0036] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0037] 1. Heat sink; 2. Hollow edge; 3. Hollow center; 4. Cooling channel; 5. Coolant inlet; 6. Coolant outlet; 7. End hollow one; 8. Heat dissipation hollow one; 9. End hollow two; 10. Heat dissipation hollow two; 11. Locking strip; 12. Fluid connector; 13. Liquid-cooled chassis; 14. Extractor; 15. Electrical printed circuit board; 16. Box body. DETAILED DESCRIPTION

[0038] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0041] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0042] Example 1

[0043] like Figures 1 to 4 As shown, this embodiment provides a low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources, including a heat sink 1, wherein a plurality of edge hollows 2 are provided at intervals near the edge of the heat sink 1, and a central hollow 3 is provided at the center of the heat sink 1; the central hollow 3 and the plurality of edge hollows 2 enable the heat sink 1 to form a closed heat dissipation area, a cooling channel 4 is provided in the heat dissipation area, and a coolant inlet 5 and a coolant outlet 6 connected to the cooling channel 4 are respectively provided at both ends of the heat sink 1.

[0044] During use, the coolant is delivered into the cooling channel 4 from the coolant inlet 5 in a manner that can be imagined by a person skilled in the art. The coolant flows in the cooling channel 4 to dissipate heat for the electronic equipment and is discharged from the coolant outlet 6, with a better heat dissipation effect.

[0045] Preferably, in this embodiment, the heat sink 1 is preferably a rectangular plate structure.

[0046] In addition, the heat sink 1 is an integrated structure printed by 3D printing technology, which can quickly realize the molding of microfluidic structure through 3D printing, and can achieve mechanical features that cannot be conventionally processed, and no leakage risk of the flow channel, thereby improving the safety of the heat dissipation structure. In addition, 3D printing can be used to mold microfluidic structures that cannot be achieved by conventional mechanical processing.

[0047] Preferably, in this embodiment, the plurality of edge hollows 2 are in an irregular closed structure.

[0048] In addition, the number of the edge hollows 2 is preferably four, and the four edge hollows 2 are respectively distributed at the four corners of the heat sink 1 .

[0049] Preferably, in this embodiment, the central hollow 3 is an irregular closed structure.

[0050] Based on the above solution, the heat dissipation structure provided in this embodiment is based on the weight reduction design of the flow channel structure, removing unnecessary metal structures, compared with the heat dissipation structure in the traditional technology (refer to the attached Figures 5 to 7 ) Achieve 50% weight reduction of the whole board.

[0051] The heat dissipation structure provided in this embodiment is designed according to the microchannel structure of the heat generating device on the corresponding electrical printed circuit board, and is optimized by combining the bionic optimization analysis method to reduce the flow resistance and improve the heat dissipation capacity of the local high heat flux density position.

[0052] This embodiment has a simple structure and a reasonable design. It optimizes the flow channel layout design through a low flow resistance bionic method, takes into account the mechanical properties of the entire board, removes redundant structures, takes into account the overall strength through the flow channel structure, reduces the weight of the heat dissipation structure, and achieves the effect of heat dissipation and weight reduction. At the same time, combined with 3D printing technology, a local large heat source microchannel design is realized to enhance the heat dissipation capacity, and the heat dissipation structure is integrated into one.

[0053] Example 2

[0054] On the basis of Example 1, in this embodiment, a portion of the heat dissipation area close to the coolant inlet 5 is provided with an end hollow 7, and the end hollow 7 divides the coolant fed from the coolant inlet 5 into three cooling paths.

[0055] This solution has a simple structure, and the end hollowing-out 7 is reasonably set. It is optimized and designed in combination with the bionic optimization analysis method, which reduces the flow resistance and improves the heat dissipation capacity of the local high heat flux density position, thereby greatly improving the heat dissipation effect. In addition, the design of the end hollowing-out 7 can reduce the weight of the entire heat sink 1.

[0056] Preferably, in this embodiment, the end hollow portion 7 is an irregular hole structure, and its specific shape is designed according to the temperature distribution of the electronic device to be cooled.

[0057] Example 3

[0058] On the basis of Example 2, in this embodiment, a plurality of heat dissipation hollows 8 are respectively provided at intervals on the three cooling paths of the heat dissipation area close to the coolant inlet 5 .

[0059] This solution has a simple structure, and multiple heat dissipation hollows 8 are reasonably arranged. The design is optimized by combining the bionic optimization analysis method to reduce the flow resistance while improving the heat dissipation capacity of the local high heat flux density position, and the heat dissipation effect is greatly improved; in addition, the design of multiple heat dissipation hollows 8 can reduce the weight of the entire heat dissipation plate 1.

[0060] It should be noted that the number of the heat dissipation hollows 8 can be designed according to the temperature distribution of the electronic equipment to be cooled.

[0061] Example 4

[0062] On the basis of any one of Examples 2 to 3, in this embodiment, a portion of the heat dissipation area close to the coolant outlet 6 is provided with a plurality of end hollowing portions 9 at intervals, and the end hollowing portions 9 divide the portion of the heat dissipation area close to the coolant outlet 6 into a plurality of cooling paths.

[0063] This solution has a simple structure, and the multiple end hollows 9 are reasonably arranged. The design is optimized by combining the bionic optimization analysis method to reduce the flow resistance while improving the heat dissipation capacity of the local high heat flux density position, and the heat dissipation effect is greatly improved; in addition, the design of multiple end hollows 9 can reduce the weight of the entire heat sink 1.

[0064] It should be noted that the number of the end hollow portions 9 can be designed according to the temperature distribution of the electronic equipment to be cooled.

[0065] Example 5

[0066] On the basis of Example 4, in this embodiment, the shapes of the plurality of end hollowings 9 are different, and the shapes of the plurality of end hollowings 9 and the end hollowings 7 are different.

[0067] The shapes of the plurality of end hollow portions 9 and the end hollow portions 7 are reasonably designed and can be reasonably designed according to the heat distribution of the electronic device to be cooled to ensure the heat dissipation effect of the electronic device.

[0068] Alternatively, the shapes of the plurality of end hollow portions 9 may be consistent, and the shape of the end hollow portion 9 may be consistent with the shape of the end hollow portion 1 7.

[0069] Example 6

[0070] On the basis of any one of Embodiments 4 to 5, in this embodiment, a plurality of heat dissipation hollow portions 10 are provided at intervals in the heat dissipation region near the other side of the coolant outlet 6 .

[0071] The multiple heat dissipation hollows 10 are reasonably designed and can be reasonably designed according to the heat distribution of the electronic device to be dissipated to ensure the heat dissipation effect of the electronic device. The structure is simple, and the multiple end hollows 9 are reasonably set and optimized by combining the bionic optimization analysis method to reduce the flow resistance while improving the heat dissipation capacity of the local high heat flux density position, and the heat dissipation effect is greatly improved. In addition, the design of multiple heat dissipation hollows can reduce the weight of the entire heat sink 1.

[0072] It should be noted that the number of the heat dissipation hollows 10 can be designed according to the temperature distribution of the electronic equipment to be cooled.

[0073] Example 7

[0074] On the basis of Embodiment 6, in this embodiment, the shapes of the plurality of heat dissipation hollow portions 10 are different.

[0075] The shapes of the plurality of heat dissipation hollow portions 10 are reasonably designed and can be reasonably designed according to the heat distribution of the electronic device to be dissipated, thereby ensuring the heat dissipation effect of the electronic device.

[0076] Alternatively, the shapes of the plurality of heat dissipation hollow portions 10 may be consistent, and may be specifically designed according to the temperature distribution of the electronic device to be cooled.

[0077] Example 8

[0078] On the basis of the above embodiments, in this embodiment, locking strips 11 for connecting to a chassis are relatively fixedly installed at both ends of the heat sink 1, and one end of the two locking strips 11 is respectively fixedly connected to a fluid connector 12, one end of the two fluid connectors 12 is respectively connected to the coolant inlet 5 and the coolant outlet 6, and the other end is respectively used to connect to a liquid-cooled chassis 13.

[0079] The solution has a simple structure and a comprehensive design. The heat sink 1 can be fixedly connected to the chassis frame by using the locking strip 11. At the same time, the two fluid connectors 12 can realize the connection between the liquid-cooled chassis 13 and the coolant inlet 5 and the coolant outlet 6 of the cooling channel 4, thereby realizing the cooling of the electronic equipment and achieving a better cooling effect.

[0080] Based on the above solution, the fluid connector 12 is connected to the corresponding fluid connector of the liquid cooling chassis rack to achieve fluid communication.

[0081] Example 9

[0082] On the basis of Example 8, in this embodiment, a plurality of pullers 14 for connecting to a chassis are fixedly connected to the heat sink 1 at intervals, and an electrical printed circuit board 15 is fixedly connected to one side of the heat sink 1 .

[0083] The solution has a simple structure and a comprehensive design. The heat sink 1 can be fixedly connected to the chassis frame by using the puller 14, and the assembly is convenient.

[0084] It should be noted that the above-mentioned fluid connector 12, extractor 14 and liquid cooling chassis 13 respectively adopt existing technologies, and their specific structures and principles are not described in detail here.

[0085] The heat dissipation structure has 3D printed flow channels and micro-channel structures for high heat flux density devices, and also has printed installation interfaces for extractors, locking strips, and fluid connectors. The heat of electronic devices is directly transferred to the working medium in the flow channel through the heat dissipation structure, and then the working medium is transferred to the outside through the fluid connector.

[0086] Example 10

[0087] Based on the above embodiments, this embodiment also provides a chassis, including a box body 16, and also includes multiple low-resistance bionic microchannel heat dissipation structures for concentrated heat sources as described above, and multiple heat dissipation plates 1 are evenly spaced and installed side by side in the box body 16.

[0088] Preferably, in this embodiment, the box body 16 is preferably a rectangular box body, and the plurality of heat dissipation plates 1 are evenly spaced and distributed along a direction from one side to the other side of the box body 16 .

[0089] It should be noted that the box 16 adopts the existing technology, and its specific structure and principle are not described in detail here.

[0090] Based on the above solution, the heat sink 1 can be fixedly connected to the chassis frame by using the locking strip 11 and the puller 14, which is convenient for assembly.

[0091] The present embodiment also provides a chassis with a simple structure and reasonable design. The flow channel layout design is optimized through a low flow resistance bionic method, while taking into account the mechanical properties of the entire board, removing redundant structures, and taking into account the overall strength through the flow channel structure, thereby reducing the weight of the heat dissipation structure and achieving the effect of heat dissipation and weight reduction. At the same time, combined with 3D printing technology, a micro-channel design of a local large heat source is realized to enhance the heat dissipation capacity, and the heat dissipation structure is integrated into one.

[0092] The working principle of the present invention is as follows:

[0093] During use, the coolant is delivered into the cooling channel 4 from the coolant inlet 5 in a manner that can be imagined by a person skilled in the art. The coolant flows in the cooling channel 4 to dissipate heat for the electronic equipment and is discharged from the coolant outlet 6, with a better heat dissipation effect.

[0094] The heat dissipation structure provided by the present invention is lighter in weight when installed with the same electrical equipment, and has stronger heat dissipation capacity and smaller flow resistance when installed with the electrical equipment with the same heat generation.

[0095] In addition, the flow field and flow resistance bionic optimization design method can be widely used in liquid cooling structures with various concentrated heat sources.

[0096] Compared with traditional electronic chassis, it has higher integration, more compact chassis structure, higher space utilization, and structural and electrical integration.

[0097] like Figure 8 and Fig. 9 The figures show the temperature distribution diagrams of the heat dissipation structure provided by the present invention and the heat dissipation structure in the prior art when the electronic device is radiated. The red area in the figure is the area with higher temperature, and the darker the red, the higher the temperature. Therefore, in comparison, the heat dissipation structure provided by the present invention has a better heat dissipation effect on the electronic device (refer to Figure 8 ), while the heat dissipation structure in the prior art has a poor heat dissipation effect on electronic equipment (refer to Fig. 9 ).

[0098] It should be noted that all electronic components involved in the present invention adopt the existing technology, and the above-mentioned components are electrically connected to the controller, and the control circuit between the controller and each component is the existing technology.

[0099] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0100] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0101] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources, characterized by: The invention comprises a heat dissipation plate (1), wherein a plurality of edge hollowings (2) are provided at intervals near the edge of the heat dissipation plate (1), and a central hollowing (3) is provided at the center of the heat dissipation plate (1); the central hollowing (3) and the plurality of edge hollowings (2) enable the heat dissipation plate (1) to form a closed heat dissipation area, wherein a cooling channel (4) is provided in the heat dissipation area, and a cooling liquid inlet (5) and a cooling liquid outlet (6) which are connected to the cooling channel (4) are respectively provided at both ends of the heat dissipation plate (1).

2. The low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources according to claim 1, characterized in that: An end hollowing-out (7) is provided at a portion of the heat dissipation region close to the coolant inlet (5), and the end hollowing-out (7) divides the coolant fed from the coolant inlet (5) into three cooling paths.

3. The low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources according to claim 2, characterized in that: A plurality of heat dissipation hollows (8) are respectively arranged at intervals on the three cooling paths of the heat dissipation area close to the coolant inlet (5).

4. The low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources according to claim 2, characterized in that: A portion of the heat dissipation region close to the coolant outlet (6) is provided with a plurality of end hollowing portions (9) at intervals, and the end hollowing portions (9) divide the portion of the heat dissipation region close to the coolant outlet (6) into a plurality of cooling paths.

5. The low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources according to claim 4, characterized in that: The shapes of the plurality of end hollowings 2 (9) are different, and the shapes of the plurality of end hollowings 2 (9) and the end hollowing 1 (7) are different.

6. The low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources according to claim 4, characterized in that: A plurality of heat dissipation hollows (10) are arranged at intervals in the heat dissipation area near the other side of the coolant outlet (6).

7. The low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources according to claim 6, characterized in that: The shapes of the plurality of heat dissipation hollows 2 (10) are different.

8. The low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources according to any one of claims 1 to 7, characterized in that: Locking strips (11) for connecting to a chassis are relatively fixedly installed at both ends of the heat sink (1), one end of each of the two locking strips (11) is respectively fixedly connected to a fluid connector (12), one end of each of the two fluid connectors (12) is respectively connected to the coolant inlet (5) and the coolant outlet (6), and the other end is respectively used to connect to a liquid-cooled chassis (13).

9. The low flow resistance bionic microchannel heat dissipation structure for concentrated heat sources according to claim 8, characterized in that: The heat sink (1) is also fixedly connected to a plurality of pullers (14) for connecting to a chassis at intervals, and an electrical printed circuit board (15) is also fixedly connected to one side of the heat sink (1).

10. A chassis, comprising a housing (16), characterized in that: It also comprises a plurality of low flow resistance bionic microchannel heat dissipation structures for concentrated heat sources as described in any one of claims 1 to 9, wherein the plurality of heat dissipation plates (1) are evenly spaced and installed side by side in the box (16).

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