Heat dissipation device and electronic equipment

Abstract

The embodiment of the invention discloses a heat dissipation device and electronic equipment, a heat dissipation module in the heat dissipation device comprises at least two first liquid cooling plates which are arranged side by side and communicated in series, each first liquid cooling plate comprises a liquid cooling flow channel with a liquid inlet and a liquid outlet, the liquid inlet of the first liquid cooling plate located at one end is communicated with a first liquid inlet pipe, and the liquid outlet of the first liquid cooling plate located at the other end is communicated with a second liquid inlet pipe; the liquid outlet or the liquid inlet of the first liquid cooling plate located at the other end is communicated with the first liquid return pipe, and the other liquid outlets and liquid inlets, every two adjacent liquid outlets and every two adjacent liquid inlets are communicated in a staggered mode through connecting pipes. The adjacent first liquid cooling plates in the heat dissipation device are connected in series and communicated through the staggered holes of the connecting pipes, so that the bending radius and operability of the connecting pipes are increased, the flow resistance is reduced, and the heat dissipation capability is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of communication equipment, and in particular to a heat dissipation device and electronic equipment. Background Art

[0002] As the demand for high-density, high-performance optical modules in data centers and high-performance computing continues to grow, heat dissipation has become one of the key factors restricting equipment performance. Traditional air cooling is not enough for high-power density optical modules, while liquid cooling has gradually become the mainstream trend in the industry with its excellent heat dissipation effect. However, in actual applications, especially in high-density installation environments, multiple liquid cooling plates of multiple optical modules usually need to be installed side by side in a close arrangement to maximize the utilization of chassis space.

[0003] At present, the adjacent liquid inlets and outlets between adjacent liquid cooling plates are usually connected in series through connecting pipes. Since the optical module itself is small in size, and in order to save space, the liquid inlets and outlets of the liquid cooling plate on it are usually designed to be compact, resulting in a very small bending radius of the connecting pipe between adjacent liquid cooling plates. This not only increases the difficulty of installing the connecting pipe, but also increases the water flow resistance due to the sharp bending angle, affecting the cooling effect, and even causing the risk of damage to the connecting pipe. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a heat dissipation device and an electronic device, which increases the bending radius and operability of the connecting pipes, reduces the flow resistance, and improves the heat dissipation capacity by connecting the connecting pipes in an alternating series manner.

[0005] In a first aspect, an embodiment of the present invention provides a heat dissipation device, the heat dissipation device comprising at least one group of heat dissipation modules, the heat dissipation modules comprising at least two first liquid cooling plates arranged side by side and connected in series, each first liquid cooling plate comprising a liquid cooling channel having a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet being arranged on a first side surface of the first liquid cooling plate and respectively close to two side edges, and the liquid inlet and the liquid outlet of two adjacent first liquid cooling plates being arranged adjacent to each other;

[0006] Among them, the liquid inlet of the first liquid cooling plate located at one end is connected to the first liquid inlet pipe, and the liquid outlet or liquid inlet of the first liquid cooling plate located at the other end is connected to the first liquid return pipe, and among all the other liquid outlets and liquid inlets, two adjacent liquid outlets and two adjacent liquid inlets are connected in an alternating manner through connecting pipes.

[0007] Optionally, the heat dissipation module includes an even number of the first liquid cooling plates, and the liquid inlets of the two first liquid cooling plates located at both ends are respectively connected to the first liquid inlet pipe and the first liquid return pipe, and among all the other liquid outlets and liquid inlets, two adjacent liquid outlets and two adjacent liquid inlets are respectively connected in an interlaced manner through the connecting pipes.

[0008] Optionally, the heat dissipation module includes an odd number of the first liquid cooling plates, the liquid inlet of the first liquid cooling plate located at one end is connected to the first liquid inlet pipe, the liquid outlet of the first liquid cooling plate located at the other end is connected to the first liquid return pipe, and among all the other liquid outlets and liquid inlets, two adjacent liquid outlets and two adjacent liquid inlets are respectively connected in an alternating manner through the connecting pipes.

[0009] Optionally, the liquid inlet is provided with a liquid inlet joint, and the liquid outlet is provided with a liquid outlet joint, and the liquid inlet joint and the liquid outlet joint are respectively connected to the first liquid inlet pipe or the first liquid return pipe or the connecting pipe.

[0010] Optionally, a first connecting block is installed outside the liquid inlet, the first connecting block is provided with a first mounting through hole, a first guide channel is formed between the first connecting block and the first liquid cooling plate, the first mounting through hole and the liquid inlet are respectively connected with openings at both ends of the first guide channel, and the first mounting through hole and the liquid inlet are staggered and not opposite;

[0011] A second connecting block is installed on the outside of the liquid outlet, and the second connecting block is provided with a second mounting through hole. A second guide channel is formed between the second connecting block and the first liquid cooling plate, and the second mounting through hole and the liquid outlet are respectively connected to the openings at both ends of the second guide channel, and the second mounting through hole and the liquid outlet are staggered and not opposite.

[0012] Optionally, the first guide channel and the second guide channel extend in the height direction or in the length direction, the first mounting through hole and the liquid inlet are staggered and not opposite in the height direction or in the length direction, and the second mounting through hole and the liquid outlet are staggered and not opposite in the height direction or in the length direction.

[0013] Optionally, the first guide channel and the second guide channel are L-shaped channels or obliquely extending channels, the first mounting through hole and the liquid inlet are obliquely staggered and not opposite, and the second mounting through hole and the liquid outlet are obliquely staggered and not opposite.

[0014] Optionally, the first liquid cooling plate is provided with a first fluid groove, the first fluid groove is located on the outside of the liquid inlet, and the liquid inlet is connected to one end of the first fluid groove, the first connecting block is provided with a second fluid groove, the second fluid groove is located on one side of the first mounting through hole, and one end of the second fluid groove is connected to the first mounting through hole, and the first fluid groove and the second fluid groove are buckled to form the first guide channel;

[0015] The first liquid cooling plate is provided with a third fluid groove, the third fluid groove is located on the outside of the liquid outlet, and the liquid outlet is connected with one end of the third fluid groove, the second connecting block is provided with a fourth fluid groove, the fourth fluid groove is located on one side of the second mounting through hole, and one end of the fourth fluid groove is connected with the second mounting through hole, and the third fluid groove and the fourth fluid groove are buckled to form the second guide channel.

[0016] Optionally, the heat dissipation device includes multiple groups of heat dissipation modules arranged side by side, and the first liquid inlet pipes and first liquid return pipes of the multiple groups of heat dissipation modules are respectively connected to the cooling capacity distribution unit through the first liquid distributor and the second liquid distributor to form multiple first cooling liquid circuits arranged in parallel.

[0017] Optionally, the heat dissipation device also includes a second liquid cooling plate, and a second liquid inlet pipe and a second liquid return pipe of the second liquid cooling plate are respectively connected to the cold distribution unit through the first liquid distributor and the second liquid distributor to form a second cooling liquid circuit, and the second cooling liquid circuit is arranged in parallel with the first cooling liquid circuit.

[0018] Optionally, a main liquid inlet pipe is connected between the first liquid distributor and the cold capacity distribution unit, and a main liquid return pipe is connected between the second liquid distributor and the cold capacity distribution unit.

[0019] In a second aspect, an embodiment of the present invention provides an electronic device, comprising a chassis and a heat dissipation device as described in the first aspect, wherein at least two optical module groups are arranged in the chassis, and the first liquid cooling plate is connected to the optical module groups in a one-to-one correspondence.

[0020] Optionally, the heat dissipation device further includes a second liquid cooling plate arranged in parallel with the loop of the heat dissipation module, and the electronic device further includes an electronic device, and the second liquid cooling plate is connected to the electronic device.

[0021] Optionally, the electronic device also includes a shielding cage and a radiator snap-fit ​​structure arranged above the shielding cage, the radiator snap-fit ​​structure includes a first snap-fit ​​piece and a second snap-fit ​​piece that are snap-fitted together to form a accommodating space, the first snap-fit ​​piece is snap-fitted to the shielding cage, the first liquid cooling plate is installed in the accommodating space, and the optical module group is installed in the shielding cage.

[0022] The heat dissipation module in the heat dissipation device of the embodiment of the present invention includes at least two first liquid cooling plates arranged side by side and connected in series, each first liquid cooling plate includes a liquid cooling channel having a liquid inlet and a liquid outlet, the liquid inlet of the first liquid cooling plate at one end is connected to the first liquid inlet pipe, the liquid outlet or liquid inlet of the first liquid cooling plate at the other end is connected to the first liquid return pipe, and among all the other liquid outlets and liquid inlets, two adjacent liquid outlets and two adjacent liquid inlets are connected in an alternating manner through connecting pipes. The alternating and serial connection between adjacent first liquid cooling plates in the heat dissipation device through connecting pipes increases the bending radius and operability of the connecting pipes, reduces the flow resistance, and improves the heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0024] Figure 1 is a schematic diagram of a framework of a heat dissipation device according to an embodiment of the present invention;

[0025] Figure 2 It is a structural schematic diagram of the connection between the first liquid cooling plate, the liquid inlet joint and the liquid outlet joint according to an embodiment of the present invention;

[0026] Figure 3 is a structural schematic diagram of the connection between a first liquid cooling plate, a first connecting block and a second connecting block according to another embodiment of the present invention;

[0027] Figure 4 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present invention;

[0028] Figure 5 is a schematic structural diagram of a first liquid cooling plate according to another embodiment of the present invention;

[0029] Figure 6 is a structural schematic diagram of a first interconnection block according to another embodiment of the present invention;

[0030] Figure 7 is a schematic structural diagram of a second interconnection block according to another embodiment of the present invention;

[0031] Figure 8 is a cross-sectional view of the connection between a first liquid cooling plate, a first connecting block and a second connecting block according to another embodiment of the present invention;

[0032] Fig. 9 is a structural schematic diagram of a heat dissipation device according to another embodiment of the present invention;

[0033] Fig.10 is a structural schematic diagram of a first liquid cooling plate according to another embodiment of the present invention;

[0034] Fig.11 is a structural schematic diagram of a first communication block according to another embodiment of the present invention;

[0035] Fig.12 is a structural schematic diagram of a second communication block according to another embodiment of the present invention;

[0036] Fig.13 is a cross-sectional view of the connection between a first liquid cooling plate, a first connecting block and a second connecting block according to another embodiment of the present invention;

[0037] Fig.14 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present invention.

[0038] Reference numerals:

[0039] 100-heat dissipation module; 1-first liquid cooling plate; 11-liquid inlet; 12-liquid outlet; 13-liquid cooling channel; 14-first fluid groove; 15-third fluid groove; 2-first liquid inlet pipe; 3-first liquid return pipe; 4-connecting pipe; 5-liquid inlet joint; 6-liquid outlet joint; 7-first connecting block; 71-first mounting through hole; 72-second fluid groove; 7a-first guide channel; 8-second connecting block; 81-second mounting through hole; 82-fourth fluid groove; 8a-second guide channel; 9-first liquid distributor; 10-second liquid distributor; 101-second liquid inlet pipe; 102-second liquid return pipe; 103-main liquid inlet pipe; 104-main liquid return pipe; 105-second liquid cooling plate; 200-cold capacity distribution unit. DETAILED DESCRIPTION

[0040] The present application is described below based on embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, some specific details are described in detail. It is possible for those skilled in the art to fully understand the present application without the description of these details. In order to avoid confusing the essence of the present application, known methods, processes, flows, components and circuits are not described in detail.

[0041] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0042] Unless otherwise clearly defined and specified, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] Unless the context clearly requires otherwise, the words "include", "comprising" and similar words throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, the meaning is "including but not limited to".

[0044] In the description of this application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0045] Figure 1 Schematic diagram of the framework of the heat dissipation device of the present application embodiment. Figure 1 As shown, the heat dissipation device includes at least one group of heat dissipation modules 100, each group of heat dissipation modules 100 includes at least two first liquid cooling plates 1 arranged side by side, and all the first liquid cooling plates 1 in each group of heat dissipation modules 100 are connected in series. Among them, each first liquid cooling plate 1 includes a liquid cooling channel 13 having a liquid inlet 11 and a liquid outlet 12. The liquid inlet 11 and the liquid outlet 12 are arranged on the first side of the first liquid cooling plate 1 and are respectively close to the edges on both sides. The first side refers to the side of one side of the first liquid cooling plate 1 along the width direction. Since all the first liquid cooling plates 1 are arranged side by side, the liquid inlet 11 and the liquid outlet 12 in each group of heat dissipation modules 100 are arranged in a sequentially interlaced manner, that is, starting from one side, the liquid inlet 11, the liquid outlet 12, the liquid inlet 11, and the liquid outlet 12 are arranged in sequence, which makes the liquid inlet 11 of one of the adjacent first liquid cooling plates 1 and the liquid outlet 12 of another first liquid cooling plate 1 arranged adjacent to each other, and the distance is short.

[0046] like Figure 1As shown, the liquid inlet 11 of the first liquid cooling plate 1 at one end of each heat dissipation module 100 is connected to the first liquid inlet pipe 2, and the liquid outlet 12 or the liquid inlet 11 of the first liquid cooling plate 1 at the other end is connected to the first liquid return pipe 3. Among all the other liquid outlets 12 and liquid inlets 11 in the heat dissipation module 100, two adjacent liquid outlets 12 and two adjacent liquid inlets 11 are connected in a staggered manner through connecting pipes 4, that is, staggered holes are connected in series. Staggered connection and staggered holes in series refer to that there is a liquid inlet 11 between two liquid outlets 12 (non-adjacent) connected at both ends of the connecting pipe 4 or there is a liquid outlet 12 between two liquid inlets 11 (non-adjacent). The staggered holes in series between adjacent first liquid cooling plates 1 in each heat dissipation module 100 can increase the bending radius of the connecting pipe 4, reduce the difficulty of installing the connecting pipe 4 and the first liquid cooling plate 1, reduce the flow resistance, and improve the cooling effect.

[0047] The port of the first liquid cooling plate 1 at the other end connected to the first liquid return pipe 3 depends on the number of first liquid cooling plates 1 in each group of heat dissipation modules 100. Specifically, when the heat dissipation module 100 includes an even number of first liquid cooling plates 1, the first liquid inlet pipe 2 and the first liquid return pipe 3 are respectively connected to the liquid inlets 11 of the two first liquid cooling plates 1 at the two ends, and among all the other liquid outlets 12 and liquid inlets 11, two adjacent liquid outlets 12 and two adjacent liquid inlets 11 are respectively connected by a connecting pipe 4, such as Figure 1 When the heat dissipation module 100 includes an odd number of first liquid cooling plates 1, the liquid inlet 11 of the first liquid cooling plate 1 at one end is connected to the first liquid inlet pipe 2, and the liquid outlet 12 of the first liquid cooling plate 1 at the other end is connected to the first liquid return pipe 3. Among all the other liquid outlets 12 and liquid inlets 11, two adjacent liquid outlets 12 and two adjacent liquid inlets 11 are connected in an alternating manner through a connecting pipe 4, as shown in FIG. Figure 1 shown.

[0048] In the embodiment of the present application, the heat dissipation device may include multiple groups of heat dissipation modules 100, and the first liquid cooling plates 1 in the multiple groups of heat dissipation modules 100 are connected in series in the above-mentioned staggered manner to form a loop. Among them, the first liquid inlet pipes 2 and the first liquid return pipes 3 of the multiple groups of heat dissipation modules 100 are respectively connected to the cooling capacity distribution unit 200 through the first liquid distributor 9 and the second liquid distributor 10 to form multiple first cooling liquid loops arranged in parallel, such as Figure 1 A main liquid inlet pipe 103 is connected between the first liquid distributor 9 and the cold distribution unit 200, and a main liquid return pipe 104 is connected between the second liquid distributor 10 and the cold distribution unit 200. Figure 1 shown.

[0049] The first liquid distributor 9 and the second liquid distributor 10 have multiple liquid inlets and liquid return ports, and the first liquid distributor 9 and the second liquid distributor 10 are used to divert the coolant to form multiple parallel loops. The parallel arrangement of multiple first coolant loops means that in the liquid cooling system, multiple first coolant loops are independently connected to the same cold distribution unit 200, and each first coolant loop can be cooled independently without being affected by other loops, which can effectively improve the heat dissipation efficiency. In an optional embodiment, the main liquid inlet pipe 103 and the main liquid return pipe 104 can be connected to the cold distribution unit 200 respectively through quick connectors. Among them, the quick connector is pluggable and connected to the cold distribution unit 200, making the installation of the heat dissipation device more convenient.

[0050] Among them, the number of first liquid cooling plates 1 in each group of heat dissipation modules 100 may be the same or different, and the number of heat dissipation modules 100 and the number of first liquid cooling plates 1 in each group of heat dissipation modules 100 are determined according to the product specifications of the optical module. In the embodiment of the present application, multiple groups and multiple refer to two or more. Preferably, multiple groups of heat dissipation modules 100 are arranged side by side inside an electronic device, and side-by-side arrangement refers to arrangement in the same direction inside an electronic device or on a panel to achieve high-density installation and efficient management, which helps to optimize the space utilization inside the device and facilitates later maintenance and upgrading. In addition, multiple groups of heat dissipation modules 100 can also be set at corresponding positions according to specific needs.

[0051] like Figure 1 As shown, the heat dissipation device may also include a second liquid cold plate 105, and the second liquid cold plate 105 may also be connected to the cold distribution unit 200 through the above-mentioned first liquid distributor 9 and the second liquid distributor 10 to form a second coolant circuit. The second coolant circuit is arranged in parallel with the first coolant circuit to improve the heat dissipation efficiency. Specifically, the first liquid distributor 9 is connected to the second liquid cold plate 105 through the second liquid inlet pipe 101, and the second liquid distributor 10 is connected to the second liquid cold plate 105 through the second liquid return pipe 102. The coolant flows out from the cold distribution unit 200 through the main liquid inlet pipe 103 and the first liquid distributor 9, enters the second liquid inlet pipe 101 and flows into the second liquid cold plate 105, and then flows out from the second liquid cold plate 105 through the second liquid return pipe 102 to the second liquid distributor 10, and returns to the cold distribution unit 200 through the main liquid return pipe 104.

[0052] In one embodiment, the liquid inlet 11 of the first liquid cooling plate 1 is provided with a liquid inlet connector 5, and the liquid outlet 12 is provided with a liquid outlet connector 6. Figure 2As shown. The liquid inlet joint 5 and the liquid outlet joint 6 are directly connected to the first liquid inlet pipe 2 or the first liquid return pipe 3 or the connecting pipe 4 respectively. The liquid inlet joint 5 and the liquid outlet joint 6 will not change the outflow direction of the coolant. The liquid inlet joint 5 and the liquid outlet joint 6 are used to ensure that the connection between the pipeline and the first liquid cold plate 1 is both fast and reliable, while preventing leakage and ensuring that the system can operate stably for a long time. Among them, common types of liquid inlet joints 5 and liquid outlet joints 6 include quick-disconnect joints, threaded joints, ferrule joints, crimping joints, and flange joints. The selection of joints depends on the type of coolant, working pressure, temperature range, connection frequency, etc. Among them, the second liquid cold plate 105, the first liquid distributor 9, the second liquid distributor 10, etc. can also be connected to the pipeline through the above-mentioned joints.

[0053] In another embodiment, a first connecting block 7 is installed outside the liquid inlet 11 of the first liquid cooling plate 1, and a second connecting block 8 is installed at the liquid outlet 12 of the first liquid cooling plate 1. Figure 3 , Figure 4 and Fig. 9 The first connecting block 7 is provided with a first mounting through hole 71, and the second connecting block 8 is provided with a second mounting through hole 81, as shown. Figure 3 , Fig.11 and Fig.12 After the first interconnecting block 7 is connected to the outside of the liquid inlet 11 of the first liquid cooling plate 1, a first guide channel 7a is formed between the first interconnecting block 7 and the first liquid cooling plate 1, and the first mounting through hole 71 and the liquid inlet 11 are respectively connected to the openings at both ends of the first guide channel 7a, so that the first mounting through hole 71 and the liquid inlet 11 are staggered and not opposite to each other, as shown in FIG. Figure 8 As shown. Preferably, the first mounting through hole 71 and the liquid inlet 11 are respectively connected vertically with the first guide channel 7a. Among them, the first mounting through hole 71 is connected to the corresponding pipeline, which can be connected by a joint. After the second connecting block 8 is connected to the outside of the liquid outlet 12 of the first liquid cooling plate 1, a second guide channel 8a is formed between the second connecting block 8 and the first liquid cooling plate 1, and the second mounting through hole 81 and the liquid outlet 12 are respectively connected with the openings at both ends of the second guide channel 8a, so that the second mounting through hole 81 and the liquid outlet 12 are staggered and not opposite, as shown in FIG. Figure 8 As shown. Preferably, the second mounting through hole 81 and the liquid outlet 12 are respectively vertically connected to the second guide channel 8a. Among them, the second mounting through hole 81 is connected to the corresponding pipeline, which can be connected through a joint. The first guide channel 7a and the second guide channel 8a are smooth channels for reducing the flow resistance of the coolant, and their smoothness can be set according to requirements.

[0054] Among them, "the first mounting through hole 71 and the liquid inlet 11 are staggered and not opposite to each other" means that the first mounting through hole 71 and the liquid inlet 11 can be staggered in the vertical direction (i.e., the height direction / up and down) and / or staggered in the horizontal direction (i.e., the length direction / left and right) so that the two are not opposite to each other. "The second mounting through hole 81 and the liquid outlet 12 are staggered and not opposite to each other" means that the second mounting through hole 81 and the liquid outlet 12 can be staggered in the vertical direction (i.e., the height direction / up and down) and / or staggered in the horizontal direction (i.e., the length direction / left and right) so that the two are not opposite to each other.

[0055] In the embodiment of the present application, the first liquid cooling plate 1 is provided with a first fluid groove 14, the first fluid groove 14 is located outside the liquid inlet 11, and the liquid inlet 11 is connected to one end of the first fluid groove 14, the first liquid cooling plate 1 is provided with a third fluid groove 15, the third fluid groove 15 is located outside the liquid outlet 12, and the liquid outlet 12 is connected to one end of the third fluid groove 15, as shown in FIG. Figure 5 and Fig.10 The first connecting block 7 is provided with a second fluid groove 72, the second fluid groove 72 is located on one side of the first mounting through hole 71, and one end of the second fluid groove 72 is connected to the first mounting through hole 71, as shown in FIG. Figure 6 and Fig.11 The second connecting block 8 is provided with a fourth fluid groove 82, which is located at one side of the second mounting through hole 81, and one end of the fourth fluid groove 82 is connected to the second mounting through hole 81, as shown in FIG. Figure 7 and Fig.12 As shown. The first fluid groove 14 and the second fluid groove 72 are completely symmetrical, and the third fluid groove 15 and the fourth fluid groove 82 are completely symmetrical. After the first connecting block 7, the second connecting block 8 and the first liquid cooling plate 1 are connected, the first fluid groove 14 and the second fluid groove 72 are buckled to form a first guide channel 7a, and the third fluid groove 15 and the fourth fluid groove 82 are buckled to form a second guide channel 8a. Figure 8 and Fig.13 The formation method of the first guide channel 7a and the second guide channel 8a is convenient for processing and operation.

[0056] In one embodiment, the first guide channel 7a and the second guide channel 8a extend in the height direction or in the length direction, so that the first mounting through hole 71 and the liquid inlet 11 are staggered and not opposite in the height direction or in the length direction (horizontal direction), and the second mounting through hole 81 and the liquid outlet 12 are staggered and not opposite in the height direction or in the length direction. Figure 10-12 They are schematic diagrams of the structures of the first liquid cooling plate, the first interconnecting block 7 and the second interconnecting block 8, respectively, wherein the first fluid groove 14, the third fluid groove 15, the second fluid groove 72 and the fourth fluid groove 82 extend in the height direction. Fig.13Schematic diagram of the first guide channel 7a and the second guide channel 8a extending in the height direction, wherein the first mounting through hole 71 and the liquid inlet 11 are staggered in the height direction. The structure of the first guide channel 7a and the second guide channel 8a extending in the length direction is not shown, and the arrangement is basically similar to the above embodiment. Whether the first mounting through hole 71 and the liquid inlet 11, the second mounting through hole 81 and the liquid outlet 12 are staggered in the length direction or in the height direction needs to be selected according to the space in front of the first liquid cooling plate.

[0057] In another embodiment, the first guide channel 7a and the second guide channel 8a are L-shaped channels or obliquely extending channels, so that the first mounting through hole 71 and the liquid inlet 11 are obliquely staggered and not opposite, and the second mounting through hole 81 and the liquid outlet 12 are obliquely staggered and not opposite. Obliquely staggered and not opposite includes obliquely staggered upward or obliquely staggered downward, which means that the two are staggered in both the height direction and the horizontal direction. Among them, the obliquely staggered and not opposite mode can meet the requirements of the installation space. Figure 5-Figure 7 They are schematic diagrams of the structures of the first liquid cooling plate, the first interconnecting block 7 and the second interconnecting block 8, respectively, wherein the first fluid groove 14, the third fluid groove 15, the second fluid groove 72 and the fourth fluid groove 82 are L-shaped grooves, and their two ends are staggered in both the height direction and the length direction.

[0058] The heat dissipation module in the heat dissipation device of the embodiment of the present application includes at least two first liquid cooling plates arranged side by side and connected in series, the liquid inlet of the first liquid cooling plate located at one end is connected to the first liquid inlet pipe, and the liquid outlet or liquid inlet of the first liquid cooling plate located at the other end is connected to the first liquid return pipe, and among all other liquid outlets and liquid inlets, two adjacent liquid outlets and two adjacent liquid inlets are connected by staggered holes through connecting pipes, respectively, which increases the bending radius and operability of the connecting pipes, reduces the flow resistance, and improves the heat dissipation capacity.

[0059] Fig.14 It is a schematic diagram of the structure of an electronic device of an embodiment of the present application. Among them, the electronic device includes a chassis and a heat dissipation device of the above embodiment, and an optical module group is arranged in the chassis. Each optical module group may include multiple optical modules. The heat dissipation device can be installed in the chassis to dissipate heat and cool the heating components in the chassis. Among them, the number of first liquid cooling plates 1 in the heat dissipation device is the same as the number of optical module groups, and a first liquid cooling plate 1 is connected above each optical module group to improve the heat dissipation capacity by liquid cooling.

[0060] In a specific embodiment, a plurality of optical module groups can be arranged side by side at one end of the chassis, and a corresponding plurality of first liquid cooling plates can be installed side by side above the corresponding optical module groups, which can maximize the utilization of the chassis space and also maximize the reduction of the temperature inside the chassis. Each optical module group is installed side by side in a corresponding shielding cage, and the first liquid cooling plate 1 is connected to the top of the shielding cage through a radiator snap-fit ​​structure, so as to dissipate heat and cool the optical module in the shielding cage. The radiator snap-fit ​​structure includes a first snap-fit ​​part and a second snap-fit ​​part that are snap-fitted together to form a receiving space, and the first snap-fit ​​part can also be snap-fitted with the shielding cage. The first liquid cooling plate 1 is installed in the receiving space to form a whole, which is convenient for disassembly and installation.

[0061] The chassis is also provided with electronic devices such as processors, chips, and circuit boards. The second liquid cooling plate 105 in the heat dissipation device is connected to the electronic device to dissipate heat and cool the electronic device. In the present application, the chassis is provided with an upper and lower two-layer structure through a partition, wherein the heat dissipation device can be provided on the upper layer, so that the heat dissipation device is smaller and thinner, and can be more easily installed in electronic devices with high-density electronic devices, making the electronic device thinner and smaller in size as a whole. The lower space of the chassis can be provided with a fan lamp heat dissipation structure, which can dissipate heat for other electronic devices in the chassis.

[0062] In the heat dissipation device of the electronic device in the embodiment of the present application, adjacent first liquid cooling plates are connected in series through staggered holes of connecting pipes, which increases the bending radius and operability of the connecting pipes, reduces flow resistance, and improves heat dissipation capacity.

[0063] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device comprises at least one group of heat dissipation modules (100), the heat dissipation module (100) comprising at least two first liquid cooling plates (1) arranged side by side and connected in series, each first liquid cooling plate (1) comprising a liquid cooling channel (13) having a liquid inlet (11) and a liquid outlet (12), the liquid inlet (11) and the liquid outlet (12) being arranged on a first side surface of the first liquid cooling plate (1) and close to two side edges respectively, and the liquid inlet (11) and the liquid outlet (12) of two adjacent first liquid cooling plates (1) being arranged adjacent to each other; The liquid inlet (11) of the first liquid cooling plate (1) at one end of the heat dissipation module (100) is connected to the first liquid inlet pipe (2), the liquid outlet (12) or the liquid inlet (11) of the first liquid cooling plate (1) at the other end is connected to the first liquid return pipe (3), and among all the other liquid outlets (12) and liquid inlets (11), two adjacent liquid outlets (12) and two adjacent liquid inlets (11) are connected in an alternating manner via connecting pipes (4).

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation module (100) comprises an even number of the first liquid cooling plates (1), the liquid inlets (11) of the two first liquid cooling plates (1) located at the two ends are respectively connected to the first liquid inlet pipe (2) and the first liquid return pipe (3), and among all the other liquid outlets (12) and the liquid inlets (11), two adjacent liquid outlets (12) and two adjacent liquid inlets (11) are respectively connected in an alternating manner via the connecting pipe (4).

3. The heat dissipation device according to claim 1, characterized in that: The heat dissipation module (100) comprises an odd number of the first liquid cooling plates (1); the liquid inlet (11) of the first liquid cooling plate (1) at one end is connected to the first liquid inlet pipe (2); the liquid outlet (12) of the first liquid cooling plate (1) at the other end is connected to the first liquid return pipe (3); and among all the other liquid outlets (12) and liquid inlets (11), two adjacent liquid outlets (12) and two adjacent liquid inlets (11) are connected in an alternating manner via the connecting pipe (4).

4. The heat dissipation device according to any one of claims 1 to 3, characterized in that: The liquid inlet (11) is provided with a liquid inlet joint (5), and the liquid outlet (12) is provided with a liquid outlet joint (6); the liquid inlet joint (5) and the liquid outlet joint (6) are respectively connected to the first liquid inlet pipe (2) or the first liquid return pipe (3) or the connecting pipe (4).

5. The heat dissipation device according to any one of claims 1 to 3, characterized in that: A first connecting block (7) is installed outside the liquid inlet (11), the first connecting block (7) is provided with a first mounting through hole (71), a first guide channel (7a) is formed between the first connecting block (7) and the first liquid cooling plate (1), the first mounting through hole (71) and the liquid inlet (11) are respectively connected to two end openings of the first guide channel (7a), and the first mounting through hole (71) and the liquid inlet (11) are staggered and not opposite; A second connecting block (8) is installed outside the liquid outlet (12), the second connecting block (8) is provided with a second mounting through hole (81), a second guide channel (8a) is formed between the second connecting block (8) and the first liquid cooling plate (1), the second mounting through hole (81) and the liquid outlet (12) are respectively connected to the openings at both ends of the second guide channel (8a), and the second mounting through hole (81) and the liquid outlet (12) are staggered and not opposite.

6. The heat dissipation device according to claim 5, characterized in that: The first guide channel (7a) and the second guide channel (8a) extend in the height direction or in the length direction, the first mounting through hole (71) and the liquid inlet (11) are staggered and not opposite in the height direction or in the length direction, and the second mounting through hole (81) and the liquid outlet (12) are staggered and not opposite in the height direction or in the length direction.

7. The heat dissipation device according to claim 5, characterized in that: The first guide channel (7a) and the second guide channel (8a) are L-shaped channels or obliquely extending channels; the first mounting through hole (71) and the liquid inlet (11) are obliquely staggered and not opposite; and the second mounting through hole (81) and the liquid outlet (12) are obliquely staggered and not opposite.

8. The heat dissipation device according to claim 5, characterized in that: The first liquid cooling plate (1) is provided with a first fluid groove (14), the first fluid groove (14) is located outside the liquid inlet (11), and the liquid inlet (11) is connected to one end of the first fluid groove (14), the first connecting block (7) is provided with a second fluid groove (72), the second fluid groove (72) is located on one side of the first mounting through hole (71), and one end of the second fluid groove (72) is connected to the first mounting through hole (71), and the first fluid groove (14) and the second fluid groove (72) are buckled to form the first guide channel (7a); The first liquid cooling plate (1) is provided with a third fluid groove (15), the third fluid groove (15) is located outside the liquid outlet (12), and the liquid outlet (12) is connected to one end of the third fluid groove (15), the second connecting block (8) is provided with a fourth fluid groove (82), the fourth fluid groove (82) is located on one side of the second mounting through hole (81), and one end of the fourth fluid groove (82) is connected to the second mounting through hole (81), and the third fluid groove (15) and the fourth fluid groove (82) are buckled to form the second guide channel (8a).

9. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device comprises a plurality of groups of heat dissipation modules (100) arranged side by side, wherein the first liquid inlet pipes (2) and the first liquid return pipes (3) of the plurality of heat dissipation modules (100) are respectively connected to a cooling capacity distribution unit (200) via a first liquid distributor (9) and a second liquid distributor (10) to form a plurality of first cooling liquid circuits arranged in parallel.

10. The heat dissipation device according to claim 9, characterized in that: The heat dissipation device also includes a second liquid cooling plate (105), wherein a second liquid inlet pipe (101) and a second liquid return pipe (102) of the second liquid cooling plate (105) are respectively connected to the cooling capacity distribution unit (200) via the first liquid distributor (9) and the second liquid distributor (10) to form a second cooling liquid circuit, and the second cooling liquid circuit is arranged in parallel with the first cooling liquid circuit.

11. The heat dissipation device according to claim 10, characterized in that: A main liquid inlet pipe (103) is connected between the first liquid distributor (9) and the cold distribution unit (200), and a main liquid return pipe (104) is connected between the second liquid distributor (10) and the cold distribution unit (200).

12. An electronic device, characterized in that: The electronic device comprises a chassis and a heat dissipation device as claimed in any one of claims 1 to 11, wherein at least two optical module groups are arranged in the chassis, and the first liquid cooling plate (1) is connected to the optical module groups in a one-to-one correspondence.

13. The electronic device according to claim 12, characterized in that: The heat dissipation device further comprises a second liquid cooling plate (105) arranged in parallel with the circuit of the heat dissipation module (100); the electronic device further comprises an electronic device, and the second liquid cooling plate (105) is connected to the electronic device.

14. The electronic device according to claim 12, characterized in that: The electronic device further comprises a shielding cage and a heat sink snap-fitting structure arranged above the shielding cage, the heat sink snap-fitting structure comprising a first snap-fitting member and a second snap-fitting member snap-fitted together to form a receiving space, the first snap-fitting member is snap-fitted with the shielding cage, the first liquid cooling plate (1) is installed in the receiving space, and the optical module group is installed in the shielding cage.

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