Cooling device for high-voltage SVG

Abstract

The invention relates to the technical field of cooling of high-voltage SVG equipment. More specifically, the invention relates to a cooling device for a high-voltage SVG, and the device comprises a cooling pipeline which is disposed in a cabinet of the high-voltage SVG, and a water inlet and a water outlet of the cooling pipeline penetrate out of the cabinet of the high-voltage SVG; a water inlet and a water outlet of the water cooling system are respectively communicated with the water outlet and the water inlet of the cooling pipeline; the semiconductor refrigeration mechanism is embedded in the high-voltage SVG cabinet; the temperature detection unit is used for obtaining the temperature in the high-voltage SVG cabinet and the temperature of cooling water in the water cooling system; and the control unit is electrically connected with the water cooling system, the semiconductor refrigeration mechanism and the temperature detection unit. According to the cooling device for the high-voltage SVG, the advantages of a water cooling system and the semiconductor refrigeration technology are combined, the cooling mode is selected according to actual needs, and therefore energy consumption is reduced on the premise that the cooling effect of the cooling device on the high-voltage SVG is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling high-voltage SVG equipment, and more specifically, to a cooling device for high-voltage SVG. Background Art

[0002] High-voltage static VAR generators (SVG) are widely used in power systems, mainly to improve grid voltage quality, transmission capacity and stability. With the development of power electronics technology, the power density of SVG continues to increase, and the performance requirements for the cooling system are becoming increasingly stringent. Traditional air cooling methods have been unable to meet the requirements in high-power density application scenarios due to problems such as low heat dissipation efficiency and high noise. Therefore, the development of efficient and reliable cooling devices has become the key to improving the overall performance of SVG.

[0003] At present, the industry mainly adopts the following solutions to the cooling problem of SVG: First, simple natural air cooling or forced air cooling, using fans to discharge heat from the cabinet; second, liquid cooling system, using circulating coolant to remove the heat generated by the equipment; third, semiconductor electronic refrigeration technology, using the Peltier effect to achieve local cooling. These methods have their own characteristics, but there are certain limitations in practical applications.

[0004] Although the above cooling solutions can solve the temperature rise problem of SVG to a certain extent, there are still obvious shortcomings. For example, the traditional air cooling method has low heat dissipation efficiency and cannot effectively cope with the large amount of heat generated under high power density; while the existing liquid cooling system has a good heat dissipation effect, it has a complex structure and high maintenance cost; semiconductor electronic refrigeration technology is limited by its limited cooling capacity and high energy consumption. These problems limit the overall performance and reliability of SVG, and a comprehensive and efficient cooling solution is urgently needed to overcome the defects of existing technologies. Summary of the invention

[0005] The object of the present invention is to provide a cooling device for high-voltage SVG, which combines the advantages of a water cooling system and semiconductor refrigeration technology, selects a cooling method according to actual needs, and thereby reduces energy consumption while ensuring the cooling effect of the cooling device on the high-voltage SVG.

[0006] In order to achieve these objects and other advantages according to the present invention, there is provided a cooling device for high-voltage SVG, comprising:

[0007] A cooling pipeline is arranged in the high-voltage SVG cabinet, and its water inlet and outlet pass through the high-voltage SVG cabinet;

[0008] A water cooling system, whose water inlet and water outlet are respectively connected to the water outlet and water inlet of the cooling pipeline;

[0009] Semiconductor refrigeration mechanism, which is embedded in the high-voltage SVG cabinet;

[0010] A temperature detection unit, which is used to obtain the temperature inside the high-voltage SVG cabinet and the temperature of the cooling water in the water cooling system;

[0011] A control unit is electrically connected to the water cooling system, the semiconductor refrigeration mechanism and the temperature detection unit respectively.

[0012] Furthermore, in the cooling device for high-voltage SVG, the water cooling system comprises:

[0013] a steam-water separator, the water inlet of which is connected to the water outlet of the cooling pipeline through a first pipeline;

[0014] a water tank, the water inlet of which is connected to the water outlet of the steam-water separator through a second pipe;

[0015] A booster pump, the water inlet of which is connected to the water outlet of the water tank through a third pipe;

[0016] A deionization tank, whose water inlet is connected to the water outlet of the booster pump through a fourth pipeline, and a first solenoid valve is provided on the fourth pipeline;

[0017] A heat exchanger, whose water inlet is connected to the water outlet of the booster pump and the water outlet of the deionization tank through a fifth pipe and a sixth pipe respectively, the water inlet of the heat exchanger is connected to the water inlet of the cooling pipeline through a seventh pipe, and a second solenoid valve is provided on the fifth pipe;

[0018] a water replenishment pump, the water outlet of which is connected to the water inlet of the deionization tank through an eighth pipeline, and a third solenoid valve is provided on the eighth pipeline;

[0019] A water replenishment tank, the water outlet of which is connected to the water inlet of the water replenishment pump through a ninth pipe;

[0020] The first solenoid valve, the second solenoid valve and the third solenoid valve are electrically connected to the control unit respectively.

[0021] Furthermore, in the cooling device for high-voltage SVG, a semiconductor refrigerator is connected to the outer shell of the water tank, and the semiconductor refrigerator is electrically connected to the control unit.

[0022] Furthermore, in the cooling device for high-voltage SVG, the water cooling system further comprises:

[0023] The steam-water separator, water tank, booster pump, deionization tank, heat exchanger, water supply pump and water supply tank are all arranged in the box.

[0024] A mesh plate, a plurality of ventilation holes are formed on the box body, and the mesh plate is arranged in the ventilation holes.

[0025] Furthermore, in the cooling device for high-voltage SVG, the temperature detection unit comprises:

[0026] A first temperature sensor, which is used to obtain the temperature inside the high-voltage SVG cabinet;

[0027] A second temperature sensor, used to obtain the temperature of the cooling water in the sixth pipe;

[0028] a third temperature sensor, used to obtain the temperature of the cooling water in the seventh pipe;

[0029] The first temperature sensor, the second temperature sensor and the third temperature sensor are electrically connected to the control unit respectively.

[0030] Furthermore, in the cooling device for high-voltage SVG, a liquid level gauge is provided in the water tank, and the liquid level gauge is electrically connected to the control unit.

[0031] Furthermore, in the cooling device for high-voltage SVG, the semiconductor refrigeration mechanism comprises:

[0032] A plurality of semiconductor refrigeration components are arranged in the cabinet at intervals and are electrically connected to the control unit respectively.

[0033] Furthermore, in the cooling device for high-voltage SVG, the semiconductor refrigeration component comprises:

[0034] A refrigeration plate, on which a plurality of mounting grooves are arranged at intervals, a notch corresponding to the refrigeration plate is arranged on the cabinet of the high-voltage SVG, and the refrigeration plate is embedded in the notch;

[0035] Semiconductor cooling sheets, each of the mounting grooves is provided with the semiconductor cooling sheets;

[0036] Internal heat dissipation fins, which are arranged in the cabinet of the high-voltage SVG and connected to the refrigeration plate;

[0037] The external heat dissipation fins are arranged outside the cabinet of the high-voltage SVG and connected to the refrigeration plate.

[0038] The present invention also provides a high-voltage SVG cooling method, which is applied to the above-mentioned high-voltage SVG cooling device, comprising the following steps:

[0039] S1, the temperature detection unit obtains the temperature T inside the high-voltage SVG cabinet a , and the inlet temperature T of the cooling water in the water cooling system b and outlet water temperature T c , and sent to the control unit;

[0040] S2, the control unit pre-sets a first threshold value T1, a second threshold value T2 and a third threshold value T3 of the temperature inside the high-voltage SVG cabinet, wherein T1<T2<T3;

[0041] When T a When <T1, the controller controls the water cooling system to operate at low power;

[0042] When T1≤T a When <T2, the controller controls the water cooling system to operate at high power;

[0043] When T2≤T a When <T3, the controller controls the water cooling system to operate at high power, and controls the semiconductor refrigeration mechanism to operate at low power;

[0044] When T a When ≥T3, the controller controls the water cooling system to operate at high power, and controls the semiconductor refrigeration mechanism to operate at high power.

[0045] Furthermore, the high-pressure SVG cooling method further includes:

[0046] The temperature detection unit obtains the inlet water temperature T of the cooling water in the water cooling system. b and outlet water temperature T c , and sent to the control unit;

[0047] The control unit pre-sets a temperature difference threshold ΔT between the inlet temperature and the outlet temperature of the cooling water in the water cooling system. b -T c When ≥ΔT, the controller controls the semiconductor refrigerator arranged on the water tank shell of the water cooling system to operate.

[0048] The beneficial effects of the present invention are:

[0049] In the cooling device for high-voltage SVG of the present invention, the temperature in the high-voltage SVG cabinet and the temperature of the cooling water in the water cooling system are collected, and the water cooling system is controlled to input cooling water to the cooling pipeline according to the collected temperatures, and the high-voltage SVG cabinet is cooled by a semiconductor refrigeration mechanism, thereby reducing energy consumption while ensuring the cooling effect of the cooling device on the high-voltage SVG.

[0050] Other advantages, objectives and features of the present invention will be embodied in part through the following description, and in part will be understood by those skilled in the art through study and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a schematic structural diagram of the cooling device for high-voltage SVG according to the present invention;

[0052] Figure 2 The figure is a flow chart of the high-pressure SVG cooling method according to the present invention. DETAILED DESCRIPTION

[0053] The present invention is further described in detail below in conjunction with embodiments so that those skilled in the art can implement the invention with reference to the description.

[0054] It should be noted that, in the description of the present invention, the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0055] like Figure 1 As shown, an embodiment of the present invention provides a cooling device for high-voltage SVG, comprising:

[0056] A cooling pipeline is arranged in the high-voltage SVG cabinet, and its water inlet and outlet pass through the high-voltage SVG cabinet;

[0057] A water cooling system, whose water inlet and water outlet are respectively connected to the water outlet and water inlet of the cooling pipeline;

[0058] Semiconductor refrigeration mechanism, which is embedded in the high-voltage SVG cabinet;

[0059] A temperature detection unit, which is used to obtain the temperature inside the high-voltage SVG cabinet and the temperature of the cooling water in the water cooling system;

[0060] A control unit is electrically connected to the water cooling system, the semiconductor refrigeration mechanism and the temperature detection unit respectively.

[0061] In the above embodiment, when the high-voltage SVG cooling device is working:

[0062] S1. Obtain the temperature T inside the high-voltage SVG cabinet through the first temperature sensor a ; The temperature of the cooling water in the sixth pipe is obtained by the second temperature sensor, that is, the inlet temperature T of the cooling water in the water cooling system b ; The temperature of the cooling water in the seventh pipe is obtained by the third temperature sensor, that is, the outlet water temperature T of the cooling water in the water cooling system c ;

[0063] The temperature detection unit obtains the temperature T in the high-voltage SVG cabinet a , and the inlet temperature T of the cooling water in the water cooling systemb and outlet water temperature T c , and sent to the control unit;

[0064] S2, the control unit pre-sets a first threshold value T1, a second threshold value T2 and a third threshold value T3 of the temperature inside the high-voltage SVG cabinet, wherein T1<T2<T3;

[0065] When T a When <T1, the controller controls the water cooling system to operate at low power;

[0066] When T1≤T a When <T2, the controller controls the water cooling system to operate at high power;

[0067] When T2≤T a When <T3, the controller controls the water cooling system to operate at high power, and controls the semiconductor refrigeration mechanism to operate at low power;

[0068] When T a When ≥T3, the controller controls the water cooling system to operate at high power, and controls the semiconductor refrigeration mechanism to operate at high power.

[0069] Also includes:

[0070] The temperature detection unit obtains the inlet water temperature T of the cooling water in the water cooling system. b and outlet water temperature T c , and sent to the control unit;

[0071] The control unit pre-sets a temperature difference threshold ΔT between the inlet temperature and the outlet temperature of the cooling water in the water cooling system. b -T c When ≥ΔT, the controller controls the semiconductor refrigerator arranged on the water tank shell of the water cooling system to operate.

[0072] Preferably, as another embodiment of the present application, the water cooling system includes:

[0073] a steam-water separator, the water inlet of which is connected to the water outlet of the cooling pipeline through a first pipeline;

[0074] a water tank, the water inlet of which is connected to the water outlet of the steam-water separator through a second pipe;

[0075] A booster pump, the water inlet of which is connected to the water outlet of the water tank through a third pipe;

[0076] A deionization tank, whose water inlet is connected to the water outlet of the booster pump through a fourth pipeline, and a first solenoid valve is provided on the fourth pipeline;

[0077] A heat exchanger, whose water inlet is connected to the water outlet of the booster pump and the water outlet of the deionization tank through a fifth pipe and a sixth pipe respectively, the water inlet of the heat exchanger is connected to the water inlet of the cooling pipeline through a seventh pipe, and a second solenoid valve is provided on the fifth pipe;

[0078] a water replenishment pump, the water outlet of which is connected to the water inlet of the deionization tank through an eighth pipeline, and a third solenoid valve is provided on the eighth pipeline;

[0079] A water replenishment tank, the water outlet of which is connected to the water inlet of the water replenishment pump through a ninth pipe;

[0080] The first solenoid valve, the second solenoid valve and the third solenoid valve are electrically connected to the control unit respectively.

[0081] In the above embodiment, the outlet water of the cooling pipeline enters the steam-water separator, and is discharged into the water tank for temporary storage after the steam is removed. At this time, the water in the water tank has two paths: one is to be directly sent to the heat exchanger through the booster pump, and the other is to be sent to the deionization tank by the booster pump for treatment, and then enter the heat exchanger. After the heat exchange treatment of the water in the heat exchanger, the temperature is reduced, and then enters the cooling pipeline. When flowing through the cooling pipeline, it exchanges heat with the hot air in the high-voltage SVG cabinet to cool the high-voltage SVG cabinet.

[0082] Preferably, as another embodiment of the present application, a semiconductor refrigerator is connected to the outer shell of the water tank, and the semiconductor refrigerator is electrically connected to the control unit.

[0083] Preferably, as another embodiment of the present application, the water cooling system further includes:

[0084] The steam-water separator, water tank, booster pump, deionization tank, heat exchanger, water supply pump and water supply tank are all arranged in the box.

[0085] A mesh plate, a plurality of ventilation holes are formed on the box body, and the mesh plate is arranged in the ventilation holes.

[0086] Preferably, as another embodiment of the present application, a liquid level meter is provided in the water tank, and the liquid level meter is electrically connected to the control unit.

[0087] Preferably, as another embodiment of the present application, the semiconductor refrigeration mechanism includes:

[0088] A plurality of semiconductor refrigeration components are arranged in the cabinet at intervals and are electrically connected to the control unit respectively.

[0089] Preferably, as another embodiment of the present application, the semiconductor refrigeration component includes:

[0090] A refrigeration plate, on which a plurality of mounting grooves are arranged at intervals, a notch corresponding to the refrigeration plate is arranged on the cabinet of the high-voltage SVG, and the refrigeration plate is embedded in the notch;

[0091] Semiconductor cooling sheets, each of the mounting grooves is provided with the semiconductor cooling sheets;

[0092] Internal heat dissipation fins, which are arranged in the cabinet of the high-voltage SVG and connected to the refrigeration plate;

[0093] The external heat dissipation fins are arranged outside the cabinet of the high-voltage SVG and connected to the refrigeration plate.

[0094] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation modes. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the embodiments shown and described herein.

Claims

1. A cooling device for high-voltage SVG, characterized in that: include: A cooling pipeline is arranged in the high-voltage SVG cabinet, and its water inlet and outlet pass through the high-voltage SVG cabinet; A water cooling system, whose water inlet and water outlet are respectively connected to the water outlet and water inlet of the cooling pipeline; Semiconductor refrigeration mechanism, which is embedded in the high-voltage SVG cabinet; A temperature detection unit, which is used to obtain the temperature inside the high-voltage SVG cabinet and the temperature of the cooling water in the water cooling system; A control unit is electrically connected to the water cooling system, the semiconductor refrigeration mechanism and the temperature detection unit respectively.

2. A cooling device for high-voltage SVG according to claim 1, characterized in that: The water cooling system comprises: a steam-water separator, the water inlet of which is connected to the water outlet of the cooling pipeline through a first pipeline; a water tank, the water inlet of which is connected to the water outlet of the steam-water separator through a second pipe; A booster pump, the water inlet of which is connected to the water outlet of the water tank through a third pipe; A deionization tank, whose water inlet is connected to the water outlet of the booster pump through a fourth pipeline, and a first solenoid valve is provided on the fourth pipeline; A heat exchanger, whose water inlet is connected to the water outlet of the booster pump and the water outlet of the deionization tank through a fifth pipe and a sixth pipe respectively, the water inlet of the heat exchanger is connected to the water inlet of the cooling pipeline through a seventh pipe, and a second solenoid valve is provided on the fifth pipe; a water replenishment pump, the water outlet of which is connected to the water inlet of the deionization tank through an eighth pipeline, and a third solenoid valve is provided on the eighth pipeline; A water replenishment tank, the water outlet of which is connected to the water inlet of the water replenishment pump through a ninth pipe; The first solenoid valve, the second solenoid valve and the third solenoid valve are electrically connected to the control unit respectively.

3. A cooling device for high-voltage SVG according to claim 2, characterized in that: A semiconductor refrigerator is connected to the shell of the water tank, and the semiconductor refrigerator is electrically connected to the control unit.

4. A cooling device for high-voltage SVG according to claim 2, characterized in that: The water cooling system also includes: The steam-water separator, water tank, booster pump, deionization tank, heat exchanger, water supply pump and water supply tank are all arranged in the box. A mesh plate, a plurality of ventilation holes are formed on the box body, and the mesh plate is arranged in the ventilation holes.

5. A cooling device for high-voltage SVG according to claim 2, characterized in that: The temperature detection unit comprises: A first temperature sensor, which is used to obtain the temperature inside the high-voltage SVG cabinet; A second temperature sensor, used to obtain the temperature of the cooling water in the sixth pipe; a third temperature sensor, used to obtain the temperature of the cooling water in the seventh pipe; The first temperature sensor, the second temperature sensor and the third temperature sensor are electrically connected to the control unit respectively.

6. A cooling device for high-voltage SVG according to claim 2, characterized in that: A liquid level meter is arranged in the water tank, and the liquid level meter is electrically connected to the control unit.

7. A cooling device for high-voltage SVG according to claim 1, characterized in that: The semiconductor refrigeration mechanism comprises: A plurality of semiconductor refrigeration components are arranged in the cabinet at intervals and are electrically connected to the control unit respectively.

8. A cooling device for high-voltage SVG according to claim 7, characterized in that: The semiconductor refrigeration component comprises: A refrigeration plate, on which a plurality of mounting grooves are arranged at intervals, a notch corresponding to the refrigeration plate is arranged on the cabinet of the high-voltage SVG, and the refrigeration plate is embedded in the notch; Semiconductor cooling sheets, each of the mounting grooves is provided with the semiconductor cooling sheets; Internal heat dissipation fins, which are arranged in the cabinet of the high-voltage SVG and connected to the refrigeration plate; The external heat dissipation fins are arranged outside the cabinet of the high-voltage SVG and connected to the refrigeration plate.

9. A high-pressure SVG cooling method, applied to the high-pressure SVG cooling device according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, the temperature detection unit obtains the temperature T inside the high-voltage SVG cabinet a , and the inlet temperature T of the cooling water in the water cooling system b and outlet water temperature T c , and send it to the control unit; S2, the control unit pre-sets a first threshold value T1, a second threshold value T2 and a third threshold value T3 of the temperature inside the high-voltage SVG cabinet, wherein T1<T2<T3; When T a When <T1, the controller controls the water cooling system to operate at low power; When T1≤T a When <T2, the controller controls the water cooling system to operate at high power; When T2≤T a When <T3, the controller controls the water cooling system to operate at high power, and controls the semiconductor refrigeration mechanism to operate at low power; When T a When ≥T3, the controller controls the water cooling system to operate at high power, and controls the semiconductor refrigeration mechanism to operate at high power.

10. A high pressure SVG cooling method according to claim 9, characterized in that: Also includes: The temperature detection unit obtains the inlet water temperature T of the cooling water in the water cooling system. b and outlet water temperature T c , and send it to the control unit; The control unit pre-sets a temperature difference threshold ΔT between the inlet temperature and the outlet temperature of the cooling water in the water cooling system. b -T c When ≥ΔT, the controller controls the semiconductor refrigerator arranged on the water tank shell of the water cooling system to operate.

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